JP2008185669A - Manufacturing method of liquid crystal device - Google Patents

Abstract

A liquid crystal panel capable of reliably preventing display defects such as flicker and burn-in in a liquid crystal device caused by ion deviation when the surface potentials of a pixel electrode and a counter electrode are different after manufacturing. A method for manufacturing a liquid crystal device is provided.
Steps S1 for forming electrodes for applying a driving voltage to the liquid crystal on the TFT substrate and the counter substrate, steps S4 for performing plasma treatment on one of the electrodes of the TFT substrate and the counter substrate, TFT And step S5 of forming an inorganic alignment film on the electrodes of the substrate and the counter substrate, respectively.
[Selection] Figure 4

Description

  The present invention relates to a method of manufacturing a liquid crystal device including a liquid crystal panel in which liquid crystal is interposed between a first substrate and a second substrate facing the first substrate.

  As is well known, for example, a liquid crystal panel of a light transmission type liquid crystal device is configured by interposing liquid crystal between two substrates made of a glass substrate, a quartz substrate, or the like.

  In addition, in a liquid crystal panel, switching elements such as thin film transistors (hereinafter referred to as TFTs) and pixel electrodes are arranged in a matrix on one substrate, and a counter electrode is arranged on the other substrate. By changing the optical response of the liquid crystal layer interposed between the substrates according to the image signal, it is possible to display an image.

  In addition, the TFT substrate on which the TFT is disposed and the counter substrate disposed to face the TFT substrate are manufactured separately. The TFT substrate and the counter substrate are configured, for example, by laminating a semiconductor thin film, an insulating thin film, or a conductive thin film having a predetermined pattern on a quartz substrate. Each layer is formed by repeating a film forming process and a photolithography process for various films.

The TFT substrate and the counter substrate thus formed are bonded with high accuracy (for example, within an alignment error of 1 μm) in the panel assembly process. An example of this panel assembly process will be described. First, liquid crystal molecules are aligned along the substrate surface on the pixel electrode of the TFT substrate manufactured in the manufacturing process of each substrate and on the counter electrode of the counter substrate. For example, an inorganic alignment film made of SiO ₂ or the like is formed.

  The inorganic alignment film is formed by being deposited on the target substrate at a predetermined angle corresponding to the pretilt angle, so that the pretilt angle of the liquid crystal can be defined without forming a rubbing treatment after the formation. Such a method for forming an inorganic alignment film is referred to as oblique vapor deposition.

  Next, when the liquid crystal is interposed between the TFT substrate and the counter substrate by, for example, a liquid crystal sealing method, a sealing material serving as an adhesive is partially formed on one of the TFT substrate and the counter substrate. It is applied in a substantially circumferential shape so as to have a notch serving as an inlet, and this sealing material is used to attach the counter substrate to the TFT substrate.

  Next, after alignment and curing by pressure bonding, a prescribed amount of liquid crystal is dropped in the vicinity of the inlet of the sealing material of the TFT substrate under vacuum, and then released to the atmosphere, thereby opening the inlet. Then, liquid crystal is injected between the TFT substrate and the counter substrate, and finally, the injection port is sealed with a sealing material to manufacture a liquid crystal panel.

  By the way, the liquid crystal panel manufactured in this way supplies an image signal to the pixel electrode by turning on the switching element, and applies a voltage based on the image signal to the liquid crystal layer between the pixel electrode and the counter electrode. Then, the arrangement of the liquid crystal molecules is changed. Thereby, the transmittance of the pixel is changed, and light passing through the pixel electrode and the liquid crystal layer is changed according to the image signal to perform image display.

  Here, in the liquid crystal panel, due to the application of the DC component of the applied signal, for example, decomposition of the liquid crystal component and contamination due to impurities in the liquid crystal occur, and display defects such as image burn-in and flicker appear.

  Specifically, in the liquid crystal panel, as is well known, a driving voltage is applied to the pixel electrode only for a certain period in consideration of the capacitance. However, during a period in which the drive voltage is not applied to the pixel electrode, the voltage held in the pixel gradually decreases due to the influence of coupling capacitance and charge leakage.

