JP2008198730A - Surface mounting machine, screen printing device and mounting line - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve manufacturing quality in mounting process. <P>SOLUTION: According to this system (surface mounter Z3, solder printer Z2 and mounting line L), information (information about substrate inspection before printing) about inspection of a substrate P which has been executed before printing is utilized in a printing process and a mounting process. In this way, printing failure and a mounting failure of components can be reduced and the manufacturing quality can be improved in the mounting process. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a surface mounting machine, a screen printing apparatus, and a mounting line.

In recent years, there has been a demand for miniaturization of electronic components and advancement of mounting density, and the positional accuracy when mounting electronic components on electrodes of a substrate has also been advanced. In such a mounting board on which components are mounted at a high density, it is extremely difficult to perform repair work on a board that has been determined to be defective after completion as a mounting board. For this reason, most of those determined to be defective by the inspection after the completion of mounting are often forced to be disposed of, so that expensive electronic components are wasted. In order to avoid this type of problem, in the following patent document, it is proposed to perform correction processing based on solder position data when a component is mounted on a substrate.
JP 2005-252290 A

According to the technique of the above-mentioned patent document, the mounting position of the component is corrected according to the position where the solder is applied, so that the component can be correctly mounted on the solder. However, there is a case where the solder applied on the substrate is displaced from the electrode on the substrate, and it is necessary to consider this point.
The present invention has been completed based on the above-described circumstances, and an object thereof is to improve manufacturing quality in the mounting process.

  As a means for achieving the above object, the invention according to claim 1 (surface mounting machine) includes a mounting head and a head driving means for driving the mounting head, and mounting a component on a printed board. It is a surface mounter that moves and mounts components to the position by the mounting head, based on pre-printing board inspection information that has been subjected to board inspection before the printing is performed, and printing position information related to the printing position, It is characterized in that it includes a mounting position correcting unit that corrects the component mounting position and a first control unit that controls the head driving unit based on the corrected component mounting position.

As an embodiment of the present invention, the following configuration is preferable.
The pre-printing board inspection information is the position information of the electrodes formed on the board. If the component mounting position is set (corrected) after accurately grasping the electrode position, it is possible to mount the component at the optimum position on the substrate.

  As means for achieving the above object, the invention of claim 3 (screen printing apparatus) comprises a mask having a printing opening, a holding means for holding a substrate which is a substrate, and the mask and holding means. A screen printing apparatus that performs printing on the substrate while overlapping the substrate held by the holding unit and the mask by the operation of the driving unit. A printing position correcting unit that corrects a printing position with respect to the substrate based on pre-printing substrate inspection information obtained by inspecting the substrate before the printing is performed, and a second that controls the relative driving unit based on the corrected printing position. And a control means.

As an embodiment of the present invention, the following configuration is preferable.
The pre-printing board inspection information is the position information of the electrodes formed on the board. Generally, printing is done on the electrodes of the substrate. Therefore, if the printing position is set (corrected) after accurately grasping the position of the electrode, printing can be performed at the optimum position on the substrate.
-The printing position correction means performs correction by giving priority to an area where the electrode arrangement pattern is fine as compared with other areas.
・ Include information on adhesion of foreign substances adhered on the substrate in the pre-printing substrate inspection information. In accordance with this, the apparatus is provided with foreign matter removing means capable of removing foreign matter.

  As a means for achieving the above object, the invention according to claim 8 (mounting line) includes a pre-printing board having board inspection information obtaining means for obtaining pre-printing board inspection information based on a board image obtained from the imaging means. An inspection apparatus, the screen printing apparatus according to any one of claims 3 to 7, and the surface mounter according to claim 1 or 2 are sequentially arranged along a production line. After inspecting the substrate by the pre-printing board inspection apparatus, the inspected board is sent to the screen printing apparatus to perform a predetermined printing process, and the printed board is sent to the surface mounter. The pre-print board information is transmitted from the pre-print board inspection apparatus to the screen printing apparatus and the surface mount machine directly or indirectly via the other. , Characterized by the surface mounter from the screen printing device, where there is a configuration in which print position information about the print position after indirectly the correction via direct or others are transmitted.

As an embodiment of the present invention, the following configuration is preferable.
-It is set as the structure by which the transmission / reception of information between each apparatus which comprises a line is performed in the aspect matched with specific information. With such a configuration, information management can be performed for each board, and there is no error in the use of information.
-A coating line is placed between the screen printing device and the surface mounter to build a production line.

  According to the present invention (surface mounting machine, screen printing apparatus, mounting line), it is decided to use the inspection information (substrate inspection information before printing) performed before printing in the mounting process. In this way, printing defects and component mounting defects can be reduced, and manufacturing quality is increased in the mounting process.

<Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS.
1. Overall Configuration of Mounting Line (Manufacturing Line) L FIG. 1 is a diagram showing a partial configuration of a mounting line L applied to this embodiment. In the figure, reference numeral Z1 denotes a pre-printing board inspection apparatus for determining the quality of the substrate P, and Z2 denotes a solder paste (hereinafter simply referred to as a pattern D) on an electrode arrangement pattern (hereinafter simply referred to as a pattern D) exposed on the surface of the substrate P. A solder printing apparatus (an example of the “screen printing apparatus” of the present invention) that screen-prints solder, Z3 is a surface mounter (hereinafter simply referred to as a “mounter”) that mounts components on a substrate P printed with solder. Called).

  In this mounting line L, the left side in FIG. 1 is upstream of the line and the right side is downstream of the line, and whether or not the pattern D is correctly formed in the leading pre-printing board inspection apparatus Z1, that is, whether the board P is good or bad. The printing process and the component mounting process are performed by each of the devices Z2 and Z3 while conveying the good board P excluding the defective board judged and judged to be negative toward the downstream of the line.

