JP2008122890A - Manufacturing method of color filter - Google Patents

Abstract

A color filter manufacturing method using a dry etching method, which is capable of manufacturing a color filter having fine and rectangular pixels and excellent flatness.
An etching stopper layer is formed on a first colored layer provided on a support, and the first colored layer corresponding to a region where the second colored layer is to be formed is removed by a dry etching method. . A second colored layer was formed so as to fill the removed region. After the second colored layer was removed until the etching stopper layer was detected, an etching stopper layer was formed. Next, the first colored layer corresponding to the region where the third colored layer is to be formed is removed by a dry etching method. In this method, a third colored layer is formed so as to embed the removed region, and the colored layer laminated on the colored layer is removed until the etching stopper layer is exposed.
[Selection figure] None

Description

  The present invention relates to a method for manufacturing a color filter using a dry etching method.

  As a method for producing a color filter used for a liquid crystal display device or a solid-state imaging device, a dyeing method, a printing method, an electrodeposition method, and a pigment dispersion method are known.

  Among these, the pigment dispersion method is a method for producing a color filter by a photolithography method using a colored radiation-sensitive composition in which a pigment is dispersed in various photosensitive compositions. It has the advantage of being stable to heat and the like. Further, since patterning is performed by a photolithography method, it has been widely used as a suitable method for manufacturing a color filter for a large-screen, high-definition color display with high positional accuracy.

  When producing a color filter by a pigment dispersion method, a radiation sensitive composition is applied on a glass substrate by a spin coater or a roll coater and dried to form a coating film, and the coating film is subjected to pattern exposure and development. Colored pixels are formed, and a color filter can be obtained by repeating this operation for each necessary color.

  Examples of the pigment dispersion method include a negative photosensitive composition in which a photopolymerizable monomer and a photopolymerization initiator are used in combination with an alkali-soluble resin (see, for example, Patent Documents 1 to 4).

  In recent years, color filters for solid-state imaging devices have been desired to have higher definition, and a technique using a dye has been proposed (for example, see Patent Document 5). However, a curable composition containing a dye is generally inferior to a pigment in terms of various performances such as light resistance, heat resistance, solubility, and coating uniformity. In particular, in the case of the use for producing a color filter for a solid-state imaging device, a film thickness of 1.5 μm or less is required, so that a large amount of dye must be added to the curable composition. There are various problems, such as insufficient adhesion, insufficient curing, and loss of dye even in the exposed area, which makes pattern formation extremely difficult.

  In addition, in the liquid crystal display device and the solid-state imaging device, the pixel size is being reduced, and the color filter is also required to be reduced. In particular, miniaturization of a solid-state imaging device is remarkable, and a high-resolution technique with a size of less than 2.0 μm is required, and the resolution of the conventional photolithographic method is becoming a limit.

  In contrast to the color filter manufacturing method using the photolithographic method, a dry etching method has been known for a long time as a method for forming a fine pattern with a thinner film. The dry etching method has been conventionally employed as a method for forming a pattern on a dye-deposited thin film (see, for example, Patent Document 6). With regard to the thin film formation, the film thickness is set to the same level as the spectral characteristics compared to the photolithographic system. However, it is possible to form a thin film having a thickness of 1/2 or less. In addition, a pattern formation method combining a photolithography method and a dry etching method has been proposed (see, for example, Patent Document 7).

JP-A-2-181704 JP-A-2-199403 Japanese Patent Laid-Open No. 5-273411 JP-A-7-140654 JP-A-6-75375 JP-A-55-146406 JP 2001-249218 A

However, in the formation of a thin film by vapor deposition, contamination of the vapor deposition apparatus is unavoidable, and it is a heavy load for the production of a color filter. Further, since the pixel is formed only with the pigment or the dye, the adhesion with the lower planarization film or the upper layer is poor, which is one of the causes of the yield not increasing.
In the production of a color filter by dry etching, the second color material applied on the first layer and the first layer are removed when forming and etching the second color layer. There is a problem that it is difficult to simultaneously remove the coloring material of the second layer applied to the region. In the case of separately removing the second layer coloring material applied on the first layer and the second layer coloring material applied to the region from which the first layer has been removed, There were problems such as an increase in cost and cost increase.

  The present invention has been made in view of the above problems, and is a method of manufacturing a color filter using a dry etching method, which can manufacture a color filter having fine and rectangular pixels and excellent in flatness. It is an object of the present invention to provide a method for manufacturing a possible color filter.

Specific means for solving the above problems are as follows.
<1> (a) a first colored layer forming step for forming a first colored layer on a support; and (b) an etching stopper layer for forming an etching stopper layer on at least the first colored layer. Forming step; (c) forming a photoresist layer on the etching stopper layer; and (d) forming a second colored layer different from the first colored layer on the support. An image forming step of forming an image on the etching stopper layer by removing the photoresist layer in the region, and (e) the etching stopper layer in the region like the image formed by the image forming step. And an etching step of removing the first colored layer by a dry etching method, and (f) removing the photoresist layer remaining after the etching step. A photoresist layer removing step, (g) a second colored layer forming step for forming the second colored layer in at least the region where the first colored layer is removed, and (h) the etching stopper. And a colored layer removing step of removing the colored layer portion laminated on the etching stopper layer until the layer is detected.
<2> The method for producing a color filter according to <1>, further including at least one group of step groups in which the steps (b) to (h) are sequentially performed.
<3> At least one of the colored layer forming step is a step of forming a colored layer by applying a colored curable composition. The color filter according to <1> or <2>, It is a manufacturing method.
<4> The method for producing a color filter according to <3>, wherein the colored curable composition is applied by coating.
<5> The method for producing a color filter according to <3> or <4>, wherein the colored curable composition is a colored photocurable composition or a colored thermosetting composition. .

  According to the present invention, there is provided a color filter manufacturing method using a dry etching method and capable of manufacturing a color filter having fine and rectangular pixels and excellent flatness. can do.

[Colored layer forming step]
The method for producing a color filter of the present invention includes (a) a first colored layer forming step of forming a first colored layer on a support.
<Support>
Examples of the support in the present invention include soda glass, borosilicate glass, quartz glass used for liquid crystal display elements and the like, and those obtained by attaching a transparent conductive film to these, and photoelectric conversion element substrates used for imaging elements and the like. Examples thereof include a silicon substrate and a complementary metal oxide semiconductor (CMOS). These supports may be formed with black stripes that separate pixels.
Further, an undercoat layer may be provided on these supports, if necessary, in order to improve adhesion with the upper layer, prevent diffusion of substances, or flatten the substrate surface.

<Colored layer>
The colored layer in the present invention can constitute at least one of the pixels of the color filter in the present invention.
In the present invention, the first colored layer is preferably formed by applying a colored curable composition containing a colorant. By using the colored curable composition, the adhesion to the support or the undercoat layer provided on the support can be improved.
Furthermore, in the present invention, the colored curable composition is preferably applied by coating. As a coating method, the colored curable composition can be applied on at least the support by a method such as spin coating, cast coating, roll coating, or slit coating. By applying the colored curable composition by coating, the colored curable composition can be more uniformly applied on the support.

In the present invention, as the colored curable composition, a colored photocurable composition or a non-photosensitive colored thermosetting composition can be preferably used. Thereby, not only materials developed for etching but also existing materials can be used.
The colored layer in the present invention is more preferably formed using a non-photosensitive colored thermosetting composition from the viewpoint of spectral characteristics.

(Colored thermosetting composition)
The non-photosensitive colored thermosetting composition in the present invention contains a colorant and a thermosetting compound, and the colorant concentration in the total solid content is 50% by mass or more and less than 100% by mass. preferable.

-Colorant-
The colorant that can be used in the present invention is not particularly limited, and various conventionally known dyes and pigments can be used alone or in combination.

Examples of the pigment that can be used in the present invention include conventionally known various inorganic pigments or organic pigments. Further, considering that it is preferable to have a high transmittance, whether it is an inorganic pigment or an organic pigment, it is preferable to use a pigment having an average particle size as small as possible, and considering the handling properties, the average particle size of the pigment is 0.01 μm to 0.1 μm is preferable, and 0.01 μm to 0.05 μm is more preferable.
Examples of the inorganic pigment include metal compounds represented by metal oxides, metal complex salts, and the like. Specifically, iron, cobalt, aluminum, cadmium, lead, copper, titanium, magnesium, chromium, zinc, antimony And metal oxides such as the above-mentioned metal oxides.

As the organic pigment, for example,
C. I. Pigment yellow 11,24,31,53,83,93,99,108,109,110,138,139,147,150,151,154,155,167,180,185,199;
C. I. Pigment orange 36, 38, 43, 71;
C. I. Pigment red 81,105,122,149,150,155,171,175,176,177,209,220,224,242,254,255,264,270;
C. I. Pigment violet 19, 23, 32, 39;
C. I. Pigment Blue 1, 2, 15, 15: 1, 15: 3, 15: 6, 16, 22, 60, 66;
C. I. Pigment green 7, 36, 37;
C. I. Pigment brown 25, 28;
C. I. Pigment black 1,7;
Examples thereof include carbon black.

  Examples of pigments that can be preferably used in the present invention include the following. However, the present invention is not limited to these.

C. I. Pigment yellow 11,24,108,109,110,138,139,150,151,154,167,180,185;
C. I. Pigment orange 36, 71;
C. I. Pigment red 122,150,171,175,177,209,224,242,254,255,264;
C. I. Pigment violet 19, 23, 32;
C. I. Pigment blue 15: 1, 15: 3, 15: 6, 16, 22, 60, 66;
C. I. Pigment Black 1

  These organic pigments can be used alone or in combination of two or more. By using two or more types in combination, the color purity of the colored layer can be increased. Specific examples of the above combinations are shown below. For example, as a red pigment, an anthraquinone pigment, a perylene pigment, a diketopyrrolopyrrole pigment alone or at least one of them, a disazo yellow pigment, an isoindoline yellow pigment, a quinophthalone yellow pigment or a perylene red pigment And the like can be used. For example, as an anthraquinone pigment, C.I. I. Pigment Red 177, and perylene pigments include C.I. I. Pigment red 155, C.I. I. Pigment Red 224, and diketopyrrolopyrrole pigments include C.I. I. Pigment Red 254, and C.I. I. Mixing with Pigment Yellow 139 is preferred. The mass ratio of the red pigment to the yellow pigment is preferably 100: 5 to 100: 75. Within this range, the light transmittance can be suppressed and the color purity can be increased. A more preferable mass ratio is 100: 10 to 100: 50.

  As the green pigment, a halogenated phthalocyanine pigment can be used alone, or a mixture thereof with a disazo yellow pigment, a quinophthalone yellow pigment, an azomethine yellow pigment or an isoindoline yellow pigment can be used. For example, C.I. I. Pigment Green 7, 36, 37 and C.I. I. Pigment yellow 83, C.I. I. Pigment yellow 138, C.I. I. Pigment yellow 139, C.I. I. Pigment yellow 150, C.I. I. Pigment yellow 180 or C.I. I. Mixing with Pigment Yellow 185 is preferred. The mass ratio of the green pigment to the yellow pigment is preferably 100: 5 to 100: 150.

  As the blue pigment, a phthalocyanine pigment can be used alone, or a mixture thereof with a dioxazine purple pigment can be used. For example, C.I. I. Pigment blue 15: 6 and C.I. I. Mixing with pigment violet 23 is preferred. The mass ratio of the blue pigment to the violet pigment is preferably 100: 0 to 100: 30.

  In the present invention, when the colorant is a dye, it can be uniformly dissolved in the composition to obtain a non-photosensitive thermosetting colored resin composition.

  The dye that can be used as the colorant constituting the composition in the present invention is not particularly limited, and conventionally known dyes for color filters can be used. For example, Japanese Patent Application Laid-Open No. 64-90403, Japanese Patent Application Laid-Open No. 64-91102, Japanese Patent Application Laid-Open No. 1-94301, Japanese Patent Application Laid-Open No. 6-11614, No. 2592207, US Pat. No. 4,808,501. Specification, US Pat. No. 5,667,920, US Pat. No. 5,059,500, JP-A-5-333207, JP-A-6-35183, JP-A-6-51115 JP-A-6-194828, JP-A-8-21599, JP-A-4-249549, JP-A-10-123316, JP-A-11-302283, JP-A-7-286107, JP 2001-4823, JP-A-8-15522, JP-A-8-29771, JP-A-8-146215, JP-A-11-3434. 7, JP-A-8-62416, JP-A-2002-14220, JP-A-2002-14221, JP-A-2002-14222, JP-A-2002-14223, JP-A-8-302224 The dyes disclosed in JP-A-8-73758, JP-A-8-179120, JP-A-8-151531, and the like can be used.

  The chemical structure includes pyrazole azo, anilino azo, triphenyl methane, anthraquinone, anthrapyridone, benzylidene, oxonol, pyrazolotriazole azo, pyridone azo, cyanine, phenothiazine, pyrrolopyrazole azomethine, Xanthene-based, phthalocyanine-based, benzopyran-based and indigo-based dyes can be used.

