[go: up one dir, main page]

JP2008194904A - Resin sealing device - Google Patents

Resin sealing device Download PDF

Info

Publication number
JP2008194904A
JP2008194904A JP2007031138A JP2007031138A JP2008194904A JP 2008194904 A JP2008194904 A JP 2008194904A JP 2007031138 A JP2007031138 A JP 2007031138A JP 2007031138 A JP2007031138 A JP 2007031138A JP 2008194904 A JP2008194904 A JP 2008194904A
Authority
JP
Japan
Prior art keywords
substrate
sealing
resin
mold
compression molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007031138A
Other languages
Japanese (ja)
Other versions
JP5010303B2 (en
Inventor
Akihiro Ukita
明宏 浮田
Masanobu Yusa
正信 遊佐
Tsutomu Miyatake
勤 宮武
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Heavy Industries Ltd
Original Assignee
Sumitomo Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Priority to JP2007031138A priority Critical patent/JP5010303B2/en
Publication of JP2008194904A publication Critical patent/JP2008194904A/en
Application granted granted Critical
Publication of JP5010303B2 publication Critical patent/JP5010303B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/50—Improvements relating to the production of bulk chemicals
    • Y02P20/52—Improvements relating to the production of bulk chemicals using catalysts, e.g. selective catalysts

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

【課題】圧縮成形金型を複数有する樹脂封止装置のコンパクト化及び封止生産性の向上。
【解決手段】半導体チップが搭載された基板を樹脂封止するための樹脂封止装置１００であって、封止前基板の供給及び封止後基板の収納がされる基板ストック部１０４と、一列に配列された複数の圧縮成形金型１１０と、圧縮成形金型１１０の配列方向と平行に配置されるＸ方向ガイド１０６と、該Ｘ方向ガイド１０６上を移動可能であって圧縮成形金型１１０に対する封止前基板の搬入と圧縮成形金型１１０からの封止後基板の搬出の双方を行なう基板搬送機構１１２と、を備え、基板ストック部１０４を圧縮成形金型１１０に対して同じ側に配置する。
【選択図】図１A resin sealing device having a plurality of compression molding dies is made compact and the sealing productivity is improved.
A resin sealing apparatus 100 for resin-sealing a substrate on which a semiconductor chip is mounted, the substrate stock section 104 for supplying a substrate before sealing and storing the substrate after sealing, and a row A plurality of compression molding dies 110 arranged in parallel, an X direction guide 106 arranged parallel to the arrangement direction of the compression molding dies 110, and movable on the X direction guide 106. And a substrate transport mechanism 112 for both carrying in the substrate before sealing and unloading the substrate after sealing from the compression molding die 110, and the substrate stock portion 104 on the same side with respect to the compression molding die 110. Deploy.
[Selection] Figure 1

Description

本発明は、半導体チップが搭載された基板を樹脂封止するための樹脂封止装置の技術分野に関する。   The present invention relates to a technical field of a resin sealing device for resin sealing a substrate on which a semiconductor chip is mounted.

従来、図５に示した圧縮成形金型１０が公知である。圧縮成形金型１０は、上型１０Ａと下型１０Ｂとで構成される。この圧縮成形金型１０では、封止前基板７０が上型１０Ａに保持され、且つ、下型１０Ｂにリリースフィルム９０を介して樹脂８０が配置された状状態で、両金型１０Ａ、１０Ｂが閉じることによって、樹脂による基板の圧縮成形が行われる。   Conventionally, a compression mold 10 shown in FIG. 5 is known. The compression mold 10 includes an upper mold 10A and a lower mold 10B. In this compression mold 10, both molds 10 </ b> A and 10 </ b> B are held in a state where the substrate 70 before sealing is held by the upper mold 10 </ b> A and the resin 80 is disposed on the lower mold 10 </ b> B via the release film 90. By closing, the substrate is compression-molded with resin.

このような圧縮成形金型１０を備える樹脂封止装置全体の概略構成は図６のようになる（例えば特許文献１参照）。樹脂封止装置１は、ベース部１２の略中央に圧縮成形金型１０が配置され、当該圧縮成形金型１０を挟んで一方側に封止前基板供給部１４が配置され、他方側に封止後基板収納部１８が配置される。即ち、装置内における基板の概略的な流れは、図６において矢示したように一方向（図６において左から右へ）となる。   A schematic configuration of the entire resin sealing apparatus including such a compression mold 10 is as shown in FIG. 6 (see, for example, Patent Document 1). In the resin sealing device 1, a compression molding die 10 is disposed at substantially the center of the base portion 12, a pre-sealing substrate supply unit 14 is disposed on one side of the compression molding die 10, and sealing is performed on the other side. After stopping, the substrate storage portion 18 is arranged. That is, the schematic flow of the substrate in the apparatus is in one direction (from left to right in FIG. 6) as indicated by an arrow in FIG.

特開２００６−３１５１８４号公報 図１Japanese Patent Laid-Open No. 2006-315184 FIG.

