JP2008198959A - Method for manufacturing piezoelectric actuator and method for manufacturing liquid transfer device - Google Patents

Abstract

Provided is a method of manufacturing a piezoelectric actuator that can easily prevent the formation of a piezoelectric layer on the surface of a recess formed in a diaphragm when the piezoelectric layer is formed by an aerosol deposition method.
First, a recess 40 is formed at a position corresponding to a pressure chamber 14 on the upper surface of a vibration plate 30. Next, the recess 40 of the diaphragm 30 is filled with a low elastic material 50 having a lower elastic modulus than the diaphragm 30 and having fluidity. Then, an aerosol containing particles of piezoelectric material and a carrier gas is sprayed on the upper surface of the vibration plate 30 to form the piezoelectric layer 31. At this time, since the particles of the piezoelectric material do not adhere to the surface of the low elastic material 50 filled in the recess 40, the piezoelectric layer 31 can be formed only in the region excluding the surface of the low elastic material 50.
[Selection] Figure 7

Description

  The present invention relates to a method for manufacturing a piezoelectric actuator and a method for manufacturing a liquid transfer device.

  2. Description of the Related Art Conventionally, an inkjet head that ejects ink from a nozzle includes a piezoelectric actuator that applies ejection pressure to ink using piezoelectric deformation (piezoelectric strain) when an electric field acts on a piezoelectric material layer. ing.

  For example, a piezoelectric actuator for an inkjet head described in Patent Document 1 includes a metal diaphragm that covers a plurality of pressure chambers formed in a flow path unit, a piezoelectric layer disposed on the upper surface of the diaphragm, and a piezoelectric layer. And a plurality of individual electrodes respectively disposed in regions facing the plurality of pressure chambers. And this piezoelectric actuator is a diaphragm by contraction of the piezoelectric layer when a predetermined drive voltage is applied between the individual electrode on the upper surface of the piezoelectric layer and the diaphragm as a common electrode located below the piezoelectric layer. It is comprised so that bending deformation may be produced. Then, when the volume of the pressure chamber changes according to the deformation of the diaphragm, the ejection pressure is applied to the ink in the pressure chamber.

  Moreover, in the piezoelectric actuator of this patent document 1, the recessed part (groove | channel) is formed in the upper surface of a diaphragm. As this recessed part, what was formed in the area | region facing a pressure chamber, and what was formed in the outer side area | region which does not oppose a pressure chamber are disclosed. Then, the piezoelectric layer is formed by depositing particles of the piezoelectric material using the aerosol deposition method (AD method) or the like over the entire upper surface of the diaphragm including the concave portion. Then, since particles are less likely to deposit in the recesses than in the surrounding flat region, the piezoelectric layer is locally thinned in the region where the recesses of the diaphragm are formed. As a result, in the region where the recess is formed, the thickness of both the diaphragm and the piezoelectric layer, that is, the rigidity of the piezoelectric actuator is locally reduced.

  When the concave portion of the diaphragm is disposed in a region facing the pressure chamber, the diaphragm is easily deformed in the region facing the pressure chamber. That is, it is possible to reduce the driving voltage necessary for obtaining a desired deformation amount (that is, the volume change amount of the pressure chamber). Further, when the concave portion of the diaphragm is disposed in a region between adjacent pressure chambers, pressure fluctuation (crosstalk) due to the mutual propagation of the deformation of the diaphragm between these adjacent pressure chambers. Is suppressed.

JP 2006-96034 A

  From the viewpoint of accelerating the deformation of the diaphragm in the region facing the pressure chamber and reducing the driving voltage, or suppressing crosstalk between adjacent pressure chambers, the piezoelectric actuator in the region where the recess is formed In order to further reduce the rigidity, it is preferable that no piezoelectric material is deposited on the surface of the recess. However, in the piezoelectric actuator of Patent Document 1, the amount of piezoelectric material deposited in the recess is less than that in a flat region other than the recess, but is somewhat deposited. Although it is possible to remove the piezoelectric layer deposited in the concave portion using a laser or the like, it is necessary to remove the piezoelectric layer in a necessary region with high processing accuracy so as not to remove the piezoelectric layer in a necessary region. Therefore, the manufacturing cost increases due to the increase of such processes.

  An object of the present invention is to provide a method of manufacturing a piezoelectric actuator that can easily prevent the formation of a piezoelectric layer on the surface of a recess when the piezoelectric layer is formed on the surface of a diaphragm having the recess by an AD method. Is to provide.

According to a first aspect of the present invention, there is provided a method of manufacturing a piezoelectric actuator, comprising: a vibration plate that is bonded to one surface of a base material that includes a deformation permissible portion so as to cover the deformation permissible portion; A piezoelectric layer disposed on a laminated surface opposite to the surface, a first electrode disposed on one surface of the piezoelectric layer, and a second electrode disposed on the other surface of the piezoelectric layer; A method of manufacturing a piezoelectric actuator including:
A recess forming step of forming a recess at a position corresponding to the deformation-permitting portion of the laminated surface of the diaphragm; and an elastic modulus lower than the laminated surface of the diaphragm in the recessed portion of the diaphragm; and A low-elastic material filling step of filling a low-elastic material having fluidity, and an aerosol containing piezoelectric material particles and a carrier gas is sprayed onto the laminated surface of the diaphragm, and the concave portion is filled. And a piezoelectric layer forming step of forming the piezoelectric layer by depositing particles of the piezoelectric material in a region excluding the surface of the low elastic material.

  In the manufacturing method of the piezoelectric actuator of the present invention, after filling the concave portion of the diaphragm with a low elastic material having a smaller elastic modulus than the diaphragm, an aerosol containing particles of the piezoelectric material and a carrier gas is sprayed on the diaphragm, The piezoelectric layer is formed by causing the particles to collide with the vibration plate and depositing them. Here, when aerosol is sprayed on the surface of the diaphragm provided with the low elastic material, adhesion of material particles is inhibited on the surface of the low elastic material having a low elastic modulus (that is, low surface hardness). Is known (see JP 2005-317952 A). Therefore, the piezoelectric material particles are not deposited on the surface of the low elastic material filled in the recesses, and the piezoelectric layer 31 is formed only in a region other than the surface of the low elastic material 50. In other words, before forming the piezoelectric layer by the AD method, it is possible to prevent the piezoelectric layer from being formed on the surface of the concave portion formed in the vibration plate by adding a simple process of filling the concave portion with a low elastic material. it can.

