JP2008198923A - Coil parts - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a coil component for realizing high density mounting. <P>SOLUTION: The coil component includes a first coil conductor, a first lead-out electrode connected with the first coil conductor, a second coil conductor opposite to the first coil conductor, a second lead-out electrode connected with the second coil conductor, two or more insulating layer equipped with the first and second coil conductors and the first and second drawing electrodes, a main body 17 constituted by unifying these members, and outer electrodes 18-21 connected to the first and second coil conductors and the first and second drawing electrodes. A bump 22 is provided at the outer electrodes 18-21 located at an upper face 17b of the main body 17. At the same time, the outer electrodes 18-21 provided at an edge face 17a of the main body 17 is covered with insulating film 23. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a coil component used in various electronic devices such as digital devices, AV devices, and information communication terminals.

  As shown in FIGS. 11 and 12, this type of conventional coil component includes a plurality of insulating layers 1a to 1e and first to fourth conductors 2 provided on each of the plurality of insulating layers 1a to 1e. To 5, connecting the first conductor 2 and the second conductor 3, connecting the third conductor 4 and the fourth conductor 5, and further, The third conductor 4 is opposed to each other, and these are integrated to form the main body 6, and then external electrodes 7 a to 7 d are formed at both ends of the main body 6.

As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
JP 2003-1224028 A

  In the conventional coil component described above, the external electrodes 7a to 7d are formed at both ends of the main body 6. Therefore, when this coil component is mounted on the mounting board, solder fillets adhere to the outside of the external electrodes 7a to 7d. Thus, there is a problem that high-density mounting cannot be performed.

  The present invention solves the above-described conventional problems, and an object of the present invention is to provide a coil component that enables high-density mounting.

  In order to achieve the above object, the present invention has the following configuration.

  The invention according to claim 1 of the present invention includes a first coil conductor, a first extraction electrode whose one end is connected to one end of the first coil conductor via a first via, and A second coil conductor provided to face the first coil conductor, a second extraction electrode having one end connected to one end of the second coil conductor via a second via, A plurality of insulating layers provided on the upper surface with the first coil conductor and the second coil conductor, the first extraction electrode and the second extraction electrode, a main body formed by integrating them, and the first A coil conductor, a second coil conductor, a first extraction electrode, and four external electrodes connected to the other end of each of the second extraction electrodes, each of the four external electrodes being an end surface of the main body, Provided to be continuous with part of the upper surface and part of the lower surface, and on the upper surface of the main body A bump is disposed on the external electrode to be placed, and the external electrode provided on the end face of the main body is covered with an insulating film. According to this configuration, the external electrode provided on the end face of the main body is insulated. Since it is covered with a film, the solder fillet does not adhere to the outside of the end face of the external electrode, which enables high-density mounting by BGA (Ball Grid Array) with excellent occupation area and mounting performance. The effect of becoming is obtained.

  The invention according to claim 2 of the present invention is a first coil conductor, a first extraction electrode having one end connected to one end of the first coil conductor via a first via, and A second coil conductor provided to face the first coil conductor, a second extraction electrode having one end connected to one end of the second coil conductor via a second via, A plurality of insulating layers provided on the upper surface with the first coil conductor, the second coil conductor, the first extraction electrode and the second extraction electrode, a main body formed by integrating them, and an upper surface of the main body And four bumps connected to the other end of each of the first coil conductor, the second coil conductor, the first extraction electrode, and the second extraction electrode. Through the third via provided in the first coil conductor, the second coil conductor, The other end of each of the first extraction electrode and the second extraction electrode is connected to the bump. According to this configuration, the bump provided on the upper surface of the main body, the first coil conductor, the first Since the extraction electrode, the second coil conductor, and the second extraction electrode are connected via the third via provided inside the main body, there is no need to form an external electrode on the end face of the main body. As a result, the solder fillet is not attached, so that it is possible to achieve high density mounting by BGA having excellent occupied area and mounting performance and to simplify the method of forming the external electrode.

  In the invention according to claim 3 of the present invention, in particular, the first via connected to the first coil conductor is formed inside the spiral or spiral second coil conductor. According to the present invention, the bump forming position connected to the first lead electrode is equivalent to the amount of the first via connecting the first coil conductor and the first lead electrode formed inside the second coil conductor. Since it can be made inside, it is possible to prevent the solder fillet from adhering without enlarging the main body, thereby obtaining the effect of enabling higher density mounting.

