JP2008103577A - Power module heat dissipation structure and motor control device including the same - Google Patents

Abstract

[PROBLEMS] To improve heat transfer while ensuring miniaturization and to efficiently dissipate heat from a power module, as well as to ensure insulation and improve assembly and reduce costs. A structure and a motor control apparatus including the structure are provided.
A power module comprising: a power module main body 2 including a power semiconductor element; and a metal plate 23 for transferring heat generated by the operation of the power semiconductor element to an external heat sink 1. The power module main body 2 and the metal plate 23 are attached integrally, and the metal plate 23 is made larger than the mounting surface of the metal plate 23 in the power module main body 2.
[Selection] Figure 1

Description

  The present invention relates to the field of power electronics, and more particularly to a heat dissipation structure for a power module including a power semiconductor element used in a motor control device such as an inverter device for a motor drive or a servo drive device, and a motor control device including the same.

Conventionally, a heat radiation structure of a power module incorporating a power semiconductor element used in the power electronics field, particularly in an inverter device or a servo drive device for a motor drive is as shown in FIG. 3 (for example, see Patent Document 1).
FIG. 3 is a cross-sectional view showing a heat dissipation structure of a conventional power module.
In FIG. 3, 100 is a power module, 101 is a mounting hole, 102 is a base, 103 is a recess, 104 is a holding part, 200 is a printed wiring board, 201 is a mounting hole, 300 is a screw, 400 is a heat sink, 401 is a fin is there.
With respect to this power module heat dissipation structure, a pedestal 102 having a mounting hole 101 penetrated is provided on the upper surface of the power module 100, and a recess 103 corresponding to the head of the screw is formed on the upper surface of the pedestal 102. The printed wiring board 200 is mounted through the mounting hole 201 of the board, and a heat sink 400 is attached to the lower surface of the power module 100 with a screw 300 that passes through the mounting hole 101 of the power module. In addition, in order to perform favorable heat transfer, the metal plate which is not illustrated is provided in the surface where the power module 100 contacts the heat sink 400.
With this configuration, the heat generated from the power module 100 moves to a metal plate (not shown), and the heat transferred to the metal plate heats to the heat sink 400 through the contact surface with the heat sink, and inside the heat sink 400. Moves and is dissipated from the fin 401 to the atmosphere.
Japanese Patent Laid-Open No. 11-247771 (page 3, FIG. 1)

However, in the conventional heat dissipation structure of the power module, if the power module is reduced in size, it becomes impossible to secure a contact area between the power module and the heat sink necessary for heat transfer from the power module to the heat sink, so-called heat transfer area, As a result, good heat transfer could not be performed. In addition, there is a problem that the power module cannot efficiently radiate heat even if the heat radiation area is increased, such as changing the shape of the fins of the heat sink or increasing the number of fins.
Also, in order to ensure insulation between the heat sink and the charging parts such as the electronic parts mounted on the printed wiring board placed on the top of the power module and the connection part provided on the upper surface of the power module, There was also a problem that the height had to be increased.
Furthermore, the printed wiring board arranged on the upper part of the power module has a problem that it must be fixed to the power module and separately fixed by a fixing member provided on the heat sink.
The present invention has been made in view of such problems, and while ensuring miniaturization, it is possible to improve heat transfer, efficiently dissipate the power module, ensure insulation, and assemblability. It is an object of the present invention to provide a heat radiating structure for a power module and a motor control device having the same that can improve the cost and reduce the cost.

