JP2008177202A - Substrate receiving device - Google Patents

Abstract

An object of the present invention is to provide a substrate under-mounting device that is excellent in multi-product compatibility and is capable of receiving under low-cost and high-density mounting.
A substrate receiving device for receiving and supporting a substrate from the lower surface side in an electronic component mounting apparatus, wherein the base receiving plate is used in combination with a base plate with holes in which a plurality of pin holes are formed in a regular array. The pin module 32 is attached to the pin hole of the base plate with a hole so that the first pin member 35 whose upper end is in contact with the substrate and supports the substrate is held by the pin holding member 37, and can be inserted and removed in a vertical posture. The two second pin members 34 are connected by a connecting member 39, and the pin holding member 37 is attached to the connecting member 39 so that the relative position in the horizontal direction can be adjusted. Thereby, the horizontal position of the first pin member 35 can be adjusted, and interference with already mounted components can be prevented.
[Selection] Figure 6

Description

  The present invention relates to a substrate receiving device for receiving a substrate by a receiving pin in an electronic component mounting device such as an electronic component mounting device or a screen printing device.

  As a substrate on which electronic components are mounted, there is a so-called double-sided mounting substrate in which electronic components are mounted on both sides as well as one side of the substrate. In the mounting process of the double-sided mounting substrate, first, mounting on the first surface is performed, and then the substrate is reversed and mounting operations such as solder printing, electronic component mounting, and reflow are performed on the second surface. At the time of mounting on this second surface, since the already mounted surface on which the electronic component has already been mounted faces downward, in an apparatus that needs to position and hold the board such as solder screen printing or component mounting, This already mounted surface is supported from below.

At this time, the receiving pins are arranged so as not to directly contact the already mounted components, and support only the board surface to receive the already mounted surface. In addition, when receiving the mounted surface, if the number of support points is insufficient only on the board surface where no parts are present, support is made by contacting the receiving pins directly on the mounted parts as well as the bottom surface of the board. There is known a substrate receiving device having a configuration to be described (see Patent Document 1). In the example shown in this patent document, a plurality of backup pins are held up and down in a predetermined lattice arrangement so that the backup pins can be raised and lowered by a working fluid and the position of the backup pins can be held at an arbitrary height position. . As a result, the operator can change the setup for each board type without individually adjusting the height of the backup pins.
JP 2002-64298 A

  In recent years, with the miniaturization of electronic devices, the miniaturization of electronic components themselves and the increase in mounting density tend to further advance. For this reason, when receiving the already mounted surface of the double-sided mounting substrate, there is a case where it is not allowed to contact the backup pin with the electronic component itself as shown in the above-mentioned patent document example. This is because the terminals and electrodes of the electronic component are very easily deformed due to the miniaturization of the electronic component, and the contact of the backup pin with such a terminal or electrode causes a mounting failure.

  When targeting a board with such a narrow pitch and high-density mounting, there is no other way but to produce a dedicated block for each board by removing the part that interferes with the mounted parts from the bearing surface. Manufacturing preparation work for dealing with a new substrate type has a large burden both in terms of cost and time required for preparation. As described above, in the field of electronic component mounting, there has been a demand for a substrate receiving device that can support high-mix low-volume production at a low cost for substrates with high-density mounting.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate under-mounting device that is excellent in multi-product compatibility and capable of under-loading corresponding to high-density mounting at low cost.

The substrate receiving device of the present invention is a substrate receiving device for receiving and supporting a substrate from the lower surface side in an electronic component mounting device, wherein a base portion in which a plurality of pin holes are formed in a regular arrangement, and an upper end A first pin member whose portion abuts against the substrate and supports the substrate, a second pin member that is removably mounted in a vertical posture on the pin hole, and the pin of the second pin member A detent means for restricting rotation about the vertical axis with respect to the hole, and a pin coupling means for coupling the first pin member and the second pin member so that the relative position in the horizontal direction can be adjusted.

  According to the present invention, the first pin member that contacts and supports the substrate and the second pin member that is removably attached to the pin hole of the base portion are coupled so that the relative position in the horizontal direction can be adjusted. By adopting such a configuration, it is possible to realize a substrate receiving apparatus that is excellent in multi-product compatibility and capable of receiving support corresponding to high-density mounting at low cost.

