JP2008185601A - Optical module, optical transmission apparatus, and manufacturing method of the optical module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical module whose productivity can be improved by eliminating precise control of application of adhesive, and to provide an optical transmission apparatus and the manufacturing method of the optical module. <P>SOLUTION: This optical module 1A includes a light-emitting element array 3; a support substrate 2A on which the emitting element array 3 is mounted; an optical waveguide 4 having an optical coupling face 4a for optical coupling to the light-emitting face 3a of the emitting element array 3 and having a reflecting face 4b installed at a position facing the optical coupling face 4a; and an adhesive 5 that is supplied by capillary force between the light-emitting face 3a of the emitting array 3 and the light coupling face 4a of the optical wave guide 4 and that sticks the light-emitting face 3a and the light-coupling face 4a together. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an optical module, an optical transmission apparatus, and an optical module manufacturing method.

  In recent years, with the further improvement in performance of electronic devices, it has become difficult to cope with data transfer speed and EMI (Electro Magnetic Interference) noise reduction with conventional electrical wiring, so some electrical wiring has been replaced with optical wiring. Transmission techniques have been adopted.

  Various types of optical modules have been proposed. Among them, there is an optical module using an optical waveguide having an optical path conversion surface (for example, see Patent Document 1).

This optical module includes a substrate, an optical device using a surface emitting laser mounted on the substrate, and a fluorinated polyimide optical waveguide film having a mirror surface at an angle of 45 degrees on the end surface, and the mirror surface of the optical waveguide film After the optical coupling surface provided at the opposing position is positioned and fixed on the optical device by, for example, a bump made of Au / Sn, an ultraviolet curable adhesive is applied from the periphery of the optical device to the optical waveguide film and the optical device. After filling the gap (for example, 40 μm), the film is irradiated with ultraviolet rays and cured to fix the optical waveguide film and the optical device. According to this configuration, it is possible to prevent the positional deviation between the optical waveguide film and the optical device due to the difference in thermal expansion.
JP 2000-214351 A

  An object of the present invention is to provide an optical module, an optical transmission device, and an optical module manufacturing method that make it possible to eliminate the need for precise management of the adhesive application amount and increase productivity. .

  In order to achieve the above object, an embodiment of the present invention provides the following optical module, optical transmission device, and optical module manufacturing method.

[1] A surface-type optical element having an optical surface that emits or receives light on the side opposite to the mounting surface, a substrate to which the mounting surface of the optical element is attached, and optical coupling that optically couples with the optical surface of the optical element And a predetermined position from a coupling portion between the optical surface of the optical element and the optical coupling surface of the optical waveguide, and an optical waveguide having an optical path conversion surface provided at a position facing the optical coupling surface. And an adhesive having a second adhesive part that is supplied to the coupling part by capillary force from the first adhesive part and adheres the optical surface and the optical coupling surface. An optical module comprising:

[2] The optical module according to [1], wherein the first adhesive portion of the adhesive is applied to the predetermined position on the substrate.

[3] The optical module according to [1], wherein the first adhesive portion of the adhesive is applied to the predetermined position that seals a wire that electrically connects the optical element and the substrate. .

[4] The optical module according to [1], wherein the adhesive is a curable adhesive that is cured by receiving heat or energy rays.

[5] A surface-type light emitting device having a light emitting surface opposite to the mounting surface, a substrate to which the mounting surface of the light emitting device is attached, an optical coupling surface that is optically coupled to the light emitting surface of the light emitting device, and An optical waveguide having an optical path conversion surface provided at a position facing the optical coupling surface, and a coating portion applied from a coupling portion between the light emitting surface of the light emitting element and the optical coupling surface of the optical waveguide. A first adhesive portion, and an adhesive having a second adhesive portion that is supplied from the first adhesive portion to the coupling portion by capillary force and adheres the light emitting surface and the optical coupling surface. An optical module, a planar light receiving element having a light receiving surface opposite to the mounting surface, a substrate to which the mounting surface of the light receiving element is attached, and an optical coupling surface that is optically coupled to the light receiving surface of the light receiving element And provided at a position facing the optical coupling surface. An optical waveguide having an optical path conversion surface, a first adhesive portion applied at a predetermined position from a coupling portion between the light receiving surface of the light receiving element and the optical coupling surface of the optical waveguide, and the first A second optical module comprising an adhesive having a second adhesive portion that is supplied from the adhesive portion to the coupling portion by capillary force and adheres the light receiving surface and the optical coupling surface; An optical transmission device comprising: an optical fiber that connects the optical waveguide of the optical module and the optical waveguide of the second optical module.

