JP2008116784A - Light source device, illumination device, projector and monitor device - Google Patents

Abstract

An object of the present invention is to accurately adjust the temperature of a wavelength conversion element that performs wavelength conversion of laser light.
A laser light source device includes a semiconductor laser array, an optical wavelength conversion element, and a reflection mirror. The thermistor 35 and the heater 37 are connected to the optical wavelength conversion element 30, and the temperature control circuit 70 controls the heater 37 based on the temperature measured by the thermistor 35 to adjust the temperature of the optical wavelength conversion element 30. To do. A light shielding plate 50 that shields unnecessary laser light LB3 is disposed between the semiconductor laser array 20 and the optical wavelength conversion element 30, so that the unnecessary laser light LB3 directly or indirectly irradiates the thermistor 35. Is prevented.
[Selection] Figure 2

Description

  The present invention relates to a light source device, an illumination device, a projector, and a monitor device using a laser light source.

  Conventionally, an ultra-high pressure mercury lamp (UHP) has been generally used as a light source for a projector that enlarges and projects an image. However, UHP has various problems such as that it takes a few minutes to reach the maximum luminance and that the life is relatively short. Therefore, in recent years, a method using a semiconductor infrared laser as a light source is being developed (for example, see Patent Document 1).

JP-A-2005-99160 JP 2003-16699 A

  In order to obtain visible light from infrared laser light (wavelength: around 1000 nm), a wavelength conversion element such as PPLN (Periodically Poled Lithium Niobate) can be used. By using this wavelength conversion element, visible light such as blue (wavelength: 460 nm) or green (wavelength: 532 nm) can be obtained using a semiconductor infrared laser device that is relatively easy to manufacture.

  However, it is known that the light conversion efficiency of the wavelength conversion element is greatly influenced by the temperature. FIG. 9 is a graph showing an example of light conversion efficiency by the wavelength conversion element. As shown in the figure, the temperature of the wavelength conversion element with the highest wavelength conversion efficiency is a narrow range of about 1 ° C. with respect to a predetermined temperature. If the temperature is out of the range, the conversion efficiency is greatly reduced. Resulting in.

  In consideration of the above-described problems that occur in an apparatus that uses laser light as a light source, the problem to be solved by the present invention is to accurately adjust the temperature of the wavelength conversion element.

Based on the above problems, the present invention is configured as a light source device as follows. That is,
A light source device,
A laser light source;
A wavelength conversion element that converts the wavelength of the laser light emitted from the laser light source into a predetermined wavelength;
A temperature sensor for detecting the temperature of the wavelength conversion element;
A temperature regulator for adjusting the wavelength conversion element to a predetermined temperature according to the temperature detected by the temperature sensor;
The gist of the invention is that the light source includes a light shielding portion that shields light between the laser light source and the temperature sensor.

  In the light source device of the present invention, the light shielding unit shields light between the temperature sensor that detects the temperature of the wavelength conversion element and the laser light source. Therefore, erroneous detection of temperature by the temperature sensor can be suppressed without irradiating the temperature sensor with laser light emitted from the laser light source. As a result, the temperature regulator can maintain the temperature of the wavelength conversion element with high accuracy, and a stable output can be obtained.

  In the light source device having the above configuration, the light shielding unit may include a metal that is a heat conductive material.

  With such a configuration, the heat generated with the light shielding of the laser light is radiated by the light shielding portion, so that erroneous detection of the temperature of the wavelength conversion element by the temperature sensor can be suppressed. Examples of the metal include at least one of aluminum, nickel, magnesium, iron, brass, titanium, and stainless steel. In addition, the light-shielding part may be formed of these metals themselves, or may be a resin in which metal powder is mixed, or a metal part may be formed in a part of the resin.

In the light source device having the above configuration,
The light source device may include a heat dissipation mechanism that emits heat farther than the temperature sensor, and the light shielding unit may be connected to the heat dissipation mechanism. With such a configuration, the heat generated in the light shielding portion can be efficiently radiated by the heat radiating mechanism.

