JP2008108871A - Mounting structure of semiconductor light emitting device - Google Patents

Abstract

Provided is a mounting structure of a semiconductor light emitting element that converts a light emission color by using a semiconductor light emitting element without using a separate color conversion filter with a simple configuration.
A first light-transmitting base material having flexibility, a conductive pattern made of a metal film affixed on the base base material, and placed so as to sandwich the conductive pattern on the base base material In the mounting structure of the semiconductor light emitting element in which the semiconductor light emitting element 12 is mounted on the flexible substrate 11 including the second translucent substrate 11b having flexibility, the flexible substrate is a semiconductor having the conductive pattern. Between the electrode parts for mounting the light emitting elements, the first and second translucent substrates are formed with slits or slit parts 13e and 13f along the respective electrode parts, and the semiconductor light emitting element is formed. The semiconductor light emitting device mounting structure is configured such that the light emitting surface is inserted into the slit portion or the slit portion and is covered with the first and second translucent substrates.
[Selection] Figure 3

Description

  The present invention relates to a mounting structure of a semiconductor light emitting element such as an LED as a light source in an illumination lamp, for example.

Conventionally, an illumination structure using, for example, an LED is disclosed in Patent Document 1, for example.
The telephone dial button illumination structure according to Patent Document 1 is configured as shown in FIG.
That is, in FIG. 5, the telephone dial button illumination structure 1 is connected to the LED connection land 3 a provided on the LED mounting flexible substrate 3 attached to the attachment position 2 a on the inner surface of the upper cover 2 by soldering or the like. LED4 is provided as a light source for illumination.
By incorporating the upper cover 2 into the main body (not shown), the LED 4 is attached in a direction facing the main board on the main body side.

  According to the illumination structure of such a configuration, the LED 4 emits illumination light in a direction facing the main board on the telephone body side. The illumination light is reflected by the main board on the telephone body side and proceeds to the dial button side of the telephone while being diffused almost uniformly. As a result, the dial button is indirectly back-lit uniformly.

Further, by applying the flexible substrate 3 on which such LEDs 4 are mounted, a bulb-type illumination lamp as shown in FIG. 6 may be configured.
In FIG. 6, the bulb-type illumination lamp 5 includes a flexible substrate 3 on which the LEDs 4 are mounted, a diffusion lens 6 disposed so as to surround the flexible substrate 3, and a drive for driving each LED 4 on the flexible substrate 3. Circuit 7.

  By the way, in the illumination structure by patent document 1 mentioned above and the illumination lamp 5 shown in FIG. 6, as shown in FIG. 7, the flexible substrate 3 is equipped with the electrical wiring pattern in insulating sheets, such as a polyimide film. Such a wiring pattern is routed between the LEDs 4. Thereby, a drive circuit for driving each LED 4 is configured.

When each of the LEDs 4 is a white LED and it is desired to convert the light emission color to a light bulb color (for example, to change white light having a color temperature of 6500K to light bulb color light having a color temperature of 3600K), The type and blending ratio of the applied phosphor is changed, or as shown in FIG. 7, white light from the LED 4 leaks between the color conversion filter 8 and the flexible substrate 3 and the diffusing lens 6. There is no need to insert.
JP 07-31138 A

  However, both in the illumination structure according to Patent Document 1 and in the illumination lamp 5 according to FIG. 6, when the light emission color is converted into a light bulb color by the color conversion filter 8, the LED 4 mounted on the flexible substrate 3 is placed in front of each LED 4. In order to prevent light from the LEDs 4 from leaking, it is very difficult to arrange the color conversion filter 8 in terms of mounting technology, and some of the white light from each LED 4 is emitted to the outside, causing color unevenness. May occur.

  On the other hand, when changing the type and blending ratio of the phosphors applied on the light emitting surfaces of the individual LEDs 4 and changing the light emission color from each LED 4 to the light bulb color, the color temperature of the light emission color Every time, it is necessary to change the type and blending ratio of the phosphors to produce the LED, which increases the manufacturing cost. Moreover, since the light conversion efficiency of the phosphor for changing the white light to the light bulb color is significantly lower than that of the color conversion filter 8, it has already been clarified that the illumination light of the lamp becomes dark. .

