JP2008130312A - Electroluminescent element panel manufacturing method and electroluminescent element panel sealing substrate - Google Patents

Abstract

【Task】
It is an object of the present invention to provide a manufacturing method and a sealing substrate that are particularly effective when a plurality of EL element panels are taken from a large substrate.
[Solution]
(A) a first step of forming a sealing substrate by providing an adhesive layer on the first substrate;
(B) a second step of forming an element substrate provided with a plurality of electroluminescent elements including a display part and a wiring part on the second base material;
(C) a third step of bonding the sealing substrate to the element substrate to form an electroluminescence element panel;
In the first step, at least one of Ag, Al, Au, Cd, Cu, Mg, Sn, and Ti is provided in the specific region on the adhesive layer in the first step. A method for producing an electroluminescent element panel, wherein a non-adhesive layer pattern including a metal is provided, and the specific region is a region corresponding to an outer peripheral region of the display unit including at least a part of the wiring unit. .
[Selection] Figure 4

Description

The present invention relates to a method for manufacturing an electroluminescence element panel and a sealing substrate for an electroluminescence element panel. In particular, the present invention relates to a manufacturing method and a sealing substrate that are effective when a plurality of electroluminescent element panels are formed using a large substrate (hereinafter, also referred to as multi-cavity).

2. Description of the Related Art Conventionally, a display using an electroluminescence (hereinafter simply referred to as EL) display device has been developed for a display unit of a mobile device such as a mobile phone or a PDA, or a personal computer. An EL display device drives an EL element having a single or array of light emitting layers to perform a desired display. Such EL display devices can be classified into, for example, a bottom emission type in which light is extracted from the element substrate side and a top emission type in which light is extracted from the sealing member side, depending on the difference in the light extraction direction from the light emitting layer. However, the bottom emission type structure has been mainly studied so far because of the high degree of freedom of material selection.

On the other hand, in the field of display devices, there are high needs for enlargement, high definition, and high brightness, and research aimed at increasing the size of EL display devices is also actively conducted. However, when the above-mentioned bottom emission type EL display device is increased in size, it is necessary to increase the thickness of the wiring electrode for supplying a signal to the electrode, which causes a problem that the aperture ratio of the pixel is lowered. In addition, when the aperture ratio is reduced in this way, a large current is passed through the light emitting layer in order to ensure the luminance of the pixel, resulting in a problem that the product life is shortened. For this reason, in recent years, a top emission type structure in which the aperture ratio of a pixel is not affected by the structure of a wiring or the like has attracted attention and has been actively studied.

Here, the EL element has a structure in which a light emitting layer exhibiting at least an EL phenomenon is sandwiched between an electrode as an anode and an electrode as a cathode, and emits light when a voltage is applied between the electrodes. The light emitting layer emits light by injecting holes and electrons into the layer and recombining the holes and electrons in the light emitting layer. Furthermore, for the purpose of increasing luminous efficiency, a hole injection layer, a hole transport layer, or an electron transport layer, an electron injection layer, etc. between the anode and the light emitting layer Are appropriately selected and provided. The light emitting layer and these hole injection layer, hole transport layer, electron transport layer, electron injection layer and the like are collectively referred to as a light emitting medium layer.

The EL element includes an inorganic EL element and an organic EL element. Typical examples of the light emitting medium layer of the organic EL element include copper phthalocyanine for the hole injection layer and N, N′− for the hole transport layer. Di (1-naphthyl) -N, N′-diphenyl-1, 1′-biphenyl-4, 4′-diamine, a low molecular EL element in which tris (8-quinolinol) aluminum is laminated on the phosphor layer, There is a polymer EL element in which a polythiophene derivative is stacked on a hole transport layer and a polyalkylfluorene derivative is stacked on a light emitting layer.

It is known that the EL element is deteriorated by moisture and oxygen in the atmosphere when the light emitting medium layer and the cathode layer are left exposed to the atmosphere. In particular, the influence of moisture is remarkable, and a specific representative example is a phenomenon in which a non-light-emitting region called a dark spot occurs and expands with time.

Therefore, a sealing structure that blocks moisture is required, but conventionally, glass or metal sealing cans that block moisture are bonded together with an adhesive to form a hollow structure, and moisture entering from the cross section of the adhesive is sealed. A structure (can sealing structure) that collects with a desiccant provided inside the stopper and does not reach the element has been generally used (see, for example, Patent Documents 1 and 2).

However, in the top emission structure, it is not preferable to cover the display side with a hollow sealing can because it causes image multiplexing. Therefore, solid sealing is required to seal the flat plate in close contact. As a solid sealing method, for example, a method of bonding a sheet-like solid adhesive and a flat plate on an EL element has been proposed as in Patent Document 3, and such a sheet-like solid adhesive is used as a plurality of ELs. When pasted on a multi-sided element substrate provided with an element, the wiring part provided on the outer periphery of the EL element is also covered with an adhesive, and the EL element cannot be driven. There was a problem.
JP-A-7-169567 Japanese Patent Laid-Open No. 10-12376 JP 2006-179352 A

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a manufacturing method and a sealing substrate that are particularly effective when a plurality of EL element panels are taken from a large substrate.