In the light source device having the above configuration,
The light shielding unit may include a reflective film that reflects the laser light emitted from the laser light source. According to such a configuration, it is possible to easily shield light by reflecting unnecessary laser light emitted from the laser light source.

In the light source device having the above configuration,
The said light shielding part is good also as what is formed including the heat insulating material.

  According to such a configuration, it is possible to suppress the heat generated by the shielding of the laser light from reaching the temperature sensor, so that the temperature of the wavelength conversion element can be maintained with high accuracy. As such a heat insulating material, for example, silicon or resin can be employed. In addition, the light-shielding portion can have a hollow structure, or can be formed using ABS, epoxy, or rubber-based material. Moreover, it is good also as what forms a light-shielding part by bonding together a heat insulating material and the heat conductive material mentioned above.

In the light source device having the above configuration,
The light shielding portion is formed as a cover that covers the wavelength conversion element and the temperature sensor except for a portion where the laser light is incident on the wavelength conversion element and a portion where the laser light is emitted from the wavelength conversion element. It may be a thing.

  With such a configuration, unnecessary laser light can be easily shielded, so that erroneous detection of the temperature of the wavelength conversion element by the temperature sensor can be suppressed.

In the light source device having the above configuration,
The laser light source emits infrared laser light, and the light shielding portion can be configured to shield at least the infrared laser light. With such a configuration, it is possible to output visible laser light using an infrared laser light source that is relatively easily available.

In the light source device having the above configuration,
The wavelength conversion element may be an element that converts the wavelength of the infrared laser light into a wavelength corresponding to blue or green. If it is such a structure, the light source device of this invention can be utilized for the various use for which a blue or green light source is required.

  Moreover, this invention can be comprised as an illuminating device provided with the light source device of the various structures mentioned above and the diffusion element which diffuses the light inject | emitted from the said wavelength conversion element. With such a configuration, it is possible to perform illumination with a stable output.

Further, the present invention can be configured as the following projector. That is,
A projector that projects an image according to an input image signal,
A laser light source;
A wavelength conversion element that converts a wavelength of a laser emitted from the laser light source into a predetermined wavelength;
A temperature sensor for detecting the temperature of the wavelength conversion element;
A temperature regulator that adjusts the temperature of the wavelength conversion element according to the temperature detected by the temperature sensor;
A light shielding part that shields light between the laser light source and the temperature sensor;
A modulation unit that modulates light emitted from the wavelength conversion element according to the image signal;
And a projection unit for enlarging and projecting the modulated light. With such a configuration, an image with stable luminance can be projected.

The present invention can also be configured as the following monitor device. That is,
A monitor device for outputting a photographed subject,
A laser light source;
A wavelength conversion element that converts a wavelength of a laser emitted from the laser light source into a predetermined wavelength;
A temperature sensor for detecting the temperature of the wavelength conversion element;
A temperature regulator that adjusts the temperature of the wavelength conversion element according to the temperature detected by the temperature sensor;
A light shielding part disposed between the laser light source and the temperature sensor;
A diffusion element for diffusing the light emitted from the wavelength conversion element;
An imaging unit for imaging the subject illuminated by the diffusing element;
It is a summary to provide. With such a configuration, the subject can be illuminated brightly with a high-power laser light source, so that a clear image can be taken.

Hereinafter, in order to further clarify the operations and effects of the present invention described above, embodiments of the present invention will be described based on examples in the following order.
A. First embodiment (lighting device):
B. Second embodiment (monitor device):
C. Third embodiment (projector):
D. Variation:

A. First embodiment (lighting device):
FIG. 1 is a schematic configuration diagram of a lighting apparatus 10 as a first embodiment of the present invention. As illustrated, the illumination device 10 includes a laser light source device 12 and a diffusion element 14 that diffuses the laser light emitted from the laser light source device 12. The laser light source device 12 is configured by arranging a laser cell 20 </ b> C containing the semiconductor laser array 20, a light shielding plate 50, a light wavelength conversion element 30, and a reflection mirror 40 in a package 45. As the diffusing element 14, for example, a diffusing lens or a hologram element in which interference fringes are formed in advance so that incident light is diffused can be used.