  In addition, such a problem occurs not only when the LED 4 is used as the light emitter but also when other types of semiconductor light emitting elements are used.

  In view of the above, the present invention is capable of converting a luminescent color using a semiconductor light emitting element that generates white light without using a separate color conversion filter with a simple configuration. An object of the present invention is to provide a semiconductor light emitting device mounting structure.

  According to the present invention, the object is to provide a flexible first light-transmitting substrate (base substrate), a conductive pattern comprising a metal film affixed on the base substrate, and the base substrate. A semiconductor light emitting device in which a semiconductor light emitting device is mounted on a flexible substrate including a flexible second translucent base material (cover base material) placed so as to sandwich the conductive pattern on a material. In the mounting structure, the flexible substrate is between the electrode portions for mounting the semiconductor light emitting element of the conductive pattern, and the slit portions or slit portions are formed in the first and second translucent substrates along the respective electrode portions. The semiconductor light emitting device is characterized in that the semiconductor light emitting element is inserted into the slit portion or the slit portion, and the light emitting surface thereof is covered with the first and second translucent substrates. Depending on the device mounting structure It is.

  In the mounting structure of the semiconductor light emitting element according to the present invention, preferably, the second translucent base material of the flexible substrate is provided with an opening corresponding to the electrode portion.

  The mounting structure of the semiconductor light emitting element according to the present invention is preferably set as appropriate so that at least one of the first and second translucent base materials of the flexible substrate imparts a predetermined spectral characteristic to the transmitted light. The pigment is dispersed and added.

According to the said structure, the said semiconductor light-emitting device is inserted in the tear part or slit part of the said flexible substrate, and is electrically connected with respect to an electrode part. Thereby, it is driven and emits light in the same manner as in the prior art, and the light emitting surface is covered with the first and second translucent base materials located above the light emitting surface.
Therefore, all the light emitted from the semiconductor light emitting element is transmitted through the first light-transmitting substrate and the second light-transmitting substrate and is emitted to the outside. There is no possibility of leaking outside without passing through the translucent substrate.
Furthermore, since the configuration of the flexible substrate itself is the same as that of the conventional flexible substrate, the cost does not increase significantly.

  The second translucent substrate of the flexible substrate is provided with an opening corresponding to the electrode portion, and the semiconductor light emitting element is electrically connected to the conductive pattern of the flexible substrate by the opening. A connection is made. Usually, the electrode portion of the flexible substrate is not covered with the second translucent resin, and in such a case, it is not necessary to provide the opening. When the opening is provided as described above, a normal means such as soldering for electrically connecting the semiconductor light emitting element to the flexible substrate can be used.

When an appropriate pigment is dispersed and added so that at least one of the first and second translucent substrates of the flexible substrate imparts a predetermined spectral characteristic to transmitted light, the flexible substrate The first and second translucent substrates of the substrate function as a color conversion filter, and substantially all of the light from the light emitting surface of the semiconductor light emitting element inserted into the gap is the first. The light-transmitting base material and the second light-transmitting base material are transmitted to the outside and can be color-converted.
In this case, since color conversion is performed in the same manner as a conventionally known color conversion filter, high color conversion efficiency is obtained, and for example, a bright illumination lamp is obtained.
In addition, since it is not necessary to arrange a separate color conversion filter in front of the semiconductor light emitting element, for example, the entire illumination lamp can be configured in a small size.

Thus, according to the present invention, an appropriate pigment is dispersed and added to at least one of the first and second translucent substrates constituting the flexible substrate, and color conversion is performed on these translucent substrates. Provide a filter function. As a result, substantially all of the light from the light emitting surface of the semiconductor light emitting element is transmitted through the first and second light transmissive substrates, and is subjected to color conversion.
Accordingly, direct light that is not color-converted is substantially prevented from being emitted to the outside. As a result, there is no color unevenness, and color conversion is performed in the same manner as a conventional color conversion filter, and bright irradiation light is obtained.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to FIGS.
The embodiments described below are preferable specific examples of the present invention, and thus various technically preferable limitations are given. However, the scope of the present invention is particularly limited in the following description. As long as there is no description of the effect, it is not restricted to these aspects.