  In this case, since the decrease in the electrode application voltage at the time of the positive polarity driving is larger than the decrease of the electrode application voltage at the time of the negative polarity driving, the pixel electrode in which the TFT substrate and the counter substrate are exposed from the liquid crystal, Negative charges or positive charges are likely to be accumulated at the portion of the counter electrode.

  Therefore, when charges are accumulated in each pixel electrode and counter electrode of the TFT substrate and the counter substrate, the above-described impurity ions (hereinafter referred to as impurity ions) are exposed to the liquid crystal pixel electrode and counter electrode. It tends to remain at the interface between the part and the liquid crystal. As a result, impurity ions are adsorbed on each interface.

  Therefore, if there is an extreme deviation in the amount of adsorbed impurity ions between the pixel electrode part exposed on the TFT substrate and the counter electrode part exposed on the counter substrate, it is excessively adsorbed on one electrode. There is a problem in that the influence of a direct current component generated between the two electrodes due to the generated ions, that is, applied to the liquid crystal is increased, and display defects such as image sticking and flicker are accelerated.

  Therefore, in general, a technique for preventing display defects such as burn-in of a display image by performing known inversion driving in which the polarity of the driving voltage of each pixel electrode is inverted for each field in an image signal, for example. It is.

Further, in Patent Document 1, in the reflection type liquid crystal device, in addition to the application of the DC component of the applied signal, the bias of ion adsorption that occurs when the material of the pixel electrode is different from the material of the counter electrode Proposed technology to prevent display defects such as image sticking and flicker by covering the electrode with a different metal film whose standard potential is opposite to that of the metal material constituting the pixel electrode. Has been.
JP 2003-57674 A

  However, the technique disclosed in Patent Document 1 is applied to a transmissive liquid crystal panel that uses transparent electrodes for the pixel electrode and the counter electrode in order to cover the pixel electrode with a metal film having low transmittance. There was a problem that I couldn't.

  Here, since the shape and surface area of the pixel electrode formed on the TFT substrate and the counter electrode formed on the counter substrate change due to the manufacturing method and process, the surface potential is different between the pixel electrode and the counter electrode. May be different.

  If the surface potential is different between the pixel electrode and the counter electrode, the pixel electrode and the counter electrode have the same surface potential at the exposed portion of the pixel electrode and the exposed portion of the counter electrode. As compared with the case, there is a problem that the amount of impurity ions adsorbed is extremely biased, and display defects such as image sticking and flicker are likely to occur.

  Specific examples are shown in FIGS. 6 schematically shows a state in which the surface potential of the counter electrode on the counter substrate side is lower than the surface potential of the pixel electrode on the TFT substrate side, and FIG. 7 shows that the pixel electrode is minus with respect to the counter electrode. FIG. 8 is a diagram schematically showing a state where the surface potential of the pixel electrode on the TFT substrate side is lower than the surface potential of the counter electrode on the counter substrate side, and FIG. It is a figure which shows the state which the pixel electrode shifted to the plus side with respect to the counter electrode.

  For example, as shown in FIG. 6, when the surface potential of the counter electrode of the counter substrate 200 becomes lower than the pixel electrode of the TFT substrate 100, the counter electrode is relatively negatively charged than the pixel electrode, and the TFT substrate As shown in FIG. 7, the potential (* 2) of the pixel electrode is negative due to the bias of ion adsorption generated in the liquid crystal panel due to negative ions adsorbed on 100 and positive ions adsorbed on the counter substrate 200. As well as shifting to the negative side (* 3), the known center potential, which was the same potential as the counter electrode potential (* 1), also shifts to the negative side (* 4).

  If the center potential shifts to the minus side (* 4), flicker is likely to occur, and if the pixel electrode potential (* 2) shifts to the minus side (* 3), the potential of the counter electrode Since (* 1) does not shift, a direct current component is always applied to the liquid crystal layer by the amount of shift to the negative side of the potential of the pixel electrode, and burn-in of the display image is likely to occur.