In the case of a resist system that performs water or alkali development, an acid dye and / or a derivative thereof may be suitably used from the viewpoint of completely removing a binder and / or dye in a portion to be removed by development. .
In addition, a direct dye, a basic dye, a mordant dye, an acid mordant dye, an azoic dye, a disperse dye, an oil-soluble dye, a food dye, and / or a derivative thereof can be usefully used.

The acidic dye is not particularly limited as long as it has an acidic group such as sulfonic acid or carboxylic acid, but is soluble in an organic solvent or a developer, salt-forming with a basic compound, absorbance, other in the composition. It is selected in consideration of all the required performances such as interaction with the components, light resistance and heat resistance.
Although the specific example of the said acidic dye is given to the following, it is not limited to these. For example,
acid alizarin violet N; acid black 1, 2, 24, 48; acid blue 1, 7, 9, 15, 18, 23, 25, 27, 29, 40, 45, 62, 70, 74, 80, 83, 86 , 87, 90, 92, 103, 112, 113, 120, 129, 138, 147, 158, 171, 182, 192, 243, 324: 1; acid chroma violet K; acid Fuchsin; acid green 1, 3, 5 , 9, 16, 25, 27, 50; acid orange 6, 7, 8, 10, 12, 50, 51, 52, 56, 63, 74, 95; acid red 1, 4, 8, 14, 17, 18 , 26, 27, 29, 31, 34, 35, 37, 42, 44, 50, 51, 52, 57, 66, 73, 0, 87, 88, 91, 92, 94, 97, 103, 111, 114, 129, 133, 134, 138, 143, 145, 150, 151, 158, 176, 183, 198, 211, 215, 216 217,249,252,257,260,266,274; acid violet 6B, 7,9,17,19; acid yellow 1,3,7,9,11,17,23,25,29,34,36, 42, 54, 72, 73, 76, 79, 98, 99, 111, 112, 114, 116, 184, 243; Food Yellow 3; and derivatives of these dyes.

Among these, the acid dye includes acid black 24; acid blue 23, 25, 29, 62, 80, 86, 87, 92, 138, 158, 182, 243, 324: 1; acid orange 8, 51, 56, Acid red 1,4,8,34,37,42,52,57,80,97,114,143,145,151,183,217; acid violet 7; acid yellow 17,25,29, Dyes such as 34, 42, 72, 76, 99, 111, 112, 114, 116, 184, 243; acid green 25 and derivatives of these dyes are preferred.
Other than the above, azo, xanthene and phthalocyanine acid dyes are also preferred. I. Solvent Blue 44, 38; C.I. I. Acid dyes such as Solvent orange 45; Rhodamine B, Rhodamine 110, and derivatives of these dyes are also preferably used.

  Although the coloring agent content rate in the total solid of the colored thermosetting composition in this invention is not specifically limited, Preferably it is 30-60 mass%. By setting it to 30% or more, an appropriate chromaticity as a color filter can be obtained. Moreover, thermosetting can fully be advanced by setting it as 60% or less, and the strength reduction as a film | membrane can be suppressed.

  In the present invention, conventionally known pigment dispersants and surfactants can be added for the purpose of improving the dispersibility of the pigment. As these dispersants, many kinds of compounds are used. For example, a phthalocyanine derivative (commercial product EFKA-745 (manufactured by Efka)), Solsperse 5000 (manufactured by Nippon Lubrizol Co., Ltd.); organosiloxane polymer KP341 (Manufactured by Shin-Etsu Chemical Co., Ltd.), (meth) acrylic acid-based (co) polymer polyflow No. 75, No. 90, No. 95 (manufactured by Kyoeisha Yushi Chemical Co., Ltd.), W001 (Yusho Co., Ltd.) )) Cationic surfactants such as: polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol di Stearate, sol Nonionic surfactants such as tan fatty acid esters; Anionic surfactants such as W004, W005, W017 (manufactured by Yusho Co., Ltd.); EFKA-46, EFKA-47, EFKA-47EA, EFKA polymer 100, EFKA polymer 400, EFKA polymer 401, EFKA polymer 450 (manufactured by Morishita Sangyo Co., Ltd.), disperse aid 6, disperse aid 8, disperse aid 15, disperse aid 9100 (manufactured by San Nopco) Agents: Solsperse 3000, 5000, 9000, 12000, 13240, 13940, 17000, 24000, 26000, 28000 and other Solsperse dispersants (manufactured by Nippon Lubrizol Co., Ltd.); Adeka Pluronic L31, F38, L42, L44, L61, L 4, F68, L72, P95, F77, P84, F87, P94, L101, P103, F108, L121, P-123 (manufactured by Asahi Denka Co., Ltd.) and Isonet S-20 (manufactured by Sanyo Kasei Co., Ltd.). It is done.

-Thermosetting compound-
The thermosetting compound that can be used in the present invention is not particularly limited as long as the film can be cured by heating. For example, a compound having a thermosetting functional group can be used. As the thermosetting compound, for example, those having at least one group selected from an epoxy group, a methylol group, an alkoxymethyl group, and an acyloxymethyl group are preferable.

  More preferable thermosetting compounds include (a) an epoxy compound, (b) a melamine compound, a guanamine compound, and a glycoluril substituted with at least one substituent selected from a methylol group, an alkoxymethyl group, and an acyloxymethyl group. A compound or a urea compound, (c) a phenol compound, a naphthol compound, or a hydroxyanthracene compound substituted with at least one substituent selected from a methylol group, an alkoxymethyl group, and an acyloxymethyl group. Among these, a polyfunctional epoxy compound is particularly preferable as the thermosetting compound.

  The epoxy compound (a) may be any epoxy compound as long as it has an epoxy group and has crosslinkability, for example, bisphenol A diglycidyl ether, ethylene glycol diglycidyl ether, butanediol diglycidyl ether. Divalent glycidyl group-containing low molecular weight compounds such as hexanediol diglycidyl ether, dihydroxybiphenyl diglycidyl ether, diglycidyl phthalate, N, N-diglycidyl aniline, and the like; Trivalent glycidyl group-containing low molecular weight compounds represented by methylolphenol triglycidyl ether, TrisP-PA triglycidyl ether, etc .; similarly, pentaerythritol tetraglycidyl ether, tetramethylol Tetravalent glycidyl group-containing low molecular weight compounds typified by Sphenol A tetraglycidyl ether; similarly, polyvalent glycidyl group-containing low molecular weight compounds such as dipentaerythritol pentaglycidyl ether and dipentaerythritol hexaglycidyl ether; (Meth) acrylate, glycidyl group-containing polymer represented by 1,2-epoxy-4- (2-oxiranyl) cyclohexane adduct of 2,2-bis (hydroxymethyl) -1-butanol and the like It is done.

  Commercially available products include alicyclic epoxy compounds: “CEL-2021”, etc., alicyclic solid epoxy resins: “EHPE-3150”, etc., epoxidized polybutadiene: “PB3600”, etc. Ring epoxy compound: etc. "CEL-2081", lactone modified epoxy resin: "PCL-G" etc. are mentioned (all are Daicel Chemical Industries Ltd. make). Other examples include “Celoxide 2000”, “Epolide GT-3000”, “GT-4000” (all manufactured by Daicel Chemical Industries, Ltd.), and the like. Among these, the alicyclic solid epoxy resin has the best curability, and “EHPE-3150” has the best curability. These compounds may be used alone or in combination of two or more, and combinations with other types shown below are also possible.

The number of methylol groups, alkoxymethyl groups, and acyloxymethyl groups contained in (b) that are substituted for each compound is 2 to 6 for melamine compounds, glycoluril compounds, guanamine compounds, and urea compounds. Although it is 2-4, Preferably it is 5-6 in the case of a melamine compound, and 3-4 in the case of a glycoluril compound, a guanamine compound, and a urea compound.
Hereinafter, the melamine compound, guanamine compound, glycoluril compound and urea compound of (b) are collectively referred to as a compound (containing a methylol group, an alkoxymethyl group or an acyloxymethyl group) in (b).

  The methylol group-containing compound in (b) can be obtained by heating the alkoxymethyl group-containing compound in (b) in an alcohol in the presence of an acid catalyst such as hydrochloric acid, sulfuric acid, nitric acid, methanesulfonic acid or the like. The acyloxymethyl group-containing compound in (b) can be obtained by mixing and stirring the methylol group-containing compound in (b) with acyl chloride in the presence of a basic catalyst.

Hereinafter, specific examples of the compound in (b) having the substituent will be given.
Examples of the melamine compound include hexamethylol melamine, hexakis (methoxymethyl) melamine, a compound in which 1 to 5 methylol groups of hexamethylol melamine are methoxymethylated, or a mixture thereof, hexakis (methoxyethyl) melamine, hexakis (acyloxy) Methyl) melamine, a compound in which 1 to 5 methylol groups of hexamethylolmelamine are acyloxymethylated, or a mixture thereof.

  Examples of the guanamine compound include tetramethylolguanamine, tetrakis (methoxymethyl) guanamine, a compound obtained by methoxymethylating 1 to 3 methylol groups of tetramethylolguanamine or a mixture thereof, tetrakis (methoxyethyl) guanamine, tetrakis (acyloxy) Methyl) guanamine, a compound obtained by acyloxymethylating 1 to 3 methylol groups of tetramethylolguanamine, or a mixture thereof.

  Examples of the glycoluril compound include tetramethylol glycoluril, tetrakis (methoxymethyl) glycoluril, a compound obtained by methoxymethylating 1 to 3 methylol groups of tetramethylolglycoluril or a mixture thereof, and tetramethylolglycoluril methylol. Examples thereof include compounds in which 1 to 3 groups are acyloxymethylated or a mixture thereof.

Examples of the urea compound include tetramethylol urea, tetrakis (methoxymethyl) urea, a compound obtained by methoxymethylating 1 to 3 methylol groups of tetramethylolurea or a mixture thereof, tetrakis (methoxyethyl) urea, and the like. .
These compounds in (b) may be used alone or in combination.

  The compound in (c) above, that is, the phenol compound, naphthol compound or hydroxyanthracene compound substituted with at least one group selected from a methylol group, an alkoxymethyl group, and an acyloxymethyl group is a compound in the above (b) As in the case of, the intermixing with the overcoated photoresist is suppressed and the film strength is further increased. Hereinafter, these compounds may be collectively referred to as a compound (containing a methylol group, an alkoxymethyl group or an acyloxymethyl group) in (c).

The number of methylol groups, acyloxymethyl groups or alkoxymethyl groups contained in the compound in (c) is at least two per molecule, and from the viewpoints of thermosetting and storage stability, a phenolic compound serving as a skeleton A compound in which all of the 2- and 4-positions are substituted is preferred. Further, the naphthol compound and hydroxyanthracene compound as the skeleton are also preferably compounds in which all of the ortho-position and para-position of the OH group are substituted. The 3-position or 5-position of the phenol compound may be unsubstituted or may have a substituent.
The naphthol compound may be unsubstituted or substituted except for the ortho position of the OH group.

As the methylol group-containing compound in (c), a compound in which the phenolic OH group has a hydrogen atom at the 2-position or 4-position is used as a raw material, and this is used as sodium hydroxide, potassium hydroxide, ammonia, tetraalkylammonium hydroxide, etc. Obtained by reacting with formalin in the presence of a basic catalyst.
The alkoxymethyl group-containing compound in (c) can be obtained by heating the methylol group-containing compound in (c) in an alcohol in the presence of an acid catalyst such as hydrochloric acid, sulfuric acid, nitric acid, methanesulfonic acid or the like.
The acyloxymethyl group-containing compound in (c) can be obtained by reacting the methylol group-containing compound in (c) with an acyl chloride in the presence of a basic catalyst.

  Examples of the skeletal compound in (c) include phenolic compounds, naphthols, hydroxyanthracene compounds, etc., in which the ortho-position or para-position of the phenolic OH group is unsubstituted. For example, phenol, cresol isomers, 2, 3 -Bisphenols such as xylenol, 2,5-xylenol, 3,4-xylenol, 3,5-xylenol and bisphenol A; 4,4'-dihydroxybiphenyl, TrisP-PA (Honshu Chemical Industry Co., Ltd.) Manufactured), naphthol, dihydroxynaphthalene, 2,7-dihydroxyanthracene, and the like.

  Specific examples of (c) include, as a phenol compound, for example, trimethylolphenol, tris (methoxymethyl) phenol, a compound obtained by methoxymethylating one or two methylol groups of trimethylolphenol, trimethylol-3- Compound obtained by methoxymethylating one or two methylol groups of cresol, tris (methoxymethyl) -3-cresol, trimethylol-3-cresol, dimethylol cresol such as 2,6-dimethylol-4-cresol, tetramethylol Bisphenol A, tetrakis (methoxymethyl) bisphenol A, compounds obtained by methoxymethylating 1 to 3 methylol groups of tetramethylolbisphenol A, tetramethylol-4,4′-dihydroxybiphenyl, tetrakis (methoxymethyl) -4,4′-dihydroxybiphenyl, a hexamethylol form of TrisP-PA, a hexakis (methoxymethyl) form of TrisP-PA, a compound obtained by methoxymethylating 1 to 5 methylol groups of the hexamethylol form of TrisP-PA, And bis (hydroxymethyl) naphthalenediol.