FIG. 1 shows a configuration of an embodiment of an LED mounting structure to which the present invention is applied.
In FIG. 1, an LED mounting structure 10 includes a flexible substrate 11 and a plurality (five in the illustrated example) of LEDs 12 as semiconductor light emitting elements.

  As shown in FIGS. 2 and 3, the flexible substrate 11 includes a first base material (base base material) 11a and a second base material (cover base material) 11b made of a flexible translucent material. The conductive pattern 13 is disposed between the base materials 11a and 11b.

  The base materials 11a and 11b are formed in a film shape from polyimide or the like, for example, and are stacked on each other and fixed by adhesion or the like so as to sandwich a conductive pattern 13 to be described later.

  The LED 12 is a so-called chip type white LED, and emits white light when driven.

As shown in FIG. 2, the conductive pattern 13 is made of a metal film such as copper, for example, and is attached on the first base material 11 a, so that power is supplied to each LED 12. Has been.
Furthermore, the conductive pattern 13 has electrode portions 13 a and 13 b provided on both sides of the mounting portion of each LED 12. Moreover, it has the connection terminals 13c and 13d for connecting to an external drive circuit.
In the illustrated case, the conductive pattern 13 is formed so that the LEDs 12 are connected in series.

The above configuration is the same as the conventional LED mounting structure, but the LED mounting structure 10 according to the embodiment of the present invention is different in the following points.
That is, in the embodiment of the present invention, the base materials 11a and 11b function as a color conversion filter by dispersing and adding an appropriate pigment, for example, a yellow or orange pigment.
Here, the base materials 11a and 11b have spectral characteristics as shown in FIG. 4, for example, and convert, for example, white light incident from each LED 12 into light bulb color light.

Further, in the embodiment of the present invention, as shown in FIGS. 2 and 3, the flexible substrate 11 includes the electrode portions 13 a and 13 b in the region between the electrode portions 13 a and 13 b for mounting the LEDs 12. Slit portions 13e and 13f are formed on the inner side.
As shown in FIG. 3B, these slit portions 13e and 13f penetrate vertically through the flexible substrate 11, that is, penetrate vertically through the first base material 11a and the second base material 11b. Yes. In addition, it can replace with these slit parts 13e and 13f, and can also be made into a simple tear part.

  Furthermore, an opening is formed in the second base material 11b located on the electrode portions 13a and 13b of the conductive pattern 13, and the electrode portions 13a and 13b are exposed. Usually, in the case of this type of flexible substrate, the second base member 11b is removed in advance because the electrode portions 13a and 13b serve as connection terminals for electrical connection. Does not require an opening.

  The LED mounting structure 10 according to the embodiment of the present invention is configured as described above. When the individual LEDs 12 are mounted on the flexible substrate 11, as shown in FIG. The flexible substrate 11 is inserted from one of the slit portions 13e or 13f provided in the region of the LED mounting portion using the flexibility of the first and second substrates, and the first substrate 11a and the second substrate 11a are inserted. It passes through the back side of the base material 11b, is installed so that one end of the LED 12 protrudes from the other slit portion 13e or 13f, and the electrodes provided at both ends of the LED 12 are the electrode portions 13a of the conductive pattern 13, It is connected to 13b by soldering or the like. In this way, each LED 12 is mounted on the flexible substrate 11.

In this way, each LED 12 emits light when a driving voltage is applied from an external driving circuit (not shown) to the connection terminals 13c and 13d of the conductive pattern 13 of the flexible substrate 11 on which each LED 12 is mounted.
The light emitted from the light emitting surface of each LED 12 is emitted to the outside through the first base material 11a and the second base material 11b of the flexible substrate 11.
In this case, the light emitting surface of each LED 12 is substantially covered with the first base material 11a and the second base material 11b. For this reason, substantially all of the emitted light from each LED 12 is transmitted through the first base material 11a and the second base material 11b.