  In addition, since a low elastic material having fluidity is used, the low elastic material can be easily filled into the recesses. Further, since the concave portion is formed in the diaphragm in advance and filled with the low elastic material, the low elastic material having fluidity can be fixed in a predetermined region where the formation of the piezoelectric layer is desired to be prevented.

  The method for manufacturing a piezoelectric actuator according to a second aspect of the invention is characterized in that, in the first aspect of the invention, the method further comprises a removing step of removing the low-elasticity material after the piezoelectric layer forming step. As described above, after the piezoelectric layer is formed, the low elastic material in the recess is removed, whereby the rigidity of the piezoelectric actuator in the region where the recess is formed in the diaphragm is further reduced.

  The method for manufacturing a piezoelectric actuator according to a third aspect of the present invention further includes a heat treatment step in which heat treatment is performed on the piezoelectric layer after the step of forming the piezoelectric layer in the second aspect, and the thermal decomposition temperature of the low elastic material is The temperature is lower than the heat treatment temperature of the piezoelectric layer in the heat treatment step.

  When the piezoelectric layer is formed by the AD method, particle miniaturization or lattice defects occur due to collision with the diaphragm, and as such, the piezoelectric characteristics necessary for deforming the diaphragm cannot be obtained. There are many. Therefore, in order to improve the piezoelectric characteristics, heat treatment (annealing) is usually performed on the piezoelectric layer formed by the AD method. Here, in the present invention, since the thermal decomposition temperature of the low elastic material is lower than the heat treatment temperature (annealing temperature) of the piezoelectric layer, the low elastic material is thermally decomposed and dissipated during the heat treatment. That is, since the heat treatment of the piezoelectric layer and the removal of the low elastic material can be performed simultaneously, the manufacturing process of the piezoelectric actuator can be shortened.

  The method for manufacturing a piezoelectric actuator according to a fourth aspect of the present invention is the method for manufacturing a piezoelectric actuator according to any one of the first to third aspects, wherein in the recess forming step, at least a region of the laminated surface of the diaphragm facing the deformation allowing portion. The concave portion is formed. In this way, the concave portion is formed in the region facing the deformation allowing portion of the diaphragm, and the piezoelectric layer is not deposited on the surface of the concave portion, so that the diaphragm is deformed in the region facing the deformation allowing portion. Therefore, the drive voltage can be reduced.

  The method for manufacturing a piezoelectric actuator according to a fifth aspect of the present invention is the method for manufacturing a piezoelectric actuator according to the fourth aspect, wherein, in the recess formation step, the recess is formed in a region of the laminated surface of the diaphragm facing the peripheral edge of the deformation allowing portion. It is characterized by doing. In this case, the piezoelectric layer is formed in a region facing the central portion of the deformation-permitting portion where no recess is formed. Therefore, by disposing the first electrode and the second electrode so as to sandwich the piezoelectric layer, the central region where the piezoelectric layer is formed is a driving region in which the piezoelectric layer contracts itself and the diaphragm is deformed. It becomes. On the other hand, a piezoelectric layer is not formed in a region facing the peripheral portion of the deformation allowing portion, and this region becomes a driven region that is deformed in accordance with the deformation of the diaphragm caused by the drive region.

  In the method of manufacturing a piezoelectric actuator according to a sixth aspect of the present invention, in the fourth aspect of the invention, in the concave portion forming step, the concave portion is formed in a region of the laminated surface of the diaphragm facing the central portion of the deformation allowing portion. It is characterized by doing. In this case, the piezoelectric layer is formed in a region facing the peripheral edge of the deformation-permitting portion where no recess is formed. Therefore, by arranging the first electrode and the second electrode so as to sandwich the piezoelectric layer, the peripheral region where the piezoelectric layer is formed is a driving region in which the piezoelectric layer contracts itself and the diaphragm is deformed. It becomes. On the other hand, the piezoelectric layer is not formed in a region facing the central portion of the deformation allowing portion, and this region becomes a driven region that is deformed in accordance with the deformation of the diaphragm caused by the drive region.

  According to a seventh aspect of the present invention, there is provided a piezoelectric actuator manufacturing method according to any one of the first to third aspects, wherein the base material has a plurality of deformation permissible portions and a partition wall that separates the plurality of deformation permissible portions. In the recess forming step, the recess is formed in at least a region of the laminated surface of the diaphragm facing the partition wall. In this way, by forming a recess in the region facing the partition wall of the diaphragm and further preventing the piezoelectric layer from being deposited on the surface of the recess, vibration is generated between the two deformation-permitted portions separated by the partition wall. The deformation of the plate is difficult to propagate and crosstalk is suppressed.

In the piezoelectric actuator manufacturing method according to an eighth aspect of the invention, the diaphragm is made of a metal material, and the first electrode is always held at a predetermined reference potential, while the second electrode is One of two kinds of potentials, a predetermined driving potential different from the reference potential and the reference potential, is selectively applied,
An insulating layer forming step of forming an insulating layer so as to cover the concave portion on the laminated surface after forming the concave portion on the laminated surface of the diaphragm in the concave portion forming step; and the concave portion on the surface of the insulating layer; A first electrode forming step of forming the first electrode in a non-opposing region; and forming the piezoelectric layer so as to cover the first electrode on a surface of the insulating layer in the piezoelectric layer forming step; And a second electrode forming step of forming the second electrode in a region facing the first electrode on the surface opposite to the diaphragm.

  When the diaphragm is made of a metal material, the recess can be easily formed by etching. However, since no piezoelectric material is deposited on the surface of the recess when the piezoelectric layer is formed, if the surface of the recess is left exposed, the surface of the recess of the conductive diaphragm and the opposite side of the diaphragm of the piezoelectric layer There is a possibility that a short circuit may occur with the second electrode disposed in the. However, in the present invention, since the insulating layer is formed on the laminated surface of the diaphragm so as to cover the recess, a short circuit between the diaphragm and the second electrode is reliably prevented. Further, the first electrode disposed on the surface of the piezoelectric layer on the vibration plate side is insulated from the conductive vibration plate by the insulating layer covering the vibration plate. Furthermore, since the first electrode is covered with the piezoelectric layer, a short circuit between the first electrode and the second electrode is also prevented.

