JP2008108958A - Light emitting device and method for manufacturing light emitting device - Google Patents

Abstract

The present invention relates to a light emitting device composed of upper and lower electrode type light emitting diodes having an upper electrode and a lower electrode, and a method of manufacturing the light emitting device.
A light emitting device according to the present invention includes a metal substrate, one and the other insulated from each other by a slit, a lower electrode of an upper and lower electrode type light emitting diode connected to one of the metal substrates, and the upper and lower electrodes. A conductive connecting member for connecting the upper electrode of the light emitting diode to the other of the metal substrate, a substantially cylindrical reflector for reflecting light from the upper and lower electrode light emitting diodes, and the inside of the reflector filled And at least a transparent sealing material. The reflector can maintain strength as a package by being attached to a metal substrate provided with slits by an adhesive or the like.
[Selection] Figure 1

Description

  The present invention relates to a light emitting device composed of upper and lower electrode type light emitting diodes having an upper electrode and a lower electrode, and a method for manufacturing the light emitting device. In particular, the present invention is a light emitting device using the upper and lower electrode type light emitting diodes, which can pass a large current, radiates heat generated at that time, or expands or contracts due to thermal stress of the conductive connecting member due to the heat. The present invention relates to a light emitting device and a method for manufacturing the light emitting device.

  FIG. 5A is a schematic sectional view for explaining a light emitting diode assembly in a conventional example, and FIG. 5B is a plan view for explaining the light emitting diode assembly in the conventional example. 5A and 5B, the light-emitting diode assembly 50 surrounds a printed wiring board 51, a submount board 52 provided on the printed wiring board 51, and the periphery of the submount board 52. A plastic cylindrical body 53, an upper and lower electrode type light emitting diode 55, and a transparent sealing resin 56 that covers the upper and lower electrode type light emitting diode 55.

  The plastic cylinder 53 is integrally formed with the lead frame 54 by using, for example, a thermosetting resin mainly composed of an epoxy resin. On the printed wiring board 51, a printed wiring 511 for connecting to a control circuit (not shown) for blinking the upper and lower electrode type light emitting diodes 55 is formed in a desired pattern by etching or the like. The submount substrate 52 has a pair of wirings 522 formed on its upper surface by forming an evaporation pattern using etching or a mask.

  In the plastic cylinder 53, the lead frame 54 penetrates the inside (the embedded portion 541). The plastic cylinder 53 reflects light emitted from the upper and lower electrode type light emitting diodes 55 from the inner periphery. Further, the plastic cylinder 53 is integrally manufactured by so-called insert or outsert molding (injection molding) in which the lead frame 54 is embedded in the injection molding.

  The upper and lower electrode type light emitting diodes 55 are provided with two electrodes 523 at the bottom, cut out by dicing from a submount substrate 52 made of a semiconductor wafer, and the electrodes are connected to the wiring 522 of the submount substrate 52. The transparent sealing resin 56 has heat resistance, is filled in the plastic cylinder 53, and constitutes a flat or convex lens.

In the light emitting diode package described in Japanese Patent Laid-Open No. 2001-244508, the lower electrode of the upper and lower electrode type light emitting diode is attached to one side of a metal substrate, and the upper electrode of the upper and lower electrode type light emitting diode is insulated with the other by a bonding wire. Connected to the metal substrate. Some conventional light emitting diode packages have a resin inserted in an insulating portion of a metal core. For example, the manufacturing method of the said package for light emitting diodes is described in Unexamined-Japanese-Patent No. 2005-116579. Further, in the conventional surface mount type light emitting diode, the metal core substrate is divided by an insulating adhesive and the submount substrate is mounted. For example, Japanese Unexamined Patent Publication No. 2003-303999 discloses the surface-mount light emitting diode.
JP 2001-244508 A JP 2005-116579 A JP 2003-303999 A

  The sub-mount type flip-chip type light emitting diode has an advantage that all the emitted light is irradiated to the outside because there is no electrode on the upper part. However, in recent years, upper and lower electrode type light emitting diodes have been developed having performances superior to the above-described flip chip type light emitting diodes. The upper and lower electrode type light emitting diode can flow a large amount of current and can improve the illuminance. However, when the submount type structure is used, the wiring may be disconnected due to heat, or the light emitting diode may be destroyed due to aging. There were drawbacks. Further, the submount type has a problem that productivity for mass production is poor.

