JP2008187212A - Surface mount type light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inexpensive light emitting element easy in manufacture, low in cost, and uniform in light emission, in a light emitting element in which a light emission wavelength of an LED chip is changed by a fluorescent material. <P>SOLUTION: After mounting an LED chip 1, a translucent resin 2' is cured into a dome shape around the LED chip 1 in a recess formed by a substrate part 5 and a light reflecting part 4. Thereafter, a fluorescent material containing resin 3' is encapsulated and cured so as to cover the entire of the upper surface of the cured translucent resin 2'. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to a surface-mounted light-emitting element that converts an emission wavelength of an LED chip with a fluorescent material.

  A light-emitting element that converts the emission wavelength of an LED chip that emits blue or ultraviolet light into white or the like with a fluorescent material has been developed for the purpose of applying it to illumination of display units of various devices, general illumination, etc. Yes.

  Examples of such a conventional light emitting device include those described in JP-A-5-152609 and JP-A-7-99345. Here, the light emitting element described in Japanese Patent Laid-Open No. 7-99345 will be described with reference to FIG. In FIG. 7, 101 is an LED chip, 102 is a translucent resin, 103 ′ is a fluorescent material, 103 is a resin containing the fluorescent material 103 ′, 108 is a lead frame, and 100 is an LED chip 101 mounting portion of the lead frame 108. It is a formed cup.

  As shown in FIG. 7, in this light emitting device, an LED 101 is mounted on a cup 100 formed on a lead frame 108, the inside of the cup 100 is filled with a resin 103 containing a fluorescent material 103 ′, and the resin 103 is cured. Then, the periphery 102 is sealed so as to be surrounded by a translucent resin.

  Another conventional light emitting device is described in Japanese Patent Laid-Open No. 10-200165. Here, the light emitting element described in Japanese Patent Laid-Open No. 10-200165 will be described with reference to FIG. In FIG. 8, 111 is an LED chip, 112 is a resin sealing body composed of a sealing portion 112a and a lens portion 112b, 113 is a fluorescent cover made of a translucent resin material containing a fluorescent material, 117 is a lead thin wire, 118 Is a lead frame.

  As shown in FIG. 8, this light-emitting element includes a fluorescent material after LED 111 is mounted on lead frame 118 and wired to lead frame 118 with lead thin wire 117, which is sealed with resin sealing body 112. The fluorescent resin 113 is formed so as to surround the resin sealing body 112 by resin molding or spraying or applying the resin material to the resin sealing body 112.

  However, the above conventional techniques have the following problems. First, in the device described in Japanese Patent Laid-Open No. 7-99345 described with reference to FIG. 7, the lead frame 108 is prepared by mixing the fluorescent material 103 ′ with uncured liquid resin and dropping it around the LED chip 101. The resin 103 is cured by thermal curing or the like after being injected into the cup 100, but it takes several hours for the curing, and the fluorescent material 103 ′ having a high specific gravity settles during the curing. When such a sedimentation of the fluorescent material 103 ′ occurs, a large amount of the fluorescent material 103 ′ is distributed in the vicinity of the bottom surface of the cup 100. Then, the amount of the fluorescent material 103 ′ that passes through differs between the light emitted in the upper surface direction of the LED chip 101 and the light emitted in the side surface direction of the LED chip 101.

  As a result, color unevenness occurs in light emitted from such a light emitting element. For example, if the emission color of the LED chip 101 is blue and the fluorescent material converts blue to yellow, the light emitted toward the top surface of the LED chip 101 becomes strong light, and the side direction of the LED chip 101 The light emitted from the light causes uneven color such that yellow becomes a strong light.

  Furthermore, the light emitting portion of the LED chip is usually mounted so as to be in the upper surface direction, and when the fluorescent material settles, the fluorescent material is not distributed so much in the direction in which the light emission amount of the LED chip is large. The wavelength conversion effect due to cannot be sufficiently obtained.

  Therefore, in order to improve this, it is conceivable to increase the amount of the fluorescent material 103 ′ added. However, since the absorption by the fluorescent material 103 ′ also increases, the total amount of light emitted from the light emitting element decreases. End up. Moreover, since the fluorescent material is expensive, the cost is increased.