According to a ninth aspect of the invention, there is provided a liquid transfer device manufacturing method comprising: a flow path unit in which a liquid flow path including a pressure chamber is formed; and a piezoelectric actuator disposed on one surface of the flow path unit; A diaphragm that is bonded to one surface of the flow path unit so as to cover the pressure chamber, and a piezoelectric layer that is disposed on a laminated surface of the vibration plate opposite to the bonding surface with the flow path unit. A method of manufacturing a liquid transfer device, comprising: a first electrode disposed on one surface of the piezoelectric layer; and a second electrode disposed on the other surface of the piezoelectric layer,
A concave portion forming step of forming a concave portion at a position corresponding to the pressure chamber of the laminated surface of the diaphragm; and an elastic modulus lower than the laminated surface of the diaphragm in the concave portion of the diaphragm; and A low-elastic material filling step of filling a low-elastic material having fluidity, and an aerosol containing particles of a piezoelectric material and a carrier gas is sprayed on the laminated surface of the diaphragm so that the low-filled material is filled in the recess. And a piezoelectric layer forming step of forming the piezoelectric layer by depositing particles of the piezoelectric material in a region excluding the surface of the elastic material.

  In the method for manufacturing a liquid transfer device according to the present invention, the concave portion of the diaphragm is filled with a low elastic material having a smaller elastic modulus than the diaphragm, and then the piezoelectric layer is formed on the diaphragm by the aerosol deposition method. Here, when the aerosol containing the particles of the piezoelectric material and the carrier gas is sprayed on the surface of the diaphragm provided with the low elastic material, the deposition of the piezoelectric material is inhibited on the surface of the low elastic material. Therefore, before the piezoelectric layer is formed by the AD method, it is possible to prevent the piezoelectric layer from being formed on the surface of the concave portion formed in the vibration plate by adding a simple process of filling the concave portion with a low elastic material. it can. That is, it is possible to easily manufacture a piezoelectric actuator that can realize further reduction in driving voltage and suppression of crosstalk.

  In addition, since a low elastic material having fluidity is used, the low elastic material can be easily filled into the recesses. Further, since the concave portion is formed in the diaphragm in advance and filled with the low elastic material, the low elastic material having fluidity can be fixed in a predetermined region where the formation of the piezoelectric layer is desired to be prevented.

  According to the present invention, the piezoelectric layer is formed on the surface of the concave portion formed in the vibration plate by adding a simple process of filling the concave portion with a low elastic material before forming the piezoelectric layer by the AD method. Can be prevented. In addition, since a low elastic material having fluidity is used, the low elastic material can be easily filled into the recesses. Further, since the concave portion is formed in the diaphragm in advance and filled with the low elastic material, the low elastic material having fluidity can be fixed in a predetermined region where the formation of the piezoelectric layer is desired to be prevented.

  Next, an embodiment of the present invention will be described. The present embodiment is an example in which the present invention is applied to an ink jet head that performs recording by ejecting ink onto recording paper as a liquid transfer device.

  First, an ink jet printer 100 including the ink jet head 2 of the present embodiment will be briefly described. As shown in FIG. 1, an inkjet printer 100 includes a carriage 1 that can move in the left-right direction in FIG. 1, a serial type inkjet head 2 that is provided on the carriage 1 and that ejects ink onto recording paper P, A conveyance roller 3 is provided for conveying the recording paper P forward in FIG.

  The inkjet head 2 records the ink supplied from an ink cartridge (not shown) from a nozzle 20 (see FIGS. 2 to 5) disposed on the lower surface while moving in the left-right direction in FIG. 1 integrally with the carriage 1. Ink is ejected onto the paper P. Further, the transport roller 3 transports the recording paper P forward in FIG. The ink jet printer 100 conveys the recording paper P forward by the transport roller 3 while ejecting ink from the nozzles 20 of the ink jet head 2 to the recording paper P, so that a desired image, character, or the like is printed on the recording paper P. It is configured to record.

  Next, the inkjet head 2 will be described in detail. As shown in FIGS. 2 to 5, the inkjet head 2 is configured to apply pressure to the ink in the pressure chamber 14 and the flow path unit 4 in which the ink flow path including the nozzle 20 and the pressure chamber 14 is formed. And a piezoelectric actuator 5 that ejects ink from the nozzles 20 of the flow path unit 4.

  First, the flow path unit 4 will be described. As shown in FIGS. 4 and 5, the flow path unit 4 includes a cavity plate 10, a base plate 11, a manifold plate 12, and a nozzle plate 13, and these four plates 10 to 13 are joined in a stacked state. Yes. Among these, the cavity plate 10, the base plate 11 and the manifold plate 12 are stainless steel plates, and ink flow paths such as a manifold 17 and a pressure chamber 14 described later can be easily etched in these three plates 10-12. It can be formed. The nozzle plate 13 is formed of, for example, a polymer synthetic resin material such as polyimide, and is bonded to the lower surface of the manifold plate 12.

  As shown in FIGS. 2 to 5, among the four plates 10 to 13, the uppermost cavity plate 10 has a plurality of pressure chambers 14 arranged along a plane vertically passing through the plate 10. It is formed by the hole to do. And as shown in FIG. 5, the adjacent pressure chamber 14 is separated by the partition part 10a. The plurality of pressure chambers 14 are arranged in two rows in a staggered manner in the paper feeding direction (vertical direction in FIG. 2). The plurality of pressure chambers 14 are respectively covered with a diaphragm 30 and a base plate 11 described later from above and below. Furthermore, each pressure chamber 14 is formed in a substantially elliptical shape that is long in the scanning direction (left-right direction in FIG. 2) in plan view.

  As shown in FIGS. 3 and 4, communication holes 15 and 16 are formed at positions where the base plate 11 overlaps both end portions of the pressure chamber 14 in a plan view, respectively. The manifold plate 12 is formed with two manifolds 17 extending in the paper feeding direction so as to overlap with the communication hole 15 side portions of the pressure chambers 14 arranged in two rows in a plan view. These two manifolds 17 communicate with an ink supply port 18 formed in a vibration plate 30 described later, and ink is supplied to the manifold 17 from an ink tank (not shown) via the ink supply port 18. Furthermore, a plurality of communication holes 19 respectively connected to the plurality of communication holes 16 are formed at positions where the manifold plate 12 overlaps the ends of the plurality of pressure chambers 14 opposite to the manifolds 17 in plan view.

  Further, a plurality of nozzles 20 are respectively formed at positions where the nozzle plate 13 overlaps the plurality of communication holes 19 in plan view. As shown in FIG. 2, the plurality of nozzles 20 are arranged so as to respectively overlap the ends of the plurality of pressure chambers 14 arranged in two rows along the paper feed direction on the side opposite to the manifold 17. That is, the plurality of nozzles 20 are arranged in two rows in a staggered manner corresponding to the plurality of pressure chambers 14 respectively.