  Examples of the hydroxyanthracene compound include 1,6-bis (hydroxymethyl) -2,7-dihydroxyanthracene. Examples of the acyloxymethyl group-containing compound include a methylol group of the methylol group-containing compound. Examples thereof include compounds in which a part or all of them are acyloxymethylated.

Among these compounds, trimethylolphenol, bis (hydroxymethyl) -p-cresol, tetramethylolbisphenol A, hexamethylol body of TrisP-PA (Honshu Chemical Industry Co., Ltd.) or their methylol are preferable. Examples thereof include an alkoxymethyl group and a phenol compound substituted with both a methylol group and an alkoxymethyl group.
These compounds in (c) may be used alone or in combination.

  The total content of the thermosetting compound in the colored thermosetting composition of the present invention varies depending on the material, but is 0.1 to 50 mass based on the total solid content (mass) of the curable composition. % Is preferable, 0.2 to 40% by mass is more preferable, and 1 to 35% by mass is particularly preferable.

-Various additives-
In the colored thermosetting composition of the present invention, various additives such as a binder, a curing agent, a curing catalyst, a solvent, a filler, and a high amount other than those described above are included in the range that does not impair the effects of the present invention. Molecular compounds, surfactants, adhesion promoters, antioxidants, ultraviolet absorbers, aggregation inhibitors, dispersants, and the like can be blended.

~binder~
The binder is often added at the time of preparing the pigment dispersion, does not require alkali solubility, and may be soluble in an organic solvent.

  The binder is preferably a linear organic polymer that is soluble in an organic solvent. Examples of such linear organic high molecular polymers include polymers having a carboxylic acid in the side chain, such as JP-A-59-44615, JP-B-54-34327, JP-B-58-12577, and JP-B-54-. No. 25957, JP-A-59-53836, JP-A-59-71048, methacrylic acid copolymer, acrylic acid copolymer, itaconic acid copolymer, crotonic acid copolymer, etc. Examples thereof include polymers, maleic acid copolymers, partially esterified maleic acid copolymers, and acidic cellulose derivatives having a carboxylic acid in the side chain are also useful.

In addition to the above, polymers obtained by adding acid anhydrides to polymers having a hydroxyl group, polyhydroxystyrene resins, polysiloxane resins, poly (2-hydroxyethyl (meth) acrylate), polyvinylpyrrolidone, polyethylene oxide, polyvinyl Alcohol and the like are also useful.
Moreover, you may copolymerize the monomer which has hydrophilic property, As an example, alkoxyalkyl (meth) acrylate, hydroxyalkyl (meth) acrylate, glycerol (meth) acrylate, (meth) acrylamide, N-methylol acrylamide, Secondary or tertiary alkylacrylamide, dialkylaminoalkyl (meth) acrylate, morpholine (meth) acrylate, N-vinylpyrrolidone, N-vinylcaprolactam, vinylimidazole, vinyltriazole, methyl (meth) acrylate, ethyl (meth) acrylate Branched or linear propyl (meth) acrylate, branched or linear butyl (meth) acrylate, phenoxyhydroxypropyl (meth) acrylate, and the like.

  Among these various binders, from the viewpoint of heat resistance, polyhydroxystyrene resins, polysiloxane resins, acrylic resins, acrylamide resins, and acrylic / acrylamide copolymer resins are preferable. Acrylic resins, acrylamide resins, and acrylic / acrylamide copolymer resins are preferred.

As the acrylic resin, a copolymer comprising monomers selected from benzyl (meth) acrylate, (meth) acrylic acid, hydroxyethyl (meth) acrylate, (meth) acrylamide, and the like, for example, benzyl methacrylate / methacrylic acid, Each copolymer such as benzyl methacrylate / benzylmethacrylamide, KS resist-106 (manufactured by Osaka Organic Chemical Industry Co., Ltd.), cyclomer P series (manufactured by Daicel Chemical Industries, Ltd.) and the like are preferable.
By dispersing the colorant in these binders at a high concentration, it is possible to impart adhesion to the lower layer and the like, which also contributes to the coated surface shape during spin coating and slit coating.

As the binder, a polymer having a mass average molecular weight (polystyrene equivalent value measured by GPC method) of 1000 to 2 × 10 ⁵ is preferable, a polymer of 2000 to 1 × 10 ⁵ is more preferable, and 5000 to 5 × 10. The polymer of ⁴ is particularly preferred.

  The content of the binder in the colored thermosetting composition of the present invention is preferably less than 0.1 to 50% by mass, and preferably 0.2 to 40% by mass with respect to the total solid content (mass) of the composition. Is more preferable, and 1-35 mass% is especially preferable.

~ Curing agent ~
In this invention, when using an epoxy resin as a thermosetting compound, it is preferable to add a hardening | curing agent. There are many types of curing agents for epoxy resins, and their properties, pot life with resin and curing agent mixture, viscosity, curing temperature, curing time, heat generation, etc. vary greatly depending on the type of curing agent used. An appropriate curing agent must be selected according to the purpose of use, use conditions, working conditions, and the like. The curing agent is described in detail in Chapter 5 of Hiroshi Kakiuchi “Epoxy resin (Shojodo)”. Examples of the curing agent are as follows.
Those that act catalytically include tertiary amines, boron trifluoride-amine complexes, those that react stoichiometrically with functional groups of epoxy resins, polyamines, acid anhydrides, etc .; Examples of such materials include diethylenetriamine, polyamide resin, and medium temperature curing examples such as diethylaminopropylamine and tris (dimethylaminomethyl) phenol; examples of high temperature curing include phthalic anhydride and metaphenylenediamine. In terms of chemical structure, amines include diethylenetriamine as an aliphatic polyamine, metaphenylenediamine as an aromatic polyamine, tris (dimethylaminomethyl) phenol as a tertiary amine, phthalic anhydride and polyamide as an acid anhydride. Resin, polysulfide resin, boron trifluoride-monoethylamine complex; Synthetic resin initial condensate includes phenol resin, dicyandiamide and the like.

  These curing agents react with an epoxy group by heating and polymerize to increase the crosslinking density and cure. For thinning, both the binder and the curing agent are preferably as small as possible. In particular, the curing agent is 35% by mass or less, preferably 30% by mass or less, more preferably 25% by mass or less with respect to the thermosetting compound. It is preferable that

~ Curing catalyst ~
In order to achieve a high colorant concentration in the present invention, curing by reaction between epoxy groups is effective in addition to curing by reaction with the curing agent. For this reason, a curing catalyst can be used without using a curing agent. The addition amount of the curing catalyst is about 1/10 to 1/1000, preferably about 1/20 to 1/500, more preferably 1/30, based on the mass of the epoxy resin having an epoxy equivalent of about 150 to 200. It can be cured with a slight amount of about 1/250.

  Specific examples of the curing catalyst include those that are commercially available. For example, imidazole silane series “IS-1000”, “IS-1000D”, “IM-1000”, “SP-1000” of Japan Energy Co., Ltd. , “IA-1000A”, “IA-100P”, “IA-100F”, “IA-100AD”, “IA-100FD”, “IM-100F”, “IS-3000”, “IS-4000”, etc. In addition, “1B2PZ”, “SFZ” and the like manufactured by Shikoku Chemicals are useful.

~solvent~
The colored thermosetting composition in the present invention can be used as a solution dissolved in various solvents. Each solvent used in the colored thermosetting composition in the present invention is basically not particularly limited as long as it satisfies the solubility of each component and the coating property of the colored thermosetting composition. A thermosetting composition is prepared. Solvents that can be used include esters such as ethyl acetate, n-butyl acetate, isobutyl acetate, amyl formate, isoamyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate, alkyl esters, Methyl lactate, ethyl lactate, methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate, methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate,

3-oxypropionic acid alkyl esters such as methyl 3-oxypropionate and ethyl 3-oxypropionate; methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, 3-ethoxypropionic acid Ethyl, 2-oxypropionic acid alkyl esters such as methyl 2-oxypropionate, ethyl 2-oxypropionate, propyl 2-oxypropionate; methyl 2-methoxypropionate, ethyl 2-methoxypropionate, 2- Propyl methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, methyl 2-oxy-2-methylpropionate, ethyl 2-oxy-2-methylpropionate, 2-methoxy-2-methylpropionic acid Methyl, 2- Ethyl ethoxy-2-methylpropionate,

Methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, methyl 2-oxobutanoate, ethyl 2-oxobutanoate, etc .; ethers such as diethylene glycol dimethyl ether, tetrahydrofuran, ethylene glycol monomethyl ether, ethylene glycol mono Ethyl ether, ethylene glycol monomethyl ether acetate (methyl cellosolve acetate), ethylene glycol monoethyl ether acetate (ethyl cellosolve acetate), diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, diethylene glycol monoethyl ether acetate (ethyl carbitol acetate) , Diethylene Recall monobutyl ether acetate (butyl carbitol acetate),

Propylene glycol methyl ether, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, propylene glycol propyl ether acetate and the like; ketones such as methyl ethyl ketone, cyclohexanone, 2-heptanone, 3-heptanone and the like; aromatic hydrocarbons such as toluene, Examples include xylene.

  Of these, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethylene glycol monoethyl ether acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, cyclohexanone, diethylene glycol monoethyl Ether acetate, diethylene glycol monobutyl ether acetate, propylene glycol methyl ether, propylene glycol methyl ether acetate and the like are more preferable.

~ Dispersant ~
The dispersant can be added to improve the dispersibility of the pigment. As the dispersant, known ones can be appropriately selected and used, and examples thereof include a cationic surfactant, a fluorosurfactant, and a polymer dispersant.

  Furthermore, the graft copolymer having a specific acid amide group-containing monomer and a quaternary ammonium salt monomer residue in the main chain described in JP-A-10-254133 has an excellent effect of finely dispersing the pigment. Therefore, it can be used as the dispersant. By using the graft copolymer, it is possible to finely disperse the pigment while reducing energy and time consumption, and the dispersed pigment may aggregate or settle even over time. Long-term dispersion stability can be maintained.

  The dispersants may be used alone or in combination of two or more. The amount of the dispersant added in the colored thermosetting composition of the present invention is usually preferably about 0.1 to 50 parts by mass with respect to 100 parts by mass of the pigment.

~ Other additives ~
Various additives can be further added to the non-photosensitive colored thermosetting composition in the present invention as necessary. As various additives, for example, a filler, a polymer compound other than the above, a surfactant, an adhesion promoter, an antioxidant, an ultraviolet absorber, an aggregation inhibitor, and the like can be blended.

  Specific examples of these additives include fillers such as glass and alumina; polymer compounds other than binder resins such as polyvinyl alcohol, polyacrylic acid, polyethylene glycol monoalkyl ether, and polyfluoroalkyl acrylate; nonionic, cationic And anionic surfactants: vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (2-methoxyethoxy) silane, N- (2-aminoethyl) -3-aminopropylmethyldimethoxysilane, N- (2 -Aminoethyl) -3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ) Ethyltrimetoki Adhesion promoters such as silane, 3-chloropropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane; 2,2-thiobis (4-methyl- 6-t-butylphenol), 2,6-di-t-butylphenol and other antioxidants: 2- (3-t-butyl-5-methyl-2-hydroxyphenyl) -5-chlorobenzotriazole, alkoxybenzophenone, etc. And an anti-aggregation agent such as sodium polyacrylate.

(Method for preparing colored thermosetting composition)
A preferred method for preparing a colored thermosetting composition in the present invention will be described. However, the present invention is not limited to this.

As described above, for the colored thermosetting composition of the present invention, a method using a pigment having finely divided pigment particles and a sharp particle size distribution is suitable. Specifically, a method using a pigment constituted by including 75% by mass or more of pigment particles having an average particle size of about 0.01 μm and a particle size in the range of 0.01 ± 0.005 μm is preferable.
In order to adjust the particle size distribution of the pigment within the above range, the pigment dispersion method is particularly important. As such a dispersion method, for example, dry dispersion (kneading dispersion treatment) in which a kneader or a roll mill such as two rolls is used to disperse in a high viscosity state, and a relatively low viscosity state using a three roll or bead mill or the like. Examples of the dispersion method include a combination of wet dispersion (fine dispersion treatment) for dispersion. In the dispersion method, it is also preferable to co-disperse two or more pigments, or not to use a solvent or to reduce the amount of use as much as possible during the kneading dispersion treatment, or to use various dispersants. Further, in order to relieve the solvent shock, it is preferable to add the resin component separately at the time of the kneading dispersion treatment and at the time of the fine dispersion treatment (use in two divisions), and shift from the kneading dispersion treatment to the fine dispersion treatment. In order to prevent reaggregation of the pigment particles, it is preferable to use a resin component having excellent solubility. Furthermore, it is also effective to use high hardness ceramics or beads with a small particle diameter for the beads of the bead mill used during the fine dispersion treatment. In addition, as said resin component, the above-mentioned alkali-soluble resin can be used, for example.

