JP2008131399A - Substrate support structure of imaging apparatus and imaging apparatus - Google Patents

Abstract

Each circuit board is separable, enables partial replacement of the circuit board, supports each circuit board easily and reliably, and sacrifices the assembly of an imaging device (video camera, etc.) Without reducing the size of the image pickup apparatus, the vibration resistance is improved.
Control boards 80a to 80c (circuit boards) on which electronic components 81 and connectors 83a to 83c are mounted, bottom panels 30 and top panels 40 for accommodating the control boards 80a to 80c, and control boards The control boards 80a to 80c are connected to the connectors 83a to 83c with the FFCs 82a and 82b, and the one end faces are made of silicon rubber. The other end surface is held by the bottom panel 30 by being pressed by 41.
[Selection] Figure 6

Description

  The present invention relates to a substrate support structure and an imaging apparatus for an imaging apparatus that accommodates and supports a plurality of circuit boards having electronic components and connectors mounted on a surface in a base case and a cover case. More specifically, the present invention relates to a technique that easily and reliably supports each circuit board, and is excellent in assembling of the imaging device while reducing the size of the imaging device and enhancing the vibration resistance.

  An imaging apparatus such as a video camera forms light on an imaging surface of an imaging element (for example, a CCD (Charge Coupled Devices) device, etc.) by an optical system such as a lens or an optical filter, and the light of the image. The light and dark due to is photoelectrically converted into the amount of electric charge, which is read out sequentially and converted into an electrical signal.

  Here, various electronic components such as a CCD device are mounted on a plurality of circuit boards and housed inside a video camera case. The circuit boards are electrically connected. And as a method of electrically connecting each circuit board, a method using a board-to-board connector, a method of connecting each circuit board stacked up and down with electrical wiring, each circuit board by a multilayer flexible board And a method for integrating the electric wiring and the like are known.

  Among these, in the method using the board-to-board connector, in order to ensure the reliability of soldering, it is necessary to make the terminal pitch of the connector 0.8 mm or more, and the size of the connector becomes large. . Since the size of the connector affects the space between the circuit boards and the effective mounting area of the electronic components on the circuit board in the video camera case, the size of the connector is hindered. In addition, there is a stress on the solder part due to the mounting deviation of the connector, and there is a possibility of causing a crack in the solder part. Therefore, it is necessary to improve mounting accuracy and incorporate a structural crack prevention measure. Furthermore, when the video camera is used in a vibration environment, the vibration of the circuit board is transmitted to the contact portion of the connector, causing a contact failure of the contact portion.

  Next, in the method of connecting the circuit boards stacked one above the other with electric wiring, the structure of each circuit board is stacked, so that the assembling property and workability at the time of electrical adjustment are deteriorated, and the screwing of each circuit board is performed. A lot of work man-hours are required for fixing and connecting electric wiring. In addition, the number of screws increases and the weight also increases. Furthermore, the lower circuit board has more holes due to the influence of the fixing posts, and the effective mounting area of the electronic component is reduced.

On the other hand, the method of using a multilayer flexible substrate is the method with the best mounting efficiency of electronic components and excellent in miniaturization of the imaging device. Therefore, in place of the method of using the board-to-board connector described above and the method of connecting the circuit boards stacked one above the other with electrical wiring, it is adopted as a substrate support structure for a video camera (for example, , See Patent Document 1).
JP 2001-275022 A

FIG. 7 is an exploded perspective view showing a substrate support structure of the conventional video camera 100 described in Patent Document 1 described above.
As shown in FIG. 7, between the front panel 110 and the rear panel 120, a circuit board 180a on which the CCD device 140 is mounted, a circuit board 180b connected with the circuit board 180a and a flexible cable 181a, and a circuit board 180b are flexible. A circuit board 180c connected by a cable 181b is disposed. The circuit boards 180a, 180b, 180c and the flexible cables 181a, 181b are integrated to form a multilayer flexible board 180.