  In this embodiment, each substrate P is assigned a unique identification number (an example of “unique information” of the present invention, hereinafter referred to as ID information), and each substrate P can be individually managed. It is like that. The devices Z1 to Z3 are connected by a bidirectional communication network so that various types of information can be exchanged between the devices.

  The pre-printing board inspection apparatus Z1 is configured to inspect misalignment (details will be described later) of the pattern D in addition to the pass / fail information of the board P. The pre-printing board inspection information is printed together with the ID information. It is configured to be transmitted from the front board inspection device Z1 to the solder printing device Z2.

  Then, the solder printing apparatus Z2 performs solder printing on the board P while performing a process of correcting the solder printing position on the board P (details will be described in detail later) based on the inputted pre-printing board inspection information. Execute.

  Thereafter, the board P on which the solder is printed is sent to the mounting machine Z3. Then, the pre-printing board inspection information and the printing position correction value are transmitted together with the ID information of the board P from the solder printing apparatus Z2 to the mounting machine Z3.

  Then, the mounting machine Z3 performs a component mounting operation while correcting the component mounting position on the substrate P based on the pre-printing board inspection information and the printing position correction value so that the following setting is obtained.

  As shown in FIG. 13C, the component mounting position so that the terminals B1 and B2 of the component B are placed on the area where the actual position of the pattern on the substrate P (position of the actual pattern) and the printing position of the solder overlap. Is corrected.

  As described above, according to the present embodiment, the pre-printing board inspection information is reflected in the mounting process (solder printing process, component mounting process), so that solder printing and components are mounted at the best position on the board P. By doing so, the production quality is improved.

  In this example, information such as pre-printing inspection information and printing position correction values is exchanged between apparatuses. However, these information are transmitted together with ID information, and ID management is performed for each substrate P. That is, by referring to the ID information, it is possible to specify which substrate P the pre-printing inspection information and the printing position correction value are information about. By such a data management method, the “information between each device constituting the mounting line (in the above example, pre-printing board inspection information, printing position correction value) of the present invention is transferred to the unique information (in the above example, "Executed in a manner associated with (ID information)" (in the above example, various information and ID information are transmitted as a set).

  Hereinafter, the configuration of each device will be specifically described.

2. Pre-Printing Substrate Inspection Device A pre-printing substrate inspection device Z1 includes a substrate holding unit (not shown) for holding the substrate P, an imaging camera (not shown) as an imaging means, and an imaging camera in the upper region of the substrate P. A drive unit (not shown) for driving in the XY directions, an image analysis unit (not shown) as a substrate inspection information acquisition unit for analyzing a substrate image obtained from the imaging camera, and a reading device for reading ID information (“ Corresponding to “reading means” (not shown).

  The pre-printing board inspection apparatus Z1 acquires the board image and the ID information while moving the imaging camera to an arbitrary position on the board by the driving unit. Thereafter, the obtained image of the substrate is analyzed by an image analysis unit to inspect the pattern defect on the substrate P, thereby determining whether the substrate P is good or bad (the processing of Step 10 and Step 20 in FIG. 2). At the same time, the following printed circuit board inspection information is acquired.

  In the present embodiment, as shown in FIG. 3, reference marks (hereinafter referred to as fiducial marks) F <b> 1 and F <b> 2 are attached to the upper right corner of the substrate P and its opposing position. The fiducial marks F1 and F2 serve as a reference for the substrate P, and the positions of the patterns D are determined by design based on the positions where the marks F1 and F2 are attached.

  Therefore, in this embodiment, based on the substrate image obtained from the imaging camera, the actual position of each pattern D with respect to the fiducial marks F1 and F2 (hereinafter, actual positions: X1, Y1, etc. in FIG. 3) is determined. The deviation of the actual position of the pattern D with respect to the design reference value is detected by detecting this and comparing it with a design reference value (Xo, Yo, etc. in FIG. 3) determined in terms of design. In the example of FIG. 3, only one dimension drawing is shown, but actually, data of four corners of each pattern D is detected.

  Information regarding the deviation of the actual position of the pattern D is sent as pre-printing board inspection information together with the ID information of the board P to the solder printing apparatus Z2, which will be described below (processing in step 30 in FIG. 2). The sent information is received by the solder printing apparatus Z2 and stored in the storage means 37 provided in the apparatus (see FIG. 6).

3. Configuration of Solder Printing Device Z2 Next, the configuration of the solder printing device Z2 will be described with reference to FIGS. FIG. 4 is a cross-sectional side view of a main part of the solder printing apparatus.

  The solder printing apparatus Z2 includes a printing machine main body 2 having a base 1, a board support unit 3 having a holding unit 4 that holds the board P in a positioned state, and the board P is loaded into the board support unit 3. A carry-out conveyor (not shown) is provided.

  The substrate support unit 3 is not shown in detail, but an RZ stage 3A that supports the substrate P so that the substrate P can be moved up and down (moved in the Z-axis direction) and rotated (rotated around the Z axis), and the RZ stage 3A is supported on the substrate. An XY stage 3B that is movably supported in a conveying direction (X-axis direction; a direction orthogonal to the paper surface in FIG. 4) and a direction orthogonal to the conveyance direction (Y-axis direction). The substrate P is moved by the mutual operation.

  The printing machine main body 2 is provided with a frame 2b supported by a column 2a erected on the base 1. A metal mask M, which will be described later, is fixed to the frame 2b, and the squeegee unit 5 is disposed above the metal mask M. Note that the entire circumference of the metal mask M is held by the frame member 8 and is fixed to the frame 2b via the frame member 8.

  The squeegee unit 5 supplies cream solder onto the rail member 5a provided on the frame 2b, the movable part 5b capable of moving back and forth in the Y-axis direction along the rail member 5a, and the metal mask M. A solder supply device (not shown). The movable portion 5b is provided with a pair of squeegees 22 having a predetermined length in the X-axis direction and lifting means 10 that drives the squeegees 22 to move up and down.