  In the invention according to claim 4 of the present invention, in particular, a magnetic part is provided around the first via formed in the insulating layer located between the first coil conductor and the second coil conductor. Thus, according to this configuration, since the magnetic fields generated by the first coil conductor and the second coil conductor can be passed through the magnetic part, the magnetic force between the first coil conductor and the second coil conductor can be reduced. The coupling can be strengthened, and thereby, an effect of being able to remove more common mode noise can be obtained.

  In the invention according to claim 5 of the present invention, in particular, the bump and the first coil conductor, the second coil conductor, the first extraction electrode, and the second extraction electrode, which are positioned at the top The insulating layer in between is made of a material having a dielectric constant lower than that of the other insulating layer. According to this structure, the bump, the first coil conductor, the second coil conductor, and the first lead Since the stray capacitance between the electrode and the second extraction electrode can be reduced, an effect of removing common mode noise in a higher frequency band can be obtained.

  As described above, in the coil component of the present invention, four external electrodes are provided so as to be continuous with the end surface of the main body, a part of the upper surface and a part of the lower surface, respectively, and bumps are provided on the external electrodes located on the upper surface of the main body. Since the external electrode provided on the end face of the main body is covered with an insulating film, the solder fillet is not attached to the outside of the end face of the external electrode. This provides an excellent effect of enabling high-density mounting by BGA having excellent performance.

(Embodiment 1)
Hereinafter, the first aspect of the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view of a common mode noise filter that is an example of a coil component according to Embodiment 1 of the present invention, and FIG. 2 is an exploded perspective view of the common mode noise filter.

  The common mode noise filter according to the first to third embodiments of the present invention is mounted with the surface on which the bump is formed facing down. A description will be given of bumps formed thereon.

  Therefore, the description and embodiment of the claims of the present invention and the mounted common mode noise filter are upside down.

  As shown in FIG. 1 and FIG. 2, the common mode noise filter according to the first exemplary embodiment of the present invention includes a first coil conductor 11 and one end portion 12 a that are connected to one end portion 11 a of the first coil conductor 11 and the first coil conductor 11. The first lead electrode 12 connected through the via 13a, the second coil conductor 14 provided so as to face the first coil conductor 11, and the one end 15a of the second coil conductor 14, a second extraction electrode 15 connected to one end portion 14 a of the first electrode 14 via a second via 13 b, the first coil conductor 11, the first extraction electrode 12, the second coil conductor 14, and the second A plurality of insulating layers 16a to 16d having an extraction electrode 15 on the upper surface, a main body 17 formed by integrating them, the first coil conductor 11, the first extraction electrode 12, and the second coil conductor 14 , Each of the second extraction electrodes 15 The other end portion 11b, 12b, 14b, in which and a 15b and four first through connected fourth external electrodes 18-21.

  The first to fourth external electrodes 18 to 21 are provided so as to be continuous with the end surface 17a of the main body 17, a part of the upper surface 17b, and a part of the lower surface 17c, respectively, and are positioned on the upper surface 17b of the main body 17. The bumps 22 are disposed on the external electrodes 18 to 21, and the external electrodes 18 to 21 provided on the end surface 17 a of the main body 17 are covered with an insulating film 23.

  In the above configuration, the first coil conductor 11 is formed in a spiral shape by plating a conductive material such as silver, and is provided on the upper surface of the second insulating layer 16b.

  The first extraction electrode 12 is formed by plating a conductive material, and is provided on the upper surface of the first insulating layer 16a located below the second insulating layer 16b. The first via 13a is provided at a predetermined location of the second insulating layer 16b, and the one end 12a of the first extraction electrode 12 is connected to the one end 11a of the first coil conductor 11 and the first via. 13a is connected.

  The second coil conductor 14 is formed in a spiral shape by plating a conductive material such as silver, and is provided on the upper surface of the third insulating layer 16c located above the second insulating layer 16b. ing. The second coil conductor 14 is provided so as to face the first coil conductor 11.

  The second extraction electrode 15 is formed by plating a conductive material, and is provided on the upper surface of the fourth insulating layer 16d located above the third insulating layer 16c. A second via 13b is provided at a predetermined location of the fourth insulating layer 16d, and one end 15a of the second extraction electrode 15 is connected to one end 14a of the second coil conductor 14 and the second end 14a. They are connected via vias 13b. A fifth insulating layer 16e is provided on the upper surface of the second extraction electrode 15, and the first via 13a and the second via 13b are configured by filling a through hole with a conductor. is doing.

