JP2008179090A - INJECTION DEVICE, SOLUTION INJECTION METHOD, AND ELECTRONIC DEVICE USING THE SAME - Google Patents

Abstract

An injection device and a solution injection method are provided that suppress an injection failure at the time of solution injection accompanying a change in solution properties when solution injection is stopped.
An injection device for injecting an injection solution, wherein a water-soluble injection is performed by an injection device in which a cooling portion of a thermoelectric conversion element is arranged in an injection nozzle portion, and an injection device having a thermoelectric conversion element in the vicinity of the injection nozzle portion. A solution injection method for injecting a liquid, wherein the injection liquid in the vicinity of the injection nozzle portion is kept lower than the outside air temperature in the vicinity of the injection nozzle portion and higher than the dew point by a thermoelectric conversion element when the injection is stopped.
[Selection] Figure 1

Description

  The present invention relates to an injection device, a solution injection method, and an electronic apparatus using the same.

  2. Description of the Related Art An ejecting apparatus for forming images and characters on recording paper or the like by ejecting liquid droplets such as an aqueous solution having a small particle diameter as used in an ink jet printer is widely used. For example, in addition to an ink jet printer, solution droplets containing conductive solutes are attached to a substrate to form a desired conductive film pattern, an ink jet device for forming a desired conductive film pattern, a biochemical solution injection device containing a biochemical substance, etc. It has been known. A head, which is a solution ejecting section of the ejecting apparatus, is provided with a solution filling section filled with a solution and an infusion path for guiding the solution from the solution filling section. This solution is ejected from the nozzle at the tip of the head by the solution or the expansion of the solution filling portion by the piezoelectric element or the heat generating element by the compression or expansion. The solution at the nozzle tip is always exposed to the atmosphere of the outside air from which the solution is ejected when the solution ejection operation is not performed. The solution existing in the infusion path near the nozzle hardly dries if the spraying operation is continuously performed within a certain time, but the drying proceeds as the non-ejection time becomes longer. As the drying of the solution proceeds, solutes in the solution adhere to the infusion path, which narrows the infusion path, especially the nozzle section, changes the volume of the desired solution to be ejected, and ejects droplets. There was a problem that the direction to be changed was changed.

  The injection failure of such an injection device will be described with reference to FIGS. FIG. 59 is an explanatory diagram of a head portion of a conventional injection device. The head 1 of this ejecting apparatus is filled with ink 9 in an infusion path 8 surrounded by a head front plate 6, a head rear plate 7, and a head side plate. The head front plate 6 includes a small nozzle 2. The ink 9 is ejected from the nozzle 2 as droplets by a pressing force of a piezoelectric element (not shown) in the infusion path 8. FIG. 60 is a cross-sectional view showing a state where ink is ejected from the head 1. In this case, the ink 9 is ejected from the nozzle 2 by applying a pressing force from the infusion path 8 on the right side of the drawing.

  While there is no problem while the ink 9 is continuously ejected, the liquid level 11 at the tip of the nozzle is exposed to the outside air while the ejection of the ink 9 is stopped. If this state continues for a long time, volatile substances, mainly solvents, may evaporate from the solution near the liquid surface 11 into the outside air. When the solvent in the ink 9 evaporates, as shown in FIG. 61, the liquid surface 11 is retracted into the back of the nozzle 2, the ink 9 near the liquid surface 11 becomes highly viscous due to lack of solvent, or the wall surface of the nozzle 2 May adhere to or solidify. This phenomenon is remarkable when the ink temperature is relatively high, particularly when the solvent is water and is higher than the dew point of the outside air. FIG. 61 schematically shows the state of evaporation of ink when the ink temperature is 30 ° C. and the outside air temperature is 25 ° C.

  If the ink flow from the nozzle to the outside air is less than the speed at which the ink moisture evaporates, the concentration of the ink near the nozzle increases and the viscosity increases. In such a state, in a printer, since the viscosity is high, ejection cannot be performed normally, density unevenness occurs, and print image quality deteriorates. Furthermore, there is a risk of nozzle clogging. In addition, since it is difficult for the ink to be smoothly ejected, droplets are scattered around the nozzle, and are fixed around the nozzle, causing secondary clogging of the nozzle. For this reason, it is necessary to clean the droplets scattered near the nozzle. Furthermore, in the image formation of the printer, the ink droplet shape is not constant, so that the image quality is deteriorated. In such a case, it is necessary to adjust the flushing pressure to eliminate nozzle clogging or to perform flushing (coloring). Some printers are equipped with a cap for preventing drying as a moisturizing mechanism for that purpose, but the mechanism parts are many and complicated. The same applies to the evaporation of the volatile solvent even in an ink containing a water-insoluble solvent.

  On the other hand, when the ink temperature is extremely low and lower than the dew point of the outside air, the water aggregates in the ink near the liquid surface of the nozzle, and the ink 9 is diluted with the water. Then, the viscosity of the ink may decrease too much or the ink may overflow from the nozzles. FIG. 62 schematically shows the situation. In FIG. 62, it is assumed that the dew point of the outside air is 25 ° C. and the ink temperature is 15 ° C. Further, FIG. 63 shows a state in which the ink temperature is equal to the dew point of the outside air, but the nozzle 2, that is, the front plate 6 is cooled to be below the dew point of the outside air. Water in the air in the vicinity of the nozzle is cooled, and moisture condenses on the front plate 6. As a result, the moisture near the ink liquid surface of the nozzle disappears, the humidity near this decreases, and the dew point also decreases. When the dew point is lowered, water may evaporate from the liquid surface, and ink concentration may occur. FIG. 64 shows the temperature of each part. Tn is the temperature of the ink in the vicinity of the ejection nozzle portion, and Ti is the temperature of the ink in the vicinity of the ejection nozzle portion, which is almost constant at any portion. Th is the temperature of the head front plate in the vicinity of the injection nozzle part, Ta is the ambient temperature of the outside air in the vicinity of the injection nozzle part, and Td is the dew point of the outside air in the vicinity of the injection nozzle part.

  For such a problem, for example, Patent Document 1 proposes a flushing technique for performing preliminary ejection in order to suppress drying of ink in the nozzles. In this Patent Document 1, when a non-ejection time to a substrate to which a solution droplet is applied is detected to some extent, the inkjet head is moved directly above a solution storage portion provided outside the substrate arrangement range, and this solution storage A liquid droplet is discharged toward the part and flushed.

  Japanese Patent Application Laid-Open No. 2003-228867 has conventionally known a technique for preventing drying by constantly cooling the nozzles of an ink jet printer. However, in this method, it is necessary to always cool, and it is necessary to add a cooling device. Therefore, it is not suitable for an ink jet printer because it has disadvantages such as an increase in the size of the apparatus and an increase in operating cost. And when the ink jet printer is not used, an apparatus for capping a nozzle and sucking a part of the solution at the tip of the nozzle is disclosed.

Patent Document 3 proposes a droplet discharge device that cools the entire head, which is an infusion path for droplet discharge, with a Peltier element to prevent the solution from drying. In the present invention, the solution filling section is indirectly cooled from the side surface of the droplet discharge head by the Peltier element. As a result, the entire ink in the infusion path is cooled, and the evaporation of the solvent from the liquid surface of the nozzle is suppressed. Furthermore, since this droplet discharge device cools the droplet discharge head during both the discharge and non-discharge operations of the solution droplet, the evaporation of the solvent in the solution guided into the nozzle is performed. It is also said that the increase of the viscosity due to the water is suppressed, and it is useful at the time of forming the solution droplets.
Patent Document 4 proposes an ink jet printer head that cools the entire head with a Peltier element in order to cool the heated ink in the head in an ink jet printer that uses pressure increase due to heating and foaming of the ink solution in the head. Yes.
JP 2002-264366 A Japanese Patent Laid-Open No. 62-25054 JP 2004-223914 A Japanese Patent Publication No.56-9429

  As described above, various countermeasures against the drying of the solvent when the injection of the injection device is stopped have been taken and proposed. However, each is not enough. In the method of Patent Document 1, if the fixing is severe, flushing may not be possible, and the waste of ink for flushing is large. In the combination of capping and suction described in Patent Document 2, the apparatus becomes complicated and easily causes a failure. Also, the capping itself may stick. The method of cooling the nozzle is not described in detail, but there is a risk of condensation on the nozzle and the liquid level may not be sufficiently cooled. Further, as described in Patent Document 2, there is a special cooling method. Unless it is devised, a large-scale device is necessary for cooling. In the method of Patent Document 3, the entire ink in the head is cooled, so that the viscosity of the ink increases too much and the ejection energy at the time of ejection increases. Further, at rest, energy for cooling the entire head is always required. The ejection device described in Patent Document 4 is not necessarily effective in preventing solvent evaporation from the ink nozzle. Thus, no complete solution has been found for troubles such as ink drying when the ejection device is stopped.