  As shown in FIG. 4, the manifold 17 communicates with the pressure chamber 14 through the communication hole 15, and the pressure chamber 14 communicates with the nozzle 20 through the communication holes 16 and 19. As described above, a plurality of individual ink flow paths 21 extending from the manifold 17 to the nozzles 20 through the pressure chambers 14 are formed in the flow path unit 4.

  Next, the piezoelectric actuator 5 will be described. As shown in FIGS. 2 to 5, the piezoelectric actuator 5 covers the vibration plate 30 disposed on the upper surface of the cavity plate 10 so as to cover the plurality of pressure chambers 14, and the upper surface (lamination surface) of the vibration plate 30. The insulating layer 37, the piezoelectric layer 31 disposed on the upper surface of the diaphragm 30 covered with the insulating layer 37, and the common electrode 34 disposed on the lower surface of the piezoelectric layer 31 (between the insulating layer 37 and the piezoelectric layer 31). (First electrode) and a plurality of individual electrodes 32 (second electrodes) arranged on the upper surface of the piezoelectric layer 31.

  The diaphragm 30 is a substantially rectangular metal plate in plan view, and is made of, for example, an iron-based alloy such as stainless steel, a copper-based alloy, a nickel-based alloy, or a titanium-based alloy. As shown in FIGS. 4 and 5, the diaphragm 30 is disposed on the upper surface of the cavity plate 10 so as to cover the plurality of pressure chambers 14, and the lower surface (joint surface) of the diaphragm 30 is the partition wall of the cavity plate 10. It is joined to the part 10a. The cavity plate 10 to which the diaphragm 30 is joined corresponds to the base material of the present invention, and the pressure chamber 14 formed in the cavity plate 10 corresponds to the deformation allowable portion of the present invention.

  On the upper surface of the diaphragm 30, a plurality of recesses 40 are formed at positions corresponding to the plurality of pressure chambers 14, respectively. Specifically, each recess 40 is a substantially annular (C-shaped) groove divided in a part in the circumferential direction. The recess 40 extends over substantially the entire circumference of the pressure chamber 14 except for a region facing the communication hole 15 in a region facing the peripheral edge of the pressure chamber 14 on the upper surface of the diaphragm 30. . As shown in FIG. 3, the outer peripheral shape of the concave portion 40 is slightly larger than the outer peripheral shape of the pressure chamber 14, and the concave portion 40 is formed so as to include the edge of the corresponding pressure chamber 14 in plan view. Yes. That is, the inner portion of the recess 40 is disposed in a region facing the pressure chamber 14, and the outer portion of the recess 40 is disposed in a region not facing the pressure chamber 14.

  The insulating layer 37 is formed over the entire upper surface of the diaphragm 30, and the surfaces of the plurality of recesses 40 are also covered with the insulating layer 37. As will be described in detail later, in the manufacturing process of the piezoelectric actuator 5, the insulating layer 37 is heat-treated after the insulating layer 37 is formed. Therefore, an insulating material having a high heat resistance temperature is used for the insulating layer 37. . As such an insulating material, for example, an insulating ceramic material such as alumina or zirconia can be used.

  The piezoelectric layer 31 is made of a piezoelectric material mainly composed of lead zirconate titanate (PZT), which is a solid solution of lead titanate and lead zirconate and is a ferroelectric substance. The piezoelectric layer 31 is formed on the upper surface of the vibration plate 30 on which the insulating layer 37 is formed so as to cover the plurality of pressure chambers 14. However, the piezoelectric layer 31 is not formed on the surfaces of the plurality of recesses 40 of the vibration plate 30. In other words, a plurality of through holes 41 respectively corresponding to the plurality of recesses 40 are formed in the piezoelectric layer 31, so that the regions facing the central portions of the plurality of pressure chambers 14 are surrounded by the plurality of through holes 41, respectively. A structure in which a plurality of driving units 38 are arranged is realized. In addition, although the recessed part 40 is parted in the area | region facing the one end part (end part by the side of the communicating hole 15) of the pressure chamber 14, the piezoelectric layer 31 (connection part) is formed in the surface of the part which has divided this recessed part 40. 39) is formed. That is, the piezoelectric layer 31 has a structure in which a plurality of driving units 38 corresponding to the plurality of pressure chambers 14 are connected to each other via a plurality of connecting portions 39.

  The common electrode 34 is disposed on the surface of the insulating layer 37 (that is, the lower surface of the piezoelectric layer 31), and is insulated from the upper surface of the conductive diaphragm 30 by the insulating layer 37. The common electrode 34 is made of a conductive material such as gold, copper, silver, palladium, platinum, or titanium. The common electrode 34 is formed to face at least all of the plurality of pressure chambers 14. However, the common electrode 34 is not formed in a region facing the concave portion 40 of the diaphragm 30. Further, as described above, by forming the piezoelectric layer 31 in a region other than the region facing the plurality of recesses 40, the common electrode 34 is completely covered with the piezoelectric layer 31 and is not exposed. The common electrode 34 is connected to a driver IC (not shown) and is always held at a ground potential which is a reference potential via the driver IC.

  The plurality of individual electrodes 32 are respectively disposed on the upper surfaces of the plurality of driving units 38 of the piezoelectric layer 31. Each individual electrode 32 has a main electrode portion 32a having a substantially elliptical planar shape that is slightly smaller than the pressure chamber 14, and a contact portion 32b extending from one end of the main electrode portion 32a along the upper surface of the piezoelectric layer 31. Have The main electrode portion 32 a is disposed on the upper surface of the piezoelectric layer 31 in a region facing the substantially central portion of the pressure chamber 14 (drive unit 38). On the other hand, the contact part 32b is drawn from the longitudinal end of the main electrode part 32a along the longitudinal direction of the main electrode part 32a on the upper surface of the connecting part 39 connected to the drive part 38, and does not face the pressure chamber 14. It extends to the area. The plurality of individual electrodes 32 are also made of a conductive material such as gold, copper, silver, palladium, platinum, or titanium, like the common electrode 34.

  The contact portions 32b of the plurality of individual electrodes 32 are connected to a driver IC (not shown) via a flexible printed circuit (FPC). The plurality of individual electrodes 32 are configured to selectively apply one of two types of potentials, that is, a ground potential and a predetermined driving potential different from the ground potential from the driver IC. .