しかしながら、上記の樹脂封止装置１のような構成を採用する限りにおいて、装置全体をコンパクトに構成することは困難である。特に、装置内に圧縮成形金型を複数有する、所謂「マルチプレス」の樹脂封止装置の場合には、金型の数に対応した封止前基板供給部や、封止後基板収納部を設ける必要がある。仮に、搬送機構によって、一の封止前基板供給部から複数の金型に封止前基板の搬入を行ったり、複数の金型から一の封止後基板収納部に封止後基板の搬出を行うとしても、封止前基板供給部と封止後基板収納部とが金型を挟んで配置されていれば、それぞれ別系統の搬送機構が必要となる。その結果、装置の構成が複雑となる（即ちコスト高となる）他、装置全体での必要となるスペースが大きくなってしまう。   However, as long as the configuration like the resin sealing device 1 described above is adopted, it is difficult to make the entire device compact. In particular, in the case of a so-called “multi-press” resin sealing apparatus having a plurality of compression molds in the apparatus, a pre-sealing substrate supply section corresponding to the number of molds and a post-sealing substrate storage section are provided. It is necessary to provide it. Temporarily, the pre-sealing substrate is loaded into a plurality of dies from one pre-sealing substrate supply unit by the transport mechanism, or the post-sealing substrate is unloaded from the plurality of dies to one post-sealing substrate storage unit. Even if it performs, if the board | substrate supply part before sealing and the board | substrate accommodating part after sealing are arrange | positioned on both sides of a metal mold | die, a conveyance mechanism of a different system will be needed, respectively. As a result, the configuration of the apparatus becomes complicated (that is, the cost increases), and the space required for the entire apparatus increases.

本発明はこのような問題点を解決するべくなされたものであって、装置内に複数の圧縮成形金型を有する場合においても、省スペース且つ低コストで実現できる樹脂封止装置を提供するものである。   The present invention has been made to solve such problems, and provides a resin sealing device that can be realized in a space-saving and low-cost manner even when a plurality of compression molding dies are provided in the device. It is.

本発明は、半導体チップが搭載された基板を樹脂封止するための樹脂封止装置であって、樹脂封止前の封止前基板が供給される封止前基板供給部と、樹脂封止後の封止後基板が収納される封止後基板収納部と、一列に配列された複数の圧縮成形金型と、前記圧縮成形金型の配列方向と平行に配置される移動ガイドと、該移動ガイド上を移動可能であって前記圧縮成形金型に対する前記封止前基板の搬入と前記圧縮成形金型からの封止後基板の搬出の双方を行なう基板搬送機構と、を備え、前記封止前基板供給部と前記封止後基板収納部とが、共に前記圧縮成形金型に対して同じ側に配置することにより、上記課題を解決するものである。   The present invention relates to a resin sealing device for resin sealing a substrate on which a semiconductor chip is mounted, a pre-sealing substrate supply unit to which a pre-sealing substrate before resin sealing is supplied, and a resin sealing A post-sealing substrate storage portion in which a post-sealing substrate is stored, a plurality of compression molding dies arranged in a row, a movement guide arranged in parallel with the arrangement direction of the compression molding dies, A substrate transport mechanism which is movable on a moving guide and carries both the carry-in of the substrate before sealing into the compression mold and the unloading of the substrate after sealing from the compression mold; Both the pre-stop substrate supply unit and the post-sealing substrate storage unit are arranged on the same side with respect to the compression mold, thereby solving the above-described problem.

このような構成としたことで、樹脂封止装置全体をコンパクトに構成することが可能となっている。即ち、一列に配列した複数の金型と平行に移動可能且つ搬入・搬出作業の双方を行う基板搬送機構を設け、更に、金型に対して封止前基板供給部と封止後基板収納部とを同じ側に配置することで金型を挟んで封止前基板供給部と封止後基板収納部を配置する必要がない。この点見方を変えれば、金型を挟んで対向する側に補機類（例えば後述する樹脂供給部など）を設置するためのスペースを確保することができる。また、一の基板搬送機構によって搬入・搬出の双方を行うことが可能であるため、装置内における基板搬送機構の移動スペース（移動ガイドを含む）を２系統確保する必要もない。その結果、樹脂封止装置全体としてのコンパクト化を実現することが可能となっている。   With such a configuration, the entire resin sealing device can be configured in a compact manner. In other words, a substrate transport mechanism that can move in parallel with a plurality of molds arranged in a row and performs both loading and unloading operations is provided, and further, a substrate supply unit before sealing and a substrate storage unit after sealing with respect to the molds Are disposed on the same side, so that it is not necessary to dispose the pre-sealing substrate supply part and the post-sealing substrate storage part across the mold. If this point of view is changed, it is possible to secure a space for installing auxiliary machinery (for example, a resin supply unit described later) on the opposite side across the mold. In addition, since both loading and unloading can be performed by one substrate transport mechanism, it is not necessary to secure two systems of movement space (including a movement guide) for the substrate transport mechanism in the apparatus. As a result, it is possible to achieve a compact resin sealing device as a whole.