  In view of the above-described problems, an object of the present invention is to provide an injection device and a solution injection method that suppress an injection failure at the time of solution injection accompanying a change in solution properties at the time of stopping injection of the solution. In addition, an ink jet printer equipped with this ejecting apparatus, a lead pattern forming apparatus, an organic semiconductor forming apparatus, an EL (electroluminescent) material manufacturing apparatus, a liquid crystal and plasma display manufacturing apparatus, a resist manufacturing apparatus, a biochemical solution processing apparatus, and An object is to provide a light-transmitting material manufacturing apparatus.

  As a result of intensive studies to solve the above problems, the present inventors have found that the above problems can be solved by the following means, and have completed the present invention.

  The present invention includes an injection device for injecting an injection solution, wherein a cooling unit for a thermoelectric conversion element is disposed in an injection nozzle portion.

  The present invention includes the above-described injection device, wherein the thermoelectric conversion element is disposed in the injection solution.

  The present invention includes the above-described injection device, wherein the heat dissipation portion of the thermoelectric conversion element is arranged either on the wall surface of the solution injection hole farther from the injection nozzle portion than the cooling portion or in the injection solution.

  The present invention includes the above-described injection device, wherein the thermoelectric conversion element is disposed outside the injection solution.

  The present invention includes the above-described injection device, wherein the heat dissipation portion of the thermoelectric conversion element is disposed in the outside air.

  The present invention includes the above-described injection device, wherein at least part of the wall surface of the solution injection hole forming the injection nozzle portion is formed by a cooling portion of a thermoelectric conversion element.

  The present invention includes the above-described injection device in which a sensor for measuring the outside air temperature around the injection nozzle portion is arranged.

  The present invention includes the above-described injection device including a sensor for measuring the outside air temperature humidity or dew point around the injection nozzle portion.

  The present invention includes the above-described injection device including a sensor for measuring the temperature of the injection nozzle portion.

  The present invention includes an injection device including a plurality of injection nozzle portions, wherein the thermoelectric conversion element including a common power supply wiring is arranged in the plurality of injection nozzle portions.

  This invention is an injection apparatus provided with the some injection nozzle part, Comprising: One thermoelectric conversion element has been arrange | positioned to the several injection nozzle part, The said injection apparatus characterized by the above-mentioned is included.

  The present invention relates to a solution injection method in which a water-soluble injection liquid is injected by an injection device provided with a thermoelectric conversion element in the vicinity of an injection nozzle portion, and the injection liquid in the vicinity of the injection nozzle portion is transferred to a thermoelectric conversion element during an injection pause. The solution injection method is characterized in that the temperature is kept lower than the outside air temperature near the injection nozzle portion and higher than the dew point.

  The present invention relates to a solution injection method in which a water-soluble injection liquid is injected by an injection device provided with a thermoelectric conversion element in the vicinity of an injection nozzle portion, and the injection liquid in the vicinity of the injection nozzle portion is transferred to a thermoelectric conversion element during an injection pause. And a solution injection method characterized in that the temperature is lower than the outside air temperature in the vicinity of the injection nozzle section and is maintained at a temperature equal to or higher than the temperature of the injection liquid at which the maximum jettable viscosity is possible.

The present invention relates to a solution injection method for injecting a water-soluble injection liquid by an injection device provided with a thermoelectric conversion element in the vicinity of an injection nozzle part, wherein the outside air temperature in the vicinity of the injection nozzle part is Ta and the outside air in the vicinity of the injection nozzle part is The dew point is Td, the temperature of the portion exposed to the outside air of the injection nozzle portion is Th, the temperature of the portion of the injection nozzle portion exposed to the outside air is Tn, and the design injection minimum viscosity in the solution injection apparatus is the minimum. When the temperature of the propellant is Tm,
When the injection is stopped, Th and Tn are
Formula [Ta ≧ Th>Tn> Tm] and Formula [Th> Td]
And a solution jetting method characterized by being in a temperature range satisfying the above.

  The present invention relates to a solution injection method for injecting a water-soluble injection liquid by an injection device provided with a thermoelectric conversion element in the vicinity of an injection nozzle portion. A solution injection method characterized in that the dew point temperature of the outside air in the vicinity of the section is maintained at -3 ° C to 3 ° C.

The present invention relates to a sensor for measuring the outside air temperature and humidity in the vicinity of the injection nozzle part, a sensor for measuring the temperature of the part exposed to the outside air of the injection nozzle part, and a part of the injection nozzle part exposed to the outside air. A solution injection method for injecting a water-soluble injection liquid by an injection device provided with a thermoelectric conversion element in the vicinity of an injection nozzle part,
At the time of jetting suspension, from the outside air temperature and humidity in the vicinity of the jet nozzle part and the temperature of the part exposed to the outside air of the jet nozzle part, the moisture in the jet liquid of the jet nozzle part is released to the outside air, Alternatively, the absorption amount is calculated, the change in the volume of the injection liquid in the injection nozzle unit is calculated from the release or absorption of the water, and the liquid of the injection liquid in the injection nozzle unit corresponding to the change in the volume of the injection liquid Estimate the surface level,
When the liquid level reaches the lower limit of the injection device, the temperature of the portion of the injection nozzle exposed to the outside air of the injection liquid and / or the temperature of the portion of the injection nozzle exposed to the outside air of the injection liquid is determined from the dew point. Supply power to the thermoelectric conversion element to lower it,
When the liquid level reaches the upper limit of the injection device, the power supply to the thermoelectric conversion element is stopped.

  The present invention relates to a solution injection method for injecting a water-soluble injection liquid by an injection device provided with a thermoelectric conversion element in the vicinity of an injection nozzle part, and after the injection is stopped, at the time of restarting the injection, the injection nozzle part by the thermoelectric conversion element A solution jetting method is characterized in that the solution jetting operation is performed after the neighborhood is repeatedly heated and cooled a plurality of times.

  In the present invention, after resuming the ejection, when resuming the ejection, the vicinity of the ejection nozzle is cooled by the thermoelectric conversion element so that the temperature of the ink in the ejection nozzle is lower than the dew point of the outside air near the ejection nozzle. The liquid level in the nozzles of the ink in the nozzle part is raised to the upper limit, and then the solution jetting operation is performed after repeating the heating and cooling operations in the vicinity of the jet nozzle part a plurality of times. Including a solution injection method.

  The present invention includes an ink jet printer including the ejecting device that ejects ink for image formation.

The present invention includes a conductor pattern forming apparatus including the above-described spraying device that sprays a conductive solution.
The present invention includes an organic semiconductor forming apparatus comprising the above-described spraying device for spraying an organic semiconductor solution.

The present invention includes an EL layer forming apparatus including the above-described injection device for injecting an EL (electroluminescent) material solution.
The present invention includes an apparatus for manufacturing a display device, characterized by including the above-described injection device for injecting a material solution of a liquid crystal and plasma display device.

  The present invention includes a resist layer forming apparatus comprising the spraying device for spraying a resist solution.

  The present invention includes a biochemical solution processing apparatus including the above-described injection device that injects a biochemical solution containing a biochemical substance.

  The present invention includes a light-transmitting material manufacturing apparatus including the above-described injection device for forming a microlens array.

  According to the present invention, it is an object to provide an injection device and a solution injection method that suppress an injection failure at the time of solution injection accompanying a change in solution properties at the time of stopping injection of the solution. Also, an ink jet printer equipped with this jetting device, a lead pattern forming device, an organic semiconductor forming device, an EL (electroluminescent) material manufacturing device, a liquid crystal and plasma display device manufacturing device, a resist manufacturing device, a biochemical solution An object of the present invention is to provide a processing apparatus and a light transmitting material manufacturing apparatus.

  The present invention will be described with reference to some embodiments, but the present invention is not limited to these embodiments, and various changes and modifications can be made based on the object of the present invention. Hereinafter, the spray device of the present invention, the solution spray method, and various devices including the spray device of the present invention will be described in order.

[Embodiment of injection device]
(Embodiment 1)
The injection apparatus of Embodiment 1 is shown in FIGS. 1-4 as an injection apparatus example (1). FIG. 1 is an explanatory diagram of an example of the ejection device (1), mainly showing a head portion, and an ink tank, a pressing device, and the like are omitted from the drawing. The ink tank, the pressing device, etc. may be the same as the conventional structure. It should be noted that the head container formed of the head front plate 6 and the head rear plate 7 is practically made of metal, but is assumed to be made of a transparent material so that the internal structure can be observed. In FIG. 1, ink 9 that is a jetting solution is sealed in an infusion path 8 in a head container formed by a head front plate 6, a head rear plate 7, and the like, and small holes formed in the head front plate 6. A Peltier element 3 that is a thermoelectric conversion element is disposed in an injection nozzle portion 2 (in the drawing, simply referred to as nozzle 2; the same applies hereinafter) that is a peripheral portion of the injection nozzle. In this embodiment, the Peltier element 3 is a micro thermoelectric conversion element that combines a P-type semiconductor and an N-type semiconductor, and is supplied with electric power by an electric wiring 10. FIG. 2 is a plan view of the head of the ejecting apparatus example (1), and FIG. 3 is a cross-sectional view of the central portion of FIG. 2 cut in the left-right direction. As can be seen from FIG. 3, the Peltier element 3 is arranged such that the endothermic bonding electrode plate 4 serving as a cooling portion is in close contact with the head front plate side and the heat dissipation bonding electrode plate 5 is exposed to the atmosphere side. In this injection device example (1), if the current direction of the electric power supplied by the electric wiring 10 is reversed, the heat-absorbing bonded electrode plate 4 serves as a heat-dissipating bonded electrode plate, and the heat-dissipating bonded electrode plate 5 absorbs the heat. It can also be used as a bonded electrode plate.