  As shown in FIG. 5, the metal mask M has a printing opening K that follows the shape of the pattern D of the substrate P, and a reference mark (hereinafter referred to as a fiducial mark) F3 on the lower surface of the mask. F4 is provided.

  In the present embodiment, the fiducial marks F3 and F4 on the mask side are formed in the same arrangement in accordance with the fiducial marks F1 and F2 formed on the substrate P. Therefore, while driving the XY stage 3B and the RZ stage 3A so that the fiducial marks F1 and F2 on the substrate P side coincide with the fiducial marks F3 and F4 on the mask side, the substrate P with respect to the metal mask M is driven. Is adjusted so that the printing opening K of the metal mask M and the pattern D of the substrate P substantially coincide with each other.

  In order to perform the above adjustment, it is necessary to recognize the positions of the fiducial marks F1 and F2 on the substrate P side and the positions of the fiducial marks F3 and F4 on the metal mask M side. The recognition camera 24 and the substrate recognition camera 25 are in charge.

  Briefly describing the installation positions of the cameras 24 and 25, the mask recognition camera 24 is installed on the left side of the RZ stage 3A so as to be movable in the X-axis direction. The mask recognition camera 24 is driven in the Y-axis direction integrally with the substrate support unit 3 and is driven in the X-axis direction so that an image at an arbitrary position of the metal mask M (image on the lower surface of the mask) can be taken.

  The board recognition camera 25 is movable in the X axis direction along the camera support portion 25a, and the camera support member 25a is movable in the Y axis direction along the rail member 5a. When the substrate support unit 3 is at the position on the right side of FIG. 4 (dashed line display position: substrate transfer position, image pickup position) and the printed substrate P is unloaded, a new substrate P is loaded, and the substrate recognition camera 25 is loaded. Moves in the X-axis direction and further in the Y-axis direction to image fiducial marks F1 and F2.

  Thereafter, the substrate support unit 3 moves in the Y axis toward the left position (solid line display position: work position) in FIG. Further, the mask recognition camera 24 moves in the X-axis direction and images the mask fiducial marks F3 and F4. With the substrate support unit 3 stopped at a predetermined position in the Y-axis direction, the XY stage 3B and the RZ stage 3A are driven, and the substrate P is aligned with the metal mask M, and the metal mask M is moved from below the substrate P. Join.

  FIG. 6 is a block diagram showing an electrical configuration of the solder printing apparatus Z2. In the figure, reference numeral 30 denotes a controller that controls and controls the entire solder printing apparatus Z2. More specifically, the controller 30 is composed of a CPU, and is composed of a main control unit 31, a squeegee unit control unit 32, an XY stage control unit 33, an RZ stage control unit 34, an input / output unit 35 serving as an interface, The image processing unit 36 and storage means 37 are included. Reference numeral 38 shown in FIG. 6 denotes a reading device (an example of the “reading unit” in the present invention). The reading device 38 has a function of reading the ID information attached to the substrate P.

  The input / output unit 35 receives the ID information of the substrate P and the pre-printing substrate inspection information, and the image processing unit 36 receives the mask image obtained from the mask recognition camera 24 and the substrate image obtained from the substrate recognition camera 25. Are to be captured.

  The main control unit 31 of the controller 30 reads out necessary information from the storage unit 37 while controlling the devices 32 to 36, and performs a pass / fail judgment process for the metal mask M, a correction value calculation process, and a process according to the flowchart shown in FIG. Perform solder printing processing.

  The processes executed by the controller 30 include the processes of Step 50 to Step 130. Of these processes, the mask inspection of Step 60 and the determination process of Step 70 are performed by selecting the type of the substrate P to be flowed to the mounting line L. This is a process executed at the time of the changeover operation to be switched and at the start of production.

  For example, when the metal mask M is set in the setup change, the main control unit 31 gives designation to the XY stage control unit 33 and drives the XY stage 3B. Then, an image of the entire area of the metal mask M is acquired by the mask recognition camera 24.

  Then, the obtained mask image is taken into the image processing unit 36 and subjected to image analysis. Thereby, the positions of the fiducial marks F3 and F4 of the metal mask M are detected, and the metal mask M is inspected (step 60) in parallel with this.

  In the inspection of the metal mask M, in addition to detecting whether there is an abnormality that cannot be used for production in the installed mask M (crack, presence of crack, abnormal shape of the printing opening K), fiduciary The actual position of each printing opening K with respect to the char marks F3 and F4 (X2, Y2, etc. in FIG. 5) is detected, and this is designed based on design reference values (Xo, Yo, etc. in FIG. 5). ), The positional deviation of the printing opening K with respect to the design reference value is detected. In the example of FIG. 5, only one dimension drawing is shown, but actually, data at the four corners of each printing opening K is detected. These pieces of inspection information are temporarily stored in the storage means 37.

  When the process of step 60 is completed, the process proceeds to step 70 where the main control unit 31 performs a process of determining whether or not the metal mask M can be used. If it is determined that production is not possible, error processing for notifying abnormality is executed.

  The process of recognizing the mask fiducial in step 50 is performed in conjunction with the mask inspection when performing the above-described mask inspection, and to some extent when the solder printing apparatus Z2 is in operation. It is performed regularly (for example, once every few hours). The reason for periodically inspecting the positions of the fiducial marks F3 and F4 of the metal mask M is that the metal mask M may undergo thermal expansion and contraction if there is a change in room temperature or the like during operation. . Then, the fiducial marks F3 and F4 marked on the metal mask M also change their positions somewhat, and it is necessary to correct the change.

  Now, a printing process for printing on the substrate P using the metal mask M determined to have no abnormality in step 70 will be described in order.