  The upper and lower electrode type light emitting diodes are large, have high luminous efficiency, and have high illuminance. However, when the upper and lower electrode type light emitting diodes are used for illumination, a large amount of current can flow, but there is a problem that wiring is disconnected due to heat dissipation and distortion due to thermal stress. Moreover, the light emitting diode attached to the metal board | substrate provided with the slit is sealed with transparent resin, and the thing with high hardness is used in order to give intensity | strength with the said transparent resin. However, the sealing material having a high hardness has a problem that the thermal stress generated from the light emitting diode is large. The thermal stress may break the wiring that supplies power to the light emitting diode.

  In order to solve the problems as described above, the present invention provides a metal substrate provided with a slit, an upper and lower electrode type light emitting diode, and a conductive connection for connecting the metal substrate and the upper electrode of the upper and lower electrode type light emitting diode. It is an object of the present invention to provide a light-emitting device and a method for manufacturing the light-emitting device, which are at least composed of a member, a reflector provided on the metal substrate, and a transparent sealing material filled in the reflector. An object of the present invention is to provide a light-emitting device that is excellent in mass productivity, can withstand a large current and thermal stress, and is maintained at high strength, and a method for manufacturing the light-emitting device.

(First invention)
A light emitting device according to a first aspect of the invention corresponds to a metal substrate on which a large number of package units are formed, a slit formed to separate the metal substrate of each package unit and have a plurality of electrode portions, and the slit A reflector bonded to the plurality of electrode portions, a vertical electrode type light emitting diode having a lower electrode bonded to one of the electrode portions, an upper electrode of the vertical electrode type light emitting diode, and the other of the electrode portions A conductive connecting member for connecting the upper and lower electrode type light emitting diodes, and a transparent sealing material filled in the reflector, and the metal substrate is divided into package units, A plurality of electrode portions separated by the slit are held by the reflector.

(Second invention)
The light emitting device of the second invention is characterized in that the conductive connection member of the first invention is made of a metal plate and includes at least one conductive connection part connected to the upper electrode.

(Third invention)
In the light emitting device of the third invention, the conductive connection member of the first invention or the second invention is curved in a plane direction and / or a cross-sectional direction between the connection part of the upper electrode and one electrode part. Features.

(Fourth invention)
The light emitting device of the fourth invention is characterized in that the upper and lower electrode type light emitting diodes of the first to third inventions are installed in a recess provided in one of the electrode portions.

(Fifth invention)
The light emitting device of the fifth invention is characterized in that a convex portion connected to the conductive connecting member is formed on the other of the electrode portions of the first to fourth inventions.

(Sixth invention)
In the light emitting device of the sixth invention, the hardness of the transparent sealing resin for sealing the light emitting diode inside the reflector of the first invention to the fifth invention is 15 to 85, preferably 20 from Shore A (rubber hardness). 80.

(Seventh invention)
According to a seventh aspect of the present invention, there is provided a method for manufacturing a light emitting device, comprising: forming a slit on a metal substrate so as to have a plurality of package unit electrode portions; and at least one width of each package unit from a length of each slit. Joining a plurality of short reflectors to the electrode part, joining one of the electrode parts separated by the slit and the lower electrode of the upper and lower electrode type light emitting diodes with eutectic solder, Bonding the upper electrode of the upper and lower electrode type light emitting diode with a conductive connecting member, sealing the upper and lower electrode type light emitting diode, and filling the inside of the reflector with a transparent sealing material; The upper and lower electrode type light emitting diode package assembly produced in each step comprises at least a step of dividing each package unit, and separated by the slits. Wherein the electrode portion of the number is held in the reflector.