  The endothermic bonding electrode plate 4 in this ejection device example (1) is in close contact with the ejection nozzle portion 2 of the head front plate 6, and the ink 9 in the ejection nozzle hole and in the vicinity of the ejection nozzle portion 2 is ejected from the ejection nozzle portion 2. Can be cooled. FIG. 4 shows an example of the temperature distribution in the vicinity of the injection nozzle when the injection device stops the injection operation and the Peltier element is operating. When the outside air temperature and the ink temperature in the head were 25 ° C., the temperature distribution when the ejection nozzle portion 2 was cooled by the Peltier element 3 was displayed. The numbers 20-30 in the figure represent the Celsius temperature of that part. In the vicinity of the endothermic bonding electrode plate 4 of the Peltier element 3, the temperature is the lowest at 20 ° C., and the ink in the jet nozzle hole in the immediate vicinity is 23 ° C. Note that the ink 9 in the portion of the Peltier element 3 in the infusion path 8 away from the endothermic bonding electrode plate 4 by a certain distance remains at 25 ° C. Thus, by evaporating the temperature of the ink 9 in the ejection nozzle hole, the evaporation of the solvent from the ink can be prevented. The degree of cooling may be appropriately adjusted according to the transpiration characteristics of the solvent in the ink and the temperature of the ink 9 in the ejection nozzle hole. Since the cooling by the Peltier element 3 is very local, most of the ink in the infusion path of the head is not cooled. For this reason, most of the ink in the infusion route does not cause an increase in viscosity, and there is no possibility of causing trouble such as ejection failure or ink clogging when restarting the ejection operation. Note that the air in the vicinity of the heat radiation joining electrode plate 5 of the Peltier element 3 is heated to near 30 ° C. This influence does not reach the air around the ejection nozzle hole, and the air in contact with the liquid surface 11 of the ink 9 in the ejection nozzle hole is 25 ° C. For this reason, the temperature of the liquid surface 11 of the ink 9 is not particularly heated by the air in contact with the liquid surface 11.

  The Peltier device is not a large-capacity heat absorption device, but recently it has become very small due to advances in semiconductor manufacturing technology and can be formed on the head front plate to a size of about 10 to 20 μm by microfabrication. This is a kind of micro thermoelectric conversion element suitable as a method for locally cooling the ink in the ejection nozzle holes of the ejection nozzle diameter. In the present invention, any thermoelectric conversion element can be used.

(Embodiment 2)
A second embodiment of the present invention will be described with reference to FIGS. FIG. 5 is an explanatory view of the injection device example (2) of the second embodiment, as in FIG. 1, and FIGS. 6, 7 and 8 are a plan view, a cross-sectional view, and an explanatory view of the temperature distribution. It is. The difference between the injection device example (2) and the injection device example (1) is the arrangement of the heat absorption bonding electrode plate 4 and the heat dissipation bonding electrode plate 5 of the Peltier element 3. In the injection device example (2), the endothermic bonding electrode plate 4 is configured to cool the outside air portion immediately above the injection nozzle hole. The corresponding heat-dissipating bonded electrode plate 5 is disposed on the side of the head front plate 6 away from the spray nozzle hole. That is, this is a structure in which the thermal energy moves radially outward in parallel to the head front plate 6 in the Peltier element. Referring to the plan view of FIG. 6, the injection nozzle hole, the endothermic bonding electrode plate 4, and the heat dissipation bonding electrode plate 5 are arranged so as to draw concentric circles from the inside in this order. If it demonstrates with sectional drawing of FIG. 7, the Peltier element 3 will be arrange | positioned so that a heat may be moved to the direction away from the injection nozzle hole of the injection nozzle part in the vicinity of the injection nozzle hole. In this case, as shown in the temperature distribution diagram of FIG. 8, the ink 9 in and near the ejection nozzle hole is cooled to, for example, 23 ° C. due to the cooling effect of the endothermic bonding electrode plate 4. The air in contact with the liquid surface 11 of the ink 9 in the vicinity of the ejection nozzle hole is also cooled to about 23 ° C., and the evaporation of the solvent in the ink 9 can be suppressed more than in the first embodiment. The other operational effects as described in the first embodiment can also be exhibited in the injection device example (2).

  On the other hand, at the same time as the ink in the ejection nozzle hole is cooled, the heat radiation by the Peltier element 3 is directly joined and disposed at a location away from the ejection nozzle hole, so that the heat is transmitted to the head front plate 6 from the ejection nozzle hole. The ink in the infusion path of the remote head can be heated. For this reason, the viscosity of the ink in the infusion path is promoted to improve the fluidity, the printing start time can be advanced when the ejection operation is restarted, and the infusion capacity can be increased, so that a large amount of ink is supplied. It is effective for high-speed printing, and heating may be continued during printing depending on the degree of ink supply.

(Embodiment 3)
In the third embodiment, the arrangement of the Peltier elements 3 in the injection device example (1) described in the first embodiment is changed from the outside of the infusion path 8 of the head front plate 6 to the inside of the infusion path 8. Then, the endothermic bonding electrode plate 4 of the Peltier element 3 is brought into close contact with the head front plate 6 so that the heat radiation bonding electrode plate 5 is in the infusion path 8. In FIGS. 9-12, the explanatory drawing of the example of an injection device (3) similarly to Embodiment 1, the top view, sectional drawing, and explanatory drawing of temperature distribution were shown. This ejection device example (3) can also cool the ink 9 in the ejection nozzles efficiently through the ejection nozzle portion 2 of the head front plate 6. The state of cooling in the vicinity of the injection nozzle unit 2 is shown in FIG. In this ejecting apparatus example (3), since the heat radiation joining electrode plate 5 is in the ink 9, all the heat that has cooled the vicinity of the ejection nozzle portion 2 is dissipated in the ink 9, and the entire ink 9 in the infusion path 8. The temperature does not decrease. For this reason, when the ink ejection of the ejection device is resumed, troubles due to an increase in the viscosity of the ink 9 are not particularly likely to occur. Also about the example (3) of an injection apparatus, the other effect as demonstrated in Embodiment 1 and 2 can also be exhibited.

(Embodiment 4)
In the fourth embodiment, the arrangement of the Peltier elements 3 in the injection device example (2) described in the second embodiment is changed from the outside of the infusion path 8 of the head front plate 6 to the inside of the infusion path 8. A cross-sectional view of the injection device example (4) of Embodiment 4 is shown in FIG. 13 and its temperature distribution is shown in FIG. As shown in FIG. 14, the ink 9 in the infusion path 8 is lowered in the vicinity of the ejection nozzle hole 2, but the temperature is not lowered as a whole. Also in this case, as in the third embodiment, all the heat that has cooled the vicinity of the ejection nozzle portion 2 is dissipated into the ink 9, and the temperature of the entire ink 9 in the infusion path 8 does not decrease. For this reason, when ink ejection of the ejection device is resumed, troubles due to an increase in the viscosity of the ink 9 do not occur. Also about the example of an injection device (4), the other operation effects as explained in Embodiment 3 can be exhibited.

(Embodiment 5)
The fifth embodiment is an intermediate modification of the second and fourth embodiments, in which the Peltier element is embedded in a part of the head front plate. 15 to 17 show a plan view, a cross-sectional view, and a temperature distribution explanatory view similar to those described above as the injection device example (5). In this case, the Peltier element 3 has the same thickness as the head front plate 6, and also serves as a part of the head front plate 6 portion of the ejection nozzle portion 2. Also in this case, the same effects as those of the first to fourth embodiments can be obtained. In the injection device example (5) shown in FIGS. 15 to 17, the side wall of the injection nozzle hole is covered with the head front plate 6, but all or part of the side wall of the injection nozzle hole is covered with the Peltier element 3. It may be directly covered with the endothermic bonding electrode plate 4.

(Embodiment 6)
The injection device example (6) of the sixth embodiment is similar to the injection device example (3). In the ejecting device example (3), the heat-dissipating bonded electrode plate 5 is disposed in the ink 9 in the infusion path 8, but in the ejecting device example (6), as shown in FIGS. The heat dissipation bonding electrode plate 5 of the element 3 is connected to the head rear plate 7. In the injection device example (3), the Peltier element 3 is arranged in the shape of a hollow disk around the injection nozzle hole. In the injection device example (6), as shown in the horizontal sectional view of FIG. The Peltier element 3 is disposed only in a part of the periphery. In this way, a flow path for the ink 9 from the infusion path 8 to the ejection nozzle hole is secured. Also in this case, the example of the injection device (6) has the same effect as the example of the injection device already described.