  However, in the technique described in Patent Document 1, each of the circuit boards 180a to 180c and the flexible cables 181a and 181b are integrated by the multilayer flexible board 180, so that one of the circuit boards 180a to 180c. Even when there is only a problem, there is a problem that the multilayer flexible board 180 (all of the circuit boards 180a to 180c and the flexible cables 181a and 181b) must be replaced. In addition, since the multilayer flexible substrate 180 is formed of a polyimide resin, it is vulnerable to heat, and circuit patterns are peeled off and contact failure is likely to occur due to heat generated by replacement of electronic components, and repair is difficult. Furthermore, it is difficult to support each of the circuit boards 180a to 180c easily and reliably, and in particular, since the support of the intermediate circuit board 180b is likely to be insufficient, there is a problem in enhancing vibration resistance.

  Therefore, the problem to be solved by the present invention is that each circuit board can be separated, the circuit board can be partially exchanged, and each circuit board is supported easily and reliably, and the imaging device (video) This is to reduce the size of the imaging device and enhance the vibration resistance without sacrificing the assemblability of the camera.

The present invention solves the above-described problems by the following means.
According to a first aspect of the present invention, there is provided an imaging apparatus comprising: a plurality of circuit boards on which electronic components and connectors are mounted; and a base case and a cover case for housing the circuit boards. A circuit board support structure comprising a pressing member that presses one end surface of each circuit board toward the base case, and each circuit board is connected to each connector with a flexible flat cable, and has one end surface It is pressed by the pressing member, and the other end surface is held by the base case.

  The invention according to claim 6, which is another one of the present invention, includes a plurality of circuit boards having electronic components and connectors mounted on the surface thereof, and a base case and a cover case for housing the circuit boards. An imaging device comprising: a pressing member that presses one end surface of each circuit board toward the base case; each circuit board having a flexible flat cable connected to each connector; It is pressed by the pressing member, and the other end surface is held by the base case.

(Function)
The invention described in claim 1 and claim 6 includes a pressing member that presses one end surface of each circuit board toward the base case, and each circuit board has a flexible flat cable connected to each connector. The one end surface is pressed by the pressing member, and the other end surface is held by the base case. Therefore, each circuit board can be separated by removing the flexible flat cable from each connector. Moreover, since each circuit board hold | maintained at the base case is pressed by a pressing member, each circuit board is supported easily and reliably.

  According to the invention described above, since the circuit boards can be separated from each other, the circuit boards can be partially exchanged. Moreover, since each circuit board is connected by a flexible flat cable, the image pickup apparatus can be reduced in size. Furthermore, since each circuit board is supported easily and reliably, the vibration resistance can be enhanced without sacrificing the assembling property of the imaging apparatus.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the following embodiments, as will be described later, a video camera 1 suitable for industrial use such as FA (Factory Automation) is exemplified as an imaging apparatus of the present invention. The video camera 1 of the present embodiment uses a CCD device 140 as an image sensor.

FIG. 1 is a perspective view showing a video camera 1 of the present embodiment.
As shown in FIG. 1, the video camera 1 according to the present embodiment includes a front panel 10, a rear panel 20, a bottom panel 30 (corresponding to a base case in the present invention), and a top panel 40 (the main panel). Equivalent to the cover case in the invention). As will be described later, the top panel 40 has a U-shaped cross section, and the U-shaped opening is covered toward the bottom panel 30.

  Further, on the front side of the front panel 10 is formed a cylindrical portion 11 in which a screw for attaching a lens is engraved on the inner surface, and this cylindrical portion 11 is a lens mount for mounting the lens. Therefore, the video camera 1 can be equipped with various lenses such as a focal length according to the application. An optical filter 120 and a CCD device 140 are attached to the back side of the front panel 10 in the cylindrical portion 11.