(Eighth invention)
According to an eighth aspect of the present invention, there is provided a method for manufacturing a light emitting device, comprising: forming a slit in a metal substrate so as to have a plurality of package unit electrode portions; and at least one width of each package unit from a length of each slit Joining a plurality of short reflectors to the electrode part, joining one of the electrode parts separated by the slit and the lower electrode of the upper and lower electrode type light emitting diodes with eutectic solder, Bonding the upper electrode of the upper and lower electrode type light emitting diodes using a conductive connecting member, dividing the package assembly for the upper and lower electrode type light emitting diodes produced in the respective steps into each package unit, The upper and lower electrode type light emitting diodes are sealed and filled with a transparent sealing material inside the reflector, and separated by the slits. Wherein the electrode portion of the number is held in the reflector.

(9th invention)
The method for manufacturing a light emitting device according to the ninth invention is characterized in that the hardness of the transparent sealing resin in the seventh invention or the eighth invention is Shore A (rubber hardness) of 15 to 85, preferably 20 to 80. To do.

  According to the present invention, since the upper and lower electrodes in the upper and lower electrode type light emitting diode are connected by the metal substrate provided with the slit and the conductive connecting member such as the metal plate, not only can a large current flow. It is excellent in heat dissipation and can be relaxed even if thermal stress occurs. In particular, since the metal substrate and the conductive connecting member can be increased in thickness and surface area, even when a large current is passed, the electrical resistance is low and the heat generation can be reduced.

  According to the present invention, by changing the shape of the conductive connecting member that connects the upper electrode of the upper and lower electrode type light emitting diode and the metal substrate, the luminous efficiency of the upper and lower electrode type light emitting diode can be improved or by thermal expansion. Thermal stress can be relaxed.

  According to the present invention, the strength as a package can be sufficiently maintained by attaching the reflector, although the metal substrate is provided with a slit. Further, by giving elasticity to the resin filled in the slit and the reflector, thermal stress generated when a large current is passed can be relaxed.

  According to the present invention, in particular, the upper and lower electrode type light emitting diode package in which the inside of the reflector is filled with an elastomer-based transparent sealing resin is attached with the upper and lower electrode type light emitting diode, The elastomer-type transparent sealing resin filled in the reflector can sufficiently absorb thermal stress. In addition, according to the present invention, it is possible to attach the light emitting diode in a package assembly state and seal the transparent sealing resin, so that productivity is improved.

(First invention)
A light emitting device according to a first aspect of the present invention is a metal substrate in which one and the other electrode portions are formed by slits, a vertical electrode type light emitting diode in which one of the electrode portions and a lower electrode are connected, A conductive connecting member that connects the upper electrode of the light emitting diode and the other of the electrode portions, a substantially cylindrical reflector that reflects light from the upper and lower electrode type light emitting diodes, and at least the interior of the reflector is filled. And a transparent sealing material. The one electrode portion and the other electrode portion are insulated from each other by a space formed by a slit when the metal substrate is divided, or the slit is filled with an insulating material. The width of at least one of the reflectors is shorter than the length of the slit, so that the one electrode portion and the other electrode portion are in an insulated state.

  The upper and lower electrode type light emitting diode includes an upper electrode and a lower electrode on the upper and lower sides, the lower electrode is bonded onto the one electrode part, and the upper electrode is connected to the other electrode part via the conductive connecting member. It is connected. The metal substrate is formed with an electrode portion plated with gold and / or silver as necessary, thereby improving the electrical connection between the lower electrode of the upper and lower electrode type light emitting diode and the conductive connection member. be able to.

  The reflector is, for example, a substantially cylindrical body having an inclined surface that extends toward the top. The reflector may be circular, square, elliptical, rectangular, or the like. The reflector is attached to the electrode portion, reflects the light of the upper and lower electrode type light emitting diodes in a desired direction, and joins the electrode portion divided by the slit to form a metal substrate to be the electrode portion. Try to keep enough strength. The reflector is made of alumina, a composite ceramic of alumina and glass. The reflector is bonded to the metal substrate with an epoxy resin, polyimide resin, glass or brazing adhesive. Further, the shape of the slit includes a straight shape, a curved shape, a cross shape, a T shape, an H shape, and the like. The insulating material filled in the slit can be made of strong ceramic or elastomer type resin.

