JP2008194750A - Method for preventing brittleness of titanium and dissimilar metal joint and improving joint strength using silver diffusion control layer - Google Patents
Method for preventing brittleness of titanium and dissimilar metal joint and improving joint strength using silver diffusion control layer Download PDFInfo
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- JP2008194750A JP2008194750A JP2007202824A JP2007202824A JP2008194750A JP 2008194750 A JP2008194750 A JP 2008194750A JP 2007202824 A JP2007202824 A JP 2007202824A JP 2007202824 A JP2007202824 A JP 2007202824A JP 2008194750 A JP2008194750 A JP 2008194750A
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- 239000010936 titanium Substances 0.000 title claims abstract description 77
- 229910052719 titanium Inorganic materials 0.000 title claims abstract description 68
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 title claims abstract description 67
- 238000009792 diffusion process Methods 0.000 title claims abstract description 55
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 54
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 53
- 239000004332 silver Substances 0.000 title claims abstract description 53
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 46
- 239000002184 metal Substances 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 34
- 239000000463 material Substances 0.000 claims abstract description 59
- 238000005304 joining Methods 0.000 claims abstract description 23
- 238000005219 brazing Methods 0.000 claims abstract description 17
- 238000003780 insertion Methods 0.000 claims abstract description 13
- 230000037431 insertion Effects 0.000 claims abstract description 13
- 238000002844 melting Methods 0.000 claims abstract description 10
- 230000008018 melting Effects 0.000 claims abstract description 10
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 2
- 238000007740 vapor deposition Methods 0.000 claims description 2
- 229910000765 intermetallic Inorganic materials 0.000 abstract description 21
- 230000015572 biosynthetic process Effects 0.000 abstract description 10
- 150000002739 metals Chemical class 0.000 abstract description 6
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 230000002265 prevention Effects 0.000 abstract description 2
- 239000010949 copper Substances 0.000 description 24
- 229910052802 copper Inorganic materials 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 229910010165 TiCu Inorganic materials 0.000 description 9
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 9
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 229910017945 Cu—Ti Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010587 phase diagram Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- -1 Ti 2 Cu Chemical compound 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- AHGIVYNZKJCSBA-UHFFFAOYSA-N [Ti].[Ag].[Cu] Chemical compound [Ti].[Ag].[Cu] AHGIVYNZKJCSBA-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- MZFIXCCGFYSQSS-UHFFFAOYSA-N silver titanium Chemical compound [Ti].[Ag] MZFIXCCGFYSQSS-UHFFFAOYSA-N 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000005211 surface analysis Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
【課題】銀拡散制御層を使用したチタンと異種金属接合部の脆性防止及び接合力向上方法を提供する。
【解決手段】チタン母材に銀拡散制御層を形成させる工程（工程１）；前記工程１で銀拡散制御層が形成されたチタン母材と異種金属の間に挿入材を位置させる工程（工程２）；及び工程２で挿入された挿入材の溶融温度以上に加熱して、チタン母材と異種金属を接合する工程（工程３）を含んでなる銀拡散制御層を使用したチタンと異種金属接合部の脆性防止及び接合力向上方法に関するものである。本発明による方法は、チタン母材上に銀拡散制御層を形成させることで、チタンと異種金属ブレイジング接合時に接合部で脆性が大きい金属間化合物の生成を抑制して脆性防止及び接合部の靭性を向上させることができるので、チタンと異種金属ブレイジング接合時に有用に使用できる。
【選択図】図２The present invention provides a brittleness prevention and bonding strength improving method for a titanium and dissimilar metal joint using a silver diffusion control layer.
A step of forming a silver diffusion control layer on a titanium base material (step 1); a step of positioning an insertion material between the titanium base material on which the silver diffusion control layer is formed in step 1 and a dissimilar metal (step) 2); and titanium and dissimilar metal using a silver diffusion control layer comprising a step (step 3) of heating the insert material inserted in step 2 to a temperature equal to or higher than the melting temperature to join the dissimilar metal to the titanium base material. The present invention relates to a method for preventing brittleness of a bonded portion and improving a bonding force. In the method according to the present invention, the formation of a silver diffusion control layer on a titanium base material prevents brittleness and toughness of the joint by suppressing the formation of intermetallic compounds having high brittleness at the joint when titanium and a dissimilar metal brazing joint is formed. Therefore, it can be usefully used during brazing joining of titanium and dissimilar metals.