Here, the pigment is dispersedly added to the first base material 11a and the second base material 11b as described above. Thereby, since it functions as a color conversion filter, white light from each LED 12 is color-converted into, for example, light bulb color light when transmitted through the first base material 11a and the second base material 11b, and is emitted to the outside. Will do.
At that time, substantially all the emitted light from each LED 12 passes through the first base material 11a and the second base material 11b. For this reason, the direct light (white light) from each LED 12 does not leak to the outside and cause color unevenness in the irradiation light.

  Further, the LED mounting structure 10 according to the embodiment of the present invention does not need to be provided with a separate color conversion filter as compared with a conventional illumination lamp using a flexible substrate. obtain. Also, the cost can be reduced.

  As described above, according to the LED mounting structure 10 according to the embodiment of the present invention, light emission can be performed using a semiconductor light emitting element that generates white light with a simple configuration without using a separate color conversion filter. Color conversion can be performed.

  In the embodiment described above, the five LEDs 12 are mounted on the flexible substrate 11, but the present invention is not limited to this, and it is apparent that one to four, or six or more LEDs 12 may be mounted. is there.

  In the above-described embodiment, the flexible substrate 11 is formed flat. However, the flexible substrate 11 is not limited to this, and is formed into an appropriate shape or appropriately bent according to the configuration of, for example, an illumination lamp. Obviously, it may be divided into a plurality of parts.

  Furthermore, in the above-described embodiment, the case where an LED is used as a semiconductor light emitting element has been described. Obviously it can.

  In the above-described embodiment, the LED mounting structure has been described. However, the LED mounting structure may be applied to various illumination lamps or other lamps as long as the LED mounting structure is formed of a flexible substrate on which a semiconductor light emitting element is mounted. It is obvious that the present invention can also be applied.

  As described above, according to the present invention, it is possible to perform conversion of emission color using a semiconductor light emitting element that generates white light with a simple configuration without using a separate color conversion filter. A mounting structure of a semiconductor light emitting element is provided.

It is a schematic perspective view which shows the structure of one Embodiment of the mounting structure of LED by this invention. It is a schematic perspective view of the flexible substrate used with the mounting structure of LED of FIG. It is sectional drawing which mounted (A) top view and (B) sectional drawing, and (C) LED which show the flexible substrate of FIG. It is a graph which shows the spectral characteristic with respect to the transmitted light of the 1st and 2nd base material which comprises the flexible substrate of FIG. It is a disassembled perspective view which shows the structure of an example of the mounting structure of the conventional LED. It is a disassembled perspective view which shows the structure of the other example of the mounting structure of the conventional LED. It is a schematic perspective view which shows the structure of an example of the mounting structure of LED made to perform color conversion with the conventional color conversion filter.

Explanation of symbols

10 LED mounting structure 11 Flexible substrate 11a First substrate (base substrate)
11b Second base material (cover base material)
12 LED (semiconductor light emitting device)
13 Conductive pattern 13a, 13b Electrode part 13c, 13d Connection terminal 13e, 13f Slit part

Claims (3)

A first light-transmitting base material (base base material) having flexibility, a conductive pattern made of a metal film affixed on the base base material, and sandwiching the conductive pattern on the base base material In the mounting structure of the semiconductor light-emitting element in which the semiconductor light-emitting element is mounted on the flexible substrate including the second translucent base material (cover base material) provided with flexibility,
The flexible substrate is formed between the electrode portions for mounting the semiconductor light emitting element of the conductive pattern, and a slit portion or a slit portion is formed in the first and second light-transmitting substrates along each electrode portion. Become
The semiconductor light-emitting element mounting structure, wherein the semiconductor light-emitting element is inserted into the slit or slit, and the light-emitting surface is covered with the first and second light-transmitting substrates.   The mounting structure for a semiconductor light emitting element according to claim 1, wherein an opening is provided in the second translucent substrate of the flexible substrate corresponding to the electrode portion. An appropriate pigment is dispersed and added so that at least one of the first and second translucent base materials of the flexible substrate imparts a predetermined spectral characteristic to the transmitted light, The mounting structure of the semiconductor light-emitting device according to claim 1.

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