  FIG. 2 is an explanatory diagram showing a main part of the laser light source device 12. As described above, the laser light source device 12 includes the semiconductor laser array 20, the light shielding plate 50, the light wavelength conversion element 30, and the reflection mirror 40.

  The semiconductor laser array 20 is called a VCSEL (Vertical-Cavity Surface-Emitting Laser) in which the laser beam LB1 is emitted perpendicularly to the substrate surface 20a, and a plurality of light emitting layers (active layers) 20b are arranged in one row. It has a dimensional array structure. The light emitting layer 20b corresponds to the “laser light source” of the present invention. Although the number of the light emitting layers 20b is five in the example of the drawing, it is not necessary to be limited to five. The semiconductor laser array 20 of the present embodiment emits infrared laser light.

  The optical wavelength conversion element 30 is a second harmonic generation (SHG) phenomenon, that is, a second-order nonlinear optical phenomenon in which two photons are converted into one photon having twice the frequency. The polarization inversion structure is formed in the ferroelectric material. The optical wavelength conversion element 30 introduces the laser beam LB1 emitted from the semiconductor laser array 20 into the inside thereof, and converts the wavelength of the laser beam into a visible laser beam LB2 such as blue or green.

  The polarization inversion structure in the optical wavelength conversion element 30 is formed by an electric field application method in an element using lithium niobate or lithium tantalate. Note that the method of forming the domain-inverted structure is not limited to this method, and other methods such as a domain-inverted method using ion exchange and a microdomain-inverted method using an electron beam may be used. The material is not limited to lithium niobate and lithium tantalate, and may be configured using an appropriate material in each method.

  The light wavelength conversion element 30 is provided with a thermistor 35 as a temperature sensor and a heater 37 for raising the temperature of the light wavelength conversion element 30 to a predetermined temperature by an adhesive. As shown in the figure, the thermistor 35 is mounted at a position farther from the semiconductor laser array 20 than the heater 37 in consideration of heat generation of laser light emitted from the semiconductor laser array 20. In addition, at the time of such attachment, the thermistors 35 are attached to some extent apart so that the heat generated by the heater 37 is not directly detected. For convenience of illustration, the thermistor 35 and the heater 37 are preferably provided on different surfaces of the optical wavelength conversion element 30 that are attached to the same surface of the optical wavelength conversion element 30. The heater 37 is preferably formed in a planar shape so as to heat the entire surface of one surface of the light wavelength conversion element 30.

  The thermistor 35 and the heater 37 are connected to a temperature control circuit 70. The temperature control circuit 70 measures the temperature of the optical wavelength conversion element 30 with the thermistor 35 and flows the temperature to the heater 37 so that the temperature becomes the temperature (for example, 50 ° C.) at which the wavelength conversion efficiency of the wavelength conversion element 30 is the highest. The temperature of the optical wavelength conversion element 30 is adjusted by feedback control of the amount of current. In the present embodiment, the heater 37 is attached to adjust the temperature of the light wavelength conversion element 30, but depending on the temperature characteristics of the light wavelength conversion element 30, a cooler such as a Peltier element is attached. Also good.

  The reflection mirror 40 is obtained by applying a special coating to the surface 40a on the light wavelength conversion element 30 side. This special coating is highly reflective with respect to the excitation light emitted from the semiconductor laser array 20 and highly transparent with respect to the second harmonic emitted from the optical wavelength conversion element 30. On the other hand, the substrate surface 20a on the emission side of the semiconductor laser array 20 is provided with a special coating that is highly transmissive to the excitation light and highly reflective to the second harmonic. With this configuration, an optical resonator is configured between the substrate surface 20 a of the semiconductor laser array 20 and the surface 40 a of the reflection mirror 40. The laser beam LB1 emitted from the semiconductor laser array 20 is confined in the optical resonator and passes through the optical wavelength conversion element 30 many times. Since the optical wavelength conversion element 30 is temperature-controlled by the heater 37 as described above, it is possible to obtain the second harmonic with less noise. The second harmonic wave passes through the reflection mirror 40 and is applied to the diffusing element 14 as laser light LB2 that has been wavelength-converted into visible light.