  As described above, in the device described in JP-A-7-99345, emission of color unevenness occurs due to sedimentation of the fluorescent material 103 ′ when the resin 103 is cured, and the wavelength conversion effect by the fluorescent material is sufficiently obtained. I couldn't.

  On the other hand, in the device described in Japanese Patent Laid-Open No. 10-200165 described with reference to FIG. 8, a resin material containing a fluorescent material is resin-molded or sprayed or applied to the resin sealing body 112 to obtain a fluorescent cover 113. Is formed so as to surround the resin sealing body 112. When the fluorescent cover 113 is resin-molded with a resin material containing a fluorescent material, the fluorescent cover 113 is attached so as to cover the resin sealing body 112 after the molding. Will be formed. Therefore, it is necessary to fill them with a translucent adhesive. However, it is difficult to bond such a shape with an adhesive so as not to form an air layer at all.

  Further, when the fluorescent cover 113 is formed by spraying or applying a resin material containing a fluorescent material to the resin sealing body 112 and curing it, uneven spraying or uneven application of the resin material occurs. Therefore, in order to prevent this and form a uniform fluorescent cover 113, a large amount of expensive fluorescent material is required, resulting in an increase in cost.

Note that the same problem as described above is expected even when applied to a surface-mount type (chip component type) light-emitting element.
JP-A-7-99345 Japanese Patent Laid-Open No. 10-200165

  The present invention has been made to solve the above-described problems, and is a light-emitting element that converts the light emission wavelength of an LED chip with a fluorescent material, and can be easily manufactured and can produce uniform light emission at low cost. An object is to provide an element and a light-emitting element.

In order to solve the above problems, in the light emitting device of the present invention,
A substrate part on which a wiring part is formed; and
LED chips wired to the wiring part on the substrate part;
A light reflecting portion for increasing the light output upward of the LED chip;
A translucent resin encapsulated around the LED chip and formed in a dome shape;
A resin containing a fluorescent material sealed so as to cover the entire top surface of the translucent resin;
With
The upper surface of the light reflecting portion is configured to be higher than the upper surface of the translucent resin .

According to the light emitting device of the present invention, since the substrate portion, the LED chip, the light reflecting portion, the translucent resin, and the resin containing the fluorescent material are provided, the light emitting device can be easily manufactured. It is possible to prevent unevenness in the light emission color of the light emitting element and improve the efficiency of wavelength conversion by the fluorescent material.

In addition, since the upper surface of the light reflecting portion is configured to be higher than the upper surface of the translucent resin, the light reflecting portion can prevent the resin material from leaking. Resin material with low viscosity can be used, various materials can be selected, and resin material with low viscosity can be enclosed by dropping, etc., improving design freedom and effective in manufacturing process .

In the light emitting device of the present invention,
A substrate on which a wiring portion is formed;
LED chips wired to the wiring part on the substrate;
A translucent resin formed in a dome shape around the LED chip;
A resin containing a fluorescent material formed so as to cover the entire exposed portion of the translucent resin;
With
The light emitted from the LED chip is configured to pass through the fluorescent material at substantially the same distance at any angle or in any direction.

According to the light emitting device of the present invention, since the substrate, the LED chip, the translucent resin, and the resin containing the fluorescent material are provided, the light emitting device can be easily manufactured, and the light emitting color of the light emitting device can be reduced. It is possible to prevent color unevenness and improve the efficiency of wavelength conversion by the fluorescent material.

Moreover, since the light emitted from the LED chip passes through the fluorescent material at almost the same distance at any angle or in any direction, the shades to be converted are substantially the same, and color unevenness does not occur.

According to the light emitting device of the present invention, since the substrate portion, the LED chip, the light reflecting portion, the translucent resin, and the resin containing the fluorescent material are provided, the light emitting device can be easily manufactured. It is possible to prevent unevenness in the light emission color of the light emitting element and improve the efficiency of wavelength conversion by the fluorescent material.