また、前記基板搬送機構が、自身の一部を前記圧縮成形金型内に進入させて前記基板の搬送を行なっており、一度の進入で前記搬入と前記搬出が完了する構成とすれば、基板の受渡しに要する時間を短縮できる。その結果、同様のスピードで移動ガイド上を移動できる一の基板搬送機構でより多数の圧縮成形金型に対応することが可能となり、所謂封止の生産性が向上する。   In addition, if the substrate transport mechanism has a configuration in which a part of itself enters the compression mold to transport the substrate, and the carry-in and the carry-out are completed in one entry, the substrate The time required for delivery can be shortened. As a result, it is possible to cope with a larger number of compression molding dies with a single substrate transport mechanism that can move on the moving guide at the same speed, and so-called sealing productivity is improved.

また、更に、前記圧縮成形金型に投入される樹脂が供給される樹脂供給部を供え、該樹脂供給部が、前記圧縮成形金型を挟んで（スペース的に余裕のある）前記封止前基板供給部及び前記封止後基板収納部と対向する側に配置するように構成すれば、往々にして異物（粉塵など）となり得る樹脂が供給される樹脂供給部の位置を基板の供給位置、収納位置から隔離することができ、異物による封止異常の発生を低減することが可能となる。   Furthermore, a resin supply unit to which resin to be charged into the compression molding die is supplied is provided, and the resin supply unit sandwiches the compression molding die (with sufficient space) before the sealing. If the substrate supply unit and the post-sealing substrate storage unit are arranged to face each other, the position of the resin supply unit to which resin that can be a foreign substance (such as dust) is supplied is often the substrate supply position, It can be isolated from the storage position, and it is possible to reduce the occurrence of sealing abnormality due to foreign matter.

また、前記封止前基板供給部と前記封止後基板収納部とを、上下に配置すれば、装置全体を水平方向によりコンパクトに構成することが可能となる。   Further, if the pre-sealing substrate supply unit and the post-sealing substrate storage unit are arranged vertically, the entire apparatus can be configured more compactly in the horizontal direction.

本発明を適用することにより、圧縮成形金型を複数有する樹脂封止装置をコンパクトに構成することができると共に、封止の生産性を向上させることができる。   By applying the present invention, a resin sealing device having a plurality of compression molding dies can be configured in a compact manner, and the sealing productivity can be improved.

以下、添付図面を参照しつつ、本発明の実施形態の一例について詳細に説明する。   Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

図１は、本発明の実施形態の一例である樹脂封止装置１００の概略構成平面図である。図２は、図１における矢示II方向からみた基板ストック部１０４を示した図である。図３は、図１における矢示III方向からみた基板搬送機構１１２を示した図である。図４は、図１における矢示IV方向からみた金型１１０と基板搬送機構１１２を示した図である。   FIG. 1 is a schematic configuration plan view of a resin sealing device 100 as an example of an embodiment of the present invention. FIG. 2 is a diagram showing the substrate stock portion 104 as seen from the direction of arrow II in FIG. FIG. 3 is a diagram showing the substrate transport mechanism 112 as seen from the direction of arrow III in FIG. FIG. 4 is a diagram showing the mold 110 and the substrate transport mechanism 112 as seen from the direction of arrow IV in FIG.

樹脂封止装置１００は、当該装置の基台となるベース部１０２上に、基板がストックされる基板ストック部１０４と、樹脂が供給される樹脂供給部１０８と、これら基板ストック部１０４及び樹脂供給部１０８との間に並んで一列に配置される４つの圧縮成形金型１１０を備えている。また、ベース部１０２には基板ストック部、樹脂供給部１０８、圧縮成形金型１１０の並びと平行して、Ｘ方向ガイド１０６が設置されている。このＸ方向ガイド１０６上には、基板搬送機構１１２及び樹脂用ローダ１３０が配置されている。これら基板搬送機構１１２及び樹脂用ローダ１３０は、一列に複数配置された金型１１０に対する搬送機構として機能する。   The resin sealing device 100 includes a substrate stock portion 104 on which a substrate is stocked, a resin supply portion 108 to which a resin is supplied, a substrate stock portion 104 and a resin supply on a base portion 102 serving as a base of the device. There are four compression molding dies 110 arranged in a row in line with the portion 108. In addition, an X-direction guide 106 is installed in the base portion 102 in parallel with the arrangement of the substrate stock portion, the resin supply portion 108, and the compression mold 110. A substrate transport mechanism 112 and a resin loader 130 are disposed on the X-direction guide 106. The substrate transport mechanism 112 and the resin loader 130 function as a transport mechanism for a plurality of molds 110 arranged in a row.

