JP2008177248A - Retaining ring for polishing head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a retainer ring for a polishing head which uniformly polishes the whole of a wafer, allows recycling and reduces an amount of waste resin to the minimum. <P>SOLUTION: The retainer ring includes a base portion 9A which is made of a highly rigid material in a ring shape and is supported on the polishing head side, and a resin portion 9B which has a plurality of resin blocks 9b attached at almost the same interval on the undersurface of the base portion 9A and forms the contact side to a polishing pad. Gaps between adjacent resin blocks 9b and the undersurface of the base portion 9A form slurry channels 18. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a retainer ring for a polishing head, and more particularly, to a retainer ring for a polishing head that can uniformly polish and recycle the entire wafer in chemical mechanical polishing (CMP). It is.

  The oxide film formed on the semiconductor wafer is subjected to lithography and etching to form a groove pattern corresponding to the wiring pattern, and a conductive film made of Cu or the like for filling the groove pattern is formed thereon, A process for forming a wiring pattern or the like by polishing and removing unnecessary portions of the conductive film by CMP is known. In such a process for forming a wiring pattern or the like on a wafer, it is important to uniformly polish the entire wafer to a portion close to the edge.

  As a related art related to this, for example, the following wafer polishing apparatus is known. This prior art is provided in the head body in a wafer polishing apparatus for polishing by pressing the wafer against a rotating polishing pad while surrounding the periphery of the wafer with a retainer ring attached to the head body in the polishing head. A retainer ring mounting portion to which the retainer ring is detachably mounted, a snap ring that is mounted on an outer periphery of a contact portion between the retainer ring mounting portion and the retainer ring and that fixes the retainer ring to the retainer ring mounting portion, and a retainer A snap ring cover provided on the outer periphery of the ring mounting portion and covering the outer periphery of the snap ring, the snap ring cover provided to be slidable upward from a position covering the outer periphery of the snap ring Has been.

Since the retainer ring is pressed against the polishing pad together with the wafer, it is worn by use. At this time, the snap ring cover is slid upward, the snap ring is pushed and widened, and the snap ring is removed from the contact portion. Thereby, a retainer ring is removed from a retainer ring attaching part. In this way, the retainer ring is attached to and detached from the retainer ring mounting portion with a single touch, and the retainer ring worn by use is periodically replaced (for example, see Patent Document 1).
Japanese Patent No. 3627143 (pages 2 to 5, FIGS. 2 and 4).

  Conventional retainer rings are generally made of resin alone. For this reason, it is weak in terms of rigidity, and its influence appears on the polished shape of the wafer, and depending on the polishing conditions, the entire wafer, particularly the portion close to the edge, may not be uniformly polished. In addition, the retainer ring made of resin is worn by use. At this time, in the prior art described in Patent Document 1, the worn retainer ring is removed from the retainer ring mounting portion and periodically replaced. However, the worn retainer ring cannot be regenerated and the removed retainer ring must be discarded. For this reason, the amount of resin for the retainer ring to be discarded is wasted.

Therefore, there is a technical problem to be solved in order to polish the entire wafer uniformly, to enable recycling, and to minimize the amount of resin to be discarded, and the present invention solves this problem. Objective.

  The present invention has been proposed in order to achieve the above-mentioned object, and the invention according to claim 1, when the wafer held by the polishing head is pressed against the rotating polishing pad and the slurry is supplied for polishing. A retainer ring for a polishing head which is supported by the polishing head and surrounds the periphery of the wafer while being in contact with the polishing pad, a base portion which is formed in a ring shape with a high rigidity material and is supported on the polishing head side, and a plurality of base portions The resin block is mounted on the lower surface of the base portion at substantially the same interval and has a resin portion that is in contact with the polishing pad, and the slurry is formed between adjacent resin blocks and the lower surface of the base portion. A retainer ring for a polishing head formed with a flow path is provided.

  According to this configuration, since the base portion is formed of a high-rigidity material, the overall rigidity is increased, and the holding property for appropriately holding the periphery of the wafer is enhanced. In addition to this, a large number of slurry flow paths are formed at appropriate intervals in the resin portion, so that the supplied slurry can easily reach the entire wafer. As a result, the entire wafer can be uniformly polished. In addition, since the contact side to the polishing pad is formed of the resin portion, generation of metal fine particles and the like which are problematic in the wafer process is prevented, and further, damage to the wafer due to contact is suppressed.

  According to a second aspect of the present invention, a plurality of concave portions are formed on the lower surface of the base portion, and the resin block is fitted into the plurality of concave portions and bonded, welded, or screwed to the lower surface of the base portion. Provided is a retainer ring for a polishing head that is mounted.

  According to this configuration, each resin block is fitted and fixed in each recess, whereby the fixing position of each resin block is positioned at a predetermined position, and the slurry is placed at a predetermined interval around the entire circumference of the ring-shaped base portion. The flow path is formed. Since the circumferential force received by the friction with the polishing pad when the polishing head rotates is received by the fitting portion in the recess, the mounting strength of each resin block on the base portion is maintained high.

  According to a third aspect of the present invention, a plurality of cylindrical concave portions are formed on the lower surface of the base portion, and a columnar convex portion corresponding to the cylindrical concave portion is formed on each of the resin blocks. Provided is a retainer ring for a polishing head in which the plurality of resin blocks are mounted on the lower surface of the base portion by being press-fitted into and fitted into cylindrical recesses.

  According to this configuration, the fixing position of each resin block is positioned at a predetermined position by press-fitting and fitting the columnar convex portions on the resin block side into the cylindrical concave portions in the base portion. The mounting force of each resin block on the base part is received by the fitting force between the columnar convex part and the cylindrical concave part in the circumferential direction that each resin block receives by friction with the polishing pad during operation when the polishing head rotates. Is kept high.

  According to a fourth aspect of the present invention, a plurality of dovetail groove portions are formed at required positions on the lower surface of the base portion, and the plurality of resin blocks are formed by integral molding of resin using a mold. Provided is a retainer ring for a polishing head, which is molded on the lower surface of the formed base portion, and the plurality of resin blocks are mounted on the lower surface of the base portion.

According to this configuration, the formation of the plurality of resin blocks on the lower surface of the base portion is performed by integral molding of the resin using the mold, thereby reducing the manufacturing cost. The circumferential force that each resin block receives due to friction with the polishing pad during operation when the polishing head rotates is received mainly by the resin molding part against the dovetail groove part formed on the lower surface of the base part. The mounting strength of each resin block to the part is maintained high.

  According to a fifth aspect of the present invention, the plurality of resin blocks, in which the base portion is provided with an intake hole communicating with the lower surface thereof at a required position and temporarily fixed to the lower surface of the base portion by appropriate temporary fixing means, are provided in the intake hole. A retainer ring for a polishing head is provided in which the plurality of resin blocks are mounted on the lower surface of the base portion by suction and fixing to the lower surface of the base portion.