  The first to fifth insulating layers 16a to 16e are made of an insulating material, and the third insulating layer 16c is made of a nonmagnetic material such as Cu—Zn ferrite or glass ceramic, The second, fourth, and fifth insulating layers 16a, 16b, 16d, and 16e are made of Ni—Zn ferrite that is a magnetic material.

  The main body 17 includes the first coil conductor 11, the first extraction electrode 12, the second coil conductor 14, the second extraction electrode 15, and the first to fifth insulating layers 16a to 16e as described above. Constructed by laminating and uniting in composition.

  Further, first to fourth external electrodes 18 to 21 are provided on the end surface 17a, a part of the upper surface 17b and a part of the lower surface 17c of the main body 17 so as to be continuous with each other. These are formed by printing silver, and the surface thereof is further provided with a nickel plating layer and a tin plating layer.

  In addition, the other end portion 11 b of the first coil conductor 11 and the first external electrode 18, the other end portion 12 b of the first lead electrode 12, the second external electrode 19, and the second coil conductor 14 are also included. The end 14 b and the third external electrode 20, the other end 15 b of the second extraction electrode 15 and the fourth external electrode 21 are connected to each other, and further, the first to fourth positions located on the upper surface 17 b of the main body 17. The external electrodes 18 to 21 are connected with externally connected I / O bumps 22 formed by coating the surface of a spherical solder ball mainly composed of tin or a metal sphere mainly composed of copper with tin or the like. ing. The first to fourth external electrodes 18 to 21 located on the end surface 17a of the main body 17 are covered with an insulating film 23 made of epoxy resin or the like.

  When this common mode noise filter is mounted on a mounting board, the body 17 is turned upside down, and the bump 22 and the mounting solder are joined with the surface on which the bumps 22 are formed facing down. Mount the mode noise filter on the mounting board.

  The first coil conductor 11, the first extraction electrode 12, the second coil conductor 14, and the second extraction electrode 15 are not formed by plating, but are formed by other methods such as printing or vapor deposition. May be. Further, the first to fifth insulating layers 16a to 16e may be composed of a plurality of sheets instead of being composed of one sheet as shown in FIG.

  Next, a method for manufacturing a common mode noise filter that is an example of the coil component according to Embodiment 1 of the present invention will be described.

  1 and 2, first, a predetermined number of rectangular first to fifth insulating layers 16a to 16e are respectively produced from a mixture of magnetic material and non-magnetic material powder and resin as raw materials. At this time, a predetermined portion of the second insulating layer 16b and the fourth insulating layer 16d is drilled by laser, punching or the like, and the holes are filled with silver to fill the first via 13a and the second via 13b. Form.

  Next, the first extraction electrode 12 is formed on the upper surface of the first insulating layer 16a by plating.

  Next, the second insulating layer 16b provided with the first via 13a is laminated on the upper surface of the first extraction electrode 12. At this time, the one end portion 12a of the first extraction electrode 12 and the first via 13a are connected.

  Next, the first coil conductor 11 is formed in a spiral shape on the upper surface of the second insulating layer 16b by plating. At this time, the one end portion 11a of the first coil conductor 11 and the first via 13a are connected.

  Next, the third insulating layer 16c is laminated on the upper surface of the first coil conductor 11, and then the second coil conductor 14 is formed in a spiral shape on the upper surface of the third insulating layer 16c by plating.

  Next, a fourth insulating layer 16 d provided with a second via 13 b is laminated on the upper surface of the second coil conductor 14. At this time, the one end portion 14a of the second coil conductor 14 and the second via 13b are connected.

  Next, the second extraction electrode 15 is formed on the upper surface of the fourth insulating layer 16d by plating. At this time, the one end 15a of the second extraction electrode 15 and the second via 13b are connected.

  The first coil conductor 11, the first extraction electrode 12, the second coil conductor 14, and the second extraction electrode 15 are formed in a predetermined pattern shape on a separately prepared base plate (not shown). The conductor is formed by plating, and then formed by transferring the conductor to each insulator layer.

  Next, the main body 17 is configured by laminating and integrating the fifth insulating layer 16 e on the upper surface of the second extraction electrode 15.