  First, the substrate P to be printed is carried out from the pre-printing substrate inspection apparatus Z1 described above. The board | substrate P carried out is sent to the solder printing apparatus Z2 via a conveyor. Eventually, the substrate P is carried into the solder printing apparatus Z2, and is held in a state where it is positioned on the substrate support unit 3 that stands by at the substrate conveyance position indicated by the one-dot chain line in FIG.

  Thereafter, the substrate recognition camera 25 is driven in the X-axis and Y-axis directions to photograph the substrate P held on the substrate support unit 3. The obtained substrate image is taken into the image processing unit 36 where image analysis is performed. As a result, the positions of the fiducial marks F1 and F2 of the substrate P to be printed are detected, and a process for reading the ID information of the substrate P is executed by the reading device 38 in conjunction with this (step 80).

  Thereafter, the substrate support unit 3 located at the substrate transport position is driven in the Y-axis direction (left direction shown in FIG. 4). As a result, the substrate P to be printed reaches the working position below the metal mask M (the position indicated by the solid line in FIG. 4). At this time, if necessary, the mask recognition camera 24 performs a process of imaging the mask metal M, and the positions of the fiducial marks F3 and F4 of the metal mask M are inspected from the obtained mask image.

  Then, in parallel with the movement process of the substrate support unit 3, the processes of Step 90 and Step 100 are performed. As a result, the pre-printing board inspection information and the ID information added to the board inspection information in step 90 are read from the storage unit 37. In step 100, the inspection information of the printing opening K is read from the storage unit 37.

  Thus, when the reading of various information is completed, the process proceeds to step 110 thereafter. In step 110, a process of collating the ID information of the substrate P to be printed (ID information read in the process of step 80) with the ID information added to the pre-printing board inspection information is executed. If the ID information matches, the main control unit 31 executes a process for calculating a print position correction value based on the following four pieces of information.

(1) Pre-printing board inspection information (2) Inspection information of printing opening K (3) Position information of fiducial marks F1, F2 on the substrate (4) Position information of fiducial marks F3, F4 on the mask

  Now, the print position correction value here refers to the positional deviation of the printing opening K on the metal mask M side and the positional deviation of the pattern D on the substrate P side with respect to the design standard, and the print position is corrected. It means to do. That is, if the printing opening K and the pattern D are not deviated from the design standard, the printing opening K and the pattern D are matched if the fiducial marks F1 to F4 are made to coincide with each other. .

  On the other hand, in reality, due to the distortion of the substrate P and the distortion of the mask M, the positions of the printing openings K / patterns D are deviated from the design standard to some extent on the metal mask M side and the substrate P side. Yes. Therefore, as shown in FIG. 7, the fiducial mark F1 on the substrate P side and the fiducial mark F3 on the mask M side, and the fiducial mark F2 on the substrate P side and the fiducial mark F4 on the mask M side are provided. Even if they match, the pattern D of the substrate P and the printing opening K of the mask are shifted.

  Accordingly, an adjustment amount (printing position correction value) is determined in order to finely adjust the overlapping position of the substrate P with respect to the metal mask M so that the positional deviation between the printing opening K and the pattern D can be suppressed. It is.

  Specifically, the substrate P and the metal mask M have already been completed, and the position of the pattern D and the printing opening K itself cannot be individually adjusted. What can be adjusted is limited to the mutual positional relationship between the substrate P and the metal mask M (XY direction, rotation direction about the Z axis).

  Accordingly, when there are a plurality of patterns D that are misaligned with respect to the printing opening K, it is necessary to give priority to which pattern D should be adjusted.

  In the present embodiment, the adjustment is performed with priority given to the region where the pattern D is fine compared to other regions. That is, in the example of FIG. 7, since the area A is denser than the other areas, the area A is prioritized and adjustment is performed as follows.

  In the example of FIG. 7, the printing opening K of the metal mask M is displaced in the R direction as a whole with respect to the pattern D of the substrate P. Therefore, if the mutual position of the mask M and the substrate P is changed by the angle θ1 as shown in FIG. 8 with respect to the reference printing position shown in FIG. 7, the printing opening K of the mask M is compared with that before the movement. And the pattern D of the substrate P can be reduced. Therefore, in this case, the print position correction value is determined as an angle θ1 in the R direction.

  The processing function performed by the “printing position correcting means” of the present invention is realized by the processing of step 110 executed by the main control unit 31.

  Thus, when the process of step 110 is completed and the print position correction value is calculated, the process of step 120 is executed.

  In step 120, the position of the substrate support unit 3 at the work position is adjusted according to a command from the main control unit 31. That is, the XY stage 3B is driven, and the position of the substrate P is set so that the positional relationship between the printing opening K of the metal mask M and the pattern D of the substrate P becomes the positional relationship shown in FIG.

  Thus, when the substrate P is set at a desired position, the main control unit 31 gives a command to the RZ stage control unit 34, and this time drives the RZ stage 3A. As a result, the substrate P to be printed is lifted to the upper side of the apparatus while maintaining the positional relationship with respect to the metal mask M (the positional relationship in FIG. 8 in which the positional deviation is reduced). Eventually, the substrate P to be printed comes into contact with the lower surface of the metal mask M.

  Then, the main control unit 31 gives a command to the squeegee unit control unit 32 to drive the squeegee unit 5. Thus, the squeegee unit 5 is lowered in the Z direction, and the squeegee Z contacts the metal mask M.

  Thereafter, the solder supplied onto the mask metal M by the solder supply device is stretched while the squeegee 22 reciprocates in the Y-axis direction. As a result, the solder is embedded in the printing opening K, and the solder is printed at a desired position on the substrate P.

  Thus, solder is printed on the pattern D of the substrate P at the position shown in FIG. If the correction process in step 100 shown in FIG. 2 is not executed, the solder printing position is shifted with respect to the pattern D on the substrate P as shown in FIG. The overlapping area becomes smaller. With this configuration, the solder can be printed with almost no positional deviation with respect to the pattern D on the substrate P, and the overlapping area between the pattern D and the solder can be increased.

