JP2008122040A - Evaporative cooling device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an evaporative cooling device capable of preventing a cooling object from being excessively cooled and preventing temperature hunting. <P>SOLUTION: A jacket 2 is disposed at the outer periphery of a reaction pot 1. A cooling fluid pipe conduit 6 is laid in the jacket 2. The cooling fluid pipe conduit 6 has a cooling fluid jetting port composed of a thermally-actuated member. In the case of cooling the reaction pot 1, only the cooling fluid heated to a prescribed temperature is jetted from the cooling fluid pipe conduit 6 into the jacket 2, so that the reaction pot 1 can be prevented from being excessively cooled. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an evaporative cooling device that cools an object to be cooled in a cooling chamber by latent heat of vaporization of a cooling fluid.

  The evaporative cooling device connects a cooling fluid conduit having a plurality of cooling fluid injection ports, injects a cooling fluid from the cooling fluid injection port, and connects a cooling chamber to a suction means to vaporize an object to be cooled. It can be cooled.

In this evaporative cooling device, the temperature of the cooling fluid in the cooling fluid supply pipe is excessively cooled in the initial stage of cooling, so that the object to be cooled is excessively cooled and temperature hunting occurs. there were.
JP 2006-258316 A

  The problem to be solved is to provide an evaporative cooling device capable of preventing temperature hunting by preventing an object to be cooled from being excessively cooled.

  The present invention provides a cooling fluid supply pipe in which a cooling chamber for cooling an object to be cooled is formed, a cooling fluid supply pipe for supplying a cooling fluid to the cooling chamber is connected, and the cooling chamber is connected to suction means. By forming the end of the cooling chamber side with a temperature-responsive member, when the temperature of the cooling fluid is low, the cooling fluid is not supplied to the object to be cooled, while when the temperature of the cooling fluid is high The cooling fluid is supplied to the object to be cooled.

  In the evaporative cooling device of the present invention, the cooling chamber side end of the cooling fluid supply pipe is formed of a temperature-responsive member, so that the cooling fluid is supplied to the object to be cooled when the temperature of the cooling fluid is low. Therefore, the object to be cooled is not cooled excessively, and temperature hunting can be prevented.

  In the present invention, the cooling chamber side end of the cooling fluid supply pipe is formed of a temperature responsive member, and as the temperature responsive member, a conventionally known material such as a bimetal or a shape memory alloy can be used.

In the present embodiment, an example in which the jacket portion 2 of the reaction kettle 1 is used as a cooling chamber is shown. An object to be cooled (not shown) placed inside the reaction kettle 1 is cooled by a cooling fluid as a cooling source supplied to the jacket portion 2.

  A jacket portion 2 is formed over substantially the entire circumference of the reaction kettle 1, and a combined vacuum pump 4 as a suction means and a cooling fluid supply pipe 5 are connected to the jacket portion 2. The cooling fluid supply pipe 5 is connected to a cooling fluid pipe line 6 disposed in the jacket portion 2.

  The lower part of the cooling fluid supply pipe 5 is connected to a part of the circulation path 15 of the combination vacuum pump 4 and the upper part is connected to one end part of the cooling fluid pipe 6. The cooling fluid pipe 6 is spirally disposed in the jacket portion 2 and a plurality of cooling fluid injection ports are provided on the reaction kettle 1 side of the cooling fluid pipe 6 (not shown).

In this embodiment, the cooling fluid injection port is formed of a bimetal as a temperature responsive member, so that when the temperature of the cooling fluid is lower than a predetermined value, the cooling fluid is not supplied to the reaction kettle 1 side. On the other hand, when the temperature of the cooling fluid becomes higher than a predetermined value, the bimetal is deformed and the cooling fluid can be supplied to the reaction kettle 1 side.

  In this embodiment, a steam supply pipe 8 with a flow rate adjusting valve 7 interposed is connected to the upper left portion of the jacket portion 2. By supplying the steam for heating at a predetermined pressure, that is, a predetermined temperature from the steam supply pipe 8 to the jacket part 2, the object to be heated in the reaction kettle 1 can be heated.