In order to solve the above problems, the present invention is configured as follows.
The invention according to claim 1 relates to a heat dissipation structure of a power module, a power module main body including a power semiconductor element, and a metal plate for transferring heat generated by the operation of the power semiconductor element to an external heat sink And the power module main body and the metal plate are integrally attached, and the metal plate is larger than a surface to which the metal plate is attached in the power module. It is said.
The invention according to claim 2 is the heat dissipation structure for the power module according to claim 1, wherein an insulating heat insulating portion having insulating properties and heat insulating properties is provided between the power module main body and the metal plate. It is characterized by.
According to a third aspect of the present invention, in the power module heat dissipation structure according to the second aspect, the insulating heat insulating portion is integrated with a member constituting an exterior of the power module main body. According to a fourth aspect of the present invention, in the power module heat dissipation structure according to the second or third aspect, a printed wiring board is disposed on an upper portion of the power module body opposite to the metal plate, and the insulation is provided. The heat insulation part has the attachment part of the said printed wiring board, It is characterized by the above-mentioned.
The invention described in claim 5 is characterized by a motor control device provided with the heat dissipation structure for a power module described in any one of claims 1 to 4.

According to the first aspect of the present invention, the contact area with the heat sink can be increased and a large amount of heat can be transmitted to the heat sink, so that the power module can be efficiently radiated.
According to the second aspect of the present invention, since the insulation between the heat sink and the electronic component mounted on the printed wiring board and the connection portion of the power module is performed by the insulating heat insulating portion, the exposed charging portion and the heat sink As a result, the electronic components can be mounted at a high density without being affected by the insulation and thermal effects. Can be achieved.
In addition, according to the invention described in claim 3, since it can be manufactured together with the exterior member of the power module main body, and the development and manufacture of the member can be simplified, the development cost and cost reduction and assembly of the electronic device can be reduced. Can be improved.
In addition, according to the invention described in claim 4, the printed wiring board mounting member provided on the heat sink can be reduced, and the development and production of the member can be simplified. Can be improved.
According to the invention described in claim 5, a remarkable cooling effect can be obtained by applying the power module heat dissipation structure described in any one of claims 1 to 4 to the inverter device.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is an exploded perspective view of a heat dissipation structure for a power module showing a first embodiment of the present invention, and shows only a portion related to the heat dissipation structure for the power module.
In the figure, 1 is a heat sink, 11 is a base, 12 is a fin, 2 is a power module body, 21 is a connection part, 22 is a power module exterior, 23 is a metal plate, 24 is an insulation heat insulating part, 25 is a mounting hole, 3 Is a printed wiring board, 4 is a mounting screw, and 5 is a stud.
The features of the present invention are as follows.
That is, the heat sink 1 is composed of a base 11 to which a component or the like can be attached on one surface, and a fin 12 provided on a surface opposite to this surface. The power module includes a power module main body 2 containing a power semiconductor element (not shown), a connection portion 21 for connecting a printed wiring board 3 mounted with a drive circuit component or the like on the power module main body 2, and a lower portion. And a metal plate 23 for transferring heat generated by the operation of the power semiconductor element (not shown) to the external heat sink 1 and between the power module body 2 and the metal plate 23 to provide insulation and heat insulation. And an insulating heat insulating part 24 integrated with a member constituting the exterior of the power module main body 2.
Further, the power module main body 2 and the metal plate 23 are integrally attached, and the surface of the metal plate 23 facing the power module main body 2 is made larger than the mounting surface of the metal plate 23 in the power module main body 2. It has become a thing.
The metal plate 23 is attached to the heat sink 1 through the attachment hole 25. Mounting screws 4 and studs 5 are used for mounting the power module main body 2, and among these, the studs 5 are also used for fixing the printed wiring board 3. Then, the number of screws and studs used for mounting the power module is not particularly specified as long as an appropriate pressure can be obtained.

The process of heat dissipation of the heat dissipation structure of the power module will be described.
Most of the heat generated in the power module main body 2 is transferred to a part of the metal plate 23 and diffused throughout. The metal plate 23 is provided with an insulating heat insulating portion 24 on one surface, and heat cannot be radiated to the outside through this portion. Moreover, since the other surface is a mounting surface to the heat sink 1 and is in contact with the heat sink 1 in a larger area than a conventional power module, a large amount of heat can be transferred to the heat sink 1. The heat transmitted evenly to the heat sink 1 is transferred from the base 11 to the fins 12 and is radiated to the atmosphere.