The invention according to claim 1
(A) a first step of forming a sealing substrate by providing an adhesive layer on the first substrate;
(B) a second step of forming an element substrate provided with a plurality of electroluminescent elements including a display part and a wiring part on the second base material;
(C) a third step of bonding the sealing substrate to the element substrate to form an electroluminescence element panel;
In the first step, at least one of Ag, Al, Au, Cd, Cu, Mg, Sn, and Ti is provided in the specific region on the adhesive layer in the first step. A method for producing an electroluminescent element panel, wherein a non-adhesive layer pattern including a metal is provided, and the specific region is a region corresponding to an outer peripheral region of the display unit including at least a part of the wiring unit. It is.

A non-adhesive layer pattern containing at least one of Ag, Al, Au, Cd, Cu, Mg, Sn, and Ti is provided in a specific region on the adhesive layer, and the specific region is at least in the wiring portion. By being an area corresponding to the outer peripheral area of the display part including a part, the EL element display part can be solid-sealed with an adhesive, and at the same time, the wiring part in the outer peripheral area of the EL element display part is directly solid with an adhesive. A method for manufacturing an EL element panel that is not sealed can be provided.

The invention according to claim 2
(A) a first step of forming a sealing substrate by providing an adhesive layer on the first substrate;
(B) a second step of forming an element substrate provided with a plurality of electroluminescent elements including a display part and a wiring part on the second base material;
(C) a third step of bonding the sealing substrate to the element substrate to form an electroluminescence element panel;
In the first step, a non-adhesive layer pattern containing at least a fluororesin is provided in a specific region on the adhesive layer, and the specific region is at least the wiring It is an area corresponding to the outer peripheral area of the display part including a part of the part.

A non-adhesive layer pattern including at least a fluororesin is provided in a specific region on the adhesive layer, and the specific region is a region corresponding to an outer peripheral region of the display unit including at least a part of the wiring portion. It is possible to provide a method for manufacturing an EL element panel in which the display part can be solid-sealed with an adhesive and the wiring part in the outer peripheral region of the EL element display part is not directly solid-sealed with an adhesive.

The invention according to claim 3 is the method of manufacturing an electroluminescent element panel according to claim 1 or 2, wherein the non-adhesive layer pattern is formed by a transfer method.

By forming the non-adhesion layer pattern by a transfer method, it is possible to prevent the adhesive from deteriorating during pattern formation.

Invention of Claim 4 is a manufacturing method of the electroluminescent element panel in any one of Claim 1 thru | or 3, Comprising: Furthermore,
(D) a fourth step of removing the first base material, the adhesive layer, and the non-adhesive layer pattern in a specific region from the electroluminescence element panel;
And the specific region is a region in which the non-adhesive layer pattern is provided, and is a region including at least a part of the wiring portion.

By including a step of removing the first base material, the adhesive layer, and the non-adhesive layer pattern in a region where the non-adhesive layer pattern is provided and including at least a part of the wiring portion, the EL element display unit Can be provided with a method of manufacturing an EL element panel in which the wiring part in the outer peripheral region of the EL element display part is taken out at the same time that is solid-sealed with an adhesive layer.

The invention according to claim 5 is the method of manufacturing an electroluminescent element panel according to any one of claims 1 to 3, further comprising:
(D) a fourth step of removing the first base material, the adhesive layer, and the non-adhesive layer pattern in a specific region from the electroluminescent element panel and simultaneously separating the electroluminescent element panel;
And the specific region is a region in which the non-adhesive layer pattern is provided, and is a region including at least a part of the wiring portion.

For the region where the non-adhesive layer pattern is provided and including at least a part of the wiring portion, the first base material, the adhesive layer, and the non-adhesive layer pattern are removed and the EL element panel is separated into pieces. By including the steps, the EL element display part is solid-sealed with an adhesive layer, and at the same time, the wiring part in the outer peripheral area of the EL element display part is taken out and separated into individual EL element panels. Can be provided.

The invention according to claim 6 is the method of manufacturing an electroluminescent element panel according to any one of claims 1 to 3, further comprising:
(D) a fourth step of separating the electroluminescence element panel into pieces;
(E) a fifth step of removing the first base material, the adhesive layer, and the non-adhesive layer pattern in a specific region from the separated electroluminescence element panel;
And the specific region is a region in which the non-adhesive layer pattern is provided, and is a region including at least a part of the wiring portion.

After the EL element panel is separated into pieces, the first base material, the adhesive layer, and the non-adhesive layer pattern are removed from the region where the non-adhesive layer pattern is provided and includes at least a part of the wiring portion. By including the steps, the EL element display part is solid-sealed with an adhesive layer, and at the same time, the wiring part in the outer peripheral area of the EL element display part is taken out and separated into individual EL element panels. Can be provided.

The invention according to claim 7 is the electroluminescence according to any one of claims 1 to 6, wherein the water vapor permeability of the first base material is 10 ^-4 g / m ² / day or less. It is a manufacturing method of an element panel.

Providing a method for producing an EL element panel in which moisture permeation is prevented and generation of dark spots is prevented when the water vapor permeability of the first substrate is 10 ⁻⁴ g / m ² / day or less. it can.

The invention according to claim 8 is the method of manufacturing an electroluminescent element panel according to any one of claims 1 to 7, wherein the light transmittance of the first base material is 80% or more. .

When the light transmittance of the first substrate is 80% or more, a method for manufacturing a top emission type EL element panel can be provided.

The invention according to claim 9 has an adhesive layer on a first substrate having a water vapor transmission rate of 10 ⁻⁴ g / m ² / day or less, and at least part of Ag on the adhesive layer, A sealing substrate for an electroluminescent element panel, wherein a non-adhesive layer pattern containing any one of Al, Au, Cd, Cu, Mg, Sn, and Ti is provided.