[Selection] Figure 2
Description
本発明は、銀拡散制御層を使用したチタンと異種金属接合部の脆性防止及び接合力向上方法に関するものである。 The present invention relates to a method for preventing brittleness and improving bonding strength between a titanium and dissimilar metal joint using a silver diffusion control layer.
現在建築物；自動車、船舶、飛行機、列車などの輸送器機を含む構造物；各種配管；及びパイプ類などには金属または合金間の接合が必要な器機部品がたくさん存在する。このような金属及び合金間の接合には、大部分高温溶融接合を使用した溶接方式が使用されている。 Currently, there are many equipment parts that require joining between metals or alloys in structures; structures including transport equipment such as automobiles, ships, airplanes, and trains; various pipes; and pipes. For joining between such metals and alloys, a welding method using high temperature fusion joining is mostly used.
しかし、溶融接合及び溶接は、作業温度が高いため粒子粗大化などの周囲母材の組職を変化させて、機械的物性を低下させる問題点を有しているだけではなく、高温処理による内部応力形成によって応力腐食亀裂（ＳＣＣ）などの問題を発生させている。このような点を考慮して最近では、このような構造部品の金属及び合金間に十分な引張強度及び接着強度、そして優秀な漏洩防止（ｌｅａｋ ｔｉｇｈｔ）特性を付与して、現場適用が可能な非溶融方式を使用した低温固相接合技術に対する研究が活発に進行されている。このような固相接合技術中の一つであるブレイジング技術は、最近セラミックや高温用材料などの新素材に適用するための研究が活発に行われていて、ブレイジング接合方法は、溶融接合と比べて母材の機械的物性に影響を与えないので、内部熱応力の側面でも非常に好ましい効果を示している。 However, melt bonding and welding not only have the problem of lowering mechanical properties by changing the composition of surrounding base materials such as coarsening of particles due to high working temperature, but also internal processing due to high temperature processing. Stress formation causes problems such as stress corrosion cracking (SCC). In view of these points, it has recently been possible to apply in the field by providing sufficient tensile strength and adhesive strength between the metal and alloy of such a structural component, and excellent leak tight characteristics. Research on low-temperature solid-phase bonding technology using a non-melting method is actively underway. The brazing technology, which is one of these solid-phase bonding technologies, has been actively researched recently for application to new materials such as ceramics and high-temperature materials. Therefore, the mechanical properties of the base material are not affected, so that a very favorable effect is shown in terms of internal thermal stress.
しかし、ブレイジング接合方法で同種ではない異種金属及び合金を接合する時には、大部分接合しようとする二つの母材成分間の金属間化合物（ｉｎｔｅｒｍｅｔａｌｌｉｃ ｐｈａｓｅ）が接合部に生成されて、接合部の靭性を低める問題がある。これは、ブレイジング接合時に溶融された挿入材の中に、接合しようとする二つの異種金属あるいは合金成分が多量溶解（ｄｉｓｓｏｌｕｔｉｏｎ）し、冷却時にこの二つの成分間の金属間化合物が生成されるからである。例えば、チタンブレイジング時に使用される銀−銅−チタン系挿入材を使用してチタン−銅間の異種ブレイジング接合をすると、Ｔｉ２Ｃｕ、ＴｉＣｕ、Ｔｉ３Ｃｕ４、ＴｉＣｕ２、ＴｉＣｕ４などのチタン−銅間金属間化合物が接合部に形成されるため、接合部の靭性が低くなってチタン−銅間接合物の強度低下を誘発する。 However, when dissimilar metals and alloys that are not of the same type are joined by the brazing joining method, an intermetallic compound between the two base metal components to be joined mostly is generated in the joint, and the toughness of the joint There is a problem of lowering. This is because a large amount of two dissimilar metals or alloy components to be joined dissolve in the insert melted at the time of brazing joining, and an intermetallic compound between the two components is generated during cooling. It is. For example, when different types of brazing bonding between titanium and copper is performed using a silver-copper-titanium insert used in titanium brazing, titanium such as Ti 2 Cu, TiCu, Ti 3 Cu 4 , TiCu 2 and TiCu 4 is used. -Since the intermetallic compound between copper is formed in a junction part, the toughness of a junction part becomes low and the intensity | strength reduction of a titanium-copper junction thing is induced.