In the present invention, in particular, two or more pigments are used, and two or more pigments are further dispersed in a high viscosity state of 50000 mPa · s or more, and then further dispersed in a low viscosity state of 1000 mPa · s or less. It is preferable to use a different colorant.
Generally, these pigments are supplied after drying by various methods after synthesis. Usually, it is dried from an aqueous medium and supplied as a powder. However, since water requires a large latent heat of vaporization for drying, a large amount of heat energy is given to dry it to form a powder. Therefore, the pigment usually forms an aggregate (secondary particle) in which primary particles are aggregated.

  When the colorant is a pigment in the method for preparing a colored thermosetting composition in the present invention, first, the viscosity after kneading and dispersing the above-mentioned binder into the colorant (pigment) is 50,000 mPa · s or more (preferably 50, The kneading and dispersing treatment is preferably performed so as to have a relatively high viscosity of (000 to 100,000 mPa · s). Here, the kneading dispersion treatment may be high viscosity dispersion or dry dispersion.

  Then, if necessary, the above-mentioned binder is additionally added to the dispersion after the kneading dispersion treatment so that the viscosity after the fine dispersion treatment is 1000 mPa · s or less (preferably 100 mPa · s or less). It is preferable to perform fine dispersion treatment. The fine dispersion treatment may be low viscosity dispersion or wet dispersion.

  In the kneading and dispersing treatment, the solvent ratio is preferably 0 to 20% by mass with respect to the dispersion. Thus, when the dispersion is performed without using much solvent, the surface of the pigment particles can promote the wetting with the constituent component mainly composed of the resin component of the vehicle. The solid / gas interface between the pigment particles and air can be converted to a solid / solution interface between the pigment particles and the vehicle solution. When the interface formed by the surfaces of the pigment particles is converted from air to a solution and mixed and stirred, the pigment can be dispersed to a fine state close to the primary particles.

  Thus, in order to highly disperse the pigment, it is effective to convert the interface formed by the pigment particle surface from air to a solution. Such conversion requires a strong shearing force or compressive force. For this reason, in the said kneading | mixing dispersion | distribution process, it is preferable to use a high viscosity thing as a to-be-kneaded material using the kneader which can exhibit strong shearing force and compressive force.

  In the fine dispersion treatment, it is preferable to mix and stir together with fine dispersion media such as glass or ceramic. Furthermore, it is preferable that the ratio of the solvent at the time of a fine dispersion process is 20-90 mass% of to-be-dispersed material. At the time of the fine dispersion treatment, since it is necessary to distribute the pigment particles uniformly and stably to a fine state, a disperser capable of imparting impact force and shear force to the agglomerated pigment particles; It is preferable to use a low-viscosity material.

  When the colorant is a dye, it is not necessary to perform the dispersion step as described above, and it is only necessary to dissolve it together with the binder in an appropriate solvent.

  The pigment dispersion or dye solution thus obtained is added with a thermosetting compound such as an epoxy resin and a curing catalyst or a curing agent, or when the binder is already a thermosetting compound, it is cured. A colored thermosetting composition in the present invention can be prepared by adding a catalyst or a curing agent to impart a thermosetting function, and adding a solvent as necessary.

The first colored layer in the present invention is preferably formed by a step of applying the colored thermosetting composition to a support and drying to form the first colored layer.
Specifically, for example, a coating method such as spin coating, slit coating, cast coating, roll coating or the like on the support directly or via another layer with the colored thermosetting composition in the present invention containing a solvent. Can be formed by coating.
The specific thickness of the first colored layer is preferably 0.005 μm to 0.9 μm, preferably 0.01 μm to 0.7 μm, and more preferably 0.02 μm to 0.65 μm. .

  It is preferable that the 1st colored layer formation process in this invention further includes a heating process (it may be a post-baking process). Specifically, the colored layer is formed by applying the colored thermosetting composition of the present invention to a support to form a coating film, and then thermally curing the coating film by a heating step. The heating step may be performed at the same time as drying after coating, or a separate thermosetting step may be provided after coating and drying. In the heating step, a known heating means such as an oven or a hot plate is used, preferably 130 ° C. to 300 ° C., more preferably 150 ° C. to 280 ° C., particularly preferably 170 ° C. to 260 ° C., preferably 10 ° C. Second to 3 hours, more preferably 30 seconds to 2 hours, particularly preferably 60 seconds to 60 minutes. However, considering the production, the time required for curing is preferably as short as possible.

(Colored photocurable composition)
The colored photocurable composition used in the present invention contains at least a colorant and a photocurable component. Among these, the “photo-curable component” is a photo-curable composition usually used in the photolithography method, such as a binder resin (alkali-soluble resin, etc.), a photosensitive polymerization component (photo-photosynthesis monomer, etc.), a photopolymerization initiator. A composition containing at least the above can be used.

-Colorant-
As the colorant, the same colorant as described in the colored thermosetting composition can be preferably used.

-Photocurable component-
The “photocurable component” is a photocurable composition usually used in the photolithography method, and includes a binder resin (such as an alkali-soluble resin), a photosensitive polymerization component (such as a photopolymerizable monomer), and a photopolymerization initiator. Compositions can be used.

~ Binder resin ~
A known binder resin can be arbitrarily selected as the binder resin, and an alkali-soluble resin is particularly preferable.
As the alkali-soluble resin, an acrylic resin having a polyalkylene oxide chain and / or hydroxyethyl methacrylate (HEMA) in the molecule has a change rate of the line width after development with respect to the exposure intensity of the coating film as described above. × 10 ⁻⁵ μm · m ² / J or less is preferable.
The acrylic resin preferably has a polystyrene-reduced mass average molecular weight of 5,000 to 50,000, more preferably 6,000 to 30,000, and most preferably 8,000 to 20,000.
The content of the polyalkylene oxide chain is preferably 0.5 to 18 mol%, more preferably 0.8 to 15 mol%, and most preferably 1 to 10 mol% in terms of molar ratio.
Among the polyalkylene oxide chains, polyethylene oxide chains are preferable, and the number of added moles n ((EO) n) is preferably 2 to 25, more preferably 2 to 15, and most preferably 5 to 12.
The content of the hydroxyethyl methacrylate is preferably 10 to 30% by mole, more preferably 15 to 25% by mole.

Examples of the acrylic resin having a polyalkylene oxide chain in the molecule include the following alkali-soluble resin A.
The alkali-soluble resin A is at least (i) at least one acid component monomer selected from maleic anhydride (MAA), acrylic acid (AA), methacrylic acid (MA), and fumaric acid (FA), and (ii) alkyl. It is a copolymer comprising polyoxyethylene (meth) acrylate and (iii) benzyl (meth) acrylate.

In the alkali-soluble resin A, (i) acid component monomer, (ii) alkyl polyoxyethylene (meth) acrylate (Acr (EO) n: for example, CH ₃ (OC ₂ H ₄ ) nOCOC (R) ═CH ₂ , (R = H, CH ₃ )), and (iii) the molar ratio of each monomer component of benzyl (meth) acrylate (BzMA) is preferably 15-30 / 1-20 / 50-84, more preferably 17-25. / 2-15 / 60-80. Moreover, as polystyrene-reduced mass average molecular weight (Mw) by GPC of alkali-soluble resin A, Preferably it is 5,000-50,000, More preferably, it is 6,000-30,000.

(I) When the molar ratio of the acid component monomer is not less than the lower limit of the above range, alkali solubility is improved. Moreover, the solubility to a solvent improves by being below the upper limit of the said range.
(Ii) alkylpolyoxyethylene (meth) acrylate (Acr (EO) n: for _{example, CH 3 (OC 2 H 4} ) nOCOC (R) = CH 2, (R = H, CH 3)) the composition mass ratio of When it is at least the lower limit of the above range, the photosensitive coloring resin composition coating solution spreads sufficiently on the substrate, and the present invention tends to be effectively achieved. Moreover, when it is below the upper limit of the above range, the dispersibility of the colorant tends to improve, which is preferable.
(Iii) When the composition mass ratio of benzyl (meth) acrylate (BzMA) is not less than the lower limit of the above range, the dispersion stability of the colorant and the solubility in the composition tend to be improved, which is preferable. Moreover, since it is below the upper limit of the said range, the alkali developability of a coating film improves, and it is preferable.

(Ii) Alkyl polyoxyethylene (meth) acrylate (Acr (EO) n: for example, CH ₃ (OC ₂ H ₄ ) nOCOC (R) = CH ₂ , (R = H, CH ₃ )) polyoxyethylene The number n of (EO) n is 2 to 25, preferably 2 to 15 and particularly preferably 5 to 12. When the number n of repetitions is not less than the lower limit of the range, it is easy to suppress development residue after development with an alkaline developer, and conversely, the composition is not more than the upper limit of the range. The fluidity of the coating liquid is improved, the occurrence of uneven coating is suppressed, the uniformity of the coating film thickness and the liquid-saving property tend to be improved, which is preferable.

Examples of the acrylic resin having hydroxyethyl methacrylate (HEMA) in the molecule include those obtained by replacing (ii) alkyl polyoxyethylene (meth) acrylate of alkali-soluble resin A with hydroxyethyl methacrylate (HEMA).
Examples of the acrylic resin having a polyalkylene oxide chain and hydroxyethyl methacrylate (HEMA) in the molecule include those obtained by further copolymerizing alkali-soluble resin A with hydroxyethyl methacrylate (HEMA).

  Moreover, 0.5-15 mass% is preferable and, as for content of binder resin (especially alkali-soluble resin) in the photocurable composition in this invention, 1.0-12 mass% is more preferable. When the content of the alkali-soluble resin is 0.5% by mass or more, the progress of development is accelerated and the production cost is reduced. Moreover, a favorable pattern profile comes to be obtained as it is 15 mass% or less.

-Photopolymerization component-
As the photosensitive polymerization component used in the present invention, a polymerizable monomer is generally used. The polymerizable monomer is preferably a compound having at least one addition-polymerizable ethylenically unsaturated group and having a boiling point of 100 ° C. or higher under normal pressure. Examples thereof include polyethylene glycol mono (meth) acrylate, Monofunctional acrylates and methacrylates such as polypropylene glycol mono (meth) acrylate and phenoxyethyl (meth) acrylate; polyethylene glycol di (meth) acrylate, trimethylolethane tri (meth) acrylate, neopentyl glycol di (meth) acrylate , Pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, hex After adding ethylene oxide or propylene oxide to polyfunctional alcohols such as polydiol (meth) acrylate, trimethylolpropane tris (acryloyloxypropyl) ether, tris (acryloyloxyethyl) isocyanurate, glycerin or trimethylolethane (meth) Acrylates, urethane acrylates as described in JP-B-48-41708, JP-B-50-6034, JP-A-51-37193, JP-A-48-64183, JP-B-49 No. 43191, Japanese Patent Publication No. 52-30490, and polyfunctional acrylates and methacrylates such as polyester acrylates and epoxy acrylates which are reaction products of epoxy resin and (meth) acrylic acid It can be mentioned a mixture thereof. Furthermore, the Japan Adhesion Association Vol. 20, no. 7, pages 300 to 308 are introduced as photocurable monomers and oligomers.

A polymerizable monomer having a polyalkylene oxide chain in the molecule makes the rate of change of the line width after development with respect to the exposure intensity of the coating film not more than 7.5 × 10 ⁻⁵ μm · m ² / J. Therefore, it is preferable. Examples of such polymerizable monomers include the following.

  The content of the polymerizable monomer in the photocurable composition is preferably from 0.1 to 90 mass%, more preferably from 1.0 to 80 mass%, particularly from 2.0 to 70 mass%, based on the solid content. preferable.

~ Photoinitiator ~
The photopolymerization initiator is not particularly limited as long as it can polymerize the polymerizable monomer (and optionally the alkali-soluble resin), but in terms of polymerization characteristics, initiation efficiency, absorption wavelength, availability, cost, and the like. It is preferable to include at least one compound selected from the group consisting of halomethyl-s-triazine compounds, oxime compounds, and α-aminoketone compounds.

  As photopolymerization initiators of halomethyl-s-triazine compounds, vinyl-halomethyl-s-triazine compounds described in JP-B-59-1281 and 2- (naphtho-) described in JP-A-53-133428 are disclosed. 1-yl) -4,6-bis-halomethyl-s-triazine compounds and 4- (p-aminophenyl) -2,6-bis-halomethyl-s-triazine compounds.

  Other examples include TAZ series, TAZ-107, TAZ-110, TAZ-104, TAZ-109, TAZ-140, TAZ-204, TAZ-113, TAZ-123, and TAZ-104 manufactured by Midori Chemical. .

  Examples of photopolymerization initiators for α-aminoketone compounds include Irgacure series, Irgacure 907, Irgacure 369, 2-methyl-1-phenyl-2-morpholinopropan-1-one, 2-methyl, manufactured by Ciba Specialty Chemicals. Examples include -1- [4- (hexyl) phenyl] -2-morpholinopropan-1-one and 2-ethyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1.

  Although it does not specifically limit as a photoinitiator of an oxime type compound, 1- [4- (phenylthio) phenyl] -1,2-octanedione = 2- (O-benzoyloxime), 1- (4-methylsulfanyl) Phenyl) -1,2-butanedione = 2- (O-acetyloxime), 1- (4-methylsulfanyl-phenyl) -1-butanone = O-acetyloxime, hydroxyimino- (4-methylsulfanyl-phenyl)- Examples include acetic acid ethyl ester-O-acetate, hydroxyimino- (4-methylsulfanyl-phenyl) -acetic acid ethyl ester-O-benzoate, and the like.