(Embodiment 7)
The injection device example (7) of the seventh embodiment is similar to the injection device example (4) and the injection device example (6). In the ejecting device example (4), the Peltier element 3 is arranged so as to hang in the ink 9 in the infusion path 8. In the ejecting device example (7), as shown in FIGS. The side surface opposite to the side surface connected to the head front plate 6 is connected to the head rear plate 7. In the ejection device example (7), the Peltier element 3 is disposed only in a part around the ejection nozzle hole as in the ejection device example (6), and the ink 9 from the infusion path 8 to the ejection nozzle hole is provided. The flow path is secured. In this case as well, the ejecting device example (7) can efficiently cool only the ink in the vicinity of the ejecting nozzle holes in the same manner as the ejecting device example already described.

(Embodiment 8)
The injection device example (8) of the eighth embodiment is a modification of the injection device example (3). In the injection device example (3), the Peltier element is disposed on the head front plate 6 in the infusion path 8. However, in the injection device example (8), as shown in FIGS. Connected to the plate 7. In this case, the heat dissipation bonding electrode plate 5 of the Peltier element 3 is connected to the head rear plate 7, and the heat absorption bonding electrode plate 4 is disposed in the ink 9 near the ejection nozzle hole. In this way, the ink 9 is cooled in the vicinity of the ejection nozzle hole of the infusion path 8. Also in this case, the ejection device example (8) can cool only the ink in the vicinity of the ejection nozzle holes in the same manner as the above-described ejection device example. In FIGS. 23 and 24, the Peltier element 3 has a hollow disk shape when viewed from the injection nozzle side, but it may have a disk shape without making the center part a space.

(Embodiment 9)
The injection device example (9) of the ninth embodiment is a modification of the injection device example (8). In the ejecting device example (8), the Peltier element 3 is connected to the head rear plate 7, but in the ejecting device example (9), the Peltier element 3 is embedded in the head rear plate 7 as shown in FIG. Yes. In this case, the heat dissipation bonding electrode plate 5 of the Peltier element 3 is disposed outside the head rear plate 7, and the heat absorption bonding electrode plate 4 is disposed on the infusion path 8 side. In this way, the ink 9 is cooled in the vicinity of the ejection nozzle hole of the infusion path 8. Also in this case, the ejection device example (9) can cool only the ink in the vicinity of the ejection nozzle holes in the same manner as the ejection device example already described.

(Embodiment 10)
The injection device example (10) of the tenth embodiment is a further modification of the injection device example (9). In the injection device example (9), the Peltier element 3 has a hollow disk shape when viewed from the injection nozzle side, but the injection device example (10) has a disk shape without a space in the center. In the injection device example (10), as shown in FIG. 26, the outer diameter of the Peltier element 3 may be smaller than that of the injection device example (9). In this case as well, the ejecting device example (10) can cool only the ink in the vicinity of the ejecting nozzle holes in the same manner as the ejecting device example already described.

(Embodiment 11)
The injection device example (11) of the eleventh embodiment is a modification of the injection device example (8). In the injection device example (8), the endothermic bonding electrode plate 4 of the Peltier element 3 is disposed so as to face the injection nozzle hole. However, as shown in FIG. 27, the injection device example (11) has a hollow disk shape. The inner side surface of the Peltier element 3 is the endothermic bonding electrode plate 4, and the outer side surface is the heat dissipation bonding electrode plate 5. In this case as well, the ejecting device example (11) can cool only the ink in the vicinity of the ejecting nozzle holes as in the ejecting device example described above.

Embodiment 12
The injection device example (12) of the twelfth embodiment is a modification of the injection device example (1). The injection device example (12) is an example in which sensors for measuring the temperature and humidity of the atmosphere near the injection nozzle hole are arranged in the injection device example (1) (see FIG. 28). Any sensor may be used, but the space in the vicinity of the ejection nozzle hole is a space where ink is ejected from the ejection nozzle, so that it does not interfere with ink ejection, for example, a non-contact type using optical means. Sensor, temperature / humidity detection element or dew point detection element for measuring the atmosphere. In this example of the ejecting device (12), not only can the ink in the vicinity of the ejecting nozzle hole be cooled in the same way as the example of the ejecting apparatus already described, but the temperature of the ink 9 in the ejecting nozzle hole is taken into consideration of the temperature and humidity in the vicinity of the ejecting nozzle hole. Can be controlled. Humidity as well as temperature is an important control factor when the ink is water-soluble.

(Embodiment 13)
The injection device example (13) of the thirteenth embodiment is a modification of the injection device example (12). The injection device example (13) is an example in which sensors for measuring the temperature, humidity, or dew point of the atmosphere in the vicinity of the injection nozzle hole are arranged as in the injection device example (12) (see FIGS. 29 and 30). This sensor is installed around the jet nozzle portion of the head front plate 6. Although there is no particular limitation on the measurement of temperature and humidity, a thermistor or the like may be used for temperature measurement, and a humidity sensitive resistor, a capacitance material, or the like may be used for humidity measurement. Alternatively, an atmosphere meter described in JP 07-55748 A can be used. In this jet device example (13), not only can the ink in the vicinity of the jet nozzle hole be cooled in the same manner as the jet device example (12) already described, but the temperature of the ink 9 in the jet nozzle hole can be changed to the temperature in the vicinity of the jet nozzle hole. It is possible to control and control the power supply to the Peltier element in consideration of the humidity.

(Embodiment 14)
The example of the injection device (14) of the fourteenth embodiment is a modification of the example of the injection device (2). In the injection device example (14), the Peltier element 3 is arranged on the head front plate 6 as in the injection device example (2). However, the arranged Peltier element 3 is thin, such as vapor deposition, CVD, sputtering, and photolithography. N-type and P-type semiconductors were joined and formed by a layer pattern forming method (see FIG. 31). The injection device example (14) is structurally the same as the injection device example (2), but the Peltier element 3 is almost integrated with the head front plate 6. Similarly to the above-described ejection device example (2), this ejection device example (14) can also cool only the ink in the vicinity of the ejection nozzle holes.

(Embodiment 15)
The injection device example (15) of the fifteenth embodiment is a modification of the injection device example (14). In the injection device example (15), the Peltier element 3 is formed by bonding N-type and P-type semiconductors by a thin layer pattern forming method such as vapor deposition, CVD, sputtering, and photolithography as in the injection device example (14). Yes. In the spray device example (15), the temperature measurement resistance pattern 14 which is a thermometer for measuring the temperature of the spray nozzle portion is installed inside the endothermic bonding electrode plate 4 of the Peltier element 3 on the head front plate 6. (See FIG. 32). There is no particular limitation on the thermometer for temperature measurement, but a thermistor or the like may be used. The Peltier element 3 and the temperature measuring resistance pattern 14 are almost integrated with the head front plate 6. Similarly to the jet device example (14) already described, this jet device example (15) can cool only the ink in the vicinity of the jet nozzle hole, and further, the ink in the jet nozzle hole in consideration of the temperature of the jet nozzle portion 2 9 temperatures can be controlled.

  FIG. 33 is a cross-sectional view of the injection apparatus example (15). In this injection device example (15), the Peltier element 3 is formed by bonding N-type and P-type semiconductors by a thin layer pattern forming method such as vapor deposition, CVD, sputtering, and photolithography. A resistance pattern 14 for temperature measurement, which is a thermometer for measuring the temperature of the spray nozzle portion, is installed inside the endothermic bonding electrode plate 4 of the Peltier element 3 on the head front plate 6. Further, in this example of the injection device, the electric wiring 10 of the Peltier element 3 and the temperature measuring input / output signal wiring 15 of the temperature measuring resistor pattern 14 are also formed by the above-described thin layer forming method (see FIG. 33).

  In this injection device example (15), the Peltier element 3, the temperature measuring resistance pattern 14, and the wiring are also almost integrated with the head front plate 6. Similarly to the spray device example (15) described in accordance with the plan view of FIG. 32 described above, this spray device example (15) can cool only the ink in the vicinity of the spray nozzle hole, and sprays in consideration of the temperature of the spray nozzle portion 2. The temperature of the ink 9 in the nozzle hole can be controlled.

(Embodiment 17)
The injection device example (17) of the seventeenth embodiment is a modification of the injection device example (4). The injection device example (16) has the same structure as the injection device example (4), but the Peltier element 3 is formed by the thin layer pattern forming method in the same manner as the injection device example (16). A temperature measuring resistance pattern 14, which is a thermometer for measuring the temperature of the ink 9 in the ejection nozzle portion, is formed inside the endothermic bonding electrode plate 4 of the Peltier element 3 on the top 6 by a thin layer pattern forming method. The electrical wiring 10 of the Peltier element 3 and the temperature measuring input / output signal wiring 15 of the temperature measuring resistor pattern 14 are also formed by the above-described thin layer forming method. In the injection device example (17), the Peltier element 3, the temperature measuring resistor pattern 14, and the wirings are almost integrated with the head front plate 6 and are contained in the infusion route 8 (see FIG. 34). Similarly to the above-described ejecting device example (4), this ejecting device example (17) can cool only the ink in the vicinity of the ejecting nozzle hole, and further, the temperature of the ink 9 in the ejecting nozzle portion 2 is taken into consideration. The temperature of the ink 9 inside can be controlled.

