JP2008139246A - Microchip, microchip energization unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a microchip and a microchip energization unit capable of heating a sample surely up to a prescribed temperature, and observing the sample in a recessed part for analysis by a microscope. <P>SOLUTION: When setting at a desired temperature, for example, at 40°C, and switching on a controller 27 by operating an operation knob of the controller 27, a transparent conducting film 19 is energized through alligator lead wires 29, 31. Hereby, the transparent conducting film 19 is heated, and a recessed part formation plate 7 or the like is heated. The surface temperature of the recessed part formation plate 7 is detected by a temperature sensor 39, and the result is transmitted to the controller 27, and energization to the transparent conducting film 19 is controlled by the controller 27 based on the transmitted detection result. Hereby, the temperature of the recessed part formation plate 7 including the bottom part and the inner side face of the recessed part 11 for analysis is kept at 40°C. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a microchip and a microchip energization unit, and more particularly to a microchip and a microchip energization unit that can heat a sample accommodated in an analysis recess of the microchip.

Since devices such as microchips can downsize chemical experiments, they have various merits such as shortening measurement time, reducing the amount of reagents and the amount of drainage, and their use is spreading. And not only having a concave portion for analysis on a substrate, but also having a function useful for experiments such as a microchip described in Patent Document 1 having a pump function has appeared.

JP 2006-212473 A

However, there is no microchip having a function for heating a sample, and its appearance is desired. In particular, a microchip often observes a sample in a concave portion for analysis under a microscope, and if a heater for heating the sample prevents observation with a microscope, it becomes unsuitable for practical use.
The present invention has been made paying attention to the above-mentioned conventional problems, and is a microchip capable of reliably heating a sample to a predetermined temperature and observing the heated sample with a microscope. An object of the present invention is to provide a microchip energization unit.

  The present invention has been made to solve the above problems, and the invention of claim 1 includes a substrate having a transparent portion at least in part, and a concave portion for analysis provided on the surface side of the transparent portion of the substrate. A transparent heating element that is formed in at least a region corresponding to the analysis concave portion of the substrate and that generates heat by energization provided to the analysis concave portion through an electrical insulating portion, the transparent chip The heating element is a microchip that is connected to the energizing means and heats the analysis recess.

According to a second aspect of the present invention, in the microchip according to the first aspect, the substrate has a concave portion forming plate provided with a concave portion for analysis, and a transparent heating element is directly formed on the back surface of the concave portion forming plate. It is a microchip characterized by having.

  A third aspect of the present invention is the microchip according to the second aspect, wherein a cover covering the transparent heating element is overlapped and fixed on the back surface side of the recess forming plate.

  A fourth aspect of the present invention is the microchip according to the third aspect, wherein the recess forming plate and the cover are bonded together with an adhesive having transparency.

According to a fifth aspect of the present invention, in the microchip according to the first aspect, the substrate includes a concave portion forming plate provided with a concave portion for analysis, and a conductive film forming plate which is overlapped and fixed on the back side of the concave portion forming plate. And a transparent heating element is provided in the transparent portion of the conductive film forming plate.

  A sixth aspect of the invention is the microchip according to the fifth aspect, wherein the concave portion forming plate and the conductive film forming plate are bonded together with an adhesive having transparency.

  The invention of claim 7 is the microchip according to any one of claims 1 to 6, wherein a pair of electrodes electrically connected to the transparent heating element is provided.

  According to an eighth aspect of the present invention, in the microchip according to the seventh aspect, the pair of electrodes are respectively arranged on both sides of the region corresponding to the concave portion for analysis, and are spaced apart from each other. It is a microchip.

  A ninth aspect of the present invention is the microchip according to the eighth aspect, wherein the pair of electrodes extend in a range connecting both end portions in the length direction of the concave portion for analysis.

  A tenth aspect of the present invention is a microchip energization unit comprising the microchip according to any one of the first to ninth aspects and an energizing means for energizing the transparent heating element of the microchip. .

An eleventh aspect of the present invention is the microchip energization unit according to the tenth aspect, further comprising temperature control means for controlling the temperature of the transparent heating element.

According to a twelfth aspect of the present invention, in the microchip energization unit according to the eleventh aspect, the energization control means includes a temperature detection means for detecting the temperature of the substrate, and an energization control means for energization based on the detection result of the temperature detection means. It is comprised from these. The microchip electricity supply unit characterized by the above-mentioned.