以上のことに鑑みて、本発明者等は、チタン異種金属ブレイジング接合時の金属間化合物の生成を抑制する方法を研究中に、チタン母材の上に銀（Ａｇ）拡散制御層を形成させることにより、チタン異種金属ブレイジング接合時、接合部において脆性（ｂｒｉｔｔｌｅｎｅｓｓ）が大きい金属間化合物の生成を抑制して、脆性防止及び接合部の靭性が向上することを確認して本発明を完成した。 In view of the above, the present inventors have formed a silver (Ag) diffusion control layer on a titanium base material while researching a method for suppressing the formation of intermetallic compounds during titanium dissimilar metal brazing bonding. Thus, at the time of titanium dissimilar metal brazing joining, it was confirmed that the formation of an intermetallic compound having high brittleness at the joint was suppressed, and that the prevention of brittleness and the toughness of the joint were improved, thereby completing the present invention.
本発明の目的は、銀拡散制御層を使用したチタンと異種金属接合部の脆性防止及び接合力向上方法を提供することにある。 An object of the present invention is to provide a method for preventing brittleness and improving bonding strength between a titanium and dissimilar metal joint using a silver diffusion control layer.
前記目的を達成するために、本発明は、チタン母材に銀拡散制御層を形成させる工程（工程１）；
前記工程１で銀拡散制御層が形成されたチタン母材と異種金属との間に挿入材を位置させる工程（工程２）；及び
工程２で挿入された挿入材を溶融温度以上に加熱してチタン母材と異種金属を接合する工程（工程３）を含んでなる、銀拡散制御層を使用したチタン異種接合部の脆性防止及び接合力向上方法を提供する。
In order to achieve the above object, the present invention comprises a step of forming a silver diffusion control layer on a titanium base material (step 1);
A step of positioning an insert between the titanium base material on which the silver diffusion control layer is formed in step 1 and a dissimilar metal (step 2); and the insert inserted in step 2 is heated to a melting temperature or higher. Provided is a method for preventing brittleness of a titanium dissimilar joint using a silver diffusion control layer and improving a joining force, which includes a step (step 3) of joining a titanium base material and a dissimilar metal.
以下、本発明を詳しく説明する。
Ａｇ−Ｃｕ−Ｔｉ系を使用してチタン異種金属ブレイジング接合をすると、溶融した挿入材で母材であるチタンと銅が多量溶解されて、接合後の接合部にはチタン−銅間金属間化合物が生成される。このように接合部に金属間化合物が生成されると、接合部の靭性が低くなって低い強度で破壊が起きるようになる。したがって、このような金属間化合物の生成を防止すれば、接合部の接合力を向上させて接合部の脆性を防止することができる。
The present invention will be described in detail below.
When titanium dissimilar metal brazing joining is performed using an Ag-Cu-Ti system, a large amount of titanium and copper, which are base materials, are dissolved in the molten insert material, and a titanium-copper intermetallic compound is formed in the joined portion after joining. Is generated. Thus, when an intermetallic compound is produced | generated in a junction part, the toughness of a junction part will become low and a fracture | rupture will occur with low intensity | strength. Therefore, by preventing the formation of such an intermetallic compound, it is possible to improve the joint strength of the joint and prevent brittleness of the joint.
このように、接合部の金属間化合物の生成を防止するためには、ブレイジング接合時に接合しようとする二つの母材の中で少なくとも一つ以上の母材が溶融された挿入材で母材の溶解を防止しなければならない。 As described above, in order to prevent the formation of intermetallic compounds in the joint portion, at least one of the base materials to be joined at the time of brazing joining is an insert material in which at least one base material is melted. Dissolution must be prevented.