(Embodiment 18)
The injection device example (18) of the eighteenth embodiment is a modification of the injection device example (16) and the injection device example (17). The injection device example (18) includes both the Peltier element 3, the temperature measurement resistance pattern 14 and the wirings in the injection device example (16) and the injection device example (17) (see FIGS. 35 and 36). That is, the Peltier element 3 and the thermometer are arranged on the outer side and the inner side of the head front plate 6. Thus, not only the functions of the ejecting apparatus example (16) and the ejecting apparatus example (17) are provided, but also the temperature of the ink 9 in the vicinity of the ejection nozzle hole can be controlled more precisely and effectively.

(Embodiment 19)
The example of injection device (19) of the nineteenth embodiment is a modification of the example of injection device (17). The injection device example (19) has the same structure as the injection device example (17). However, as shown in FIGS. 37 and 38, the sensor 13 for measuring the temperature and humidity of the atmosphere around the injection nozzle portion 2 is provided in front of the head. It is provided on the injection nozzle part 2 of the plate 6. The head front plate 6 near the sensor 13 is provided with a cavity. This cavity is for minimizing heat transfer from the head front plate 6 to the sensor 13 and improving the accuracy of the ambient temperature and humidity measurement of the sensor 13. In this jetting device example (19), a thermometer 14 for measuring the ink temperature is also disposed on the side of the infusion path 8 of the head front plate 6. In order to improve the temperature measurement accuracy of the thermometer 14, the thermometer 14 is provided with a cavity (see FIGS. 37 and 39). The cavity may have a structure in which the ink 9 can enter. In the ejection device example (19), the temperature of the ink 9 in the ejection nozzle hole is adjusted to prevent evaporation of the solvent, and the temperature and humidity of the external atmosphere and the temperature of the ink 9 around the ejection nozzle hole are directly measured. Since the power supplied to the Peltier element 3 can be controlled, the ink temperature around the ejection nozzle hole can be controlled more precisely.

(Embodiment 20)
The example of injection device (20) of the twentieth embodiment is a modification of the example of injection device (19). The injection device example (20) has the same function as the injection device example (19). However, as shown in FIGS. 40 and 41, the fine processing technology (Micro Electro Mechanical System = MEMS technology) is used. The infusion path 8 is formed in a substrate in which the head front plate 6 and the head rear plate 7 are integrated. In the ejection device example (20), in principle, the Peltier element 3 is disposed outside the head rear plate 7. However, in the ejecting device example (20) formed by the fine processing technique, the outside of the head rear plate 7 is also in the vicinity of the ejecting nozzle portion, and the ink 9 around the ejecting nozzle hole can be sufficiently cooled. If a microfabrication technique is used, a very small and integrated injection device can be manufactured. Also in this case, the Peltier element 3 is arranged in the injection nozzle part 2.

  The manufacturing process of the injection apparatus example (20) by the microfabrication technique (MEMS technique) will be described. FIG. 42 shows an example of the manufacturing process of the injection device example (20). Referring to FIG. 42, first, an electrical insulating layer is formed on a substrate made of silicon, glass, metal, resin or the like (a). Next, an electric resistance material layer such as NiCr, Pt, p-Si is formed on the electric insulating layer (b). An electric resistance pattern is formed by etching the electric resistance material layer, and a window is provided at a predetermined position of the electric insulating layer for etching the base material (c). A wiring pattern made of Al, Au or the like to be an electrical wiring to the electrical resistance pattern is formed (d). The substrate is etched to form a nozzle portion and a heat insulation cavity for the electrical resistance pattern portion (e). This corresponds to a head front plate having an electrical resistance pattern. On the other hand, an electrical insulating layer is formed on the same substrate as in (a), and a Peltier element, a temperature sensitive element, a piezoelectric element, and an electric input / output are formed on the electrical insulating layer in the same manner as in (b) to (d) above. Form wiring. Then, an infusion route is formed in the substrate by etching (f). Finally, the substrates on which the elements obtained in (e) and (f) are mounted are bonded together (g). By such a fine processing technique, a very small and integrated injection device can be manufactured.

  FIG. 43 is another example showing the manufacturing process of the injection device example (20) by the microfabrication technology (MEMS technology). In this case, an electrical insulating layer is formed on both surfaces of the same substrate as described above (a), and an electrical resistance pattern is formed on one surface in the same manner as in FIGS. A Peltier element, a temperature sensitive element, and a piezoelectric element are formed on the side surface (c) as in FIG. Then, electric input / output wirings are formed, and a substrate etching window is provided at a predetermined position of the electric insulating layer (d). Finally, a spray nozzle portion, an infusion path, and a heat insulation cavity are provided by etching at predetermined locations on the substrate (e). If it does in this way, the example of an injection device (20) can be manufactured easily like the above-mentioned manufacturing method.

(Embodiment 21)
The injection device example (21) of the twenty-first embodiment is a modification of the injection device example (4). Unlike the injection apparatus example (4), the injection apparatus example (21) has an injection nozzle hole disposed on the side wall of the head instead of the head front plate 6 as shown in FIGS. The Peltier element 3 is installed in the infusion route 8. In this case, the head is made thin, and the shape of the Peltier element 3 is a combination of two rectangular parallelepipeds. The Peltier element 3 also serves as a part of the ejection nozzle portion 2 of the head side plate, and the endothermic bonding electrode plate 4 cools the ink 9 in the ejection nozzle holes directly and via the ejection nozzle portion 2 of the head side plate. To do. FIG. 44 is an explanatory perspective view of the ejecting apparatus example (4). FIG. 45 is a cross-sectional view of the ejecting apparatus example (4) in the vicinity of the central portion thereof, parallel to the head front plate 6 and from the head rear plate 7 side. FIG. FIG. 46 is a cross-sectional view of the vicinity of the center portion of the injection device example (4) cut perpendicularly to the head front plate 6 and viewed from the front side surface direction of FIG. As can be seen from these figures, the endothermic bonding electrode plate 4 cools the ink 9 in a portion near the outlet in the ejection nozzle hole. Since the evaporation of the solvent of the ink 9 occurs only from the liquid surface 11 of the ink 9, it is sufficient that only the ink 9 on the liquid surface 11 is cooled. This ejecting apparatus example (21) can be expected to have the same effects as the ejecting apparatus example (4) except that ink can be ejected from the side wall of the head.

(Embodiment 22)
The example of injection device (22) of Embodiment 22 is a modification of the example of injection device (21). In the injection device example (22), the arrangement of the Peltier elements 3 of the injection device example (21) is changed (see FIGS. 47 and 48). As shown in FIG. 48, which is a cross-sectional view cut laterally of the injection device example (22), and the corresponding FIG. 45, the endothermic bonding electrode plate 4 of the Peltier element 3 forms part of the side wall of the injection nozzle hole. is doing. Thereby, the ejecting device example (22) can exhibit the same effect as the ejecting device example (21), and the cooling effect of the ink 9 in the ejecting nozzle holes is improved.

(Embodiment 23)
An example of the injection device (23) of the twenty-third embodiment is a modification of the example of the injection device (15). The example of the injection device (23) includes a plurality of injection nozzles. The jet nozzles are arranged close to the front plate of the head (three are illustrated in FIG. 49), and each jet nozzle unit has a Peltier element and a thermometer for measuring the temperature of the nozzle unit. Has been placed. The power lines of these Peltier elements are common wiring, and a plurality of Peltier elements can supply power collectively. By doing so, the wiring for the Peltier element can be greatly simplified.

(Embodiment 24)
The example of injection device (24) of Embodiment 24 is a modification of the example of injection device (23). Like the injection device example (23), the injection device example (24) includes a plurality of injection nozzles, and the injection nozzles are arranged close to each other on the head front plate. One Peltier element and a thermometer for measuring the temperature of the nozzle part are arranged so as to surround the outer periphery. By doing so, the wiring for the Peltier element can be greatly simplified. In the case of a normal ink jet printer, the diameter of the ejection nozzle holes is about 10 microns, and the interval between the ejection nozzle holes is about 14 microns. Therefore, as shown in FIG. One Peltier element can be installed to cool. In this way, it is possible to provide an injection device that can exhibit the effects of the present invention with an economical and simple structure including a plurality of injection nozzles.

[Solution injection method]
The solution injection method of the present invention will be described. The solution ejecting method of the present invention relates to a method for controlling the ink temperature in the ejecting apparatus when ejection is not performed, but when ejecting solution (also referred to as ink) is ejected in the ejecting apparatus. More specifically, when the ejection is stopped in the ejection device, the solvent in the ink in the ejection device, in particular, moisture evaporates from the liquid surface in contact with the outside air of the ejection nozzle, and the viscosity of the ink increases. This is a solution jetting method for solving a problem that normal jetting cannot be performed when the ink jetting is attempted to resume after being dried or stuck.

