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JP2008173657A - Metal joining method and armature manufacturing method - Google Patents

Metal joining method and armature manufacturing method Download PDF

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JP2008173657A
JP2008173657A JP2007007878A JP2007007878A JP2008173657A JP 2008173657 A JP2008173657 A JP 2008173657A JP 2007007878 A JP2007007878 A JP 2007007878A JP 2007007878 A JP2007007878 A JP 2007007878A JP 2008173657 A JP2008173657 A JP 2008173657A
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hole
metal
metal member
connecting portion
opening
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Yoshitaka Tao
吉隆 田尾
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Asmo Co Ltd
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Asmo Co Ltd
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Abstract

【課題】整流子のセグメントの接続部と導線とを低エネルギーで良好に接合することができる電機子の製造方法を提供する。
【解決手段】整流子のセグメントの接続部116aに予め貫通孔116bを設け、その貫通孔116bの第1の開口部116cを導線Dの導線接続部Mbにおける導線本体Daで塞ぐように配置し、レーザ光LBを接続部116aにおける貫通孔116bの第2の開口部116dの周囲に照射するとともに貫通孔116bを介して導線本体Daに照射して接続部116aと導線本体Daとをレーザ溶接によって接合する接合工程を備える。
【選択図】図9
A method of manufacturing an armature capable of satisfactorily joining a connecting portion of a segment of a commutator and a conducting wire with low energy.
A through hole 116b is provided in advance in a connecting portion 116a of a commutator segment, and a first opening 116c of the through hole 116b is disposed so as to be closed by a conductor main body Da in a conductor connecting portion Mb of the conductor D. The laser beam LB is irradiated around the second opening 116d of the through-hole 116b in the connection portion 116a, and the conductive wire body Da is irradiated through the through-hole 116b to join the connection portion 116a and the conductive wire body Da by laser welding. A joining step is provided.
[Selection] Figure 9

Description

本発明は、例えば整流子のセグメントと導線とをレーザ溶接によって接合する金属の接合方法、及び電機子の製造方法に関するものである。   The present invention relates to a metal joining method for joining, for example, a commutator segment and a conductive wire by laser welding, and an armature manufacturing method.

従来からモータの電機子における整流子のセグメントから延出した接続部と巻線を構成する導線とは電気的に接続される。そして、このような接続部と導線とを接合する方法としては、レーザ溶接によって接合する方法がある(例えば、特許文献1参照)。又、レーザ溶接による接合は、前記接続部と前記導線とに限らず、他の第1の金属部材と他の第2の金属部材とを接合する方法として利用されている。例えば、第1の金属板と第2の金属板とを厚さ方向に重ねて配置し、第1の金属板の平面にレーザ光を照射して第2の金属板まで熱を伝達させて接合する方法や、第1の金属板の側面(即ち、厚さ方向の直交方向の面)と第2の金属板の平面や側面とに直接レーザ光を同時に照射して接合する方法がある。
特開平9−182385号公報
Conventionally, a connecting portion extending from a commutator segment in a motor armature and a conductive wire constituting a winding are electrically connected. And there exists a method of joining by laser welding as a method of joining such a connection part and conducting wire (for example, refer to patent documents 1). Further, the joining by laser welding is not limited to the connection portion and the conducting wire, but is utilized as a method of joining another first metal member and another second metal member. For example, the first metal plate and the second metal plate are arranged so as to overlap each other in the thickness direction, and the plane of the first metal plate is irradiated with laser light to transfer heat to the second metal plate. And a method in which the side surface of the first metal plate (that is, the surface in the direction perpendicular to the thickness direction) and the plane and side surfaces of the second metal plate are directly irradiated with laser light and bonded together.
JP-A-9-182385

しかしながら、第1の金属板の平面にレーザ光を照射して第2の金属板まで熱を伝達させて接合する方法では、第1の金属板から第2の金属板まで熱を伝達させるだけの高エネルギーが必要となる。   However, in the method of irradiating the laser beam onto the plane of the first metal plate and transferring the heat to the second metal plate, the heat is only transferred from the first metal plate to the second metal plate. High energy is required.

又、第1の金属板の側面(即ち、厚さ方向の直交方向の面)と第2の金属板の平面や側面とに直接レーザ光を同時に照射して接合する方法では、第1及び第2の金属板がそれぞれ直接レーザ光のエネルギーを受けるため、比較的低エネルギーで接合することができる。しかし、この方法では、接合位置が第1の金属板の側面に限定されるため、該接合位置にレーザ光を照射することがスペース的に困難であったり第1及び第2の金属板の大きさや形状などによっては全体としての接合強度が弱くなり、良好な接合を得ることができない。   In the method in which the side surface of the first metal plate (that is, the surface in the direction perpendicular to the thickness direction) and the flat surface or side surface of the second metal plate are directly irradiated and joined simultaneously, the first and first Since each of the two metal plates directly receives the energy of the laser beam, it can be bonded with a relatively low energy. However, in this method, since the joining position is limited to the side surface of the first metal plate, it is difficult to irradiate the joining position with laser light in terms of space or the size of the first and second metal plates. Depending on the sheath and shape, the bonding strength as a whole becomes weak, and good bonding cannot be obtained.