  Here, the video camera 1 according to the present embodiment is used in, for example, a mounting machine that mounts an electronic component such as an IC chip on a printed board, an inspection apparatus that images each inspection site of a semiconductor device that is continuously supplied, and the like. It is done. That is, the electronic component is moved to the mounting part of the electronic component in accordance with the printed board, and the mounting part is imaged with high accuracy to position the electronic component. In addition, it moves to the inspection site in accordance with the supply of the semiconductor device, and inspects the presence / absence of defects by imaging the inspection site with high accuracy.

Therefore, not only the vibration due to the movement of the video camera 1 itself but also various vibrations act on the video camera 1 from a printed circuit board, an electronic component transport unit, a semiconductor device supply unit, and the like.
Thus, since the video camera 1 of this embodiment is used in a very severe environment, it is reduced in size and weight and has high vibration resistance. Specifically, the video camera 1 is about 2G. It can operate continuously for 24 hours under the vibration environment.

FIG. 2 is an exploded perspective view showing the video camera 1 of this embodiment, and shows a state in which the top panel 40 shown in FIG. 1 is removed.
When the top panel 40 (see FIG. 1) having a U-shaped cross section is removed, the CCD substrate 60 on which the CCD device 140 (see FIG. 1) is mounted and the external connector 50 enable electrical connection to the outside. A board 70, three control boards 80a to 80c (corresponding to a circuit board in the present invention) on which various electronic components such as a DC / DC converter are mounted, and an L-shaped holding metal fitting 90 (a holding in the present invention) (Corresponding to the member) is exposed.

  Here, the CCD substrate 60 is attached to the back side of the front panel 10 in parallel with the front panel 10. The connector board 70 is attached to the inner side of the rear panel 20 in parallel with the rear panel 20. Further, the three control boards 80a to 80c are held by the bottom panel 30 such that their lower portions have a predetermined interval in a direction perpendicular to the CCD board 60 and the connector board 70, respectively.

  The CCD board 60 and the connector board 70 are electrically connected to the control board 80a and the control board 80c by a harness (a bundle of electric wires), and the control boards 80a to 80c are respectively connected to each other by an FFC (flexible flexible board). It is electrically connected by a flat cable. In addition, the holding metal fitting 90 is disposed on the upper side of each of the control boards 80a to 80c, is bent in an L shape, and is positioned in parallel with the outer control board 80a. Therefore, the CCD substrate 60, the connector substrate 70, and the three control substrates 80a to 80c can be arranged with high density, and the video camera 1 is reduced in size and weight.

  Incidentally, an adjustment volume (not shown) for mounting a correct captured image is mounted on the CCD substrate 60. This adjustment volume is used for electrical adjustment to match the imaging waveform, and is operated with the top panel 40 (see FIG. 1) removed. That is, in the electrical adjustment in the manufacturing process of the video camera 1, the measuring instrument probe is applied to the adjustment volume and the check land inside the video camera 1, the waveform is confirmed, and the final adjustment is performed. Do not install.

  Therefore, an opening 91 for operating the adjustment volume is formed on the upper surface of the holding metal 90 and on the end on the CCD substrate 60 side. Then, an adjustment jig is inserted from the opening 91, and the adjustment volume is operated to perform electrical adjustment, whereby images picked up by the CCD device 140 (see FIG. 1) are predetermined by the control boards 80a to 80c. It is converted into an electric signal, and a correctly adjusted image is output to the outside.

  Further, the upper surface of the holding metal fitting 90 is a support portion 92 that supports the control boards 80 a to 80 c on the opposite side of the bottom panel 30. That is, the bottom panel 30 erects the control boards 80a to 80c, and the control boards 80a to 80c are not fixed as they are. Therefore, by sandwiching the control boards 80 a to 80 c between the bottom panel 30 and the support portion 92, the upper portions of the control boards 80 a to 80 c are held by the front panel 10 and the rear panel 20 via the holding bracket 90. I have to. Note that the control board 80a and the control board 80c are fixed together by screwing the holding metal fitting 90 with the fixing screw 84 together.