  In the present invention, when connecting the upper electrode and the other electrode portion of the upper and lower electrode type light emitting diode, for example, a conductive connecting member made of a metal plate is used, so that one or two gold wires are used. Compared with what is connected, not only can a large current (for example, 350 mA or more) flow, but also heat can be radiated from the conductive connecting member itself made of the metal plate. The electrode part including the conductive connecting member and the metal substrate on which the upper and lower electrode type light emitting diodes are mounted has three functions of a conductor that reflects light, radiates heat from the upper and lower electrode type light emitting diodes, and conducts a large amount of current. It plays at the same time.

  The conductive connecting member is plated with gold, and has a very large cross-sectional area and surface area as compared with the gold wire. The gold plating can use eutectic solder for reflection of light generated from the upper and lower electrode type light emitting diodes and connection to the electrodes. The metal substrate includes copper or a copper alloy, aluminum or an aluminum alloy, or a metal plate obtained by performing silver plating and / or gold plating.

(Second invention)
The light-emitting device of 2nd invention is equipped with the at least 1 conductive connection part with which the electroconductive connection member of 1st invention is connected with the said upper electrode. For example, it is desirable that the conductive connection portion has a shape that can form an opening through which light emitted from the side portion of the upper and lower electrode type light emitting diode can be irradiated to the outside. The opening improves the light emission efficiency of the upper and lower electrode type light emitting diode.

(Third invention)
In the light emitting device of the third invention, when the conductive connecting member of the first invention or the second invention has a step between the upper electrode of the upper and lower electrode type light emitting diode and the electrode portion made of the other metal substrate, the portion is curved. A curved portion is provided. Further, since the curved portion can increase the surface area, not only can the heat dissipation due to the current flowing through the conductive connecting member be efficiently performed even when there is no step, the heat in this portion can be increased. Can absorb the expansion and contraction. Further, the conductive connecting member can be bent into a detoured shape so as not to disturb the light emitted from the upper and lower electrode type light emitting diodes. The shape of the curve may be any of a planar direction and / or a cross-sectional direction.

(Fourth invention)
A light emitting device according to a fourth aspect of the present invention is an electrode including the one metal substrate so that the upper and lower electrode type light emitting diodes according to the first to third aspects do not have a step between the upper electrode and the electrode portion including the metal substrate. It installs in the recessed part provided in the part. By making the concave portion the same as the thickness of the upper and lower electrode type light emitting diode, the step can be completely eliminated when wiring is performed. Further, since the conductive connecting member does not have the step, it is possible to perform wiring with the shortest distance and reduce electrical resistance.

(Fifth invention)
In the light emitting device of the fifth invention, a convex portion connected to the conductive connecting member is formed on the other side of the metal substrate including the electrode portion of the first to fifth inventions, and the same height as the upper electrode of the upper and lower electrode type light emitting diode. I try to be. Since the upper electrode of the upper and lower electrode type light emitting diode and the electrode portion including the other metal substrate have the same height, the conductive connecting member can easily connect both electrodes at the shortest distance.

(Sixth invention)
In the light emitting device of the sixth invention, the hardness of the transparent sealing resin for sealing the upper and lower electrode type light emitting diode inside the reflector in the first invention to the fifth invention is 15 to 85 in Shore A (rubber hardness), preferably 20 to 80 are used. The transparent sealing resin having the hardness has a hardness capable of absorbing the stress of heat generated when a large current is passed from one to the other electrode portion.

(Seventh invention)
According to a seventh aspect of the present invention, there is provided a light emitting device manufacturing method comprising: forming a slit in a metal substrate so as to have a large number of package unit electrode parts; joining a reflector to the electrode part; Joining the lower electrode of the electrode and one of the electrode parts, connecting the upper electrode of the upper and lower electrode type light emitting diode and the conductive connecting member, and joining the conductive connecting member and the other of the electrode parts And a step of filling the upper and lower electrode type light emitting diodes and the transparent sealing member in the reflector, and a step of dividing the reflector into individual package units. In the step of forming the slits, a large number of slits are formed in one row or a plurality of rows on the metal substrate so as to correspond to positions where the upper and lower electrode type light emitting diodes are attached. The slit may be linear, curved, cross-shaped, T-shaped, H-shaped, or the like, and filled with an insulating material as necessary.