本発明は、上記問題点を解決するためになされたものであって、その第1の目的は、第1の金属部材と第2の金属部材とを低エネルギーで良好に接合することができる金属の接合方法を提供することにある。   The present invention has been made to solve the above-mentioned problems, and a first object of the present invention is a metal that can satisfactorily join the first metal member and the second metal member with low energy. It is in providing the joining method of this.

又、第2の目的は、整流子のセグメントの接続部と導線とを低エネルギーで良好に接合することができる電機子の製造方法を提供することにある。   A second object is to provide a method of manufacturing an armature that can satisfactorily join a segment connecting portion of a commutator and a conducting wire with low energy.

請求項1に記載の発明では、第1の金属部材と第2の金属部材とをレーザ溶接によって接合する金属の接合方法であって、前記第1の金属部材に予め貫通孔を設け、その貫通孔の第1の開口部を前記第2の金属部材で塞ぐように配置し、レーザ光を前記第1の金属部材における前記貫通孔の第2の開口部の周囲の少なくとも一部に照射するとともに前記貫通孔を介して前記第2の金属部材に照射して前記第1の金属部材と前記第2の金属部材とを接合する接合工程を備えた。   According to the first aspect of the present invention, there is provided a metal joining method for joining a first metal member and a second metal member by laser welding, wherein a through hole is provided in the first metal member in advance, and the through-hole is provided. The first opening of the hole is disposed so as to be closed by the second metal member, and laser light is applied to at least part of the periphery of the second opening of the through hole in the first metal member. A joining step of joining the first metal member and the second metal member by irradiating the second metal member through the through hole is provided.

同発明によれば、接合工程にて、レーザ光が、第1の金属部材における貫通孔の第2の開口部の周囲の少なくとも一部に照射されるとともに貫通孔を介して貫通孔の第1の開口部を塞ぐ第2の金属部材に照射され、第1及び第2の金属部材がそれぞれ直接レーザ光のエネルギーを受ける。又、第2の金属部材に照射されたレーザ光の一部は反射してしまうが反射したレーザ光の一部は貫通孔の内面に照射され、該内面においてもレーザ光のエネルギーを受ける。これらのことから、第1の金属部材と第2の金属部材とを低エネルギーで良好に接合することができる。尚、貫通孔を設ける位置は、対象物など(その大きさや形状や周りに配置される部材)に応じて適宜設定可能であるため、レーザ光を照射する位置、ひいては接合位置を適宜設定することができる。よって、例えば、レーザ光を照射することがスペース的に困難となってしまうことを回避することができ、全体としての接合強度を強くすることができる。   According to the invention, in the joining step, laser light is applied to at least a part of the periphery of the second opening of the through hole in the first metal member, and the first through hole is formed through the through hole. The second metal member that closes the opening is irradiated to each of the first and second metal members and directly receives the energy of the laser beam. In addition, a part of the laser light applied to the second metal member is reflected, but a part of the reflected laser light is applied to the inner surface of the through hole, and the inner surface receives the energy of the laser light. From these things, a 1st metal member and a 2nd metal member can be favorably joined by low energy. In addition, since the position where the through hole is provided can be set as appropriate according to the object or the like (its size, shape, and surrounding members), the position where the laser beam is irradiated and thus the bonding position should be set as appropriate. Can do. Therefore, for example, it can be avoided that it is difficult to irradiate the laser beam in terms of space, and the overall bonding strength can be increased.

請求項2に記載の発明では、請求項1に記載の金属の接合方法において、前記貫通孔は、前記第2の開口部が前記第1の開口部より小さく設定された。
同発明によれば、貫通孔は、第2の開口部が第1の開口部より小さく設定されるため、第2の金属部材にて反射したレーザ光の一部が貫通孔の内面と第2の金属部材とで反射を繰り返しやすくなり、レーザ光が外部に反射してしまうことを低減することができる。よって、第1の金属部材と第2の金属部材とを更に低エネルギーで良好に接合することができる。
According to a second aspect of the present invention, in the metal bonding method according to the first aspect, the through hole is set such that the second opening is smaller than the first opening.
According to the present invention, since the through hole is set such that the second opening is smaller than the first opening, a part of the laser beam reflected by the second metal member is formed between the inner surface of the through hole and the second hole. It is easy to repeat the reflection with the metal member, and it is possible to reduce the reflection of the laser beam to the outside. Therefore, the first metal member and the second metal member can be favorably bonded with lower energy.

請求項3に記載の発明では、請求項2に記載の金属の接合方法において、先端に向かうほど小径となる縮径部を備えた孔あけ治具にて前記貫通孔を成形する孔成形工程を備えた。   According to a third aspect of the present invention, in the metal joining method according to the second aspect, a hole forming step of forming the through hole with a drilling jig having a reduced diameter portion that decreases in diameter toward the tip. Prepared.

同発明によれば、先端に向かうほど小径となる縮径部を備えた孔あけ治具にて貫通孔を成形するため、請求項2に記載の貫通孔を容易に成形することができる。
請求項4に記載の発明では、請求項1乃至3のいずれか1項に記載の金属の接合方法における接合工程を備えた電機子の製造方法であって、前記第1の金属部材は、整流子のセグメントから延出した接続部であって、前記第2の金属部材は、巻線を構成する導線の一部である。
According to the present invention, since the through hole is formed by the drilling jig provided with the reduced diameter portion that decreases in diameter toward the tip, the through hole according to claim 2 can be easily formed.
According to a fourth aspect of the present invention, there is provided a method of manufacturing an armature including a joining step in the metal joining method according to any one of the first to third aspects, wherein the first metal member is a rectifier. It is a connection part extended from the segment of a child, Comprising: A said 2nd metal member is a part of conducting wire which comprises a coil | winding.

