JP2008129041A - Method for producing hologram element, hologram element production device, and die - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method, a device and a die for producing hologram elements more swiftly and in large quantities. <P>SOLUTION: The method comprises: a preparation process where a die in which a working pattern for holograms is formed, an element material for hologram elements, a transfer apparatus including a die mounting means, an element material installing means, a moving stage means for movement, a heating means and a pressing means are prepared, and the preparation of working is performed; a die mounting process where the die is mounted on the die mounting means in the transfer apparatus; an element material setting process where the element material is set in a prescribed set position of the transfer apparatus; a positioning process where the element material set in the set position in the element material setting process or the die mounted in the die mounting process is positioned to a transferrable position by a moving stage means; an overheating process where heating is performed to a prescribed temperature; and a press-transfer process where the die positioned in the positioning process is press-transferred to the element material by the pressing means. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a hologram element manufacturing method, a hologram element manufacturing apparatus, and a mold.

  A hologram element is a precise product with fine processing, and thus may not be easily manufactured, and is used for various purposes including authenticity identification of a certain product. However, since precise processing is involved, manufacturing is difficult, and a simpler manufacturing method has been demanded.

  As a method for producing such a hologram, a method using a laser beam, a method using an electron beam, and a method using a printing technique are known. For example, there is JP-A-6-07107 as an example of a method for producing a hologram using laser light.

JP-A-6-07107

  However, since the method using laser light, which is the method of the above-mentioned patent document, requires an optical system, it is difficult to manufacture a large amount of hologram elements, and it is even faster to manufacture a large number of hologram elements. This method has been demanded, which has been a problem.

  It is an object of the present invention to provide a method for manufacturing a large number of hologram elements, a hologram element manufacturing apparatus, and a mold for manufacturing hologram elements in a simpler and faster manner than conventional methods.

  In order to achieve the above object, a method for manufacturing a follower element according to the present invention includes a mold having a hologram processing pattern, an element material for the hologram element, a mold mounting means for mounting the mold, and the element material. A preparation device is prepared by preparing a transfer device having an element material installation means, a moving stage means for moving the mold means or the element material, a heating means and a pressing means for heating the mold and the element material. A preparation step to be performed; a mold mounting step of mounting the mold on a mold mounting means of the transfer device; an element material setting step of setting the element material at a predetermined setting position of the transfer device; and the element material The element material set in the setting position in the setting process or the mold mounted in the mold mounting process is transferred to the hologram processing pattern by the moving stage means of the transfer device. A positioning step for positioning the mold and the element material to a predetermined temperature, an overheating step for heating the mold and the element material to a predetermined temperature by the heating means, and the mold positioned in the positioning step for the hologram element A pressing transfer step of pressing and transferring to the element material by the pressing means, and pressing and transferring the hologram pattern formed on the mold to the element material for the hologram element, Configured as a feature.

  In order to achieve the above object, it is preferable to use a focused ion beam (FIB) apparatus for the mold according to the present invention to process the processing pattern for hologram.

  In order to achieve the above object, the hologram element manufacturing apparatus of the present invention includes a mold on which a hologram processing pattern is formed, a mold mounting means for mounting the mold, and an element on which the element material is installed. A material placing means, a moving stage means for moving the mold mounting means or the element material placing means, a heating means for overheating the mold and the element material, and pressing the mold and the element material to And a pressing means for transferring the hologram pattern of the mold.

  Furthermore, in order to achieve the above object, a mold according to the present invention is a mold used in manufacturing a hologram element in which a hologram element is transferred and manufactured using an element material for the hologram element, and the mold is a hologram A mold having a hologram pattern for manufacturing the element was obtained.

  In the present invention, transfer is performed using a mold having a hologram pattern (in the present invention, not only a metal mold but also a mold for molding and transfer). Since the hologram element is manufactured by the apparatus, a large amount of hologram elements can be manufactured faster than before.

  By processing the material for the hologram element using the FIB apparatus, a mold having a hologram pattern used for transferring the hologram can be easily manufactured, and the path for mass production can be opened.