  Furthermore, the holding metal fitting 90 is made of metal and includes a heat radiating portion 93 that contacts the surface side of the electronic component mounted on the control board 80a. The heat radiating portion 93 is a portion that is bent from the support portion 92 and is positioned in parallel with the control substrate 80a, and has a resilience toward the outside of the top panel 40 (see FIG. 1). The heat radiating portion 93 is formed with a curved convex portion 93 a that contacts the inner surface of the top panel 40. Therefore, when the convex part 93a contacts and presses the inner surface of the top panel 40, the heat radiating part 93 contacts the surface side of the electronic component, and a heat radiating effect is obtained.

  Furthermore, a cutout portion 94 for pressing the silicon rubber 41 (corresponding to a pressing member in the present invention) against the upper portions of the control boards 80a to 80c is formed at the center of the upper surface of the holding metal fitting 90. . That is, the silicon rubber 41 is affixed to the back surface (ceiling surface) of the top panel 40 (see FIG. 1). When the top panel 40 is covered, the silicon rubber 41 enters between the notches 94, and each control is performed. The substrates 80a to 80c are pressed toward the bottom panel 30. Therefore, since each control board 80a-80c is pressed down by the silicone rubber 41, the high vibration resistance (quality reliability) of the video camera 1 of this embodiment used in a severe vibration environment is ensured. It becomes.

FIG. 3 is a perspective view showing the positional relationship between the control boards 80a to 80c and the holding bracket 90 in the video camera 1 of the present embodiment.
As shown in FIG. 3, three control boards 80 a to 80 c are erected on the bottom panel 30. That is, the bottom panel 30 includes three pedestals 31a to 31c. The three bases 31a to 31c have grooves for fitting the lower portions of the control boards 80a to 80c, and the control boards 80a to 80c are erected by the grooves.

  Here, various electronic components 81 are mounted on each of the control boards 80a to 80c, but some of the electronic parts 81 mounted on the respective control boards 80a to 80c are very heat generating (heat generating parts). 81a) and some are not. In the video camera 1 of the present embodiment, the control board 80a on which the heat generating component 81a having a large heat generation among the electronic components 81 is mounted is disposed on the outside (left side in FIG. 3), and the heat generating component 81a faces the outside. Yes. Therefore, the heat generated by the heat generating component 81a does not stay between the control board 80a and the control board 80b. In addition, since the heat generating component 81a is not mounted on the control board 80b and the control board 80c, the heat generation of the electronic component 81 mounted on the control board 80b and the control board 80c does not cause a problem. About the board | substrate 80c, the heat-emitting component 81a can be mounted similarly to the control board 80a.

  The control board 80a and the control board 80b are electrically connected by an FFC (flexible flat cable) 82a, and the control board 80b and the control board 80c are electrically connected by an FFC 82b. Yes. The control board 80a and the control board 80c are electrically connected to the CCD board 60 (see FIG. 2) and the connector board 70 (see FIG. 2) by a harness (not shown).

  The holding bracket 90 supports the control boards 80a to 80c by the support portion 92 on the opposite side of the bottom panel 30 and releases heat of the heat generating component 81a mounted on the control board 80a by the heat radiating portion 93. is there. That is, support pieces 95 are formed at both ends of the support portion 92, and the control board 80a and the control board 80c are supported by fixing the fixing screws 84 to the support pieces 95. On the other hand, a pair of support pieces 96 are arranged with a gap at the center of the support portion 92, and are supported by inserting the control board 80b into the gap. Since the support portion 92 is fixed to the front panel 10 (see FIG. 2) by the fixing piece 97 and fixed to the rear panel 20 (see FIG. 2) by the fixing piece 98, each control board 80a to 80c is supported by the support portion. It is fixed to the front panel 10 and the rear panel 20 via 92.