同発明によれば、接合工程にて、レーザ光が、整流子のセグメントから延出した接続部における貫通孔の第2の開口部の周囲の少なくとも一部に照射されるとともに貫通孔を介して貫通孔の第1の開口部を塞ぐ導線の一部に照射され、接続部及び導線がそれぞれ直接レーザ光のエネルギーを受ける。又、導線に照射されたレーザ光の一部は反射してしまうが反射したレーザ光の一部は貫通孔の内面に照射され、該内面においてもレーザ光のエネルギーを受ける。これらのことから、接続部と導線とを低エネルギーで良好に接合することができる。しかも、接続部側に貫通孔を設けたため、接合部分における破損を低減することができる。詳しくは、導線は径が一定であることや緊縛力を有するように設けられることが多いことなどから、導線に貫通孔を設けると切断されてしまうといった可能性が高くなるが、比較的自由に設計でき剛性を保つことが容易な接続部側に貫通孔を設けたため、接合部分における破損を低減することができる。又、導線は、一定量の電流を流すことになるため、導線に貫通孔を設けるとその部分で断面積が小さく、即ち抵抗が大きくなり発熱する可能性が高くなってその発熱に基づいて切断されてしまうといった可能性も高くなるが、この原因に基づく破損をも低減することができる。   According to the invention, in the joining step, the laser beam is applied to at least a part of the periphery of the second opening of the through hole in the connection portion extending from the commutator segment and through the through hole. A part of the conducting wire that closes the first opening of the through hole is irradiated, and the connecting portion and the conducting wire each receive the energy of the laser beam directly. Further, a part of the laser light irradiated to the conducting wire is reflected, but a part of the reflected laser light is irradiated to the inner surface of the through hole, and the inner surface receives the energy of the laser light. From these things, a connection part and a conducting wire can be favorably joined with low energy. And since the through-hole was provided in the connection part side, the damage in a junction part can be reduced. Specifically, since the conducting wire is often provided with a constant diameter or a tight binding force, there is a high possibility that if the through hole is provided in the conducting wire, it will be cut, but relatively freely. Since the through-hole is provided on the side of the connecting portion that can be designed and is easy to maintain rigidity, it is possible to reduce damage at the joint portion. In addition, since a certain amount of current flows through the conducting wire, if a through hole is provided in the conducting wire, the cross-sectional area is small at that portion, that is, the resistance increases and the possibility of heat generation increases, and cutting is based on the generated heat. Although the possibility that it will be carried out becomes high, the damage based on this cause can also be reduced.

請求項5に記載の発明では、請求項4に記載の電機子の製造方法において、前記接続部は導線の外周に沿った湾曲部を有し、前記貫通孔を前記湾曲部に設ける。
同発明によれば、接続部は導線の外周に沿った湾曲部を有し、貫通孔は湾曲部に設けられるため、接続部と導線とが広範囲に渡って密着するとともに、それらの位置ずれが防止されて接合される。よって、接続部と導線とを容易且つ強固に接合することができる。
According to a fifth aspect of the present invention, in the armature manufacturing method according to the fourth aspect, the connecting portion has a curved portion along the outer periphery of the conducting wire, and the through hole is provided in the curved portion.
According to the invention, since the connecting portion has a curved portion along the outer periphery of the conducting wire and the through hole is provided in the curved portion, the connecting portion and the conducting wire are in close contact with each other over a wide range, and their positional deviation is Prevented and joined. Therefore, the connection portion and the conducting wire can be easily and firmly joined.

請求項6に記載の発明では、請求項4又は5に記載の電機子の製造方法において、前記貫通孔を前記導線に沿って複数設ける。
同発明によれば、貫通孔は導線に沿って複数設けられ、接合部分が導線に沿って複数となるため、接続部と導線とが容易且つ強固に接合される。
According to a sixth aspect of the present invention, in the armature manufacturing method according to the fourth or fifth aspect, a plurality of the through holes are provided along the conducting wire.
According to the invention, a plurality of through holes are provided along the conducting wire, and a plurality of joining portions are provided along the conducting wire, so that the connecting portion and the conducting wire are easily and firmly joined.

請求項1〜3に記載の発明によれば、第1の金属部材と第2の金属部材とを低エネルギーで良好に接合することができる金属の接合方法を提供することができる。
又、請求項4〜6に記載の発明によれば、整流子のセグメントの接続部と導線とを低エネルギーで良好に接合することができる電機子の製造方法を提供することができる。
According to invention of Claims 1-3, the metal joining method which can join the 1st metal member and the 2nd metal member favorably with low energy can be provided.
Moreover, according to the invention of Claims 4-6, the manufacturing method of the armature which can join the connection part of a segment of a commutator and conducting wire favorably with low energy can be provided.