  According to this configuration, each resin block is temporarily fixed to the lower surface of the base portion by using a temporary fixing means such as a screw, and each vacuum block is used to suck and hold the wafer on the polishing head. Each resin block is fixed to the lower surface of the base portion by sucking the resin block. At this time, the contact surface to the polishing pad in each resin block is substantially flush and flattened, and is adsorbed and fixed in a predetermined mounting manner.

  According to the sixth aspect of the present invention, when the wafer held by the polishing head is pressed against the rotating polishing pad and the slurry is supplied and polished, the wafer is supported by the polishing head and in contact with the polishing pad. In a retainer ring for a polishing head that surrounds the periphery, a portion corresponding to a base formed integrally with a retainer ring holder provided in the polishing head in a ring shape with a highly rigid material, and a plurality of resin blocks are portions corresponding to the base And a resin portion which is mounted on the lower surface of the base plate at substantially the same interval and serves as a contact side to the polishing pad, and the slurry flow path is formed between the adjacent resin blocks and the lower surface of the portion corresponding to the base portion. A retainer ring for a polishing head is provided.

  According to this configuration, since the portion corresponding to the base portion is formed of a highly rigid material integrally with the retainer ring holder, the overall rigidity is increased, and the holding property for appropriately holding the periphery of the wafer is enhanced. In addition to this, a large number of slurry flow paths are formed at appropriate intervals in the resin portion, so that the supplied slurry can easily reach the entire wafer. As a result, the entire wafer can be uniformly polished. In addition, since the contact side to the polishing pad is formed of the resin portion, generation of metal fine particles and the like which are problematic in the wafer process is prevented, and further, damage to the wafer due to contact is suppressed.

  According to a seventh aspect of the present invention, a plurality of concave portions are formed on the lower surface of the base portion corresponding portion, and the resin block is fitted into the plurality of concave portions and bonded, welded, or screwed to correspond to the base portion. A retainer ring for a polishing head is provided which is attached to the lower surface of the part.

  According to this structure, the fixing position of each resin block is positioned at a predetermined position by fitting and fixing each resin block in each recess. Since the circumferential force received by the friction with the polishing pad when the polishing head rotates is received by the fitting portion in the recess, the mounting strength of each resin block on the portion corresponding to the base portion is maintained high. .

  According to an eighth aspect of the present invention, a plurality of cylindrical recesses are formed on the lower surface of the portion corresponding to the base portion, and a columnar projection corresponding to the cylindrical recess is formed on each of the resin blocks. A retainer ring for a polishing head is provided in which the plurality of resin blocks are mounted on the lower surface of the portion corresponding to the base portion by press-fitting each into the cylindrical recess.

According to this configuration, the fixing position of each resin block is positioned at a predetermined position by press-fitting and fitting the columnar convex portion on each resin block side into each cylindrical concave portion in the portion corresponding to the base portion. The circumferential force that each resin block receives due to friction with the polishing pad during operation when the polishing head rotates is received by the fitting portion between the columnar convex portion and the cylindrical concave portion, so that each resin block has a portion corresponding to the base portion. High mounting strength is maintained.

  The invention according to claim 9 is the polishing head in which the elastic sheet stretched on the upper surface side of the wafer inside the retainer ring is sandwiched between the portion corresponding to the base portion and the resin portion. Provide retainer rings for

  According to this structure, the base portion equivalent portion is formed integrally with the retainer ring holder, so that the elastic sheet is sandwiched between the base portion equivalent portion and the resin portion, and the inner side of the retainer ring. Is stretched.

  According to a tenth aspect of the present invention, when polishing a wafer held by a polishing head against a rotating polishing pad, the polishing is supported by the polishing head and surrounds the periphery of the wafer while being in contact with the polishing pad. In the head retainer ring, a base portion formed in a ring shape with a high-rigidity material and supported on the polishing head side, and a plurality of resin blocks are mounted on the lower surface of the base portion at substantially the same interval, and the polishing pad A polishing head retainer ring is provided which includes a resin portion on a contact side of the base portion, and the resin portion is configured to be exchangeable by releasing the mounting state with respect to the lower surface of the base portion.

  According to this configuration, when the resin part is worn due to use, it is possible to recycle the base part only by exchanging only the resin part, and the amount of resin to be discarded is reduced as much as possible only in the lower half of the retainer ring. It can be suppressed.

  According to an eleventh aspect of the present invention, an extrusion hole for extruding the resin portion and removing it from the lower surface of the base portion is opened in advance in the base portion, and the mounting state of the resin portion on the lower surface of the base portion is determined. When releasing, there is provided a polishing head retainer ring configured such that the resin part is removed from the lower surface of the base part through the extrusion hole by a rod-like body.

  According to this configuration, when the resin portion is worn by use, the resin portion is easily and efficiently removed from the lower surface of the base portion by inserting the rod-like body into the extrusion hole and pushing out each resin block. This removal method is particularly effective when each resin block is mounted on the lower surface of the base portion by means such as press fitting or adhesion.

  According to a twelfth aspect of the present invention, the resin block is slid by applying a force to the resin block in a direction opposite to the direction of the force applied to the resin block during normal operation in which the polishing head rotates. It is configured to be removable from the lower surface of the base portion, and when releasing the mounting state of the resin portion with respect to the lower surface of the base portion, a force in the reverse direction is applied to each resin block so that the resin block is attached to the base portion. A retainer ring for a polishing head configured to be detached from the lower surface of the portion is provided.

  According to this configuration, a force from the inside to the outside of the ring-shaped retainer ring is applied to each resin block during normal operation. Each resin block is configured so that it does not come off from the bottom surface of the base part due to the force from the inside to the outside, and on the contrary, it can be slid and removed when a force from the outside to the inside is applied. ing. When the resin part is worn by use, each resin block is efficiently removed from the lower surface of the base part by applying a force from the outside to the inside. This removal method is particularly effective when the resin portion is mounted on the lower surface of the base portion by integral molding of the resin.

According to a thirteenth aspect of the present invention, a lock member that locks the state in which each resin block is mounted on the lower surface of the base portion is extended from the base portion to the resin portion side, and the lower surface of the base portion is When releasing the mounting state of the resin portion, each resin block by the lock member is released.

There is provided a polishing head retainer ring configured to release a lock state and remove each resin block from the lower surface of the base portion.

  According to this configuration, each resin block is normally locked to the lower surface of the base portion by the lock member. When the resin part is worn by use, each resin block is easily and efficiently removed from the lower surface of the base part by releasing the locked state of each resin block by the lock member.

  According to a fourteenth aspect of the present invention, the high-rigidity material is a metal or ceramic or a high-rigidity engineering plastic, and the resin material is an engineering plastic containing PPS (Polyphenylene Sulfide Polyphenylene Sulfide) or PEEK (Polyetheretherketone Polyether Ether Ketone). A retainer ring for a polishing head is provided.