[6] A surface-type optical element having an optical surface for emitting or receiving light on the side opposite to the mounting surface, a substrate to which the mounting surface of the optical element is attached, and optical coupling that optically couples with the optical surface of the optical element A preparatory step of preparing a surface and an optical waveguide having an optical path conversion surface provided at a position facing the optical coupling surface, an attaching step of attaching the mounting surface of the optical element to the substrate, The uncured adhesive is applied by a capillary force generated in the gap by applying an uncured adhesive at a predetermined position from the gap between the optical surface and the optical coupling surface of the optical waveguide. An optical module manufacturing method comprising: an adhesive step of supplying the gap to the gap and curing the uncured adhesive to bond the optical surface and the optical coupling surface.

[7] In the bonding step, an uncured adhesive is applied to the surface of the substrate between the optical waveguide and the substrate to be higher than the optical element, and the optical surface of the optical element and the optical surface The optical module according to [6], wherein the gap between the optical waveguide and the optical coupling surface is gradually reduced to supply the uncured adhesive to the gap by capillary force generated in the gap. Production method.

[8] In the bonding step, an uncured adhesive is applied so as to seal a wire that electrically connects the optical element and the substrate, and the uncured adhesive is applied by capillary force. The method for manufacturing an optical module according to [6], wherein the optical module is supplied to the gap.

[9] The method for manufacturing an optical module according to [6], wherein in the bonding step, the adhesive is applied to the predetermined position after the optical waveguide is disposed on the optical element.

[10] The method for manufacturing an optical module according to [6], wherein the bonding step is performed by applying heat or energy rays to the uncured adhesive and curing the adhesive.

  According to the optical module of the first aspect, it becomes possible to eliminate the need for precise management of the adhesive application amount, and the productivity can be improved.

  According to the optical module of the second aspect, the optical waveguide can be firmly bonded to the substrate side.

  According to the optical module of the third aspect, the optical waveguide can be bonded and the wire sealed together.

  According to the optical module of the fourth aspect, the adhesive can be cured in a short time.

  According to the optical transmission device of the fifth aspect, it becomes possible to eliminate the need for precise management of the adhesive application amount, and the productivity can be improved.

  According to the optical module manufacturing method of the sixth aspect, it becomes possible to eliminate the need for precise management of the adhesive application amount, and the productivity can be increased.

  According to the optical module manufacturing method of the seventh aspect, the optical waveguide can be firmly bonded to the substrate side.

  According to the method for manufacturing an optical module according to claim 8, the optical waveguide can be bonded and the wire sealed together.

  According to the optical module manufacturing method of the ninth aspect, an adhesive having a relatively short curing time can be used.

  According to the optical module manufacturing method of the tenth aspect, the adhesive can be cured in a short time.

[First Embodiment]
1 is a perspective view showing a schematic configuration of an optical transmission apparatus according to a first embodiment of the present invention, and FIG. 2A is a plan view of an optical module provided on one side of an optical transmission line. 2B is a cross-sectional view taken along line AA in FIG. 2A, FIG. 3A is a plan view of the optical module provided on the other side of the optical transmission line, and FIG. These are the BB sectional drawing of Fig.3 (a).

  The optical transmission device 100 includes an optical module 1A provided on one side (transmission side) of the optical transmission path, an optical module 1B provided on the other side (reception side) of the optical transmission path, and both optical modules. A plurality of optical fibers 101 connecting between 1A and 1B are provided.

  The optical fiber 101 includes a core having a circular cross section and a clad formed around the core. The optical fiber 101 transmits light in many modes (paths) and transmits light in a single mode. A single mode optical fiber can be used. In the present embodiment, for example, a multimode optical fiber having a core diameter of 50 μm is used.

  As shown in FIGS. 1 and 2, the optical module 1A provided on the transmission side is optically coupled to the support substrate 2A, the light-emitting element array 3 mounted on the support substrate 2A, and the light-emitting element array 3. The light-emitting surface (optical surface) 3a of the light-emitting element array 3 and the light-coupling surface 4a of the light-guide element 4 are supplied to the optical waveguide 4 and the coupling portion between the light-emitting element array 3 and the optical waveguide 4 by capillary force. An adhesive 5 to be bonded and an optical connector 6A attached to one end of the optical waveguide 4 are provided.