  For example, as shown in FIG. 8, when the surface potential of the pixel electrode of the TFT substrate 100 becomes lower than the counter electrode of the counter substrate 200, the pixel electrode is relatively negatively charged than the counter electrode, As shown in FIG. 9, the potential (* 6) of the pixel electrode is caused by the bias of ion adsorption generated in the liquid crystal panel by adsorbing negative ions to the substrate 200 and adsorbing positive ions to the TFT substrate 100. While shifting to the plus side (* 7), the center potential that is the same potential as the potential of the counter electrode (* 5) is also shifted to the plus side (* 8).

  If the center potential shifts to the plus side (* 8), flicker tends to occur, and if the potential of the pixel electrode (* 6) shifts to the plus side (* 7), the potential of the counter electrode Since (* 5) does not shift, the direct current component is always applied to the liquid crystal layer by the amount of shift to the positive side of the potential of the pixel electrode, and burn-in of the display image is likely to occur.

  As described above, when the surface potentials of the pixel electrode and the counter electrode are different, the above-described inversion driving cannot completely prevent display defects such as image burn-in and flicker. In addition, inversion driving reduces the light transmittance in the effective pixel region of the liquid crystal panel, and therefore, when the surface potential differs between the pixel electrode and the counter electrode, the display image caused by the bias of ion adsorption Other techniques have been desired to prevent display defects such as burn-in and flicker.

  The present invention has been made paying attention to the above-mentioned circumstances and problems, and flickering and image sticking in a liquid crystal device generated due to ion deviation in the case where the surface potential is different between the pixel electrode and the counter electrode after manufacturing, etc. An object of the present invention is to provide a method of manufacturing a liquid crystal device including a liquid crystal panel that can reliably prevent display defects.

  In order to achieve the above object, a method of manufacturing a liquid crystal device according to the present invention includes a liquid crystal panel in which liquid crystal is interposed between a first substrate and a second substrate facing the first substrate. A method of manufacturing a liquid crystal device, comprising: forming an electrode for applying a driving voltage to the liquid crystal on each of the first substrate and the second substrate; and the first substrate and the second substrate. A dry surface treatment process for performing a dry surface treatment on any one of the electrodes, and an inorganic alignment film for forming an inorganic alignment film on the electrodes of the first substrate and the second substrate, respectively. And a forming step.

  According to the present invention, after the electrodes are formed on the first substrate and the second substrate, differences in the shape and surface area of the electrodes occur depending on the manufacturing method and process between the first substrate and the second substrate. Even if the surface potentials of the electrodes differ, the surface potentials of the electrodes are matched within a certain range between the first substrate and the second substrate by performing a dry surface treatment on one of the electrodes. Can be made. Therefore, a difference occurs in the surface potential of the electrode between the first substrate and the second substrate, and positive ions interposed in the liquid crystal accumulate at the interface of the electrode having a low surface potential, and negative ions interposed in the liquid crystal. Therefore, it is possible to provide a method for manufacturing a liquid crystal device that can reliably prevent display defects such as flicker and image sticking in the liquid crystal device that are generated due to ion bias due to accumulation at the interface of electrodes having a high surface potential.

  Further, the dry surface treatment step is a plasma treatment step of performing a plasma treatment on the electrode of either the first substrate or the second substrate.

  According to the present invention, after the electrodes are formed on the first substrate and the second substrate, differences in the shape and surface area of the electrodes occur depending on the manufacturing method and process between the first substrate and the second substrate. Even if the surface potentials of the electrodes are different, the surface potentials of the respective electrodes are matched within a certain range between the first substrate and the second substrate by performing plasma treatment on one of the electrodes. be able to. Therefore, a difference occurs in the surface potential of the electrode between the first substrate and the second substrate, and positive ions interposed in the liquid crystal accumulate at the interface of the electrode having a low surface potential, and negative ions interposed in the liquid crystal. Thus, it is possible to provide a method for manufacturing a liquid crystal device that can reliably prevent display defects such as flicker and image sticking in a liquid crystal device caused by ion bias due to accumulation at the interface of electrodes having a high surface potential.

  Further, after the electrode forming step, prior to the dry surface treatment step, a surface potential measurement step of measuring a surface potential of each electrode of the first substrate and the second substrate is provided, and the dry surface treatment The step is performed on the electrode having a relatively low surface potential among the electrodes of the first substrate and the second substrate.

