JP2008135983A - Solid-state imaging device - Google Patents

Abstract

An object of the present invention is to provide a compact solid-state imaging device that prevents an increase in pressure in a sealing space of an image sensor due to heating in a sealing (adhesion) process, and that ensures the adhesive strength of an IR cut filter.
In a solid-state imaging device having a circuit board 1 on which an imaging device 2 is mounted, a casing 13 covering the circuit board 1, an IR cut filter 14 and a lens 7 provided in the casing 13, an IR cut is provided. An IR cut filter holding part 9 for holding the filter 14, an air vent through hole 12 provided in the IR cut filter holding part 9, and openings 14 a and 14 b provided in the IR cut filter 14, and the openings 14 a and 14 b At least one is provided at a position overlapping with the through hole 12.
[Selection] Figure 1

Description

  The present invention relates to a solid-state imaging device, and more particularly to a solid-state imaging device mounted on a portable device such as a mobile phone.

  There is a demand for further downsizing of solid-state imaging devices mounted on portable devices such as cellular phones. FIG. 16 is a cross-sectional view of a solid-state imaging device according to the prior art. In a conventional solid-state imaging device, an imaging element 2 is mounted on a circuit board 1 and wiring 10 with the circuit board 1 is provided. Furthermore, the housing 3 is fixed to the circuit board 1 via an adhesive (not shown) so as to cover the image sensor 2, and the image sensor 2 is sealed. The housing 3 includes a cylindrical body portion 3a and a frame body portion 3b. The imaging element 2 is housed inside the frame body portion 3b, and a lens holder 6 including a lens 7 is placed inside the cylindrical body portion 3a. Screwed by a screw mechanism 5. Further, an IR cut filter holding unit 9 is provided between the lens 7 and the image sensor 2, and an IR cut filter 4 for cutting infrared rays is attached to the IR cut filter holding unit 9.

  In this conventional solid-state imaging device, the imaging element 2 surrounded by the circuit board 1 and the frame portion 3b of the housing 3 by heat treatment for curing the thermosetting adhesive used for sealing. The pressure in the sealing space 8 is increased, the circuit board 1 and the housing 3 are deformed, the adhesion failure occurs, the adhesive portion leaks, the housing 3 is lifted and misaligned, In order to solve the problem, a solid-state imaging device in which an air vent through hole communicating with the outside is formed on either the circuit board 1 or the side surface of the housing 3 and a resin is injected into the through hole after sealing to close it. A manufacturing method is also disclosed. However, in the manufacturing method of a small solid-state imaging device, a large number of image sensors are arranged in a matrix on the collective substrate, a housing is attached to this, and the collective substrate is cut in the final process, and the individual steps are cut. It is often separated into a solid-state imaging device. For this reason, in the manufacturing process of a solid-state imaging device, when the space | interval of adjacent solid-state imaging devices is narrow and a through-hole is provided in the side surface of the frame part 3b of the housing | casing 3, resin etc. are sealed after sealing a through-hole. There is a problem in that the work of filling and closing takes time and the man-hours increase accordingly. In addition, since the work is performed in a narrow space, the injection of the resin into the through hole becomes unstable, and there is a problem that the reliability of sealing by the portion is lowered. Further, since components are mounted on the circuit board 1 and there are various wirings, it is difficult to provide a through hole in the circuit board 1. On the other hand, a solid-state imaging device capable of solving the above-described problems and ensuring sealing reliability is disclosed (for example, see Patent Document 1).

  FIG. 17 is a schematic diagram of a solid-state imaging device disclosed in Patent Document 1. FIG. 17A is a cross-sectional view, and FIG. 17B is a plan view showing a positional relationship among a housing, a through hole, and an IR cut filter. FIG. Hereinafter, a conventional example disclosed in Patent Document 1 will be described with reference to FIG. As shown in FIG. 17, this solid-state imaging device is different from the conventional example shown in FIG. 16 in that a through hole 12 is provided in the IR cut filter holding portion 9 of the housing 3. The other basic structure is the same as that of the conventional example shown in FIG. As shown in FIG. 17, the through hole 12 provided in the IR cut filter holding portion 9 is provided at a site inside the cylindrical body portion 3 a of the housing 3 and outside the IR cut filter 4. The outline of the sealing process of the solid-state imaging device is as follows. First, the imaging device 2 is fixed to the upper surface of the circuit board 1, the wiring 10 is applied, and then the frame 3 b of the housing 3 is covered so as to cover the imaging device 2. At the same time, the housing 3 is bonded and fixed to the circuit board 1 through a thermosetting adhesive (not shown). When bonding, the case 3 and the circuit board 1 are bonded to each other through a thermosetting adhesive and placed in a heating furnace (not shown), and heat treatment is performed to cure the thermosetting adhesive. However, since the through hole 12 is provided in the IR cut filter holding portion 9, the gas escapes to the outside, so that the pressure in the sealed space 8 of the image sensor 2 does not increase. When the bonding is completed, the lens holder 6 in which the lens 7 is incorporated is screwed and fixed to the cylindrical body portion 3a of the housing 3 through the screw mechanism 5.