  According to the present invention, the sample can be reliably heated to a predetermined temperature. Moreover, it is possible to observe with the microscope in the state which heated the sample in the recessed part for analysis.

A microchip 1 and a microchip energization unit 3 according to Embodiment 1 of the present invention will be described with reference to FIGS.
The configuration of the microchip 1 will be described.
Reference numeral 5 denotes a substrate, and the substrate 5 includes a recess forming plate 7, a cover 9, and the like.
The recess forming plate 7 and the cover 9 are a glass plate or a synthetic resin plate, and a transparent and electrically insulating plate is used. The synthetic resin plate is not particularly limited as long as it has transparency and electrical insulation, but a highly transparent one such as an acrylic plate, a polycarbonate plate, and a styrene plate is preferable.
An analysis recess 11 is formed on the surface of the recess forming plate 7, and the analysis recess 11 has three reservoirs 13, three supply units 15, and three flows for connecting the reservoir 13 and the supply unit 15. It is constituted by a path 17.

A transparent conductive film 19 as a transparent heating element is directly formed on the entire back surface of the recess forming plate 7. The transparent conductive film 19 is made of a conductive metal thin film and has a property of generating heat when energized. Specifically, tin oxide, SiO ₂ -indium alloy, indium oxide, tin or antimony-doped indium oxide, antimony-doped tin oxide, or the like can be used. As a method of forming the conductive metal thin film on the inner surfaces of the transparent plates 7 and 9, it can be performed by a vapor deposition method (for example, a vacuum vapor deposition method), a sputtering method, a dipping method, a CVD method or the like.
Since the transparent conductive film 19 is formed on the entire back surface of the recess forming plate 7 as described above, the recess is formed in a region corresponding to the analysis recess 11 and is an electrically insulating portion with respect to the analysis recess 11. It is provided via a forming plate 7.

  A pair of electrodes 21 and 23 are fixed to the surface of the transparent conductive film 19, and the electrodes 21 and 23 are electrically connected to the transparent conductive film 19. One end portions of the electrodes 21 and 23 protrude from the end surface of the substrate 5. The electrodes 21 and 23 are arranged on both sides of a region corresponding to the analysis concave portion 11 of the transparent conductive film 19 and are provided at a distance from each other. As the electrodes 21 and 23, a metal thin film having high conductivity such as copper or silver is preferably used.

A cover 9 is adhered and fixed to the back surface side of the recess forming plate 7 with an adhesive 25.
The adhesive 25 has insulation and transparency, and silicone, polyurethane and the like can be used, and silicone can be suitably used from the viewpoint of insulation and stability. Examples of silicone include silicone gel and silicone rubber. As silicone rubber, RTV silicone rubber having adhesiveness, LTV silicone rubber and the like are suitable, and either one-pack type or two-pack type may be used.

  The microchip 1 is manufactured by forming the analysis recess 11 on the surface of the recess forming plate 7 and then forming the transparent conductive film 19 on the back surface of the recess forming plate 7 as shown in FIGS. The electrodes 21 and 23 are formed. And the cover 9 is affixed and fixed to the back surface of the recessed part formation board 7 with the adhesive agent 25, and the microchip 1 shown in FIG. 1, FIG. 2 is completed.

The microchip 1 is configured as described above, and the microchip energization unit 3 is configured by the microchip 1 and a controller 27 described below.
Reference numerals 29 and 31 denote shed lead wires, and sheds 33 and 35 provided on one end side of the shed lead wires 29 and 31 are connected across a portion protruding from the end face of the substrate 5 of the electrodes 21 and 23, The other end is connected to a controller 27 as control means.

Reference numeral 39 denotes a temperature sensor as temperature detection means, and the detection part of the temperature sensor 39 is attached to the surface of the substrate 5 in the vicinity of the storage part 13. A signal line of the temperature sensor 39 is connected to the controller 27.
The controller 27 is connected to an AC power source (not shown), and the controller 27 adjusts the current and voltage based on the detection result of the temperature sensor 39 and energizes the transparent conductive film 19.
The shed lead wires 29 and 31 and the controller 27 constitute energization means.