  The solution injection method of the present invention can be implemented using, for example, the above-described injection device example (19). FIG. 51 is a block diagram of an ink control unit around the ejection nozzle unit for implementing the solution ejection method of the present invention. First, the measurement unit measures the temperature and humidity around the ejection nozzle unit, measures the ink temperature around the ejection nozzle unit, measures the input power to the Peltier element, and stores them in the measurement data and reference information storage unit. The condition calculation unit calculates the optimal ink temperature condition around the ejection nozzle unit and the input power condition condition to the Peltier element to achieve this based on the current time, ink type characteristics, Peltier element performance characteristics, and the like. Based on this, the control unit controls the input power to the Peltier element and the ink temperature around the ejection nozzle unit. Hereinafter, the solution jetting method of the present invention in the ink jet printer provided with the jetting device example (19) will be described as an embodiment.

(Embodiment 25)
Embodiment 25 is an example of the solution injection method of the present invention, and can be executed according to the flowchart (1) of FIG. When the power of the ink jet printer is turned on and the operation of the ejecting apparatus is started, the power is applied to the Peltier element, and the ink 9 near the ejecting nozzle portion is cooled. In addition, evaporation of moisture in the ink is prevented. When a command to start printing is input, the input power to the Peltier element is stopped and ink is ejected from the ejection nozzles of the ejection device. At this time, since the ink is not solidified due to moisture transpiration or abnormal viscosity increase, normal solution ejection is performed and normal printing can be performed. When printing is completed, the Peltier element is turned on again, and the ink 9 near the ejection nozzle is cooled. Then, the evaporation of moisture in the ink is prevented, and the next printing start command is prepared. Then, the process ends when the power of the inkjet printer is stopped.

(Embodiment 26)
Embodiment 26 is another example of the solution injection method of the present invention, and can be executed according to the flowchart (2) of FIG. The power of the ink jet printer is turned on, and the operation of the ejection device is started. When the operation of the ejecting device is started, the Peltier element is turned on and the ink 9 near the ejecting nozzle portion starts to be cooled (step S1). When an instruction to start printing is input (step S2), the input power to the Peltier element is stopped (step S6), and ink is ejected from the ejection nozzles of the ejection device. At this time, since the ink is not solidified due to moisture transpiration or abnormal viscosity increase, normal solution ejection is performed and normal printing can be performed. When printing is completed (step S7), the Peltier element is turned on again, and the ink 9 near the ejection nozzle is cooled (step S1). In addition, evaporation of moisture in the ink is prevented. The steps up to the point where the next print start command is prepared are the same as those in the flowchart (1). In Embodiment 26, the ambient temperature Ta and humidity of the outside air near the injection nozzle are measured, and the dew point Td at that time is calculated. On the other hand, the ink temperature Tn around the ejection nozzle is measured (step S3), and the ink temperature Tn is controlled so that [atmosphere temperature Ta> ink temperature Tn> dew point Td] (step S4). As a specific method of this control, taking into account the measured ink temperature Tn, it may be performed by on / off control of the input power to the Peltier element or by changing the input power amount to the Peltier element.

(Embodiment 27)
The twenty-seventh embodiment is a modification of the twenty-sixth embodiment, and in step S3 of the twenty-sixth embodiment, the ambient temperature Ta and humidity of the outside air near the injection nozzle unit are measured, and the dew point Td at that time is calculated. Further, the ink temperature Tn around the ejection nozzle and the ejection nozzle portion temperature Th of the portion exposed to the outside air of the ejection nozzle portion are measured, and as a characteristic of the ink separately, it becomes the minimum viscosity that can be designed and ejected in the solution ejecting apparatus. The temperature Tm of the spray liquid is stored in advance. In step S4, the ink temperature Tn is jetted so that [atmosphere temperature Ta ≧ jet nozzle temperature Th> ink temperature Tn> ink temperature Tm with respect to jettable viscosity] and the formula [jet nozzle temperature Th> dew point Td]. The nozzle part temperature Th is controlled. The rest may be the same as in the twenty-sixth embodiment.

(Embodiment 28)
Embodiment 28 is another example embodiment. In the twenty-eighth embodiment, the amount of electric power supplied to the Peltier element is maintained so that the injection liquid in the vicinity of the injection nozzle portion is maintained at −3 ° C. to 3 ° C. with respect to the dew point of the outside air in the vicinity of the injection nozzle portion at the time of the injection suspension. Control power supply time. As for the temperature of the outside air in the vicinity of the ejection nozzle portion, when ink that is an aqueous solution is used as the ejection liquid, if the liquid surface temperature of the ink is always the same as the dew point, the release and absorption of moisture by the ink are balanced. Therefore, it is ideal to keep the ink surface temperature equal to the dew point. However, since the temperature and humidity of the outside air changes, it is not practical to accurately follow this and keep the ink surface temperature the same as the dew point. Therefore, assuming that the normal outside air temperature, which is the normal operating condition range of the injector, is 5 to 40 ° C. and the relative humidity is about 30 to 90% RH, as can be seen from FIG. On the other hand, the dew point also changes by about 3 ° C., and the dew point changes by about 3 ° C. for a relative humidity change of 10-20% RH. Usually, such a change in temperature or humidity is considered to require one hour or more. In such a state, a small and practical temperature / humidity sensor and a small ink temperature control device such as a Peltier element measure the temperature and humidity of the outside air near the ejection nozzle and calculate the dew point. The temperature near the liquid level can be controlled. If the temperature of the ink in the vicinity of the ejection nozzle is in the range of about −3 ° C. to 3 ° C. with respect to the dew point, the moisture from the liquid level of the ejection nozzle hole can be seen from the change in the dew point with respect to the relative humidity in FIG. Most of the transpiration and absorption is negligible. When the temperature is in the range of -5 ° C to 5 ° C, when the outside air is extremely dry or humid for a long period of time, the transpiration and absorption of water from the liquid level of the injection nozzle hole exceed the limit. In some cases. For this reason, keeping the dew point of the outside air in the vicinity of the jet nozzle part at -3 ° C to 3 ° C is such that normal ink having a relatively high viscosity does not cause transpiration or absorption of water so as to be a substantial problem. In view of the heat capacity of the system, even if the temperature of the Peltier element can be easily controlled by a simple control method and circuit, it is also a practical temperature control method for ink near the ejection nozzle.

Embodiment 29
It is another example of the solution injection method of this invention, and can be performed according to the flowchart (3) of FIG. When the power of the ink jet printer is turned on and the operation of the ejecting apparatus starts, the time is measured. If there is an instruction to start printing (step S12), printing is started as it is. When printing is completed, the process returns to the start of time measurement (step S11). If there is no instruction to start printing, the printing pause period is measured as preparation for starting printing, and the amount of decrease in moisture in the ink is estimated from the relationship with the dry amount per unit time of ink stored in advance (step S15). When the amount of water decrease exceeds a predetermined value, the amount of power supplied to the Peltier element and the supply time are calculated based on the previously stored reference (step S16), and the Peltier element is turned on (step S17). Then, the ink is cooled to absorb moisture from the outside air, and when the set moisture supply time is reached, the Peltier element is turned off (step S18). Note that the amount of power supplied to the Peltier element for supplying moisture is preferably such that the temperature of the ink around the ejection nozzle is lower than the dew point of the atmosphere. Moreover, it is preferable that the temperature of the head front plate exposed to the outside air of the spray nozzle portion is also lower than the dew point of the atmosphere. As a result, part of the moisture condensed on the head front plate also flows into the ink, and water can be effectively replenished. While printing is paused, this operation is repeated to keep the moisture in the ink within a predetermined range.

Embodiment 30
The twenty-ninth embodiment is a modification of the twenty-ninth embodiment and can be executed according to the flowchart (4) in FIG. In the case of the twenty-ninth embodiment, in step S15, the amount of water decrease in the ink is estimated from the relationship with the amount of ink dried per unit time. The temperature Ta and humidity are measured, and the dew point Td at that time is calculated. On the other hand, the ink temperature Tn around the ejection nozzle is measured (step S32). Since the vapor pressure of moisture in the ink can be determined from the ambient temperature Ta and humidity, and the ink temperature Tn around the ejection nozzle, a relational expression for estimating the amount of ink dried from the liquid surface of the ejection nozzle is stored in advance. Then, a dry water amount is calculated (step S35). When a predetermined amount of drying occurs, power is supplied to the Peltier element to replenish moisture (step S36). The amount of power supplied to the Peltier element, the supply time, and the subsequent steps are the same as in the twenty-ninth embodiment.