Japanese Patent Laying-Open No. 2005-20412 (page 3, FIG. 2)

  However, in the solid-state imaging device according to the prior art shown in FIG. 17, when the resin or the like is injected into the through hole 12 and closed, the through hole 12 is provided in the IR cut filter holding unit 9, so Although it is possible to work, there is an advantage that the work is easy, but it is necessary to arrange the IR cut filter 4 so as not to block the through hole 12. In this case, the adhesive width b of the IR cut filter 4 in the vicinity of the through hole 12 is the size of the outer peripheral portion of the IR cut filter 4 and the size of the inner peripheral portion of the window portion 9a of the IR cut filter holding portion 9 facing this. It will be decided by Sato. Therefore, the value of the bonding width b of the IR cut filter 4 decreases with the downsizing of the solid-state imaging device, and the bonding area also decreases with this. For this reason, when downsizing the solid-state imaging device, it is difficult to ensure the adhesive strength of the IR cut filter 4. In general, a rectangular glass plate is used as the IR cut filter 4. However, when a sheet-like film is used instead of the glass plate in order to reduce the thickness of the solid-state imaging device, the adhesive strength is ensured. Was particularly difficult. Therefore, there is a problem that it is difficult to further reduce the size and thickness of the solid-state imaging device.

(Object of invention)
The present invention has been made in view of the above problems, and prevents an increase in pressure inside the housing, which is a sealing space of the image sensor due to heating in the sealing (adhesion) process, and also provides an adhesive strength of the IR cut filter. The object is to provide a small solid-state imaging device.

  To achieve the above object, a solid-state imaging device of the present invention is a solid-state imaging device having a circuit board on which an imaging element is mounted, a casing that covers the circuit board, and an IR cut filter and a lens that are provided inside the casing. A position having an IR cut filter holding portion for holding the IR cut filter, an air vent through hole provided in the IR cut filter holding portion, and an opening provided in the IR cut filter, wherein at least one of the openings overlaps the through hole It is provided in.

  The IR cut filter is a sheet-like film.

  Further, the IR cut filter has a plurality of openings.

  Further, the number of openings of the IR cut filter is larger than the number of through holes.

  As described above, according to the present invention, the IR cut filter holding portion provided in the housing, the air vent through hole provided in the IR cut filter holding portion, and the IR cut filter at a position corresponding to the through hole. Providing an opening prevents an increase in pressure inside the housing due to heating in the sealing (adhesion) process, and by increasing the adhesion area of the IR cut filter, ensures the adhesive strength of the IR cut filter, and A small solid-state imaging device can be realized.

  In the solid-state imaging device according to the present embodiment, the IR cut filter holding portion is provided with a through hole for venting air, the IR cut filter is provided with an opening, and the IR cut filter is provided with at least one of the openings of the IR cut filter holding portion. By arranging at a position overlapping with the through hole, an increase in pressure inside the housing, which is a sealing space of the image sensor due to heating in the sealing (adhesion) step, is prevented. Further, by increasing the bonding area of the IR cut filter, the bonding strength of the IR cut filter is ensured, and the solid-state imaging device is miniaturized.

  FIGS. 1 to 5 are diagrams showing a solid-state imaging device in Example 1 of the present embodiment, FIGS. 6 to 8 are diagrams showing a solid-state imaging device in Example 2, and FIGS. 9 to 11 are solid-state imaging in Example 3. FIG. FIGS. 12 to 14 are diagrams illustrating a solid-state imaging device according to a fourth embodiment, and FIG. 15 is a diagram illustrating a solid-state imaging device according to a fifth embodiment. In each embodiment, the same components as those in the conventional example are given the same reference numerals and description thereof is omitted. Hereinafter, specific embodiments will be described with reference to the drawings.