  Next, embodiments of the present invention will be described with reference to the drawings. 1 is a side view of a screen printing apparatus according to an embodiment of the present invention, FIG. 2 is a front view of the screen printing apparatus according to an embodiment of the present invention, and FIG. 3 is a screen printing apparatus according to an embodiment of the present invention. FIG. 4 is a diagram for explaining the operation of the screen printing apparatus according to the embodiment of the present invention, FIG. 5 is a perspective view of the substrate receiving apparatus according to the embodiment of the present invention, and FIG. 6 is an embodiment of the present invention. FIG. 7 and FIG. 8 are explanatory views of application examples of the substrate receiving device according to the embodiment of the present invention.

  First, the structure of the screen printing apparatus will be described with reference to FIG. 1, FIG. 2, and FIG. This screen printing apparatus is an electronic component mounting apparatus used in an electronic component mounting line for mounting electronic components on a substrate, and the substrate receiving apparatus of the present invention is used.

  In FIG. 1, the screen printing apparatus is configured by disposing a screen printing mechanism above a substrate positioning unit 1. The substrate positioning unit 1 is configured by stacking a Y-axis table 2, an X-axis table 3, and a θ-axis table 4, and further combining a first Z-axis table 5 and a second Z-axis table 6 thereon. Yes. The configuration of the first Z-axis table 5 will be described. Similarly, on the upper surface side of the horizontal base plate 4 a provided on the upper surface of the θ-axis table 4, the horizontal base plate 5 a is held up and down by an elevating guide mechanism (not shown). The base plate 5a is moved up and down by a Z-axis lifting mechanism configured to rotationally drive a plurality of feed screws 5c via a belt 5d by a transport rail lifting motor 5b. Vertical frames 5e and 5f are erected on the base plate 5a, and two transport rails 8a constituting the substrate transport mechanism 8 are held at upper ends of the vertical frames 5e and 5f.

  The transport rails 8a are arranged in parallel to the substrate transport direction (X direction--the direction perpendicular to the paper surface in FIG. 1), and the both ends of the substrate 10 to be printed are moved by the substrate transport conveyors provided on these transport rails 8a. Transport in support. Here, of the vertical frames 5e and 5f, one vertical frame 5f is slidable in the Y direction by a slide mechanism including a guide rail 5g and a slider 5h arranged in the Y direction on the upper surface of the base plate 5a. That is, among the two transport rails 8a, the transport rail 8a held by the vertical frame 5f is movable in the Y direction so that the transport width by the substrate transport mechanism 8 can be changed according to the substrate type. It has become. By driving the first Z-axis table 5, the substrate 10 held by the substrate transport mechanism 8 can be lifted and lowered with respect to the screen printing mechanism described later together with the transport rail 8 a.

  The configuration of the second Z-axis table 6 will be described. A horizontal base plate 6a is disposed between the substrate transport mechanism 8 and the base plate 5a so as to be movable up and down along a lifting guide mechanism (not shown). The base plate 6a is lifted and lowered by a Z-axis lifting mechanism configured to rotationally drive a plurality of feed screws 6c via a belt 6d by a lower part lift motor 6b. A substrate support 7 is detachably mounted on the upper surface of the base plate 6a.

The substrate receiving unit 7 receives and holds the substrate conveyed from below to the printing position by the screen printing mechanism. The substrate 10 to be printed is a double-sided mounting substrate, and the electronic component P is mounted on the lower surface side in the previous process. Here, the already mounted surface of the substrate 10 is a receiving surface by the substrate receiving portion 7. In the present embodiment, the substrate support provided with the receiving pin module 32 (see FIG. 5) capable of fine adjustment of the pin position so that the lower surface of the substrate 10 can be received while avoiding the position of the electronic component P. Part 7 is used.

  As shown in FIGS. 2 and 3, the conveyance rail 8a extends to the upstream side (left side in FIGS. 2 and 3) and the downstream side. In the printing operation by the screen printing device, the substrate transport mechanism 8 receives the substrate 10 from the upstream device by the transport rail 8a, and carries it to the printing position by the screen printing mechanism for positioning. And the board | substrate 10 after printing by the screen printing mechanism is carried out from a printing position by the conveyance rail 8a, and is delivered to a downstream apparatus.