  The heat radiating portion 93 of the holding metal fitting 90 is formed by being bent into an L shape from the support portion 92. Therefore, the heat radiating part 93 is a leaf spring having rebound resilience at the bent part, and the heat radiating part 93 is balanced in a state of being opened slightly outward. And the heat radiating part 93 is located in parallel with the control board 80a, and the part (contact part) inside the heat radiating part 93 and facing the surface side of the heat-generating component 81a has high thermal conductivity and generates heat. A heat conductive rubber 99 that can effectively release the heat generated by the component 81a is attached. The opposite side of the heat dissipating part 93 is also bent to prevent rubbing with the inner surface side of the top panel 40 (see FIG. 1).

  Thus, although the heat radiating part 93 of the holding metal fitting 90 is provided with the heat conductive rubber 99 on the inner side, the heat radiating part 93 is slightly opened outward with respect to the control board 80a. There is a gap between the heat generating component 81a. This gap is necessary and sufficient for covering the holding bracket 90 from the upper side of each control board 80a to 80c and simply fixing the support portion 92 to the front panel 10 (see FIG. 2) and the rear panel 20 (see FIG. 2). It has become. Therefore, the video camera 1 of this embodiment is excellent in assemblability.

  And the convex part 93a which protruded outside is formed in the thermal radiation part 93. As shown in FIG. This convex part 93a is for making the holding metal fitting 90 exhibit a heat radiation function. That is, as described above, the heat radiating portion 93 is balanced in a state of being slightly opened outward. Therefore, in this state, the heat conductive rubber 99 does not contact the surface of the heat generating component 81a. Therefore, when covering the top panel 40 (see FIG. 1), the convex portion 93a comes into contact with the inner surface of the top panel 40, and the heat radiating portion 93 is pressed toward the control board 80a, so that the heat conductive rubber. 99 is in close contact with the surface of the heat generating component 81a.

  Further, as described above, when the top panel 40 (see FIG. 1) is put on, the control boards 80 a to 80 c are pressed by the silicon rubber 41. That is, the upper part of each control board 80a-80c is pressurized with the silicon rubber 41 which has cushioning properties, and the vibration of each control board 80a-80c in the top panel 40 is suppressed.

FIG. 4 is a perspective view showing the top panel 40 in the video camera 1 of the present embodiment.
As shown in FIG. 4, the top panel 40 has a U-shaped cross section, and the U-shaped opening 40a is attached toward the bottom panel 30 (see FIG. 3). That is, a stepped portion 40 b is provided at the U-shaped tip, and the stepped portion 40 b is fitted inside the bottom panel 30 and fixed. Then, when the U-shaped opening 40a is covered toward the bottom panel 30 and the stepped portion 40b is fitted, the control boards 80a to 80c (see FIG. 3) and the holding bracket 90 (see FIG. 3) are placed inside the top panel 40. ) Is housed.

A silicon rubber 41 is attached to the ceiling surface of the top panel 40. Therefore, when the U-shaped opening 40a of the top panel 40 is put on the bottom panel 30 (see FIG. 3), the silicon rubber 41 presses the control boards 80a to 80c (see FIG. 3) from above. Become. As a result, the control substrates 80a to 80c are firmly held by the pressure of the silicon rubber 41 so as not to move.
Then, next, the mutual relationship between the top panel 40 and each control board 80a-80c is demonstrated.

FIG. 5 is a side view showing the mutual relationship between the top panel 40 and the control boards 80a to 80c in the video camera 1 of the present embodiment, and shows a state where the top panel 40 is removed.
6 is a side view showing the mutual relationship between the top panel 40 and the control boards 80a to 80c in the video camera 1 of the present embodiment, as in FIG. 5, and shows a state in which the top panel 40 is attached. Is.