  1A and 1B are schematic diagrams illustrating a solid-state imaging device according to Example 1 of the present embodiment, in which FIG. 1A is a plan view and FIG. 1B is a cross-sectional view taken along line AA in FIG. 2 is a plan view showing the positional relationship between the through hole of the IR cut filter holding portion and the opening of the IR cut filter according to the first embodiment, FIG. 3 is a plan view showing the IR cut filter according to the first embodiment, and FIG. 5 is a plan view showing another example of the IR cut filter in Example 1, FIG. 5 is a partially enlarged schematic view showing the adhesion state in the vicinity of the opening of the IR cut filter of Example 1, and FIG. 5 (b) is a plan view showing a relief groove of the adhesive. Hereinafter, the solid-state imaging device according to the present embodiment will be described with reference to FIGS.

  The basic structure of the solid-state imaging device in this embodiment is similar to that of the conventional example, but will be described briefly. As shown in FIG. 1, the housing 13 is fixed to the circuit board 1 on which the image sensor 2 is mounted via an adhesive (not shown) so as to cover the image sensor 2, and the image sensor 2 is sealed. ing. The housing 13 includes a cylindrical body portion 13a and a frame body portion 13b. The imaging element 2 is housed inside the frame body portion 13b, and a lens holder 6 including a lens 7 is placed inside the cylindrical body portion 13a. Screwed by a screw mechanism 5. Further, an IR cut filter holding part 9 is provided between the lens 7 and the image sensor 2, and the IR cut filter holding part 9 is provided with a through hole 12 for venting air. The through hole 12 is disposed in an inner region of the cylindrical portion 13a. Further, an IR cut filter 14 for cutting infrared rays is attached to the side of the IR cut filter holding unit 9 facing the image sensor 2, and the IR cut filter 14 has a through hole 12 provided in the IR cut filter holding unit 9. A hole 14a is provided as an opening at a position overlapping with the hole 14a.

  FIG. 2 is a plan view showing the state of the inside of the housing 13 in an easy-to-understand manner with the circuit board 1 removed, and shows the housing 13 and the IR cut filter 14 viewed from the circuit board 1 side. As shown in FIGS. 2 and 3, the IR cut filter 14 has a substantially square shape, and is provided with holes 14 a and 14 b as two openings. The hole portion 14a is arranged at a position overlapping the through hole 12 of the IR cut filter holding portion 9, and is surrounded by the frame body portion 13a of the housing 13 and the circuit board 1 through the through hole 12 and the hole portion 14a. The air in the sealed space 8 of the image pickup device 2 is allowed to escape to the cylindrical body portion 13 b side of the housing 13.

  The hole 14b is provided at a position symmetrical to the hole 14a with respect to the center position 20 of the IR cut filter 14. For this reason, by rotating the IR cut filter 14 by 180 degrees with the center position 20 as a base point, the hole 14 b can be arranged at a position overlapping the through hole 12 of the IR cut filter holding part 9. As described above, it is sufficient that one hole as an opening of the IR cut filter 14 is disposed at a position overlapping the through hole 12 of the IR cut filter holding unit 9. In the step of attaching to 9, it is preferable because there is an advantage of improving workability by providing a plurality of openings as in this embodiment.

  The IR cut filter 14 is bonded and fixed to the IR cut filter holding part 9 using an adhesive. At this time, the adhesive flows out and the through hole 12 of the IR cut filter holding part 9 or the hole having the opening of the IR cut filter 14 is provided. There is a risk of blocking the portion 14a. Therefore, in this embodiment, as shown in FIG. 5, the hole 14 a is surrounded by a region outside the hole 14 a of the IR cut filter 14 arranged at a position overlapping the through hole 12 of the IR cut filter holding portion 9. A ring-shaped adhesive relief groove 15 is provided. As a result, the adhesive 16 that has flowed out can be guided to the escape groove 15, and the adhesive 16 can be prevented from flowing into the through hole 12 or the hole 14a.

  The IR cut filter 14 is formed by providing a filter layer that cuts infrared rays on the surface of a substrate that transmits visible light, or a sheet-like film made of a resin material such as polyester or acrylic. A glass plate can be used as the base material that transmits visible light. In the case of a glass plate, the practical thickness limit is about 0.3 mm, but the thickness of a sheet-like film can be reduced to about 0.1 mm. Therefore, the sheet-like film is preferable in terms of downsizing and thinning of the solid-state imaging device. Further, the processing of the holes 14a and 14b as the openings of the IR cut filter 14 is also easier with the sheet-like film, which is preferable in terms of cost. In this example, a sheet-like film was adopted as the IR cut filter 14, and a polymer interference multilayer filter (trade name: DISIR66010-RE) manufactured by Sumitomo 3M Limited was used. Note that the thickness of the polymer interference multilayer filter is approximately 0.1 mm.