  Next, the main body 17 is baked for a predetermined time at a temperature of about 900 ° C., and then the first to fourth external electrodes 18 are continuous with the end surface 17a, a part of the upper surface 17b, and a part of the lower surface 17c. To 21 are formed. The first to fourth external electrodes 18 to 21 are formed by printing silver. At this time, the other end 11 b of the first coil conductor 11 and the first external electrode 18, the other end 12 b of the first extraction electrode 12, the second external electrode 19, and the other end of the second coil conductor 14 The portion 14b is connected to the third external electrode 20, and the other end portion 15b of the second extraction electrode 15 is connected to the fourth external electrode 21.

  Next, a nickel plating layer and a tin plating layer are formed on the surfaces of the first to fourth external electrodes 18 to 21 by plating.

  Finally, the first to fourth external electrodes 18 to 21 located on the end surface 17a of the main body 17 are covered with the insulating film 23, and the first to fourth external electrodes 18 to 21 located on the upper surface 17b of the main body 17 are covered. A spherical metal is placed on the upper surface and heated at about 200 ° C. to 260 ° C. to connect the bumps 22 to the first to fourth external electrodes 18 to 21.

  In the first embodiment of the present invention described above, the first to fourth external electrodes 18 to 21 provided on the end surface 17a of the main body 17 are covered with the insulating film 23. In the coil component in which the solder fillets are not attached to the outside of the end faces of the external electrodes 18 to 21, thereby, a plurality of insulating layers 16 a to 16 e, a plurality of conductors 11 and 14, and lead electrodes 12 and 15 are laminated. In addition, it is possible to obtain an effect that high density mounting by BGA having excellent occupation area and mounting performance becomes possible.

  Further, in the first embodiment of the present invention, the intended purpose can be achieved simply by adding the bump 22 and the insulating film 23 to the conventional configuration as shown in FIGS. Furthermore, since the conventional production equipment can be used as it is, an effect that a common mode noise filter capable of high-density mounting can be obtained easily is obtained.

  In the common mode noise filter according to the first embodiment of the present invention, the first to fifth insulating layers 16a to 16e have been described using magnetic materials made of ferrite and nonmagnetic materials. As shown in FIG. 6, a part of the first to fifth insulating layers 16a to 16e formed of a resin 17d such as polyimide and a coil conductor on the upper surface thereof may be used.

(Embodiment 2)
Hereinafter, the second and fifth aspects of the present invention will be described with reference to the drawings.

  4 is a perspective view of a common mode noise filter that is an example of a coil component according to Embodiment 2 of the present invention, FIG. 5 is a top view of the common mode noise filter, and FIG. 6 is an exploded perspective view of the common mode noise filter. is there. In the second embodiment of the present invention, components having the same configurations as those of the first embodiment of the present invention are denoted by the same reference numerals, and the description thereof is omitted.

  4 to 6, the second embodiment of the present invention is different from the first embodiment of the present invention described above in that the first to fourth external electrodes 18 to 21 are not formed and the first embodiment The other end portions 11b, 12b, 14b, and 15b of the coil conductor 11, the first extraction electrode 12, the second coil conductor 14, and the second extraction electrode 15 and the bumps 22 are respectively connected to the third via 13c. It is a point that I tried to connect.

  In this case, four third vias 13c are formed, and the third via 13c connected to the other end 12b of the first extraction electrode 12 is the second to fifth insulating layers 16b to 16e. The third via 13c formed in the first coil conductor 11 and connected to the other end 11b of the first coil conductor 11 is formed in the third to fifth insulating layers 16c to 16e. The third via 13c connected to the end portion 14b is formed in the fourth to fifth insulating layers 16d to 16e, and is also connected to the other end portion 15b of the second extraction electrode 15. Is formed on the fifth insulating layer 16e. As a result, the other end portions 11 b, 12 b, 14 b, and 15 b are pulled out to the upper surface of the main body 17 and are connected to the four bumps 22 formed on the upper surface of the main body 17.

  Four electrode pads 24 are formed on the upper surface of the main body 17 in order to form the bumps 22. The electrode pad 24 is composed of Ag, Ni, and Sn in order from the bottom. That is, it is configured by printing Ag on the upper surface of the main body 17 and curing it, and then plating Ni and Sn respectively.