  According to the present invention, after the electrodes are formed on the first substrate and the second substrate, differences in the shape and surface area of the electrodes occur depending on the manufacturing method and process between the first substrate and the second substrate. Even if the surface potential of the electrode is different, by performing dry surface treatment on the electrode having a relatively low surface potential, the surface potential of the electrode having the relatively low surface potential is changed to the surface potential. Can be matched with the surface potential of the electrode having a relatively high value within a certain range. Therefore, a difference occurs in the surface potential of the electrode between the first substrate and the second substrate, and positive ions interposed in the liquid crystal accumulate at the interface of the electrode having a low surface potential, and negative ions interposed in the liquid crystal. Therefore, it is possible to provide a method for manufacturing a liquid crystal device that can reliably prevent display defects such as flicker and image sticking in the liquid crystal device that are generated due to ion bias due to accumulation at the interface of electrodes having a high surface potential.

  Furthermore, each of the electrodes of the first substrate and the second substrate is a transparent electrode. The liquid crystal panel is a light transmissive liquid crystal panel.

  According to the present invention, when each electrode of the first substrate and the second substrate is a transparent electrode and the liquid crystal panel is a light transmission type liquid crystal panel, the electrodes are provided on the first substrate and the second substrate. Even if the surface potential of the electrode is different due to the difference in the shape or surface area of the electrode due to the difference in the manufacturing method or process between the first substrate and the second substrate after the formation, any of the electrodes By performing the dry surface treatment, the surface potentials of the electrodes can be matched within a certain range between the first substrate and the second substrate. Therefore, a difference occurs in the surface potential of the electrode between the first substrate and the second substrate, and positive ions interposed in the liquid crystal accumulate at the interface of the electrode having a low surface potential, and negative ions interposed in the liquid crystal. Therefore, it is possible to provide a method for manufacturing a liquid crystal device that can reliably prevent display defects such as flicker and image sticking in the liquid crystal device that are generated due to ion bias due to accumulation at the interface of electrodes having a high surface potential.

  Embodiments of the present invention will be described below with reference to the drawings. In the embodiment described below, the liquid crystal panel of the liquid crystal device will be described by taking a light transmission type liquid crystal panel as an example.

  In addition, one of the pair of substrates opposed to each other in the liquid crystal device is an element substrate (hereinafter referred to as a TFT substrate) which is a first substrate, and the other substrate is a first substrate facing the TFT substrate. The counter substrate, which is the second substrate, will be described as an example.

  First, the configuration of the entire liquid crystal panel of the liquid crystal device manufactured by the manufacturing method of the present embodiment will be described. 1 is a plan view of a liquid crystal panel in a liquid crystal device manufactured by the manufacturing method of the present embodiment, FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1, and FIG. It is the elements on larger scale which show the pixel electrode and inorganic alignment film in the liquid crystal panel, and its vicinity.

  As shown in FIGS. 1 and 2, the liquid crystal panel 1 uses, for example, a TFT substrate 10 using a quartz substrate, a glass substrate, or the like, and a glass substrate, a quartz substrate, or the like disposed opposite to the TFT substrate 10. A liquid crystal 50 is interposed between the counter substrate 20 and the counter substrate 20. The TFT substrate 10 and the counter substrate 20 that are arranged to face each other are bonded together by a sealing material 52.

  A display area 10 h of the TFT substrate 10 that constitutes the display area 40 of the liquid crystal panel 1 is formed in an area in contact with the liquid crystal 50 of the TFT substrate 10. Further, in the display area 10h, transparent electrodes, for example, pixel electrodes 9 made of known ITO, which constitute pixels and apply a driving voltage to the liquid crystal 50 together with a counter electrode 21 described later are arranged in a matrix. .

  Further, a transparent electrode for applying a driving voltage to the liquid crystal 50 together with the pixel electrode 9, for example, a counter electrode 21 made of known ITO, is provided in a region in contact with the liquid crystal 50 of the counter substrate 20. A display area 20h of the counter substrate 20 that constitutes the display area 40 of the liquid crystal panel 1 in the liquid crystal device is formed in an area facing the area 10h.