These photopolymerization initiators can be used in combination with a sensitizer and a light stabilizer.
Specific examples thereof include benzoin, benzoin methyl ether, 9-fluorenone, 2-chloro-9-fluorenone, 2-methyl-9-fluorenone, 9-anthrone, 2-bromo-9-anthrone, 2-ethyl-9-anthrone. 9,10-anthraquinone, 2-ethyl-9,10-anthraquinone, 2-t-butyl-9,10-anthraquinone, 2,6-dichloro-9,10-anthraquinone, xanthone, 2-methylxanthone, 2- Methoxyxanthone, 2-ethoxyxanthone, thioxanthone, 2,4-diethylthioxanthone, acridone, 10-butyl-2-chloroacridone, benzyl, dibenzalacetone, p- (dimethylamino) phenylstyryl ketone, p- (dimethyl Amino) phenyl-p-methylstyryl ketone Examples include benzophenone, p- (dimethylamino) benzophenone (or Michler's ketone), p- (diethylamino) benzophenone, benzoanthrone, benzothiazole compounds described in Japanese Patent Publication No. 51-48516, tinuvin 1130, 400, and the like. .

In the present invention, in addition to the above photopolymerization initiators, other known photopolymerization initiators can be used.
Specifically, the vicinal polykettle aldonyl compound disclosed in US Pat. No. 2,367,660, disclosed in US Pat. Nos. 2,367,661 and 2,367,670. Substituted α-carbonyl compounds, acyloin ethers disclosed in US Pat. No. 2,448,828, α-hydrocarbons disclosed in US Pat. No. 2,722,512 Aromatic acyloin compounds, polynuclear quinone compounds disclosed in US Pat. Nos. 3,046,127 and 2,951,758, disclosed in US Pat. No. 3,549,367. Triarylimidazole dimer / p-aminophenyl ketone combination, benzothiazole compound / triha disclosed in Japanese Patent Publication No. 51-48516 And lomethyl-s-triazine compounds.
Examples of the photopolymerization initiator include at least one active halogen compound selected from a halomethyl oxadiazole compound, a halomethyl-s-triazine compound, a 3-aryl-substituted coumarin compound, a lophine dimer, a benzophenone compound, an acetophenone compound, and Examples thereof include cyclopentadiene-benzene-iron complexes and salts thereof, and oxime compounds other than those described above.

Active halogen compounds such as halomethyloxadiazole can also be used effectively. Examples of these compounds include 2-halomethyl-5-vinyl-1,3,4 described in JP-B-57-6096. -Oxadiazole compounds, 2-trichloromethyl-5-styryl-1,3,4-oxadiazole, 2-trichloromethyl-5- (p-cyanostyryl) -1,3,4-oxadiazole 2-trichloromethyl-5- (p-methoxystyryl) -1,3,4-oxadiazole and the like.
Further, as the photopolymerization initiator, T series manufactured by PANCHIM can also be used effectively, and examples thereof include T-OMS, T-BMP, TR, and TB.
Further, as the photopolymerization initiator, Irgacure series manufactured by Ciba Specialty Chemicals can be used effectively. Examples of these are Irgacure 651, Irgacure 184, Irgacure 500, Irgacure 1000, Irgacure 149. Irgacure 819, Irgacure 261, Darocure series, Darocure 1173, and the like.
Other examples of the photopolymerization initiator include 4,4′-bis (diethylamino) -benzophenone, 2-benzyl-2-dimethylamino-4-morpholinobutyrophenone, 2,2-dimethoxy-2-phenylacetophenone, 2- (o -Chlorophenyl) -4,5-diphenylimidazolyl dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazolyl dimer, 2- (o-methoxyphenyl) -4,5-diphenylimidazolyl dimer 2-mer, 2- (p-methoxyphenyl) -4,5-diphenylimidazolyl dimer, 2- (p-dimethoxyphenyl) -4,5-diphenylimidazolyl dimer, 2- (2,4-dimethoxyphenyl) ) -4,5-diphenylimidazolyl dimer, 2- (p-methylmercaptophenyl) -4,5-diphenylimid Dazolyl dimer, benzoin isopropyl ether and the like are also usefully used.

  The amount of the photopolymerization initiator used in the present invention is preferably 0.01% by mass to 50% by mass, more preferably 1% by mass to 30% by mass, and more preferably 1% by mass to the solid content of the polymerizable monomer. 20% by mass is particularly preferred. When the amount of the photopolymerization initiator used is 0.01% by mass or more, the polymerization is facilitated. Moreover, by setting it as 50 mass% or less, although a polymerization rate becomes small, molecular weight becomes large and film | membrane intensity | strength can be strengthened.

  In addition to the above, it is preferable to add a thermal polymerization inhibitor to the photocurable composition in the present invention, for example, hydroquinone, p-methoxyphenol, di-t-butyl-p-cresol, pyrogallol. , T-butylcatechol, benzoquinone, 4,4′-thiobis (3-methyl-6-tert-butylphenol), 2,2′-methylenebis (4-methyl-6-tert-butylphenol), 2-mercaptobenzimidazole, etc. Is useful.

~solvent~
The solvent used as necessary in the photocurable composition used in the present invention is basically not particularly limited as long as the solubility and coating properties of the composition are satisfied, but in particular, dyes and binders (alkali-soluble resins). It is preferable to select in consideration of solubility, applicability, and safety.
Specifically, the same solvent as described in the above colored thermosetting composition can be preferably used.

~ Other additives ~
Various additives can be added to the photocurable composition of the present invention as necessary. Specific examples of various additives include the various additives described in the above colored thermosetting composition.

  Further, in the case where the alkali solubility of the part to be removed by development is promoted and the photocurable composition is further improved in developability, the photocurable composition has an organic carboxylic acid, preferably a molecular weight of 1000 or less. Of low molecular weight organic carboxylic acids can be added. Specifically, aliphatic monocarboxylic acids such as formic acid, acetic acid, propionic acid, butyric acid, valeric acid, pivalic acid, caproic acid, diethyl acetic acid, enanthic acid, caprylic acid; oxalic acid, malonic acid, succinic acid, glutar Aliphatic dicarboxylic acids such as acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, brassic acid, methylmalonic acid, ethylmalonic acid, dimethylmalonic acid, methylsuccinic acid, tetramethylsuccinic acid, citraconic acid; Aliphatic tricarboxylic acids such as carbaryl acid, aconitic acid, and camphoronic acid; aromatic monocarboxylic acids such as benzoic acid, toluic acid, cumic acid, hemelitic acid, and mesitylene acid; phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, trimesin Aromatic polycarboxylic acids such as acid, merophanic acid, pyromellitic acid; phenylacetic acid, Doroatoropa acid, hydrocinnamic acid, mandelic acid, phenyl succinic acid, atropic acid, cinnamic acid, cinnamylidene acetic acid, coumaric acid, other carboxylic acids such as umbellic acid.

  When the first colored layer forming step in the present invention is performed using the colored photocurable composition, the colored photocurable composition is applied directly on the support or through another layer, and then dried. Forming a coating film (coating film forming process), exposing the coating film (exposure process), developing the exposed coating film with an alkaline developer (developing process), and developing And a step (post-bake step) of performing a heat treatment on the processed coating film that has been subjected to the exposure process.

In the coating film forming step, the colored photocurable composition is applied onto the support by a coating method such as spin coating, casting coating, roll coating, slit coating, and the like, and dried to form a colored photocurable composition layer (coating). Film layer) can be formed.
The specific thickness of the first colored photocurable composition layer is preferably 0.005 μm to 0.9 μm, more preferably 0.01 μm to 0.7 μm, and 0.02 μm to 0.65 μm. More preferably.

  In the exposure step, the coating film can be photocured by irradiating the coating film formed in the coating film forming step with radiation. For example, a specific pattern is exposed through a mask or the like. As radiation used for exposure, ultraviolet rays such as g-line, h-line and i-line are particularly preferably used.

  In the post-baking step, heat treatment can be performed in order to sufficiently cure the coated film after exposure. 100-300 degreeC is preferable and the heating temperature in the said heat processing has more preferable 150-250 degreeC. The heating time is preferably about 10 minutes to 1 hour, more preferably about 5 minutes to 30 minutes.

[Etching stopper layer forming process]
The method for producing a color filter of the present invention includes (b) a step of forming an etching stopper layer on at least the first colored layer. By providing the etching stopper layer, fluctuations in the thickness of the first colored layer due to the subsequent process can be suppressed, and the transmission spectral characteristics of the color filter pixels can be easily controlled.
The etching stopper layer in the present invention is not particularly limited as long as the etching rate is lower than the colored curable composition layer (colored layer), but is formed of a curable composition that is transparent to visible light. It is preferable. Thereby, a color filter can be manufactured without completely removing the etching stopper layer. Here, being transparent to visible light means that the transmittance of visible light is 95% or more. The visible light transmittance can be measured by, for example, a spectrophotometer: U-4100 manufactured by Hitachi, Ltd.

  In the present invention, as the curable composition used for forming the etching stopper layer, a composition containing a polymer compound curable by heat can be preferably used. As said high molecular compound, a polysiloxane type polymer and a polystyrene type polymer can be mentioned as a preferable thing, for example. Among them, a material known as a spin-on-glass (SOG) material, or a thermosetting composition mainly composed of a polystyrene derivative or a polyhydroxystyrene derivative can be mentioned as a more preferable one. In the present invention, it is particularly preferable to use a polyhydroxystyrene derivative from the viewpoint of ease of process.

  Specific examples of the polystyrene derivative and polyhydroxystyrene derivative include, for example, Maruka Linker (manufactured by Maruzen Chemical Co., Ltd.) (Marca Linker CMM, CHM, CST, etc.), VP Series (VP 2500, VP 8000) manufactured by Nippon Soda Co., Ltd. VP15000 etc.). Specific examples of the SOG material include OCD Type-7 manufactured by Tokyo Ohka Co., Ltd., ACCUGLASS P-5S manufactured by Honeywell, HSG series manufactured by Hitachi Chemical Co., Ltd., and the like.

  The thermosetting composition containing the polyhydroxystyrene derivative in the present invention can be prepared as a solution by diluting an acid generator, a crosslinking agent, and other additives with an organic solvent in addition to the polyhydroxystyrene derivative. The solution can be formed as an etching stopper layer by spin-coating and drying the solution on a substrate and then post-baking.

By making the etching rate of the etching stopper layer lower than that of the colored curable composition layer, it is possible to satisfactorily remove the laminated colored layer. That is, it is important that the etching resistance of the etching stopper layer is better than the etching resistance of the colored curable composition layer. Thus, the etching stopper layer can be used to detect the end point of the etching process.
As an index indicating the etching resistance of the curable composition forming the etching stopper layer, for example, Onishi parameter (reference document J. Electrochem Soc 143, 130 (1983) H. Gokan, S. Esho and Y. Ohnishi, JP 2004-294638 A and JP 2005-146182 A) can be used. In the present invention, when the parameter value of the colored curable composition is 3.5 to 4.5, the parameter value of the curable composition forming the etching stopper layer is 2.5 or less. Therefore, it can be determined that selectivity can be secured for the colored curable composition layer. The Onishi parameter can be calculated by the following formula (I).

        (C + O + H) / (C−O) Formula (I)

  In formula (I), C, O, and H represent the number of moles of carbon atoms, oxygen atoms, and hydrogen atoms, respectively, in the structural repeating unit of the polymer. An example of calculating Onishi parameters is shown below. It should be noted that the calculation was performed by rounding off the three decimal places.

Example 1. Fluorene acrylate compound (when n = 1)
(C + O + H) / (C-O) = (33 + 6 + 25) / (33-6) = 2.37
Example 2. Epoxy compound (C + O + H) / (C−O) = (8 + 2 + 12) / (8-2) = 3.66
Example 3 Polyhydroxystyrene derivative (C + O + H) / (C−O) = (8 + 1 + 8) / (8-1) = 2.42

  From the above calculation results, it can be seen that, for example, those containing a fluorene acrylate compound or a polyhydroxystyrene derivative can be used as the curable composition for forming the etching stopper layer.

In the present invention, the etching stopper layer can be formed as a cured film obtained by applying the curable composition onto the first colored layer, drying it, and curing it with heat or the like.
Specifically, for example, the curable composition can be formed by coating on the first colored layer by a coating method such as spin coating, slit coating, cast coating, or roll coating.
The thickness of the etching stopper layer is preferably within a range of 5 to 2000 nm, and preferably within a range of 100 to 500 nm, from the viewpoint of over-etching resistance and a thin color filter layer. More preferred.

[Photoresist layer forming step]
The method for producing a color filter of the present invention includes (c) a photoresist layer forming step of forming a photoresist layer on the etching stopper layer.
(Photoresist layer)
As described above, after the etching stopper layer is formed and cured on the first colored layer, a photoresist layer (photosensitive resin layer) is formed on the etching stopper layer. Specifically, a positive or negative photosensitive resin composition is applied on the etching stopper layer and dried to form a photoresist layer. In the formation of the photoresist layer of the present invention, it is preferable to perform a pre-bake treatment.