  The outline of the sealing process of the solid-state imaging device in the present embodiment is almost the same as that of the conventional example, but will be briefly described. First, the image pickup device 2 is fixed to the upper surface of the circuit board 1, the wiring 10 is applied, and then the frame 13 b of the housing 13 is covered so as to cover the image pickup device 2, and a thermosetting adhesive (not shown) is applied. The housing 13 is bonded and fixed to the circuit board 1. When bonding, the case 13 and the circuit board 1 are bonded to each other through a thermosetting adhesive and placed in a heating furnace (not shown), and heat treatment is performed to cure the thermosetting adhesive. However, since the through hole 12 is provided in the IR cut filter holding portion 9 and the hole portion 14a of the IR cut filter 14 is provided at a position overlapping the through hole 12, the housing 13 is formed through the through hole 12 and the opening portion 14a. Is surrounded by the frame body portion 13a and the circuit board 1, and the air in the sealing space 8 of the image sensor 2 is released to the cylindrical body portion 13b side of the housing 13, from which the gas escapes to the outside. Therefore, the pressure in the sealed space 8 of the image sensor does not increase. When the bonding is completed, resin or the like is injected into the through hole 12 to close the through hole 12, and the lens holder 6 in which the lens 7 is incorporated is screwed and fixed to the cylindrical body portion 13a of the housing 13 via the screw mechanism 5. . Thereby, the airtightness inside the housing 13 can be ensured.

  As described above, according to the present embodiment, the IR cut filter holding portion 9 provided in the housing 13, the air vent through hole 12 provided in the IR cut filter holding portion 9, and the through hole 12 are supported. By providing a hole 14a as an opening of the IR cut filter 14 at a position where the image is to be sealed, an increase in the pressure in the sealed space 8 of the image pickup device 2, that is, the inside of the housing due to heating in the sealing (adhesion) process is prevented. Can do. Also, by increasing the bonding area of the IR cut filter 14, the bonding strength of the IR cut filter 14 can be ensured. As a result, it is possible to reduce the thickness by using a sheet-like film as the IR cut filter 14.

  FIG. 4 shows another example of the IR cut filter. In the present embodiment, the hole that penetrates the IR cut filter is described as an example of the opening of the IR cut filter. However, as shown in FIG. 4, the IR cut filter 17 has two notches 17a and 17b as openings. Even if it is provided, the same effect can be obtained. The two cutouts 17a and 17b extend from the holes 14a and 14b serving as the openings of the IR cut filter 14 toward the outer periphery of the IR cut filter 14 and are cut out. Thus, the IR cut filter 17 is functionally similar except that the two notches 17a and 17b are different from the holes 14a and 14b of the IR cut filter 14 in shape. Further, the other specifications of the IR cut filter 17 are the same as those of the IR cut filter 14, and therefore the description thereof is omitted.

  6A and 6B are schematic diagrams illustrating the solid-state imaging device according to the second embodiment. FIG. 6A is a plan view, FIG. 6B is a cross-sectional view taken along the line AA in FIG. FIG. 8 is a plan view showing the IR cut filter in the second embodiment. FIG. 8 is a plan view showing the positional relationship between the through hole of the IR cut filter holding part and the opening of the IR cut filter. The solid-state imaging device in the present embodiment is an example in which a through hole of the IR cut filter holding part is provided in a region outside the cylindrical body part of the housing, and a cutout of the IR cut filter is provided at a position overlapping the through hole. Other basic structures are the same as those in the first embodiment.

  As shown in FIG. 6, a housing 23 is fixed to the circuit board 1 on which the image sensor 2 is mounted via an adhesive (not shown) so as to cover the image sensor 2, and the image sensor 2 is sealed. ing. The casing 23 includes a cylindrical body portion 23a and a frame body portion 23b. The imaging element 2 is housed inside the frame body portion 23b, and a lens holder 6 including a lens 7 is placed inside the cylindrical body portion 23a. Screwed by a screw mechanism 5. Further, an IR cut filter holding unit 9 is provided between the lens 7 and the image pickup device 2, and an air vent through hole 22 is provided in the IR cut filter holding unit 9. The through hole 22 is disposed in an area outside the cylindrical body portion 13a, and the inside and outside of the frame body portion 23b of the housing communicate with each other through the through hole 22. Further, an IR cut filter 27 for cutting infrared rays is attached to a side of the IR cut filter holding unit 9 facing the image sensor 2, and the IR cut filter 27 has a through hole 22 provided in the IR cut filter holding unit 9. A cutout portion 27a is provided as an opening at a position overlapping with.