When bonded to an element substrate provided with an EL element including a display part and a wiring part, the water vapor transmission rate of the first substrate is 10 ⁻⁴ g / m ² / day or less, so that the moisture to the EL element Can be prevented, the occurrence of dark spots can be prevented, and an EL element panel sealing substrate capable of solid-sealing an EL element display portion with an adhesive layer can be provided.

Further, a wiring part is provided by providing a non-adhesive layer pattern including at least one of Ag, Al, Au, Cd, Cu, Mg, Sn, and Ti on a part of the adhesive layer. It is possible to provide a sealing substrate for an EL element panel in which a desired region such as the above is not directly solid-sealed with an adhesive.

The invention according to claim 10 has an adhesive layer on the first base material having a water vapor transmission rate of 10 ⁻⁴ g / m ² / day or less, and at least a fluororesin on a part of the adhesive layer. A sealing substrate for an electroluminescent element panel, wherein a non-adhesive layer pattern including is provided.

When bonded to an element substrate provided with an EL element including a display part and a wiring part, the water vapor transmission rate of the first base material is 10 ⁻⁴ g / m ² / day or less, so that moisture to the EL element is obtained. Can be prevented, the occurrence of dark spots can be prevented, and an EL element panel sealing substrate capable of solid-sealing an EL element display portion with an adhesive layer can be provided.

Furthermore, a non-adhesive layer pattern including at least a fluororesin is provided on a part of the adhesive layer, so that an EL element panel in which a desired region such as a wiring portion is not directly sealed with an adhesive. An encapsulating substrate can be provided.

The invention according to claim 11 is the sealing substrate for an electroluminescent element panel according to claim 9 or 10, wherein the non-adhesive layer pattern is a lattice.

When the non-adhesive layer pattern is in a lattice shape, a desired region such as a wiring portion is directly solid-sealed with an adhesive when bonded to an element substrate provided with a plurality of EL elements including a display portion and a wiring portion. A sealing substrate for an EL element panel can be provided.

An invention according to claim 12 is the electroluminescent element panel sealing substrate according to any one of claims 9 to 11, wherein the electroluminescent element has a light transmittance of 80% or more. It is the sealing substrate for panels.

When the light transmittance of the first base material is 80% or more, a sealing substrate applicable to a top emission type EL element panel can be provided.

According to the present invention, (a) a first step in which an adhesive layer is provided on a first substrate to form a sealing substrate, and (b) an EL element including a display unit and a wiring unit on a second substrate. A method for manufacturing an EL element panel, comprising: a second step of forming a plurality of element substrates; and (c) a third step of forming an EL element panel by bonding a sealing substrate to the element substrate. , A non-adhesive layer pattern containing at least one of Ag, Al, Au, Cd, Cu, Mg, Sn, and Ti is provided in a specific region on the adhesive layer, and the specific region is at least wiring The EL element display part can be solid-sealed with an adhesive, and at the same time, the wiring in the outer peripheral area of the EL element display part. The part of the EL element panel that is not directly solid-sealed with an adhesive It is possible to provide a production method.

(A) a first step of providing an adhesive layer on the first base material to form a sealing substrate; (b) a plurality of electroluminescent elements including a display portion and a wiring portion provided on the second base material. A second step of forming an element substrate;
(C) a third step of forming an EL element panel by bonding a sealing substrate to an element substrate, and in the first step, in a specific region on the adhesive layer The EL element display unit is characterized in that a non-adhesive layer pattern including at least a fluororesin is provided, and the specific region is a region corresponding to an outer peripheral region of the display unit including at least a part of the wiring portion. It was possible to provide a method for manufacturing an EL element panel that can be solid-sealed with an adhesive and at the same time the wiring part in the outer peripheral region of the EL element display part is not directly solid-sealed with an adhesive.

Furthermore, it has an adhesive layer on the first substrate having a water vapor transmission rate of 10 ⁻⁴ g / m ² / day or less, and at least part of the adhesive layer has Ag, Al, Au, Cd, A non-adhesive layer pattern containing any one metal of Cu, Mg, Sn, and Ti is provided, so that it is attached to an element substrate provided with an EL element including a display portion and a wiring portion. When combined, the water vapor permeability of the first substrate is 10 ⁻⁴ g / m ² / day or less, so that moisture can be prevented from entering the EL element, and the occurrence of dark spots can be prevented, and the adhesive layer Thus, an EL element panel sealing substrate capable of solid-sealing the EL element display portion can be provided. Further, a wiring part is provided by providing a non-adhesive layer pattern including at least one of Ag, Al, Au, Cd, Cu, Mg, Sn, and Ti on a part of the adhesive layer. Thus, it was possible to provide a sealing substrate for an EL element panel in which a desired region such as the above was not directly solid-sealed with an adhesive.

Furthermore, the non-adhesive layer pattern which has an adhesive layer on the 1st base material whose water-vapor-permeation rate is 10 < ^-4 > g / m < ² > / day or less, and contains a fluororesin at least in part on an adhesive layer Is provided, and when bonded to an element substrate provided with an EL element including a display portion and a wiring portion, the water vapor permeability of the first base material is 10 ⁻⁴ g / m ^2. / Day or less, the penetration of moisture into the EL element is prevented, the generation of dark spots can be prevented, and the EL element display unit can be solid-sealed with an adhesive layer. Could be provided. Furthermore, a non-adhesive layer pattern including at least a fluororesin is provided on a part of the adhesive layer, so that an EL element panel in which a desired region such as a wiring portion is not directly sealed with an adhesive. A sealing substrate for use could be provided.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the drawings referred to in the following description of the embodiments are for explaining the configuration of the present invention, and the size, thickness, dimensions, and the like of each part shown in the drawings are different from the actual ones. The present invention is not limited to these.