  If necessary, the metal substrate can form a pair of electrode portions at positions where the upper and lower electrode type light emitting diodes are attached in one or a plurality of rows. In the pair of electrode portions, for example, the metal substrate itself or a gold and / or silver plating layer having a predetermined size is formed. In the step of joining the reflector to the electrode portion, a reflector having at least one width shorter than the length of each slit is joined corresponding to each slit. Each of the bonding steps can be performed at a time, for example, by placing eutectic solder on a predetermined portion and applying heat.

  The upper and lower electrode type light emitting diodes are sealed inside the reflector and filled with a transparent sealing member. In the dividing step, the upper and lower electrode type light emitting diode package assembly produced in each step is then cut inside each slit. The metal substrate (electrode part) divided by the slit can maintain a predetermined strength by attaching the reflector.

(Eighth invention)
The manufacturing method of the light emitting device in the eighth invention is different from that in the seventh invention only in the sealing time of the upper and lower electrode type light emitting diodes and the filling time of the transparent sealing material. That is, in the method for manufacturing a light emitting device according to the eighth aspect of the invention, after the package is divided, the upper and lower electrode type light emitting diodes are sealed and the inside of the reflector is filled with a transparent sealing material.

(9th invention)
According to a ninth aspect of the present invention, there is provided a method for manufacturing a light emitting device, wherein the transparent sealing resin according to the seventh or eighth aspect has a Shore A (rubber hardness) hardness of 15 to 85, preferably 20 to 80. It became easier to fill whether before or after dividing. Moreover, the transparent sealing resin having the hardness has a suitable hardness to absorb the heat stress generated when a large current flows from one side to the other electrode part.

  1 (a) to 1 (c) show a first embodiment of the present invention, (a) is a state diagram in which upper and lower electrode type light emitting diodes are attached to a package, (b) is an enlarged view of (a), and (c). FIG. 2 is a plan view of a package and upper and lower electrode type light emitting diodes. 1 (a) to 1 (c), the light emitting device according to this embodiment includes metal substrates 12, 14, a slit or insulating member 13 provided between the metal substrates 12, 14, and an upper and lower electrode type. A light-emitting diode 11, a conductive connecting member 15 that connects the metal substrate 14 and the upper electrode 111 of the upper and lower electrode type light-emitting diodes 11, and a reflective film 161 that is attached to the metal substrates 12 and 14 and has a reflective film 161 formed thereon. It is comprised at least from the body 16 and the transparent sealing material (not shown) with which the inside of the said reflector 16 was filled. The reflector 16 is formed of a substantially cylindrical body having a reflective portion inclined so as to spread toward the upper part.

  For example, the metal substrates 12 and 14 can contain copper in a small amount to increase the strength, and can be plated with silver and / or gold. The metal substrates 12 and 14 and the reflector 16 can be circular, square, rectangular, elliptical or the like. The reflector 16 is made of alumina ceramic that reflects light, or a composite ceramic of alumina and glass. The reflector 16 can also be plated with gold and / or silver on a synthetic resin member. Further, the reflector is bonded to the metal substrate with an adhesive such as epoxy resin, polyimide resin, glass, or brazing material.

  The insulating member 13 can be filled with, for example, a ceramic material, a thermosetting resin whose main component is a one-component or two-component epoxy resin, or a resin made of a silicon resin. It can have insulating properties. Since the cylindrical reflector 16 spreading toward the top is bonded to the metal substrates 12 and 14 with an adhesive, it can maintain high strength as a package. The reflector 16 is filled with a transparent sealing resin. The transparent sealing resin can be an elastomer type. The elastomer type resin preferably has a Shore A (rubber hardness) of 15 to 85, preferably 20 to 80. Furthermore, it is desirable that the insulating member 13 is an elastomer made of a silicon resin.

  The metal substrate 12 is electrically separated from the metal substrate 14 by a slit or an insulating member 13. The metal substrates 12 and 14 and the conductive connection member 15 can be made of copper or copper alloy, aluminum or aluminum alloy, iron or iron alloy. The reflector 16 is made of, for example, a composite ceramic of alumina, alumina and glass, and bonded to the metal substrates 12 and 14 with an epoxy resin, polyimide resin, glass, or brazing adhesive. Yes. Moreover, the reflector 16 can be made of synthetic resin and coated with a film of gold, silver, aluminum, or the like, in addition to the above-described members.