Accordingly, the first embodiment of the present invention includes a power module body including a power semiconductor element and a metal plate for transferring heat generated by the operation of the power semiconductor element to an external heat sink. In the module, the power module body and the metal plate are attached together, and the metal plate is made larger than the mounting surface of the metal plate in the power module, so that the contact area with the heat sink can be increased. , Can transfer a lot of heat to the heat sink. As a result, the heat dissipation of the power module can be performed efficiently.
In addition, in the power module, by providing an insulating heat insulating part having insulating properties and heat insulating properties on the surface opposite to the mounting surface of the metal plate, it is possible to ensure insulation between the exposed charged part and the heat sink and The influence of heat on the parts can be prevented, and the electronic parts can be mounted with high density without being affected by the insulation and the influence of heat, so that the electronic device can be miniaturized.
Furthermore, in the power module, since the insulating heat insulating part is integrated with the member constituting the exterior of the power module, it can be manufactured together with the exterior member of the power module, and the development and manufacture of the member can be simplified. Therefore, it is possible to reduce the development cost and cost of the electronic device and improve the assemblability.

FIG. 2 is an exploded perspective view of a heat dissipation structure for a power module showing a second embodiment of the present invention.
In FIG. 2, reference numeral 26 denotes a printed wiring board mounting portion.
The second embodiment is different from the first embodiment in that an insulating heat insulating portion 24 is provided on the insulating heat insulating portion 24 of the power module body 2 instead of the stud 5 provided for mounting the printed wiring board 3 on the heat sink 1. The integrated printed wiring board mounting portion 26 is provided.
Specifically, the heat sink 1 has an integrated power module body 2, a metal plate 23, and an insulating heat insulating part 24 fixed by mounting screws 4, and the printed wiring board 3 is integrated with the insulating heat insulating part 24. The printed wiring board mounting portion 26 and the connecting portion 21 of the power module main body 2 are attached on the power module main body 2.
Note that the heat dissipation process is the same as that of the first embodiment, and is omitted.

  Accordingly, in the second embodiment of the present invention, in the power module, the printed wiring board mounting member provided on the heat sink is provided by having the printed wiring board mounting portion on which the insulating heat insulating portion is disposed above. Since the development and production of members can be simplified, the cost reduction and assembly of electronic equipment can be improved.

  The present invention can be applied to all power modules in which a metal plate capable of transferring heat generated by the operation of a built-in power semiconductor element to the outside such as a heat sink is provided as a mounting surface.

The exploded perspective view of the heat dissipation structure of the power module which shows 1st Example of this invention The exploded perspective view of the heat dissipation structure of the power module which shows 2nd Example of this invention Sectional view showing the heat dissipation structure of a conventional power module

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Heat sink 11 Base 12 Fin 2 Power module 21 Connection part 22 Power module exterior 23 Metal plate 24 Insulation heat insulation part 25 Mounting hole 26 Printed wiring board mounting part 3 Printed wiring board 4 Mounting screw 5 Stud

Claims (5)

A power module body incorporating a power semiconductor element;
A metal plate for transferring heat generated by the operation of the power semiconductor element to an external heat sink;
In the power module with
A heat dissipation structure for a power module, wherein the power module main body and the metal plate are integrally attached, and the metal plate is larger than a mounting surface of the metal plate in the power module.   2. The heat radiation structure for a power module according to claim 1, wherein an insulating heat insulating portion having insulating properties and heat insulating properties is provided between the power module main body and the metal plate.   The heat insulating structure for a power module according to claim 2, wherein the insulating heat insulating portion is integrated with a member constituting an exterior of the power module main body.   3. The printed wiring board is disposed on an upper portion of the power module main body on the side opposite to the metal plate, and the insulating heat insulating portion includes a mounting portion for the printed wiring board. Or the heat radiation structure of the power module of 3.   The motor control apparatus provided with the thermal radiation structure of the power module of any one of Claims 1-4.

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