  By driving the second Z-axis table 6, the substrate receiving unit 7 moves up and down with respect to the substrate 10 held by the substrate transport mechanism 8. Then, the substrate receiving portion 7 supports the substrate 10 from the lower surface side when the lower surface of the substrate receiving portion 7 contacts the lower surface of the substrate 10. A clamp mechanism 9 is disposed on the upper surface of the substrate transport mechanism 8. The clamp mechanism 9 includes two clamp members 9a that are arranged opposite to each other on the left and right sides, and the substrate 10 is clamped and fixed from both sides by moving the clamp member 9a on one side forward and backward by the drive mechanism 9b (see FIG. (See also 3).

  Next, a screen printing mechanism that is disposed above the substrate positioning unit 1 and prints paste on the substrate conveyed to the printing position will be described. 1 and 2, a mask plate 12 is extended on a mask frame 11 held by a mask holder (not shown), and the mask plate 12 has a shape and position of an electrode to be printed on the substrate 10. Correspondingly, a pattern hole 12a is provided. A squeegee driving mechanism 13 is disposed on the mask plate 12. The squeegee driving mechanism 13 has a structure in which two squeegee raising / lowering mechanisms 15 for raising and lowering a pair of squeegee heads 16 arranged opposite to each other are arranged on a horizontal plate 14. A plate-like squeegee member 16 a is held on each squeegee head 16 coupled to the lifting shaft 15 a of each squeegee lifting mechanism 15.

  By driving the squeegee raising / lowering mechanism 15, the squeegee head 16 moves up and down, whereby the squeegee member 16 a comes into contact with the upper surface of the mask plate 12. A feed screw 18 that is rotationally driven by a squeegee moving motor 17 is screwed onto a nut 19 fixed to the lower surface of the plate 14. By driving the squeegee moving motor 17, the squeegee head 16 moves together with the plate 14 in the Y direction. Move horizontally in the direction.

  As shown in FIG. 2, a guide rail 23 is disposed in the Y direction on a bracket 22 disposed on the vertical frame 21, and a slider 24 slidably fitted on the guide rail 23 is provided on the plate 14. Connected to both ends. Thereby, the squeegee drive mechanism 13 is slidable in the Y direction. In FIG. 2, a guide rail 27 is disposed on the vertical frame 21 in the Y direction, and a slider 28 slidably fitted to the guide rail 27 is coupled to the head X-axis table 26 via a bracket 26a. Yes. Thereby, the head X-axis table 26 is slidable in the Y direction. The head X-axis table 26 is horizontally moved in the Y direction by a head Y-axis moving mechanism 25 including a nut 30, a feed screw 29, and a head moving motor (not shown) that rotationally drives the feed screw 29.

As shown in FIGS. 1 and 2, the camera head unit 20 is mounted on the head X-axis table 26. The camera head unit 20 includes a substrate recognition camera 20a for imaging the substrate 10 from above, and a mask recognition camera 20b for imaging the mask plate 12 from the lower surface side. The head Y-axis moving mechanism 25, the head By driving the X-axis table 26 and moving the camera head unit 20, the recognition of the substrate 10 and the mask plate 12 are performed.
Can be recognized at the same time. When the substrate 10 and the mask plate 12 are not recognized by the camera head unit 20, the camera head unit 20 is in a position retracted from the upper side of the substrate positioning unit 1 as shown in FIG.

  Next, a printing operation by the screen printing mechanism will be described with reference to FIG. First, as shown in FIG. 4 (a), the board 10 having the electronic component P already mounted on the lower surface is carried into the printing position by the carrying rail 8 a of the board carrying mechanism 8 and aligned with the board receiving part 7. Is done. Thereby, each lower receiving pin module 32 is located in each lower receiving position adjusted beforehand corresponding to substrate 10. Next, the second Z-axis table 6 is driven, and the second Z-axis table 6 is driven to raise the substrate receiving portion 7 as shown in FIG. 4B, so that the lower surface of the substrate 10 is received. . At this time, the first lower receiving pin 35 (see FIG. 5) whose position has been adjusted in advance by the lower receiving pin module 32 avoids interference with the electronic component P and abuts on the lower surface of the substrate 10. Is received by the substrate receiving portion 7.