  The light shielding plate 50 is disposed between the semiconductor laser array 20 and the light wavelength conversion element 30, and a through hole 51 is provided at the center thereof. The through hole 51 is formed at a position where only the laser beam LB1 emitted perpendicularly from the light emitting layer 20b passes through the optical wavelength conversion element 30. The outer periphery of the light shielding plate 50 is in contact with the package 45 shown in FIG. 1, and the light shielding plate 50 causes the inside of the package 45 to have a region where the semiconductor laser array 20 exists, the optical wavelength conversion element 30 and the reflection mirror 40. Will be partitioned into areas where

  According to the laser light source device 12 provided in the illumination device 10 configured as described above, the infrared laser light emitted in the vertical direction from the semiconductor laser array 20 passes through the through-hole 51 of the light shielding plate 50. When the laser beam is emitted in a direction other than the vertical direction, the laser beam (hereinafter referred to as “unnecessary laser beam LB3”) is transmitted to the bottom surface of the light shielding plate 50. Will be shielded from light. That is, the unnecessary laser beam LB3 is shielded by the light shielding plate 50, so that it is possible to prevent the unnecessary laser beam LB3 from reaching the thermistor 35 directly or indirectly by reflecting inside the package 45. become. As a result, the thermistor 35 is prevented from misidentifying the temperature of the optical wavelength conversion element 30, and the temperature of the optical wavelength conversion element 30 can be adjusted with high accuracy.

  The light shielding plate 50 can be formed of, for example, silicon or resin which is a heat insulating material. Further, the light shielding portion 50 can be formed in a hollow structure, or can be formed using ABS, epoxy, or rubber-based material. In addition, a multilayer reflective film that reflects the unnecessary laser beam LB3 may be formed on the surface of the light shielding plate 50 on the semiconductor laser array 20 side. With such a configuration, it is possible to suppress the heat from reaching the thermistor 35 when the unnecessary laser beam LB3 is shielded by the light shielding plate 50.

  FIG. 3 is an explanatory diagram showing the effect of this embodiment. The graph shown at the top of the figure represents the amount of current flowing through the semiconductor laser array 20. Further, a graph indicated by a solid line at the bottom of the figure represents the original temperature of the light wavelength conversion element 30, and a graph indicated by a broken line represents the temperature measured by the thermistor 35 when the light shielding plate 50 is not provided. As shown in these graphs, at a certain time t1, the temperature control circuit 70 starts heating the heater 37, and after the temperature of the optical wavelength conversion element 30 reaches a predetermined temperature, the semiconductor laser array at time t2. When an electric current is passed through 20, the laser light LB1 passes through the optical wavelength conversion element 30, so that the original temperature of the optical wavelength conversion element 30 slightly increases as shown by the graph shown by the solid line. However, when there is no light-shielding plate 50, laser light emitted in a direction other than the vertical direction is directly or indirectly applied to the thermistor 35, and the thermistor 35 is shown in the broken line graph of FIG. The temperature of the light wavelength conversion element 30 is detected higher than the original temperature. As a result, the temperature control of the light wavelength conversion element 30 by the temperature control circuit 70 becomes unstable, and the wavelength conversion efficiency of the laser light by the light wavelength conversion element 30 may be greatly reduced. However, according to the present embodiment, by providing the light shielding plate 50, the thermistor 35 is not directly or indirectly irradiated with the unnecessary laser light LB3. The measured temperature approaches the original temperature of the light wavelength conversion element 30. As a result, the wavelength conversion efficiency by the optical wavelength conversion element 30 can be maintained with high accuracy, and a stable output light quantity can be obtained from the laser light source device 12.

  FIG. 4 is an explanatory diagram showing a first modification of the first embodiment. In this modification, the light shielding plate 50 is made of a metal as a thermoconductive material. As such a metal, for example, aluminum, nickel, magnesium, iron, brass, titanium, stainless steel, or an alloy thereof can be employed. The light shielding plate 50 may be formed of a resin containing these metals or a resin partially provided with these metals.