An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a diagram showing a conceptual apparatus configuration relating to a transfer apparatus as a manufacturing apparatus for manufacturing a hologram element used in this embodiment. FIG. 2 shows characteristic steps in the hologram element manufacturing method of this embodiment. In FIG. 1, a transfer apparatus 10 includes a mold 11, a mold mounting plate 13 on which the mold is mounted, a pressing portion 17 that presses the mold against the material element 12 for the hologram element, and a moving stage 15 that moves the element material. And the heating unit 16 and the like. As shown in FIG. 2, the hologram element manufacturing process according to the embodiment of the present invention includes a preparation process ST1, a mold mounting process ST2, an element material installation process ST3, a positioning process ST4, a heating process ST5, and a pressure transfer process. It has each manufacturing process of process ST6. Hereinafter, these apparatuses and processes will be described with reference to FIGS.

(Preparation process ST1)
In a preparation step ST1 in FIG. 2, a mold 11 on which a hologram processing pattern is processed and a resin plate (for example, an acrylic plate) 12 that is an element material for hologram are first prepared. Moreover, the transfer device 10 is also prepared. As shown in FIG. 1, the transfer apparatus 10 includes a mold mounting part 13 for mounting a mold 11, a pallet 14 on which a resin plate 12 is installed, and a moving stage 15 that moves an element material. And a superheater 16 that heats the mold and the resin plate, and a motor-driven pressing portion 17 that presses the mold 11 against the resin plate, and preparation for operation necessary for operation is made.

(Mold mounting process ST2)
Further, in the mold mounting step ST2, the mold on which the hologram processing pattern is processed is mounted on the mold mounting portion 13 of the transfer device 10 described above.

(Element material installation step ST3)
In the element material installation step ST3, the resin plate 12 is installed on the pallet 14 of the transfer device 10. As shown in FIG. 1, the pallet 14 is placed on a moving stage device 16 configured with X and Y axes. The moving stage 16 has a configuration for positioning on the XY plane using driving means of an XY orthogonal coordinate system. .

(Positioning step ST4)
In the positioning step ST4, the pallet 14 on which the resin plate 12 is installed is moved by the moving stage 16 to a transferable position corresponding to the mold.

(Press transfer process ST6)
In the press transfer process ST6, the mold 11 is pressed against the resin material 12 for the hologram element using a predetermined pressable pressing portion 17 driven by an electric motor and an operating mechanism prepared in the transfer device 10, and the metal mold 11 is pressed. The hologram processing pattern processed into the mold is transferred to the resin material 12 to manufacture a hologram element.

  Next, the production of the mold 16 used in this embodiment having the processing pattern for hologram will be described with reference to FIG. FIG. 2 shows a conceptual apparatus configuration necessary for manufacturing the mold 16, and an original image 51 used for a hologram is first determined and prepared and input to a personal computer (PC) apparatus 20. The

The PC device 20 controls a scanner 21, a keyboard 22, a monitor display 23, a communication device 24, and other input / output devices, an operating system (OS) program 41, and an input / output device. It includes input / output software 42, conversion software 43 which is software for controlling data conversion, memory 26 for storing other various software and various data, and CPU 27 for controlling these.

The original image 51 is scanned using the scanner 21 prepared in the PC device 20 and is taken into the PC device 20 as hologram image data 46. Further, by the conversion software 43 to hologram processing data set in the PC device, the data is converted into a processing data format (for example, bitmap pattern data: BPD), and processing data 47 is created. The processing data 47 is ON / OFF binary data, and corresponds to the processing shape for the hologram of the die to be processed. The ON portion of this data is irradiated with an ion beam, and the OFF portion is blanked with the ion beam, and processed into a shape with concave and convex grooves as a whole. (Note that such hologram pattern ON / OFF data can exhibit the same function as a hologram even if the unevenness is reversed, so that the data can exhibit the same function even if ON / OFF is inverted.)