Further, according to the light emitting element of the present invention, since the substrate, the LED chip, the translucent resin, and the resin containing the fluorescent material are provided, the light emitting element can be easily manufactured, and the light emitting element emits light. It is possible to prevent color unevenness and improve the efficiency of wavelength conversion using a fluorescent material.

  Hereinafter, the present invention will be described in detail with reference to the illustrated embodiments.

  As shown in FIG. 1, the light emitting device of the first reference example includes a substrate portion 5 on which a wiring portion 6 is formed, an LED chip 1 wired on the substrate portion 5 with a thin metal wire 7, and the LED chip 1. Surrounding the periphery, forming a recess together with the substrate part 5 and increasing the light output upward of the LED chip 1, the light reflecting part 4 made of a light-reflective resin, and encapsulated around the LED chip 1 and cured. The light-transmitting resin 2 and the resin 3 containing a fluorescent material are formed by being sealed and cured in the light-transmitting resin 2 after the light-transmitting resin 2 is cured. In the light emitting device of the above reference example, the wiring portion 6 is a three-dimensional wiring as shown in FIG. 1, and is configured as a surface mount type, that is, a chip type component type light emitting device.

  In the manufacture of the light emitting element of the above reference example, the light reflecting portion 4 is formed on the substrate portion 5 on which the wiring portion 6 is formed so as to surround the periphery of the LED chip 1 mounting portion. Then, the LED chip 1 is disposed on the bottom surface of the recess formed by the substrate portion 5 and the light reflecting portion 4, wiring is performed on the wiring portion 6 using the metal thin wire 7, and the LED chip 1 is mounted. Next, a translucent resin 2 such as an epoxy resin or a silicon resin is sealed around the LED chip 1 inside the recess formed by the substrate portion 5 and the light reflecting portion 4 and cured. Thereafter, the fluorescent material-containing resin 3 is uniformly sealed so as to cover the entire upper surface of the cured translucent resin 2 and cured.

  In addition, as a resin material used for the fluorescent material-containing resin 3, a translucent resin material such as an epoxy resin or a silicon resin similar to the translucent resin 2 can be used. Moreover, if the upper surface of the light reflection part 4 which forms a recessed part after the hardening of the translucent resin 2 is made higher than the upper surface of the translucent resin 2, the light reflection part 4 causes the resin material to leak. Therefore, it is possible to use a resin material having a low viscosity for the fluorescent material-containing resin 3, and various materials can be selected, and the resin material having a low viscosity can be enclosed by dropping, etc. Is effective in the manufacturing process.

  As described above, the light-emitting element of the reference example as shown in FIG. 1 can be easily manufactured.

  According to the above reference example, in the surface mount type light emitting device, the translucent resin 2 is enclosed around the LED chip 1 and cured, and then the fluorescent material-containing resin 3 is encapsulated on the cured translucent resin 1. Since it is configured by curing, the fluorescent material can be distributed almost uniformly in the upper surface direction where the light emission intensity of the LED chip 1 is strong, and the unevenness of the light emission color of the light emitting element is prevented and the wavelength conversion by the fluorescent material is performed. It is possible to improve the efficiency. Therefore, the amount of expensive fluorescent material used can be reduced, and a low-cost light-emitting element can be realized.

  In order to prevent color unevenness of the emission color of the light emitting element, the light emitted from the LED chip 1 passes through the wavelength conversion material (fluorescent material) at almost the same distance at any angle or in any direction. Therefore, the shades to be converted are almost the same, and color unevenness does not occur.

  Furthermore, as the part that forms the recess around the LED chip 1, the light reflecting part 4 that is made of a light reflecting resin and has an opening extending upward is used, so that the light output is further increased. Thus, the light emitted from the LED chip 1 can be used more efficiently.

  In addition, since the distance from the LED chip 1 to the fluorescent material-containing resin 3 can be made substantially uniform, even in an array shape in which a large number of light emitting elements are arranged, it is possible to prevent variation in coloring between the elements.

2nd Embodiment is described using FIG. 2 which is principal part sectional drawing.