  The light shielding plate 50 is connected to a heat radiation mechanism 60 having a large number of heat radiation fins 61 provided outside the package 45 of FIG. The material of the heat dissipation mechanism 60 can be the same material as the light shielding plate 50. With such a configuration, even if the temperature of the light shielding plate 50 rises due to the shielding of the unnecessary laser beam LB3, the heat can be released to the outside by the heat dissipation mechanism 60. As a result, the heat of the light shielding plate 50 is suppressed from propagating to the thermistor 35 in the package 45, and the temperature of the optical wavelength conversion element 30 can be adjusted with higher accuracy.

  FIG. 5 is an explanatory view showing a second modification of the first embodiment. In the present modification, the entire optical wavelength conversion element 30 including the thermistor 35 and the heater 37 is enclosed by a light shielding cover 80 formed of a heat insulating or heat conductive material.

  FIG. 6 is an explanatory view showing an AA cross section of the light shielding cover 80 shown in FIG. On the light shielding cover 80, on the semiconductor laser array 20 side and the reflection mirror 40 side, through holes 81 and 82 through which the laser light emitted from the light emitting layer 20b passes are provided. Even with this configuration of this modification, the light shielding cover 80 can prevent the unnecessary laser light LB3 from reaching the thermistor 35 directly or indirectly, and therefore the temperature of the optical wavelength conversion element 30 can be adjusted with high accuracy. It becomes possible.

B. Second embodiment (monitor device):
FIG. 7 is a schematic configuration diagram of a monitor device 400 as a second embodiment of the present invention. The monitor device 400 includes a device main body 410 and an optical transmission unit 420. The apparatus main body 410 includes the laser light source apparatus 12 of the first embodiment described above. As described in the first embodiment, the laser light source device 12 includes the semiconductor laser array 20, the light shielding plate 50, the light wavelength conversion element 30, and the reflection mirror 40.

  The light transmission unit 420 includes two light guides 421 and 422 on the light sending side and the light receiving side. Each of the light guides 421 and 422 is a bundle of a large number of optical fibers, and can send laser light to a distant place. The laser light source device 12 is disposed on the incident side of the light guide 421 on the light transmitting side, and the diffusion plate 423 is disposed on the emission side thereof. The laser light emitted from the laser light source device 12 is transmitted to the diffusion plate 423 provided at the tip of the light transmission unit 420 through the light guide 421 and is diffused by the diffusion plate 423 to irradiate the subject.

  An imaging lens 424 is also provided at the tip of the light transmission unit 420, and reflected light from the subject can be received by the imaging lens 424. The received reflected light travels through the light guide 422 on the receiving side and is sent to a camera 411 as an imaging means provided in the apparatus main body 410. As a result, the camera 411 can capture an image based on the reflected light obtained by irradiating the subject with the laser light emitted from the laser light source device 12.

  According to the monitor device 400 configured as described above, the subject can be irradiated by the high-power laser light source device 12, so that an image can be clearly captured by the camera 411.

  In the monitoring device 400 of the second embodiment described above, the laser light source device 12 may be replaced with the laser light source device described in each modification of the first embodiment.

C. Third embodiment (projector):
FIG. 8 is a schematic configuration diagram of a projector 500 as a third embodiment of the invention. In the drawing, a casing constituting the projector 500 is omitted for simplification. The projector 500 includes a red laser light source device 501R that emits red light, a green laser light source device 501G that emits green light, and a blue laser light source device 501B that emits blue light.

  The red laser light source device 501R is a general semiconductor laser array that emits red laser light LBb. The green laser light source device 501G has the same configuration as the laser light source device 12 of the first embodiment described above, and includes a semiconductor laser array 20, a light shielding plate 50, a light wavelength conversion element 30, and a reflection mirror 40. In this optical wavelength conversion element 30, wavelength conversion is performed so as to emit laser light LBg having a green wavelength. The blue laser light source device 501B has the same configuration as the laser light source device 12 of the first embodiment described above, and includes a semiconductor laser array 20, a light wavelength conversion element 30, and a reflection mirror 40. In this optical wavelength conversion element 30, wavelength conversion is performed so as to emit laser light LBb having a blue wavelength.

