JP2008109064A - Surface plate protecting device in cmp apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent damage of a surface plate used in a CMP apparatus due to troubles generated in repair or replacement of the surface plate or operation of the CMP apparatus, and the like. <P>SOLUTION: In order to solve the problem, the surface plate protecting device is provided in the CMP apparatus, which is a surface plate 2 used in the CMP apparatus, wherein a polishing pad 16 is replaceably bonded with the upper surface of a sheet 8, and the lower surface of the sheet 8 is bonded to the upper surface of the surface plate 2, by an adhesive agent 9 having adhesive force larger than the adhesive force of the polishing pad 16, so that damages, or the like, of the surface of the surface plate 2 generated caused by troubles, etc. in the polishing of a wafer can be blocked by the sheet 8. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a surface plate protection device in a CMP apparatus, and more particularly to a surface plate protection device in a CMP apparatus that can prevent damage to the surface of a surface plate that occurs during a CMP operation or the like.

Conventionally, there is no surface plate protection device in this type of CMP apparatus. As the closest one, the one described in Patent Document 1 is known. Thus, what is described in the document 1 is wound with a separator attached to one side of a double-sided adhesive tape and an abrasive cloth attached to the other side, and mounted on a surface plate. In this case, the adhesive surfaces on both sides of the double-sided tape are protected by the separator so that the polishing pad does not lift due to the repulsive force of the separator, and thus the polishing cloth is attached to the surface plate. It is made up of. Of course, when the polishing cloth is attached to the surface plate, the separator is removed.
JP 2001-131500 A.

  The above conventional example cannot prevent scratches or dents on the upper surface of the surface plate that occur during operation of the CMP apparatus.

  A polishing pad is mounted on a surface plate used in the CMP apparatus, but this polishing pad is a consumable part and must be periodically replaced. When the polishing pad is replaced, carelessness or the like may cause scratches or dents on the surface of the surface plate. Further, the surface of the surface plate may be damaged due to troubles such as popping out of the wafer during wafer polishing. Thus, the shape of the surface of the surface plate and the wafer polishing shape are closely related. When the surface of the surface plate is scratched, the polishing performance of the wafer is affected by the degree of the scratch. Accordingly, when the surface of the surface plate is damaged or a mark is generated, the surface plate needs to be repaired or replaced with a new surface plate. However, repair work in a state where it is attached to the CMP apparatus involves difficulty. Further, the platen is heavy and the replacement work is not easy, requiring a considerably long working time, and the operation of the CMP apparatus has to be stopped in such a time zone, and the operation efficiency of the CMP apparatus is reduced. Not only that, the platen itself is expensive to manufacture, and there is a defect that the economic burden increases with the time and labor.

  Thus, a technical problem to be solved in order to overcome the defect arises, and the present invention aims to solve the problem.

  The present invention has been proposed to achieve the above object, and the invention according to claim 1 is a surface plate used in a CMP apparatus, wherein a sheet is adhered to the upper surface of the surface plate with an adhesive. Furthermore, a polishing pad is replaceably bonded to the upper surface of the sheet, and CMP is configured to protect the surface plate surface from being damaged when the polishing pad is replaced or when polishing the wafer. A surface plate protection device for an apparatus is provided.

  According to this configuration, the sheet is bonded to the upper surface of the surface plate, and the polishing pad is bonded to the upper surface of the sheet, and the wafer polishing operation by the CMP apparatus is executed.

According to a second aspect of the present invention, there is provided a surface plate protection device in a CMP apparatus, wherein an adhesive force of the pressure-sensitive adhesive for bonding the upper surface of the surface plate and the sheet is larger than an adhesive force of the polishing pad. Is.

  According to this configuration, when the polishing pad is periodically replaced, the polishing pad can be detached from the sheet bonded to the upper surface of the surface plate, and the new polishing pad is left and adhered to the upper surface of the surface plate. The wafer is polished by the CMP apparatus according to claim 1 while being adhered to the sheet surface.