  As shown in FIGS. 1 and 3, the optical module 1B provided on the receiving side is optically coupled to the support substrate 2B, the light receiving element array 7 mounted on the support substrate 2B, and the light receiving element array 7. The light receiving surface (optical surface) 7a of the light receiving element array 7 and the optical coupling surface 4a of the light guide 4 are supplied to the optical waveguide 4 and the coupling portion between the light receiving element array 7 and the optical waveguide 4 by capillary force. An adhesive 5 to be bonded and an optical connector 6B attached to one end of the optical waveguide 4 are provided.

  Optical connectors 102A and 102B are fixed to both ends of the optical fiber 101, respectively, and a pair of pins 103 project from the optical connectors 102A and 102B. A pair of pin holes 60 are formed in the optical connectors 6A and 6B. Then, by inserting the pins 103 of the optical connectors 102A and 102B into the pin holes 60 of the optical connectors 6A and 6B, the optical connector 6A and the optical connector 102A, and the optical connector 6B and the optical connector 102B are positioned and optically coupled. The

(Optical waveguide)
The optical waveguide 4 is composed of a core 40 and a clad 41 formed around the core 40, and is a reflection surface as an optical path conversion surface inclined at 45 degrees at the ends of the light emitting element array 3 and the light receiving element array 7 side. 4b is formed, and an end face 4c perpendicular to the end of the optical connectors 6A and 6B is formed. In the optical waveguide 4, for example, the core 40 has a rectangular cross section of 50 μm × 50 μm, and the layer thickness is 150 to 200 μm.

  The optical waveguide 4 can be manufactured, for example, by a method using photolithography or RIE (reactive ion etching) that is generally used. In particular, it can be efficiently produced by a production process using a mold described in Japanese Patent Application Laid-Open No. 2004-29507 already proposed by the present applicant. The manufacturing process will be described below.

  First, a master on which convex portions corresponding to the core are formed is produced using, for example, a photolithography method. Next, a curable resin having a viscosity of, for example, about 500 to 7000 mPa · s and having light transmittance in the ultraviolet region and the visible region, for example, a methylsiloxane group in the molecule, A layer of curable organopolysiloxane containing an ethylsiloxane group and a phenylsiloxane group is provided by coating or the like, and then cured to form a cured layer. Next, the hardened layer is peeled off from the master and a mold having a concave portion corresponding to the convex portion is produced.

  Next, a clad film substrate made of a resin excellent in adhesion to the mold, for example, an alicyclic acrylic resin film, an alicyclic olefin resin film, a cellulose triacetate film, a fluororesin film, or the like is adhered to the mold. Let Next, the concave portion of the mold is filled with, for example, an ultraviolet curable or thermosetting monomer, an oligomer or a mixture of a monomer and an oligomer, an epoxy type, a polyimide type, an acrylic type ultraviolet curable resin, or the like. . Next, after hardening the curable resin in the recess to form the core 40, the mold is peeled off. This leaves the core 40 on the cladding film substrate.

  Next, a clad layer is provided so as to cover the core 40 on the surface side of the clad film substrate on which the core 40 is formed. Examples of the clad layer include a film, a layer cured by applying a curable resin for clad, and a polymer film formed by applying a solvent solution of a polymer material and drying. Finally, the surface where the core 40 of the optical waveguide is exposed is cut at a predetermined angle by a dicer to form the reflection surface 4b and the end surface 4c. Further, by cutting out with a dicer parallel to the core 40, the optical waveguide 4 having the clad film base material and the clad layer as the clad 41 is completed.