  As shown in FIG. 5, the control boards 80 a to 80 c are erected on the pedestals 31 a to 31 c of the bottom panel 30. That is, the bottom panel 30 is made of aluminum die-cast material and has high rigidity, and includes pedestals 31a to 31c in which grooves (inserting grooves) for positioning and holding the control boards 80a to 80c are provided at both front and rear ends. Yes. Therefore, the control boards 80a to 80c are erected when the lower ends of the control boards 80a to 80c are fitted into the grooves of the bases 31a to 31c.

  Here, the groove width of each base 31a-31c is larger than the plate | board thickness of each control board 80a-80c. Therefore, when assembling, the control boards 80a to 80c can be easily fitted into the grooves of the bases 31a to 31c. Further, the control board 80a and the control board 80c are pressed against the side surfaces of the fitting grooves of the base 31a and the base 31c, and the control board 80b is prevented from being lifted from the base 31b. It has become easier.

  More specifically, the heat generating component 81a is mounted on the control board 80a toward the outside, and the connector 83a is mounted sideways on the control board 81b. The control board 81b is mounted with an electronic component 81 that generates little heat (heat generation is not a problem), and a downward connector 83b is mounted on both sides of the control board 81b. Furthermore, an electronic component 81 with less heat generation is mounted on the control board 81c, and a connector 83b is mounted sideways toward the control board 81b. Further, the control board 80a and the control board 81b are electrically connected by the FFC 82a, and the control board 80b and the control board 81c are electrically connected by the FFC 82b.

  Since the FFC 82a and the FFC 82b are bent so as to be convex with respect to the bottom panel 30 between the control boards 80a to 80c, the electronic component 81 (the heat generating component 81a) is generated by the repulsive force of the FFC 82a and the FFC 82b. ) Is applied to each of the control boards 80a to 80c on which is mounted). Therefore, the outer control board 80a and the control board 80c are pressed against the side surfaces of the fitting grooves formed on the base 31a and the base 31c.

  Further, the connectors 83a to 83c are arranged in such a direction that the control board 80b does not float from the base 31b due to the repulsive force of the bent FFC 82a and FFC 82b. Therefore, even if the width of the fitting groove of each pedestal 31a to 31c is larger than the thickness of each control board 80a to 80c, the friction with the side face of the fitting groove and the lifting are prevented, so that each control board 80a ~ 80c does not come off from the pedestals 31a to 31c. Therefore, temporary fixing at the time of assembly can be performed without using screws or the like.

  In this manner, the control boards 80a to 80c can be easily erected on the pedestals 31a to 31c of the bottom panel 30. Moreover, the holding metal fitting 90 can be easily arranged on the upper part of each of the control boards 81a to 81c. That is, support pieces 95 are formed at both ends of the holding metal fitting 90, and a pair of support pieces 96 are arranged with a gap at the center. Therefore, if the holding metal fitting 90 is put on the control boards 80a to 80c erected on the bottom panel 30, the fixing pieces 84 can be screwed by abutting the support pieces 95 against the control boards 80a and 80c. The control board 80b can be inserted into the gap of the piece 96 and positioned.

  Further, the holding metal fitting 90 has a heat radiating portion 93 bent in an L shape. However, when the top panel 40 is removed, the holding metal fitting 90 is opened to the outside by a repulsive elastic balance (no leaf spring is acting). ing. That is, the convex portion 93 a formed on the heat radiating portion 93 protrudes outward from the U-shaped opening 40 a of the top panel 40 that covers the bottom panel 30. Therefore, in this state, the heat conductive rubber 99 affixed to the inside of the heat dissipating part 93 does not come into close contact with the heat generating component 81a mounted on the control board 80a. .

  In the video camera 1 of the present embodiment, the control boards 80 a to 80 c are pressed and held by the silicon rubber 41 only by covering the top panel 40 with the bottom panel 30. That is, a silicon rubber 41 having a predetermined compressive force is attached to the ceiling surface of the top panel 40. Further, the holding metal 90 is formed with a notch 94 (see FIG. 2) at a position corresponding to the silicon rubber 41. Therefore, when the stepped portion 40b of the top panel 40 is fitted into the bottom panel 30 and the top panel 40 is attached, the silicon rubber 41 acts to compress the control boards 80a to 80c as shown in FIG. The vibration of each control board 80a-80c is suppressed.