  The positive photosensitive resin composition is used for positive photoresists that are sensitive to radiation such as ultraviolet rays (g rays, i rays), deep ultraviolet rays including excimer lasers, electron beams, ion beams, and X rays. Any suitable positive resist composition can be used. Of the radiation, the one that exposes the photosensitive resin layer is preferably g-line or i-line for the purpose of the present invention, and i-line exposure is particularly preferable.

  Specifically, the positive photosensitive resin composition is preferably a composition containing a quinonediazide compound and an alkali-soluble resin. A positive-type photosensitive resin composition containing a quinonediazide compound and an alkali-soluble resin indicates that a quinonediazide group is decomposed by light irradiation with a wavelength of 500 nm or less to generate a carboxyl group, and as a result, the alkali-insoluble state becomes alkali-soluble. It is used as a positive photoresist. Since this positive photoresist has remarkably excellent resolution, it is used for manufacturing integrated circuits such as ICs and LSIs. Examples of the quinonediazide compound include naphthoquinonediazide compounds.

  In recent years, with respect to integrated circuits, the width of wiring has become finer as the degree of integration has improved, and for this reason, dry etching has become the mainstream in place of conventional wet etching. In this dry etching, the shape of the resist is directly reflected in the shape of the layer to be etched. Therefore, if the shape of the resist is poor, etching is performed up to a portion that does not require etching, which may cause defective integrated circuits and poor yield. For this reason, a resist having a good profile with little development residue (scum) or the like is required more than ever. In dry etching, the temperature of the support increases, and the resist pattern may be thermally deformed, resulting in a decrease in dimensional accuracy. For this reason, the heat resistance of a resist is requested | required more than before. Looking at positive photoresists currently used from this point of view, many products that satisfy various performances such as profile, scum, resolution and heat resistance are commercially available. For example, Fuji Film Electronics Materials ( FH-6000 series, for example, “FH-6400L”, “FH-6800L”, etc., and FHi-3000 series, for example, “FHi-3200”, “FHi-3950”, etc. Series such as “FHi-644”, “FHi-645”, and Fi-SP series manufactured by the same company such as “Fi-SP2” can be mentioned. However, the present invention is not limited to this, and it can be used as a positive-type photosensitive resin composition regardless of whether it is commercially available as long as it has a mask shape preferable for pattern formation.

  Examples of the negative photosensitive resin composition include negative photoresists sensitive to radiation rays such as ultraviolet rays (g rays, i rays), far ultraviolet rays, X rays, electron rays, molecular rays, γ rays, and synchrotron radiation. A composition. More specifically, a negative photoresist composition that is excellent in resolving power and sensitivity and that does not substantially cause microdefects due to undeveloped residues is preferable. The negative photoresist in the present invention is applied on the colored layer to a thickness of, for example, 0.5 μm to 3 μm by spin coating or roller coating. Thereafter, it is heated and dried, a circuit pattern or the like is printed by ultraviolet irradiation through an exposure mask, and if necessary, after a post-exposure heating step (PEB), development is performed to obtain a negative image. Further, patterning can be applied to the thermosetting resin layer by etching using this image as a mask. Typical application fields are semiconductor manufacturing processes such as ICs, circuit boards such as liquid crystals and thermal heads, and other photof application processes. Moreover, it can also be applied to a lithographic printing plate by utilizing the difference in affinity between the image and the support substrate for ink. With higher integration of semiconductor substrate processing, higher resolution of the photoresist is required.

  The negative photosensitive resin layer preferably contains a photopolymerization initiator and a polymerizable compound having an ethylenically unsaturated bond. The following prior art is known about the negative photosensitive resin composition used for formation of such a photosensitive resin layer. For example, Japanese Patent Publication No. 54-23574 discloses a technique for photocuring a novolak resin in combination with a photoacid generator composed of an organic halide. Also, West German Patent Publication No. 2057473 discloses that a phenol resin such as novolak can be applied as a binder between a photoacid generator composed of a diazo compound and a photocurable composition composed of methylolated melamine. Further, JP-A-60-263143 discloses a composition comprising a photoacid generator, an acid curable amino blast resin such as a melamine resin, and a general novolac resin, and is aqueous developable and heat stable. High negative image is obtained. JP-A-62-164045 discloses that an organic halide having light absorption in the far ultraviolet region can be advantageously used as a photoacid generator for such a composition. Similarly, Japanese Patent Application Laid-Open No. 2-52348 states that an organic halide having a pKa value in a specific region is advantageous as a similar photoacid generator. Furthermore, JP-A-2-154266 shows that oxime sulfonic acid esters are effective as a photoacid generator for a similar photocurable composition. As another example, JP-A-2-146444 discloses a composition in which a photoacid generator having a specific trichlorotriazine group and a novolak resin containing 30% or more of m-cresol in alkoxylated melamine are combined. It is useful for high energy beam exposure. Further, European Patent No. 396460A discloses that a novolak resin having a high degree of branching is used in a similar composition. These negative photosensitive resin compositions are commercially available, for example, SC series manufactured by Fujifilm Electronics Materials, Inc., such as “SC-60”, “SC-450”, etc. HR series, for example, “HR-100”, “HR-200”, HNR series manufactured by the same company, for example, “HNR-80”, “HNR-120”, and the like. However, the present invention is not limited to these, and any mask having a preferable shape for pattern formation can be used regardless of whether it is commercially available.

As the coating method of the photosensitive resin, the above-described coating method can be suitably used.
The specific thickness of the photosensitive resin layer is preferably 0.01 μm to 3 μm, preferably 0.1 μm to 2.5 μm, and more preferably 0.15 μm to 2 μm.

[Image forming process]
In the method for producing a color filter of the present invention, (d) a photoresist layer in a region on a support on which a second colored layer different from the first colored layer (colored layer already formed) is formed is removed. Thus, an image forming step of forming an image on the etching stopper layer is included.
In the image forming step, the photoresist layer is exposed in an image-like manner corresponding to a region where the second colored layer is formed on the support, and developed with a developer to form an etching mask (pattern image). can do.

  In the present invention, an image from which the photoresist layer in the region on the support on which the second colored layer is formed is removed is formed on the etching stopper layer. As a result, the etching stopper layer is exposed like the image. On the other hand, in the etching stopper layer, the region other than the region where the second colored layer is formed on the support is covered with the photoresist layer.

  In the color filter manufactured by the manufacturing method of the present invention, by forming the second colored layer on the support, in addition to the pixels constituted by the first colored layer, another type of pixel is further added. Can be formed. Since the photoresist layer serving as a mask material can be miniaturized and has rectangularity, each pixel of the color filter manufactured by the manufacturing method of the present invention can be formed in a fine and rectangular shape.

  The photoresist layer is exposed to a positive or negative photosensitive resin composition through a predetermined (image-like) mask pattern, such as g-line, h-line, i-line, preferably i-line. It can be done by applying.

  As the developer, any developer can be used as long as it does not affect the colored layer containing the colorant and dissolves the exposed portion of the positive resist and the uncured portion of the negative resist. Specifically, a combination of various organic solvents or an alkaline aqueous solution can be used.

  Examples of the alkaline aqueous solution include sodium hydroxide, potassium hydroxide, sodium carbonate, sodium oxalate, sodium metasuccinate, aqueous ammonia, ethylamine, diethylamine, dimethylethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide. , Choline, pyrrole, piperidine, alkaline compounds such as 1,8-diazabicyclo- [5.4.0] -7-undecene, the concentration is 0.001 to 10% by mass, preferably 0.01 to 1% by mass. An alkaline aqueous solution obtained by dissolution is preferable. When a developer composed of such an alkaline aqueous solution is used, it is generally washed with water after development.

[First etching step]
The method for producing a color filter of the present invention includes: (e) the first colored layer and the etching stopper layer in a region where the second colored layer is formed in an image-like manner formed by the first image forming step. An etching process for removing the film by dry etching.
As described above, in the image forming step, only the region corresponding to the region on the support on which the second colored layer is formed is exposed in the etching stopper layer. In this state, for example, by performing anisotropic etching by plasma etching treatment using an etching gas, the etching stopper layer and the first coloring of the lower layer are formed like the image formed in the first image forming step. The layer can be removed.

In the present invention, it is preferable to manage the overetch rate with an endpoint detector. Thus, even if the support surface is Si ₃ N ₄ which is a passivation film, or the support is a curable resin transparent to visible light, the amount of scraping of the support due to the etching process can be reduced. Can be suppressed.

As the gas used for the dry etching process in the present invention, a known gas can be used. Among them, O ₂ , CF _{4 and the} like are preferable. Representative examples of the dry etching method include JP-A-59-126506, JP-A-59-46628, JP-A-58-9108, JP-A-58-2809, JP-A-57-148706, JP-A-61-41102. Such a method as described in such publications is known.

[Photoresist layer removal step]
The color filter manufacturing method of the present invention includes (f) a photoresist layer removing step of removing a photoresist layer remaining after the etching step.
After completion of the etching process, the mask resist (photosensitive resin layer after curing) is removed with a special stripping solution or solvent.

The photoresist layer removing step in the present invention includes (1) a step of applying a stripping solution or a solvent on the photoresist layer to make the photoresist layer removable, and (2) the photoresist layer, And removing with washing water.
As a process of applying a stripping solution or solvent on the photoresist layer to make it removable, for example, a paddle development process in which the stripping solution or solvent is applied on at least the photoresist layer and stagnated for a predetermined time. Can be mentioned. Although there is no restriction | limiting in particular as time to make stripping solution or a solvent stagnant, It is preferable that it is several dozen seconds to several minutes.

The step of removing the photoresist layer using cleaning water includes, for example, a step of removing the photoresist layer by spraying cleaning water onto the photoresist layer from a spray type or shower type spray nozzle. Can do.
As the washing water, pure water can be preferably used.
Further, examples of the injection nozzle include an injection nozzle in which the entire support is included in the injection range, and an injection nozzle that is a movable injection nozzle and in which the movable range includes the entire support. When the spray nozzle is movable, the photoresist layer is more effectively removed by moving the support from the center of the support to the end of the support more than twice during the step of removing the photoresist layer and spraying the cleaning water. Can be removed.

The stripping solution generally contains an organic solvent, but may further contain an inorganic solvent. Examples of organic solvents include 1) hydrocarbon compounds, 2) halogenated hydrocarbon compounds, 3) alcohol compounds, 4) ether or acetal compounds, 5) ketones or aldehyde compounds, and 6) ester compounds. 7) polyhydric alcohol compounds, 8) carboxylic acids or acid anhydride compounds thereof, 9) phenol compounds, 10) nitrogen compounds, 11) sulfur compounds, and 12) fluorine compounds.
The stripping solution in the present invention preferably contains a nitrogen-containing compound, and more preferably contains an acyclic nitrogen-containing compound and a cyclic nitrogen-containing compound.

The acyclic nitrogen-containing compound is preferably an acyclic nitrogen-containing compound having a hydroxyl group. Specific examples include monoisopropanolamine, diisopropanolamine, triisopropanolamine, N-ethylethanolamine, N, N-dibutylethanolamine, N-butylethanolamine, monoethanolamine, diethanolamine, triethanolamine and the like. Monoethanolamine, diethanolamine, triethanolamine, and more preferably monoethanolamine (H ₂ NCH ₂ CH ₂ OH).

  Examples of the cyclic nitrogen-containing compound include isoquinoline, imidazole, N-ethylmorpholine, ε-caprolactam, quinoline, 1,3-dimethyl-2-imidazolidinone, α-picoline, β-picoline, γ-picoline, 2-pipecoline, 3-pipecoline, 4-pipecoline, piperazine, piperidine, pyrazine, pyridine, pyrrolidine, N-methyl-2-pyrrolidone, N-phenylmorpholine, 2,4-lutidine, 2,6-lutidine and the like are preferable, N-methyl-2-pyrrolidone and N-ethylmorpholine are preferable, and N-methyl-2-pyrrolidone (NMP) is more preferable.

The stripping solution in the present invention preferably contains an acyclic nitrogen-containing compound and a cyclic nitrogen-containing compound, and among them, as the acyclic nitrogen-containing compound, at least one selected from monoethanolamine, diethanolamine and triethanolamine More preferably, the cyclic nitrogen-containing compound includes at least one selected from N-methyl-2-pyrrolidone and N-ethylmorpholine, and further includes monoethanolamine and N-methyl-2-pyrrolidone. preferable.
The content of the acyclic nitrogen-containing compound is 9 parts by mass or more and 11 parts by mass or less with respect to 100 parts by mass of the stripping solution, and the content of the cyclic nitrogen-containing compound is 65 parts by mass or more and 70 parts by mass or less. It is desirable.
Moreover, it is preferable that the stripping solution in the present invention is obtained by diluting a mixture of a non-cyclic nitrogen-containing compound and a cyclic nitrogen-containing compound with pure water.