  FIG. 7 is a plan view showing the state of the inside of the housing 23 in an easy-to-understand manner with the circuit board 1 removed, and shows the housing 23 and the IR cut filter 27 viewed from the circuit board 1 side. As shown in FIGS. 7 and 8, the IR cut filter 27 has a substantially square shape, and is provided with notches 27a, 27b, 27c, and 27d as openings at each of the four corners. The cutout portion 27a is disposed at a position overlapping the through hole 22 of the IR cut filter holding portion 9, and is surrounded by the frame body portion 23a of the housing 23 and the circuit board 1 through the through hole 22 and the cutout portion 27a. The air in the sealed space 8 of the image sensor is allowed to escape to the outside of the housing 23.

  Since the notches 27a, 27b, 27c, and 27d are arranged at the four corners of the IR cut filter 27, every time the IR cut filter 27 is rotated 90 degrees from the center position, the notches 27a to 27b are provided. 27c, 27d can be arranged at positions overlapping the through hole 22 of the IR cut filter holding portion 9. A single cutout portion as an opening of the IR cut filter 27 may be disposed at a position overlapping the through hole 22 of the IR cut filter holding portion 9, but the step of attaching the IR cut filter 27 to the IR cut filter holding portion 9 In this embodiment, it is preferable to provide a plurality of openings as in this embodiment, which has the advantage of improving workability. In addition, as the IR cut filter 27, the same sheet-like film as Example 1 is employ | adopted, Since it is the same as that of Example 1 also about adhesion | attachment to the IR cut filter holding part 9, description is abbreviate | omitted.

  The sealing process of the solid-state imaging device in the present embodiment is the same as that in the first embodiment in that the housing 23 is bonded and fixed to the circuit board 1 via a thermosetting adhesive (not shown). The image sensor 2 is sealed by being surrounded by the frame body portion 23b of the housing 23 and the circuit board 1 through the through hole 22 provided in the holding portion 9 and the cutout portion 27a of the IR cut filter 27 provided at a position overlapping the through hole 22. The structure is such that the air in the stop space 8 is released to the outside of the housing 23, and the pressure in the sealed space 8 of the image sensor 2 does not increase. When the bonding is completed, the lens holder 6 is screwed and fixed to the cylindrical body portion 23a of the housing 23, and finally, resin or the like is injected into the through hole 22 exposed to the outside of the housing 23 to close the through hole 22. Accordingly, the airtightness inside the housing 23 can be ensured. As described above, also in the present embodiment, by increasing the bonding area of the IR cut filter 27, the bonding strength of the IR cut filter 27 can be secured, and the same effect as in the first embodiment can be obtained.

  FIG. 9 is a schematic diagram illustrating a solid-state imaging device according to the third embodiment. FIG. 9A is a plan view, FIG. 9B is a cross-sectional view taken along line AA in FIG. 9A, and FIG. The top view which shows the positional relationship of the through-hole of the IR cut filter holding | maintenance part in Example 3, and the opening part of IR cut filter, FIG.10 (b) is AA sectional drawing in Fig.10 (a), FIG. 3 is a plan view showing an IR cut filter 3. FIG. The solid-state imaging device according to the present embodiment is an example in which the cylindrical body portion and the frame body portion constituting the housing are separated, and the other points are the same as those of the first embodiment.

  As shown in FIG. 9, the housing 33 is fixed to the circuit board 1 on which the image sensor 2 is mounted via an adhesive (not shown) so as to cover the image sensor 2, and the image sensor 2 is sealed. ing. The housing | casing 33 is provided with the cylinder part 33a and the frame part 33b, and each is formed by the different body. The cylindrical portion 33a and the frame portion 33b are bonded and fixed in a sealing step as will be described later. The imaging element 2 mounted on the circuit board 1 is housed inside the frame body portion 33b, and the lens holder 6 including the lens 7 is screwed into the inside of the tubular body portion 33a by the screw mechanism 5. The IR cut filter holding part 9 is provided on the side of the frame part 33b where the cylindrical part 33a is disposed, and the IR cut filter holding part 9 is provided with a through hole 32 for venting air. The through hole 32 is disposed in an inner region of the cylindrical portion 33a, and the inside and the outside of the frame portion 33b communicate with each other through the through hole 32. Further, an IR cut filter 24 for cutting infrared rays is attached to the side of the IR cut filter holding unit 9 facing the lens 7, and the IR cut filter 24 includes a through hole 32 provided in the IR cut filter holding unit 9. A hole 24a is provided as an opening at the overlapping position.