  Next, the substrate positioning unit 1 is driven to align the substrate 10 with respect to the mask plate 12, and then the first Z-axis table 5 is driven to raise the substrate 10 together with the substrate transport mechanism 8 so that the pattern holes 12a are formed. The substrate 10 is brought into contact with the lower surface of the provided mask plate 12, and then the substrate 10 is clamped by the clamp mechanism 9. Thereby, the horizontal position of the board | substrate 10 is fixed in the squeegee which moves the squeegee head 16 by the squeegee drive mechanism 13. FIG.

  In this state, one of the two squeegee heads 16 is lowered in accordance with the squeegeeing direction in the squeezing operation, and the squeegee member 16 a is brought into contact with the mask plate 12. Next, the cream solder is printed on the substrate 10 through the pattern holes 12a by sliding the squeegee member 16a in the squeegeeing direction (Y direction) on the mask plate 12 to which cream solder as paste is supplied. .

  Next, the substrate receiving part 7 used in the present embodiment will be described with reference to FIGS. As shown in FIG. 5, the substrate support portion 7 forms a base portion of the support by combining a plurality of long rectangular base plates 31 with holes according to the width of the target substrate 10 (FIG. 3). Also, a base pin module 32, a base pin module 32A, and a single base pin 33 for supporting the lower surface of the substrate 10 in the pin holes 31a provided in each base plate 31 with a predetermined arrangement pitch p. It is configured to be mounted in accordance with the target board.

  The single lower receiving pin 33 is a simple pin member, and is used by being inserted into the pin hole 31a as it is, and the pin is placed immediately below a supportable position on the substrate 10, that is, a position where no mounted electronic component P is present. Used when the hole 31a exists. On the other hand, the lower receiving pin module 32 is used when the pin hole 31a does not exist immediately below the supportable position on the substrate 10 and the single lower receiving pin 33 cannot be used as it is. That is, the lower receiving pin module 32 is used. In order to avoid interference with the already mounted electronic component P, the first receiving pin 35 that is in contact with and supported by the substrate 10 with respect to the second receiving pin 34 inserted into the pin hole 31a. It is possible to offset only the necessary dimensions.

  The lower receiving pin module 32A connects the first lower receiving pad 35A having a suction pad at the upper end to the vacuum suction source 36 instead of the first lower receiving pin 35 in the lower receiving pin module 32. It is used when screen printing needs to ensure a sufficient holding force when separating plates. That is, the vacuum suction source 36 is driven and vacuum suction is performed from the first lower receiving pad 35A while the first lower receiving pad 35A is in contact with the lower surface of the substrate 10, thereby attracting the substrate 10 from the lower surface side. Can be held.

  Next, the structure and function of the receiving pin module 32 will be described with reference to FIG. As shown in FIG. 6A, the lower receiving pin module 32 is configured by combining a first lower receiving pin 35, a pin holding member 37, a coupling member 39 and a second lower receiving pin 34. The first lower receiving pin 35 is a simple pin member, and the upper end of the first receiving pin 35 abuts on the substrate 10 to support the substrate 10 from below. Here, a small-diameter pin member is selected as the first receiving pin 35 so as to cope with a narrow gap in the high-density mounting substrate.

  The pin holding member 37 is manufactured by cutting a rectangular small block block member made of metal, and is a stepped member provided with a convex portion 37a at one end portion. A pin fitting hole 37b having a hole diameter into which the one receiving pin 35 is fitted is provided. The cutting portion 37c thinned by cutting is provided with a long hole-shaped position adjusting groove 37d.

  The coupling member 39 is a rectangular member having substantially the same planar shape as the pin holding member 37, and is provided with two pin connection holes 39a into which the second lower receiving pins 34 are fitted. Further, a screw hole 39b into which a fixing bolt 38 inserted through the position adjusting groove 37d is screwed is provided on the upper surface of the coupling member 39, and the side surface of the coupling member 39 corresponds to the position of the pin coupling hole 39a. A screw hole 39c into which a set screw 40 for fixing the second receiving pin 34 is screwed is provided.

  In order to assemble the lower receiving pin module 32 by combining these parts, the first lower receiving pin 35 is first fitted into the pin fitting hole 37b and held in a vertical posture. Then, the two second lower receiving pins 34 are inserted into the pin connection holes 39 a of the coupling member 39, and the second lower receiving pins 34 are fixed by the set screws 40. Next, the pin holding member 37 is overlaid on the coupling member 39, and the fixing bolt 38 is inserted through the position adjusting groove 37d and screwed into the screw hole 39b to be tightened, as shown in FIG. Module 32 is assembled.