(Light emitting element array)
The light emitting element array 3 may be an array of a plurality of light emitting elements (surface optical elements) such as a surface light emitting diode or a surface laser. In the present embodiment, a VCSEL (surface emitting laser) array is used as the light emitting element array 3. In the surface emitting laser array, for example, an n-type lower reflector layer, an active layer 30, a current confinement layer, a p-type upper reflector layer, a p-type contact layer, and a p-side electrode 31 are formed on an n-type GaAs substrate. The n-side electrode 32 is formed on the back surface of the n-type GaAs substrate. The active layer 30, the current confinement layer, the p-type upper reflector layer, the p-type contact layer, and the p-side electrode 31 are provided for each light emitting element. Is formed. The p-side electrode 31 has an opening 31 a immediately above the light emitting region of the active layer 30. The light emitting element array 3 has, for example, a width of 0.3 mm, a height of 0.2 mm, and a length of 1 mm in the array direction, and four openings 31a are arranged on the light emitting surface 3a with a pitch of 250 μm in the longitudinal direction. Yes.

(Light receiving element array)
For the light receiving element array 7, for example, a planar optical element such as a planar photodiode can be used. In this embodiment, a GaAs PIN photodiode excellent in high-speed response is used as the light receiving element. The light receiving element array 7 includes, for example, a P-layer, a I-layer and an N-layer which are PIN-bonded on a GaAs substrate, a p-side electrode 71 connected to the P layer, and an n-side electrode 72 formed on the N layer. The P layer, the I layer, the N layer, the p-side electrode 71 and the n-side electrode 72 are formed for each light receiving element. The p-side electrode 71 has an opening 71a, and the inside of the opening 71a serves as a light receiving unit 70 that receives laser light. The light receiving element array 7 has, for example, a width of 0.3 mm, a height of 0.2 mm, and a length of 1 mm in the array direction, and four light receiving portions 70 are arranged on the light receiving surface 7a with a pitch of 250 μm in the longitudinal direction. ing.

(Support substrate)
The transmission-side support substrate 2 </ b> A includes a base material 20 formed of an insulating material such as glass epoxy resin, and a ground 21 and a pad 22 formed of a conductive material such as copper on the upper surface of the base material 20. The n-side electrode 32 and the ground 21 of the light emitting element array 3 are bonded by a conductive adhesive (not shown), and the p-side electrode 31 and the pad 22 are connected by a bonding wire 8 made of gold or the like.

  The support substrate 2B on the receiving side includes a base material 20 formed of an insulating material such as glass epoxy resin, and a p-side pad 23 and an n-side pad 24 formed on the upper surface of the base material 20 from a conductive material such as copper. And have. The p-side electrode 71 and the p-side pad 23 and the n-side electrode 72 and the n-side pad 24 are connected to each other by bonding wires 8 made of gold or the like.

  The support substrates 2A and 2B may be configured so that they can be mounted on other circuit boards. For example, the ground 21 and pads 22, 23, 24 formed on the surfaces of the support substrates 2A, 2B are connected to the BGA (ball grid array) provided on the back surfaces of the support substrates 2A, 2B through the through holes. The substrates 2A and 2B may be mounted on the circuit board via the BGA.

(adhesive)
The adhesive 5 includes a first adhesive portion 5a to which the uncured adhesive 5 is first applied, and the light emitting surface 3a of the light emitting element array 3 or the light receiving element array 7 by capillary force from the first adhesive portion 5a. And a second adhesive portion 5 b supplied to a gap (coupling portion) G between the light receiving surface 7 a and the optical coupling surface 4 a of the optical waveguide 4. The position of the 1st adhesion part 5a is on support substrate 2A, 2B, Comprising: The distance which can supply the uncured adhesive 5 to the space | gap G between the light emission surface 3a and the optical coupling surface 4a with a capillary force. It is in.

  This adhesive 5 has a property of transmitting the light emission wavelength of the light emitting element array 3 and irradiates a thermosetting adhesive that is cured by heating, or energy rays such as visible light, ultraviolet light, electron beam, and radiation. It is possible to use an energy ray curable adhesive that is cured by heating. In this embodiment, an ultraviolet curable adhesive that is cured by ultraviolet irradiation is used.

(Assembly method of optical module)
Next, an example of an assembly method of the optical modules 1A and 1B will be described with reference to FIGS. 4A and 4B. 4A and 4B show an example of an assembly process of the optical module 1A.

(1) Attachment process As shown to Fig.4 (a), the n side electrode 32 of the light emitting element array 3 and the gland | grand | ground 21 of 2 A of support substrates are adhere | attached using a conductive adhesive. Next, the four p-side electrodes 31 of the light emitting element array 3 and the four pads 22 on the support substrate 2A are connected by the bonding wires 8, and the light emitting element array 3 is mounted on the support substrate 2A.