FIG. 1 shows an example of the sealing substrate 10. FIG. 1 is a schematic cross-sectional view. An adhesive layer 12 is provided on the first substrate 11, and a lattice-like non-adhesive layer pattern 13 is provided on the adhesive layer 12.

Here, the non-adhesive layer pattern 13 formed on the adhesive layer 12 includes an EL element including a display part 22 and a wiring part 23 on the sealing substrate 10 and the second base material 21 as shown in FIG. It is provided in a region corresponding to the outer peripheral region of the display unit 22 including at least a part of the wiring unit 23 when the plurality of element substrates 20 are arranged to face each other. As a result, the display unit 22 can be solid-sealed, and at the same time, a sealing substrate can be obtained in which the entire wiring portion 23 of the EL element is not directly solid-sealed with the adhesive layer 12.

Here, the wiring portion 23 is not required to directly cover the contact portion with the external drive IC or the contact portion between the built-in drive circuit and the outside with the adhesive layer, and a part or most of the wiring portion 23 is adhesive. It may be covered with a layer. In FIG. 2, as the EL element, a linear first electrode 31, a light emitting medium layer 32, a partition wall 34 for separating the light emitting medium layer is provided, and a second electrode 33 is stacked so as to be orthogonal to the first electrode 31. Although what was provided was illustrated, it is not restricted to this.

FIG. 3 shows an example of a method for manufacturing the sealing substrate 10 of the present invention. First, the adhesive layer 12 is formed on the first substrate 11.

The first base material 11 is preferably a transparent base material when applied to a top emission type EL element panel in which the first base material side is the display side, and the light transmittance is 80% or more. Is preferred. If the light transmittance is less than 80%, a larger voltage is required to satisfy the desired luminance, leading to a shortened life of the EL element. Furthermore, it is preferable that the smoothness is high.

For example, an inorganic material such as a glass plate such as soda lime glass, lead alkali glass, borosilicate glass, aluminosilicate glass, or silica glass, or a resin substrate that can be formed on a film can be used. As the resin used for such a resin substrate, a polymer material having relatively high solvent resistance and heat resistance that does not contain a volatile component that affects the EL element is preferable. Specifically, fluorine resin, polyethylene, Polypropylene, polyvinyl chloride, polystyrene, ABS resin, polyamide, polyacetal, polyester, polycarbonate, modified polyphenylene ether, polysulfone, polyarylate, polyetherimide, polyethersulfone, polyamideimide, polyimide, polyphenylene sulfide, liquid crystalline polyester, polyethylene Terephthalate, polybutylene terephthalate, polyethylene naphthalate, polymicroxylene dimethylene terephthalate, polyoxymethylene, polyethersulfone, polyetherketone, polyacrylate Relate, acrylonitrile - styrene resins, silicone resins, HiAkiraTadashi polyolefin and the like, which one, or may be used as a copolymer of two or more kinds.

In addition, since the EL element causes dark spots and edge deterioration due to oxygen and moisture, the resin substrate preferably has a barrier property against moisture and oxygen, and the water vapor transmission rate is 10 ⁻⁴ g / m ² / day or less. desirable. When the water vapor transmission rate is larger than 10 ⁻⁴ g / m ² / day, the EL element causes dark spots and edge deterioration due to the transmitted water.

The thickness is not particularly limited as long as it is a thickness having a high transmittance when applied to a top emission type EL element panel. .8 mm is preferable, and the resin substrate is preferably 10 μm to 2 mm.

As a material for the adhesive layer 12, for example, a radically polymerizable resin mainly composed of various acrylates such as polyester acrylate, polyether acrylate, epoxy acrylate, polyurethane acrylate, or a resin mainly composed of epoxy, vinyl ether or the like is used. Photo-curing resins such as cationic photopolymerizable resins, thiol / ene-added resins, polyethylene, polypropylene, polyethylene terephthalate, polymethyl methacrylate, polystyrene, polyethersulfone, polyarylate, polycarbonate, polyurethane, acrylic resin, polyacrylic Nitrile, polyvinyl acetal, polyamide, polyimide, diacryl phthalate resin, cellulosic plastic, polyvinyl acetate, polyvinyl chloride, polyvinylidene chloride And, and thermoplastic resins such as those of two or more copolymers, such as thermosetting resins. The resin forming the adhesive layer 12 does not generate outgas which causes deterioration in the manufacturing process of the EL element panel, or the generation amount is small, and changes such as deformation, shrinkage and expansion with temperature and time are small. If there is, it will not be specifically limited. However, from the viewpoint of good adhesion and adhesion to the first base material 11 and the display unit 22, the resin forming the adhesive layer 12 is a thermosetting resin that cures when heated. preferable. In consideration of film thickness uniformity and storage stability, the adhesive layer material is preferably a resin that exhibits non-flowability at room temperature, is a solid or soft solid, and melts at 50 to 100 ° C. It is desirable to be processed into a sheet (film). The thickness of the adhesive layer 12 is preferably 10 μm to 100 μm. Further, when applied to a top emission type EL element panel, a transparent adhesive is desirable.

In addition, heating for curing in the case of using a thermosetting resin is preferably performed after bonding to the EL element, but is not limited thereto.