  According to this configuration, since the base portion and the portion corresponding to the base portion are formed of a high-rigidity material made of metal, ceramic, or high-rigidity engineering plastic, the overall rigidity is sufficiently high. In addition, since each resin block that contacts the polishing pad is formed of engineering plastic, wear can be suppressed and reliability can be improved.

  The invention according to claim 1 is a polishing pad in which a base portion formed in a ring shape with a high rigidity material and supported on the polishing head side, and a plurality of resin blocks are mounted on the lower surface of the base portion with substantially the same interval. Since the slurry flow path is formed between the adjacent resin blocks and the lower surface of the base portion, the retainability for appropriately holding the periphery of the wafer is improved. The slurry supplied together with the slurry easily spreads over the entire wafer, and the entire wafer can be uniformly polished. Further, it is possible to prevent the generation of metal fine particles and the like, which are problems in the wafer process, and to further suppress the occurrence of wafer damage due to contact.

  According to a second aspect of the present invention, a plurality of concave portions are formed on the lower surface of the base portion, and the resin block is fitted into the plurality of concave portions and bonded, welded, or screwed to the lower surface of the base portion. Since it is mounted, the fixing position of each resin block can be positioned at a predetermined position. In addition, there is an advantage that the mounting strength of each resin block to the base portion can be maintained high by receiving the circumferential force received by the friction with the polishing pad at the time of operation at the portion fitted in the recess.

  According to a third aspect of the present invention, a plurality of cylindrical concave portions are formed on the lower surface of the base portion, and a columnar convex portion corresponding to the cylindrical concave portion is formed on each of the resin blocks. Since the plurality of resin blocks are mounted on the lower surface of the base portion by being press-fitted into and fitted into the cylindrical recesses, the fixing position of each resin block can be positioned at a predetermined position. Also, the mounting strength of each resin block with respect to the base part can be kept high by receiving the circumferential force that each resin block receives by friction with the polishing pad during operation at the fitting part between the columnar convex part and the cylindrical concave part. There is an advantage that can be.

According to a fourth aspect of the present invention, a plurality of dovetail groove portions are formed at required positions on the lower surface of the base portion, and the plurality of resin blocks are formed by integral molding of resin using a mold. Since the plurality of resin blocks are mounted on the lower surface of the base portion by molding on the lower surface of the formed base portion, the manufacturing cost is reduced by forming the plurality of resin blocks and mounting them by integral molding of the resin. be able to. Also, during operation, each resin block is subjected to friction with the polishing pad.

The circumferential force is received mainly by the resin molding portion for the dovetail groove portion, so that there is an advantage that the mounting strength of each resin block to the base portion can be maintained high.

  According to a fifth aspect of the present invention, the plurality of resin blocks, in which the base portion is provided with an intake hole communicating with the lower surface thereof at a required position and temporarily fixed to the lower surface of the base portion by appropriate temporary fixing means, are provided in the intake hole. Since the plurality of resin blocks are mounted on the lower surface of the base portion by suction and fixing to the lower surface of the base portion through each of the resin blocks, a vacuum or the like used when the wafer is sucked and held by the polishing head is used. Can be adsorbed and fixed to the lower surface of the base portion with a predetermined mounting manner, and thus there is an advantage that easy mounting of each resin block to the base portion can be obtained.

  According to a sixth aspect of the present invention, there is provided a base portion equivalent portion integrally formed with a retainer ring holder provided in the polishing head in a ring shape with a highly rigid material, and a plurality of resin blocks are substantially disposed on the lower surface of the base portion equivalent portion. Since a resin portion that is mounted with the same interval and serves as a contact side with the polishing pad is provided, and a slurry flow path is formed between the adjacent resin blocks and the lower surface of the portion corresponding to the base portion. By forming the portion-corresponding portion integrally with the retainer ring holder from a highly rigid material, it is possible to obtain the easy configuration of the base portion-corresponding portion and to omit the work of assembling the retainer ring to the retainer ring holder. Further, the retainability for appropriately holding the periphery of the wafer is enhanced, and the supplied slurry is easily spread over the entire wafer, so that the entire wafer can be uniformly polished. Furthermore, there is an advantage that the generation of metal fine particles and the like which are problems in the wafer process can be prevented and the occurrence of wafer damage due to contact can be suppressed.

  According to a seventh aspect of the present invention, a plurality of concave portions are formed on the lower surface of the base portion corresponding portion, and the resin block is fitted into the plurality of concave portions and bonded, welded, or screwed to correspond to the base portion. Since it was mounted on the lower surface of the part, the fixing position of each resin block can be positioned at a predetermined position. In addition, by receiving the circumferential force that each resin block receives by friction with the polishing pad during operation at the fitting portion in the recess, there is an advantage that the mounting strength of each resin block on the base equivalent portion can be maintained high. is there.

  According to an eighth aspect of the present invention, a plurality of cylindrical recesses are formed on the lower surface of the portion corresponding to the base portion, and a columnar projection corresponding to the cylindrical recess is formed on each of the resin blocks. Since the plurality of resin blocks are mounted on the lower surface of the portion corresponding to the base portion by press-fitting each into the cylindrical recess, the fixing position of each resin block can be positioned at a predetermined position. In addition, the mounting strength of each resin block to the base equivalent part is maintained high by receiving the circumferential force that each resin block receives from friction with the polishing pad during operation at the fitting part between the columnar convex part and the cylindrical concave part. There is an advantage that you can.

  According to the ninth aspect of the present invention, the elastic sheet stretched on the upper surface side of the wafer inside the retainer ring is sandwiched between the peripheral portion of the elastic sheet and the resin portion. Even when the base portion equivalent part is formed integrally with the retainer ring holder, there is an advantage that an elastic sheet necessary for the function of the polishing head can be stretched inside the retainer ring.

The invention according to claim 10 is a polishing pad in which a base portion formed in a ring shape with a high rigidity material and supported on the polishing head side and a plurality of resin blocks are mounted on the lower surface of the base portion with substantially the same interval. And the resin part is configured to be exchangeable by releasing the mounting state on the lower surface of the base part, so that the base part can be recycled and the amount of resin to be discarded can be reduced. There is an advantage that it can be suppressed as much as possible.

  According to an eleventh aspect of the present invention, an extrusion hole for extruding the resin portion and removing it from the lower surface of the base portion is opened in advance in the base portion, and the mounting state of the resin portion on the lower surface of the base portion is determined. When releasing, since the resin portion is removed from the lower surface of the base portion through the extrusion hole by a rod-shaped body, when replacing only the resin portion, the rod-shaped body is inserted into the extrusion hole and each resin is inserted. By extruding the block, there is an advantage that the resin portion can be easily and efficiently removed from the lower surface of the base portion.