  An alignment film (hereinafter referred to as an inorganic alignment film) 16 made of an inorganic alignment film is provided on the pixel electrode 9 of the TFT substrate 10, and a counter electrode formed over the entire surface of the counter substrate 20. An inorganic alignment film 26 is also provided on the electrode 21.

Specifically, as shown in FIG. 3, an inorganic alignment film 16 having a plurality of columnar structures made of an insulator such as silicon oxide such as SiO ₂ or SiO is formed on the pixel electrode 9. It is formed by the above-described oblique vapor deposition method so as to be inclined at a predetermined angle θ with respect to a plane perpendicular to. As a result, the liquid crystal 50 is vertically aligned by the inorganic alignment film 16.

  As described above, since the inorganic alignment film 16 is formed by the oblique deposition method, the pixel electrode 9 is formed with a portion 9m that is exposed to the liquid crystal 50.

Although not shown, this is the same for the inorganic alignment film 26. On the counter electrode 21, a plurality of columnar structures made of an insulator such as silicon oxide such as SiO ₂ or SiO are formed. The inorganic alignment film 26 having a structure is formed by the above-described oblique deposition method so as to be inclined at a predetermined angle θ with respect to a plane perpendicular to the counter electrode 21. As a result, the liquid crystal 50 is vertically aligned by the inorganic alignment film 26.

  Further, since the inorganic alignment film 26 is formed by the oblique vapor deposition method, a portion (not shown) that is exposed to the liquid crystal 50 is also formed on the counter electrode 21.

  Further, in the display area 10h of the TFT substrate 10, a plurality of scanning lines (not shown) and a plurality of data lines (not shown) are wired so as to cross each other, and a pixel electrode is formed in an area partitioned by the scanning lines and the data lines. 9 are arranged in a matrix. A thin film transistor (TFT) (not shown) is provided corresponding to each intersection of the scanning line and the data line, and the pixel electrode 9 is electrically connected to each TFT.

  The TFT is turned on in response to the ON signal of the scanning line, whereby the image signal supplied to the data line is supplied to the pixel electrode 9. A voltage between the pixel electrode 9 and the counter electrode 21 provided on the counter substrate 20 is applied to the liquid crystal 50.

  A light shielding film 53 is provided on the counter substrate 20 as a frame that defines the display area 40 of the liquid crystal panel 1 in the liquid crystal device.

  When the liquid crystal 50 is injected between the TFT substrate 10 and the counter substrate 20 by a known liquid crystal injection method, the sealing material 52 is missing and applied at a part of one side of the sealing material 52.

  The missing part of the sealing material 52 is a liquid crystal that is a notch for injecting the liquid crystal 50 into the region surrounded by the sealing material 52 between the TFT substrate 10 and the counter substrate 20 bonded from the missing part. An inlet 108 is formed. The liquid crystal injection port 108 is sealed with a sealant 109 after liquid crystal injection.

  In order to connect the data line driving circuit 101 which is a driver for supplying an image signal to a data line (not shown) of the TFT substrate 10 at a predetermined timing and driving the data line in an area outside the sealing material 52 and an external circuit. The external connection terminal 102 is provided along one side where the liquid crystal injection port 108 of the TFT substrate 10 is located. The external connection terminal 102 may be provided on the counter substrate 20.

  A liquid crystal device having the liquid crystal panel 1 is electrically connected to an external connection terminal 102 to an electronic device such as a projector, and has a specific length (not shown), which is a flexible printed circuit (hereinafter referred to as FPC). ) Is connected at one end. By connecting the other end of the FPC to an electronic device such as a projector, the liquid crystal panel 1 and the electronic device are electrically connected.

  By supplying scanning signals to scanning lines and gate electrodes (not shown) of the TFT substrate 10 along two sides adjacent to one side of the TFT substrate 10 provided with the external connection terminals 102, the gate electrode The scanning line driving circuits 103 and 104 which are drivers for driving are provided. The scanning line driving circuits 103 and 104 are formed on the TFT substrate 10 at a position facing the light shielding film 53 inside the sealing material 52.

  Further, on the TFT substrate 10, wiring lines 105 that connect the data line driving circuit 101, the scanning line driving circuits 103 and 104, the external connection terminal 102, and the vertical conduction terminal 107 are provided to face the three sides of the light shielding film 53. ing.