In the light emitting device of the second embodiment , the difference from the first reference example is that a translucent resin 2 ′ encapsulated and cured around the LED chip 1 is formed in a dome shape, and the fluorescent material-containing resin 3 The shape of 'also changes correspondingly, and the others are almost the same as in the first reference example.

In the manufacture of the light emitting device of the above embodiment , the LED chip 1 in the recess formed by the substrate portion 5 and the light reflecting portion 4 is mounted after the LED chip 1 is mounted in the same manner as in the first reference example. A translucent resin 2 ′ made of a resin material exhibiting thixotropy (thixotropic property) is dropped around the periphery so as to have a dome shape, and is cured within a time during which the shape is maintained. Thereafter, the fluorescent material-containing resin 3 ′ is sealed and cured so as to cover the entire upper surface of the cured translucent resin 2 ′.

  As a resin material used for the fluorescent material-containing resin 3 ′, a translucent resin material such as an epoxy resin or a silicon resin can be used as in the first reference example. Moreover, if the upper surface of the light reflection part 4 which forms a recessed part becomes higher than the dome-shaped vertex part of the translucent resin 2 'after hardening of the translucent resin 2', resin will be made by the light reflection part 4. Since leakage of the material can be prevented, a resin material having a low viscosity can be used for the fluorescent material-containing resin 3 ′, and various materials can be selected and encapsulated by dropping a resin material having a low viscosity. Thus, the degree of freedom of design is improved and the manufacturing process is effective.

  In addition, as a resin material exhibiting thixotropy (thixotropic property) used for the translucent resin 2 ′, for example, a translucent resin material such as silicon resin or epoxy resin that exhibits thixotropy may be used. it can.

As described above, the light-emitting element of the above embodiment as shown in FIG. 2 can be easily manufactured.

According to the above embodiment , since the translucent resin 2 ′ encapsulated and cured around the LED chip 1 is formed in a dome shape, the lens effect due to the shape can be obtained, and the light utilization efficiency is further improved. Can be improved. In addition, since the resin material which shows thixotropy (thixotropy) is used as translucent resin 2 'enclosed and hardened around LED chip 1, it can form in a dome shape easily.

  The thixotropy is a property that a gel is changed into a sol when it is stirred or shaken, and returns to the gel when it is left as it is. Therefore, if a sol-like resin material exhibiting thixotropy (thixotropic properties) is dropped around the LED chip so as to have a dome-like shape, a gel state is maintained and the shape is maintained, and the resin is cured. The dome shape can be easily formed. That is, if a resin material that exhibits thixotropy (thixotropic properties) is used, if a liquid resin before curing is dropped around the LED chip, the shape can be easily maintained until it is cured by thermal curing or the like. Can be formed.

  In addition, as in the first reference example, it is possible to prevent uneven color emission of the light emitting element and improve the efficiency of wavelength conversion using the fluorescent material. It should be noted that, as in the first reference example, the light emitted from the LED chip 1 is prevented from being uneven in the wavelength conversion material (fluorescent material) at any angle or in any direction. Are passed through substantially the same distance, so that the colors to be converted are substantially the same, and color unevenness does not occur.

A third embodiment will be described with reference to FIG.

As shown in FIG. 3, the light emitting device of the third embodiment includes a substrate 15 such as a printed wiring board, an LED chip 1 wired by a thin metal wire 7 on the substrate 15, and primary molding around the LED chip 1. The translucent resin 12 thus formed and the resin 13 formed on the primary molded translucent resin 12 and containing a fluorescent material. As shown in FIG. 4, the light emitting device of the above embodiment is formed by wiring the LED chip 1 on a wiring portion (not shown) of the substrate 15, and is a surface mounted type, that is, a chip type component type light emitting device. It is configured as.

In the manufacture of the light emitting device of the above embodiment , the LED chip 1 is disposed on the substrate portion 15, wiring is performed using the fine metal wires 7, and the LED chip 1 is mounted. Next, a translucent resin 12 such as an epoxy resin or a silicon resin is formed around the LED chip 1 on the substrate 15 so as to form a dome shape by transfer molding. Thereafter, the fluorescent material-containing resin 13 is formed by transfer molding so as to cover the entire exposed portion around the translucent resin 12.