The method for forming the adhesive layer 12 is not particularly limited, and various methods such as a roll method, a die coating method, a gravure printing method, and a comma coater method are preferably used to form the first adhesive layer 12 on the first substrate 11. 3 (a) and (b), after forming the adhesive layer 12 on the protective substrate 41 using the various coating methods described above, a known laminator such as a thermal laminator or a vacuum laminator is used. It can also be transferred onto the first substrate 11 by a transfer method.

The material of the protective substrate 41 is preferably a film, and examples thereof include, but are not limited to, plastic films such as polyester, polyethylene, polypropylene, and PET. The film thickness is preferably 10 μm to 100 μm.

Next, the non-adhesive layer pattern 13 is provided on the adhesive layer 12 to form the sealing substrate 10. As shown in FIG. 2, the non-adhesive layer pattern 13 corresponds to an outer peripheral region of the display unit 22 including at least a part of the wiring unit 23 when the sealing substrate 10 and the element substrate 20 are disposed to face each other. It is provided in the area to be used.

The material of the non-adhesive layer pattern 13 is not limited as long as it has low adhesion and adhesion to the wiring portion 23 of the EL element. However, since the patterning is easy, a photoresist material, a metal material, or the like can be used. desirable. The photoresist material is preferably a fluororesin, more preferably a positive type. Further, the metal material is preferably a material that can be easily formed, and more preferably includes any one of Ag, Al, Au, Cd, Cu, Mg, Sn, and Ti. As a forming method, in the case of a photoresist material, after applying by a spin coat method or a slit coater method, a pattern can be formed by using a photomask, exposing and developing. In the case of a metal material, a pattern can be formed by chemical etching after a film is formed by a vacuum evaporation method such as a resistance heating evaporation method, an electron beam evaporation method, or a high frequency induction heating evaporation method. The film thickness of the non-adhesive layer pattern 13 is preferably 10 nm to 50 μm.

As another method for forming the non-adhesive layer pattern 13, as shown in FIGS. 3C to 3F, the non-adhesive layer pattern 13 is provided on the transfer base 51 by the above-described method, After forming 50, the non-adhesive layer pattern 13 can be formed on the adhesive layer 12 by a transfer method using a known laminator such as a thermal laminator or a vacuum laminator. By using the transfer method, it is possible to prevent deterioration of the adhesive layer at the time of pattern formation as compared with the case where the non-adhesive layer pattern 13 is directly formed on the adhesive layer 12.

Moreover, it is preferable that the transfer base material 51 is a film form, For example, although plastic films, such as polyester, polyethylene, a polypropylene, and PET, are mentioned, it is not restrict | limited to these. The film thickness is preferably 10 μm to 100 μm.

At this time, the interface strength between the non-adhesive layer pattern 13 and the adhesive layer 12 needs to be greater than the interface strength between the non-adhesive layer pattern 13 and the transfer substrate 51.

FIG. 4 shows an example of a method for manufacturing an EL element panel.

Corresponding to an outer peripheral region of the display unit 22 including the element substrate 20 provided with a plurality of EL elements including the display unit 22 and the wiring unit 23, and the adhesive layer 12 and at least a part of the wiring unit 23 on the first base material 11. The EL element panel 100 (FIG. 4B) can be manufactured by bonding the sealing substrate 10 provided with the non-adhesive layer pattern 13 to the region to be processed (FIG. 4A).

The display unit 22 is solid-sealed by the EL element panel 100, and at the same time, a part of the wiring unit 23 in the outer peripheral region of the display unit 22 is not directly solid-sealed with an adhesive, so that the wiring can be taken out. An easy EL element panel can be obtained.

A known method can be used as the bonding method, and examples thereof include known laminating methods such as thermal lamination and vacuum laminating.

As the second substrate 21 of the element substrate, in addition to a translucent substrate such as glass, quartz, and a plastic sheet, a metal foil or sheet such as aluminum or stainless steel, a silicon substrate, a plastic film or sheet, aluminum, copper, A non-translucent base material in which a metal film such as nickel or stainless steel is laminated can be used.

A thin film transistor (TFT) can be provided on the second substrate 21 as necessary. Examples of the semiconductor material of TFT include organic semiconductor materials such as polythiophene, polyaniline, copper phthalocyanine, and perylene derivatives, and silicon semiconductor materials such as amorphous silicon and polysilicon, and can be preferably used.

As the EL element, for example, as shown in FIG. 5, a line-shaped first electrode 31, a light emitting medium layer 32, a partition wall 34 for separating the light emitting medium layer is provided, and the second electrode is orthogonal to the first electrode 31. An example in which the electrode 33 is stacked is illustrated, but the present invention is not limited to this.

As the material and formation method of the first electrode 31, known materials can be suitably used. For example, when the first electrode is an anode, ITO (indium tin composite oxide), indium zinc composite oxide, zinc aluminum composite oxide is used. Metal composite oxides such as materials and metal materials such as gold and platinum are formed by dry film formation methods such as resistance heating vapor deposition, electron beam vapor deposition, reactive vapor deposition, ion plating, and sputtering. Obtained by patterning using a wet film-forming method such as gravure printing or screen printing, etc. with a fine particle dispersion in which fine particles of metal oxide or metal material are dispersed in epoxy resin or acrylic resin. be able to. Further, the shape of the first electrode can be suitably set, and may be a line shape, a delta arrangement, a segment shape, or a pixel shape.

If necessary, copper, chromium, aluminum, titanium on the first electrode in order to reduce the wiring resistance of the wiring part 23 which is a contact part with an external drive IC and a contact part between the built-in drive circuit and the outside. It is also possible to partially provide a metal such as these or a laminate thereof as the bus electrode 35.