  The electrode pad 24 is connected to the third via 13c, whereby each of the first coil conductor 11, the first extraction electrode 12, the second coil conductor 14, and the second extraction electrode 15 is connected. The other end portions 11b, 12b, 14b, 15b and the bump 22 are connected via the third via 13c without passing through the first to fourth external electrodes 18-21.

  The third via 13c is provided outside the outermost portions of the first coil conductor 11 and the second coil conductor 14, and is formed by filling a through hole with a conductor.

  With the above-described configuration, it is not necessary to form the external electrodes 18 to 21 on the end surface 17a of the main body 17, so that the solder fillet is not attached, and thereby, the plurality of insulating layers 16a to 16e and the plurality of insulating layers 16a to 16e are formed. In the coil component in which the conductors 11 and 14 and the lead electrodes 12 and 15 are stacked, high density mounting by BGA having excellent occupied area and mounting performance is possible, and the insulating film 23 is not required, so that the construction method is simple. It is possible to obtain the effect that

  In addition, the stacking direction of the first coil conductor 11, the second coil conductor 14, the first extraction electrode 12, and the second extraction electrode 15 and the external electrode are parallel (opposite), Although the stray capacitance between the first coil conductor 11, the second coil conductor 14, the first extraction electrode 12, the second extraction electrode 15 and the external electrode is increased, the present invention does not use the external electrode. Since a via is used, the diameter of the via is usually smaller than the width of the external electrode, whereby the first coil conductor 11, the second coil conductor 14, the first extraction electrode 12, and the second extraction electrode 15. Since the stray capacitance between the first via 13c and the third via 13c can be reduced, common mode noise in a higher frequency band can be removed.

  Also, between the bump 22 and the second extraction electrode 15 located at the top of the first coil conductor 11, the second coil conductor 14, the first extraction electrode 12, and the second extraction electrode 15. If the fifth insulating layer 16e is made of a material having a dielectric constant lower than that of the other insulating layers 16a to 16d, the bump 22, the first coil conductor 11, the second coil conductor 14, and the second coil conductor Since the stray capacitance between the first extraction electrode 12 and the second extraction electrode 15 can be reduced, common mode noise in a higher frequency band can be removed.

(Embodiment 3)
Hereinafter, the third embodiment of the present invention will be described with reference to the drawings.

  FIG. 7 is an exploded perspective view of a common mode noise filter which is an example of a coil component according to Embodiment 3 of the present invention, and FIG. 8 is a top view of the main part of the common mode noise filter. In the third embodiment of the present invention, components having the same configurations as those of the first and second embodiments of the present invention are denoted by the same reference numerals, and the description thereof is omitted.

  7 and 8, the third embodiment of the present invention is different from the second embodiment of the present invention described above in that the first via 13a connected to the first coil conductor 11 is spirally or This is a point formed inside the spiral second coil conductor 14. Here, the “inner side” of the second coil conductor 14 means that the second coil conductor 14 is further in the center of the spiral / spiral than the part of the second coil conductor 14 located at the center of the spiral / spiral most. .

  FIG. 8 shows only the third insulating layer 16c, the first extraction electrode 12, the second coil conductor 14, and the second extraction electrode 15 for the sake of simplicity.

  In this case, the second coil conductor 14 has a spiral shape, and the first extraction electrode 12 connected to the first coil conductor 11 is the first extraction electrode 15 connected to the second coil conductor 14. The third via 13c connected to the other end portion 12b of the first extraction electrode 12 is formed only on the fifth insulating layer 16e. Yes. A first via 13a connecting the first coil conductor 11 and the first lead electrode 12 is formed in a third insulating layer 16c and a fourth insulating layer 16d, and further, the first coil conductor is formed. The third via 13c connected to the other end 11b of the eleventh is formed in the third to fifth insulating layers 16c to 16e as in the second embodiment of the present invention. In addition, the second coil conductor 14 may have a spiral shape.

  With the above-described configuration, the first lead electrode 12 and the first lead electrode 12 are connected to the first coil conductor 11 by the amount formed in the second coil conductor 14 so as to connect the first coil conductor 11 and the first lead electrode 12. Since the formation position of the bumps 22 to be connected can be provided on the inner side, it is possible to prevent the solder fillet from adhering without enlarging the main body 17, thereby enabling higher density mounting with a small shape. The effect of becoming is obtained.