  According to a twelfth aspect of the present invention, the resin block is slid by applying a force to the resin block in a direction opposite to the direction of the force applied to the resin block during normal operation in which the polishing head rotates. It is configured to be removable from the lower surface of the base portion, and when releasing the mounting state of the resin portion with respect to the lower surface of the base portion, a force in the reverse direction is applied to each resin block so that the resin block is attached to the base portion. Since it is configured to be removed from the bottom surface of the portion, when only the resin portion is replaced, each resin block can be efficiently removed from the bottom surface of the base portion by applying a force from the outside to the inside on each resin block. There is an advantage.

  According to a thirteenth aspect of the present invention, a lock member that locks the state in which each resin block is mounted on the lower surface of the base portion is extended from the base portion to the resin portion side, and the lower surface of the base portion is When releasing the mounting state of the resin part, the resin member is unlocked by the lock member and the resin block is removed from the lower surface of the base part. By releasing the lock state of each resin block by the lock member, there is an advantage that each resin block can be easily and efficiently removed from the lower surface of the base portion.

  In the invention described in claim 14, the high-rigidity material is a metal or ceramic or a high-rigidity engineering plastic, and the resin material is an engineering plastic containing PPS (Polyphenylene Sulfide Polyphenylene Sulfide) or PEEK (Polyetheretherketone Polyether Ether Ketone). As a result, the overall rigidity is sufficiently high, and the retainability for holding the periphery of the wafer can be sufficiently increased. In addition, there is an advantage that wear of the resin portion due to use can be suppressed and reliability of the retainer ring can be increased.

  In order to achieve the purpose of uniformly polishing the entire wafer, enabling recycling and minimizing the amount of resin to be discarded, the wafer held by the polishing head is pressed against a rotating polishing pad and slurry is supplied. In the polishing head retainer ring that is supported by the polishing head and surrounds the periphery of the wafer while being in contact with the polishing pad, the ring is formed of a highly rigid material and is supported on the polishing head side. And a plurality of resin blocks mounted on the lower surface of the base portion at substantially the same interval, and a resin portion serving as a contact side to the polishing pad, and between each adjacent resin block and the base portion The lower surface of the slurry forms a flow path for the slurry, and the resin portion releases the mounting state on the lower surface of the base portion. It was achieved by interchangeably constituting.

  Embodiment 1 of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a perspective view of a chemical mechanical polishing apparatus to which a polishing head retainer ring is attached, and FIG. 2 is an enlarged longitudinal sectional view of the polishing head.

  First, the polishing head retainer ring according to the present embodiment will be described from the configuration of a chemical mechanical polishing apparatus to which the polishing head retainer ring is attached.

In FIG. 1, the chemical mechanical polishing apparatus 1 mainly includes a platen 2 and a polishing head 3. The platen 2 is formed in a disc shape, and a rotary shaft 4 is connected to the center of the lower surface thereof. The platen 2 rotates in the direction of arrow A by driving a motor 5. A polishing pad 6 is attached to the upper surface of the platen 2, and a slurry that is a mixture of an abrasive and a chemical is supplied onto the polishing pad 6 from a nozzle (not shown).

  As shown in FIG. 2, the polishing head 3 is mainly composed of a head body 7, a carrier 8, a retainer ring 9, a retainer ring pressing means 10, an elastic sheet 11, a carrier pressing means 16, and control means such as air. .

  The head body 7 is formed in a disk shape, and a rotary shaft 12 (see FIG. 1) is connected to the center of the upper surface thereof. The head body 7 is attached to the rotary shaft 12 and is driven by a motor (not shown) to rotate in the direction of arrow B in FIG.

  The carrier 8 is formed in a disc shape, and is disposed in the center of the head body 7. A dry plate 13 is provided between the center of the upper surface of the carrier 8 and the lower center of the head body 7, and rotation is transmitted from the head body 7 via the pins 14 and 14.

  An operating transformer main body 15a is fixed between the center lower part of the dry plate 13 and the center upper part of the carrier 8, and the core 15b of the operating transformer 15 is fixed to the center upper part of the carrier 8 and is not shown. A polishing state signal of a conductive film (not shown) made of Cu or the like formed on the wafer W (on the lower side in FIG. 2) connected to the control unit is output to the control unit.

  A carrier pressing member 16a is provided at the peripheral edge of the upper surface of the carrier 8, and a pressing force is transmitted from the carrier pressing means 16 to the carrier 8 through the carrier pressing member 16a.

  An air outlet 19 for injecting air from the air float line 17 to the elastic sheet 11 is provided on the lower surface of the carrier 8. The air float line 17 is connected to an air supply pump 21 which is an air supply source through an air filter 20 and an automatic opening / closing valve V1. Air is blown out from the air outlet 19 by switching the automatic opening / closing valve V1.

  A hole 22 is formed in the lower surface of the carrier 8 for blowing out vacuum and, if necessary, DIW (pure water) or air. The suction of the air is performed by driving the vacuum pump 23, and an automatic opening / closing valve V2 is provided in the vacuum line 24. By switching the automatic opening / closing valve V2, vacuum and DIW are fed via the vacuum line 24. Is done.

  Air supply from the air float line 17, vacuum action from the vacuum line 24, DIW supply and the like are executed by command signals from the control unit.

  The carrier pressing means 16 is disposed at the peripheral edge of the central portion of the lower surface of the head main body 7 and applies a pressing force to the carrier pressing member 16a, thereby transmitting the pressing force to the carrier 8 coupled thereto. The carrier pressing means 16 is preferably composed of a rubber sheet airbag 25 that expands and contracts by air intake and exhaust. The air bag 25 is connected to an air supply mechanism (not shown) for supplying air.

The retainer ring 9 is formed in a ring shape and disposed on the outer periphery of the carrier 8. This

The retainer ring 9 is attached to a retainer ring holder 27 provided in the polishing head 3, and the elastic sheet 11 is stretched on the inner periphery thereof.

  The elastic sheet 11 is formed in a circular shape, and a plurality of holes 22 are opened. The elastic sheet 11 is stretched on the inner side of the retainer ring 9 by sandwiching the peripheral portion between the retainer ring 9 and the retainer ring holder 27.

  An air chamber 29 is formed between the carrier 8 and the elastic sheet 11 below the carrier 8 on which the elastic sheet 11 is stretched. The wafer W on which the conductive film is formed is pressed against the carrier 8 through the air chamber 29. The retainer ring holder 27 is attached to an attachment member 30 formed in a ring shape via a snap ring 31. A retainer ring pressing member 10 a is connected to the mounting member 30. The retainer ring 9 is transmitted with the pressing force from the retainer ring pressing means 10 via the retainer ring pressing member 10a.

  The retainer ring pressing means 10 is disposed on the outer peripheral portion of the lower surface of the head body 7 and applies a pressing force to the retainer ring pressing member 10 a to press the retainer ring 9 coupled thereto against the polishing pad 6.