  FIG. 10A is a plan view showing the state of the inside of the housing 33 in an easy-to-understand manner by removing the cylindrical portion 33a, and shows the frame portion 33b and the IR cut filter 24 viewed from the cylindrical portion 33a side. ing. FIG.10 (b) is AA sectional drawing in Fig.10 (a). As shown in FIGS. 10A and 11, the IR cut filter 24 has a substantially square shape, and is disposed and fixed to a guide portion 9 b provided in the IR cut filter holding portion 9. The IR cut filter 24 is provided with holes 24a and 24b as two openings. The hole 24 a is arranged at a position overlapping the through hole 32 of the IR cut filter holding unit 9, and is surrounded by the frame 33 a of the housing 33 and the circuit board 1 through the through hole 32 and the hole 24 a. The air in the sealed space 8 of the image sensor 2 is allowed to escape to the outside. Further, a side wall 18 rising along the outer periphery of the frame portion 33b is formed outside the guide portion 9b, and the cylindrical portion 33a is arranged and fixed inside the side wall 18.

  The hole 24b of the IR cut filter 24 is provided at a position symmetrical to the hole 24a with respect to the center position of the IR cut filter 24. Further, as the IR cut filter 24, the same sheet-like film as that of the first embodiment is adopted, and the adhesion to the IR cut filter holding portion 9 is also the same as that of the first embodiment, so that the description thereof is omitted.

  In the sealing process of the solid-state imaging device in the present embodiment, the frame 33b of the housing 33 is bonded and fixed to the circuit board 1 via a thermosetting adhesive (not shown). The air in the sealing space 8 of the imaging device surrounded by the frame body portion 33b and the circuit board 1 through the through hole 32 to be provided and the hole 24a of the IR cut filter 24 provided at a position overlapping with the through hole 32 is the frame body portion 33b. The pressure in the sealed space 8 of the image sensor does not increase. Thereafter, the cylindrical body portion 33a is disposed inside the side wall 18 of the frame body portion 33b and bonded and fixed with an adhesive. When the bonding is completed, resin or the like is injected into the through hole 32 to close the through hole 32 to ensure the airtightness inside the housing 33. Next, the lens holder 6 is screwed and fixed to the cylindrical portion 33a of the housing. Thus, also in the present embodiment, by increasing the bonding area of the IR cut filter 24, the bonding strength of the IR cut filter 24 can be ensured, and the same effect as in the first embodiment can be obtained.

  12A and 12B are schematic diagrams illustrating a solid-state imaging device according to the fourth embodiment. FIG. 12A is a plan view, FIG. 12B is a cross-sectional view taken along line AA in FIG. 12A, and FIG. The top view which shows the positional relationship of the through-hole of the IR cut filter holding | maintenance part in Example 4, and the opening part of IR cut filter, FIG.13 (b) is AA sectional drawing in Fig.13 (a). FIG. 14 is a plan view showing an IR cut filter according to the fourth embodiment. The solid-state imaging device in the present embodiment is an example in which a through hole of the IR cut filter holding part is provided in a region outside the cylindrical body part of the housing, and a cutout of the IR cut filter is provided at a position overlapping the through hole. Since the other basic structure is the same as that of Example 3, description is abbreviate | omitted.

  As shown in FIG. 12, the IR cut filter holding portion 9 is provided with a through hole 42 for venting air. The through hole 42 is disposed in a region corresponding to the outside of the cylindrical body portion 33a, and the inside and the outside of the frame body portion 33b communicate with each other through the through hole 42. Further, an IR cut filter 37 for cutting infrared rays is attached to the side of the IR cut filter holding unit 9 facing the lens 7, and the IR cut filter 37 has a through hole 42 provided in the IR cut filter holding unit 9. A cutout 37a is provided as an opening at the overlapping position.

  FIG. 13 is a plan view showing the state of the inside of the housing 33 in an easy-to-understand manner by removing the cylindrical portion 33a, and shows the frame portion 33b and the IR cut filter 37 viewed from the cylindrical portion 33a side. . As shown in FIGS. 13 and 14, the IR cut filter 37 has a substantially square shape, and is disposed and fixed to a guide portion 9 b provided in the IR cut filter holding portion 9. The IR cut filter 37 is provided with notches 37a, 37b, 37c, and 37d as openings at each of the four corners. The cutout portion 37a is disposed at a position overlapping the through hole 42 of the IR cut filter holding portion 9, and is surrounded by the frame body portion 33b of the housing 33 and the circuit board 1 through the through hole 42 and the cutout portion 37a. The air in the sealed space 8 of the image sensor 2 is allowed to escape to the outside.