本発明ではこのような点を考慮して、チタン母材上に銀拡散制御層を形成させてチタンが溶融された挿入材で母材の溶解を防止して、ブレイジング接合時の接合部の靭性を向上させることができる方法を考案した。ここで、銀（Ａｇ）を拡散制御層に選択したのは、チタンと銀の間に生成されるチタン−銀相は、他の金属間化合物より靭性が優秀であるという研究結果があり、銀−銅間には銀−銅状態図（図１）に示したように、完全工程反応を通じて銀及び銅固溶相（ｓｏｌｉｄ ｓｏｌｕｔｉｏｎ）だけが生成され、他の金属間化合物が生成されないので、接合部の靭性向上に大きい効果を与えることができるからである。 In the present invention, in consideration of such points, a silver diffusion control layer is formed on the titanium base material to prevent the base material from being melted with the insert material in which titanium is melted, and toughness of the joint portion during brazing joining We devised a method that can improve Here, silver (Ag) was selected as the diffusion control layer because of the research results that the titanium-silver phase produced between titanium and silver has better toughness than other intermetallic compounds. -As shown in the silver-copper phase diagram (Fig. 1) between copper and copper, only silver and copper solid solution are generated through a complete process reaction, and no other intermetallic compound is formed. It is because a great effect can be given to the toughness improvement of the part.
以下、図２を参照して本発明を工程別で詳細に説明する。
まず、工程１は、チタン母材Ａ１に銀拡散制御層Ｂを形成する工程である。
Hereinafter, the present invention will be described in detail with reference to FIG.
First, step 1 is a step of forming a silver diffusion control layer B on the titanium base material A1.
本発明において、前記銀拡散制御層Ｂは、他の金属間化合物より靭性が優秀であり、チタン母材Ａ１に前記銀拡散制御層Ｂが形成された場合、チタンＡ１が溶融された挿入材にチタン母材Ａ１が溶解されることを防止して、他の金属間化合物が形成されることを防ぐことにより、接合部の靭性向上を助ける。 In the present invention, the silver diffusion control layer B has better toughness than other intermetallic compounds, and when the silver diffusion control layer B is formed on the titanium base material A1, the insertion material in which the titanium A1 is melted is used. By preventing the titanium base material A1 from being dissolved and preventing other intermetallic compounds from being formed, the toughness of the joint is improved.
本発明において、前記銀拡散制御層Ｂの形成方法は、コーティング、蒸着及びクラディングなどの多様な方法を使用することができ、特別に限定されない。 In the present invention, the silver diffusion control layer B may be formed by various methods such as coating, vapor deposition, and cladding, and is not particularly limited.
次に、工程２は前記工程１で銀拡散制御層が形成されたチタン母材Ａ１−１と異種金属Ａ２の間に挿入材Ｃを位置させる工程である。 Next, step 2 is a step of positioning the insertion material C between the titanium base material A1-1 on which the silver diffusion control layer is formed in the step 1 and the dissimilar metal A2.
本発明において、使用される挿入材Ｃは、一般的にＡｇ−Ｃｕ−Ｔｉ系を使用することができ、前記挿入材Ｃの形態は、パウダー、リボン、板材などの形態が可能だが、これに制限されない。 In the present invention, the insert material C to be used can generally use an Ag-Cu-Ti system, and the insert material C can be in the form of powder, ribbon, plate material, etc. Not limited.
本発明において、前記挿入材Ｃを位置させる方法としては特別に制限されず、例えば銀拡散制御層が形成されたチタン母材Ａ１−１上に挿入材Ｃを位置させた後、異種金属Ａ２をその上に位置させる方法、銀拡散制御層が形成されたチタン母材Ａ１−１または異種金属Ａ２に挿入材Ｃをコーティングする方法など様々な方法を使用することができる。 In the present invention, the method for positioning the insertion material C is not particularly limited. For example, after the insertion material C is positioned on the titanium base material A1-1 on which the silver diffusion control layer is formed, the dissimilar metal A2 is used. Various methods can be used such as a method of positioning on it, a method of coating the insert material C on the titanium base material A1-1 or the dissimilar metal A2 on which the silver diffusion control layer is formed.
工程３は、前記工程２で挿入された挿入材Ｃの溶融温度以上に加熱して、チタン母材Ａ１と異種金属Ａ２を接合する工程である。 Step 3 is a step in which the titanium base material A1 and the dissimilar metal A2 are joined by heating to a temperature equal to or higher than the melting temperature of the insertion material C inserted in the step 2.