  The vertical conduction terminals 107 are formed on the four TFT substrates 10 at the corners of the sealing material 52. Between the TFT substrate 10 and the counter substrate 20, a vertical conductive material 106 having a lower end in contact with the vertical conductive terminal 107 and an upper end in contact with the counter electrode 21 is provided. And the counter substrate 20 are electrically connected.

  Next, a method of manufacturing the liquid crystal device configured as described above, specifically, a method of forming the pixel electrode 9, the counter electrode 21, and the inorganic alignment films 16 and 26 in the liquid crystal panel 1 will be described with reference to FIG. . FIG. 4 is a flowchart showing a method for manufacturing the liquid crystal device of the present embodiment.

  In addition, since the manufacturing method of liquid crystal devices other than the formation method of the pixel electrode 9, the counter electrode 21, and the inorganic alignment films 16 and 26 is well-known, the description is abbreviate | omitted.

  As shown in FIG. 4, first, in step S1, the above-described pixel is applied to the TFT substrate 10 and the counter substrate 20 on which a plurality of thin films are formed by laminating a known semiconductor thin film, insulating thin film or conductive thin film. An electrode forming step for forming the electrode 9 and the counter electrode 21 is performed.

  After the electrode forming step, as described above, the shape and surface area of the pixel electrode 9 and the counter electrode 21 change due to the manufacturing method and process. Therefore, the surface potential between the pixel electrode 9 and the counter electrode 21 varies. May be different.

  Therefore, in step S2, a surface potential measurement step for measuring the surface potentials of the pixel electrode 9 and the counter electrode 21 is performed by a known method.

  Next, in step S <b> 3, it is determined whether or not there is a difference between the surface potential of the pixel electrode 9 and the surface potential of the counter electrode 21.

  On the other hand, when there is a difference between the surface potential of the pixel electrode 9 and the surface potential of the counter electrode 21 as in the present embodiment, the process proceeds to step S4. On the other hand, if there is no difference between the surface potential of the pixel electrode 9 and the surface potential of the counter electrode 21, the process jumps to step S5.

  In step S4, if there is a difference between the surface potential of the pixel electrode 9 and the surface potential of the counter electrode 21, the portion 9m of the pixel electrode 9 exposed to the liquid crystal 50 and the liquid crystal 50 are exposed as described above. On the other hand, the amount of adsorbed impurity ions tends to be extremely biased between the exposed portion of the counter electrode 21 and display defects such as image sticking and flicker in the liquid crystal panel 1 are likely to occur. Therefore, a plasma treatment process, which is a dry surface treatment process for making the surface potential of the pixel electrode 9 and the surface potential of the counter electrode 21 substantially coincide, is performed.

  Specifically, a known plasma treatment, which is a dry surface treatment, is performed on the electrode having a relatively low surface potential, and the surface potential of the electrode having a relatively low surface potential is changed to a surface potential of The surface potential of the relatively higher electrode is approximately matched.

  More specifically, on the other hand, as shown in FIG. 6 described above, the surface potential of the counter electrode 21 of the counter substrate is relatively lower than that of the pixel electrode 9 of the TFT substrate. When the counter electrode 21 is relatively negatively charged from the pixel electrode 9 and negative ions are adsorbed to the pixel electrode 9 and positive ions are easily adsorbed to the counter electrode 21, On the other hand, plasma processing is performed so that the surface potential substantially matches the surface potential of the pixel electrode 9.

  As a result, after the plasma treatment, a positive potential radical covers the counter electrode 21, thereby increasing the surface potential of the counter electrode 21, so that the counter electrode 21 can be set to substantially the same potential with respect to the pixel electrode 9. .

  On the other hand, as shown in FIG. 8 described above, the surface potential of the pixel electrode 9 of the TFT substrate is relatively lower than that of the counter electrode 21 of the counter substrate. When the negative electrode is relatively negatively charged from the electrode 21 and the positive ions are adsorbed to the pixel electrode 9 and the negative ions are easily adsorbed to the counter electrode 21, the surface potential is opposed to the pixel electrode 9. Plasma treatment is performed so as to substantially match the surface potential of the electrode 21.