The converted processing data 47 is connected to the communication unit 34 of the FIB device 30 via the communication device 24 of the PC device 20 and received by the FIB device 30. That is, processing information necessary for processing is transmitted and received between the communication unit 24 of the PC device 20 and the communication unit 34 of the FIB device.

  The FIB apparatus 30 uses the necessary processing data received from the communication unit 38 controlled by the built-in control apparatus 37 to generate an ion beam 32 from the ion source 31 and irradiate the mold 18 for processing. This processing is a kind of so-called sputter processing, and for irradiation of an ion beam for processing, irradiation at an acceleration voltage of 20-40 KV is convenient. Further, the ion beam is repeatedly irradiated several times depending on the amount of the element material to be processed and removed. Here, when the acceleration voltage is a low voltage of 20 KV, the beam shape has a relatively large beam diameter (for example, about 1 micrometer), and contamination by the beam irradiation is relatively reduced. When the acceleration voltage is 40 KV, which is a higher voltage, the beam shape becomes relatively sharp (for example, about 500 nanometers), but on the other hand, contamination by the beam becomes severe. Therefore, for various processes, an acceleration voltage range in the range of 20-40 KV is preferable in consideration of processing efficiency for repeated irradiation, etc., and a voltage of such a value is a range of acceleration voltages to be used.

  The ion beam scan is performed by using the processing data from the PC device 20, the acceleration voltage designation data, and other necessary data, using the built-in ion beam control device 37 of the FIB device 30, and the blanking electrode (BLK). ) 33 and scan electrode (SCAN) 34 are controlled.

  As described above, the hologram processing data is sent from the PC device 20 to the FIB device 30, and the FIB device 30 sets the received processing conditions inside, determines the beam irradiation conditions, and processes the mold 18. Then, the mold is repeatedly irradiated several times depending on the material, and the mold 11 having the hologram processing pattern is obtained. A plurality of the same images are processed on the mold 11 (repeatedly, in this application, it means not only a metal mold but also a mold for molding / transfer), and the transfer device 30 is used as an element material for a hologram element. By transferring a large number of images, a hologram element can be obtained quickly and in large quantities. Further, even if a large number of element materials are set on the pallet, moved successively from the moving stage device, and transferred on each of them, a large number of hologram elements can be obtained in the same manner.

Next, an embodiment of the present invention will be described with reference to FIG. In the example of FIG. 4, an image including the kanji character “East” is used as the original image. Further, glassy carbon was used as a material for the mold. In addition, COP (cycloolefin polymer) was used as an element material. As the FIB apparatus, an FB-2100 type FIB apparatus manufactured by Hitachi, Ltd. was used, and an ST-50 type transfer apparatus manufactured by Toshiba Machine was used as the transfer apparatus. The FIB apparatus had an acceleration voltage of 40 KV and a pressing force of about 2 KN.
FIG. 3A is a SIM image obtained by further enlarging a part of a 500-micrometer square hologram element manufactured by being transferred from a mold by a transfer device. In this image, it is observed that the width of the transferred concave and convex grooves is approximately 500 nanometers. FIG. 3 (b) shows a hologram reproduction image using the manufactured hologram element and irradiating a laser beam having a wavelength of 650 nanometers. The reproduction image including the same Chinese character “East” as the original image is black. It shows that it is displayed as a thin floating on the plate. The white part on the left is due to the straight laser beam.

  The present invention is not limited to the above-described embodiments, and various forms can be used. For example, in the embodiment described above, the method in which the element material is moved by the moving stage is shown, but an apparatus configured to move the mold may be used. The element material for the hologram element may be made of a resin that transmits light, and may be COP (cycloolefin polymer) in addition to acrylic. In the case of COP, light transmittance is relatively good. In addition, although a method using a heater is shown for the heating unit in the transfer device as the hologram element manufacturing apparatus, other heating methods such as a heat source using light such as a halogen lamp, electromagnetic waves, or the like may be used. Although the pressurizing method using an electric motor is shown for the pressurizing unit, a method using hydraulic pressure may be used. Further, the moving stage means is not limited to the rotary electric motor but may be a linear motor type, an electromagnetic strain element type, or a moving type of a hydraulic moving stage. Further, the mold may be cut using a hologram pattern, such as an ion beam, a charged particle such as an electron beam, or an ultra-precise machine tool capable of precisely positioning in nanometer units.