Next, how to use the microchip 1 and the microchip energization unit 3 will be described.
First, the microchip 1 is placed on a stage of a microscope (not shown), and the storage unit 13 is opposed to the objective lens of the microscope.
Further, the pair of electrodes 21 and 23 and the controller 27 are connected to each other through the shed lead wires 29 and 31 with the portions protruding from the end face of the substrate 5 of the pair of electrodes 21 and 23 interposed between the sheds 33 and 35. When the operation knob of the controller 27 is operated to set a desired temperature, for example, 40 ° C. and the controller 27 is turned on, the transparent conductive film 19 is energized through the shed lead wires 29 and 31. Thereby, the transparent conductive film 19 generates heat, and the recess forming plate 7 and the like are heated. The surface temperature of the recess forming plate 7 is detected by the temperature sensor 39, and the result is transmitted to the controller 27, and the controller 27 controls the energization of the transparent conductive film 19 based on the transmitted detection result. Thereby, the temperature of the recessed part formation board 7 containing the bottom part and inner surface of the recessed part 11 for an analysis is maintained at 40 degreeC.

  A sample (not shown) is supplied from the supply unit 15 in a state where the bottom and the inner side surface of the analysis recess 11 are kept at 40 ° C. as described above. The sample flows through the flow path 17 and reacts by being heated. The state of reaction of this sample is observed with a microscope. Since all of the recess forming plate 7, the cover 9, the transparent conductive film 19 and the adhesive 25 are transparent, the observation of the sample in a heated state can be observed with the microscope without hindering the observation with the microscope. it can.

A microchip 51 according to Embodiment 2 will be described with reference to FIGS.
Since the microchip 51 has the same components as the microchip 1 according to the first embodiment, the same components are denoted by the same reference numerals used in the first embodiment, and the description thereof is omitted. Only differences between the first embodiment and the second embodiment will be described.

In the microchip 51, the transparent conductive film 19 is formed on the surface of the conductive film forming plate 53 (the surface on the side facing the back surface of the concave forming plate 7), and the transparent conductive film 19 is formed on the concave forming plate 7. Not. Therefore, in the method of manufacturing the microchip 51, the analysis recess 11 is formed on the surface of the recess forming plate 7, and the transparent conductive film 19 is formed on the surface of the conductive film forming plate 53. Form. Then, the conductive film forming plate 53 is adhered and fixed to the back surface of the recess forming plate 7 with the adhesive 25 to complete the microchip 51.
The conductive film forming plate 53 is made of the same material as the recess forming plate 7 and the cover 9.
The microchip 51 is used as a constituent element of the microchip energization unit 3 in the same manner as the microchip 1 of the first embodiment.

The embodiment of the present invention has been described in detail above. However, the specific configuration is not limited to this embodiment, and the present invention can be changed even if there is a design change without departing from the gist of the present invention. included.
For example, in the first embodiment, the transparent conductive film 19 is formed on the entire back surface of the recess forming plate 7, and in the second embodiment, the transparent conductive film 19 is formed on the entire surface of the conductive film forming plate 53. Can be heated to a desired temperature, the transparent conductive film 19 does not necessarily have to be formed on the entire surface, and at least in the region corresponding to the recess 11 for analysis.

Further, the recess forming plate 7 and the cover 9 do not necessarily have to be transparent as a whole, and at least a region corresponding to the analysis recess 11 may be transparent.
The recess forming plate 7 and the cover 9 may be fixed using an adhesive, or the recess forming plate 7 and the cover 9 may be mechanically connected and fixed by a frame or the like, or may be fixed by diffusion bonding, dispersion bonding, or the like. Good.

Further, in Embodiment 1, the cover 9 is not provided, and the back surface of the recess forming plate 7 is coated with a material having transparency and insulation so that the back surface of the transparent conductive film 19 is electrically insulated. A configuration is also possible.
Moreover, the position, length dimension, etc. provided with the electrodes 21 and 23 are not limited to the said embodiment, It can change suitably. Furthermore, a configuration in which the electrodes 21 and 23 are not provided is also possible.
Without projecting one end of the electrodes 21, 23 from the end face of the substrate 5, the electrode 21, via a member electrically connected to the electrodes 21, 23 between the recess forming plate 7 such as a connector and the cover 9, 23 and the controller 27 may be connected.