  Further, as shown in FIG. 9 and FIG. 10, the magnetic field around the first via 13 a formed in the third insulating layer 16 c located between the first coil conductor 11 and the second coil conductor 14. If the portion 25 is provided, the magnetic field generated in the first coil conductor 11 and the second coil conductor 14 can be passed through the magnetic portion 25, so that the first coil conductor 11 and the second coil The magnetic coupling with the conductor 14 can be strengthened, thereby obtaining an effect that more common mode noise can be removed.

  10 shows only the third insulating layer 16c, the first via 13a connected to the first coil conductor 11, and the magnetic part 25 for the sake of simplicity.

  In the coil parts according to the first to third embodiments of the present invention, a pair of coil conductors has been described. However, two or more pairs of coil conductors may be formed to form an array type.

  In the coil component of the present invention, the common mode noise filter has been described as an example. However, the present invention can be applied to other coil components such as chip beads.

  The coil component according to the present invention has an effect that high-density mounting is possible, and is useful in coil components used for various electronic devices such as digital devices, AV devices, and information communication terminals. is there.

The perspective view of the common mode noise filter which is an example of the coil components in Embodiment 1 of this invention Exploded perspective view of the common mode noise filter Perspective view showing another example of the common mode noise filter The perspective view of the common mode noise filter which is an example of the coil components in Embodiment 2 of this invention Top view of the common mode noise filter Exploded perspective view of the common mode noise filter The disassembled perspective view of the common mode noise filter which is an example of the coil components in Embodiment 3 of this invention Top view of the main part of the common mode noise filter An exploded perspective view showing another example of the common mode noise filter Top view of the main part showing another example of the common mode noise filter Perspective view of conventional coil parts Exploded perspective view of the coil component

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 1st coil conductor 11a One end part of 1st coil conductor 11b Other end part of 1st coil conductor 12 1st extraction electrode 12a One end part of 1st extraction electrode 12b Other end part of 1st extraction electrode 13a first via 13b second via 13c third via 14 second coil conductor 14a one end of the second coil conductor 14b other end of the second coil conductor 15 second extraction electrode 15a second One end portion of extraction electrode 15b Other end portion of second extraction electrode 16a to 16e First to fifth insulating layers 17 Main body 17a End surface of main body 17b Upper surface of main body 17c Lower surface of main body 18 to 21 First to fourth outer portions Electrode 22 Bump 23 Insulating film 25 Magnetic part

Claims (5)

A first coil conductor, a first lead electrode connected at one end to the one end of the first coil conductor via a first via, and the first coil conductor so as to face the first coil conductor; The second coil conductor, the second lead electrode whose one end is connected to the one end of the second coil conductor via the second via, the first coil conductor and the second coil conductor And a plurality of insulating layers provided on the upper surface with the first extraction electrode and the second extraction electrode, a main body formed by integrating them, the first coil conductor, the second coil conductor, the first And four external electrodes connected to the other end portions of the extraction electrode and the second extraction electrode, respectively, and the four external electrodes are respectively connected to the end surface of the main body, a part of the upper surface, and a part of the lower surface. And bumps are arranged on the external electrodes located on the upper surface of the main body. With coil component in which the said external electrodes provided on an end face of the body is covered with an insulating film. A first coil conductor, a first lead electrode connected at one end to the one end of the first coil conductor via a first via, and the first coil conductor so as to face the first coil conductor; The second coil conductor, the second lead electrode whose one end is connected to the one end of the second coil conductor via the second via, the first coil conductor and the second coil conductor And a plurality of insulating layers provided on the upper surface with the first extraction electrode and the second extraction electrode, a main body formed by integrating them, a first coil conductor formed on the upper surface of the main body, Four bumps connected to the other end of each of the second coil conductor, the first extraction electrode, and the second extraction electrode, and through the third via provided in the body Of the first coil conductor, the second coil conductor, the first extraction electrode, and the second extraction electrode The other end a coil component that connects the bumps respectively. The coil component according to claim 2, wherein the first via connected to the first coil conductor is formed inside the spiral or spiral second coil conductor. The coil component according to claim 3, wherein a magnetic part is provided around the first via formed in the insulating layer located between the first coil conductor and the second coil conductor. The insulating layer between the bump and the first coil conductor, the second coil conductor, the first lead electrode, and the uppermost portion of the second lead electrode is made to have a dielectric constant higher than that of the other insulating layers. The coil component according to claim 2, wherein the coil component is made of a material having a low dielectric constant.

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