  According to a third aspect of the present invention, there is provided a surface plate protection apparatus in a CMP apparatus in which a chemical-resistant material such as a fluororesin is selected for the sheet.

  According to this structure, since the chemical-resistant material is selected for the sheet, the sheet is not eroded by acidic / alkaline slurry during the wafer polishing operation.

  According to a fourth aspect of the present invention, the lower surface of the sheet is subjected to a surface treatment that increases the coefficient of friction, and the adhesive that bonds the lower surface of the sheet and the upper surface of the surface plate has an adhesive force of the surface. It is an object of the present invention to provide a surface plate protection device in a CMP apparatus in which a material having an adhesive strength equal to or greater than that of a polishing pad is used.

  According to this configuration, the friction coefficient of the lower surface of the sheet is increased, and the adhesive has an adhesive force between the sheet and the upper surface of the surface plate by using an adhesive whose adhesive strength is equal to or greater than that of the polishing pad. It will definitely grow. As a result, when the polishing pad is periodically replaced, the polishing pad can be surely separated from the sheet bonded to the upper surface of the surface plate, and the new polishing pad is left and adhered to the upper surface of the surface plate. The wafer is polished by the CMP apparatus according to claim 1 while being adhered to the sheet surface.

  The invention according to claim 5 is a surface plate used in a CMP apparatus, and a sheet for protecting the surface of the surface plate is provided, and the lower surface side of both surfaces of the sheet is more adhesive than the upper surface side. Adhesives having different adhesive strengths are respectively applied, and the lower surface of the sheet is adhered to the upper surface of the surface plate with the adhesive having a larger adhesive force, and the adhesive force is reduced on the upper surface of the sheet. Surface plate protection in a CMP apparatus constructed so that a polishing cloth can be exchanged with the adhesive and the surface of the surface plate can be damaged by the sheet when the polishing cloth is replaced or a wafer is polished. A device is provided.

  According to this configuration, at the time of periodic replacement of the polishing cloth, the polishing cloth can be detached independently from the sheet bonded to the upper surface of the surface plate, and the new polishing cloth is left and adhered to the upper surface of the surface plate The wafer is polished by the CMP apparatus after being bonded to the surface.

  In the invention of claim 6, a pressure-sensitive adhesive that is larger than the adhesive force of the polishing pad is previously applied to the surface on the surface plate side of the sheet, the sheet is adhered to the upper surface of the surface plate, and It is an object of the present invention to provide a surface plate protection device in a CMP apparatus configured such that the polishing pad is bonded to the upper surface of the sheet.

  According to this configuration, since the pressure-sensitive adhesive having a larger adhesive force than that of the polishing pad is previously applied to the sheet, the pressure-sensitive adhesive having a larger adhesive force is adhered to the upper surface of the surface plate, and A polishing pad is bonded to the other surface side to constitute a CMP apparatus according to claim 1, and a polishing operation is performed.

The invention according to claim 7 provides a surface plate protection device in a CMP apparatus in which an outer cover sheet for preventing adhesion to other objects is bonded to each of the pressure-sensitive adhesive surfaces attached to the sheet. It is.

  According to this configuration, the pressure-sensitive adhesive or the like having different adhesive strength is applied to the sheet in advance, but each pressure-sensitive adhesive is protected by the outer cover sheet.

  In the first aspect of the invention, since the sheet is bonded to the upper surface of the surface plate and the polishing operation of the wafer is performed by the CMP apparatus in a state where the polishing pad is bonded to the upper surface of the sheet, Even when a wafer pops out and a broken piece of wafer entrains a polishing pad or the like, the upper surface of the surface plate is protected by the sheet, so that the upper surface of the surface plate is not damaged.