  In the chemical mechanical polishing apparatus 1, the standby conductive film is placed on a non-polished wafer W at a predetermined position by a moving mechanism (not shown) of the polishing head 3. Next, the vacuum line 24 of the polishing head 3 is operated, and the air chamber 29 on the lower surface of the elastic sheet 11 is evacuated through the vacuum port 19a and the hole 22 (vacuum hole), thereby sucking and holding the wafer W, By the moving mechanism, the polishing head 3 holding the wafer W by suction is carried onto the platen 2, and the wafer W is placed on the platen 2 so that the conductive film is in contact with the polishing pad 6.

  Next, the operation of the vacuum line 24 is released, and air is supplied to the airbag 25 from a pump (not shown) to inflate the airbag 25. At the same time, air is supplied to the air chamber 29 from the air outlet 19 provided in the carrier 8. Thereby, the internal pressure of the air chamber 29 becomes high.

  Due to the expansion of the airbag 25, the conductive film and the retainer ring 9 on the wafer W are pressed against the polishing pad 6 with a predetermined pressure. In this state, the platen 2 is rotated in the direction of arrow A in FIG. 1 and the polishing head 3 is rotated in the direction of arrow B in FIG. Then, slurry is supplied from a nozzle (not shown) onto the rotating polishing pad 6, and the conductive film on the upper portion of the wafer W is polished while surrounding the periphery of the wafer W with the retainer ring 9.

  Next, the structure of the retainer ring for polishing head according to the present embodiment, and the details of the operation and effect will be described with reference to FIGS. 3A and 3B are views showing the retainer ring, where FIG. 3A is a bottom view, FIG. 3B is a partially enlarged side view of FIG. 1A, and FIG. 3C is an enlarged cross-sectional view taken along line XX of FIG. It is.

The retainer ring 9 according to the present embodiment includes a ring-shaped base portion 9 </ b> A supported on the polishing head 3 side via the retainer ring holder 27 and a resin portion 9 </ b> B on the contact side with the polishing pad 6. It has a layer structure. The resin portion 9B is formed by mounting a plurality of resin blocks 9b,... On the lower surface of the base portion 9A with substantially the same interval, and between the adjacent resin blocks 9b and the base portion 9A. A plurality of slurry flow paths 18,... Are constituted by grooves formed on the lower surface.

The base portion 9A is made of a highly rigid material.

Metals such as minium or ceramics or engineering plastics with high rigidity are used. As the resin material forming the resin block 9b, an engineering plastic containing PPS (Polyphenylene Sulfide Polyphenylene Sulfide) and PEEK (Polyetheretherketone Polyether Ether Ketone) is used.

  The retainer ring 9 has a sufficiently high overall rigidity because the base portion 9A is formed of a high-rigidity material, so that the retainability for appropriately holding the periphery of the wafer W can be sufficiently increased. In addition to this, a large number of slurry flow paths 18 are formed in the resin portion 9B with appropriate intervals, so that the slurry supplied onto the polishing pad 6 during operation can easily spread over the entire wafer W. As a result, the entire wafer W can be uniformly polished to a portion close to the edge.

  In addition, since each resin block 9b is formed of a resin material made of engineering plastic, it is possible to prevent generation of metal fine particles and the like that are problematic in the process of the wafer W, and to suppress occurrence of damage to the wafer W due to contact. Can do. Furthermore, wear of the resin block 9b due to use can be suppressed to a low level and the reliability of the retainer ring 9 can be increased.

  Next, first to fourth examples of how the resin block 9b is attached to the lower surface of the base portion 9A will be described in order.

  (A) Each resin block is fitted into the concave portion of the base portion and bonded, welded or screwed. 4A and 4B are views showing a first example of the mounting mode in the present embodiment, where FIG. 4A is a partially enlarged side view similar to FIG. 3B, and FIG. 4B is an enlarged cross-section similar to FIG. FIG.

  In FIG. 4A, a recess 32 is formed at a position where each resin block 9b is mounted on the lower surface of the base portion 9A. Each resin block 9b is fitted into each recess 32 and bonded, welded, or screwed, so that a plurality of resin blocks 9b,... Are mounted on the lower surface of the base portion 9A, thereby forming the resin portion 9B.

  In the first example, each resin block 9b is fitted into each recess 32 and fixed, whereby the fixing position of each resin block 9b can be positioned at a predetermined position. As a result, the slurry flow path 18 can be formed at a predetermined interval on the entire circumference of the lower surface of the ring-shaped base portion 9A. By attaching the circumferential force received by the friction between the resin block 9b and the polishing pad 6 during the rotation of the polishing head 3 at the portion fitted into the recess 32, the mounting strength of the resin block 9b on the base portion 9A is increased. Can be maintained.

  (B) The columnar convex part of the resin block is press-fitted into the cylindrical concave part of the base part. FIG. 5 is a view showing a second example of the mounting mode in the present embodiment, where (a) is a partially enlarged side view similar to FIG. 3 (b), and (b) is an enlarged cross section similar to FIG. 3 (c). FIG.

  5 (a) and 5 (b), a plurality of cylindrical recesses 33a,... Having a cylindrical or rectangular tube shape are formed on the lower surface of the base portion 9A. On the other hand, each resin block 9b is formed with a columnar or prismatic columnar convex portion 33b corresponding to the cylindrical concave portion 33a. A plurality of resin blocks 9b,... Are mounted on the lower surface of the base portion 9A by pressing and fitting the columnar convex portions 33b into the cylindrical concave portions 33a, thereby forming the resin portion 9B.

In the second example, the columnar convex portions 33b on the resin block 9b side are respectively press-fitted and fitted into the cylindrical concave portions 33a in the base portion 9A, thereby positioning the fixed positions of the resin blocks 9b at predetermined positions. be able to. When the polishing head 3 rotates, each resin block 9b

By receiving the circumferential force received by friction with the polishing pad 6 at the fitting portion between the columnar convex portion 33b and the cylindrical concave portion 33a, the mounting strength of each resin block 9b on the base portion 9A can be maintained high. .

  (C) A plurality of resin blocks are integrally molded on the bottom surface of the base portion. 6A and 6B are views showing a third example of the mounting mode in this embodiment, where FIG. 6A is a partially enlarged side view similar to FIG. 3B, and FIG. 6B is an enlarged cross-section similar to FIG. FIG.

  In FIG. 6A, dovetail-shaped groove portions 34 are formed at positions where the respective resin blocks 9b are mounted on the lower surface of the base portion 9A. The plurality of resin blocks 9b,... Are formed on the lower surface of the base portion 9A in which the plurality of grooves 34,. The resin portion 9B is configured by being mounted on the lower surface of the portion 9A.

  In the third example, the formation and mounting of the plurality of resin blocks 9b,... On the lower surface of the base portion 9A is performed by integral molding of the resin, so that the manufacturing cost can be reduced. Each resin block 9b receives a circumferential force that is received by friction with the polishing pad 6 at the time of rotation of the polishing head 3 mainly by a resin molding portion for the dovetail groove portion 34, whereby each resin for the base portion 9A is received. The mounting strength of the block 9b can be kept high.