The partition 34 can be formed as needed. For example, a photosensitive resin solution based on an acrylic resin or a polyimide resin is applied onto the second base material 21 on which the first electrode 31 is formed using a coating method such as roll coating, spin coating, screen printing, or spray coating. The barrier ribs 34 can be formed at predetermined positions by forming a photosensitive layer having a predetermined thickness and performing patterning processing such as pattern exposure and development. The partition wall 34 is particularly effective in preventing color mixing when a multicolor organic light emitting medium layer is separately applied by a wet process.

The luminescent medium layer 31 can be formed of a single layer film including a luminescent layer or a multilayer film. Examples of the case where the light emitting medium layer 31 is formed of a multilayer film include a hole injection transport layer and an electron transporting light emitting layer, a hole transporting light emitting layer and an electron transport layer, and a hole injection transport. A three-layer structure comprising a layer, a light emitting layer, and an electron injecting and transporting layer, and further, if necessary, an electron blocking layer, a hole blocking layer, and the like can be inserted to form a multilayer. Inorganic and organic known materials can be suitably used as the material, and the forming method is not particularly limited, and a known dry process or wet process can be suitably used depending on the material.

For the second electrode 33, a known material can be preferably used. For example, in the case where the second electrode 33 is a cathode and the display side is provided, after thinly providing Li, Ca, Ba having a low work function, ITO ( Transparent materials such as metal composite oxides such as indium tin composite oxide), indium zinc composite oxide, and zinc aluminum composite oxide can be used. Further, the light emitting medium layer 31 may be laminated with a metal oxide such as ITO by doping a small amount of a metal such as Li or Ca having a low work function. As a method of forming the second electrode 33, a resistance heating vapor deposition method, an electron beam vapor deposition method, a reactive vapor deposition method, an ion plating method, or a sputtering method can be used depending on the material.

Further, the auxiliary electrode 36 may be provided in advance as a part of the wiring portion 23 below the second electrode other than the display portion by ITO or the like, and if necessary, a contact portion with an external drive IC or a built-in drive In order to reduce the wiring resistance of the wiring portion 23 that is a contact portion between the circuit and the outside, a metal such as copper, chromium, aluminum, titanium, or a laminate thereof is partially provided as a bus electrode 35 on the second electrode. You can also.

Furthermore, a passivation layer made of a material such as SiNx, SiONx, or polyparaxylene film can be suitably provided on the EL element.

Here, the EL element panel 100 is bonded to a sealing substrate provided in a region corresponding to the outer peripheral region of the display unit 22 in which the non-adhesive layer pattern includes at least a part of the wiring unit 23. In the region where the adhesive layer pattern is provided, the first base material, the adhesive layer, and the non-adhesive layer pattern can be easily removed, and the wiring portion or a part of the desired wiring portion can be taken out.

As a method of removing, for example, a cutter 61 is used if the first base material 11 is a resin substrate, a diamond cutter or a scriber device is used if glass or the like is used, and a cut 61 is made in the portion A of FIG. b)) If necessary, a force is applied from the side opposite to the cut opening with a break device or the like to cause the crack 62 to reach the non-adhesive layer pattern or close to the non-adhesive layer pattern (FIG. 6C). )), An EL device panel 200 that can be removed by using a suction device or the like and a part of the wiring portion is exposed can be obtained (FIG. 6D).

There is no limitation on the depth of the cut, and it is sufficient that the crack 62 reaches the non-adhesive layer pattern 13 or near the non-adhesive layer pattern 13 by applying the force if necessary, by inserting the cut 61. A cut may be made only in 11, or a cut may be made in the first base material 11 and the adhesive layer 12.

In addition, for the EL element panel 100, the first base material, the adhesive layer, and the non-adhesive layer pattern are removed in order to take out the wiring part or a part of the desired wiring part as described above, and at the same time, the EL element panel is separated into pieces. Can also be done. For example, it can be carried out by making cuts in the portions A to C in FIG. 7A and applying force with a break device or the like. There is no restriction on the order of cutting and the order of applying force, but for example, first, cuts 61 are made in portions A and B in FIG. 7A (FIG. 7B), and if necessary, cut with a break device or the like. A force can be applied from the opposite side of the mouth to cause the crack 62 to reach the non-adhesive layer pattern or close to the non-adhesive layer pattern (FIG. 7C). Thereafter, a cut is made in the portion C (FIG. 7 (d)), and a force is applied from the opposite side of the cut end of the C with a break device or the like, and the first base material, the adhesive layer and the non-adhesive layer between A and B At the same time as removing the pattern, the EL element panel can be separated into pieces, and an EL element panel 300 can be obtained in which a part of the wiring portion of the EL element is exposed and separated (see FIG. 7E). )).

The depth of the cut is not limited, and the cut 61 in the first base material is cut, and the crack 62 reaches the non-adhesive layer pattern 13 by applying a force as needed, or the non-adhesive layer pattern 13 It suffices if the distance is close, and only the first base material 11 may be cut, or the first base material 11 and the adhesive layer 12 may be cut. The incision into the second base material 21 may be achieved by making the incision 61 and applying a force as necessary so that the crack reaches the B crack.