  A discharge pipe 9 is connected to the lower right side of the jacket portion 2 and connected to the ejector 10 of the combination vacuum pump 4. An open / close valve 11 and a gas-liquid separator 12 are attached to the discharge pipe 9. The gas-liquid separator 12 can separate the vapor and the liquid flowing down from the discharge pipe 9, respectively, and the separated vapor is sucked into the vapor ejector 3, while the separated liquid is a pipe line. 20 is sucked through the lower ejector 10.

  The steam ejector 3 has an inlet side connected to a branch pipe 21 branched from the steam supply pipe 8, and the outlet side is again connected to the front side of the flow rate control valve 7 of the steam supply pipe 8 by a conduit 22. A part of the steam in the jacket part 2 flowing down from the pipe 9 is sucked by the steam ejector 3 and supplied again from the steam supply pipe 8 to the jacket part 2, thereby heating steam in the jacket part 2. It can be forced to circulate.

  The combination vacuum pump 4 is formed by sequentially communicating the ejector 10, the tank 13, and the circulation pump 14 through the circulation path 15. A cooling water supply pipe 16 for supplying cooling water as a cooling fluid is connected to the upper portion of the tank 13. A part of the circulation path 15 is branched to connect the excess water discharge pipe 17 and the above-described cooling fluid supply pipe 5. The cooling fluid supply pipe 5 can evaporate and cool the reaction kettle 1 by supplying a part of the circulating fluid circulating through the combination vacuum pump 4 to the cooling fluid pipe 6 of the jacket portion 2.

The left side surface of the jacket portion 2 is connected to the ejector 10 of the combination vacuum pump 4 via a pipe line 23 and an on-off valve 24. The conduit 23 is for sucking vaporized vapor of the cooling fluid generated in the jacket portion 2 to the ejector 10.

  When the object to be cooled in the reaction kettle 1 is cooled, the cooling fluid is supplied from the cooling fluid supply pipe 5 into the cooling fluid pipe 6 to fill the cooling fluid pipe 6 with the cooling fluid, and at the same time, not shown. Cooling fluid is ejected from the plurality of cooling fluid ejection ports provided on the reaction kettle 1 side of the cooling fluid pipe 6 to the entire outer surface of the reaction kettle 1.

On the other hand, the circulation pump 14 of the combination vacuum pump 4 is driven, and the inside of the jacket portion 2 is evacuated to a predetermined pressure state, for example, a vacuum below atmospheric pressure, through the discharge pipe 9 or the pipe line 23 by the suction force generated by the ejector 10. By setting the state, the cooling fluid injected to the outer surface of the reaction kettle 1 takes the heat of the object to be cooled in the reaction kettle 1 and evaporates and vaporizes and cools the object to be cooled by the latent heat of vaporization. be able to.

  The vaporized vapor of the cooling fluid that has cooled the object to be cooled by the jacket portion 2 and part of the cooling fluid that could not be vaporized are sucked into the ejector 10 through the discharge pipe 9 or the pipe line 23 and reach the tank 13.

  Since the suction force that can be generated in the ejector 10 is determined by the temperature of the fluid flowing down the ejector 10, the cooling water having a predetermined temperature is appropriately supplied from the cooling water supply pipe 16 to the tank 13, thereby causing the ejector 10 to flow down. The suction force of the ejector 10 can be controlled by adjusting the fluid temperature.

The block diagram which shows the Example of the vaporization cooling device of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Reaction kettle 2 Jacket part 4 Suction means 5 Cooling fluid supply pipe 6 Cooling fluid pipe 9 Discharge pipe 10 Ejector 13 Tank 14 Circulation pump 15 Circulation path

Claims (1)

A cooling chamber for cooling the object to be cooled is formed, a cooling fluid supply pipe for supplying a cooling fluid to the cooling chamber is connected, and the cooling chamber is connected to a suction means. By forming the end portion with a temperature-responsive member, when the temperature of the cooling fluid is low, the cooling fluid is not supplied to the object to be cooled, while when the temperature of the cooling fluid is high, the cooling fluid is covered. An evaporative cooling device that is supplied to a coolant side.

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