  When the solder printing process is completed in step 120, the board P after the solder printing is transferred to the mounting machine Z3 described below via the conveyor. In parallel with the transfer process of the board P, the following three pieces of information are transmitted from the solder printing apparatus Z2 to the mounting machine Z3 (step 130).

(1) ID information (2) Pre-printing board inspection information (3) Print position correction value (in the above example, angle θ1 in the R direction)
This print position correction value corresponds to an example of “print position information related to the corrected print position” of the present invention.

  The transmitted information is received by the mounting machine Z3 described below. Then, the mounting machine Z3 performs processing for temporarily storing the ID information, the pre-printing inspection information, and the print position correction value in the storage unit 182 described later.

4). Configuration of Mounting Machine Z3 Next, the configuration of the mounting machine Z3 will be described. FIG. 9 is a plan view of the mounting machine Z3.
As shown in FIG. 9, the mounting machine Z3 includes a conveyor 120 that conveys the substrate P, a component supply unit 130, a head unit 140, and various servo mechanisms (XY servo mechanism 160, Z) using motors 161 to 164 as drive sources. An axis servo mechanism (not shown), an R axis servo mechanism (not shown), and the like are included.

  The head unit 140 and various servo mechanisms correspond to the head driving means of the present invention.

  The component supply unit 130 is a supply location of components to be mounted on the printed circuit board P, and a plurality of component supply devices 150 such as tape feeders are arranged in parallel there.

  The head unit 140 has a function of picking up a component from the component supply device 150 and moving it onto the substrate P. The head unit 140 has an XY servo mechanism 160 in an area extending between the component supply unit 130 and the component mounting position on the substrate P. It can be moved by.

  In the head unit 140, as shown in FIG. 10, suction heads (an example of the “mounting head” of the present invention) 141 are arranged in a line. At the tip of each of these suction heads 141, a suction nozzle 142 for sucking components and mounting them on the substrate P is provided. Each nozzle 142 is supplied with a negative pressure from a negative pressure means (not shown) at the time of component suction, and sucks and picks up the component with a suction force by the negative pressure.

  Each suction head 141 can be moved in the Z-axis direction and rotated around the R-axis (nozzle center axis) by the Z-axis servo mechanism and the R-axis servo mechanism. With the above configuration, by operating each servo mechanism and driving the head unit 140, the component is picked up from the component supply device 150, and the picked-up component is placed in a predetermined component mounting position (details will be described later, but after correction) It can be mounted at the component mounting position.

  In addition, the component recognition camera 115 and the board recognition camera 145 are installed in the mounting machine Z3. As shown in FIG. 9, the component recognition camera 115 is installed on the base 110. The component recognition camera 115 has a function of imaging the component sucked by the suction head 141 and inspecting the suction position shift of the component.

  On the other hand, the substrate recognition camera 145 is fixed to the head unit 140 with the imaging surface facing downward, as shown in FIG. Thereby, the image of the arbitrary positions on the board | substrate P can be imaged by driving the above-mentioned head unit 140 to XY direction. And based on the obtained board | substrate image, it is set as the structure which recognizes the fiducial marks F1 and F2 attached | subjected to the board | substrate P, or test | inspects the mounting condition etc. of the components mounted on the board | substrate P. .

Next, the electrical configuration of the mounting machine Z3 will be described with reference to FIG.
The entire mounting machine Z3 is controlled and controlled by a controller 180. The controller 180 includes a main control unit 181 configured by a CPU or the like and responsible for calculation / control functions, a storage unit 182 that stores information such as a mounting program, and a motor control unit 183 that controls and drives various motors 161 to 164. An input / output unit 184 and an image processing unit 185 are provided as interfaces. Reference numeral 188 shown in FIG. 11 is a reading device (an example of the “reading unit” in the present invention). The reading device 188 has a function of reading the ID number assigned to the substrate P.

  The input / output unit 35 receives the ID information of the substrate P, the pre-printing substrate inspection information, and the print position correction value, and the image processing unit 36 receives the component image obtained from the component recognition camera 115 and the substrate recognition camera 145. Further obtained substrate images are captured.

  The main control unit 181 of the controller 180 reads out necessary information from the storage unit 182 while controlling the devices 183 to 185, and mounts components on the board P printed with solder according to the flowchart shown in FIG. Perform processing.

  Next, a component mounting process executed in the mounting machine Z3 will be described. First, the board P to be mounted with components is unloaded from the solder printing apparatus Z2, and then sent to the mounting machine Z3 via the conveyor 120. Eventually, the substrate P is carried into the mounting machine Z3 and held by a substrate support device (not shown).

  Thereafter, each servo mechanism is actuated by a command from the main controller 181 to drive the head unit 140. As a result, the substrate recognition camera 145 provided in the head unit 140 moves above the substrate P and takes an image of the substrate P. The obtained substrate image is taken into the image processing unit 185 where image analysis is performed. Thereby, the positions of fiducial marks F1, F2 attached to the substrate P are detected. In addition to the analysis of the substrate image, the reading device 188 reads the ID information of the substrate P (step 200).

  Thus, when the substrate P is carried in and the positions of the fiducial marks F1 and F2 are detected, each servo mechanism is actuated by the command of the main controller 181 and the head unit 140 is driven again. As a result, the suction head 141 together with the head unit 140 is transferred onto the component supply device 150 of the component supply unit 130 and is moved up and down at that position.

  By this elevation, the component pick-up operation, that is, the suction head 141 sucks and holds the component to be mounted with a negative pressure. Thereafter, the head unit 140 is driven again, and the suction head 141 passes over the component recognition camera 115. At this time, imaging is executed by the component recognition camera 115, and a component image of the sucked component is acquired. The obtained component image is captured by the image processing unit 185, where image analysis is performed, and a component suction position shift with respect to the suction head 141 is inspected (step 210).