Further, for the EL element panel 100, after the EL element panel is singulated, the first base material, the adhesive layer, and the non-adhesive layer pattern are formed in order to take out the wiring portion or a part of the desired wiring portion as described above. It can also be removed. For example, a notch 61 is made in B of FIG. 7A, and if necessary, a force is applied from the opposite side to the notch with a break device or the like to cause the crack 62 to reach the non-adhesive layer pattern 13 or the non-adhesive layer. After reaching the vicinity of the pattern 13, the EL element panel can be divided into pieces by cutting the portion C and applying a force from the opposite side of the C cut with a break device or the like. After that, incision 61 is made in A, and if necessary, a force is applied from the opposite side to the incision port with a break device or the like to cause crack 62 to reach the non-adhesive layer pattern or close to the non-adhesive layer pattern. Accordingly, by using an adsorption device or the like, the first base material, the adhesive layer and the non-adhesive layer pattern between A and B can be easily removed, and a part of the wiring portion of the EL element is exposed, In addition, the EL element panel 300 that is separated into pieces can be obtained.

(Example 1)
First, a thermosetting epoxy resin which is non-flowable at room temperature and flowable at 50 to 100 ° C. is dissolved in ethanol on a protective substrate 41 of PET film, and is spread by a roll method to volatilize ethanol. An adhesive layer 12 having a thickness of 25 μm was formed.

Next, the adhesive layer 12 formed on the protective base material 41 was transferred onto the first base material 11 made of alkali-free glass using a heat roller (see FIGS. 3A and 3B). The adhesive layer transfer conditions at this time were a temperature of 85 ° C. and a pressure of 0.2 MPa.

Further, aluminum having a thickness of 500 nm was deposited on the transfer base 51 of the PET film by a vacuum deposition method, and an aluminum non-adhesive layer pattern 13 was formed by a chemical etching method, thereby producing a transfer substrate 50 (FIG. 3C). ), FIG. 3 (d)). The non-adhesive layer pattern 13 was formed in a region corresponding to the outer peripheral region of the display unit 22 including a part of the wiring unit 23 when the element substrate 20 and the transfer substrate 50 were overlapped.

Then, the transfer substrate 50 on which the non-adhesive layer pattern 13 of aluminum was formed was transferred onto the first base material 11 on which the adhesive layer 12 was formed using a heat roller (FIG. 3 (e), FIG. f)). The adhesive layer transfer conditions at this time were a temperature of 75 ° C. and a pressure of 0.2 MPa.

On the other hand, an indium / tin alloy oxide and chromium were sequentially formed on a glass substrate 21 by sputtering to obtain films of 150 nm and 300 nm, respectively. Thereafter, the line-shaped first electrode 31 and the bus electrode 35 of the EL element were formed by chemical etching. Next, a photosensitive resin solution made of polyimide resin is applied onto the substrate 21 on which the first electrode 31 is formed by a spin coater to form a photosensitive layer, and a series of patterning processes such as pattern exposure and development are performed. Thus, a partition wall 34 having a thickness of 1 μm was formed as a bank of the pixel.

  Next, a 20 nm hole transport layer made of a mixture of poly (3,4-ethylenedioxythiophene) and polystyrenesulfonic acid between the partition walls 34, and poly [2-methoxy-5- (2′-ethylhexene). A 100 nm-thick organic light-emitting medium layer 32 having a two-layer structure composed of a light-emitting layer having a thickness of 80 nm made of (siloxy) -1,4-phenylenevinylene] (MEHPPV) was formed by a printing method.

  Next, the second electrode 33 is formed on the organic light emitting medium layer 32 by patterning an ITO film having a thickness of 50 nm by sputtering with 5 nm of calcium and an indium / tin alloy compound by vacuum deposition. It produced (refer FIG. 5).

  Then, the element substrate 20 and the sealing substrate 10 were disposed to face each other (see FIG. 4A), and were bonded together with a vacuum laminator. The bonding conditions were a temperature of 85 ° C., a time of 3 minutes, and a pressure of 1.0 MPa. Thereafter, thermal curing was performed at 120 ° C. for 1 hour to obtain an organic EL element panel 100 (see FIG. 4B).

Furthermore, a scriber device (MS5220, manufactured by Samsung Diamond) was used for the organic EL element panel 100, and scribing was performed at locations A and B shown in FIG. 7A (FIG. 7B). . The cutting depth was 0.1 mm. Thereafter, a glass breaker (MLB-300, manufactured by ECH) was used to cause cracks at locations A and B to reach the non-adhesive layer (FIG. 7C).

Next, 0.1 mm scribing was similarly performed at the location C (FIG. 7D). Thereafter, the portion C was broken with the same apparatus to obtain an EL element panel 300 in which a part of the wiring portion of the EL element was exposed and separated (see FIG. 7E).

(Example 2)
First, a thermosetting epoxy resin which is non-flowable at room temperature and flowable at 50 to 100 ° C. is dissolved in ethanol on a protective substrate 41 of PET film, and is spread by a roll method to volatilize ethanol. An adhesive layer 12 having a thickness of 25 μm was formed.

Next, the adhesive layer 12 formed on the protective base material 41 was transferred onto the first base material 11 made of alkali-free glass using a heat roller (see FIGS. 3A and 3B). The adhesive layer transfer conditions at this time were a temperature of 85 ° C. and a pressure of 0.2 MPa.

Further, 20 μm of a fluorine-containing dry film resist is formed on the transfer base 51 of the PET film by a thermal laminator method, and a non-adhesive layer pattern 13 of the fluorine-containing resist is formed by exposure and development to produce a transfer substrate 50. (See FIG. 3C and FIG. 3D). The non-adhesive layer pattern 13 was formed in a region corresponding to the outer peripheral region of the display unit 22 including a part of the wiring unit 23 when the element substrate 20 and the transfer substrate 50 were overlapped.