  In addition, when replacing the polishing pad, the polishing pad is once peeled off from the sheet bonded to the upper surface of the surface plate, and a new polishing pad is bonded again. Even if the surface of the platen is accidentally damaged during the replacement work, this damage is blocked by the sheet, the surface plate surface shape is maintained in an appropriate state, and a long platen life can be expected. The use can be continued as long as there is no damage or scarring. Therefore, it can be expected that the wafer polishing operation by the CMP apparatus can be most efficiently performed and a high-quality wafer can be obtained. Thus, repair or replacement of the surface plate can be minimized, and there is an advantage that it is economically advantageous.

  In addition to the effect of the invention of claim 1, the invention according to claim 2 is bonded to the upper surface of the sheet from the pressure-sensitive adhesive because the sheet is bonded to the upper surface of the surface plate with a pressure-sensitive adhesive having a large adhesive force. The polishing pad bonded with a pressure-sensitive adhesive can be easily separated from the upper surface of the sheet. Therefore, it is possible to easily perform the periodic replacement work of the polishing pad. Of course, even during the polishing pad replacement operation, the upper surface of the surface plate is protected by the sheet, so that there is an advantage that no damage or the like occurs on the upper surface of the surface plate.

  In the invention according to claim 3, in addition to the effect of the invention according to claim 1 or 2, since the sheet is formed of a material having excellent chemical resistance, the sheet is subjected to the wafer polishing operation by the CMP apparatus. There is an advantage that it is not eroded by the slurry made of acid, alkali or the like, and the upper surface of the surface plate can be protected at all times to prevent damage to the upper surface of the surface plate.

  In addition to the effect of the invention of claim 1 or 3, the invention of claim 4 increases the coefficient of friction of the lower surface of the sheet, and the adhesive has an adhesive strength equal to or greater than that of the polishing pad. As a result, the adhesive force between the sheet and the top surface of the surface plate is surely increased, and when the polishing pad is regularly replaced, the polishing pad can be easily and independently from the sheet bonded to the top surface of the surface plate. There exists an advantage that it can peel reliably.

  In the invention according to claim 5, a sheet is bonded to the upper surface of the surface plate with a pressure-sensitive adhesive having a large adhesive force, and a polishing cloth is bonded to the upper surface of the sheet with a pressure-sensitive adhesive having a smaller adhesive force than the pressure-sensitive adhesive. Therefore, the polishing cloth can be easily and easily separated from the upper surface of the sheet. Therefore, there is an advantage that the periodic replacement work of the polishing cloth can be easily performed.

  In addition to the effect of the invention described in claim 1, 2 or 3, the invention described in claim 6 is pre-coated with a pressure-sensitive adhesive having a high adhesive force. The advantage that the sheet can be adhered to the upper surface of the surface plate using an adhesive, and the polishing pad can be adhered to the upper surface of the sheet, thereby providing further convenience to the periodic replacement operation of the polishing pad. There is.

  In addition to the effects of the invention of claim 5 or 6, the invention described in claim 7 is that each pressure-sensitive adhesive previously applied to the sheet is bonded to the upper surface of the sheet or until the polishing cloth is bonded. Since it is protected by the covering sheet, there is an advantage that the adhesive can be carried out with the adhesive force being surely maintained without being damaged.

  A surface plate used in a CMP apparatus for the purpose of protecting the upper surface of the surface plate used in the CMP apparatus and preventing damages and the like occurring during operation of the CMP apparatus. Further, a polishing pad is bonded to the upper surface of the sheet in a replaceable manner, and the surface of the surface plate is damaged when the polishing pad is replaced or when the wafer is polished. This is achieved by providing a surface plate protection device in a CMP apparatus configured to be able to protect at the same time.

  Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to FIGS. FIG. 1 is a perspective view schematically showing a CMP apparatus (wafer polishing apparatus) 1. In the figure, the CMP apparatus 1 mainly comprises a polishing surface plate 2 and a polishing head 3. Thus, the surface plate 2 is formed in a disk shape, and a rotation shaft 4 is connected to the center of the lower surface thereof, and rotates in the direction of arrow A by the drive of the motor 5. A polishing pad 16 is mounted on the upper surface of the surface plate 2. Here, the polishing pad 16 that is generally commercially available is referred to as the polishing pad 16 including the polishing pad 6 and the double-sided adhesive tape 10 as shown in FIG.