  Since the cutout portions 37a, 37b, 37c, and 37d of the IR cut filter 37 are arranged at the four corners of the IR cut filter 37, every time the IR cut filter 37 is rotated by 90 degrees with the center position as a base point. The cutout portions 37a to 37b, 37c, and 37d can be arranged at positions that overlap with the through holes 42 of the IR cut filter holding portion 9. The specifications of the IR cut filter 37 are the same as those of the IR cut filter 27 of the second embodiment. Yes, the same sheet-like film as in Example 1 is adopted, and the adhesion to the IR cut filter holding unit 9 is also the same as in Example 1, and the description thereof is omitted.

  In the sealing process of the solid-state imaging device in the present embodiment, the frame 33b of the housing 33 is bonded and fixed to the circuit board 1 via a thermosetting adhesive (not shown). The air in the sealing space 8 of the image sensor 2 is surrounded by the frame body portion 33b and the circuit board 1 through the through hole 42 to be provided and the cutout portion 37a of the IR cut filter 37 provided at a position overlapping the through hole 42. The structure escapes to the outside of the portion 33b, and the pressure in the sealed space 8 of the image sensor 2 does not increase. Thereafter, the cylindrical body portion 33a is disposed inside the side wall 18 of the frame body portion 33b and bonded and fixed with an adhesive. Accordingly, the through hole 32 provided in the IR cut filter holding portion 9 is closed by the cylindrical portion 33a, and the airtightness inside the housing 33 is ensured. When the bonding is completed, the lens holder 6 is screwed and fixed to the cylindrical portion 33a of the housing 33. Thus, also in the present embodiment, by increasing the bonding area of the IR cut filter 37, the bonding strength of the IR cut filter 37 can be secured, and the same effect as in the first embodiment can be obtained.

  FIG. 15 is a schematic cross-sectional view illustrating the solid-state imaging device according to the fifth embodiment. The solid-state imaging device according to the present embodiment is an example in which an imaging element is disposed on one surface of a circuit board and a housing is disposed on the other surface, and the others are the same as in the first embodiment. As shown in FIG. 15, the image pickup device 2 is mounted on one surface of the circuit board 11, and a housing 43 is disposed on the other surface facing the circuit substrate 11 and fixed via an adhesive (not shown). The circuit board 11 is provided with a substrate opening 11a for irradiating the image sensor 2 with light received from the other surface side. The housing 43 includes a cylindrical body portion 43a and a frame body portion 43b. A lens holder 6 including a lens 7 is screwed into the cylindrical body portion 43a by a screw mechanism 5.

  Further, an IR cut filter holding part 9 is provided between the lens 7 and the circuit board 11 in the housing 43, and the IR cut filter holding part 9 is provided with a through hole 12 for venting air. The through-hole 12 is disposed inside the cylindrical body portion 43a and inside the substrate opening 11a. Further, an IR cut filter 14 for cutting infrared rays is attached to the side of the IR cut filter holding unit 9 facing the image sensor 2, and the IR cut filter 14 has a through hole 12 provided in the IR cut filter holding unit 9. A hole 14a is provided as an opening at a position overlapping with the hole 14a.

  The hole 14b of the IR cut filter 14 is provided at a position symmetrical to the hole 14a with respect to the center position of the IR cut filter 14. Further, the IR cut filter 14 is the same as that of the first embodiment, and the adhesion to the IR cut filter holding portion 9 is the same as that of the first embodiment.

  In the manufacturing process of the solid-state imaging device in the present embodiment, the housing 43 is bonded and fixed to the circuit board 11 via a thermosetting adhesive (not shown), but the through hole 12 provided in the IR cut filter holding unit 9; It has a structure in which the air in the space 19 surrounded by the frame body portion 43b and the circuit board 11 is released to the cylindrical body portion 43a side through the hole portion 14a of the IR cut filter 14 provided at a position overlapping the through hole 12. The pressure in the space 19 does not increase. When the bonding is completed, resin or the like is injected into the through hole 12 to close the through hole 12 to ensure the airtightness inside the housing 43. Next, the lens holder 6 is screwed and fixed to the cylindrical portion 43 a of the housing 43. Thus, also in the present embodiment, by increasing the bonding area of the IR cut filter 14, the bonding strength of the IR cut filter 14 can be secured, and the same effect as in the first embodiment can be obtained.

In the present embodiment, the example in which the IR cut filter has a substantially square shape has been described. However, the present invention is not limited to this shape, and can be set as needed.
Moreover, although the case where the number of through holes provided in the IR cut filter holding unit 9 is one has been described as an example, the present invention is not limited to this, and a plurality of through holes may be provided as necessary.