また、本実施形態における基板ストック部１０４は、樹脂封止前の封止前基板を金型１１０に対して供給する封止前基板供給部としての機能と、樹脂封止後の封止後基板を収納する封止後基板収納部としての機能を併せ持っている。例えば図２に示すように、昇降機構１５０によって全体が昇降可能な２つのストッカ（封止前基板用ストッカ１０４Ａ、封止後基板用ストッカ１０４Ｂ）を上下に配置して備え、このストッカ１０４Ａ、１０４Ｂが適宜昇降しながら、基板搬送機構１１２に対して封止前基板を受け渡したり、基板搬送機構１１２から封止後基板を受け取ることが可能とされている。   In addition, the substrate stock unit 104 in the present embodiment has a function as a pre-sealing substrate supply unit that supplies a pre-sealing substrate before resin sealing to the mold 110, and a post-sealing substrate after resin sealing. It also has a function as a post-sealing substrate storage portion for storing the substrate. For example, as shown in FIG. 2, two stockers (a substrate stocker 104A before sealing and a stocker 104B after sealing) that can be moved up and down by the lifting mechanism 150 are arranged vertically, and the stockers 104A and 104B are provided. The substrate can be delivered to the substrate transport mechanism 112 while being properly lifted and the post-sealing substrate can be received from the substrate transport mechanism 112.

なお、本実施形態においては、前述したように金型１１０が４つ一列に配置されているが、必ずしも４つの金型に限定されるものではなく、複数である限り２〜３、更には５つ以上の金型が配置されていてもよい。   In the present embodiment, as described above, the four molds 110 are arranged in a row, but the present invention is not necessarily limited to four molds. Two or more molds may be arranged.

次に、図３を用いて樹脂搬送機構１１２について説明する。   Next, the resin transport mechanism 112 will be described with reference to FIG.

基板搬送機構１１２は、ベース部１０２に設けられた２本のＸ方向ガイド１０６の上に配置されている。即ち、この基板搬送機構１１２は、Ｘ方向ガイド１０６に沿ってベース部１０２上を自在に移動することが可能とされている。基板搬送機構１１２の本体１１３は、側面（Ｘ方向）から見ると略Ｌ字形状に構成されている。このＬ字形状の長辺部分（図３において左右方向）に沿って、金型侵入部１１４がスライド可能に連結されている。また、この金型進入部１１４は天板部１１６と側面部１１７とから構成され、さらに、天板部１１６の略中央に吸着部１１８が垂設されている。この天板部１１６上に、樹脂封止前の封止前基板が載置されて金型１１０へと搬入される。また、金型１１０にて樹脂封止された封止後基板が、吸着部１１８によって吸着されて基板ストック部１０４へと搬出される。なお、この金型進入部１１４の構造はあくまで一例であり、例えば吸着により封止後基板を吸着して搬出するのではなく、把持爪のような構造を用いて基板を把持して搬出するような構造であってもよい。また、金型進入部１１４全体が自身で上下に移動可能な構成とされていてもよい。   The substrate transport mechanism 112 is disposed on the two X direction guides 106 provided in the base unit 102. That is, the substrate transport mechanism 112 can freely move on the base portion 102 along the X-direction guide 106. The main body 113 of the substrate transport mechanism 112 has a substantially L shape when viewed from the side surface (X direction). The mold intrusion portion 114 is slidably connected along the L-shaped long side portion (left and right direction in FIG. 3). The mold entry portion 114 is composed of a top plate portion 116 and a side surface portion 117, and a suction portion 118 is suspended from the approximate center of the top plate portion 116. On the top plate portion 116, the substrate before sealing before resin sealing is placed and carried into the mold 110. Further, the post-sealing substrate that is resin-sealed by the mold 110 is adsorbed by the adsorbing unit 118 and carried out to the substrate stock unit 104. The structure of the mold entry portion 114 is merely an example. For example, the substrate is not sucked and carried out after being sealed by suction, but is held and carried out using a structure like a gripping claw. It may be a simple structure. Further, the entire mold entry portion 114 may be configured to be movable up and down by itself.

続いて図４を用いて当該樹脂封止装置１００全体の作用及び基板搬送機構１１２の作用について説明する。図４は、上型１１０Ａと下型１１０Ｂとが開いている際に、両金型１１０Ａ、１１０Ｂ間に進入した基板搬送機構１１２の金型進入部を模式的に表わした図である。（Ａ）乃至（Ｅ）は各状態の図であり、経時的に（Ａ）、（Ｂ）・・・（Ｅ）と進行する。   Then, the effect | action of the said resin sealing apparatus 100 whole and the effect | action of the board | substrate conveyance mechanism 112 are demonstrated using FIG. FIG. 4 is a diagram schematically showing a mold entry portion of the substrate transport mechanism 112 that has entered between both molds 110A and 110B when the upper mold 110A and the lower mold 110B are open. (A) thru | or (E) is a figure of each state, and progresses with (A), (B) ... (E) with time.