  As a result, the surface potential of the pixel electrode 9 is increased by covering the pixel electrode 9 with positive potential radicals after the plasma treatment, and the pixel electrode 9 can be set to substantially the same potential with respect to the counter electrode 21. .

  The plasma treatment is a thin film formed under the electrodes 9 and 21 at low cost, such as plasma treatment using oxygen, plasma treatment using a halogen gas such as argon or helium, and plasma treatment using nitrogen. It is performed by plasma treatment with little influence on

  Returning to FIG. 4, finally, in step S <b> 5, an inorganic alignment film forming step for forming the inorganic alignment films 16 and 26 on the pixel electrode 9 and the counter electrode 21 by the oblique deposition method as described above is performed. Do.

  As described above, in the present embodiment, after the pixel electrode 9 and the counter electrode 21 are formed, the surface potential of each of the electrodes 9 and 21 is measured. It was shown that the plasma treatment was performed on the substrate including

  According to this, after forming each electrode 9 and 21, the difference in the shape and the surface area of the electrode occurred due to the difference in the manufacturing method and process, and the surface potential was different between the electrode 9 and the electrode 21. However, by performing plasma treatment, which is a dry surface treatment, on the electrode having the relatively low surface potential, the surface potential of the electrode having the relatively low surface potential is changed to the electrode having the relatively high surface potential. The surface potential of the electrode can be matched within a certain range.

  Therefore, a difference occurs in the surface potential of the electrode between the TFT substrate 10 and the counter substrate 20, and positive ions interposed in the liquid crystal 50 accumulate at the interface of the electrode having a low surface potential, and negative ions interposed in the liquid crystal It is possible to provide a method for manufacturing a liquid crystal device that can surely prevent display defects such as flicker and image sticking in the liquid crystal device caused by the deviation of ions due to accumulation at the interface of electrodes having a high surface potential.

  Hereinafter, another modification will be described with reference to FIG. FIG. 5 is a flowchart showing a modification of the method for manufacturing the liquid crystal device of the present embodiment.

  In the present embodiment described above, the surface potentials of the pixel electrode 9 and the counter electrode 21 are measured after the pixel electrode 9 and the counter electrode 21 are formed.

  Without being limited thereto, first, after forming the electrodes 9 and 21 and then forming the inorganic alignment films 16 and 26 as they are, the liquid crystal panel 1 is manufactured, and then the liquid crystal panel 1 is driven to generate pixel electrodes. The step of confirming the deviation of the direction and the magnitude of the potential between the electrode 9 and the counter electrode 21 is performed, and either of the pixel electrode 9 and the counter electrode 21 in the liquid crystal panel 1 manufactured by the same process is determined from the information of the deviation. In addition, the above-described plasma treatment may be performed so that the surface potentials of the pixel electrode 9 and the counter electrode 21 are substantially matched.

  Specifically, as shown in FIG. 5, first, in step S11, as described above, after the liquid crystal panel 1 is manufactured without any dry surface treatment applied to the electrodes 9, 21, the liquid crystal panel 1 is manufactured. The panel 1 is driven to perform a potential deviation confirmation process for confirming a deviation in the direction and magnitude of the potential between the pixel electrode 9 and the counter electrode 21.

  Next, in step S1, the pixel electrode 9 and the counter electrode 21 are formed on the liquid crystal panel 1 to be manufactured next, as in step S1 of FIG. 4 described above. At this time, the pixel electrode 9 and the counter electrode 21 are formed by the same process as the pixel electrode 9 and the counter electrode 21 of the liquid crystal panel manufactured in step S11.

  Next, in step S12, the above-described plasma treatment is performed on the pixel electrode 9 or the counter electrode 21 from the shift in the direction or magnitude of the potential of the counter electrode 21 with respect to the pixel electrode 9 by the potential shift confirmation process performed in step S11.

  Specifically, when the potential of the counter electrode 21 with respect to the pixel electrode 9 is shifted to the negative side, plasma processing is performed on the counter electrode 21 under conditions that consider the magnitude of potential deviation. . On the other hand, if it is shifted to the plus side, plasma treatment is performed on the pixel electrode 9 under conditions that take into account the magnitude of potential deviation.