In addition, as a resin material used for the fluorescent material-containing resin 13, a translucent resin material such as an epoxy resin or a silicon resin similar to the translucent resin 12 can be used. As described above, the light-emitting element of the above embodiment as shown in FIG. 3 can be easily manufactured.

According to the embodiment , in the surface-mount type light emitting element, after the light-transmitting resin 12 is primarily molded around the LED chip 1, the fluorescent material-containing resin 13 is formed on the primary-shaped light-transmitting resin 12. Therefore, the fluorescent material can be distributed almost uniformly in the upper surface direction where the light emission intensity of the LED chip 1 is strong, and unevenness of the light emission color of the light emitting element can be prevented, and wavelength conversion by the fluorescent material can be performed. Efficiency can be improved.

  In order to prevent color unevenness of the emission color of the light emitting element, the light emitted from the LED chip 1 passes through the wavelength conversion material (fluorescent material) at almost the same distance at any angle or in any direction. Therefore, the shades to be converted are almost the same, and color unevenness does not occur.

  Furthermore, since the distance from the LED chip 1 to the fluorescent material-containing resin 13 can be made substantially uniform, even in an array shape in which a large number of light emitting elements are arranged, it is possible to prevent variations in color between the elements.

  A fourth reference example will be described with reference to FIG.

In the light emitting device of the fourth reference example, the difference from the third embodiment is that a translucent resin 12 ′ that is primarily molded around the LED chip 1 is formed so that its upper surface has a concave shape. The shape of the fluorescent material-containing resin 13 ′ is formed such that the upper surface of the translucent resin 12 ′ fills the concave shape, and the others are substantially the same as in the third embodiment. Is.

In the manufacture of the light emitting device of the reference example, after mounting the LED chip 1 in the same manner as in the third embodiment , a translucent resin 12 ′ such as an epoxy resin or a silicon resin is formed by transfer molding. By the method, the upper surface is formed to have a concave shape. Thereafter, the fluorescent material-containing resin 13 is dropped onto the concave portion on the upper surface of the translucent resin 12 and cured.

  As the resin material used for the fluorescent material-containing resin 13 ′, a translucent resin material such as an epoxy resin or a silicon resin similar to the translucent resin 12 ′ can be used. As described above, the light-emitting element of the reference example as shown in FIG. 4 can be easily manufactured.

  According to the reference example, a concave shape is formed on the upper surface of the translucent resin 12 ′ that is primarily molded around the LED chip 1, and a fluorescent material is contained in the concave portion of the upper surface of the translucent resin 12 ′. Since the resin 13 ′ is dropped and cured, the resin containing the fluorescent material is dropped on the concave portion of the upper surface of the translucent resin. Therefore, the transfer mold molding method is not used. It can be formed and other manufacturing processes can be adopted. Also, as the resin containing the fluorescent material, a resin having a relatively low viscosity can be used, and the range of resin material selection can be expanded. Resin material can be used.

In addition, as in the third embodiment , it is possible to prevent uneven color emission of the light emitting element and improve the efficiency of wavelength conversion using a fluorescent material.

It should be noted that, as in the third embodiment , the light emitted from the LED chip 1 is prevented from being uneven in the wavelength conversion material (fluorescent material) at any angle or in any direction. Are passed through substantially the same distance, so that the colors to be converted are substantially the same, and color unevenness does not occur.

  A fifth embodiment will be described with reference to FIG.

The light emitting device of the fifth embodiment is different from the third embodiment in that a translucent resin 12 ″ that is primarily molded around the LED chip 1 is formed so that its upper surface is substantially planar. The fluorescent material-containing resin 13 ″ formed in a sheet shape is formed on the upper surface thereof by adhering with a translucent adhesive or the like, and the others are the same as in the third embodiment . It is almost the same thing.