一列に配列された複数の圧縮成形金型１１０は、それぞれが別々の（異なる）タイミングで樹脂封止を行っている。各金型１１０には、基板供給機構１１２によって次回の封止に使用する封止前基板の搬入と既に封止が完了した封止後基板の搬出が行われた後（この点の詳細は後述する）、樹脂用ローダ１３０によって、樹脂供給部１０８から供給される樹脂（例えば金型１１０のキャビティ形状にプレ成形された平板樹脂）が搬入される。その後、金型１１０が閉じることで基板が樹脂にて圧縮成形される。   The plurality of compression molds 110 arranged in a row are sealed with resin at different (different) timings. Each mold 110 is loaded with a pre-sealing substrate to be used for the next sealing by the substrate supply mechanism 112 and a post-sealing substrate that has already been sealed (details of this point will be described later). The resin loader 130 carries in the resin supplied from the resin supply unit 108 (for example, a flat resin pre-molded into the cavity shape of the mold 110). Thereafter, the mold 110 is closed, and the substrate is compression molded with resin.

基板搬送機構１１２と金型１１０との基板（封止前基板及び封止後基板）の受渡しは以下のように行われる。最初に図４（Ａ）に示すように、上型１１０Ａと下型１１０Ｂとが開いた際に所定のタイミングで基板搬送機構１１２の金型進入部１１４が進入してくる。このとき、各金型１１０に対する基板搬送機構１１２更には金型進入部１１４のＸ方向の位置決めは、Ｘ方向ガイド１０６によって正確に位置決めされている。また、金型進入部１１４の天板部１１６上には、これから樹脂封止される封止前基板１７０Ａが位置決めされ載置されている。又、下型１１０Ｂの表面には既に樹脂にて封止済みの封止後基板１７０Ｂが存在している。   Delivery of the board | substrate (a board | substrate before sealing and a board | substrate after sealing) with the board | substrate conveyance mechanism 112 and the metal mold | die 110 is performed as follows. First, as shown in FIG. 4A, when the upper mold 110A and the lower mold 110B are opened, the mold entry section 114 of the substrate transport mechanism 112 enters at a predetermined timing. At this time, the X-direction guide 106 accurately positions the substrate transport mechanism 112 and the mold entry portion 114 with respect to each mold 110 in the X direction. In addition, a pre-sealing substrate 170A to be resin-sealed is positioned and placed on the top plate portion 116 of the mold entry portion 114. Further, a post-sealing substrate 170B that is already sealed with resin is present on the surface of the lower mold 110B.

続いて図４（Ｂ）に示すように、金型進入部１１４が上型１１０Ａと下型１１０Ｂとの間に進入した状態で、下型１１０Ｂが図示せぬプレス機構の働きによって上昇する。これにより、下型１１０Ｂの表面上にある封止後基板１７０Ｂが吸着部１１８に吸着保持されることとなる。その後もプレス機構の動きは更に続き、図４（Ｃ）に示すように下型１１０Ｂを上昇させる。その結果、金型進入部１１４の側面部１１７下端が下型１１０Ｂを構成する枠状金型１１０Ｂ−２の表面に当接し、金型進入部１１４全体を持ち上げる。その結果、金型進入部１１４の天板部１１６上に載置される封止前基板１７０Ａが、上型１１０Ａの表面に接触する。それに伴って上昇は止まり、上型１１０Ａに備わる吸着機構（図示しない）の働きによって封止前基板１７０Ａが上型１１０Ａ表面に吸着される。その後、図４（Ｄ）及び図４（Ｅ）に示すように、プレス機構が下降するに伴って下型１１０Ｂも下降し、封止後基板１７０Ｂを吸着保持した金型進入部１１４が金型１１０間から退避する。   Subsequently, as shown in FIG. 4B, the lower mold 110B is raised by the action of a press mechanism (not shown) in a state where the mold entry portion 114 has entered between the upper mold 110A and the lower mold 110B. As a result, the post-sealing substrate 170B on the surface of the lower mold 110B is sucked and held by the sucking portion 118. Thereafter, the press mechanism continues to move, and the lower mold 110B is raised as shown in FIG. As a result, the lower end of the side surface portion 117 of the mold entry portion 114 comes into contact with the surface of the frame-shaped die 110B-2 constituting the lower mold 110B, and the entire mold entry portion 114 is lifted. As a result, the pre-sealing substrate 170A placed on the top plate portion 116 of the mold entry portion 114 comes into contact with the surface of the upper die 110A. Accordingly, the rise stops and the pre-sealing substrate 170A is adsorbed on the surface of the upper mold 110A by the action of an adsorption mechanism (not shown) provided in the upper mold 110A. Thereafter, as shown in FIGS. 4D and 4E, as the press mechanism is lowered, the lower die 110B is also lowered, and the die entry portion 114 holding the substrate 170B after sealing is held by the die. Retreat from between 110.