  The present invention can be applied to an industry that desires to manufacture a large amount of hologram elements relatively faster than the conventional method using the method, apparatus, and mold described in detail in the above embodiments.

Conceptual configuration diagram of a transfer apparatus as a hologram element manufacturing apparatus used in the method of the present invention The figure explaining the process of the method of this invention. The figure explaining the process of manufacturing the metal mold | die used for this invention. The figure which shows the SIM image of the metal mold | die manufactured in the Example of this invention, the SIM image of the manufactured hologram element, and the reproduction image reproduced using the same element.

Explanation of symbols

10 Transfer Device 11 Mold 12 Element Material (Acrylic Plate)
DESCRIPTION OF SYMBOLS 13 Mold mounting plate 14 Pallet for element material installation 15 Moving stage 16 Heating heater 20 Personal computer 21 Scanner 22 Keyboard 23 Display monitor 24 Communication part 26 Memory 30 FIB apparatus 32 Blanking electrode
33 Scanning Electrode 34 Communication Unit 34 Control Device 41 OS
42 I / O control program 43 Conversion program 46 Original image data
47 Machining data

Claims (9)

A method for manufacturing a hologram element, the method comprising:
A mold on which a processing pattern for hologram is formed, an element material for hologram element, a mold mounting means for mounting the mold, an element material setting means for installing the element material, and the mold means or the element material A preparation step of preparing a processing by preparing a transfer stage device having a moving stage means for moving, a heating means for heating the mold and element material, and a pressing means;
A mold mounting step of mounting the mold on the mold mounting means of the transfer device;
An element material setting step for setting the element material at a predetermined setting position of the transfer device;
Positioning for positioning the element material set at the set position in the element material setting step or the mold mounted in the mold mounting step to a position where the hologram processing pattern can be transferred by the moving stage means of the transfer device Process,
An overheating step of heating the mold and the element material to a predetermined temperature by the heating means;
A pressure transfer step of pressing and transferring the mold positioned in the positioning step to the element material for a hologram element by the pressing means;
A method for manufacturing a hologram element, comprising: pressing and transferring a hologram pattern formed on the mold to the element material for a hologram element. In the method for manufacturing a hologram element according to claim 1,
A method of manufacturing a hologram element, wherein the mold uses a focused ion beam (FIB) device to process the processing pattern for hologram.   3. The method for manufacturing a hologram element according to claim 2, wherein the processing pattern for hologram processed into the mold by the FIB apparatus scans an original image for hologram by a computer device having a scanner, and performs predetermined processing. A method for manufacturing a hologram element, wherein the data is converted into processing data using the data conversion software.   4. The method for manufacturing a hologram element according to claim 2, wherein the mold is made of glassy carbon.   5. The method of manufacturing a hologram element according to claim 1, wherein the element material for the hologram element is a thermoplastic resin.   6. The method for manufacturing a hologram element according to claim 2, wherein an acceleration voltage of the ion beam of the FIB apparatus is set to 20 to 40 KV and irradiation is repeated. In a hologram element manufacturing apparatus that manufactures a hologram element using an element material for a hologram element, the hologram element manufacturing apparatus includes:
A mold with a processing pattern for hologram;
Mold mounting means for mounting the mold;
An element material installation means for installing the element material;
Moving stage means for moving the mold mounting means or the element material setting means;
Heating means for heating the mold and the element material;
A pressing means for transferring the hologram pattern of the mold by pressing the mold and the element material;
Hologram element manufacturing apparatus characterized by comprising     A mold used in hologram element manufacturing for transferring and manufacturing a hologram element using an element material for the hologram element, wherein the mold has a hologram pattern for manufacturing the hologram element. Type.     9. The mold according to claim 8, wherein the hologram pattern processed into the former mold is processed by a charged particle beam or a machine tool.

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