  On the polishing pad 16, a wafer W pressed by pressing means (not shown) is placed in the vicinity of the lower surface of the polishing head 3, and a rotating shaft 7 is connected to the center of the upper surface of the polishing head 3. 1 is driven by a motor (not shown) attached to the rotary shaft 7 and rotates in the direction of arrow B in FIG. Further, the rotation speeds of the surface plate 2 and the polishing head 3 are different from each other, and even if they rotate relative to each other, there is no problem in polishing the wafer W. Further, during polishing, an abrasive (slurry) is supplied onto the polishing pad 16 from a nozzle (not shown). The slurry is generally acidic or alkaline.

  Next, an example of a specific configuration of the surface plate protection device according to the present embodiment will be described. In FIG. 2, a sheet 8 is bonded on the surface plate 2. Further, a polishing pad 16 is bonded onto the sheet 8. The wafer W is placed and pressed on the upper surface of the polishing pad 16, and the wafer W is polished by rotating the surface plate 2 and the polishing head 3 and supplying the slurry.

  The bonding state of the polishing pad 16 and the sheet 8 is shown in detail in FIG. In the figure, the lower surface of the sheet 8 is bonded to the upper surface of the surface plate 2 with a strong adhesive 9. Here, although the adhesive 9 is shown as a single layer in FIG. 3, specifically, a double-sided adhesive tape similar to the double-sided adhesive tape 10 in the polishing pad 16 is also used on the lower surface portion of the sheet 8, The pressure-sensitive adhesive 9 is a double-sided pressure-sensitive adhesive in the double-sided pressure-sensitive adhesive tape. A polishing pad 16 is bonded to the upper surface of the sheet 8 by an adhesive portion 10a on the lower surface of the double-sided adhesive tape 10.

  Thus, the strong pressure-sensitive adhesive 9 means that it has an adhesive force larger than the adhesive force of the adhesive portion 10a of the double-sided adhesive tape 10 in the polishing pad 16, and the polishing pad 16 is fixed. When peeling from the upper surface of the platen 2, only the polishing pad 16 is formed to be peelable from the platen 2 while the sheet 8 remains adhered to the platen 2.

Thus, when the polishing pad 16 is periodically replaced, the polishing pad 16 is removed from the upper surface of the sheet 8.
Is easily peeled off, and a new polishing pad 16 is again adhered to the upper surface of the sheet 8 at the portion of the double-sided pressure-sensitive adhesive tape 10, whereby the polishing pad 16 can be easily replaced. Even if the pressing force of the polishing pad 16 is applied to the surface plate 2 when the polishing pad 16 is replaced, the upper surface of the surface plate 2 is protected by the sheet 8 and the upper surface of the surface plate 2 is damaged. Alternatively, defects such as causing a trace are eliminated.

  Further, even if the wafer W protrudes from the polishing head 3 during polishing of the wafer W and the fragments act on the polishing pad 16 so as to damage the upper surface of the surface plate 2, the upper surface of the surface plate 2 remains the sheet. 8 can be surely protected, and the occurrence of the damages can be prevented. Therefore, the upper surface of the surface plate 2 always exhibits an appropriate shape and the polishing operation is executed. Thus, the polishing operation is carried out very effectively, the wafer W to be polished maintains a high quality, and the replacement work of the polishing pad 16 is also carried out easily and quickly. The apparatus 1 can be operated effectively and appropriately, and as a result, a high-quality wafer W can be obtained, and damage to the surface plate 2 can be suppressed as low as possible. This is extremely advantageous.