  (D) The resin block is fixed to the lower surface of the base by suction. FIG. 7 is a view showing a fourth example of the mounting mode in the present embodiment, where (a) is a partially enlarged side view similar to FIG. 3 (b), and (b) is an enlarged cross section similar to FIG. 3 (c). FIG.

  7 (a) and 7 (b), intake holes 36 communicating with the lower surface of the base portion 9A are opened at positions where the resin blocks 9b are mounted on the base portion 9A. Each resin block 9b is temporarily fixed to the lower surface of the base portion using temporary bonding or a temporary fixing means such as a screw, and in this state, each resin block 9b is sucked through each intake hole, whereby a plurality of resin blocks 9b are obtained. ,... Are mounted on the lower surface of the base portion 9A to form a resin portion 9B.

  At this time, the contact surface of each resin block 9b to the polishing pad 6 is flattened so as to be substantially flush with each other, and is fixed by suction with a predetermined mounting manner. As the suction means, a vacuum or the like used when the wafer W is sucked and held on the polishing head 3 is used.

  In the fourth example, each resin block 9b can be adsorbed and fixed to the lower surface of the base portion 9A with a predetermined mounting manner using a vacuum or the like used when adsorbing and holding the wafer W on the polishing head 3. Therefore, each resin block 9b can be easily attached to the base portion 9A.

  Details of the structure, operation, and effect of the polishing head retainer ring according to the second embodiment of the present invention will be described with reference to FIGS. FIG. 8 is a view showing a retainer ring in the present embodiment, in which (a) is a partially enlarged side view similar to FIG. 3 (b), and (b) is an enlarged cross-sectional view similar to FIG. 3 (c).

The retainer ring 9 according to this embodiment includes a base portion equivalent portion 9 </ b> C formed in a ring shape integrally with the retainer ring holder 27, and a resin portion 9 </ b> B on the contact side with the polishing pad 6. The resin portion 9B is formed by mounting a plurality of resin blocks 9b,... On the lower surface of the base portion equivalent portion 9C with substantially the same interval, and between the adjacent resin blocks 9b and the base portion. In the groove formed on the lower surface of the equivalent portion 9C

Thus, a plurality of slurry flow paths 18 are formed.

  The base portion equivalent portion 9C is made of a high-rigidity material similar to that of the first embodiment, and the resin material forming the resin block 9b is an engineering including PPS and PEEK similar to those of the first embodiment. Plastic is used.

  As described above, the retainer ring 9 according to the present embodiment has the base portion corresponding portion 9C formed integrally with the retainer ring holder 27, so that the peripheral portion of the elastic sheet 11 is in contact with the lower surface of the base portion corresponding portion 9C and the resin. It is sandwiched between the part 9B.

  In the retainer ring 9, the base portion equivalent portion 9 </ b> C is formed of a highly rigid material integrally with the retainer ring holder 27, whereby the easy configuration of the base portion equivalent portion 9 </ b> C can be obtained and the retainer ring with respect to the retainer ring holder 27 can be obtained. 9 assembly work can be omitted.

  In addition, the retainability for appropriately holding the periphery of the wafer W is enhanced, and the supplied slurry is easily spread over the entire wafer W, so that the entire wafer W can be uniformly polished to a portion close to the edge. Furthermore, it is possible to prevent the generation of metal fine particles and the like that are problematic in the process of the wafer W, and to suppress the occurrence of damage to the wafer W due to contact.

  Further, even when the base portion equivalent portion 9 </ b> C is formed integrally with the retainer ring holder 27, the elastic sheet 11 necessary for the function of the polishing head 3 can be stretched inside the retainer ring 9.

  Next, a first example and a second example of the manner of mounting the resin block 9b on the lower surface of the base portion equivalent portion 9C will be described in order.

  (A) Each resin block is fitted into the concave portion corresponding to the base portion and bonded, welded or screwed. FIG. 9 is a view showing a first example of the mounting mode in the present embodiment, where (a) is a partially enlarged side view similar to FIG. 3 (b), and (b) is an enlarged cross section similar to FIG. 3 (c). FIG.

  In FIG. 9A, a recess 37 is formed at a position where each resin block 9b is mounted on the lower surface of the base equivalent portion 9C. Each resin block 9b is fitted into each recess 37 and bonded, welded, or screwed to attach the plurality of resin blocks 9b,... To the lower surface of the base portion corresponding portion 9C, thereby forming the resin portion 9B. . A peripheral portion of the elastic sheet 11 is sandwiched between the lower surface of the base portion equivalent portion 9C and the resin portion 9B.

  In the first example, each resin block 9b is fitted into each recess 37 and fixed, whereby the fixing position of each resin block 9b can be positioned at a predetermined position. As a result, the slurry flow path 18 can be formed at a predetermined interval on the entire circumference of the lower surface of the base portion equivalent portion 9C. The mounting strength of each resin block 9b with respect to the base portion equivalent portion 9C is obtained by receiving the circumferential force received by the friction with the polishing pad 6 by the resin block 9b during the rotation of the polishing head 3 at the fitting portion into the recess 37. Can be kept high.

  (B) The columnar convex part of the resin block is press-fitted into the cylindrical concave part of the base part. FIG. 10 is a view showing a second example of the mounting mode in the present embodiment, in which (a) is a partially enlarged side view similar to FIG. 3 (b), and (b) is an enlarged cross section similar to FIG. 3 (c). FIG.

10 (a) and 10 (b), the bottom surface of the base portion equivalent portion 9C has a cylindrical or rectangular tube shape.

A plurality of cylindrical recesses 33a are formed. On the other hand, each resin block 9b is formed with a columnar or prismatic columnar convex portion 33b corresponding to the cylindrical concave portion 33a. A plurality of resin blocks 9b,... Are mounted on the lower surface of the base portion corresponding portion 9C by press-fitting and fitting the columnar convex portions 33b into the cylindrical concave portions 33a, thereby forming a resin portion 9B. A peripheral portion of the elastic sheet 11 is sandwiched between the lower surface of the base portion equivalent portion 9C and the resin portion 9B.

  In the second example, the columnar convex portion 33b on the side of each resin block 9b is press-fitted and fitted into each cylindrical concave portion 33a in the base portion corresponding portion 9C, so that the fixing position of each resin block 9b is set to a predetermined position. Can be positioned. When the polishing head 3 rotates, the resin block 9b receives the circumferential force received by the friction with the polishing pad 6 at the fitting portion between the columnar convex portion 33b and the cylindrical concave portion 33a, whereby the base portion corresponding portion 9C. The mounting strength of each resin block 9b can be maintained high.