  In this state, the interval between the second receiving pins 34 coincides with the arrangement pitch p of the pin holes 31a shown in FIG. 5, and as long as the interval coincides with this arrangement pitch p, the pin holes 31a located at any position are arranged. The lower receiving pin module 32 can be mounted. Then, by inserting and mounting the two second lower receiving pins 34 into the pin holes 31a, the rotation of the second lower receiving pins 34 around the vertical axis with respect to the pin holes 31a is restricted. That is, in the lower receiving pin module 32, the pair of second pins 34 are connected to each other so as to restrict the rotation of the second lower receiving pin 34, and this configuration is the second pin member. This is a detent means for restricting rotation around the vertical axis with respect to the 34 pin holes 31a. Of course, the shape of the pin hole 31a and the shape of the lower end portion of the second lower receiving pin 34 are made such that the rotation around the vertical axis is restricted, so that the second lower receiving pin 34 alone is vertical. The rotation around the shaft may be restricted.

  In other words, in the above configuration, the substrate receiving portion 7 is configured to use the base plate 31 with a hole, which is a base portion in which a plurality of pin holes 31a are formed in a regular arrangement, and the receiving pin module 32 in combination. The lower receiving pin module 32 is detachably attached to the first pin member 35 whose upper end abuts against the substrate 10 and supports the substrate 10 and the plurality of pin holes 31a of the holed base plate 31 in a vertical posture. The second pin member 34, the rotation stopping means for restricting the rotation of the second pin member 34 around the vertical axis with respect to the pin hole 31a, and the first pin member 35 and the second pin member 34 are arranged in the horizontal direction. It is the structure provided with the pin coupling means which couple | bonds the relative position of these so that adjustment is possible.

As shown in FIG. 6B, the position of the first lower receiving pin 35 is moved to the second lower receiving position by moving the pin holding member 37 in the longitudinal direction of the coupling member 39 using the position adjusting groove 37d. The pin 34 can be moved horizontally in the direction orthogonal to the pin 34. Further, as shown in FIG. 6 (c), by rotating the pin holding member 37 around the fixing bolt 38 with respect to the coupling member 39, the position of the first lower receiving pin 35 is changed to the second lower receiving pin 34. Can be moved horizontally relative to the rotation direction. Then, by combining the relative movement in the orthogonal direction shown in FIG. 6B and the relative movement in the rotation direction shown in FIG. 6C, the position of the first lower receiving pin 35 is moved with respect to the second lower receiving pin 34. Thus, it can be arbitrarily adjusted within a range in which relative movement is possible.

  Therefore, the pin holding member 37, the coupling member 39, the position adjusting groove 37b provided in the pin holding member 37, and the fixing bolt 38 have the relative positions of the first pin member 35 and the second pin member 34 in the horizontal direction. A pin coupling means for coupling in an adjustable manner is configured. The position adjusting groove 37b and the fixing bolt 38 provided in the pin holding member 37 serve as mounting means for mounting the pin holding member 37 to the coupling member 39 in a variable manner in the horizontal relative position.

  Next, an actual application example of such a substrate receiving portion 7 will be described with reference to FIGS. FIG. 7A is configured by arranging a plurality of underpinning pin modules 32 on the base portion in which the arrangement of the already mounted electronic components P on the target substrate 10 and the plurality of base plates 31 with holes are combined in parallel. In addition, the base plate receiving portion 7 is also shown. Here, according to the planar size of the substrate 10, the number of receiving pin modules 32 necessary to stably hold the substrate 10 is arranged so as to have as even a support point arrangement as possible.

  Here, among the plurality of underpinning pin modules 32, the underpinning pin module 32 * located at the position overlapping the already mounted electronic component P has the first lower pin by the method shown in FIGS. 6B and 6C. The position of the receiving pin 35 is adjusted, and the pin position is adjusted so that the first lower receiving pin 35 does not contact the electronic component P. This pin position adjustment operation is performed in an off-line state with good workability by removing the substrate support portion 7 from the screen printing apparatus, and after confirming the actual support state using the actual substrate 10, the work is completed. The substrate receiving portion 7 is attached to the screen printing apparatus. In the example shown here, the lower receiving pin module 32 is used at all positions. However, the single lower receiving pin 33 shown in FIG. 5 is mounted at a position where no interference with the already mounted electronic component P occurs. You may do it.