  The lower surface of the light receiving element array 7 is fixed to a predetermined position on the support substrate 2B with an adhesive or the like, and the p side electrode 71 of the light receiving element array 7, the p side pad 23 of the support substrate 2B, and the n side electrode of the light receiving element array 7 72 and the n-side pad 24 of the support substrate 2B are respectively connected by the bonding wires 8, and the light receiving element array 7 is mounted on the support substrate 2B.

(2) Bonding Step Next, as shown in FIG. 4B, the adhesive 5 is applied from the dispenser needle 201 to a predetermined position on the support substrate 2A. The coating height H is set higher than the height of the light emitting element array 3. The portion of the applied adhesive 5 is the first adhesive portion 5a and is in an uncured state.

  Next, as shown in FIG. 4C, the optical waveguide 4 is adsorbed by the adsorption tool 202 to position the optical waveguide 4 at a desired position, the adsorption tool 202 is lowered, and the light emitting surface 3a and the optical coupling surface 4a. When the gap G is gradually reduced to a predetermined value (for example, 30 to 60 μm), as shown in FIGS. 4 (d) and 4 (e), the uncured state is caused by the capillary force generated in the gap G. The adhesive 5 is supplied to the gap G from the first adhesive portion 5a. The portion of the adhesive 5 supplied to the gap G becomes the second adhesive portion 5b.

  Next, as shown in FIG. 4F, the uncured adhesive 5 is irradiated with ultraviolet rays from the ultraviolet light source 203 while the optical waveguide 4 is held by suction with the suction tool 202. Thereby, as shown in FIG. 4G, the adhesive 5 is cured, and the optical waveguide 4, the light emitting element array 3, and the support substrate 2A are bonded.

  The optical module 1B on the receiving side also applies the adhesive 5 and cures the adhesive 5 by irradiating ultraviolet rays in the same manner as the optical module 1A on the transmitting side, and the optical waveguide 4 is applied to the light receiving element array 7 and the support substrate 2B. Glue. Thereafter, the optical connectors 6A and 6B are attached to the end face 4c side of the optical waveguide 4 of the optical modules 1A and 1B.

(Operation of optical transmission equipment)
FIG. 5 is a diagram for explaining an optical transmission path. When a voltage is applied between the p-side electrode 31 and the n-side electrode 32 of the light emitting element array 3 of the optical module 1A, a laser beam having a wavelength of 850 nm, for example, is emitted in the light emitting region of the light emitting layer 30. After passing through the opening 31a of 31 and being reflected by the reflecting surface 4a of the optical waveguide 4 via the second adhesive portion 5a, it propagates through the core 40 of the optical waveguide 4 and is emitted from the end surface 4c. The laser light emitted from the end face 4c of the optical waveguide 4 enters the core 101a of the optical fiber 101, propagates through the core 101a, and is emitted from the other end face. The laser light emitted from the optical fiber 101 enters the end face 4c of the optical waveguide 4 of the optical module 1B, propagates through the core 40, is reflected by the reflecting surface 4b, and then received through the second bonding portion 5b. The light enters the light receiving portion 70 of the element array 7. A current corresponding to the amount of light incident on the light receiving unit 70 flows between the p-side electrode 71 and the n-side electrode 72.

[Second Embodiment]
FIG. 6 is a perspective view showing a schematic configuration of an optical transmission apparatus according to the second embodiment of the present invention. In the first embodiment, the adhesive 5 is applied onto the support substrates 2A and 2B. However, in the present embodiment, the light-emitting element array 3 and the light-receiving element array serve to seal the bonding wire 8 with the adhesive 5 as well. The others are applied in the same manner as in the first embodiment. The description of the same configuration as that of the first embodiment is omitted.

  The adhesive 5 includes a first adhesive portion 5a to which the uncured adhesive 5 is first applied, and the light emitting surface 3a of the light emitting element array 3 or the light receiving surface 7a of the light receiving element array 7 from the first adhesive portion 5a. And a second adhesive portion 5b supplied to the gap (coupling portion) G between the optical waveguide 4 and the optical coupling surface 4a of the optical waveguide 4 by capillary force. The position of the 1st adhesion part 5a exists on the bonding wire 8, Comprising: It exists in the distance which can supply the adhesive agent 5 of a non-hardened state to the space | gap G between the light emission surface 3a and the optical coupling surface 4a by capillary force. .