  Thereafter, the component sucked by the suction head 141 is transferred to the component mounting position on the substrate P. In the process, the processes of Step 220 and Step 230 described below are executed in order.

  First, in step 220, processing for reading out the ID information, the pre-printing inspection information, and the print position correction value from the storage unit 182 is performed.

  When the reading of information is completed, the process proceeds to step 230. In step 230, a process of comparing the ID information of the substrate P (ID information read in the process of step 200) with the ID information added to the pre-printing board inspection information is executed. And if both ID information corresponds, the process which determines a component mounting position correction value based on the following 4 information will be performed by the main control part 181. FIG.

(1) Pre-printing board inspection information (2) Print position correction value (in the above example, angle θ1 in the R direction)
(3) Position of fiducial marks F1 and F2 on the substrate P (4) Deviation of the suction position of the component

  Specifically, the component mounting position is optimally determined so that the terminals B1 and B2 of the component B are placed on the region where the pattern D of the substrate P and the printed solder overlap. If the component mounting position can be set in this way, the overlapping area S where the pattern D, the solder, and the three elements of the terminals B1 and B2 overlap can be secured most widely (see FIG. 12).

  On the other hand, the design of the pattern D formed on the substrate P is determined based on the fiducial marks F1 and F2, and the printing position of the solder is basically the fiducial marks F1 and F2. Determined by standards. Therefore, in the past, the component mounting position (see FIG. 13A) was determined based on the marks F1 and F2. When the component B is mounted at such a position, if the actual position of the pattern D matches the design standard, the overlapping area S can be secured to a certain extent.

  However, as described in the solder printing apparatus Z2, the actual position of the pattern D on the substrate P is displaced from the design standard. In this example, the printing position is corrected when performing solder printing in consideration of this positional deviation. Therefore, even if the component B is mounted at the reference component mounting position shown in FIG. 13A, the overlapping area S cannot be sufficiently secured.

  Therefore, in the process of step 230, a correction process is added to the reference component mounting position shown in FIG. 13A according to the actual position of the pattern D and the solder printing position. If there is a component adsorption position deviation, the component adsorption position deviation is also taken into account when performing this correction process.

  FIG. 13C shows a correction example of this embodiment. In the example of FIG. 13, the actual position of the pattern D and the printing position of the solder are both shifted to the right in FIG.

  Accordingly, in the above example, the distance d1 shown in FIG. 13 is a correction value, and the position shown in FIG. 13 (c) is shifted to the right by the distance d1 from the position shown in FIG. The corrected component mounting position. At this position, the terminals B1 and B2 of the component B are placed on a region where both the pattern D of the substrate P and the printed solder overlap, and the overlapping area of the three elements of the pattern D, solder, and terminals B1 and B2 S is secured most widely.

  In the present embodiment, the actual position of the pattern D on the substrate P is obtained from the pre-printing board inspection information, and the printing position of the solder is obtained from the printing position correction value. The processing function performed by the “mounting position correcting means” of the present invention is realized by the processing of step 230 executed by the main control unit 181.

  FIG. 13B shows an example in which the component mounting position is corrected in consideration of only the solder printing position. If the correction is made in this way, the terminals B1 and B2 of the component B are removed from the pattern D of the substrate P, the overlapping area S is narrowed, and the operation of this embodiment cannot be obtained.

  Thus, when the process in step 230 is completed, the process proceeds to step 240. In step 240, the main control unit 181 gives a control command to the motor control unit 183 while reflecting the correction value calculated in step 230. As a result, the servo mechanism 160 is driven, and the component is mounted on the substrate P at the corrected component mounting position.

  The process of correcting the mounting position in step 230 is basically performed individually for each component. As a result, each component can be mounted on the substrate P shown in FIG. 14 without mounting defects.

  As described above, in this embodiment, the inspection information (substrate inspection information before printing) performed before printing is used in the mounting process. By doing so, printing defects and component mounting defects can be reduced, and the manufacturing quality is increased in the mounting process.

  In the present embodiment, the solder mounting position is taken into account when the component mounting position correction value is calculated by the mounting machine Z3. The theoretical value (printing position correction value) is used for this. Originally, from the aspect of component mounting accuracy, the printing position where the solder is actually printed is inspected, the result is transmitted to the mounting machine Z3, and the component mounting position correction value is calculated. It is best to see.

  However, if the inspection of the printing position is performed for each substrate P, the tact time is prevented from being shortened. In this respect, in the present embodiment, the inspection result of the printing position is substituted by a theoretical value (printing position correction value). Therefore, it is possible to shorten the tact time while securing the component mounting accuracy that is almost the same as when the print position is inspected.

<Embodiment 2>
Next, Embodiment 2 of the present invention will be described with reference to FIG.
In the first embodiment, the pre-print inspection apparatus Z1 detects the displacement of the actual position of the pattern D with respect to the fiducial marks F1 and F2 as the pre-print inspection information. However, in the second embodiment, the actual pattern D is detected. In addition to the position shift, the presence or absence of foreign matter adhering to the substrate P is detected. And it was set as the structure which transmits the information regarding the shift | offset | difference of the actual position of the pattern D, and foreign material adhesion information from the board | substrate inspection apparatus Z1 before printing to the solder printing apparatus Z2.

  On the other hand, as shown in FIG. 15, the solder printing apparatus Z2 is newly provided with a foreign substance removing device (corresponding to “foreign substance removing means” of the present invention) 39 in addition to the configuration of the first embodiment. Concerning the configuration of the foreign matter removing device 39, a foreign substance adhering to the substrate P is picked up and removed while removing the foreign matter (for example, a suction nozzle for adsorbing parts with a suction force due to negative pressure) and the removal head as a substrate. What is necessary is just to be comprised from the drive means (not shown) which moves to the arbitrary positions on P and raises / lowers to a Z direction.