  Details of the structure, action, and effect of the polishing head retainer ring according to the third embodiment of the present invention will be described with reference to FIGS. In this embodiment, in the retainer ring 9 including the base portion 9A and the resin portion 9B shown in the first embodiment, the resin portion 9B is not attached to the lower surface of the base portion 9A, and the resin portion 9B is configured to be replaceable.

  When the resin part 9B is worn due to use, by replacing only the resin part 9B, the base part 9A can be recycled and the amount of resin to be discarded becomes only the lower half of the retainer ring 9 and can be suppressed as much as possible. .

  Next, a first example to a third example of how to release the resin part 9B from the lower surface of the base part 9A will be described in order.

  (A) Extrude holes for extruding and removing the resin part from the base part. 11A and 11B are views showing a first example of the removal mode in the present embodiment, in which FIG. 11A is a partially enlarged side view similar to FIG. 3B, and FIG. 11B is an enlarged cross-section similar to FIG. FIG.

  In FIG. 11B, an appropriate number of extrusion holes 38 for extruding the resin portion 9B and removing it from the lower surface of the base portion 9A are opened in advance in the base portion 9A. When releasing the mounting state of the resin portion 9B on the lower surface of the base portion 9A, a resin rod 9B is removed from the lower surface of the base portion 9A by inserting a rod-like body (not shown) into the extrusion hole 38 and pushing out each resin block 9b. It is.

  This removal method is particularly effective when the resin blocks 9b in Example 1 are mounted on the lower surface of the base portion 9B by means such as press fitting or adhesion. And when each resin block 9b is attached by means such as adhesion, removal becomes more effective if heating is appropriately applied before extrusion.

  In the first example, when the resin portion 9B is worn due to use, the resin portion 9B can be easily and efficiently removed from the lower surface of the base portion 9A by inserting a rod-like body into the extrusion hole 38 and pushing out each resin block 9b. Can be removed. As a result, the base portion 9A can be recycled and the amount of discarded resin is limited to the lower half of the retainer ring 9 and can be minimized.

(B) Remove the resin part by applying a force in a direction not normally applied to each resin block. FIG. 12 is a view showing a second example of the removal mode in this embodiment, and (a) is similar to FIG.

(B) is an enlarged sectional view similar to FIG. 3 (c).

  In FIG.12 (b), the force which goes outside from the inner side of the ring-shaped retainer ring 9 is applied to each resin block 9b at the time of normal operation. Each resin block 9b is latched by the outer latching portion 39 so as not to be detached from the lower surface of the base portion 9A by the force from the inside to the outside, and conversely, the force from the outside to the inside as shown in the figure. It is configured so that it can be slid and removed when applied.

  When releasing the mounting state of the resin portion 9B on the lower surface of the base portion 9A, each resin block 9b is removed from the lower surface of the base portion 9A by applying a force from the outer side to the inner side on each resin block 9b.

  This removal method is particularly effective when the resin part 9B is mounted on the lower surface of the base part 9B by integral molding of the resin in the first embodiment.

  In the second example, when the resin part 9B is worn by use, the resin part 9B can be efficiently removed from the lower surface of the base part 9A by applying a force from the outside to the inside to each resin block 9b. . As a result, similarly to the above, the base portion 9A can be recycled and the amount of resin discarded is only the lower half of the retainer ring 9 and can be suppressed as much as possible.

  (C) The resin part is removed by releasing the lock by the lock member. FIGS. 13A and 13B are views showing a third example of the removal mode in the present embodiment, in which FIG. 13A is a partially enlarged side view similar to FIG. 3B, and FIG. 13B is an enlarged cross-section similar to FIG. FIG. 4C is a diagram for explaining the removal operation.

  In FIGS. 13A and 13B, dovetail-shaped groove portions 34 are formed at positions where the resin blocks 9b are mounted on the lower surface of the base portion 9A. In addition, lock members 40 are detachably provided by tightening and tightening screws 41 at positions on the outer peripheral surface of the base portion 9A corresponding to positions where the resin blocks 9b are mounted.

  Each resin block 9b is inserted into the dovetail groove 34 and the front and rear (left and right in FIG. 13 (b)) of the resin block 9b are positioned at the outer peripheral surface positions of the inner hooking portion 42 and the base portion 9A. It is attached to the lower surface of the base portion 9A by being latched by a lock member 40 attached by tightening.

  When releasing the mounting state of the resin portion 9B on the lower surface of the base portion 9A, as shown in FIG. 13C, the screw 41 is tightened back to remove the lock member 40 (lock release), and the resin block 9b is attached to each resin block 9b. The retainer ring 9 is slid by applying a force from the inside to the outside. Thereby, each resin block 9b is removed from the lower surface of the base portion 9A.

  In the third example, when the resin portion 9B is worn by use, the lock member 40 is removed, and the lock state of each resin block 9b by the lock member 40 is released, whereby each resin block 9b is attached to the lower surface of the base portion 9A. Can be removed easily and efficiently. As a result, similarly to the above, the base portion 9A can be recycled, and the amount of resin discarded is only the lower half of the retainer ring 9 and can be suppressed as much as possible.

  The present invention can be variously modified without departing from the spirit of the present invention, and the present invention naturally extends to the modified ones.

The figure shows a retainer ring for a polishing head according to an embodiment of the present invention.
The perspective view of the chemical mechanical polishing apparatus to which the retainer ring for polishing heads was attached. FIG. 2 is an enlarged longitudinal sectional view of a polishing head in the chemical mechanical polishing apparatus of FIG. 1. It is a figure which shows the retainer ring in Example 1, (a) is a bottom view, (b) is a partial expanded side view, (c) is an expanded sectional view which follows the XX line of Fig. (A). It is a figure which shows the 1st example of the mounting | wearing aspect in Example 1, (a) is a partial expanded side view similar to FIG.3 (b), (b) is an expanded sectional view similar to FIG.3 (c). It is a figure which shows the 2nd example of the mounting aspect in Example 1, (a) is a partial expanded side view similar to FIG.3 (b), (b) is an expanded sectional view similar to FIG.3 (c). It is a figure which shows the 3rd example of the mounting | wearing aspect in Example 1, (a) is a partial expanded side view similar to FIG.3 (b), (b) is an expanded sectional view similar to FIG.3 (c). It is a figure which shows the 4th example of the mounting aspect in Example 1, (a) is a partial expanded side view similar to FIG.3 (b), (b) is an expanded sectional view similar to FIG.3 (c). It is a figure which shows the retainer ring in Example 2, (a) is a partial expanded side view similar to FIG.3 (b), (b) is an expanded sectional view similar to FIG.3 (c). It is a figure which shows the 1st example of the mounting aspect in Example 2, (a) is a partial expanded side view similar to FIG.3 (b), (b) is an expanded sectional view similar to FIG.3 (c). It is a figure which shows the 2nd example of the mounting aspect in Example 2, (a) is a partial expanded side view similar to FIG.3 (b), (b) is an expanded sectional view similar to FIG.3 (c). It is a figure which shows the 1st example of the removal aspect in Example 3, (a) is a partial expanded side view similar to FIG.3 (b), (b) is an expanded sectional view similar to FIG.3 (c). It is a figure which shows the 2nd example of the removal aspect in Example 3, (a) is a partial expanded side view similar to FIG.3 (b), (b) is an expanded sectional view similar to FIG.3 (c). It is a figure which shows the 3rd example of the removal aspect in Example 3, (a) is a partial expanded side view similar to FIG.3 (b), (b) is an expanded sectional view similar to FIG.3 (c), ( (c) is a figure for demonstrating removal operation | movement.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Chemical mechanical polishing apparatus 2 Platen 3 Polishing head 4 Rotating shaft 5 Motor 6 Polishing pad 7 Head main body 8 Carrier 9 Retainer ring 9A Base part 9B Resin part 9b Resin block 9C Base equivalent part 10 Retainer ring pressing means 11 Elastic sheet 12 Rotating shaft 13 Dry plate 14 Pin 15 Actuating transformer 16 Carrier pressing means 17 Air float line