このように挿入材Ｃを銀拡散制御層が形成されたチタン母材Ａ１−１及び銅Ａ２の間に位置させた後、加熱手段Ｄ１、Ｄ２を使用して挿入材Ｃ及び周囲温度を挿入材Ｃの溶融温度以上に加熱して、一定時間維持すると溶融した挿入材ＣとチタンＡ１−１に形成された銀拡散制御層Ｂ及び異種金属Ａ２の間には、組成成分差による合金元素の拡散が起きるようになり、それによって挿入材ＣとチタンＡ１−１及び異種金属Ａ２の間に強い接合を形成することができる。また、チタン母材Ａ１と銀拡散制御層Ｂの間にも同じ原理の拡散が起きるようになり、強い接合が成立する。 After the insertion material C is positioned between the titanium base material A1-1 and the copper A2 on which the silver diffusion control layer is formed in this way, the insertion material C and the ambient temperature are changed using the heating means D1 and D2. When heated above the melting temperature of C and maintained for a certain period of time, the diffusion of the alloy element due to the difference in the compositional components between the molten insert C and the silver diffusion control layer B and the dissimilar metal A2 formed on the titanium A1-1. As a result, a strong bond can be formed between the insert C and the titanium A1-1 and the dissimilar metal A2. Further, the same principle of diffusion occurs between the titanium base material A1 and the silver diffusion control layer B, and a strong bond is established.
本発明による方法において、前記接合温度は、７７０〜９６０℃であることが好ましく、これは挿入材Ｃの溶融点が７７０℃以下で、拡散制御層Ｂである銀の溶融点が９６２℃であるからである。 In the method according to the present invention, the joining temperature is preferably 770 to 960 ° C., and the melting point of the insertion material C is 770 ° C. or less, and the melting point of silver which is the diffusion control layer B is 962 ° C. Because.
このような方法で接合すると、チタン母材Ａ１が銀拡散制御層Ｂによって溶融された挿入材Ｃ中に溶解することができず、接合部にはチタン−異種金属間化合物が生成されないので、接合部の脆性を防止して靭性を向上させることができる。 When bonded by such a method, the titanium base material A1 cannot be dissolved in the insertion material C melted by the silver diffusion control layer B, and no titanium-dissimilar intermetallic compound is generated at the bonded portion. The brittleness of the part can be prevented and the toughness can be improved.
以下、本発明を実施例によってさらに詳細に説明する。しかし、下記の実施例は本発明の例示するだけのものであって、本発明の範囲が下記の実施例によって限定されるものではない。 Hereinafter, the present invention will be described in more detail by way of examples. However, the following examples are merely illustrative of the present invention, and the scope of the present invention is not limited by the following examples.
＜実施例＞拡散制御層を使用したチタンと異種金属間の接合
溶融温度が１１６０℃のチタン金属板にスパッタコーティング法を使用して１００μｍの銀拡散層を形成した。以後、前記銀拡散層が形成されたチタンと溶融温度が１０８３℃の銅金属板の間に挿入材として、銀７０重量％、銅２８重量％及びチタン２重量％を含有した合金からなる厚さ１００μｍのリボンを挟んだ後、アルゴン雰囲気で温度が８１０℃になるまで１００℃／分の速度で昇温させながら紫外線ブレイジング（Ｉｎｆｒａｒｅｄ ｂｒａｚｉｎｇ）をした。８１０℃で６分間温度を維持した後、平均５０℃／分の冷却速度で冷却してチタンと銅を接合させた。
<Example> A silver diffusion layer having a thickness of 100 μm was formed on a titanium metal plate having a junction melting temperature of 1160 ° C. between titanium and a dissimilar metal using a diffusion control layer by a sputter coating method. Thereafter, a titanium alloy having a thickness of 100 μm made of an alloy containing 70% by weight of silver, 28% by weight of copper and 2% by weight of titanium is used as an insert between the titanium on which the silver diffusion layer is formed and a copper metal plate having a melting temperature of 1083 ° C. After sandwiching the ribbon, ultraviolet brazing (Infrared brazing) was performed while increasing the temperature at a rate of 100 ° C./min until the temperature reached 810 ° C. in an argon atmosphere. After maintaining the temperature at 810 ° C. for 6 minutes, it was cooled at an average cooling rate of 50 ° C./min to join titanium and copper.
＜比較例＞拡散制御層を使用しないチタンと異種金属間の接合
前記チタン金属板に銀拡散層を形成する工程を除いて実施例１と同一に遂行した。但し、接合時に８１０℃で１０分間温度を維持した。
<Comparative Example> Bonding between titanium and dissimilar metal without using diffusion control layer The same procedure as in Example 1 was performed except for the step of forming a silver diffusion layer on the titanium metal plate. However, the temperature was maintained at 810 ° C. for 10 minutes during bonding.