(Assembly method of optical module)
Next, an example of an assembly method of the optical modules 1A and 1B will be described with reference to FIGS. 7A and 7B. 7A and 7B show an example of an assembly process of the optical module 1A.

  As in the first embodiment, the light emitting element array 3 is mounted on the support substrate 2A, and the light receiving element array 7 is mounted on the support substrate 2B.

  Next, as shown in FIG. 7A, the optical waveguide 4 is attracted by the adsorption tool 202 to position the optical waveguide 4 at a desired position. Subsequently, as shown in FIG. 7B, the suction tool 202 is lowered to set the gap G between the light emitting surface 3a and the optical coupling surface 4a to a predetermined value (for example, 30 to 60 μm).

  Next, as shown in FIG. 7C, the adhesive 5 is applied from the dispenser needle 201 to seal the bonding wire 8. This sealed position becomes the first adhesive portion 5a. As shown in FIGS. 7D and 7E, the adhesive 5 is supplied to the gap G from the uncured first adhesive portion 5a by the capillary force generated in the gap G. The adhesive 5 supplied to the gap G becomes the second adhesive portion 5b.

  Next, as shown in FIG. 7F, the uncured adhesive 5 is irradiated from the ultraviolet light source 203 while the optical waveguide 4 is held by suction with the suction tool 202. As a result, as shown in FIG. 7G, the adhesive 5 is cured and the optical waveguide 4, the light emitting element array 3, and the support substrate 2A are joined.

  The optical module 1B on the receiving side also applies the adhesive 5 and cures the adhesive 5 by irradiating ultraviolet rays in the same manner as the optical module 1A on the transmitting side, and the optical waveguide 4 is applied to the light receiving element array 7 and the support substrate 2B. Glue. Thereafter, the optical connectors 6A and 6B are attached to the end face 4c side of the optical waveguide 4 of the optical modules 1A and 1B.

[Other embodiments]
The present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the invention. In addition, it is possible to arbitrarily combine the constituent elements of each embodiment without departing from the spirit of the present invention.

  For example, the angle of the reflection surface of the optical waveguide is not limited to 45 degrees. Further, a metal film such as aluminum, gold, silver, and titanium, or a dielectric multilayer film having wavelength selectivity may be formed on the surface of the reflection surface of the optical waveguide.

  In each of the above embodiments, the light emitting element array 3 is used for one optical module 1A and the light receiving element array 7 is used for the other optical module 1B. , 1B, a light emitting element and a light receiving element may be arranged to perform bidirectional communication. The optical module may use a single optical element.

FIG. 1 is a perspective view showing a schematic configuration of the optical transmission apparatus according to the first embodiment of the present invention. FIG. 2A is a plan view of the optical module provided on one side of the optical transmission line, and FIG. 2B is a cross-sectional view taken along line AA in FIG. FIG. 3A is a plan view of the optical module provided on the other side of the optical transmission line, and FIG. 3B is a cross-sectional view taken along line BB in FIG. 4A to 4C are cross-sectional views illustrating an example of the assembly process of the optical module. 4B to 4G are cross-sectional views illustrating an example of an assembly process of the optical module. FIG. 5 is a diagram for explaining an optical transmission path. FIG. 6 is a perspective view showing a schematic configuration of an optical transmission apparatus according to the second embodiment of the present invention. 7A (a) to 7 (d) are cross-sectional views showing an example of the assembly process of the optical module. 7B (e) to 7 (g) are cross-sectional views showing an example of the assembly process of the optical module.

Explanation of symbols

1A, 1B Optical modules 2A, 2B Support substrate 3 Light emitting element array 3a Light emitting surface 4 Optical waveguide 4a Optical coupling surface 4b Reflecting surface 4c End surface 5 Adhesive 5b First adhesive portion 5a Second adhesive portion 6A, 6B Optical connector 7 Light-receiving element array 7a Light-receiving surface 8 Bonding wire 20 Base material 21 Ground 22 Pad 23 p-side pad 24 n-side pad 30 Active layer 31 p-side electrode 31a Opening 32 n-side electrode 40 Core 41 Clad 60 Pin hole 70 Light-receiving portion 71 p-side Electrode 71a Opening 72 N-side electrode 100 Optical transmission device 101 Optical fiber 101a Core 101b Clad 102A, 102B Optical connector 103 Pin 201 Dispenser needle 202 Adsorption tool 203 Ultraviolet light source G Gap