18 Slurry flow path 19 Air outlet 20 Air filter 21 Air supply pump 22 Hole 23 Vacuum pump 24 Vacuum line 25 Air bag 27 Retainer ring holder 29 Air chamber 30 Mounting member 31 Snap ring 32 Recess 33a Cylindrical recess 33b Columnar protrusion 34 Groove 35 Mold 36 Air intake hole 37 Recess 38 Extrusion hole 39 Outer latch 40 Lock member 41 Screw 42 Inner latch W Wafer

Claims (14)

A retainer for a polishing head that is supported by the polishing head and surrounds the periphery of the wafer while being in contact with the polishing pad when the wafer held by the polishing head is pressed against a rotating polishing pad and supplied with slurry. In the ring,
A base portion formed in a ring shape with a high-rigidity material and supported on the polishing head side, and a plurality of resin blocks are mounted on the lower surface of the base portion with substantially the same interval to be a contact side to the polishing pad. A polishing head retainer ring comprising a resin portion and a flow path for the slurry formed between adjacent resin blocks and the lower surface of the base portion.   A plurality of recesses are formed on the lower surface of the base part, and the resin block is fitted to the plurality of recesses and attached to the lower surface of the base part by bonding, welding or screwing. The retainer ring for a polishing head according to claim 1.   A plurality of cylindrical concave portions are formed on the lower surface of the base portion, and columnar convex portions corresponding to the cylindrical concave portions are formed on the respective resin blocks, and the columnar convex portions are press-fitted into the cylindrical concave portions, respectively. The retainer ring for a polishing head according to claim 1, wherein the plurality of resin blocks are attached to a lower surface of the base portion by fitting.   A plurality of dovetail-shaped groove portions are formed at required positions on the lower surface of the base portion, and the plurality of resin blocks are formed on the lower surface of the base portion on which the plurality of groove portions are formed by integral molding of resin using a mold. The retainer ring for a polishing head according to claim 1, wherein the plurality of resin blocks are molded and attached to the lower surface of the base portion.   A suction hole that leads to the lower surface of the base portion is opened at a required position, and the plurality of resin blocks temporarily fixed to the lower surface of the base portion by appropriate temporary fixing means are sucked to the lower surface of the base portion through the intake holes. The retainer ring for a polishing head according to claim 1, wherein the plurality of resin blocks are mounted on a lower surface of the base portion by being fixed. A retainer for a polishing head that is supported by the polishing head and surrounds the periphery of the wafer while being in contact with the polishing pad when the wafer held by the polishing head is pressed against a rotating polishing pad and supplied with slurry. In the ring,
A retainer ring holder provided on the polishing head is integrated with a base portion formed in a ring shape with a high rigidity material integrally with a retainer ring holder, and a plurality of resin blocks are mounted on the lower surface of the base portion corresponding portion with substantially the same interval. A polishing head retainer comprising: a resin portion that is in contact with the polishing pad, and a flow path for the slurry formed between adjacent resin blocks and a lower surface of a portion corresponding to the base portion. ring.   A plurality of recesses are formed on the lower surface of the base portion corresponding portion, and the resin block is fitted on the lower surface of the base portion corresponding portion by being fitted into the plurality of recess portions and bonded, welded or screwed. The retainer ring for a polishing head according to claim 6.   A plurality of cylindrical recesses are formed on the lower surface of the portion corresponding to the base portion, a columnar projection corresponding to the cylindrical recess is formed on each resin block, and the columnar projection is press-fitted into the cylindrical recess. 7. The retainer ring for a polishing head according to claim 6, wherein the plurality of resin blocks are mounted on a lower surface of the portion corresponding to the base portion by fitting together. The elastic sheet stretched on the upper surface side of the wafer inside the retainer ring

9. The retainer ring for a polishing head according to claim 6, wherein the retainer ring is sandwiched between the portion corresponding to the base portion and the resin portion. In a retainer ring for a polishing head that surrounds the periphery of the wafer while being supported by the polishing head and in contact with the polishing pad when polishing the wafer held by the polishing head against a rotating polishing pad,
A base portion formed in a ring shape with a high-rigidity material and supported on the polishing head side, and a plurality of resin blocks are mounted on the lower surface of the base portion with substantially the same interval to be a contact side to the polishing pad. A polishing head retainer ring, comprising: a resin portion, wherein the resin portion is configured to be exchangeable by releasing a mounting state with respect to a lower surface of the base portion.   When the resin part is pushed out from the lower surface of the base part and the resin part is released from the lower surface of the base part, the resin part is released from the rod-like body. The retainer ring for a polishing head according to claim 10, wherein the resin portion is configured to be removed from the lower surface of the base portion through the extrusion hole.   Each resin block can be slid and removed from the bottom surface of the base portion by applying a force in the opposite direction to the direction of the force applied to each resin block during normal operation when the polishing head rotates. And when releasing the mounting state of the resin portion on the lower surface of the base portion, the resin block is removed from the lower surface of the base portion by applying a force in the opposite direction to the resin block. The retainer ring for a polishing head according to claim 10, wherein the retainer ring is a polishing head.   A lock member that locks the state where each of the resin blocks is mounted on the lower surface of the base portion extends from the base portion to the resin portion side, and the mounting state of the resin portion on the lower surface of the base portion is released. 11. The polishing head retainer according to claim 10, wherein the lock state of each resin block by the lock member is released and each resin block is removed from the lower surface of the base portion. ring.   2. The high-rigidity material is a metal or ceramic or a high-rigidity engineering plastic, and the resin material is an engineering plastic containing PPS (Polyphenylene Sulfide Polyphenylene Sulfide) or PEEK (Polyetheretherketone Polyether Ether Ketone). , 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, or 13 A retainer ring for a polishing head.

Images