＜実験例１＞接合表面分析
本発明による方法で接合したチタン−異種金属接合部の接合部状態を確認するために次のような実験を遂行した。
<Experimental Example 1> Joint Surface Analysis The following experiment was performed to confirm the joint state of the titanium-dissimilar metal joint joined by the method according to the present invention.
実施例及び比較例によって接合されたチタン−銅接合部の微細組職を走査電子顕微鏡で観察した後、その結果を図３及び図４に示した。 After observing the fine structure of the titanium-copper joint joined by the Example and the Comparative Example with a scanning electron microscope, the results are shown in FIG. 3 and FIG.
図３に示したように、銀拡散制御層が形成されたチタンと銅の接合部は、チタン母材上の銀拡散制御層の存在によって、いかなるチタン−銅間金属間化合物も生成されないことを確認した。一方、図４に示したように、銀拡散制御層がない場合には、接合部にＴｉ２ＣｕＢ、ＴｉＣｕ（ｃ）、Ｔｉ３Ｃｕ４（ｄ）、ＴｉＣｕ２、またはＴｉ２Ｃｕ３（ｅ）、ＴｉＣｕ４（ｆ）などのチタン−銅間金属間化合物が生成されることを確認した。 As shown in FIG. 3, the titanium-copper junction formed with the silver diffusion control layer does not generate any titanium-copper intermetallic compound due to the presence of the silver diffusion control layer on the titanium base material. confirmed. On the other hand, as shown in FIG. 4, when there is no silver diffusion control layer, Ti 2 CuB, TiCu (c), Ti 3 Cu 4 (d), TiCu 2 , or Ti 2 Cu 3 (e ), Titanium-copper intermetallic compounds such as TiCu 4 (f) were confirmed.
したがって、本発明による方法は、チタン−異種金属間金属間化合物の生成を抑制して脆性を防止することが分かった。 Therefore, it was found that the method according to the present invention prevents brittleness by suppressing the formation of an intermetallic compound between titanium and different metals.
＜実験例２＞引張実験
本発明による方法で接合したチタン−異種金属接合部の強度を調べるために次のような実験を遂行した。
<Experimental Example 2> Tensile Experiment In order to examine the strength of a titanium-dissimilar metal joint joined by the method of the present invention, the following experiment was performed.
実施例及び比較例によって接合されたチタン−銅接合部の降伏強度、引張強度及び延伸率を引張試験を通じて測定して、その結果を表１に示した。 The yield strength, tensile strength, and stretch ratio of the titanium-copper joints joined according to the examples and comparative examples were measured through a tensile test, and the results are shown in Table 1.
表１に示したように、本発明による銀拡散制御層が形成されたチタンと銅の接合部は、チタン−銅間金属間化合物が生成されなかったため、銀拡散制御層を使用しない時より靭性が向上して、さらに高い強度と延伸率を示すことを確認することができた。 As shown in Table 1, since the titanium-copper intermetallic compound in which the silver diffusion control layer according to the present invention was formed did not produce a titanium-copper intermetallic compound, the toughness was higher than when the silver diffusion control layer was not used. As a result, it was confirmed that higher strength and a higher stretch ratio were exhibited.
本発明による方法は、チタン母材上に銀拡散制御層を形成させることによって、チタンと異種金属ブレイジング接合時の接合部で、脆性が大きい金属間化合物の生成を抑制して、脆性防止及び接合部の靭性を向上させることができるので、チタンと異種金属ブレイジング接合時に有用に使用することができる。 In the method according to the present invention, the formation of a silver diffusion control layer on a titanium base material suppresses the formation of a highly brittle intermetallic compound at the joint when titanium and a dissimilar metal brazing joint, thereby preventing brittleness and joining. Since the toughness of the part can be improved, it can be usefully used during brazing joining of titanium and a different metal.