その後、樹脂用ローダ１３０によって、下型１１０Ｂの表面の所定の位置に樹脂封止に使用するための樹脂が搬入された後、両金型１１０Ａ、１１０Ｂが型閉じされ、圧縮成形による樹脂封止が行われる。他の３つの金型１１０に対してもそれぞれタイミングを異にして単一の基板搬送機構１１２によって同様の作用が繰り返される。   After that, the resin loader 130 carries in the resin for use in resin sealing to a predetermined position on the surface of the lower mold 110B, and then the molds 110A and 110B are closed and sealed by compression molding. Is done. The same operation is repeated for the other three molds 110 by the single substrate transport mechanism 112 at different timings.

このように、樹脂封止装置１００では、一列に配列した複数の圧縮成形金型１１０と平行に移動可能且つ搬入・搬出作業を行う基板搬送機構１１２を設け、更に、圧縮成形金型１１０に対して一の基板ストック部１０４を配置する（即ち、封止前基板供給部と封止後基板収納部とを同じ側に配置する）ことで、圧縮成形金型１１０を挟んで封止前基板供給部と封止後基板収納部を配置する必要がない。この点見方を変えれば、圧縮成形金型１１０を挟んで対向する側に、樹脂供給部１０８のような補機類を設置するためのスペースを確保することができる。また、一の基板搬送機構１１２によって基板の搬入・搬出の双方を行うことが可能であるため、基板搬送機構１１２の移動スペース（Ｘ方向ガイド１０６を含む）を２系統確保する必要もない。その結果、樹脂封止装置１１０全体としてのコンパクト化を実現することが可能となっている。   As described above, the resin sealing device 100 is provided with the substrate transport mechanism 112 that is movable in parallel with the plurality of compression molding dies 110 arranged in a row and performs the loading / unloading operation. The first substrate stock portion 104 is disposed (that is, the pre-sealing substrate supply portion and the post-sealing substrate storage portion are disposed on the same side), whereby the pre-sealing substrate supply is sandwiched between the compression molds 110. There is no need to arrange the portion and the substrate storage portion after sealing. If this point of view is changed, it is possible to secure a space for installing auxiliary equipment such as the resin supply unit 108 on the opposite side across the compression mold 110. Further, since it is possible to carry in and carry out the substrate by one substrate transport mechanism 112, it is not necessary to secure two systems for the movement space (including the X direction guide 106) of the substrate transport mechanism 112. As a result, the resin sealing device 110 as a whole can be made compact.

また、基板搬送機構１１２が、自身の一部である金型進入部１１４を圧縮成形金型１１０内に進入させて基板の搬送（封止前基板１７０Ａの搬入及び封止後基板１７０Ｂの搬出）を行なっており、一度の進入で搬入と搬出を完了することが可能とされている。その結果、基板の受渡しに要する時間を（トータルで）短縮できる。仮に、同様のスピードでＸ方向ガイド１０６上を移動可能な一の基板搬送機構を想定すれば、その一の基板搬送機構でより多数の圧縮成形金型に対応することが可能となっている。   Further, the substrate transport mechanism 112 causes the mold entry portion 114, which is a part of the substrate transport mechanism 112, to enter the compression mold 110 to transport the substrate (carrying in the substrate 170A before sealing and carrying out the substrate 170B after sealing). It is possible to complete loading and unloading with a single approach. As a result, the time required for delivery of the substrate can be shortened (total). If one substrate transport mechanism that can move on the X-direction guide 106 at the same speed is assumed, it is possible to handle a larger number of compression molds with the one substrate transport mechanism.

また、本実施形態では、圧縮成形金型１１０に投入される樹脂が供給される樹脂供給部１０８を、圧縮成形金型１１０を挟んで（スペース的に余裕のある）基板ストック部１０４と対向する側に配置している。このように配置したことで、往々にして異物（粉塵など）となり得る樹脂が供給される樹脂供給部１０８の位置を基板の供給・収納位置から隔離することができ、異物による封止異常の発生を低減することが可能となっている。   Further, in the present embodiment, the resin supply unit 108 to which the resin charged into the compression molding die 110 is supplied is opposed to the substrate stock unit 104 (with sufficient space) across the compression molding die 110. Arranged on the side. With this arrangement, it is possible to isolate the position of the resin supply unit 108 to which resin that can often become a foreign substance (dust etc.) is supplied from the supply / storage position of the substrate, and the occurrence of a sealing abnormality due to the foreign substance. Can be reduced.

なお、本実施形態としては説明していないが、下型１１０Ｂの表面上に、離型フィルムが介在されていてもよい。   Although not described as this embodiment, a release film may be interposed on the surface of the lower mold 110B.

本発明は、半導体チップを搭載した基板を圧縮成形により樹脂封止する樹脂封止装置に適用できる。   The present invention can be applied to a resin sealing device that seals a substrate on which a semiconductor chip is mounted by compression molding.