Claims (10)

A surface-type optical element having an optical surface for emitting or receiving light on the side opposite to the mounting surface;
A substrate to which the mounting surface of the optical element is attached;
An optical waveguide having an optical coupling surface optically coupled with the optical surface of the optical element, and an optical path conversion surface provided at a position facing the optical coupling surface;
A first adhesive portion applied at a predetermined position from a coupling portion between the optical surface of the optical element and the optical coupling surface of the optical waveguide, and the coupling portion by capillary force from the first adhesive portion An optical module comprising: an adhesive having a second adhesive portion that is supplied to the optical surface and adheres the optical surface and the optical coupling surface.   The optical module according to claim 1, wherein the first adhesive portion of the adhesive is applied to the predetermined position on the substrate.   The optical module according to claim 1, wherein the first adhesive portion of the adhesive is applied to the predetermined position that seals a wire that electrically connects the optical element and the substrate.   The optical module according to claim 1, wherein the adhesive is a curable adhesive that is cured by receiving heat or energy rays. A planar light emitting device having a light emitting surface opposite to the mounting surface; a substrate to which the mounting surface of the light emitting device is attached; an optical coupling surface that optically couples to the light emitting surface of the light emitting device; and the optical coupling surface An optical waveguide having an optical path conversion surface provided at a position opposite to the optical waveguide, and a first portion applied at a predetermined position from a coupling portion between the light emitting surface of the light emitting element and the optical coupling surface of the optical waveguide. A first light comprising: an adhesive portion; and an adhesive having a second adhesive portion that is supplied from the first adhesive portion to the coupling portion by capillary force and adheres the light emitting surface and the optical coupling surface. Module,
A surface-type light-receiving element having a light-receiving surface opposite to the mounting surface; a substrate to which the mounting surface of the light-receiving element is attached; an optical coupling surface that optically couples to the light-receiving surface of the light-receiving element; and the optical coupling surface An optical waveguide having an optical path conversion surface provided at a position opposite to the first optical waveguide, and a first portion applied at a predetermined position from a coupling portion between the light receiving surface of the light receiving element and the optical coupling surface of the optical waveguide. A second light comprising: an adhesive portion; and an adhesive having a second adhesive portion that is supplied from the first adhesive portion to the coupling portion by capillary force to adhere the light receiving surface and the optical coupling surface Module,
An optical transmission device comprising: an optical fiber connecting the optical waveguide of the first optical module and the optical waveguide of the second optical module. A surface-type optical element having an optical surface for emitting or receiving light on the side opposite to the mounting surface, a substrate to which the mounting surface of the optical element is attached, an optical coupling surface optically coupled to the optical surface of the optical element, and A preparation step of preparing an optical waveguide having an optical path conversion surface provided at a position facing the optical coupling surface;
An attachment step of attaching the mounting surface of the optical element to the substrate;
By applying an uncured adhesive from a gap between the optical surface of the optical element and the optical coupling surface of the optical waveguide to a predetermined position, the uncured state is caused by a capillary force generated in the gap. An optical module manufacturing method comprising: an adhesive step of supplying an adhesive to the gap and curing the uncured adhesive to bond the optical surface and the optical coupling surface.   In the bonding step, an uncured adhesive is applied to the surface of the substrate between the optical waveguide and the substrate so as to be higher than the optical element, and the optical surface of the optical element and the optical waveguide The method of manufacturing an optical module according to claim 6, wherein the uncured adhesive is supplied to the gap by a capillary force generated in the gap by gradually reducing the gap with the optical coupling surface.   In the bonding step, an uncured adhesive is applied so as to seal a wire that electrically connects the optical element and the substrate, and the uncured adhesive is supplied to the gap by capillary force. An optical module manufacturing method according to claim 6.   The method of manufacturing an optical module according to claim 6, wherein, in the bonding step, the adhesive is applied to the predetermined position after the optical waveguide is disposed on the optical element.   The said adhesion process is a manufacturing method of the optical module of Claim 6 which gives a heat | fever or an energy ray to the said unhardened adhesive agent, and makes it harden | cure.