以下、本発明を具体化した一実施の形態を図1〜図11に従って説明する。
図1に示すように、本実施形態の直流モータ101は、固定子102と電機子(回転子)103とを備えている。固定子102は、略筒形状のヨークハウジング104と、該ヨークハウジング104の内周面に等角度間隔で配置固着された複数(本実施形態では6つ)のマグネット105とを備えている。本実施の形態では、マグネット105は6個(6極)設けられ、磁極数が6とされている。
Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 1, the DC motor 101 of this embodiment includes a stator 102 and an armature (rotor) 103. The stator 102 includes a substantially cylindrical yoke housing 104 and a plurality (six in this embodiment) of magnets 105 arranged and fixed at equal angular intervals on the inner peripheral surface of the yoke housing 104. In the present embodiment, six magnets 105 (six poles) are provided and the number of magnetic poles is six.

電機子103は、図1及び図2に示すように、回転軸106と、該回転軸106に固定された電機子コア107と、同じく回転軸106に固定された整流子108等とを備える。電機子103は、図2に示すように、回転軸106の両端側がヨークハウジング104を含むハウジング(詳しくはヨークハウジング104及びその開口部を塞ぐエンドハウジングE)に保持された軸受Gにて回転可能に支持されている。尚、この状態で整流子108の外周には前記エンドハウジングEに保持され給電を行うための陽極側及び陰極側ブラシ109a,109bが摺接可能に押圧接触される。又、この状態で電機子コア107はマグネット105と対向して周囲を囲まれるように配置される。   As shown in FIGS. 1 and 2, the armature 103 includes a rotating shaft 106, an armature core 107 fixed to the rotating shaft 106, and a commutator 108 that is also fixed to the rotating shaft 106. As shown in FIG. 2, the armature 103 can be rotated by a bearing G held on a housing including a yoke housing 104 (specifically, an end housing E that closes the yoke housing 104 and its opening) on both ends of the rotating shaft 106. It is supported by. In this state, the anode-side and cathode-side brushes 109a and 109b, which are held by the end housing E and perform power feeding, are pressed and slidably contacted with the outer periphery of the commutator 108. In this state, the armature core 107 is disposed so as to face the magnet 105 and be surrounded by the periphery.

電機子コア107は回転軸106を中心として放射状に延びる8個のティース部としてのティースT1〜T8を有し、該ティースT1〜T8間にはそれぞれスロットS1〜S8が形成されている(図1及び図4(a)参照)。   The armature core 107 has eight teeth T1 to T8 that extend radially about the rotation shaft 106, and slots S1 to S8 are formed between the teeth T1 to T8, respectively (FIG. 1). And FIG. 4 (a)).

詳述すると、電機子コア107は、図5に示すように、前記ティースT1〜T8の基端部を周方向に連結する周方向連結部107aと、回転軸106が内嵌される環状の固定部107bと、周方向連結部107aの周方向の一部(90°毎)から径方向内側に延出し周方向連結部107aと固定部107bとを連結する径方向連結部107cとを備える。   More specifically, as shown in FIG. 5, the armature core 107 has an annular fixed portion in which the rotation shaft 106 is fitted and a circumferential connection portion 107 a that connects the base ends of the teeth T <b> 1 to T <b> 8 in the circumferential direction. A portion 107b and a radial connecting portion 107c extending radially inward from a portion of the circumferential connecting portion 107a in the circumferential direction (every 90 °) and connecting the circumferential connecting portion 107a and the fixing portion 107b.

電機子コア107における整流子108が配置される側である軸方向一端側(図2中、上側)にはインシュレータX(図5参照)が装着され、整流子108が配置されない側である軸方向他端側(図2中、下側)にはインシュレータY(図6参照)が装着されている。   An insulator X (see FIG. 5) is attached to one end side (upper side in FIG. 2) of the armature core 107 where the commutator 108 is disposed, and the axial direction is the side where the commutator 108 is not disposed. An insulator Y (see FIG. 6) is attached to the other end side (the lower side in FIG. 2).