  Here, the silicon rubber 41 is plastically deformed by compression, and has a displacement that does not lose the repulsive force and an appropriate compressive force. That is, if the pressure by the silicon rubber 41 is too large, the control boards 80a to 80c are buckled or curved, and unnecessary stress is applied to the solder portion of the electronic component 81 that is mounted. Moreover, cracks are caused in the solder due to secular change, and defects are induced. Therefore, the characteristics of the silicon rubber 41 are determined based on the material, plate thickness, etc. of the control boards 80a to 80c.

  Further, as shown in FIG. 6, when the top panel 40 is attached, the convex portion 93 a comes into contact with the inner surface of the top panel 40, so that the deformation pressure counters the rebound resilience (leaf spring) of the heat radiating portion 93. Thus, the convex portion 93a is pressed inward. Therefore, even when the video camera 1 is used in a vibration environment, the heat conductive rubber 99 comes into close contact with the heat generating component 81a of the control board 80a. As a result, the heat generated by the heat generating component 81a is diffused throughout the holding metal fitting 90 and radiated to the top panel 40, so that a stable heat radiation effect can be obtained.

  Here, the convex portion 93a has a curved surface shape. Therefore, when the top panel 40 is put on the bottom panel 30, the convex portion 93a is smoothly pressed inward. Even when the video camera 1 is used in a vibration environment, the convex portion 93a does not bite into the inner surface of the top panel 40. Furthermore, when removing the top panel 40 from the bottom panel 30, the convex portion 93 a is not caught on the inner surface of the top panel 40, and the top panel 40 can be easily extracted.

  Moreover, the holding metal fitting 90 is not only bent at one side of the support portion 92 to become the heat radiating portion 93 but also at the opposite side of the heat radiating portion 93. That is, the holding metal fitting 90 is generally L-shaped, but both shoulders of the support portion 92 are R-shaped. For this reason, even when the video camera 1 is used in a vibration environment, the holding metal fitting 90 rubs against the inner surface of the top panel 40, and the inner surface side of the top panel 40 is scraped off, or the metal due to the rubbing of the holding metal fitting 90. No powder is generated.

  As described above, in the video camera 1 of this embodiment, the control boards 80 a to 80 c are supported by the holding metal fitting 90 on the opposite side of the bottom panel 30. And the positional accuracy of each control board 80a-80c can be raised, and the space between each control board 80a-80c which opposes can be minimized. In addition, because of the connection by the FFC 82a and the FFC 82b, the effective mounting area of each of the control boards 80a to 80c can be utilized to the maximum. Therefore, the size and weight can be reduced for FA.

  Further, since the silicon rubber 41 presses the upper portions of the control boards 80a to 80c, the control boards 80a to 80c can be reliably supported even in a vibration environment, and disconnection of the circuit pattern can be prevented. Therefore, it has high vibration resistance (quality reliability).

  Furthermore, since it is excellent in assemblability and can be exchanged for each of the control boards 80a to 80c, it is possible to reduce the cost at the time of manufacturing or repair at the service or the like. In addition, the heat generated by the heat generating component 81a of the control board 80a is efficiently transmitted to the heat conductive rubber 99, the heat radiating portion 93, and the support portion 92, and the front panel 10, the rear panel 20, and the top panel 40 to which the holding metal fitting 90 is attached. Heat is released to the atmosphere. Furthermore, since the GND is strengthened by screwing the control board 80a and the control board 80c to the holding metal fitting 90 with the fixing screw 84, it is effective for measures against unnecessary radiation and static electricity.