  Then, when the foreign matter adhesion information is transmitted from the pre-printing board inspection apparatus Z1 to the solder printing apparatus Z2, the foreign substance on the corresponding board P is removed by the previous foreign substance removing apparatus 39. With such a configuration, it is possible to avoid the situation in which solder printing and component mounting are carried out with the foreign matter adhering to the substrate P, so the number of defective products generated in the manufacturing process can be reduced. In addition, manufacturing quality is increased.

<Embodiment 3>
Next, Embodiment 3 of the present invention will be described with reference to FIG.
In the first embodiment, a part of the mounting line L is configured by the pre-printing board inspection apparatus Z1, the solder printing apparatus Z2, and the surface mounting machine Z3. On the other hand, in the third embodiment, the solder printing device Z2 and the surface mounter Z3 are left as they are, and the pre-printing board inspection device Z1 is abolished.

  Generally, the board P that is flowed to the mounting line L is delivered as a component, but in the stage of manufacturing the board P, after the board P is manufactured, the board P is inspected (distortion of the board, The position of the pattern D is inspected). Accordingly, inspection data at the time of board manufacture, that is, board inspection information before solder printing is stored in a storage medium C such as a CD-ROM together with ID information, and this is read by the solder printing apparatus Z2 so as to be printed. The board inspection information can be given to the solder printing apparatus Z2.

  As described above, even if the pre-printing board inspection apparatus Z1 is not installed at the head of the mounting line L, as long as there is pre-printing board inspection information, the same effect as that of the first embodiment, that is, pre-printing board inspection information. Is utilized in the mounting process, printing defects and component mounting defects can be reduced, and the manufacturing quality in the mounting process is enhanced.

  As already described, the substrate P to be printed and the pre-printing substrate information are both managed by ID, and can be individually identified. Therefore, even if a large amount of data is stored in the storage medium C, if the ID is referred to, the pre-printing board inspection information corresponding to the board P to be printed can be read without error, and the data is not confused. . In addition, here, the configuration in which the pre-printing board inspection information and the ID information are provided to the solder printing apparatus Z2 through the storage medium C is exemplified, but other configurations may be provided through a network.

<Embodiment 4>
Next, a fourth embodiment of the present invention will be described with reference to FIGS.
In the first embodiment, a part of the mounting line L is configured by the pre-printing board inspection apparatus Z1, the solder printing apparatus Z2, and the surface mounting machine Z3. On the other hand, in the fourth embodiment, an adhesive coating device (an example of the “coating device” of the present invention) Z4 is newly added to these devices, and the pre-printing board inspection device Z1, the solder printing device Z2, and the adhesive coating device. A part of the mounting line L is configured by arranging devices in the order of Z4 and the surface mounting machine Z3. The adhesive (an example of the “coating liquid” of the present invention) is solidified when heated in a reflow furnace, and adheres and fixes the substrate P and the component B. In the stage before component mounting is performed. Then, it is applied at a position where it does not interfere with the pattern D, the terminals B1, B2, etc. of the component B (see FIG. 18).

  FIG. 19 shows a general configuration of the adhesive application device Z4. The adhesive application device Z4 has a configuration similar to that of the mounting machine Z3, and a conveyor 220 for transporting the substrate P and a head unit 240 are provided on the base 210. The head unit 240 is driven (moved) in the XY directions by an XY servo mechanism 250. A dispenser head 260 is mounted on the head unit 240 (see FIG. 20).

  The dispenser head 260 can move in the Z direction (up and down direction) and rotate around the R axis (vertical axis) with respect to the frame of the head unit 240, and the Z axis servo motor and the R axis servo motor (not shown) respectively. It is designed to be driven.

  With the above-described configuration, the nozzle unit 261 provided at the tip of the dispenser head 260 is moved while the dispenser head 260 is moved to a predetermined position while the head unit 240 is moved relative to the substrate P, and then the dispenser head 260 is moved up and down. The adhesive is applied onto the substrate P by extruding a paste adhesive from the tip of the substrate.

  Also, a substrate recognition camera 270 for recognizing fiducial marks F1 and F2 attached to the substrate P is mounted on the head unit 240 of the adhesive application device Z4 as in the mounting machine Z3.

  Accordingly, prior to the adhesive application operation, the positions of the fiducial marks F1 and F2 on the substrate P are detected, and the positions of the obtained fiducial marks F1 and F2 are transmitted from the solder printing apparatus Z2. Based on the following three pieces of information, the adhesive application position is corrected in the same manner as described in the first embodiment (step 150 and step 160).

(1) ID information (2) Pre-printing board inspection information (3) Print position correction value

  By adopting such a configuration, the positional deviation of the pattern D and the printing position correction value are reflected in the application of the adhesive, and as a result, the adhesive is applied on the pattern D or the printing position. This can be avoided in advance, and the adhesive can be accurately applied to the optimum position on the substrate P (step 170). When the application of the adhesive is completed, the process of step 180 is executed, and the following four pieces of information are transmitted from the adhesive application device Z4 to the mounting machine Z3.

(1) ID information (2) Pre-printing board inspection information (3) Print position correction value (4) Adhesive application correction value

  As described above, if the adhesive correction value is transmitted to the mounting machine Z3 in addition to the ID information, the pre-printing board inspection information, and the printing position correction value, the component mounting position including the adhesive correction value is corrected. As a result, a precise component mounting operation can be realized.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention, and further, within the scope not departing from the gist of the invention other than the following. Various modifications can be made.