  The substrate 12 is formed with a storage recess 121 in which the upper and lower electrode type light emitting diodes 11 can be stored. The upper and lower electrode type light emitting diode 11 is provided with an upper electrode 111 and a lower electrode 112. On the metal substrates 12 and 14, package electrodes (not shown in FIG. 1) are formed by gold plating or the like in advance using a mask as necessary.

  The package electrode formed on one side of the metal substrate 12 is joined to the lower electrode 112 of the upper and lower electrode type light emitting diode 11 by eutectic solder, for example. The upper electrode 111 of the upper and lower electrode type light emitting diode 11 is connected to the package electrode formed on the metal substrate 14 by the conductive connection member 15 by eutectic solder, for example. On the surfaces of the metal substrates 12 and 14 where the upper and lower electrode type light emitting diodes 11 and the conductive connection members 15 are not present, silver plating 162 and 163 are applied to regions corresponding to the inside of the reflector 16 described later, The light emitted from the electrode type light emitting diode 11 is efficiently reflected.

  In FIG. 1C, the upper electrode 111 of the upper and lower electrode type light emitting diode 11 has an opening 113 in the shape of an eye and efficiently irradiates light from this portion. The opening 113 can be variously modified in addition to the character shape, such as a Japanese character shape, a square shape, and a U shape. The conductive connecting member 15 has, for example, two connecting portions 151 and is connected to a part of the upper electrode 111 of the upper and lower electrode type light emitting diode 11. The conductive connecting member 15 has a wide area on the side of the metal substrate 14 and is connected to a package electrode formed on the metal substrate 14. The conductive connection member 15 is connected to the upper electrode 111 and the metal substrate 14 by eutectic solder, for example. In the connection using the eutectic solder, the bonding strength can be increased by applying gold plating to each other. The conductive connecting member 15 can flow a large amount of current as about 4 to 6 gold wires.

  FIG. 2 (a) is a second embodiment of the present invention, and is a cross-sectional view for explaining another example in which upper and lower electrode type light emitting diodes are mounted on a metal substrate. (B) and (c) are diagrams of the present invention. It is a figure for demonstrating a package assembly. In FIG. 2A, the metal substrate 22 does not have a storage recess for storing the upper and lower electrode type light emitting diodes 11. However, the conductive connecting member 25 is formed in an approximately L shape, and connects the upper electrode 111 of the upper and lower electrode type light emitting diode 11 and the package electrode 214 formed on the metal substrate 14.

  Since the size of the upper and lower electrode type light emitting diodes 11 is about 1.0 mm × 1.0 mm, it is produced so that the shape of the conductive connecting member 25 is changed rather than producing the accommodating recess of the thickness. can do. Further, the conductive connecting member can absorb a step between the metal substrate and the upper electrode of the upper and lower electrode type light emitting diode by bending or bending the metal plate. In addition, although the metal substrate 14 is not illustrated, the conductive connection member 25 can be formed as a single plate member by forming a convex portion.

  2 (B) and 2 (C), the upper and lower electrode type light emitting diode packages arranged in a matrix form the slit 211 at the center of the reflector 16 as shown in FIGS. 2 (B) and 2 (C). It is provided eccentric from the part. In the arrangement, the upper and lower electrode type light emitting diodes 11 (not shown) can be arranged at the center of the reflector 16 (see FIG. 1C), and light can be efficiently radiated from the reflection film 161 of the reflector 16 to the outside. . The upper and lower electrode type light emitting diode packages are separated from each other by cutting lines 212 and 213 after the upper and lower electrode type light emitting diodes 11 are attached. The cutting may be performed with a cutter or may be pressed with a mold, and may be cut simultaneously, one by one, every row. Gold plating layers 214 and 215 are formed on the metal substrates 12, 14 and 22 as package electrodes at positions where the electrodes of the upper and lower electrode type light emitting diodes 11 and the conductive connection members 25 are disposed.