本発明の実施形態の一例である樹脂封止装置１００の概略構成平面図Schematic configuration plan view of a resin sealing device 100 as an example of an embodiment of the present invention 図１における矢示II方向から見た基板ストック部を示した図The figure which showed the board | substrate stock part seen from the arrow II direction in FIG. 図１における矢示III方向から見た基板搬送機構を示した図The figure which showed the board | substrate conveyance mechanism seen from the arrow III direction in FIG. 図１における矢示IV方向から見た金型及び基板搬送機構を示した図The figure which showed the metal mold | die and board | substrate conveyance mechanism seen from the arrow IV direction in FIG. 公知の圧縮成形金型１０の概略構成図Schematic configuration diagram of a known compression molding die 10 公知の樹脂封止装置１の概略構成図Schematic configuration diagram of a known resin sealing device 1

符号の説明Explanation of symbols

１００…樹脂封止装置
１０２…ベース部
１０４…基板ストック部（封止前基板供給部兼封止後基板収納部）
１０６…Ｘ方向ガイド（移動ガイド）
１０８…樹脂供給部
１１０…圧縮成形金型
１１０Ａ…上型
１１０Ｂ…下型
１１０Ｂ−１…圧縮金型
１１０Ｂ−２…枠状金型
１１２…基板搬送機構
１１３…本体
１１４…金型進入部
１１６…天板部
１１７…側面部
１１８…吸着部
１３０…樹脂用ローダ
１７０Ａ…封止前基板
１７０Ｂ…封止後基板 DESCRIPTION OF SYMBOLS 100 ... Resin sealing apparatus 102 ... Base part 104 ... Board | substrate stock part (Substrate supply part before sealing and board | substrate storage part after sealing)
106 ... X direction guide (moving guide)
DESCRIPTION OF SYMBOLS 108 ... Resin supply part 110 ... Compression mold 110A ... Upper mold 110B ... Lower mold 110B-1 ... Compression mold 110B-2 ... Frame-shaped mold 112 ... Substrate conveyance mechanism 113 ... Main body 114 ... Mold entry part 116 ... Top plate portion 117 ... Side portion 118 ... Suction portion 130 ... Resin loader 170A ... Pre-sealing substrate 170B ... Post-sealing substrate

Claims (4)

半導体チップが搭載された基板を樹脂封止するための樹脂封止装置であって、
樹脂封止前の封止前基板が供給される封止前基板供給部と、
樹脂封止後の封止後基板が収納される封止後基板収納部と、
一列に配列された複数の圧縮成形金型と、
前記圧縮成形金型の配列方向と平行に配置される移動ガイドと、
該移動ガイド上を移動可能であって前記圧縮成形金型に対する前記封止前基板の搬入と前記圧縮成形金型からの封止後基板の搬出の双方を行なう基板搬送機構と、を備え、
前記封止前基板供給部と前記封止後基板収納部とが、共に前記圧縮成形金型に対して同じ側に配置されている
ことを特徴とする樹脂封止装置。 A resin sealing device for resin sealing a substrate on which a semiconductor chip is mounted,
A pre-sealing substrate supply unit to which a pre-sealing substrate before resin sealing is supplied;
A post-sealing substrate storage portion in which the post-sealing substrate after resin sealing is stored;
A plurality of compression molds arranged in a row;
A movement guide arranged in parallel with the arrangement direction of the compression molding dies,
A substrate transport mechanism that is movable on the movement guide and performs both loading of the substrate before sealing into the compression molding die and unloading of the substrate after sealing from the compression molding die,
Both the said board | substrate supply part before sealing and the said board | substrate storage part after sealing are arrange | positioned at the same side with respect to the said compression molding die. The resin sealing apparatus characterized by the above-mentioned. 請求項１において、
前記基板搬送機構が、自身の一部を前記圧縮成形金型内に進入させて前記封止前基板の搬入及び前記封止後基板の搬出を行なっており、
一度の進入で前記搬入と前記搬出が完了する
ことを特徴とする樹脂封止装置。 In claim 1,
The substrate transport mechanism has a part of itself entered into the compression mold to carry in the substrate before sealing and carry out the substrate after sealing,
The resin-sealing device, wherein the carry-in and the carry-out are completed with one entry. 請求項１又は２において、
更に、前記圧縮成形金型に投入される樹脂が供給される樹脂供給部を供え、
該樹脂供給部が、前記圧縮成形金型を挟んで前記封止前基板供給部及び前記封止後基板収納部と対向する側に配置されている
ことを特徴する樹脂封止装置。 In claim 1 or 2,
Furthermore, a resin supply unit to which resin to be charged into the compression mold is supplied is provided.
This resin supply part is arrange | positioned on the side facing the said board | substrate supply part before sealing and the said board | substrate storage part after sealing on both sides of the said compression molding metal mold | die. The resin sealing apparatus characterized by the above-mentioned. 請求項１乃至３のいずれかにおいて、
前記封止前基板供給部と前記封止後基板収納部とが、上下に配置されている
ことを特徴とする樹脂封止装置。 In any one of Claims 1 thru | or 3,
The resin sealing apparatus, wherein the pre-sealing substrate supply unit and the post-sealing substrate storage unit are arranged vertically.
JP2007031138A 2007-02-09 2007-02-09 Resin sealing device Active JP5010303B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007031138A JP5010303B2 (en) 2007-02-09 2007-02-09 Resin sealing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007031138A JP5010303B2 (en) 2007-02-09 2007-02-09 Resin sealing device