Then, the transfer substrate 50 on which the non-adhesive layer pattern 13 of the fluorine-containing resist was formed was transferred onto the first base material 11 on which the adhesive layer 12 was formed using a heat roller (FIG. 3 (e), FIG. 3 (f)). The adhesive layer transfer conditions at this time were a temperature of 75 ° C. and a pressure of 0.2 MPa.

Hereinafter, the production method of the element substrate 20 and the cutting method of the organic EL element panel 100 are the same as those in the first embodiment.

It is sectional drawing which shows an example of the sealing substrate of this invention. It is sectional drawing which shows an example of the sealing substrate and element substrate of this invention. It is sectional drawing which shows an example of the manufacturing method of the sealing substrate of this invention. It is sectional drawing which shows an example of the manufacturing method of the EL element panel of this invention. It is sectional drawing and a top view which show an example of the element substrate of this invention. It is sectional drawing which shows an example of the manufacturing method of the EL element panel of this invention. It is sectional drawing which shows an example of the manufacturing method of the EL element panel of this invention.

Explanation of symbols

10 ... Sealing substrate 11 ... First base material 12 ... Adhesive layer 13 ... Non-adhesive layer pattern 20 ... Element substrate
21 …… Second substrate 22 …… Display unit 23 …… Wiring unit 31 …… First electrode 32 …… Luminescent medium layer 33 …… Second electrode 34 …… Partition wall 41 …… Protective substrate 42 …… Thermal laminator 50 ... Transfer substrate 51 ... Transfer substrate 52 ... Thermal laminator 61 ... Incision 62 ... Crack 100 ... EL element panel 200 ... EL element panel 300 ... EL element panel

Claims (12)

(A) a first step of forming a sealing substrate by providing an adhesive layer on the first substrate;
(B) a second step of forming an element substrate provided with a plurality of electroluminescent elements including a display part and a wiring part on the second base material;
(C) a third step of bonding the sealing substrate to the element substrate to form an electroluminescence element panel;
In the first step, at least one of Ag, Al, Au, Cd, Cu, Mg, Sn, and Ti is provided in the specific region on the adhesive layer in the first step. A method for producing an electroluminescent element panel, wherein a non-adhesive layer pattern including a metal is provided, and the specific region is a region corresponding to an outer peripheral region of the display unit including at least a part of the wiring unit. . (A) a first step of forming a sealing substrate by providing an adhesive layer on the first substrate;
(B) a second step of forming an element substrate provided with a plurality of electroluminescent elements including a display part and a wiring part on the second base material;
(C) a third step of bonding the sealing substrate to the element substrate to form an electroluminescence element panel;
In the first step, a non-adhesive layer pattern including at least a fluororesin is provided in a specific region on the adhesive layer, and the specific region is at least the wiring. A method for manufacturing an electroluminescent element panel, which is a region corresponding to an outer peripheral region of the display part including a part of the part. The method for manufacturing an electroluminescent element panel according to claim 1 or 2, wherein the non-adhesive layer pattern is formed by a transfer method. It is a manufacturing method of the electroluminescent element panel in any one of Claims 1 thru | or 3, Comprising: Furthermore,
(D) a fourth step of removing the first base material, the adhesive layer, and the non-adhesive layer pattern in a specific region from the electroluminescence element panel;
And the specific region is a region in which the non-adhesive layer pattern is provided, and is a region including at least a part of the wiring portion. It is a manufacturing method of the electroluminescent element panel in any one of Claims 1 thru | or 3, Comprising: Furthermore,
(D) a fourth step of removing the first base material, the adhesive layer, and the non-adhesive layer pattern in a specific region from the electroluminescent element panel and simultaneously separating the electroluminescent element panel;
And the specific region is a region in which the non-adhesive layer pattern is provided, and is a region including at least a part of the wiring portion. It is a manufacturing method of the electroluminescent element panel in any one of Claims 1 thru | or 3, Comprising: Furthermore,
(D) a fourth step of separating the electroluminescence element panel into pieces;
(E) a fifth step of removing the first base material, the adhesive layer, and the non-adhesive layer pattern in a specific region from the separated electroluminescence element panel;
And the specific region is a region in which the non-adhesive layer pattern is provided, and is a region including at least a part of the wiring portion. The method for producing an electroluminescent element panel according to claim 1, wherein the first substrate has a water vapor transmission rate of 10 ⁻⁴ g / m ² / day or less. 8. The method for manufacturing an electroluminescent element panel according to claim 1, wherein the light transmittance of the first base material is 80% or more. It has an adhesive layer on the first substrate having a water vapor transmission rate of 10 ⁻⁴ g / m ² / day or less, and at least part of the adhesive layer has Ag, Al, Au, Cd, Cu, A sealing substrate for an electroluminescence element panel, wherein a non-adhesive layer pattern containing any one metal of Mg, Sn, and Ti is provided. A non-adhesive layer pattern including at least a fluororesin is provided on a part of the adhesive layer on the first base material having a water vapor transmission rate of 10 ⁻⁴ g / m ² / day or less. A sealing substrate for an electroluminescence element panel. The sealing substrate for an electroluminescent element panel according to claim 9 or 10, wherein the non-adhesive layer pattern has a lattice shape. 12. The electroluminescent element panel sealing substrate according to claim 9, wherein the electroluminescent element panel sealing substrate has a light transmittance of 80% or more.