  FIG. 3 is a diagram for explaining another example of a package assembly according to the third embodiment of the present invention. In FIG. 3, the metal substrate 31 is provided with a cross-like slit in a substantially matrix shape at the center of the reflector 16. For example, the cross-shaped slit is filled with a space or an insulating resin in advance. The insulating resin is preferably highly elastic and adhesive like an epoxy resin. The upper and lower electrode type light emitting diode package has two upper and lower electrode type light emitting diodes (not shown) arranged in parallel across a cross-shaped slit, and can be used for a light emitting device with high illuminance.

  The reflector 16 can be arranged so that the cross-shaped slit is substantially at the center. The length of the cross-shaped slit is longer than the width of at least one of the reflectors 16 and is arranged so that a part thereof protrudes. The metal substrate 31 to which the reflector 16 is attached is shipped as a package to which upper and lower electrode type light emitting diodes are connected and the reflector 16 is filled with a transparent sealing material to form a package assembly. .

  FIGS. 4A to 4C are views for explaining a light emitting device constituted by a continuous metal substrate in the fourth embodiment of the present invention. In the example shown in FIG. 4 (a), the metal substrate 44 shown in FIG. 3 is cut in the horizontal direction, and the upper and lower electrode type light emitting diodes are attached to the upper and lower electrode type light emitting diode package 43, and these are connected in series. 4 are connected. The four upper and lower electrode type light emitting diode assemblies can be used as a horizontally long light emitting device.

  In the example shown in FIG. 4B, the metal substrate 44 is curved. In the example shown in FIG. 4C, curved portions made of arbitrary curves are provided on the left and right sides of the metal substrate 44, and the central portion is linear. In the present invention, the metal substrate 44 can be hemispherical or can be deformed into a desired shape in addition to the deformation in which the curvature, angle and the like of the metal substrate 44 are arbitrarily changed.

  Next, a method for manufacturing the light emitting device of the present invention will be described. In the method for manufacturing a light emitting device according to the present invention, a large number of cross-shaped slits or the like are formed in one or a plurality of rows on a metal substrate so as to correspond to the position where the upper and lower electrode type light emitting diodes are attached. For example, the cross-shaped slit or the like is previously filled or insert-molded with a space or an insulating material. The insulating material may be an epoxy resin or ceramic. Next, a pair of package electrodes are formed at positions where upper and lower electrode type light emitting diodes are attached to the metal substrate in one or a plurality of rows as required. The reflector has at least one width shorter than the length of each slit, and is joined to the metal substrate corresponding to each slit. The upper and lower electrode type light emitting diodes are joined by placing the lower electrode of the upper and lower electrode type light emitting diodes on one of the package electrodes.

  The conductive connecting members are bonded to each other after being placed on the upper electrode of the upper and lower electrode type light emitting diode and the other of the package electrodes on the metal substrate. Next, an elastomer type transparent sealing material is filled into the reflector from above the upper and lower electrode type light emitting diodes and the conductive connecting member. Thereafter, the upper and lower electrode type light emitting diode package assembly is cut inside each of the slits. The metal substrate divided by the slit can maintain a predetermined strength by attaching the reflector. Further, the upper and lower electrode type light emitting diode package assembly may be divided and filled with an insulating material after being divided.

  The light emitting device manufactured by the above method can be applied to a light guide plate of a liquid crystal display device, an advertisement display device, or the like, for example, by having a size of about 3 mm in length and about 20 mm in width. The light emitting device can supply a power of 350 mA or more to the upper and lower electrode type light emitting diodes, and can be used for a large-sized one.

  As mentioned above, although the Example of this invention was explained in full detail, this invention is not limited to the said Example. The present invention can be modified in various ways without departing from the scope of the claims. The connection of the upper and lower electrodes of the upper and lower electrode type light emitting diode of the present invention, the metal substrate, the conductive connecting member, etc. is known or eutectic solder, eutectic solder paste, eutectic solder and flux, gold-tin eutectic solder paste, etc. A well-known thing can be used. As the reflector member and the reflective film of the present invention, known or well-known members can be used as described above.