FIG. 1A is a schematic diagram illustrating a solid-state imaging device according to a first embodiment of the present invention, FIG. 1A is a plan view, and FIG. 1B is a cross-sectional view taken along line AA in FIG. It is a top view which shows the positional relationship of the through-hole of the IR cut filter holding | maintenance part in Example 1 of this invention, and the opening part of IR cut filter. It is a top view which shows IR cut filter in Example 1 of this invention. It is a top view which shows the other example of IR cut filter in Example 1 of this invention. FIG. 5 is a partially enlarged schematic view showing an adhesion state in the vicinity of the opening of the IR cut filter according to Example 1 of the present invention, FIG. 5A is a cross-sectional view, and FIG. 5B is a plan view showing an escape groove of the adhesive. . 6A and 6B are schematic views illustrating a solid-state imaging device according to Embodiment 2 of the present invention, in which FIG. 6A is a plan view and FIG. 6B is a cross-sectional view taken along line AA in FIG. It is a top view which shows the positional relationship of the through hole of the IR cut filter holding | maintenance part in Example 2 of this invention, and the opening part of IR cut filter. It is a top view which shows IR cut filter in Example 2 of this invention. FIG. 9A is a schematic diagram illustrating a solid-state imaging device according to a third embodiment of the present invention, FIG. 9A is a plan view, and FIG. 9B is a cross-sectional view taken along line AA in FIG. FIGS. 10A and 10B show a positional relationship among a casing, a through hole, and an opening of an IR cut filter in Example 3 of the present invention, FIG. 10A is a plan view, and FIG. 10B is an A- in FIG. It is A sectional drawing. It is a top view which shows IR cut filter in Example 3 of this invention. FIG. 12A is a schematic diagram illustrating a solid-state imaging device according to a fourth embodiment of the present invention, FIG. 12A is a plan view, and FIG. 12B is a cross-sectional view taken along line AA in FIG. The positional relationship of the through-hole of the IR cut filter holding | maintenance part in Example 4 of this invention and the opening part of IR cut filter is shown, Fig.13 (a) is a top view, FIG.13 (b) is FIG.13 (a). It is AA sectional drawing in. It is a top view which shows IR cut filter in Example 4 of this invention. It is a schematic sectional drawing which shows the solid-state imaging device in Example 5 of this invention. It is a schematic sectional drawing which shows the solid-state imaging device in a prior art. FIG. 17A is a schematic diagram illustrating another example of a solid-state imaging device according to the prior art, FIG. 17A is a cross-sectional view, and FIG. 17B illustrates a positional relationship among a housing, a through hole, and an opening of an IR cut filter. It is a top view.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Circuit board 2 Image pick-up element 3, 13, 23, 33, 43 Case 3a, 13a, 23a, 33a, 43a Case body part 3b, 13b, 23b, 33b, 43b Case body part 4 IR cut Filter 5 Screw mechanism 6 Lens holder 7 Lens 8 Sealing space 9 of solid-state imaging device IR cut filter holding portion 9a Window portion 9b of IR cut filter holding portion Guide portion 10 Wiring 11 Circuit board (with opening)
11a Circuit opening 12, 22, 32, 42 Through hole 14, 24 IR cut filter holding part IR cut filter (with hole)
14a, 24a IR cut filter hole (opening)
14b, 24b IR cut filter hole (opening)
15 Adhesive groove 16 Adhesive 17 IR cut filter (2 notches)
17a, 17b IR cut filter notch (opening)
18 Side wall 19 Space 20 IR cut filter center 27 IR cut filter (4 notches)
27a, 27b, 27c, 27d IR cut filter notch (opening)
37 IR cut filter (4 notches)
37a, 37b, 37c, 37d IR cut filter notch (opening)

Claims (4)

  In a solid-state imaging device having a circuit board on which an imaging element is mounted, a casing that covers the circuit board, and an IR cut filter and a lens provided in the casing, an IR cut filter holding unit that holds the IR cut filter Part, an air vent through hole provided in the IR cut filter holding part, and an opening provided in the IR cut filter, and at least one of the openings is provided at a position overlapping the through hole. A solid-state imaging device.   The solid-state imaging device according to claim 1, wherein the IR cut filter is a sheet-like film.   The solid-state imaging device according to claim 1, wherein the IR cut filter has a plurality of openings.   The solid-state imaging device according to claim 3, wherein the number of openings of the IR cut filter is larger than the number of the through holes.

Images