  Further, the projector 500 is a liquid crystal light valve (modulation) that modulates the laser beams LBr, LBg, and LBb of the respective colors emitted from the laser light source devices 501R, 501G, and 501B of the respective colors according to image signals sent from a personal computer or the like. Image) formed by the liquid crystal light valves 504R, 504G, and 504B, the cross dichroic prism 506 that combines the light emitted from the liquid crystal light valves 504R, 504G, and 504B and guides the light to the projection lens 507. And a projection lens 507 for projecting the image on the screen 510.

  Further, the projector 500 makes the uniform optical system downstream of the laser light source devices 501R, 501G, and 501B in order to make the illuminance distribution of the laser light emitted from the laser light source devices 501R, 501G, and 501B uniform. 502R, 502G, and 502B are provided, and the liquid crystal light valves 504R, 504G, and 504B are illuminated with the light having a uniform illuminance distribution. For example, the uniformizing optical systems 502R, 502G, and 502B are configured by hologram elements and field lenses.

  The three color lights modulated by the liquid crystal light valves 504R, 504G, and 504B are incident on the cross dichroic prism 506. This prism is formed by bonding four right-angle prisms, and a dielectric multilayer film that reflects red light and a dielectric multilayer film that reflects blue light are arranged in a cross shape on the inner surface thereof. These dielectric multilayer films combine the three color lights to form light representing a color image. The synthesized light is projected onto the screen 510 by the projection lens 507, which is a projection optical system, and an enlarged image is displayed.

  According to the projector 500 configured as described above, since the high-power laser light source devices 501G and 501B can be used, a high-luminance image can be displayed.

  As a modification of the third embodiment, at least one of the green laser light source device 501G and the blue laser light source device 501B can be replaced with each modification of the first embodiment.

D. Variation:
As mentioned above, although the various Example of this invention was described, it cannot be overemphasized that this invention is not limited to these Examples, and can take a various structure in the range which does not deviate from the meaning. For example, the following modifications are possible.

  (1) In the above embodiment, a VCSEL type laser array is used as the laser array, but instead of this, an edge emitting laser array in which the direction of light resonance is parallel to the substrate surface is used. Also good. Further, the laser light source may be another type of laser such as a solid-state laser, a liquid laser, a gas laser, or a free electron laser instead of the semiconductor laser.

  (2) In the above embodiment, the reflection mirror 40 is provided between the diffusing element 14 and the light wavelength conversion element 30, but between the light shielding plate 50 and the light wavelength conversion element 30, or It may be provided between the light shielding plate 50 and the semiconductor laser array 20. Even with such a configuration, the optical wavelength conversion element 30 can convert the wavelength of infrared laser light into visible laser light.

  (3) In each embodiment or modification described above, one through hole 51 is provided in the light shielding plate 50 for the five light emitting layers 20b, but one through hole is formed for each light emitting layer 20b. It is good also as what to do. With such a configuration, unnecessary laser light LB3 can be shielded more effectively.

  (4) The projector 500 of the third embodiment is a so-called three-plate type liquid crystal projector. Instead of this, the laser light source device is turned on in a time-sharing manner for each color so that only one light valve is used. A single-plate liquid crystal projector having a configuration that enables display may be used.

It is a schematic block diagram of the illuminating device 10 as 1st Example of this invention. It is explanatory drawing which shows the principal part of the laser light source apparatus. It is explanatory drawing which shows the effect of 1st Example. It is explanatory drawing which shows the 1st modification of 1st Example. It is explanatory drawing which shows the 2nd modification of 1st Example. It is explanatory drawing which shows the AA cross section of the light shielding cover. It is a schematic block diagram of the monitor apparatus 400 as 2nd Example of this invention. It is a schematic block diagram of the projector 500 as 3rd Example of this invention. It is a graph which shows an example of the light conversion efficiency by a wavelength conversion element.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Illuminating device 12 ... Laser light source device 14 ... Diffusion element 20 ... Semiconductor laser array 20C ... Laser cell 20b ... Light emitting layer 30 ... Light wavelength conversion element 35 ... Thermistor 37 ... Heater 40 ... Reflection mirror 45 ... Package 50 ... Light-shielding plate 51 ... Through hole 60 ... Heat radiation mechanism 61 ... Heat radiation fin 70 ... Temperature control circuit 80 ... Light shielding cover 81 ... Through hole 400 ... Monitor device 410 ... Device body 411 ... Camera 420 ... Light transmission unit 421,422 ... Light guide 423 ... Diffusion plate 424 Image forming lens 500 ... Projector 501B ... Blue laser light source device 501G ... Green laser light source device 501R ... Red laser light source device 502R, 502G, 502B ... Uniform optical system 504R, 504G, 504B ... Liquid crystal light valve 506 ... Cross dichroic prism 507 ... Copy lens 510 ... screen