インシュレータXには、図5に示すように、前記周方向連結部107aを覆う環状被覆部Xaと、ティースT1〜T8を覆うティース被覆部Xbと、ティースT1〜T8の基端部毎に対応して配置された分離部Xcと、その分離部Xcの径方向内側(即ち環状被覆部Xa上)に配置された載置凸部Xdとが設けられている。このインシュレータXは、樹脂製であって、前記各部(環状被覆部Xa、ティース被覆部Xb、分離部Xc及び載置凸部Xd)が一体形成されている。環状被覆部Xaは、周方向連結部107aを軸方向から覆う軸方向被覆部Xeと、周方向連結部107aにおける外周面(隣り合うティースT1〜T8の間)を径方向から覆う径方向被覆部Xfとを有する。径方向被覆部Xfは、周方向に隣り合うティースT1〜T8の間の中央ほど径方向外側に突出すべく軸方向から見て角状に形成され、その角に径方向内側に凹設された形状で軸方向に延びる溝Xgが形成されている。尚、前記角状の角度は正八角形に対応した角度である。又、溝Xgは略円弧形状に凹設されている。又、分離部Xcは、ティース被覆部Xbより軸方向に突出している。分離部Xcは、ティースT1〜T8の基端部において、ティース被覆部Xb側と載置凸部Xd側とを仕切るように形成されている。又、分離部Xcには、径方向内側から径方向外側に延びる凹部Xhが凹設されている。又、載置凸部Xdは、ティース被覆部Xbより軸方向に突出し、分離部Xcより突出量が小さく設定されている。本実施の形態の載置凸部Xdは、径方向から見て略台形形状(平行な2辺の内の短い方が先端(頂面)に設定された略台形形状)に形成されている(図7参照)。又、載置凸部Xdの先端(頂面)における周方向中央には、空隙形成溝Xiが凹設されている。   As shown in FIG. 5, the insulator X corresponds to the annular covering portion Xa covering the circumferential connecting portion 107a, the teeth covering portion Xb covering the teeth T1 to T8, and the base ends of the teeth T1 to T8. The separation part Xc arranged in the above-mentioned manner and the placement convex part Xd arranged on the radially inner side of the separation part Xc (that is, on the annular covering part Xa) are provided. The insulator X is made of resin, and the respective parts (the annular covering part Xa, the teeth covering part Xb, the separating part Xc, and the mounting convex part Xd) are integrally formed. The annular covering portion Xa includes an axial covering portion Xe that covers the circumferential connecting portion 107a from the axial direction, and a radial covering portion that covers the outer peripheral surface (between adjacent teeth T1 to T8) of the circumferential connecting portion 107a from the radial direction. Xf. The radial covering portion Xf is formed in a rectangular shape when viewed from the axial direction so as to protrude outward in the radial direction toward the center between the teeth T1 to T8 adjacent in the circumferential direction, and is recessed radially inward at the corner. A groove Xg extending in the axial direction is formed. The angular angle is an angle corresponding to a regular octagon. The groove Xg is recessed in a substantially arc shape. Further, the separation part Xc protrudes in the axial direction from the tooth coating part Xb. The separation part Xc is formed so as to partition the teeth covering part Xb side and the placement convex part Xd side at the base end parts of the teeth T1 to T8. Further, the separation portion Xc is provided with a recess Xh extending from the radially inner side to the radially outer side. Moreover, the mounting convex part Xd protrudes in the axial direction from the teeth covering part Xb, and the protruding amount is set smaller than that of the separating part Xc. The mounting convex portion Xd of the present embodiment is formed in a substantially trapezoidal shape as viewed from the radial direction (a substantially trapezoidal shape in which the shorter of the two parallel sides is set at the tip (top surface)) ( (See FIG. 7). In addition, a gap forming groove Xi is formed in the center in the circumferential direction at the tip (top surface) of the mounting convex portion Xd.

インシュレータYには、図6に示すように、前記周方向連結部107aを覆う環状被覆部Yaと、ティースT1〜T8を覆うティース被覆部Ybと、ティースT1〜T8の基端部毎に対応して周方向に断続的に軸方向に突出した外側壁Ycと、外側壁Ycの内側(環状被覆部Yaの内縁)で略円筒状に軸方向に突出した内側壁Ydとが設けられている。尚、本実施の形態では、外側壁Yc及び内側壁Ydがガイド部を構成している。このインシュレータYは、樹脂製であって、前記各部(環状被覆部Ya、ティース被覆部Yb、外側壁Yc及び内側壁Yd)が一体形成されている。環状被覆部Yaは、周方向連結部107aを軸方向から覆う軸方向被覆部Yeと、周方向連結部107aにおける外周面(隣り合うティースT1〜T8の間)を径方向から覆う径方向被覆部Yfとを有する。径方向被覆部Yfは、周方向に隣り合うティースT1〜T8の間の中央ほど径方向外側に突出すべく軸方向から見て角状に形成され、その角に径方向内側に凹設された形状で軸方向に延びる溝Ygが形成されている。尚、前記角状の角度は正八角形に対応した角度である。又、溝Ygは略円弧形状に凹設されている。   As shown in FIG. 6, the insulator Y corresponds to the annular covering portion Ya covering the circumferential connecting portion 107a, the teeth covering portion Yb covering the teeth T1 to T8, and the base end portions of the teeth T1 to T8. An outer wall Yc projecting in the axial direction intermittently in the circumferential direction and an inner wall Yd projecting in the axial direction in a substantially cylindrical shape inside the outer wall Yc (inner edge of the annular covering portion Ya) are provided. In the present embodiment, the outer wall Yc and the inner wall Yd constitute a guide part. The insulator Y is made of resin, and the respective parts (the annular covering part Ya, the teeth covering part Yb, the outer wall Yc, and the inner wall Yd) are integrally formed. The annular covering portion Ya includes an axial covering portion Ye that covers the circumferential connecting portion 107a from the axial direction, and a radial covering portion that covers the outer peripheral surface (between adjacent teeth T1 to T8) of the circumferential connecting portion 107a from the radial direction. Yf. The radial covering portion Yf is formed in a square shape when viewed from the axial direction so as to protrude outward in the radial direction toward the center between the teeth T1 to T8 adjacent in the circumferential direction, and is recessed radially inward at the corner. A groove Yg extending in the axial direction is formed. The angular angle is an angle corresponding to a regular octagon. Further, the groove Yg is recessed in a substantially arc shape.