The power supply unit 3 of the microchip is configured such that the controller 27 controls the power supply to the transparent conductive film 19 based on the detection result of the temperature sensor 39. However, the present invention is not limited to this, for example, in advance by a timer of the controller. It is also possible to maintain the temperature of the analysis recess 11 by energizing with a preset voltage and current for a set time every predetermined time.

Further, a lid that covers the analysis recess 11 from above may be provided, and a transparent conductive film may be formed on the lid to heat the analysis recess 11 from above. Furthermore, it is also possible to provide a structure in which the lid is provided with a temperature sensor and the energization of the transparent conductive film is controlled in the same manner as in the above embodiment based on the detection result of the temperature sensor.
Furthermore, it is good also as a structure which forms the hole corresponding to the supply part 15 of the analysis recessed part 11 with respect to this lid | cover, and supplies a sample to the analysis recessed part 11 from this hole. With such a configuration, the sample can be supplied to the analysis recess 11 without removing the lid from the recess formation plate 7.
The lid may be a plate having the same size as the recess forming plate 7 shown in the above embodiment, and the lid may be overlapped on the surface of the recess forming plate 7 to cover the analysis recess 11. The size may be smaller than the recess forming plate 7 as long as the analysis recess 11 can be covered. Further, the entire lid does not need to be transparent, and at least a portion corresponding to the analysis recess 11 may be transparent.

  The present invention can be used when a chemical experiment for mixing, reacting, separating, and detecting various samples is performed at a desired temperature.

It is an electricity supply unit perspective view of the microchip which concerns on Embodiment 1 of this invention. It is AA sectional drawing of FIG. It is BB sectional drawing of FIG. It is a figure for demonstrating the manufacturing method of the microchip which concerns on Embodiment 1 of this invention. It is sectional drawing corresponding to FIG. 2 of the microchip of Embodiment 1 of the microchip which concerns on Embodiment 2 of this invention. It is a figure for demonstrating the manufacturing method of the microchip shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,51 Microchip 3 Current supply unit 5 of microchip 5 Substrate 7 Recess formation plate 9 Cover 11 Recess for analysis 13 Storage part 15 Supply part 17 Flow path 19 Transparent conductive film 21, 23 Electrode 25 Adhesive 27 Controller 29, 31 Inlet lead Wires 33 and 35 鰐 口 39 Temperature sensor 53 Conductive film forming plate

Claims (12)

  In a microchip comprising a substrate having a transparent part at least in part and a concave portion for analysis provided on the surface side of the transparent portion of the substrate, the microchip is formed in a region corresponding to at least the concave portion for analysis, and It comprises a transparent heating element that generates heat by energization provided to the analysis recess through an electrical insulation, and the transparent heating element is connected to an energizing means to heat the analysis recess. To microchip. 2. The microchip according to claim 1, wherein the substrate has a recess forming plate provided with an analysis recess, and a transparent heating element is directly formed on the back surface of the recess forming plate. Chip.   3. The microchip according to claim 2, wherein a cover covering the transparent heating element is overlapped and fixed on the back surface side of the recess forming plate.   4. The microchip according to claim 3, wherein the recess forming plate and the cover are bonded together with a transparent adhesive. 2. The microchip according to claim 1, wherein the substrate includes a concave portion forming plate provided with a concave portion for analysis, and a conductive film forming plate that is overlapped and fixed on a back surface side of the concave portion forming plate, and A microchip, wherein a transparent heating element is provided in a transparent portion of a film forming plate.   6. The microchip according to claim 5, wherein the recess forming plate and the conductive film forming plate are bonded together with a transparent adhesive.   7. The microchip according to claim 1, further comprising a pair of electrodes that are electrically connected to the transparent heating element.   8. The microchip according to claim 7, wherein the pair of electrodes are respectively disposed on both sides of a region corresponding to the analysis concave portion, and are spaced apart from each other.   9. The microchip according to claim 8, wherein the pair of electrodes extend in a range connecting both end portions in the length direction of the concave portion for analysis.   10. A microchip energization unit comprising: the microchip according to claim 1; and energization means for energizing the transparent heating element of the microchip. The microchip energization unit according to claim 10, further comprising temperature control means for controlling the temperature of the transparent heating element. In the microchip energization unit according to claim 11, the energization control means includes a temperature detection means for detecting the temperature of the substrate and an energization control means for energization based on the detection result of the temperature detection means. A featured microchip energizing unit.

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