Embodiment 31
The 31st embodiment is a modification of the 30th embodiment, and can be executed according to the flowchart (5) of FIG. In the case of the thirty-third embodiment, the dry moisture amount of the ink is calculated and compared with a predetermined value in step S35, and the Peltier element is operated. However, in the thirty-third embodiment, the dry moisture amount of the ink is calculated. (Step S43) and this is calculated as the level drop amount of the liquid level in the injection nozzle. Then, the time at which the liquid level is reached is estimated (step S44), and when the time to reach the liquid level is reached (step S45), the Peltier element is activated so that the ink near the liquid level is below the dew point of the outside air. Then, moisture is replenished by absorbing the moisture of the outside air into the ink (step S46). Further, according to the relationship stored in advance, the water replenishment amount is calculated from the ink temperature near the liquid level and the dew point of the outside air, and the time for the liquid level in the ejection nozzle to rise and reach the upper limit level is estimated ( Step S47). Then, when it is time to reach the upper limit level (step S49), the Peltier element is turned off (step S50). The subsequent steps are the same as those in the thirty embodiment.

(Embodiment 32)
Embodiment 32 is another embodiment and can be executed according to the flowchart (6) of FIG. In the case of the thirty-second embodiment, the ink jet printer is turned on and the operation of the ejection device is started. When the operation of the ejecting apparatus is started, the power is turned on to the Peltier element, and cooling of the ink near the ejecting nozzle portion starts (step S60). Then, when an instruction to start printing is input (step S61), the ambient temperature Ta and humidity of the outside air near the jet nozzle part are measured, and the dew point Td at that time is calculated. On the other hand, the ink temperature Tn around the ejection nozzle portion and the ink temperature Ti at a position away from the ejection nozzle portion are measured (step S64). The ink temperature Ti is considered to be the temperature of the entire ink in the infusion path. During printing, the ink temperature Tn is controlled such that [atmosphere temperature Ta> ink temperature Tn> dew point Td] and [ink temperature Ti = predetermined temperature] by controlling the power supplied to the Peltier element and the supply time. , Ti are controlled (step S65). When printing is suspended, the ambient temperature Ta and humidity of the outside air near the jet nozzle part are measured, and the dew point Td at that time is calculated. On the other hand, the ink temperature Tn around the ejection nozzle portion is measured (step S62). Then, the ink temperature Tn is controlled such that [atmosphere temperature Ta> ink temperature Tn> dew point Td] during printing suspension by controlling the power supply and the supply time to the Peltier element (step S63).

Embodiment 33
The solution injection method of the embodiment 33 includes a sensor for measuring the outside air temperature and humidity in the vicinity of the injection nozzle part, a sensor for measuring the temperature of the part exposed to the outside air of the injection nozzle part, and the outside air of the injection liquid of the injection nozzle part. A sensor that measures the temperature of the exposed portion and an injection device that includes a Peltier element in the vicinity of the injection nozzle portion are used. At the time of jetting suspension, from the outside air temperature and humidity in the vicinity of the jet nozzle part and the temperature of the part exposed to the outside air of the jet nozzle part, the moisture in the jet liquid of the jet nozzle part is released to the outside air, Alternatively, the absorption amount is calculated, the change in the volume of the injection liquid in the injection nozzle unit is calculated from the release or absorption of the water, and the liquid of the injection liquid in the injection nozzle unit corresponding to the change in the volume of the injection liquid Estimate the surface level. When the liquid level reaches the lower limit of the injection device, the temperature of the portion of the injection nozzle exposed to the outside air of the injection liquid and / or the temperature of the portion of the injection nozzle exposed to the outside air of the injection liquid are set. Electric power is supplied to the Peltier element so as to be lower than the dew point, and moisture in the outside air is absorbed from the liquid level of the spray liquid at the spray nozzle section, thereby causing the liquid level to rise. When the liquid level reaches the upper limit of the injection device, the power supply to the Peltier element is stopped. Then, when the temperature of the spray liquid rises and becomes higher than the dew point of the outside air, the water in the spray liquid again evaporates, and when the liquid level reaches the lower limit of the spray device, it is exposed to the spray liquid outside the spray nozzle. The electric power is repeatedly supplied to the Peltier element so that the temperature of the portion being exposed and / or the temperature of the portion exposed to the outside air of the jet nozzle is lower than the dew point. As a result, the spray liquid is always within a predetermined concentration range and is not concentrated. FIG. 65 schematically shows an upper limit and a lower limit of the liquid level in the proper injection of the spray liquid from the spray nozzle portion. FIG. 66 shows the relationship between the ejection suspension period and the change in the ink liquid level using the vapor pressure difference Pw of the ink that is the ejection liquid as a parameter. The ink vapor pressure difference Pw is zero when the temperature is the same as the dew point on the liquid surface, and the vapor pressure difference Pw is positive when the ink temperature is high and negative when it is low.

(Embodiment 34)
The embodiment 34 is a method for preventing an injection failure with respect to an injection pause for a relatively short period of time or a method that is also used as the solution injection method described as the above-described embodiment, and is water-soluble by an injection device provided with a Peltier element in the vicinity of the injection nozzle portion. When injecting a liquid jet, after resuming injection and resuming injection, solution injection is performed after repeated heating and cooling operations in the vicinity of the injection nozzle part by reversing the direction of the current applied to the Peltier element. Operate. The repetitive cycle time is preferably several seconds to several minutes. By repeating heating and cooling in the vicinity of the jet nozzle portion, the ink in the jet nozzle portion that has been stuck can flow due to a thermal shock or a decrease in viscosity due to a temperature rise. The cycle of this repetitive operation may be a time during which the temperature of the ink in the ejection nozzle portion rises or falls to a predetermined temperature. Further, in this case, it may be used in combination with so-called idling of ink.

(Embodiment 35)
If the ejection pause time is longer than the predetermined period, before starting printing, the vicinity of the ejection nozzle is first cooled to absorb moisture from the outside air, and the ink liquid level of the ejection nozzle is set near the upper limit. This is a method for preventing injection failure by repeatedly performing heating and cooling in the vicinity of the injection nozzle part, and when injecting water-soluble injection liquid by an injection device having a Peltier element in the vicinity of the injection nozzle part, At the time of resuming the ejection, the Peltier element first cools the vicinity of the ejection nozzle part to be below the dew point of the outside air, absorbs the moisture in the outside air to the ink, and sets the ink liquid level of the ejection nozzle part near the upper limit. The solution jetting operation is performed after the vicinity of the jet nozzle portion is repeatedly heated and cooled a plurality of times so that the ink can flow due to a thermal shock or a decrease in viscosity due to a temperature rise. The ink density in the vicinity of the jet nozzle is reduced, so that the ink in the jet nozzle that has been fixed by repeated heating and cooling can flow due to a uniform density, thermal shock, and a decrease in viscosity due to temperature rise. Become.

  In any of the above-described solution jetting methods, it is possible to prevent an increase in viscosity or fixation due to drying of ink during a printing pause, or an abnormal drop or rise in the ink liquid level in the jet nozzle. For this reason, when the solution is seeded, normal injection can always be performed.

[Various apparatuses including the injection device of the present invention]
The ejecting apparatus of the present invention can be used for various applications, and in particular, an ink jet printer that ejects ink for image formation, a lead pattern forming that ejects a conductive solution, an organic transistor forming apparatus that ejects an organic semiconductor material solution, and a circuit Drawing device, EL element forming material for EL (electroluminescent) display device, color filter material for liquid crystal display device, cell for plasma display device and display element forming device for injecting solution of phosphor material, resist solution injection Resist layer forming apparatus, biochemical solution processing apparatus for injecting biochemical solution containing biochemical substances in gene, protein reaction, analysis, synthesis and pharmaceutical synthesis, and light transmitting material manufacturing apparatus for forming microlens array It can utilize suitably for various electronic devices.