そして、電機子103には、インシュレータX,Yが装着された電機子コア107のティースT1〜T8に(スロットS1〜S8内を通るように)集中巻にて巻回された巻線M1〜M8と、複数の巻線M1〜M8を繋ぐ渡り線110(図2、図10及び図11参照)とを連続して構成する導線Dが設けられている。尚、図4(a)は、電機子103を平面状に展開した模式図である。又、巻線M1〜M8は、ティースT1〜T8に巻回されることで該ティースT1〜T8の径方向に全体的に配設されるものであって、(ティースT1〜T8に対して)緊縛力を有するように配設されるものである。又、渡り線110は、周方向に複数配置されるティースT1〜T8の2つを結ぶように少なくとも1つの前記ティースを跨いで(越えて)配設されるものであって、(軸直交方向に対して)緊張力を有するように配設されるものである。   The armature 103 has windings M1 to M8 wound in concentrated winding on the teeth T1 to T8 of the armature core 107 to which the insulators X and Y are mounted (through the slots S1 to S8). And the conducting wire D which comprises continuously the connecting wire 110 (refer FIG.2, FIG.10 and FIG.11) which connects several coil | windings M1-M8 is provided. FIG. 4A is a schematic diagram in which the armature 103 is developed in a planar shape. The windings M1 to M8 are entirely disposed in the radial direction of the teeth T1 to T8 by being wound around the teeth T1 to T8 (with respect to the teeth T1 to T8). It is arranged so as to have a binding force. The crossover wire 110 is disposed across (beyond) at least one of the teeth T1 to T8 disposed in the circumferential direction so as to connect the two teeth (in the direction orthogonal to the axis). It is arranged to have tension.

本実施の形態の導線Dは、例えば、まずティースT1に集中巻にて巻回されて巻線M1を構成し、次にティースT8,T7を跨いでティースT6まで達する渡り線110を構成し、次にティースT6に集中巻にて巻回されて巻線M6を構成するといったパターンを繰り返して設けられる(図11参照)。尚、図11は、前述したような導線Dの配設工程(後述する「導線配設工程」)における途中段階を図示している。   For example, the conductive wire D of the present embodiment first forms a winding M1 by being wound around the tooth T1 in a concentrated winding, and then forms a crossover 110 that reaches the tooth T6 across the teeth T8 and T7. Next, a pattern in which the winding M6 is formed by concentrated winding on the tooth T6 is repeatedly provided (see FIG. 11). FIG. 11 illustrates an intermediate stage in the process of arranging the conductive wire D as described above (a “conductor layout process” described later).

又、各巻線M1〜M8は、それぞれにおいて最終の巻線(最後のひと巻き)である一部の巻線としての端巻線Ma(図1及び図7参照)を除いて前記分離部Xcの径方向外側でティースT1〜T8に巻回されて該分離部Xcにて径方向内側への移動が規制される。又、前記端巻線Maの一部である第2の金属部材としての導線接続部Mbは、前記載置凸部Xd上であって、空隙形成溝Xiが形成された部分においては局部的に載置凸部Xdと離間して配置される。即ち、各巻線M1〜M8は、分離部Xcによって端巻線Ma(一部の巻線)とその他の巻線とに分離されている。   In addition, each of the windings M1 to M8 is the last winding (the last one winding), except for the end winding Ma (see FIGS. 1 and 7) as a part of the windings of the separating portion Xc. Winding around the teeth T1 to T8 on the outer side in the radial direction and the movement toward the inner side in the radial direction is restricted by the separation portion Xc. In addition, the conductor connecting portion Mb as the second metal member, which is a part of the end winding Ma, is locally on the placement convex portion Xd and in the portion where the gap forming groove Xi is formed. It arrange | positions spaced apart from the mounting convex part Xd. That is, each of the windings M1 to M8 is separated into an end winding Ma (partial windings) and other windings by the separation part Xc.

又、各渡り線110は、前記載置凸部Xd上を避けて配置される。詳しくは、図2、図10及び図11に示すように、各渡り線110は、電機子コア107における軸方向他端側(整流子108が配置される側の反対側)に配置される。各渡り線110は、ガイド部(外側壁Yc及び内側壁Yd)によって、ティースT1〜T8より径方向内側で周方向に沿って案内される。即ち、各渡り線110は、外側壁Ycによって径方向外側への移動が規制され、内側壁Ydによって径方向内側への移動が規制される。   Moreover, each crossover 110 is arranged avoiding the above-mentioned placement convex part Xd. Specifically, as shown in FIGS. 2, 10, and 11, each crossover wire 110 is arranged on the other end side in the axial direction of the armature core 107 (the side opposite to the side where the commutator 108 is arranged). Each connecting wire 110 is guided along the circumferential direction radially inward of the teeth T1 to T8 by the guide portions (the outer wall Yc and the inner wall Yd). That is, the crossover wires 110 are restricted from moving radially outward by the outer wall Yc, and restricted radially outward by the inner wall Yd.

又、導線Dにおいて前記導線接続部Mb(前記軸方向一端側)と前記渡り線110(前記軸方向他端側)とを連結する導線連結部Mc(図10参照)は前記溝Xg,Ygに配置(略半分が収容)される。   Further, in the lead wire D, the lead wire connecting portion Mc (see FIG. 10) for connecting the lead wire connecting portion Mb (the one axial end side) and the connecting wire 110 (the other axial end side) is formed in the grooves Xg and Yg. Placed (substantially half accommodated).