  As the sheet 8, a sheet having excellent chemical resistance made of fluorine resin or polyethylene is adopted. If this is the case, it will withstand long-term use as the sheet 8 without being eroded by the slurry made of an acidic or alkaline substance, while maintaining the protection of the surface plate 2 as described above at all times. Can do it.

  Further, when the above-mentioned fluorine resin or the like is adopted as the material of the sheet 8, if the surface treatment for increasing the friction coefficient is applied to the lower surface of the sheet 8, the lower surface of the sheet 8 and the upper surface of the surface plate 2 are formed. Even if an adhesive having the same adhesive strength as that of the adhesive portions 10a and 10b of the double-sided adhesive tape 10 in the polishing pad 16 is used as the adhesive to be adhered, the adhesive force between the lower surface of the sheet 8 and the upper surface of the surface plate 2 Can be surely made larger than the adhesive force between the upper surface of the sheet 8 and the polishing pad 16. Of course, in this case, if the strong pressure-sensitive adhesive 9 is used as a pressure-sensitive adhesive for bonding the lower surface of the sheet 8 and the upper surface of the surface plate 2, the adhesive force between the lower surface of the sheet 8 and the upper surface of the surface plate 2 is used. Can be increased more reliably.

  As the surface treatment for increasing the coefficient of friction of the lower surface of the sheet 8, a rough surface of the lower surface of the sheet 8 is obtained by reducing or removing the fluorine component on the lower surface of the sheet 8 made of a fluorine resin or the like by chemical treatment, or by mechanical blasting. Execute the conversion process.

  By subjecting the lower surface of the sheet 8 to a surface treatment that increases the friction coefficient, the polishing pad 16 can be easily detached from the sheet 8 bonded to the upper surface of the surface plate 2 when the polishing pad 16 is periodically replaced. And it can peel reliably.

  FIG. 4 shows another embodiment. In FIG. 4, pressure-sensitive adhesives 11 and 12 having different adhesive strengths are attached to both surfaces of the sheet 8 in advance. In the figure, a pressure-sensitive adhesive 11 having a large adhesive force is applied to the lower surface side of the sheet 8, and a pressure-sensitive adhesive 12 having a low adhesive force is applied to the upper surface side. Here, the pressure-sensitive adhesives 11 and 12 applied to both surfaces of the sheet 8 are applied with the double-sided pressure-sensitive adhesive in the double-sided pressure-sensitive adhesive tape as described above. The application of the double-sided pressure-sensitive adhesive in the double-sided pressure-sensitive adhesive tape to the pressure-sensitive adhesive applied to the sheet 8 is the same as in FIG.

  In FIG. 4, the sheet 8 is adhered to the upper surface of the surface plate 2 using the adhesive 11 on the lower surface side having a large adhesive force, and the polishing cloth 6 is bonded using the adhesive 12 on the upper surface side having a small adhesive force. Glue. In such a case, the bonding operation of the sheet 8 and the polishing pad 6 is easily and quickly performed, and the periodic replacement workability of the polishing pad 6 is improved.

  FIG. 5 shows still another embodiment. In the figure, in order to protect the pressure-sensitive adhesives 11 and 12 shown in FIG. 4, covering sheets 13 and 13 are joined to the pressure-sensitive adhesives 11 and 12, respectively. Therefore, until the bonding operation is performed using the respective adhesives 11 and 12, the adhesives 11 and 12 are not damaged and the respective functions are reliably protected. Of course, when the bonding is performed using the pressure-sensitive adhesives 11 and 12, the outer covering sheets 13 and 13 are peeled off.