  Finally, in step S5, as in step S5 of FIG. 4, as described above, the inorganic alignment films 16 and 26 are formed on the pixel electrode 9 and the counter electrode 21, respectively, by the oblique vapor deposition method. A formation process is performed.

  Also by such a manufacturing method, the same effect as the above-described embodiment can be obtained. This technique is more effective when the surface potentials of the pixel electrode 9 and the counter electrode 21 cannot be measured.

  Hereinafter, another modification will be described.

  In the above-described embodiment, the liquid crystal panel of the liquid crystal device has been described by taking a light transmissive liquid crystal panel as an example. However, the present invention is not limited to this, and the manufacturing method of the present embodiment is not limited to a reflective liquid crystal panel. Even if applied to the above, the same effect as the present embodiment can be obtained.

  In the above-described embodiment, the inorganic alignment films 16 and 21 are used for the alignment of the liquid crystal 50 in the vertical alignment mode. However, the alignment is not limited to this, and the horizontal alignment may be performed depending on the angle θ of oblique deposition. You may use for the orientation of the mode liquid crystal.

  Further, the liquid crystal device is not limited to the above-described illustrated examples, and it is needless to say that various changes can be made without departing from the gist of the present invention. For example, the above-described liquid crystal device has been described by taking an active matrix type liquid crystal display module using an active element (active element) such as a TFT (thin film transistor) as an example. However, the present invention is not limited to this, and a TFD (thin film diode) or the like. An active matrix type liquid crystal display module using active elements (active elements) may be used.

The top view of the liquid crystal panel in the liquid crystal device manufactured by the manufacturing method of this Embodiment. Sectional drawing cut | disconnected along the II-II line | wire in FIG. FIG. 2 is a partial enlarged cross-sectional view illustrating a pixel electrode and an inorganic alignment film in the liquid crystal panel of FIG. 1 and the vicinity thereof. 5 is a flowchart showing a method for manufacturing the liquid crystal device of the present embodiment. 9 is a flowchart showing a modification of the method for manufacturing the liquid crystal device of the present embodiment. The figure which shows schematically the state in which the surface potential of the counter electrode on the counter substrate side became lower than the surface potential of the pixel electrode on the TFT substrate side. The figure which shows the state which the pixel electrode shifted to the minus side with respect to the counter electrode. The figure which shows schematically the state in which the surface potential of the pixel electrode on the TFT substrate side was lower than the surface potential of the counter electrode on the counter substrate side. The figure which shows the state which the pixel electrode shifted to the plus side with respect to the counter electrode.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Liquid crystal panel, 9 ... Pixel electrode, 10 ... TFT substrate, 16 ... Inorganic alignment film, 20 ... Counter substrate, 21 ... Counter electrode, 26 ... Inorganic alignment film, 50 ... Liquid crystal.

Claims (5)

A method of manufacturing a liquid crystal device comprising a liquid crystal panel in which liquid crystal is interposed between a first substrate and a second substrate facing the first substrate,
Forming an electrode for applying a driving voltage to the liquid crystal on each of the first substrate and the second substrate;
A dry surface treatment step of performing a dry surface treatment on one of the electrodes of the first substrate and the second substrate;
An inorganic alignment film forming step of forming an inorganic alignment film on each of the electrodes of the first substrate and the second substrate;
A method for manufacturing a liquid crystal device, comprising:   2. The liquid crystal device according to claim 1, wherein the dry surface treatment step is a plasma treatment step of performing a plasma treatment on the electrode of either the first substrate or the second substrate. Production method. After the electrode formation step, prior to the dry surface treatment step, comprising a surface potential measurement step of measuring the surface potential of each of the electrodes of the first substrate and the second substrate,
The said dry-type surface treatment process is performed with respect to the said electrode with a relatively low said surface potential among each said electrode of a said 1st board | substrate and a said 2nd board | substrate. 3. A method for producing a liquid crystal device according to 2.   The method for manufacturing a liquid crystal device according to claim 1, wherein each of the electrodes of the first substrate and the second substrate is a transparent electrode.   The method for manufacturing a liquid crystal device according to claim 1, wherein the liquid crystal panel is a light transmissive liquid crystal panel.

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