整流子108は、図2に示すように、整流子本体111と短絡部材112とからなる。整流子本体111は、略円筒形状の本体絶縁材113と、本体絶縁材113の外周面に周方向に24個配設されるセグメント1〜24(図4(a)参照)とを備える。尚、このセグメント1〜24は本体絶縁材113の外周で略円筒状をなし、その径方向外側から前記陽極側及び陰極側ブラシ109a,109bが当接(押圧接触)されることになる。   As shown in FIG. 2, the commutator 108 includes a commutator body 111 and a short-circuit member 112. The commutator body 111 includes a substantially cylindrical main body insulating material 113 and 24 segments 1 to 24 (see FIG. 4A) disposed on the outer peripheral surface of the main body insulating material 113 in the circumferential direction. The segments 1 to 24 are substantially cylindrical on the outer periphery of the main body insulating material 113, and the anode side and cathode side brushes 109a and 109b are brought into contact (pressing contact) from the outside in the radial direction.

短絡部材112は、整流子本体111の軸方向端部に固定され、図4(a)に示すように、24個のセグメント1〜24を120度間隔に電気的に接続し、例えば、セグメント1,9,17の組や、セグメント5,13,21の組を短絡された(同電位)状態とする。詳しくは、短絡部材112は、図3に示すように、絶縁層(絶縁紙)114を挟む2つの層にそれぞれ24個ずつ配置された短絡片115,116を備える。一方(図3中、紙面手前側の層)の各短絡片115は、その径方向内側端部が径方向外側端部に対して周方向一方(図3中、時計回り方向)に60°ずれるように形成されている。又、他方(図3中、紙面奥側の層であって、破線で示す)の各短絡片116は、その径方向内側端部が径方向外側端部に対して周方向他方(図3中、反時計回り方向)に60°ずれるように形成されている。そして、2つの層の各短絡片115,116は、互いに径方向内側端部同士、及び径方向外側端部同士が(絶縁層114を挟まずに)それぞれ電気的に接続されている。これにより、短絡部材112における短絡片115,116の径方向外側端部は、120度間隔に電気的に接続されることになる。   The short-circuit member 112 is fixed to the axial end of the commutator body 111 and electrically connects the 24 segments 1 to 24 at intervals of 120 degrees as shown in FIG. , 9, 17 and segments 5, 13, 21 are short-circuited (same potential). Specifically, as shown in FIG. 3, the short-circuit member 112 includes 24 short-circuit pieces 115 and 116 disposed in two layers sandwiching an insulating layer (insulating paper) 114, respectively. Each short-circuit piece 115 on one side (the layer on the front side in FIG. 3) has its radially inner end shifted by 60 ° in the circumferential direction (clockwise in FIG. 3) with respect to the radially outer end. It is formed as follows. In addition, each short-circuit piece 116 on the other side (in FIG. 3, a layer on the back side of the paper and indicated by a broken line) has a radially inner end portion that is circumferentially opposite to a radially outer end portion (in FIG. 3). , In a counterclockwise direction). The short-circuit pieces 115 and 116 of the two layers are electrically connected to each other between the radially inner ends and the radially outer ends (without the insulating layer 114 interposed). Thereby, the radial direction outer side edge part of the short circuit pieces 115 and 116 in the short circuit member 112 will be electrically connected to a 120 degree space | interval.

そして、短絡部材112は、その各径方向外側端部がセグメント1〜24にそれぞれ電気的に接続されるように整流子本体111に固定されている。又、本実施の形態では、他方(図3中、紙面奥側の層であって、破線で示す)の短絡片116における径方向外側端部に前記セグメント1〜24から径方向外側に延出する第1の金属部材としての接続部116a(図8参照)が形成されている。この接続部116aは、前記端巻線Maの一部である導線接続部Mbと前記載置凸部Xd上で接合されて電気的に接続固定される。又、この接続部116aには、図3、図8及び図9に示すように、予め貫通孔116bが形成されている。又、本実施の形態の貫通孔116bは、図9に示すように、導線接続部Mbが配置されて閉塞される側の第1の開口部116cが反対側の第2の開口部116dより小さく設定されている。詳しくは、本実施の形態の貫通孔116bは、貫通方向から見て円形であって、その直径が第2の開口部116dから第1の開口部116cに向かうほど小さくなるように設定されている。   And the short circuit member 112 is being fixed to the commutator main body 111 so that each radial direction outer side edge part may be electrically connected to the segments 1-24, respectively. In the present embodiment, the other end (the layer on the back side of the paper in FIG. 3 and indicated by a broken line) extends radially outward from the segments 1 to 24 at the radially outer end of the short-circuit piece 116. A connecting portion 116a (see FIG. 8) is formed as a first metal member. The connecting portion 116a is joined and electrically connected and fixed on the conducting wire connecting portion Mb, which is a part of the end winding Ma, on the placement convex portion Xd. Further, as shown in FIGS. 3, 8, and 9, a through hole 116b is formed in the connecting portion 116a in advance. Further, as shown in FIG. 9, in the through hole 116b of the present embodiment, the first opening 116c on the side where the conductor connecting portion Mb is disposed and closed is smaller than the second opening 116d on the opposite side. Is set. Specifically, the through-hole 116b of the present embodiment is circular when viewed from the penetration direction, and the diameter thereof is set so as to decrease as it goes from the second opening 116d to the first opening 116c. .