[Second colored layer forming step]
The method for producing a color filter of the present invention is different from the first colored layer in (g) the region from which at least the first colored layer is removed (region on the support for forming the second colored layer). A second colored layer forming step of forming a second colored layer;
Here, it is preferable that the second colored layer contains at least a colorant different from the colorant contained in the first colored layer.

In the second colored layer forming step in the present invention, it is preferable to form the second colored layer by applying at least the colored curable composition to the region on the support from which the first colored layer has been removed. As the colored curable composition used in this step, the above-described colored curable composition can be suitably used. The application of the colored curable composition is preferably carried out by coating, and for the application of the colored curable composition, the matters described in the “first colored layer forming step” can be applied as they are.
Furthermore, in the present invention, it is preferable to use a colored photocurable composition or a colored thermosetting composition as the colored curable composition, and it is more preferable to use a colored thermosetting composition. The matters described in the “first colored layer forming step” can be applied as they are to the colored photocurable composition and the colored thermosetting composition in the second colored layer forming step.

In the present invention, the colored curable composition is applied not only to the region where the first colored layer is removed, but also to the region where the first colored layer having the etching stopper layer as the uppermost layer remains. can do. Thereby, a colored curable composition can be more reliably provided to the area | region from which the 1st colored layer was removed.
As described above, the method for producing a color filter of the present invention includes forming a curable composition containing a colorant in a recessed portion formed in an existing colored layer by embedding at least a second or subsequent colored layer. It is a feature.

  The colored curable composition applied to the region from which the first colored layer has been removed is cured by the post-baking step described above to form a second colored layer different from the first colored layer. be able to.

[Colored layer removal step]
The method for producing a color filter of the present invention includes (h) a colored layer removing step of removing a colored layer portion laminated on the etching stopper layer until the etching stopper layer is detected.
In the present invention, when the second colored layer is formed on both the support from which the first colored layer has been removed and the etching stopper layer, the second colored layer is detected until the etching stopper layer is detected. Is preferably removed parallel to the support surface. Thereby, the color purity of the pixel formed of the first colored layer can be increased. In the present invention, when the third colored layer is further formed, it is preferable to remove the third colored layer formed on the etching stopper layer in parallel with the support surface. Thereby, the color purity of the pixel composed of the first and second colored layers can be increased.

In the colored layer removing step in the present invention, the end point of the colored layer removing step is determined by detecting the etching stopper layer. This makes it possible to easily determine the end point of the colored layer removal step, so that a color filter with a uniform film thickness can be produced.
Examples of a method for detecting the etching stopper layer in the colored layer removing step include an endpoint detector and etching time management. In the present invention, it is preferable to detect with an endpoint detector from the viewpoint of controlling the etching amount of the etching stopper layer.

Examples of the method for removing the colored layer laminated on the etching stopper layer include an etch back process and a CMP process. In the etch back process, either a mode in which the photoresist layer is formed on the colored layer or a mode in which it is not formed may be used.
By removing the colored layer formed on the colored layer by the above method, a color filter having a desired hue and excellent flatness can be obtained.

The method for producing a color filter of the present invention preferably further includes at least one group of process groups in which (b) to (h) are performed in this order in addition to the process groups of (a) to (h). .
By carrying out the process group once, it is possible to form another colored layer (for example, other colors other than the two colors) different from the already formed two colored layers (for example, two colors). A color filter composed of three (for example, three colors) colored layers can be manufactured.
Also, (b) to (h) are repeated for each color, that is, a colored layer is formed on the etching stopper layer formed for each color, and the colored layer is removed until the etching stopper layer is detected, and the support By forming a new etching stopper layer after the colored layer (pixel) is formed thereon, fluctuations in the thickness of the second layer when the third layer is formed (etched) can be suppressed.

  In the present invention, an exposure process for exposing the dicing line, the scribe line, and the PAD portion can be further provided. In the exposing step, the color filter layer and the region to be protected can be covered with a photoresist layer and exposed by ashing or etching. Thereafter, the photoresist layer can be dissolved and removed with an organic solvent or the like. Either the aspect implemented after forming each said layer, and the aspect implemented after apply | coating and heat-processing the colored layer of the last layer, and planarizing by an etch-back or polishing process may be sufficient as the said exposure process. .

Hereinafter, one aspect of a method for producing a color filter of the present invention will be described with reference to the drawings.
(A) 1st colored layer formation process As shown in FIG. 1, the coloring thermosetting composition matched with a predetermined | prescribed color component is apply | coated to the surface of the support body 1 by a desired film thickness, and a post-baking process is performed. 1st colored layer 2 is formed.

(B) Etching stopper layer forming step As shown in FIG. 2, a coating solution for forming an etching stopper layer mainly composed of an SOG material, a polystyrene derivative or a polyhydroxystyrene derivative is applied onto the first colored layer 2; An etching stopper layer 3 having a thickness of 100 to 500 nm is formed by heat treatment.

(C) First Photoresist Layer Formation Step As shown in FIG. 3, a positive or negative photoresist composition is applied on the etching stopper layer 3 and a pre-bake treatment is performed, so that a photoresist layer 4 having a desired film thickness is formed. Form.

(D) First Image Forming Step As shown in FIG. 4, an exposure process is performed through a photomask having an opening pattern corresponding to a region on the support on which a second colored layer is to be formed in the photoresist layer 4. The latent image area 5 is formed by carrying out the process.
FIG. 5 shows a state after the photoresist layer portion of the latent image region 5 to be removed is removed by development processing. The photoresist layer is removed on the support to form an etching stopper layer exposed portion 6, and this etching stopper layer exposed portion 6 corresponds to a region where the first colored layer is to be removed. An etching stopper layer laminated on the first colored layer in which the photoresist layer is removed only in the region where the second colored layer is formed on the support, and the first colored layer and the third and subsequent colored layers are formed. The upper photoresist layer 4 is left.

(E) Etching Step Next, as shown in FIG. 6, dry etching is performed using the photoresist layer 4 as a mask, and the etching stopper layer 3 and the first colored layer 2 are removed to form a second colored layer. A region (support exposed portion 7) is formed.

(F) Photoresist layer removal step After performing the etching process, the photoresist layer 4 is dissolved and removed with a stripping solution or the like. After completion of the photoresist layer removing step, as shown in FIG. 7, only the support exposed portion 7 for forming the second colored layer has a shape in which the first colored layer 2 and the etching stopper layer 3 are removed. FIG. 8 is a plan view of FIG. 7 viewed from the colored layer forming surface side of the support.

(G) Second Colored Layer Forming Step As shown in FIG. 9, on the support 1 on which the first colored layer 2 and the etching stopper layer 3 are formed, they are associated with the color components of the second colored layer. The colored thermosetting composition is applied with a film thickness in which the region 8 as the second colored layer forming portion is embedded, and post-baking is performed to form the second colored layer 9.

(H) Colored layer removal step The second colored layer 9 formed on the etching stopper layer 3 is etched or polished by etch-back processing or CMP processing until the surface of the etching stopper layer 3 is exposed. At this time, it is detected that the etching stopper layer 3 has been reached, and the etching or the like is terminated when the etching stopper layer 3 is exposed. FIG. 10 shows the layer structure at the time when etching or the like is completed. Thus, by detecting the etching stopper layer 3 and ending the colored layer removal step, the film thickness of the first colored layer 2 does not vary with the progress of the process.

(B ′) Etching Stopper Layer Forming Step As shown in FIG. 11, a coating solution for forming an etching stopper layer is applied on the etching stopper layer 3 and the second colored layer 8, and heat treatment is performed to form a film having a thickness of 100 to 500 nm. An etching stopper layer 10 having a thickness is formed.

(C ′) Photoresist Layer Formation Step Although not shown in the figure, a positive or negative photoresist is applied on the etching stopper layer 10 and prebaked to form the photoresist layer 11 again.

(D ′) Image Forming Process As shown in FIG. 12, the photoresist layer 11 is exposed through a photomask having an opening pattern corresponding to the region on the support on which the third colored layer is to be formed. Then, the latent image area 12 is formed. Thereafter, the photoresist layer portion of the latent image region 12 to be removed is removed by development processing.
As shown in FIG. 13, the etching stopper layer exposed portion 13 from which the photoresist layer has been removed corresponds to a region where the first colored layer 2, the etching stopper layer 3 and the etching stopper layer 10 are to be removed. The photoresist layer is removed only in the region where the colored layer 3 is formed.

(E ′) Etching Step As shown in FIG. 14, the dry etching process is performed only on the region where the third colored layer is formed using the photoresist layer 11 after the development process as a mask. At this time, the dry etching treatment removes not only the first colored layer 2 but also the etching stopper layers 3 and 10 at the same time, and the support surface in the region (support exposed portion 14) for forming the third colored layer To be exposed.

(F ′) Photoresist Layer Removal Step After performing the etching process, the photoresist layer is dissolved and removed with a stripping solution or the like. After the removal step, the etching stopper layers 3 and 10 and the first colored layer 2 are removed only from the support exposed portion 14 forming the third colored layer as shown in FIG. Further, the etching stopper layers 3 and 10 are stacked on the first colored layer 2, and the etching stopper layer 10 is stacked on the second colored layer 8. FIG. 16 is a plan view of FIG. 15 viewed from the colored layer non-forming surface side of the support.

(G ′) Third Colored Layer Forming Step As shown in FIG. 17, coloring associated with the color components of the third colored layer on the support on which the first colored layer and the second colored layer are formed. The thermosetting composition is applied with a film thickness in which the region 15 as the third colored layer forming portion is embedded, and post-baking is performed to form the third colored layer 16.

(H ′) Colored layer removing step After the formation of the third colored layer, etching or polishing is performed until the surface of the etching stopper layer 10 is exposed by an etch back process or a CMP process. At this time, it is detected that the etching stopper layer 10 has been reached, and the etching or the like is terminated when the etching stopper layer is exposed. Thus, by detecting the etching stopper layer 10 and ending the colored layer removing step, the film thicknesses of the first colored layer 2 and the second colored layer 8 do not vary with the progress of the process.
Thereby, as shown in FIG. 18, a color filter composed of the first colored layer 2, the second colored layer 8, and the third colored layer 15 can be manufactured. FIG. 19 is a plan view of FIG. 18 viewed from the colored layer non-formation surface side of the support.

  EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples.

In each of the following steps, when processing using a commercially available processing solution was performed, each processing was performed according to the method specified by the manufacturer unless otherwise specified.
(Example 1)
[First step]
A green thermosetting composition “SG-5000L” (manufactured by Fuji Film Electronics Materials) was applied on a silicon substrate with a spin coater so as to form a coating film having a thickness of 0.8 μm, and then a hot plate was applied. The coating film was cured by heating at 220 ° C. for 5 minutes. The thickness of the colored layer formed of “SG-5000L” was 0.65 μm.

  Next, 100 parts by mass of ethyl 3-ethoxypropionate, 2 parts by mass of camphorsulfonic acid triphenylsulfonic acid (onium salt), 0.1 part by mass of trimethylamine (tertiary fatty acid amine), polyhydroxystyrene derivative (Maruzen Science Co., Ltd.) ) Marka Linker CMM manufactured by) A colored layer formed of “SG-5000L” by applying a solution consisting of 50 parts by mass to a film thickness of 500 nm and performing post-baking treatment (200 ° C., 5 minutes). An etching stopper layer was formed thereon.

  Next, on the etching stopper layer, a positive photoresist “FHi622BC” (manufactured by FUJIFILM Electronics Materials Co., Ltd.) is applied with Mark 8 manufactured by Tokyo Electron, and pre-baked, so that the film thickness becomes 0.8 μm. A layer was formed.

Next, the region corresponding to the filter array of RED was exposed to 350 mJ / cm ² with an i-line stepper (manufactured by Canon Inc.), and post-exposure heat treatment at 110 ° C. for 1 minute (PEB treatment). After developing for 1 minute with the developer “FHD-5” (manufactured by FUJIFILM Electronics Materials), post-baking at 120 ° C. for 2 minutes to form a RED filter array The photoresist in the power region was removed. At this time, the pattern size was 1.5 μm.

Next, in a dry etching apparatus (Hitachi High-Technologies U-621), RF power: 800 W, chamber pressure: 4 Pa, substrate temperature: 50 ° C., gas type and flow rate Ar: 800 mL / min. , CF ₄ : 200 mL / min. , O ₂ : 50 mL / min. Then, the etching process was performed with an overetching rate of 10%.

  Next, using a photoresist stripping solution “MS230C” (manufactured by FUJIFILM Electronics Materials Co., Ltd.), a stripping treatment was performed for 120 seconds to remove the photoresist. As a result, the base substrate is exposed only in the region where the RED filter array is to be formed in the state where the colored layer and etching stopper layer formed of “SG-5000L” are formed except for the region where the RED filter array is to be formed. It is in a state of being.

[Second step]
The film thickness of the region where the red thermosetting composition “SR-5000L” (manufactured by FUJIFILM Electronics Materials Co., Ltd.) should form the RED filter array is formed on the substrate after the first step with a spin coater. After coating to a 0.8 μm coating film, the coating film was cured by heating at 220 ° C. for 5 minutes using a hot plate. The thickness of the colored layer formed of “SR-5000L” by heat treatment was 0.65 μm.