The light emitting device of this embodiment is manufactured in the same manner as in the third embodiment , after the LED chip 1 is mounted, a translucent resin 12 ″ such as epoxy resin or silicon resin is transfer molded. By the molding method, the upper surface is formed to be substantially planar. Then, the fluorescent material-containing resin 13 ″ previously formed into a sheet shape is bonded to the upper surface of the light-transmitting resin 12 ″ with a light-transmitting adhesive or the like.

  Note that as the resin material used for the fluorescent material-containing resin 13 ″, a translucent resin material such as an epoxy resin or a silicon resin similar to the translucent resin 12 ″ can be used. As described above, the light emitting device of this embodiment as shown in FIG. 5 can be easily manufactured.

  According to this embodiment, the fluorescent material-containing resin 13 ″ is formed into a sheet shape, and the upper surface of the translucent resin 12 ″ that is primarily molded around the LED chip 1 is formed from the sheet-shaped fluorescent material-containing resin 13 ″. Since the sheet-like resin 13 ″ in which the fluorescent material is uniformly distributed is prepared in advance, the wavelength conversion effect by the fluorescent material can be obtained with higher efficiency.

In addition, as in the third embodiment , it is possible to prevent uneven color emission of the light emitting element and improve the efficiency of wavelength conversion using a fluorescent material. It should be noted that, as in the third embodiment , the light emitted from the LED chip 1 is prevented from being uneven in the wavelength conversion material (fluorescent material) at any angle or in any direction. Are passed through substantially the same distance, so that the colors to be converted are substantially the same, and color unevenness does not occur.

  A sixth reference example will be described with reference to FIG.

  As shown in FIG. 6, the light emitting device of the sixth reference example includes a molded body 23 made of a resin containing a fluorescent material, a lead frame 8, an LED chip 1 to be mounted on the lead frame 8, and a lead frame 8. The LED chip 1 mounted on is formed of a translucent resin 22 that is injected and cured in a state of being housed in the fluorescent material-containing molded body 23. As shown in FIG. 6, the light emitting device of the above reference example is a lead frame type light emitting device in which the LED chip 1 is mounted on the lead frame 8 and the lead portion of the lead frame 8 is drawn to the outside. It is configured.

  In the manufacture of the light emitting element of the above reference example, the LED chip 1 is arranged on the LED chip 1 mounting portion of the lead frame 8, wiring is performed on the lead frame 8 using the thin metal wires 7, and the LED chip 1 is mounted. Further, a fluorescent material-containing molded body 23 having a dome shape and a hollow shape is formed by injection molding using a resin containing a fluorescent material. Next, the LED chip 1 mounted on the lead frame 8 is held in a state where it is housed inside the cavity of the fluorescent material-containing molded body 23, and a light-transmitting material such as epoxy resin or silicon resin is contained therein. Resin 22 is injected and cured.

  In addition, as a resin material used for the fluorescent material-containing molded body 23, a translucent resin material such as an epoxy resin or a silicon resin similar to the translucent resin 22 can be used. As described above, the light-emitting element of the above reference example as shown in FIG. 6 can be easily manufactured.

  According to the reference example, in the lead frame type light emitting device, the fluorescent material-containing molded body 23 is formed, the LED chip 1 mounted on the lead frame is accommodated in the molded body 23, and the interior of the molded body 23 is stored. Since the translucent resin 22 is injected into the gap and cured, the molded body 23 in which the fluorescent material is uniformly distributed is prepared in advance, so that the molded body 23 and the translucent material that is injected and cured later. A light-emitting element capable of preventing uneven color emission of the light-emitting element and improving the efficiency of wavelength conversion using a fluorescent material without forming an air layer between the resin 22 and the resin 22 Can do.

  In order to prevent color unevenness of the emission color of the light emitting element, the light emitted from the LED chip 1 passes through the wavelength conversion material (fluorescent material) at almost the same distance at any angle or in any direction. Therefore, the shades to be converted are almost the same, and color unevenness does not occur.