(A) to (C) are the first embodiment of the present invention, (A) is a state diagram in which upper and lower electrode type light emitting diodes are attached to the package, (B) is an enlarged view of (A), and (C) is a package. It is a top view of a vertical electrode type light emitting diode. Example 1 (A) is a second embodiment of the present invention, and is a cross-sectional view for explaining another example in which upper and lower electrode type light emitting diodes are mounted on a metal substrate. (B) and (C) are package assemblies according to the present invention. It is a figure for demonstrating a body. (Example 2) It is a figure for demonstrating the other example of a package aggregate | assembly in 3rd Example of this invention. (Example 3) (A) to (c) are diagrams for explaining a light emitting device constituted by a continuous metal substrate in the fourth embodiment of the present invention. Example 4 (A) is a schematic sectional drawing for demonstrating the light emitting diode assembly in a prior art example, (b) is a top view for demonstrating the light emitting diode assembly in the said prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 ... Vertical electrode type light emitting diode 111 ... Upper electrode 112 ... Lower electrode 113 ... Opening part 12, 14 ... Metal substrate 121 ... Storage recessed part 13 ... Insulating member 114 ... Side portions 15, 25 ... conductive connection member 151 ... connection portion 16 ... reflector 161 ... reflection film 162, 163 ... silver plating 214, 215 ... package electrode

Claims (9)

A metal substrate on which a number of package units are formed;
A slit formed to separate the metal substrate of each package unit and have a plurality of electrode portions;
A reflector bonded to the plurality of electrode portions corresponding to the slit;
An upper and lower electrode type light emitting diode in which a lower electrode is joined to one of the electrode parts;
A conductive connecting member for connecting the upper electrode of the upper and lower electrode type light emitting diode and the other of the electrode parts;
A transparent sealing material that seals the upper and lower electrode type light emitting diodes and is filled in the reflector;
The light emitting device is characterized in that the metal substrate is divided into package units, and a plurality of electrode portions separated by the slits are held by the reflector.   The light emitting device according to claim 1, wherein the conductive connection member is made of a metal plate and includes at least one conductive connection portion connected to the upper electrode.   3. The conductive connection member according to claim 1, wherein the conductive connection member is curved in a plane direction and / or a cross-sectional direction between the connection portion of the upper electrode and one electrode portion. Light emitting device.   The light emitting device according to any one of claims 1 to 3, wherein the upper and lower electrode type light emitting diodes are installed in a recess provided in one of the electrode portions.   The light emitting device according to any one of claims 1 to 4, wherein a convex portion connected to the conductive connection member is formed on the other of the electrode portions.   The hardness of the transparent sealing resin for sealing the light emitting diode inside the reflector is 15 to 85, preferably 20 to 80 in Shore A (rubber hardness). 6. The light-emitting device described in any one of 5 above. Forming a slit in a metal substrate so as to have a number of package unit electrode parts;
Bonding each of the package units with a plurality of reflectors having at least one width shorter than the length of each of the slits on the electrode part;
One of the electrode parts separated by the slit and the lower electrode of the upper and lower electrode type light emitting diode are joined by eutectic solder, and the other electrode part and the upper electrode of the upper and lower electrode type light emitting diode are joined by a conductive connecting member. Bonding using
Sealing the upper and lower electrode type light emitting diodes, and filling the reflector with a transparent sealing material;
Dividing the package assembly for upper and lower electrode type light emitting diodes produced in each of the above steps into each package unit;
And a plurality of electrode portions separated by the slits are held by the reflector. Forming a slit in a metal substrate so as to have a number of package unit electrode parts;
Bonding each of the package units with a plurality of reflectors having at least one width shorter than the length of each of the slits on the electrode part;
One of the electrode parts separated by the slit and the lower electrode of the upper and lower electrode type light emitting diode are joined by eutectic solder, and the other electrode part and the upper electrode of the upper and lower electrode type light emitting diode are joined by a conductive connecting member. Bonding using
Dividing the package assembly for upper and lower electrode type light emitting diodes produced in each of the above steps into each package unit;
Sealing the upper and lower electrode type light emitting diodes, and filling the reflector with a transparent sealing material;
And a plurality of electrode portions separated by the slits are held by the reflector.   The method for manufacturing a light emitting device according to the ninth invention is characterized in that the hardness of the transparent sealing resin in the seventh invention or the eighth invention is Shore A (rubber hardness) of 15 to 85, preferably 20 to 80. A method for manufacturing the light emitting device according to claim 7 or 8.

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