  Then, the CMP process (chemical mechanical polishing method) was used to polish the colored layer formed by “SR-5000L” until an etching stopper layer was detected. The polyhydroxystyrene derivative was detected with an optical end point detection monitor.

  Next, an etching stopper layer is applied to a film thickness of 500 nm, post-baked (200 ° C., 5 minutes), and etched on the etching stopper layer and the colored layer formed of “SR-5000L”. A stopper layer was formed.

  Next, a positive photoresist “FHi622BC” (manufactured by FUJIFILM Electronics Materials Co., Ltd.) was applied on the etching stopper layer and prebaked to form a photoresist layer having a thickness of 0.8 μm.

Next, after performing an alignment process for superimposing, the area corresponding to the BLUE filter array was exposed to 350 mJ / cm ² with an i-line stepper and post-exposure heat treatment at 110 ° C. for 1 minute. After that, the developing solution “FHD-5” (manufactured by FUJIFILM Electronics Materials Co., Ltd.) is subjected to a developing process for 1 minute and a post-baking process at 120 ° C. for 2 minutes to form a BLUE filter array. The photoresist was removed. At this time, the pattern size was 1.5 μm.

Next, in a dry etching apparatus, RF power: 800 W, chamber pressure: 4 Pa, substrate temperature: 50 ° C., gas type and flow rate are set to Ar: 800 mL / min. , CF ₄ : 200 mL / min, O ₂ : 50 mL / min, and an etching process was performed with an overetching rate of 10%.
Next, using a photoresist stripping solution “MS230C” (manufactured by FUJIFILM Electronics Materials Co., Ltd.), a stripping treatment was performed for 120 seconds to remove the photoresist. As a result, the base substrate is exposed only in the region where the BLUE filter array is to be formed, with the etching stopper layer being formed in the uppermost layer except for the region where the BLUE filter array is to be formed.

[Third step]
On the substrate after the second step, a blue thermosetting composition “SB-5000L” (Fuji Film Electronics Materials Co., Ltd.) is formed in a region where a BLUE filter array is to be formed using a spin coater. After coating so as to form an 8 μm coating film, the coating film was cured by heating at 220 ° C. for 5 minutes using a hot plate. The film thickness of the colored layer formed of “SB-5000L” after the heat treatment was 0.65 μm.

[Fourth step]
After the third step, the BLUE colored layer formed on the etching stopper layer was removed by CMP (chemical mechanical polishing). At this time, the end point was the time when the etching stopper layer was exposed. The end point was detected by an optical end point detection monitor.

  According to Example 1, it was possible to form a color filter array having a pattern size of 1.5 μm in a rectangular shape with a flattened surface. By providing an etching stopper layer for each color, the film thickness of the filter array did not vary with the progress of the process, and a color filter with controlled transmission spectral characteristics could be produced.

(Comparative Example 1)
[First step]
In the same manner as in Example 1, a colored layer formed of the green thermosetting composition “SG-5000L” was formed.
Next, a positive photoresist “FHi622BC” (manufactured by FUJIFILM Electronics Materials Co., Ltd.) is applied to the colored layer formed of “SG-5000L” by using Mark 8 manufactured by Tokyo Electron, and the film thickness is 0. A photoresist layer was formed to have a thickness of 8 μm. The thickness of the colored layer formed of “SG-5000L” by heat treatment was 0.65 μm.

Next, an area other than the area corresponding to the GREEN filter array was subjected to an exposure of 350 mJ / cm ² with an i-line stepper (manufactured by Canon Inc.) and a post-exposure heat treatment at 110 ° C. for 1 minute. FHD-5 "(manufactured by FUJIFILM Electronics Materials Co., Ltd.) for 1 minute and then post-baked at 120 ° C. for 2 minutes to form a photoresist in the region where the RED and BLUE filter arrays should be formed. Removed. At this time, the pattern size was 1.5 μm.

Next, in a dry etching apparatus (Hitachi High-Technologies U-621), RF power: 800 W, chamber pressure: 4 Pa, substrate temperature: 50 ° C., gas type and flow rate Ar: 800 mL / min. , CF ₄ : 200 mL / min. , O ₂ : 50 mL / min. Then, the etching process was performed with an overetching rate of 10%.

  Next, using a photoresist stripping solution “MS230C” (manufactured by FUJIFILM Electronics Materials Co., Ltd.), a stripping treatment was performed for 120 seconds to remove the photoresist. As a result, the region where the GREEN filter array is to be formed has a colored layer formed of “SG-5000L”, and the base substrate is exposed in the region where the RED and BLUE filter arrays are to be formed. It is in a state.

[Second step]
The film thickness of the region where the red thermosetting composition “SR-5000L” (manufactured by FUJIFILM Electronics Materials Co., Ltd.) should form the RED filter array is formed on the substrate after the first step with a spin coater. After coating to a 0.8 μm coating film, the coating film was cured by heating at 220 ° C. for 5 minutes using a hot plate. The film thickness of the colored layer formed of “SR-5000L” after the heat treatment was 0.65 μm.

  Next, a positive photoresist “FHi622BC” (manufactured by FUJIFILM Electronics Materials Co., Ltd.) was applied on the substrate and pre-baked to form a photoresist layer having a thickness of 0.8 μm.

Next, an area corresponding to the BLUE filter array was subjected to an exposure of 350 mJ / cm ² with an i-line stepper (manufactured by Canon Inc.) and a post-exposure heat treatment at 110 ° C. for 1 minute. -5 "(manufactured by FUJIFILM Electronics Materials Co., Ltd.) for 1 minute, followed by post-baking at 120 ° C. for 2 minutes to remove the photoresist in the region where the BLUE filter array is to be formed. At this time, the pattern size was 1.5 μm.

Next, in a dry etching apparatus (Hitachi High-Technologies U-621), RF power: 800 W, chamber pressure: 4 Pa, substrate temperature: 50 ° C., gas type and flow rate Ar: 800 mL / min. , CF ₄ : 200 mL / min. , O ₂ : 50 mL / min. Then, the etching process was performed with an overetching rate of 10%.

  Next, using a photoresist stripping solution “MS230C” (manufactured by FUJIFILM Electronics Materials Co., Ltd.), a stripping treatment was performed for 120 seconds to remove the photoresist. As a result, the region where the GREEN filter array is to be formed forms the RED filter array in a state where the colored layer formed of “SG-5000L” and the colored layer formed of “SR-5000L” are laminated. The region to be formed is in a state where a colored layer formed of “SR-5000L” is formed, and the region in which the BLUE filter array is to be formed is in a state in which the base substrate is exposed.

  Next, a positive photoresist “FHi622BC” (manufactured by FUJIFILM Electronics Materials Co., Ltd.) was applied on the substrate and pre-baked to form a photoresist layer having a thickness of 0.8 μm.

Next, the areas other than those corresponding to the BLUE and RED filter arrays were exposed to 350 mJ / cm ² with an i-line stepper (manufactured by Canon Inc.), post-exposure heat treatment at 110 ° C. for 1 minute, and then developed. After developing for 1 minute with the liquid “FHD-5” (manufactured by FUJIFILM Electronics Materials), post-baking at 120 ° C. for 2 minutes to form a photoresist in the region where the GREEN filter array is to be formed Removed. At this time, the pattern size was 1.5 μm.

Next, in a dry etching apparatus (Hitachi High-Technologies U-621), RF power: 800 W, chamber pressure: 4 Pa, substrate temperature: 50 ° C., gas type and flow rate Ar: 800 mL / min. , CF ₄ : 200 mL / min. , O ₂ : 50 mL / min. Then, the etching process was performed with an overetching rate of 10%. At this time, the end point was the time when the GREEN colored layer was exposed. As a result, a GREEN and RED filter array was formed.

  Next, using a photoresist stripping solution “MS230C” (manufactured by FUJIFILM Electronics Materials Co., Ltd.), a stripping treatment was performed for 120 seconds to remove the photoresist. As a result, the region where the GREEN filter array was to be formed was formed with the colored layer formed of “SG-5000L”, and the region where the RED filter array was to be formed was formed with “SR-5000L”. In the state where the colored layer is formed, the region where the BLUE filter array is to be formed is in a state where the base substrate is exposed.

[Third step]
The film thickness of the region where the BLUE filter array is to be formed with the blue thermosetting composition “SB-5000L” (manufactured by Fuji Film Electronics Materials) on the substrate after the second step is determined by a spin coater. After coating to a 0.8 μm coating film, the coating film was cured by heating at 220 ° C. for 5 minutes using a hot plate. The film thickness of the colored layer formed of “SB-5000L” after the heat treatment was 0.65 μm.

  Next, a positive photoresist “FHi622BC” (manufactured by FUJIFILM Electronics Materials Co., Ltd.) was applied on the substrate and pre-baked to form a photoresist layer having a thickness of 0.8 μm.

Next, an area other than the region corresponding to the BLUE filter array was subjected to 350 mJ / cm ² exposure using an i-line stepper (manufactured by Canon Inc.) and post-exposure heat treatment at 110 ° C. for 1 minute. FHD-5 "(manufactured by FUJIFILM Electronics Materials Co., Ltd.) for 1 minute and then post-baked at 120 ° C for 2 minutes to remove the photoresist other than the region where the BLUE filter array is to be formed. did. At this time, the pattern size was 1.5 μm.

Next, in a dry etching apparatus (Hitachi High-Technologies U-621), RF power: 800 W, chamber pressure: 4 Pa, substrate temperature: 50 ° C., gas type and flow rate Ar: 800 mL / min. , CF ₄ : 200 mL / min. , O ₂ : 50 mL / min. Then, the etching process was performed with an overetching rate of 10%. At this time, the end point was the time when the GREEN colored layer was exposed.

  Next, using a photoresist stripping solution “MS230C” (manufactured by FUJIFILM Electronics Materials Co., Ltd.), a stripping treatment was performed for 120 seconds to remove the photoresist. As a result, a color filter array having a pattern size of 1.5 μm could be formed. However, in this comparative example in which the removal of the colored layer was completed based on the GREEN colored layer, the thickness of each colored layer could not be formed uniformly.

It is sectional drawing which shows the state in which the 1st colored layer was formed on the support body. It is sectional drawing which shows the state in which the etching stopper layer was formed on the 1st colored layer. It is sectional drawing which shows the state in which the photoresist layer was formed on the etching stopper layer. It is sectional drawing which shows the state of the photoresist layer after exposure. It is sectional drawing which shows the state of the photoresist layer after image development processing. It is sectional drawing which shows the layer structure after a dry etching process. It is sectional drawing which shows the layer structure after a photoresist layer removal. It is the top view which showed FIG. 7 from the colored layer formation surface side of a support body. It is sectional drawing which shows the state in which the 2nd colored layer was formed. It is sectional drawing which shows the layer structure after removing a 2nd colored layer until an etching stopper layer is exposed. It is sectional drawing which shows the layer structure after the etching stopper layer was further formed. It is sectional drawing which shows the state after exposure of the photoresist layer formed on the etching stopper layer. It is sectional drawing which shows the state of the photoresist layer after image development processing. It is sectional drawing which shows the layer structure after an etching process. It is sectional drawing which shows the layer structure after a photoresist layer removal. It is the top view which showed FIG. 15 from the colored layer non-formation surface side of a support body. It is sectional drawing which shows the state in which the 3rd colored layer was formed. It is sectional drawing which shows the layer structure of the color filter after the last process. It is the top view which showed FIG. 18 from the colored layer non-formation surface side of a support body.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Support body 2 1st coloring layer 3,10 Etching stopper layer 4,11 Photoresist layer 5,12 Unhardened latent image area | region 6,13 Etching stopper layer exposure part 7,14 Support body exposure part 8 2nd coloring Layer forming portion 9 Second colored layer 15 Third colored layer forming portion 16 Third colored layer

Claims (5)

(A) a first colored layer forming step of forming a first colored layer on the support;
(B) an etching stopper layer forming step of forming an etching stopper layer on at least the first colored layer;
(C) a photoresist layer forming step of forming a photoresist layer on the etching stopper layer;
(D) an image forming step of forming an image on the etching stopper layer by removing the photoresist layer in a region on a support on which a second colored layer different from the first colored layer is formed; ,
(E) an etching step of removing the etching stopper layer and the first colored layer in the region by a dry etching method like the image formed by the image forming step;
(F) a photoresist layer removing step of removing the photoresist layer remaining after the etching step;
(G) a second colored layer forming step of forming the second colored layer at least in the region where the first colored layer is removed;
(H) a colored layer removing step of removing a colored layer portion laminated on the etching stopper layer until the etching stopper layer is detected;
A method for producing a color filter comprising:   The method for producing a color filter according to claim 1, further comprising at least one group of process groups in which (b) to (h) are sequentially performed.   The method for producing a color filter according to claim 1, wherein at least one of the colored layer forming step is a step of forming a colored layer by applying a colored curable composition.   The method for producing a color filter according to claim 3, wherein the colored curable composition is applied by coating.   The method for producing a color filter according to claim 3 or 4, wherein the colored curable composition is a colored photocurable composition or a colored thermosetting composition.

Images