  FIG. 7B and FIG. 8A show a state where the substrate 10 is received by the substrate receiving portion 7 in which the pin position is adjusted in this way. That is, in the receiving pin module 32 * that is in a position overlapping with the already mounted electronic component P, the first receiving pin 35 is offset by a necessary amount by the pin position adjustment operation that has been performed in advance. No interference between the first receiving pin 35 and the electronic component P occurs. Therefore, there is no problem in receiving in the conventional apparatus as shown in FIG. 8B, that is, no damage due to the direct contact of the single receiving pin 33 with the electronic component P.

  As described above, in the substrate receiving portion 7 shown in the present embodiment, the base plate 31 with the holes provided with the pin holes 31a is used so that the pin holes 31a correspond to the target receiving positions of the substrate. In the general-purpose substrate receiving apparatus of the type that inserts and removes the receiving pins, the first pin member 35 that contacts and supports the substrate and the pin hole 31a of the holed base plate 31 are detachably mounted. The second pin member 34 is configured to be coupled so that the relative position in the horizontal direction can be adjusted.

  As a result, even when the mounting surface where the pins are not allowed to be brought into contact with the electronic component itself on the double-sided mounting board is used as a receiving target, the position of the first pin 35 is finely adjusted to Interference can be prevented. Therefore, it is possible to cover a wide variety of substrates with different sizes and component types with the same substrate receiving device, and it is possible to cover a wide variety of substrates with excellent low-cost and high-density mounting. Is realized.

  In the above-described embodiment, an example of a screen printing apparatus that prints paste such as cream solder on a substrate as an electronic component mounting apparatus has been described. However, the application target of the present invention is not limited to a screen printing apparatus. Any apparatus that performs a predetermined operation while supporting the lower surface of the substrate, such as a component mounting apparatus, is an application target of the present invention.

  The substrate receiving device of the present invention has an effect that it can realize a substrate receiving device capable of receiving a substrate corresponding to high-density mounting at low cost with excellent versatility, and can be used for mounting electronic components such as screen printing devices. This is useful in a component mounting line in which an industrial device is incorporated.

The side view of the screen printing apparatus of one embodiment of this invention 1 is a front view of a screen printing apparatus according to an embodiment of the present invention. The top view of the screen printing apparatus of one embodiment of this invention Operation explanatory diagram of a screen printing apparatus according to an embodiment of the present invention The perspective view of the board | substrate receiving apparatus of one embodiment of this invention Structure explanatory drawing of the receiving pin unit used for the board | substrate receiving apparatus of one embodiment of this invention Explanatory drawing of the application example of the board | substrate receiving apparatus of one embodiment of this invention Explanatory drawing of the application example of the board | substrate receiving apparatus of one embodiment of this invention

Explanation of symbols

7 Substrate receiving portion 10 Substrate 31 Base plate with hole 31a Pin hole 32, 32A Lower receiving pin module 33 Single lower receiving pin 34 Second lower receiving pin 35 First lower receiving pin 37 Pin holding member 37d Position adjustment groove 38 Fixed Bolt 39 coupling member

Claims (3)

A substrate receiving device for receiving and supporting a substrate from the lower surface side in an electronic component mounting device,
A base portion in which a plurality of pin holes are formed in a regular arrangement, a first pin member whose upper end abuts against the substrate and supports the substrate, and a vertically attachable and detachable attachment to the pin hole. A second pin member, a detent means for restricting rotation of the second pin member around a vertical axis with respect to the pin hole, and a relative position in the horizontal direction between the first pin member and the second pin member. And a pin coupling means for coupling the substrate in an adjustable manner.   2. The substrate receiving apparatus according to claim 1, wherein the rotation preventing means restricts the rotation by connecting a pair of the second pins to each other.   The pin coupling means includes: a pin holding member that holds a lower end portion of the first pin; a coupling member that is coupled to the upper end portion of the second pin member; and the pin holding member that is horizontal to the coupling member. The substrate receiving apparatus according to claim 1, further comprising mounting means for variably mounting the relative position of the substrate.

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