  Therefore, unlike the conventional one described in JP-A-10-200165, it is not necessary to fill a light-transmitting adhesive between the fluorescent cover 113 and the resin sealing body 112. In addition to reducing the raw material cost, it is possible to realize a high-quality light-emitting element that can be reduced by simplifying the manufacturing process. Further, like the conventional one described in JP-A-10-200185, a resin material containing a fluorescent material is sprayed or applied to the resin sealing body 112 and cured to form the fluorescent cover 113. Therefore, the uneven distribution of the fluorescent material at the time of formation thereof does not occur, and a large amount of the fluorescent material is not required, so that a low-cost and high-quality light-emitting element can be realized.

  Further, in the above reference example, a dome shape having a lens portion as shown in FIG. 6 is used, so that the lens effect due to the shape can be obtained and the light utilization efficiency can be further improved.

  In any reference example and embodiment, the LED chip 1 is disposed so that the light emitting portion is in the upper surface direction (however, in the sixth reference example, the downward direction in FIG. 7).

  As for any of the above reference examples and embodiments, as a result of using a blue light emitting LED chip 1 as a fluorescent material and converting the wavelength of blue to yellow as a fluorescent material, good white light emission without color unevenness is obtained. I was able to get it.

In the case of the first reference example (FIG. 1) or the second embodiment (FIG. 2), the light emission wavelength of the LED chip 1 is measured after the translucent resin 2 or translucent resin 2 ′ is cured. By adjusting the content of the fluorescent material of the fluorescent material-containing resin 3 or the fluorescent material-containing resin 3 ′ according to the wavelength, light emission with a more stable wavelength can be obtained. And white light with no variation could be obtained.

It is principal part sectional drawing which shows schematic structure of the light emitting element of a 1st reference example. It is principal part sectional drawing which shows schematic structure of the light emitting element of 2nd Embodiment . It is principal part sectional drawing which shows schematic structure of the light emitting element of 3rd Embodiment . It is principal part sectional drawing which shows schematic structure of the light emitting element of the 4th reference example. It is principal part sectional drawing which shows schematic structure of the light emitting element of 5th Embodiment. It is principal part sectional drawing which shows schematic structure of the light emitting element of a 6th reference example. It is principal part sectional drawing which shows schematic structure of the conventional light emitting element. It is principal part sectional drawing which shows schematic structure of the conventional light emitting element.

Explanation of symbols

1 LED chip 2, 2 ′, 12, 12 ′, 12 ″, 22 Translucent resin 3, 3 ′, 13, 13 ′, 13 ″, 23 Resin containing fluorescent material 4 Light reflecting portion 5 Substrate portion 6 Wiring Part 7 Metal thin wire 8 Lead frame 15 Substrate 23 Molded body containing fluorescent material

Claims (6)

A substrate part on which a wiring part is formed; and
LED chips wired to the wiring part on the substrate part;
A light reflecting portion for increasing the light output upward of the LED chip;
A translucent resin encapsulated around the LED chip and formed in a dome shape;
A resin containing a fluorescent material sealed so as to cover the entire top surface of the translucent resin;
With
A surface-mounted light-emitting element, wherein an upper surface of the light reflecting portion is configured to be higher than an upper surface of the translucent resin. A substrate on which a wiring portion is formed;
LED chips wired to the wiring part on the substrate;
A translucent resin formed in a dome shape around the LED chip;
A resin containing a fluorescent material formed so as to cover the entire exposed portion of the translucent resin;
With
A surface-mounted light-emitting element configured so that light emitted from the LED chip passes through the fluorescent material at substantially the same distance at any angle or in any direction. The surface-mount light-emitting element according to claim 2,
The surface-mount light-emitting element, wherein the translucent resin has a substantially flat upper surface and a resin containing the fluorescent material is formed on the upper surface. In the surface-mounted light emitting device according to any one of claims 1 to 3,
The surface-mount light-emitting element, wherein the resin containing the fluorescent material is substantially uniformly distributed in the upper surface direction of the translucent resin. In the surface-mounted light emitting device according to any one of claims 1 to 4,
A surface-mount type light emitting device characterized in that a distance from the LED chip to the resin containing the fluorescent material is substantially uniform. In the surface-mounted light emitting device according to any one of claims 1 to 5,
A surface-mounted light-emitting element, wherein a plurality of the surface-mounted light-emitting elements are arranged in an array.

Images