Publications (2)

Publication Number Publication Date
JP2008194904A true JP2008194904A (en) 2008-08-28
JP5010303B2 JP5010303B2 (en) 2012-08-29

Family

ID=39754302

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007031138A Active JP5010303B2 (en) 2007-02-09 2007-02-09 Resin sealing device

Country Status (1)

Country Link
JP (1) JP5010303B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010082890A (en) * 2008-09-30 2010-04-15 Towa Corp Common use operation unit for substrate supply or the like
JP2013176874A (en) * 2012-02-28 2013-09-09 Towa Corp Resin sealing device and method for manufacturing resin sealing body
JP7498836B1 (en) 2023-07-19 2024-06-12 Ｔｏｗａ株式会社 Resin molding device and method for manufacturing resin molded product

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61148016A (en) * 1984-12-24 1986-07-05 Hitachi Ltd mold equipment
JPH1058457A (en) * 1996-08-20 1998-03-03 Apic Yamada Kk Resin molding apparatus
JP2007005496A (en) * 2005-06-22 2007-01-11 Sumitomo Heavy Ind Ltd Sealing device
JP2008179025A (en) * 2007-01-24 2008-08-07 Sumitomo Heavy Ind Ltd Mechanism for transporting member to resin sealing mold

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61148016A (en) * 1984-12-24 1986-07-05 Hitachi Ltd mold equipment
JPH1058457A (en) * 1996-08-20 1998-03-03 Apic Yamada Kk Resin molding apparatus
JP2007005496A (en) * 2005-06-22 2007-01-11 Sumitomo Heavy Ind Ltd Sealing device
JP2008179025A (en) * 2007-01-24 2008-08-07 Sumitomo Heavy Ind Ltd Mechanism for transporting member to resin sealing mold

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010082890A (en) * 2008-09-30 2010-04-15 Towa Corp Common use operation unit for substrate supply or the like
JP2013176874A (en) * 2012-02-28 2013-09-09 Towa Corp Resin sealing device and method for manufacturing resin sealing body
CN103295921A (en) * 2012-02-28 2013-09-11 东和株式会社 Resin seal device and resin seal body manufacture method
JP7498836B1 (en) 2023-07-19 2024-06-12 Ｔｏｗａ株式会社 Resin molding device and method for manufacturing resin molded product
WO2025017977A1 (en) * 2023-07-19 2025-01-23 Ｔｏｗａ株式会社 Resin molding device and method for producing resin molded article
JP2025014630A (en) * 2023-07-19 2025-01-30 Ｔｏｗａ株式会社 Resin molding device and method for manufacturing resin molded product

Also Published As

Publication number Publication date
JP5010303B2 (en) 2012-08-29

Similar Documents

Publication Publication Date Title
JP4373237B2 (en) Semiconductor chip resin sealing molding method and resin sealing molding die
CN101405854B (en) Resin sealing molding device
TWI729625B (en) Resin casting device
JP5156579B2 (en) Board loading / unloading device
US20120175334A1 (en) Overhead hoist transport system and operating method thereof
KR20160113973A (en) Resin sealing apparatus and resin sealing method
US20210370565A1 (en) Conveying apparatus, resin molding apparatus, conveying method, and resin molded product manufacturing method
TWI750369B (en) Resin molding die and resin molding device
KR20140089517A (en) Load port and efem
JP6180206B2 (en) Resin sealing method and compression molding apparatus
JP6176416B1 (en) Semiconductor package resin sealing apparatus and semiconductor package resin sealing method
JP2013184413A (en) Resin sealing device and resin sealing method
JP5010303B2 (en) Resin sealing device
JP4369901B2 (en) Sealing device
TW202103886A (en) Workpiece carrying-in device, workpiece take-out device, plastic sealing mould, and resin plastic sealing device including the same capable of positioning the plastic sealing mould and delivering the workpiece and/or resin by using a simplified mould structure
US20220063149A1 (en) Resin molding apparatus and method of manufacturing resin molded product
JP6202292B1 (en) Semiconductor package resin sealing apparatus and semiconductor package resin sealing method
TWI499098B (en) Substrate carrier for molding electronic devices
US20230249424A1 (en) Method of producing lens molded article
KR102808258B1 (en) Material storage apparatus and logistics management equipment including the same
KR20200028279A (en) Glue dispensing apparatus
KR101515715B1 (en) Vertical molding apparatus
JP2023105331A (en) Resin sealing equipment
TW202513260A (en) Compression forming device and compression forming method
KR101394387B1 (en) Unit for loading a substrate and apparatus for bonding dies having the unit

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090911

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120227

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120306

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120427

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120529

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120601

R150 Certificate of patent or registration of utility model

Ref document number: 5010303

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150608

Year of fee payment: 3

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250