Claims (13)

A light source device,
A laser light source;
A wavelength conversion element that converts the wavelength of the laser light emitted from the laser light source into a predetermined wavelength;
A temperature sensor provided in the vicinity of the wavelength conversion element for detecting temperature;
A temperature regulator for adjusting the wavelength conversion element to a predetermined temperature according to the temperature detected by the temperature sensor;
A light source device comprising: a light shielding unit that shields light between the laser light source and the temperature sensor. The light source device according to claim 1,
The light shielding unit includes a metal which is a heat conductive material. The light source device according to claim 2,
The light shielding unit includes at least one of aluminum, nickel, magnesium, iron, brass, titanium, and stainless steel as the metal. The light source device according to claim 2 or 3, wherein
The light source device includes a heat dissipation mechanism that emits heat far away from the temperature sensor,
The light shielding unit is connected to the heat dissipation mechanism. The light source device according to claim 1,
The light-shielding unit includes a reflective film that reflects laser light emitted from the laser light source. The light source device according to claim 1,
The light shielding unit is formed by including a heat insulating material. The light source device according to claim 6,
The light shielding unit includes a silicon or a resin as the heat insulating material. The light source device according to claim 1,
The light shielding portion is formed as a cover that covers the wavelength conversion element and the temperature sensor except for a portion where the laser light is incident on the wavelength conversion element and a portion where the laser light is emitted from the wavelength conversion element. Light source device. The light source device according to any one of claims 1 to 8,
The laser light source emits infrared laser light,
The light-shielding unit shields at least the infrared laser light. The light source device according to claim 9,
The wavelength conversion element is an element that converts the wavelength of the infrared laser light into a wavelength corresponding to blue or green. A lighting device,
A laser light source;
A wavelength conversion element that converts the wavelength of the laser light emitted from the laser light source into a predetermined wavelength;
A temperature sensor provided in the vicinity of the wavelength conversion element for detecting temperature;
A temperature regulator that adjusts the temperature of the wavelength conversion element according to the temperature detected by the temperature sensor;
A light shielding part that shields light between the laser light source and the temperature sensor;
A diffusing element that diffuses light emitted from the wavelength conversion element. A projector that projects an image according to an input image signal,
A laser light source;
A wavelength conversion element that converts the wavelength of the laser light emitted from the laser light source into a predetermined wavelength;
A temperature sensor provided in the vicinity of the wavelength conversion element for detecting temperature;
A temperature regulator that adjusts the temperature of the wavelength conversion element according to the temperature detected by the temperature sensor;
A light shielding part that shields light between the laser light source and the temperature sensor;
A modulation unit that modulates light emitted from the wavelength conversion element according to the image signal;
A projector comprising: a projection unit that magnifies and projects the modulated light. A monitor device for outputting a photographed subject,
A laser light source;
A wavelength conversion element that converts the wavelength of the laser light emitted from the laser light source into a predetermined wavelength;
A temperature sensor provided in the vicinity of the wavelength conversion element for detecting temperature;
A temperature regulator that adjusts the temperature of the wavelength conversion element according to the temperature detected by the temperature sensor;
A light shielding part disposed between the laser light source and the temperature sensor;
A diffusion element for diffusing the light emitted from the wavelength conversion element;
A monitor device comprising: an imaging unit that images a subject illuminated by the diffusing element.

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