As mentioned above, although one Embodiment of this invention was described, this invention is not limited to embodiment mentioned above, For example, the following various deformation | transformation is possible.
(1) In the present embodiment, the FA video camera 1 is taken as an example of the imaging device. However, the imaging device is not limited to this, and may be an imaging device other than a video camera or a video camera for various uses. In the present embodiment, the CCD device 140 has been described as an example of the image pickup device. However, the image pickup device is not limited to this and may be another image pickup device such as a CMOS (Complementary Metal Oxide Semiconductor) device.

  (2) In the present embodiment, the silicon rubber 41 is used as the pressing member. However, the present invention is not limited to this, and other rubber members may be used. Further, as long as each of the control boards 80a to 80c can be pressed and held, it may not be a rubber member. Furthermore, in the present embodiment, the holding metal fitting 90 is made of metal so as to have a heat dissipation function and a GND strengthening function. However, considering only the positioning of the control boards 80a to 80c, the cost can be reduced. It may be made of an effective resin.

It is a perspective view which shows the video camera of this embodiment. It is a disassembled perspective view which shows the video camera of this embodiment, and shows the state which removed the top panel shown in FIG. It is a perspective view which shows the positional relationship of the control board and holding | maintenance metal fitting in the video camera of this embodiment. It is a perspective view which shows the top panel in the video camera of this embodiment. It is a side view which shows the mutual relationship of the top panel and each control board in the video camera of this embodiment, and shows the state which removed the top panel. It is a side view which shows the mutual relationship of the top panel and each control board in the video camera of this embodiment, and shows the state which attached the top panel. It is a disassembled perspective view which shows the board | substrate support structure of the conventional video camera.

Explanation of symbols

1 Video camera (imaging device)
30 Bottom panel (base case)
31a, 31b, 31c Pedestal 40 Top panel (cover case)
40a Opening 41 Silicone rubber (pressing member)
80a, 80b, 80c Control board (circuit board)
81 Electronic component 81a Heat generating component (electronic component)
82a, 82b FFC (flexible flat cable)
83a, 83b, 83c Connector 90 Holding bracket (holding member)

Claims (6)

A plurality of circuit boards on which electronic components and connectors are mounted; and
A substrate support structure for an imaging device, comprising: a base case that houses each circuit board; and a cover case,
A pressing member that presses one end surface of each circuit board toward the base case;
Each of the circuit boards includes a flexible flat cable connected to each of the connectors, one end surface is pressed by the pressing member, and the other end surface is held by the base case. . In the board | substrate support structure of the imaging device of Claim 1,
The cover case has a U-shaped cross section, and covers each circuit board and each flexible flat cable inside the U-shape by covering the U-shaped opening toward the base case,
The substrate support structure for an imaging apparatus, wherein the pressing member is attached to a U-shaped ceiling surface of the cover case. In the board | substrate support structure of the imaging device of Claim 1,
The base case includes a pedestal for fitting to stand up each of the circuit boards,
Each flexible flat cable is bent between the circuit boards,
Each of the circuit boards is pressed against a side surface of a fitting groove formed in each of the pedestals by a repulsive force of each of the bent flexible flat cables. In the board | substrate support structure of the imaging device of Claim 1,
Each of the flexible flat cables is bent so as to be convex with respect to the base case,
Each connector of each circuit board is disposed in a direction in which each circuit board does not lift from the base case by the repulsive force of each bent flexible flat cable. Support structure. In the board | substrate support structure of the imaging device of Claim 1,
A board support structure for an imaging apparatus, comprising a holding member that holds each of the circuit boards on the opposite side of the base case. A plurality of circuit boards on which electronic components and connectors are mounted; and
An imaging device comprising a base case and a cover case for housing each of the circuit boards,
A pressing member that presses one end surface of each circuit board toward the base case;
In each of the circuit boards, a flexible flat cable is connected to each connector, one end surface is pressed by the pressing member, and the other end surface is held by the base case.

Images