Ａ１：チタン母材
Ａ１−１：拡散制御層が形成されたチタン
Ａ２：銅
Ｂ：銀拡散制御層
Ｃ：挿入材
Ｄ１：加熱手段
Ｄ２：加熱手段
ａ：Ｔｉ Ｓ．Ｓ． （Ｔｉ−ｒｉｃｈ）
ｂ：Ｔｉ２Ｃｕ
ｃ：ＴｉＣｕ
ｄ：Ｔｉ３Ｃｕ４
ｅ：ＴｉＣｕ２（またはＴｉ２Ｃｕ３）
ｆ：ＴｉＣｕ４
ｇ：Ａｇ−ｒｉｃｈ
ｆ：Ｃｕ（Ｔｉ，Ａｇ）
ｉ：Ｃｕ−ｒｉｃｈ
α：ＴｉＡｇ
β：Ａｇ
γ：Ｃｕ Ｓ．Ｓ．（Ｃｕ−ｒｉｃｈ）
δ：Ａｇ Ｓ．Ｓ．（Ａｇ−ｒｉｃｈ）
A1: Titanium base material A1-1: Titanium in which a diffusion control layer is formed A2: Copper B: Silver diffusion control layer C: Insert material D1: Heating means D2: Heating means a: Ti S. (Ti-rich)
b: Ti 2 Cu
c: TiCu
d: Ti 3 Cu 4
e: TiCu 2 (or Ti 2 Cu 3 )
f: TiCu 4
g: Ag-rich
f: Cu (Ti, Ag)
i: Cu-rich
α: TiAg
β: Ag
γ: Cu S.I. S. (Cu-rich)
δ: Ag S.R. S. (Ag-rich)
Claims (6)
前記工程１で銀拡散制御層が形成されたチタン母材と異種金属の間に挿入材を位置させる工程（工程２）；及び
工程２で挿入した挿入材の溶融温度以上に加熱してチタン母材と異種金属を接合する工程（工程３）を含んでなる、銀拡散制御層を使用したチタンと異種金属接合部の脆性防止及び接合力向上方法。 Forming a silver diffusion control layer on the titanium base material (step 1);
A step of positioning an insert between the dissimilar metal with the titanium base material on which the silver diffusion control layer is formed in the step 1 (step 2); and a titanium base that is heated above the melting temperature of the insert inserted in the step 2 A method for preventing brittleness between titanium and a dissimilar metal joint and for improving the joining force using a silver diffusion control layer, comprising a step of joining a material and a dissimilar metal (step 3).
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| WO2020198205A1 (en) | 2019-03-25 | 2020-10-01 | Packless Industries | Autogenous submerged liquid diffusion welding of titanium |
| CN115106639A (en) * | 2022-06-27 | 2022-09-27 | 西安理工大学 | Method for connecting multi-bronze/two-phase titanium alloy bimetal |
| KR20230067934A (en) * | 2021-11-10 | 2023-05-17 | 공주대학교 산학협력단 | Bonding material for diffusion bonding of dissimilar metal with hierarchical structure and diffusion bonding methode using the same |
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| KR100954097B1 (en) | 2008-04-16 | 2010-04-23 | 한국원자력연구원 | Method for Improving Bonding Characteristics of Heterojunctions between Titanium or Titanium Alloys and Steel Alloys by Using Silver Diffusion Control Layer and Silver-based Inserts |
| KR101070375B1 (en) * | 2009-10-08 | 2011-10-05 | 한국수력원자력 주식회사 | Method for enhancing corrosion resistance of joint between pure Ti/Ti-base alloy and Fe-base steel alloy using Ag-Cu-Pd inserted material and Ag diffusion control layer |
| KR102066858B1 (en) * | 2013-12-23 | 2020-01-16 | 재단법인 포항산업과학연구원 | Method for joining titanum alloy |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2020198205A1 (en) | 2019-03-25 | 2020-10-01 | Packless Industries | Autogenous submerged liquid diffusion welding of titanium |
| EP3814046A4 (en) * | 2019-03-25 | 2022-03-30 | Packless Industries | WELDING OF TITANIUM BY DIFFUSION OF AUTOGENOUS SUBMERGED LIQUID |
| KR20230067934A (en) * | 2021-11-10 | 2023-05-17 | 공주대학교 산학협력단 | Bonding material for diffusion bonding of dissimilar metal with hierarchical structure and diffusion bonding methode using the same |
| KR102631788B1 (en) * | 2021-11-10 | 2024-01-30 | 공주대학교 산학협력단 | Bonding material for diffusion bonding of dissimilar metal with hierarchical structure and diffusion bonding methode using the same |
| CN115106639A (en) * | 2022-06-27 | 2022-09-27 | 西安理工大学 | Method for connecting multi-bronze/two-phase titanium alloy bimetal |
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