  Next, the operation of the piezoelectric actuator 5 during ink ejection will be described. When a driving voltage is selectively applied from the driver IC to the plurality of individual electrodes 32, the main electrode portion 32a of the individual electrode 32 to which the driving potential is applied and the piezoelectric layer 31 below the ground potential are held. Since the potentials of the common electrodes 34 on the side are different from each other, an electric field in the thickness direction is generated in the drive unit 38 of the piezoelectric layer 31 sandwiched between the individual electrodes 32 and the common electrode 34. When the polarization direction of the piezoelectric layer 31 and the direction of the electric field are the same, the piezoelectric layer 31 extends in the thickness direction, which is the polarization direction, and contracts in the horizontal direction. The diaphragm 30 is deformed so that a portion facing the pressure chamber 14 is convex toward the pressure chamber 14 (unimorph deformation). At this time, since the volume of the pressure chamber 14 is reduced, pressure is applied to the ink inside the pressure chamber 14, and ink droplets are ejected from the nozzle 20 communicating with the pressure chamber 14.

  Here, as described above, the drive unit 38 sandwiched between the common electrode 34 and the individual electrode 32 is disposed in the region of the upper surface of the diaphragm 30 facing the central portion of the pressure chamber 14. This region is a drive region in which the drive unit 38 contracts itself when the drive potential is applied to the individual electrode 32 and causes the diaphragm 30 to be deformed. On the other hand, the peripheral area of the upper surface of the vibration plate 30 (the region facing the peripheral edge of the pressure chamber 14) is a driven region in which the vibration plate 30 is deformed by the contraction of the drive unit 38. In this driven region, the concave portion 40 is formed in the vibration plate 30, and the piezoelectric layer 31 is not disposed on the surface of the concave portion 40. That is, the rigidity of the piezoelectric actuator 5 is locally reduced in the driven region.

  Thus, if the rigidity of the piezoelectric actuator 5 in the driven region is reduced, the diaphragm 30 is likely to be deformed in the region facing the pressure chamber 14 when the drive unit 38 contracts in the horizontal direction. In other words, the driving voltage (voltage between the individual electrode 32 and the common electrode 34) required to cause the diaphragm 30 to be deformed more than a predetermined amount can be reduced, and the power consumption of the piezoelectric actuator 5 can be reduced. It becomes possible.

  Further, if the rigidity of the piezoelectric actuator 5 in the peripheral region of the drive unit 38 is reduced, when the drive unit 38 facing the certain pressure chamber 14 contracts, the deformation generated in the diaphragm 30 according to the contraction is reduced. It becomes difficult to propagate to the adjacent pressure chamber 14. That is, crosstalk between adjacent pressure chambers 14 is suppressed.

  Next, a method for manufacturing the inkjet head 2 of the present embodiment will be described with reference to FIGS. First, a plurality of recesses 40 are formed in a region on the upper surface of the vibration plate 30 that faces the peripheral edges of the plurality of pressure chambers 14 when joined to the cavity plate 10 (recess formation step). Here, in this embodiment, since the diaphragm 30 is made of a metal material, the plurality of recesses 40 can be easily formed by etching.

  On the other hand, of the plates constituting the flow path unit 4, holes constituting the ink flow paths such as the pressure chambers 14 and the manifold 17 are formed in the cavity plate 10, the base plate 11, and the manifold plate 12. Since these plates 10 to 12 are also made of a metal material in the same manner as the diaphragm 30, the holes constituting the ink flow path can be easily formed by etching.

  Then, as shown in FIG. 6A, the four plates of the vibration plate 30, the cavity plate 10, the base plate 11, and the manifold plate 12 are stacked and joined. In this bonding step, for example, four plates can be bonded by metal diffusion bonding by pressing the stacked plates while heating them to a predetermined temperature (for example, 1000 ° C.) or higher. Alternatively, the four plates may be joined with a ceramic adhesive having high heat resistance.

  Next, as shown in FIG. 6B, an insulating layer 37 is formed on the upper surface of the diaphragm 30 so as to cover the plurality of recesses 40 (insulating layer forming step). Here, when an insulating ceramic material such as alumina or zirconia is used, the ceramic material particles are oscillated by an aerosol deposition method (AD method), a sputtering method, or a chemical vapor deposition method (CVD method). By depositing on the upper surface of the insulating layer 37, the insulating layer 37 can be formed.

  Then, as shown in FIG. 6C, the common electrode 34 is formed on the surface of the insulating layer 37 so as to face all of the plurality of pressure chambers 14 (common electrode (first electrode) forming step). However, the common electrode 34 is not formed in a region facing the plurality of recesses 40 of the diaphragm 30. The common electrode 34 can be formed by screen printing, vapor deposition, sputtering, or the like.

  Next, as shown in FIG. 7A, the recess 40 covered with the insulating layer 37 is filled with a low elastic material 50 having fluidity (low elastic material filling step). Here, as the fluid low elastic material 50, the elastic modulus is the elastic modulus of the metallic diaphragm 30 (about 200 GPa) and the elastic modulus of the insulating layer 37 such as alumina covering the upper surface (about 300 GPa). In addition, a material whose thermal decomposition temperature is sufficiently lower than a heat treatment temperature (annealing temperature: 650 to 900 ° C.) of the piezoelectric layer 31 described later is used. For example, an epoxy resin (uncured state, thermal decomposition temperature of about 400 ° C.), a fluorine resin (uncured state, thermal decomposition temperature of about 600 ° C.), or the like can be used.

  Here, by using a material having fluidity as the low-elasticity material 50, the filling operation into the recess 40 can be easily performed. For example, as shown in FIG. 7A, the low elastic material 50 can be injected into the recess 40 using the dispenser 51. Alternatively, as shown in FIG. 8, the low elastic material 50 can be filled in the recess 40 by applying the low elastic material 50 to the surface of the insulating layer 37 using a blade 52 or the like.

  Furthermore, a recess 40 is formed in advance in a region corresponding to the pressure chamber 14 on the upper surface of the diaphragm 30, and the fluid 40 is filled with a fluid low elastic material 50, thereby providing a fluid low elasticity 50. It can be made to settle in the recessed part 40, and it can prevent that the low elastic material 50 flows out out of a predetermined filling area | region. The low-elasticity material 50 may be any material that exhibits fluidity at least when it is filled, and need not have fluidity even after filling into the recess 40.