Explanatory drawing of the example of an injection device of the present invention (1) Plan view of the injection apparatus example (1) of the present invention Sectional drawing of the injection apparatus example (1) of this invention Explanatory drawing of temperature distribution of example of injection device (1) of the present invention Explanatory drawing of the example of an injection device of the present invention (2) Plan view of the injection device example (2) of the present invention Sectional drawing of the example of injection device (2) of this invention Explanatory drawing of temperature distribution of injection device example (2) of the present invention Explanatory drawing of the example of injection device (3) of the present invention Plan view of the injection device example (3) of the present invention Sectional drawing of the example of injection device (3) of this invention Explanatory drawing of temperature distribution of example of injection device (3) of the present invention Sectional drawing of the example of injection device (4) of this invention Explanatory drawing of temperature distribution of injection device example (4) of the present invention Plan view of the injection device example (5) of the present invention Sectional drawing of the example of injection device (5) of this invention Explanatory drawing of temperature distribution of example of injection device (5) of the present invention Horizontal sectional view of the injection device example (6) of the present invention Sectional drawing of the injection apparatus example (6) of this invention Explanatory drawing of temperature distribution of example of injection device (6) of the present invention Sectional drawing of the example of an injection device (7) of the present invention Explanatory drawing of temperature distribution of injection device example (7) of the present invention Sectional drawing of the example of injection device (8) of this invention Explanatory diagram of temperature distribution of injection device example (8) of the present invention Sectional drawing of the example of injection device (9) of this invention Sectional drawing of the injection apparatus example (10) of this invention Sectional drawing of the injection apparatus example (11) of this invention Sectional drawing of the example of injection device (12) of this invention Plan view of the injection apparatus example (13) of the present invention Sectional drawing of the example of injection device (13) of this invention Plan view of the injection device example (14) of the present invention Plan view of the injection device example (15) of the present invention Sectional drawing of the injection apparatus example (15) of this invention Sectional drawing of the example of an injection device of the present invention (17) Sectional drawing of the example of an injection device (18) of this invention Explanatory drawing of temperature distribution of injection device example (18) of the present invention Sectional drawing of the example of injection device (19) of this invention Plan view of the injection device example (19) of the present invention Plan view of the back side of the head front plate of the ejecting apparatus example (19) of the present invention Sectional drawing of the injection apparatus example (20) of this invention Cross-sectional perspective view of an example of the injection device (20) of the present invention Manufacturing process diagram (1) of the injection device example (20) of the present invention Manufacturing process diagram (2) of the injection device example (20) of the present invention Explanatory drawing of the example of an injection device (21) of the present invention Cross-sectional view of the injection device example (21) of the present invention Longitudinal sectional view of an example of the injection device (21) of the present invention Explanatory drawing of the example of an injection device (22) of the present invention Sectional drawing of the injection apparatus example (22) of this invention Plan view of the injection device example (23) of the present invention Plan view of the injection device example (24) of the present invention Control block diagram of the injection device of the present invention Flow chart of the injection method of the present invention (1) Flowchart (2) of the injection method of the present invention Flowchart (3) of the injection method of the present invention Flowchart (4) of the injection method of the present invention Flowchart (5) of the injection method of the present invention Flowchart (6) of the injection method of the present invention Dew point for relative humidity at each temperature Explanatory drawing of conventional injection device Cross-sectional view of ink ejection of ejection device Illustration of drying ink near the nozzle Illustration of moisture absorption of ink near the nozzle Illustration of drying ink near the nozzle Temperature explanatory diagram of each part near the nozzle Nozzle ink level Ink level fluctuation graph

Explanation of symbols

1: jetting device 2: jet nozzle unit 3: Peltier element 4: joining electrode plate for heat absorption 5: joining electrode plate for heat absorption 6: head front plate 7: head rear plate 8: infusion path 9: ink 10: electric wiring 11: Liquid level 12: Discharge pressure source 13: Sensor 14: Temperature measurement resistor pattern 15: Temperature measurement electric wire 16: Electrical insulating material layer 17: Heater or piezoelectric element for generating discharge pressure

Claims (26)

  An injection apparatus for injecting an injection solution, wherein a cooling section of a thermoelectric conversion element is arranged in an injection nozzle section.   The injection device according to claim 1, wherein the thermoelectric conversion element is disposed in the injection solution.   The spray device according to claim 2, wherein the heat radiating portion of the thermoelectric conversion element is disposed either on a wall surface of the solution spray hole that is farther from the spray nozzle portion than the cooling portion, or in the spray solution.   The injection device according to claim 1, wherein the thermoelectric conversion element is disposed outside the injection solution.   The spray device according to claim 3, wherein the heat radiation portion of the thermoelectric conversion element is disposed in the outside air.   The injection device according to claim 1, wherein at least a part of a wall surface of the solution injection hole forming the injection nozzle portion is formed by a cooling portion of a thermoelectric conversion element.   The injection device according to any one of claims 1 to 6, wherein a sensor for measuring an outside air temperature around the injection nozzle portion is arranged.   The injection device according to any one of claims 1 to 7, further comprising a sensor for measuring outside air humidity or dew point around the injection nozzle portion.   The injection device according to any one of claims 1 to 8, further comprising a temperature measurement sensor for the injection nozzle portion.   It is an injection apparatus provided with the some injection nozzle part, Comprising: The said thermoelectric conversion element provided with the common electric power supply wiring in the some injection nozzle part is arrange | positioned, The any one of Claim 1 thru | or 9 characterized by the above-mentioned. The injection device described in 1.   The injection device according to any one of claims 1 to 9, wherein the injection device includes a plurality of injection nozzle portions, and one thermoelectric conversion element is arranged in the plurality of injection nozzle portions. A solution injection method of injecting a water-soluble injection liquid by an injection device provided with a thermoelectric conversion element in the vicinity of an injection nozzle part,
A solution jetting method characterized in that the jetting liquid in the vicinity of the jetting nozzle part is kept lower than the outside air temperature in the vicinity of the jetting nozzle part and higher than the dew point by the thermoelectric conversion element when the jetting is stopped. A solution injection method of injecting a water-soluble injection liquid by an injection device provided with a thermoelectric conversion element in the vicinity of an injection nozzle part,
When the injection is stopped, the injection liquid in the vicinity of the injection nozzle is cooled by the thermoelectric conversion element, and is kept below the temperature of the injection liquid that is lower than the outside air temperature in the vicinity of the injection nozzle and becomes the maximum jettable viscosity of the injection device. And a solution jetting method. A solution injection method of injecting a water-soluble injection liquid by an injection device provided with a thermoelectric conversion element in the vicinity of an injection nozzle part,
The outside temperature in the vicinity of the injection nozzle portion is Ta, the dew point of the outside air in the vicinity of the injection nozzle portion is Td, the temperature of the portion exposed to the outside air in the injection nozzle portion is Th, and the outside temperature of the injection liquid in the injection nozzle portion is exposed to the outside air. When the temperature of the portion is Tn, and the temperature of the jet liquid that is the lowest viscosity that can be designed and jetted in the solution jetting device is Tm,
When the injection is stopped, Th and Tn are
Formula [Ta ≧ Th>Tn> Tm] and Formula [Th> Td]
A solution jetting method characterized by being in a temperature range satisfying A solution injection method of injecting a water-soluble injection liquid by an injection device provided with a thermoelectric conversion element in the vicinity of an injection nozzle part,
A spraying method in which the spraying liquid in the vicinity of the spraying nozzle part is maintained at −3 ° C. to 3 ° C with respect to the dew point of the outside air in the vicinity of the spraying nozzle part when the spraying is stopped. A sensor that measures the outside air temperature and humidity in the vicinity of the injection nozzle, a sensor that measures the temperature of the portion of the injection nozzle exposed to the outside air, and a temperature of the portion of the injection nozzle that is exposed to the outside air And a solution injection method for injecting a water-soluble injection liquid by an injection device provided with a thermoelectric conversion element in the vicinity of the injection nozzle part,
At the time of jetting suspension, from the outside air temperature and humidity in the vicinity of the jet nozzle part and the temperature of the part exposed to the outside air of the jet nozzle part, the moisture in the jet liquid of the jet nozzle part is released to the outside air, Alternatively, the absorption amount is calculated, the change in the volume of the injection liquid in the injection nozzle unit is calculated from the release or absorption of the water, and the liquid of the injection liquid in the injection nozzle unit corresponding to the change in the volume of the injection liquid Estimate the surface level,
When the liquid level reaches the lower limit of the injection device, the temperature of the portion of the injection nozzle exposed to the outside air of the injection liquid and / or the temperature of the portion of the injection nozzle exposed to the outside air of the injection liquid is determined from the dew point. Supply power to the thermoelectric conversion element to lower it,
When the liquid level reaches the upper limit of the injection device, the power supply to the thermoelectric conversion element is stopped. A solution injection method of injecting a water-soluble injection liquid by an injection device provided with a thermoelectric conversion element in the vicinity of an injection nozzle part,
A solution jetting method comprising performing a solution jetting operation after repeatedly performing heating and cooling operations in the vicinity of a jet nozzle portion a plurality of times by a thermoelectric conversion element after jetting is stopped after jetting is resumed.   After resuming the ejection, when resuming the ejection, the vicinity of the ejection nozzle is cooled by the thermoelectric conversion element so that the temperature of the ink in the ejection nozzle is lower than the dew point of the outside air near the ejection nozzle. 18. The liquid level in the nozzle is increased to an upper limit, and then the solution jetting operation is performed after repeating the heating and cooling operations in the vicinity of the jet nozzle part a plurality of times. Solution injection method.   An ink jet printer comprising the ejecting apparatus according to claim 1, which ejects an image forming ink.   A conductor pattern forming apparatus comprising the spraying device according to any one of claims 1 to 11, which sprays a conductive solution.   The organic-semiconductor formation apparatus provided with the injection apparatus as described in any one of Claims 1 thru | or 11 which injects an organic-semiconductor solution.   12. An EL layer forming apparatus comprising the injection device according to claim 1, wherein an injection device according to claim 1 is used to inject an EL (electroluminescent) material solution.   An apparatus for manufacturing a display device comprising the injection device according to any one of claims 1 to 11, which injects a material solution of a liquid crystal display device and a plasma display device.   A resist layer forming apparatus comprising the spraying apparatus according to claim 1, which sprays a resist solution.   The biochemical solution processing apparatus provided with the injection apparatus as described in any one of Claims 1 thru | or 11 which injects the biochemical solution containing a biochemical substance.   A light-transmitting material manufacturing apparatus, comprising the injection device according to any one of claims 1 to 11 for forming a microlens array.

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