  FIG. 6 shows an embodiment of the sheet 8 and the polishing pad 16. In the figure, a pressure-sensitive adhesive 14 having an adhesive force larger than the adhesive force of the adhesive portion 10a of the double-sided adhesive tape 10 in the polishing pad 16 is previously applied to the surface to be bonded to the surface plate 2 side of the sheet 8. . As in the embodiment of FIG. 5, the adhesive sheet 14 and the adhesive portion 10a are bonded in advance to the surface of the adhesive portion 10a of the double-sided adhesive tape 10 in the adhesive 14 on the lower surface of the sheet 8 and the polishing pad 16. You may make it protect. Of course, when performing each adhesion | attachment using this adhesive 14 and the adhesion part 10a of the double-sided adhesive tape 10, it is natural that an outer covering sheet will peel.

  FIG. 7 is an explanatory view showing the exchange state of the sheet 8. 3, 4, and 6, when the sheet 8 itself is damaged during polishing, the sheet 8 is peeled off from the upper surface of the surface plate 2, and a new sheet 8 is attached as described above. The surface plate 2 is bonded to the upper surface to protect the surface plate 2.

  The present invention can be variously modified without departing from the spirit of the present invention, and the present invention naturally extends to the modified ones.

The perspective view which shows the outline of CMP apparatus. The partially cutaway front view which shows the state which mounted | wore the sheet | seat and the polishing pad on the surface plate. The partial notch longitudinal cross-sectional view which shows the principal part of this invention. The partially notched front view which shows the other Example of a sheet | seat. The partially cutaway perspective view showing still another embodiment of the sheet. The partially cutaway front view which shows the Example of a sheet | seat and the polishing pad. Explanatory drawing which shows the exchange state of a sheet | seat.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 CMP apparatus 2 Surface plate 3 Polishing head 4,7 Rotating shaft 5 Motor 6 Polishing cloth 8 Sheet 9, 11, 12, 14 Adhesive 10 Double-sided adhesive tape 10a, 10b Adhesive part 13 Cover sheet 16 Polishing pad

Claims (7)

  A surface plate used in a CMP apparatus, wherein a sheet is adhered to an upper surface of the surface plate with an adhesive, and a polishing pad is adhered to the upper surface of the sheet in a replaceable manner. When the polishing pad is replaced Alternatively, the platen protection device in a CMP apparatus is configured to protect the surface plate surface from being damaged when the wafer is polished.   2. The platen protective device in a CMP apparatus according to claim 1, wherein the adhesive force of the pressure-sensitive adhesive for bonding the upper surface of the platen and the sheet is larger than the adhesive force of the polishing pad.   3. The surface plate protection device for a CMP apparatus according to claim 1, wherein the sheet is made of a chemical resistant material such as a fluororesin.   The lower surface of the sheet is subjected to a surface treatment that increases the coefficient of friction, and the adhesive that bonds the lower surface of the sheet and the upper surface of the surface plate has an adhesive force greater than or equal to the adhesive force of the polishing pad. The surface plate protection device for a CMP apparatus according to claim 1 or 3, wherein a device is used.   A surface plate used in a CMP apparatus, provided with a sheet for protecting the surface of the surface plate, and a pressure-sensitive adhesive having a different adhesive force on both sides of the sheet, the lower surface side having a larger adhesive force than the upper surface side Each of the adhesives is applied, and the lower surface of the sheet is adhered to the upper surface of the surface plate with the adhesive having a large adhesive force, and the upper surface of the sheet is coated with an abrasive cloth with the adhesive having a small adhesive force. A platen protection device in a CMP apparatus, wherein the platen is bonded in a replaceable manner so that damage to the surface of the platen caused by exchanging the polishing cloth or polishing a wafer can be protected by the sheet.   A pressure-sensitive adhesive larger than the adhesive strength of the polishing pad is applied in advance to the surface of the surface of the sheet, the sheet is adhered to the upper surface of the surface plate, and the polishing pad is attached to the upper surface of the sheet. 4. The platen protective device in a CMP apparatus according to claim 1, wherein the platen is adhered to each other. 7. A platen protective device in a CMP apparatus according to claim 5, wherein an outer cover sheet for preventing adhesion to other objects is bonded to each of the pressure-sensitive adhesive surfaces attached to the sheet. .

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