  7B, the piezoelectric layer 31 is formed on the upper surface of the diaphragm 30 covered with the insulating layer 37 by the AD method (piezoelectric layer forming step). Specifically, first, an aerosol is generated by mixing particles of piezoelectric material (PZT) and a carrier gas with an aerosol generator (not shown). Then, the aerosol containing the piezoelectric material particles and the carrier gas is sprayed from the film forming nozzle (not shown) toward the vibration plate 30 to cause the piezoelectric material particles to collide with the surface of the insulating layer 37 at a high speed. Deposit. As the carrier gas, an inert gas such as helium or argon, nitrogen, oxygen, air, or the like can be used.

  By the way, since the low elastic material 50 filled in the concave portion 40 of the diaphragm 30 is a material having a lower elastic modulus (rigidity) than the diaphragm 30 and the insulating layer 37, the diaphragm 30 covered with the insulating layer 37. The surface hardness of the recessed area filled with the low-elasticity material 50 on the upper surface is lower than the other areas. Here, when the aerosol containing the particles of the piezoelectric material and the carrier gas is sprayed on the diaphragm 30, the region where the elastic modulus (surface hardness) is low compared to the region where the elastic modulus (surface hardness) is high. Thus, it has been found by the inventors of the present application that particle deposition is inhibited (see JP-A-2005-317952).

  Therefore, when the low elastic material 50 is filled in the concave portion 40 of the diaphragm 30 and then aerosol is sprayed on the upper surface of the diaphragm 30, the low elastic material 50 filled in the concave portion 40 as shown in FIG. The piezoelectric material particles are not deposited on the surface, and the piezoelectric layer 31 is formed only in the region excluding the surface of the low elastic material 50. That is, the piezoelectric layer 31 (drive unit 38) is formed in the region of the upper surface of the diaphragm 30 that is surrounded by the recess 40 and faces the central portion of the pressure chamber 14, while the recess 40 is formed. The piezoelectric layer 31 is not formed in a region facing the peripheral edge of the pressure chamber 14. Further, as described above, the common electrode 34 is not formed in a region facing the recess 40, and therefore the piezoelectric layer 31 is formed so as to completely cover the common electrode 34.

  By the way, when the piezoelectric layer 31 is formed by the AD method, particle miniaturization, lattice defects, and the like occur at the time of collision with the vibration plate 30, so that the piezoelectric characteristics necessary for deforming the vibration plate 30 can be obtained as it is. I can't. Therefore, in order to grow grain crystals of the piezoelectric material and repair lattice defects in the crystals to improve the piezoelectric characteristics, a laminated body including the piezoelectric layer 31, the vibration plate 30, and the plates 10 to 12 is predetermined. The piezoelectric layer 31 is heated to the annealing temperature and subjected to heat treatment (annealing treatment) (heat treatment step).

  From the viewpoint of improving the piezoelectric characteristics of the piezoelectric material alone, the annealing temperature is preferably high. However, if the temperature is too high, the diffusion of the elements contained in the metal diaphragm 30 is promoted and exceeds the insulating layer 37. To the piezoelectric layer 31. And when such an element diffuses, the piezoelectric characteristics of the piezoelectric layer 31 are deteriorated. Therefore, the annealing temperature is set to a temperature at which diffusion of elements contained in the diaphragm 30 into the piezoelectric layer 31 can be suppressed. Specifically, the annealing temperature is set to 650 to 900 ° C.

  Here, the thermal decomposition temperature of the low elastic material 50 filled in the recess 40 of the vibration plate 30 is lower than the annealing temperature described above. Therefore, when the laminated body including the piezoelectric layer 31, the vibration plate 30, and the plates 10 to 12 is heated to 650 to 900 ° C. in order to perform heat treatment on the piezoelectric layer 31, as shown in FIG. The elastic material 50 is thermally decomposed and dissipated, and as a result, the low elastic material 50 in the recess 40 is removed (removal process).

  Thereafter, as shown in FIG. 7D, a plurality of individual electrodes 32 are formed on the top surfaces of the plurality of driving portions 38 of the piezoelectric layer 31 facing the plurality of pressure chambers 14 and the common electrode 34 (individual electrodes ( Second electrode) forming step). The plurality of individual electrodes 32 can be formed by screen printing, vapor deposition, sputtering, or the like.

  Finally, after a plurality of nozzles 20 are formed on the synthetic resin nozzle plate 13 by laser processing or the like, the nozzle plate 13 is joined to the lower surface of the manifold plate 12 with an adhesive or the like.

  The nozzle plate 13 may be formed of a metal material such as stainless steel, similarly to the other three plates 10 to 12 constituting the flow path unit 4. In this case, since the heat resistant temperature of the nozzle plate 13 is higher than the annealing temperature of the piezoelectric layer 31, the nozzle plate 13 may be joined to the manifold plate 12 before the piezoelectric layer forming step. For example, in the plate joining process shown in FIG. 6A, the plates 10 to 12 and the diaphragm 30 and the nozzle plate 13 may be joined at a time.

According to the method for manufacturing the inkjet head 2 described above, the following effects can be obtained.
When the low elastic material 50 is filled in the concave portion 40 formed in the vibration plate 30 and then the aerosol is sprayed on the upper surface of the vibration plate 30, the piezoelectric material is not deposited on the surface of the low elastic material 50 filled in the concave portion 40. The piezoelectric layer 31 is formed only in a region other than the surface of the low elastic material 50. That is, before the piezoelectric layer 31 is formed by the AD method, the piezoelectric layer 31 is formed on the surface of the recess 40 formed in the vibration plate 30 only by adding a simple process of filling the recess 40 with the low elastic material 50. Can be prevented from forming. Moreover, since what has fluidity | liquidity is used as the low elastic material 50, the filling to the recessed part 40 can be performed easily. Further, since the concave portion 40 is formed in the diaphragm 30 in advance and the concave portion 40 is filled with the low elastic material 50, the low elastic material 50 can be made to stand in a predetermined region where the formation of the piezoelectric layer 31 is desired to be prevented.

  Moreover, since the low elastic material 50 in the recess 40 is removed after the piezoelectric layer 31 is formed, the rigidity of the entire piezoelectric actuator 5 in the region where the recess 40 is formed can be further reduced. Accordingly, the diaphragm 30 is more easily deformed in the region facing the pressure chamber 14, and the driving voltage can be further reduced. Further, crosstalk between adjacent pressure chambers 14 can be further suppressed. Furthermore, since the low elastic material 50 can be removed simultaneously with the annealing treatment of the piezoelectric layer 31 by thermally decomposing the low elastic material 50 during the heat treatment (annealing treatment) of the piezoelectric layer 31, the manufacturing process of the piezoelectric actuator 5. Can be shortened.