  (1) In the first to fourth embodiments, the information such as the pre-printing substrate inspection information is sequentially transmitted from the upstream device to the downstream device. However, it is only necessary that the system is constructed so that each apparatus constituting the line can share the pre-printing board inspection information and the information corrected in other apparatuses by some method. For example, as shown in FIG. Alternatively, a management computer 400 that monitors the entire line may be installed, and the above-described information may be centrally managed by the management computer 400. A system constructed in this way corresponds to the transmission of information indirectly through others, as used in the present invention.

  (2) The thing of FIG. 23 adds the solder test | inspection apparatus Z5 with respect to the structure of Embodiment 4, and measures the printing position of solder. Then, a deviation amount of the printing position with respect to the design standard is calculated from the actually measured printing position of the solder, and this is transmitted to the adhesive application device Z4 and, consequently, to the mounting machine Z3. In this way, the actual printing position of the solder can be reflected in the application of the adhesive and the mounting of the component.

The figure which shows the line structure of the mounting line applied to Embodiment 1. FIG. The flowchart figure which shows the flow of the process performed with each apparatus which comprises a line Plan view of substrate P Sectional view showing the main parts of the solder printer Plan view of design standard, substrate, and metal mask (shows substrate P and mask distortion) Block diagram showing the electrical configuration of the solder printer The figure which shows the state which piled up the substrate and the mask on the basis of fiducial mark The figure which shows the state adjusted position so that the shift | offset | difference of a pattern and the opening part for printing may become small from the position shown in FIG. Top view of mounting machine Enlarged view of the head unit and its surroundings Block diagram showing the electrical configuration of the mounting machine Illustration of overlapping area S (A) Diagram showing component mounting position (reference) (b) Diagram showing component mounting position (when only printing position is considered) (c) Diagram showing component mounting position (print position and actual pattern position) When both are considered) The figure which shows the state where components are mounted on the board The block diagram which shows the electric constitution of the solder application apparatus in Embodiment 2. The figure which shows the line structure of the mounting line in Embodiment 3. The figure which shows the line structure of the mounting line in Embodiment 4. Diagram showing adhesive application position Top view of adhesive applicator Enlarged view of the head unit and its surroundings The flowchart figure which shows the flow of a process of each apparatus which comprises a mounting line. The figure which shows other embodiment The figure which shows other embodiment

Explanation of symbols

3 ... Substrate support unit (an example of "relative drive means" of the present invention)
4 ... holding part (an example of the "holding means" of the present invention)
31... Main control section (an example of “printing position correction means” of the present invention, an example of “second control means”)
141... Mounting head 180... Controller 181... Main controller (an example of “mounting position correcting means” and an example of “first control means” in the present invention)
B ... Part D ... Pattern P ... Board M ... Metal mask L ... Mounting line Z1 ... Pre-printing board inspection device Z2 ... Solder printing device (an example of "screen printing device" of the present invention)
Z3 ... Mounting machine Z4 ... Adhesive coating device (an example of "coating device" of the present invention)

Claims (10)

A surface mounting machine comprising a mounting head and a head driving means for driving the mounting head, wherein the mounting head moves and mounts components to a component mounting position on a printed board,
A mounting position correcting means for correcting the component mounting position based on pre-printing board inspection information obtained by inspecting the board before the printing is performed, and printing position information relating to the printing position;
A surface mounter comprising: first control means for controlling the head driving means based on the corrected component mounting position. The surface mounting machine according to claim 1, wherein the pre-printing board inspection information is position information of electrodes formed on the board. A mask having a printing opening; holding means for holding a substrate which is a substrate to be printed; and relative driving means for relatively moving the mask and the holding means. The holding means is operated by the operation of the relative driving means. A screen printing apparatus that performs printing on the substrate while stacking the substrate held on the substrate and the mask,
A printing position correcting unit that corrects the printing position with respect to the substrate based on pre-printing substrate inspection information obtained by inspecting the substrate before the printing is performed;
A screen printing apparatus comprising: a second control unit that controls the relative driving unit based on a corrected printing position. The screen printing apparatus according to claim 3, wherein the pre-printing board inspection information is position information of electrodes formed on the board. 5. The screen printing apparatus according to claim 3, wherein the printing position correction unit performs the correction by giving priority to a region in which the electrode arrangement pattern is fine as compared with other regions. 6. The screen printing apparatus according to claim 3, wherein the pre-printing board inspection information is foreign matter adhesion information attached on a substrate. The screen printing apparatus according to claim 6, further comprising a foreign matter removing unit that removes the foreign matter attached to the substrate. A pre-printing board inspection apparatus having board inspection information acquisition means for acquiring pre-printing board inspection information based on a substrate image obtained from an imaging means;
A screen printing apparatus according to any one of claims 3 to 7,
The surface mounter according to claim 1 or claim 2 is arranged in order along the production line,
After the substrate is inspected by the pre-printing substrate inspection apparatus, the inspected substrate is sent to the screen printing apparatus to perform a predetermined printing process, and the printed board is sent to the surface mounter. An implementation line to be implemented,
The pre-print board information is transmitted from the pre-print board inspection apparatus to the screen printing apparatus and the surface mounter, either directly or indirectly via another,
A mounting line characterized in that printing position information related to the corrected printing position is transmitted from the screen printing apparatus to the surface mounting machine directly or indirectly via another. In what is readable to the substrate and is given in advance a unique information for identifying each substrate,
The pre-printing board inspection apparatus, the screen printing apparatus, and the surface mounter are each provided with reading means capable of reading the specific information, and information exchange between each apparatus constituting a mounting line is performed by the specific information. The mounting line according to claim 8, wherein the mounting line is configured to be executed in a manner associated with the mounting line. An applicator comprising: a dispenser head that discharges a coating liquid; and a head driving unit that drives the dispenser head; and a coating apparatus that applies the coating liquid by transferring the dispenser head to a coating position on a printed substrate. The mounting line according to claim 8 or 9, wherein a manufacturing line is constructed by arranging between a screen printing apparatus and the surface mounting machine.

Images