  Since the insulating layer 37 is formed so as to cover the plurality of recesses 40 on the upper surface of the diaphragm 30, the upper surface of the diaphragm 30 is not exposed in the plurality of recesses 40. Therefore, a short circuit between the conductive diaphragm 30 and the individual electrode 32 to which the drive potential is applied is reliably prevented. The common electrode 34 below the piezoelectric layer 31 is insulated from the conductive diaphragm 30 by the insulating layer 37. Furthermore, since the common electrode 34 is covered with the piezoelectric layer 31 and is not exposed, a short circuit between the common electrode 34 and the individual electrode 32 is also prevented.

  Next, modified embodiments in which various modifications are made to the embodiment will be described. However, components having the same configuration as in the above embodiment are given the same reference numerals and description thereof is omitted as appropriate.

  1] The region where the concave portion of the diaphragm is formed is not limited to the region facing the peripheral portion of the pressure chamber.

  For example, as shown in FIG. 9, the partition wall 10 a is straddled from a region on the upper surface of the diaphragm 30 </ b> A facing the peripheral edge of the pressure chamber 14 to a region facing the peripheral edge of another adjacent pressure chamber 14. A concave portion 40A may be formed in (a modified embodiment 1). In this case, when the particles of the piezoelectric material are deposited by the AD method after filling the recess 40A with the low elastic material, the piezoelectric layer 31A is not formed in the peripheral portion of the pressure chamber 14 and the region facing the partition wall portion 10a. . Therefore, the drive voltage can be reduced by reducing the rigidity of the piezoelectric actuator in the region (driven region) facing the peripheral edge of the pressure chamber 14. In addition, by reducing the rigidity of the piezoelectric actuator in the region facing the partition wall 10a, the deformation propagation (crosstalk) of the diaphragm 30A between the two pressure chambers 14 separated by the partition wall 10a can be reduced. , Can be more effectively suppressed.

  In addition, it is not always necessary to form a recess in a region on the upper surface of the diaphragm facing the pressure chamber. For example, when it is necessary to preferentially suppress the crosstalk over the reduction of the driving voltage, as shown in FIG. 10, the partition wall 10a on the upper surface of the diaphragm 30B that has the largest influence on the crosstalk. It is also possible to form the recess 40B only in the region facing the surface and not form the piezoelectric layer 31 on the surface of the recess 40B (Modification 2).

  Moreover, in the said embodiment, the drive part of a piezoelectric layer is arrange | positioned in the area | region facing the center part of a pressure chamber, and this area | region becomes a drive area | region. However, if the position of the drive unit (drive region) is different, the position of the driven region that is deformed in accordance with the deformation of the drive unit is also different, so the position where the recess is to be formed inevitably changes.

  For example, as shown in FIGS. 11 and 12, an annular drive unit 38C, which is a part of the piezoelectric layer 31C, is formed on the upper surface of the vibration plate 30C in a region facing the peripheral portion of the pressure chamber 14, and this driving is performed. When the annular individual electrode 32C is disposed on the upper surface of the portion 38C, a region facing the peripheral portion of the pressure chamber 14 is a driving region, and a region facing the central portion of the pressure chamber 14 is a driven region. When manufacturing such a piezoelectric actuator, first, the concave portion 40C is formed in the driven region on the upper surface of the vibration plate 30C facing the central portion of the pressure chamber 14. Then, after filling the recess 40C with the low elastic material, the piezoelectric material particles are deposited on the upper surface of the vibration plate 30C by the AD method, so that only the piezoelectric region 31C ( A drive unit 38C) may be formed (Modification 3).

  2] As shown in FIG. 13, the diaphragm 30 made of a metal material is always held at the ground potential, whereby the upper surface of the diaphragm 30 is used as a common electrode (first electrode) facing the plurality of individual electrodes 32. It can be used (Modification 4). In this case, a step of separately forming the common electrode is not necessary, and the configuration of the piezoelectric actuator is simplified. Needless to say, in the third modification, unlike the previous embodiment, it is not necessary to cover the upper surface of the diaphragm 30 as the common electrode with the insulating layer 37. However, since the particles of the piezoelectric material are not deposited on the surface of the recess 40, the conductive surface of the recess 40 is exposed, and there is a possibility that a short circuit occurs between the surface of the recess 40 and the individual electrode 32. Therefore, in order to prevent this short circuit, only the surface of the recess 40 in the upper surface of the diaphragm 30 may be covered with an insulating layer.

  3] As shown in FIG. 14, the common electrode 34 that is always held at the ground potential (reference potential) is disposed on the upper surface of the piezoelectric layer 31, and either the ground potential or the driving potential is selectively applied. The electrode 32 may be formed on the surface of the insulating layer 37 and disposed on the lower surface of the piezoelectric layer 31 (between the piezoelectric layer 31 and the insulating layer 37) (Modification 5).

  4] As the low elastic material filled in the concave portion of the diaphragm, a material having a thermal decomposition temperature higher than the heat treatment temperature of the piezoelectric layer can be used (Modification 6). In this case, as shown in FIG. 15, the low elastic material 50 remains in the recess 40 even after the heat treatment of the piezoelectric layer 31. Therefore, the rigidity of the piezoelectric actuator in the region where the recess 40 is formed is somewhat higher than when the low-elastic material 50 is removed from the recess 40 as in the embodiment. However, compared to a mode in which the piezoelectric layer 31 is not locally formed on the upper surface of the flat diaphragm without a recess, the rigidity of the piezoelectric actuator is reduced by the thickness of the diaphragm 30 having high rigidity. .

  5] The diaphragm does not necessarily need to be a metal plate, and any material other than metal (for example, a ceramic material such as alumina or zirconia) may be used as long as it has a rigidity that allows unimorph deformation according to the contraction of the drive unit. Alternatively, those formed of silicon or the like can also be used. In this case, ultrasonic machining is most desirable as a method of forming the recess 40 in the diaphragm.

  As described above, the embodiment of the present invention has been described with reference to the example in which the present invention is applied to the piezoelectric actuator of the inkjet head that applies the ejection pressure to the ink in the pressure chamber. However, the scope of the present invention is not limited to this. It is not something that can be done. For example, a liquid transfer actuator such as a liquid transfer device for transferring a liquid such as a chemical solution or a biochemical solution inside a micro total analysis system (μTAS), or a liquid transfer device for transferring a liquid such as a solvent or a chemical solution inside a microchemical system. The present invention can also be applied to the piezoelectric actuator.

  Furthermore, the application target of the present invention is not limited to an actuator for applying pressure to a liquid such as ink. That is, the present invention is also applied to piezoelectric actuators used for applications other than liquid transfer, such as actuators that press and drive various objects by deforming portions of the diaphragm while allowing deformation of the diaphragm at the deformation allowing portion of the base material. It is possible to apply.

1 is a schematic configuration diagram of an inkjet printer according to an embodiment of the present invention. It is a top view of an inkjet head. FIG. 3 is a partially enlarged view of FIG. 2. FIG. 4 is a sectional view taken along line IV-IV in FIG. 3. It is the VV sectional view taken on the line of FIG. It is a figure which shows the first half process of the manufacturing method of an inkjet head, (a) shows a plate joining process, (b) shows an insulating layer formation process, (c) shows a common electrode formation process, respectively. It is a figure which shows the latter half process of the manufacturing method of an inkjet head, (a) is a low elastic material filling process, (b) is a piezoelectric layer formation process, (c) is a heat treatment process, (d) is an individual electrode formation process and a nozzle. Each of the plate joining steps is shown. It is a figure which shows another form of a low elastic material filling process. It is sectional drawing equivalent to FIG. 5 of the inkjet head of the modification 1. FIG. It is sectional drawing equivalent to FIG. 5 of the inkjet head of the modification 2. FIG. FIG. 6 is a partially enlarged plan view of an ink jet head according to a third modification. It is the XII-XII sectional view taken on the line of FIG. FIG. 6 is a cross-sectional view corresponding to FIG. 5 of an inkjet head according to a modified embodiment 4; FIG. 6 is a cross-sectional view corresponding to FIG. It is sectional drawing equivalent to FIG. 5 of the inkjet head of the modification 6. FIG.

Explanation of symbols

2 Inkjet head 4 Flow path unit 5 Piezoelectric actuator 10a Partition 14 Pressure chamber 30, 30A, 30B, 30C Diaphragm 31, 31A, 31C Piezoelectric layer 32, 32C Individual electrode 34 Common electrode 37 Insulating layers 40, 40A, 40B, 40C Recess 50 Low elastic material

Claims (9)

A diaphragm that is bonded to one surface of a base material provided with a deformation-permitting portion so as to cover the deformation-permitting portion, and a laminated surface of the vibration plate that is located on the opposite side of the bonding surface with the base material. A piezoelectric layer, a first electrode arranged on one surface of the piezoelectric layer, and a second electrode arranged on the other surface of the piezoelectric layer,
A recessed portion forming step of forming a recessed portion at a position corresponding to the deformation allowing portion of the laminated surface of the diaphragm;
Low elastic material filling step of filling the concave portion of the diaphragm with a low elastic material having a lower elastic modulus than the laminated surface of the diaphragm and having fluidity;
An aerosol containing piezoelectric material particles and a carrier gas is sprayed on the laminated surface of the diaphragm, and the piezoelectric material particles are deposited in a region excluding the surface of the low-elasticity material filled in the recess. A piezoelectric layer forming step of forming the piezoelectric layer;
A method of manufacturing a piezoelectric actuator comprising:   The method for manufacturing a piezoelectric actuator according to claim 1, further comprising a removing step of removing the low-elasticity material after the piezoelectric layer forming step. A heat treatment step of performing a heat treatment on the piezoelectric layer after the piezoelectric layer forming step;
3. The method of manufacturing a piezoelectric actuator according to claim 2, wherein a thermal decomposition temperature of the low elastic material is lower than a heat treatment temperature of the piezoelectric layer in the heat treatment step.   4. The method of manufacturing a piezoelectric actuator according to claim 1, wherein, in the recess forming step, the recess is formed at least in a region of the laminated surface of the diaphragm facing the deformation allowing portion. Method.   5. The method for manufacturing a piezoelectric actuator according to claim 4, wherein, in the concave portion forming step, the concave portion is formed in a region of the laminated surface of the diaphragm facing the peripheral edge portion of the deformation allowing portion.   5. The method for manufacturing a piezoelectric actuator according to claim 4, wherein, in the recess forming step, the recess is formed in a region of the laminated surface of the diaphragm facing a central portion of the deformation allowing portion. The base material has a plurality of deformation permissible portions and a partition wall that separates the plurality of deformation permissible portions,
The method for manufacturing a piezoelectric actuator according to any one of claims 1 to 3, wherein in the recess forming step, the recess is formed at least in a region of the laminated surface of the diaphragm facing the partition wall. . The diaphragm is made of a metal material,
Further, the first electrode is always held at a predetermined reference potential, while the second electrode is one of two types of potentials, the reference potential and a predetermined drive potential different from the reference potential. Is given selectively,
An insulating layer forming step of forming an insulating layer on the laminated surface so as to cover the concave portion after forming the concave portion on the laminated surface of the diaphragm in the concave portion forming step;
A first electrode forming step of forming the first electrode in a region not facing the concave portion on the surface of the insulating layer;
After forming the piezoelectric layer so as to cover the first electrode on the surface of the insulating layer in the piezoelectric layer forming step, a region facing the first electrode on the surface of the piezoelectric layer opposite to the diaphragm Forming a second electrode on the second electrode; and
The method for manufacturing a piezoelectric actuator according to claim 1, wherein: A flow path unit in which a liquid flow path including a pressure chamber is formed, and a piezoelectric actuator disposed on one surface of the flow path unit;
The piezoelectric actuator is disposed on a vibration plate that is bonded to one surface of the flow path unit so as to cover the pressure chamber, and a laminated surface of the vibration plate that is opposite to the bonding surface with the flow path unit. A method for manufacturing a liquid transfer device, comprising: a piezoelectric layer; a first electrode disposed on one surface of the piezoelectric layer; and a second electrode disposed on the other surface of the piezoelectric layer,
A recess forming step of forming a recess at a position corresponding to the pressure chamber of the laminated surface of the diaphragm;
Low elastic material filling step of filling the concave portion of the diaphragm with a low elastic material having a lower elastic modulus than the laminated surface of the diaphragm and having fluidity;
An aerosol containing piezoelectric material particles and a carrier gas is sprayed on the laminated surface of the diaphragm, and the piezoelectric material particles are deposited in a region excluding the surface of the low-elasticity material filled in the recess. A piezoelectric layer forming step of forming the piezoelectric layer;
A method for manufacturing a liquid transfer device.

Images