又、導線Dは、導電性金属(本実施の形態では銅)よりなる導線本体Da(図9参照)と該導線本体Daを被覆する絶縁皮膜とを有する。そして、導線接続部Mbにおける絶縁皮膜は除去され、該部分で露出した導線本体Daと接続部116aとが接合されて電気的に接続されている(図9参照)。尚、図9では、絶縁皮膜が除去された導線接続部Mb、即ち導線本体Daのみとなった導線接続部Mbを図示している。又、図9では、導線接続部Mb(導線本体Da)と接続部116aとが接合される前の状態を図示している。又、本実施の形態では、導線接続部Mb及び接続部116aは、載置凸部Xd上に軸方向に重ねて、詳しくは接続部116aが載置凸部Xdと共に導線接続部Mbを挟むように配置される。又、接続部116aは、前記凹部Xhと周方向に対応した位置に配置される。又、この接続部116aは、24個の短絡片116において、周方向に3つおきに(即ち全体で8個)形成されている。   Moreover, the conducting wire D has a conducting wire body Da (see FIG. 9) made of a conductive metal (copper in the present embodiment) and an insulating film that covers the conducting wire body Da. Then, the insulating film in the conductor connecting portion Mb is removed, and the conductor main body Da exposed at the portion and the connecting portion 116a are joined and electrically connected (see FIG. 9). In FIG. 9, the conductor connection portion Mb from which the insulating film has been removed, that is, the conductor connection portion Mb having only the conductor main body Da is illustrated. Further, FIG. 9 illustrates a state before the conductor connecting portion Mb (conductor main body Da) and the connecting portion 116a are joined. Further, in the present embodiment, the conductor connecting portion Mb and the connecting portion 116a are stacked on the placement convex portion Xd in the axial direction. Specifically, the connection portion 116a sandwiches the conductor connecting portion Mb together with the placement convex portion Xd. Placed in. The connecting portion 116a is disposed at a position corresponding to the concave portion Xh and the circumferential direction. Further, the connection portions 116a are formed at intervals of three (that is, eight in total) in the circumferential direction of the 24 short-circuit pieces 116.

次に、上記のように構成された電機子103の製造方法(金属の接合方法を含む)について詳述する。電機子103の製造方法は、「導線配設工程」、「皮膜除去工程」、及び「接合工程」を含む。   Next, a manufacturing method (including a metal bonding method) of the armature 103 configured as described above will be described in detail. The manufacturing method of the armature 103 includes a “conductor arrangement step”, a “film removal step”, and a “joining step”.

「導線配設工程」では、前記導線Dによって前記巻線M1〜M8を構成する過程で(即ち巻回作業中に)その一部を前記接続部116aと対応した位置(本実施の形態では載置凸部Xd上)に配置する。詳しくは、本実施の形態では、導線Dによって、各巻線M1〜M8を構成する際に、それぞれにおいて最終の巻線(最後のひと巻き)である一部の巻線としての端巻線Ma(図1及び図7参照)を前記分離部Xcより径方向内側に(載置凸部Xd上を通るように)配置し、端巻線Maを除くその他の巻線を前記分離部Xcより径方向外側に配置する。又、本実施の形態では、前記渡り線110を電機子コア107における軸方向他端側(整流子108が配置されない側)に配置する(図11参照)。   In the “conductor arrangement step”, a part of the windings M1 to M8 is formed by the conductor D (that is, during the winding operation) at a position corresponding to the connecting portion 116a (in this embodiment, mounted). (On the placement convex part Xd). Specifically, in the present embodiment, when each of the windings M1 to M8 is configured by the conductive wire D, the end winding Ma (as a partial winding which is the final winding (the last one winding) in each of the windings M1 to M8) 1 and FIG. 7) are arranged radially inward of the separation part Xc (so as to pass over the mounting convex part Xd), and other windings except for the end winding Ma are arranged in the radial direction of the separation part Xc. Place outside. In the present embodiment, the crossover wire 110 is disposed on the other end side in the axial direction of the armature core 107 (the side where the commutator 108 is not disposed) (see FIG. 11).

次に、「皮膜除去工程」では、図7に示すように、導線Dにおける導線接続部Mbにレーザ光LBを照射して該部分の絶縁皮膜を除去し、導線本体Da(図9参照)を露出させる。尚、本実施の形態では、空隙形成溝Xiによって、導線接続部Mbが載置凸部Xdと離間しているため、「皮膜除去工程」時の発熱が載置凸部Xdに伝達されてしまうことが低減される。   Next, in the “film removal step”, as shown in FIG. 7, the conductor connection portion Mb in the conductor D is irradiated with the laser beam LB to remove the insulating film in the portion, and the conductor main body Da (see FIG. 9) is removed. Expose. In the present embodiment, since the conductor connecting portion Mb is separated from the placement convex portion Xd by the gap forming groove Xi, heat generated during the “film removal step” is transmitted to the placement convex portion Xd. Is reduced.

次に、「接合工程」では、まず、前記電機子コア107に対して前記整流子108の軸方向の位置決めを行うことで、前記接続部116aを前記導線Dに軸方向に接触させる。詳しくは、本実施の形態では、電機子コア107が固定された回転軸106に整流子108を圧入によって固定することで前記軸方向の位置決めを行い、それによって接続部116aを導線Dの導線接続部Mbにおける露出した導線本体Daに軸方向に接触させる(図8及び図9参照)。又、このとき、図9に示すように、接続部116aにおける貫通孔116bの第1の開口部116cを導線接続部Mbにおける導線本体Daで塞ぐように配置する。又、本実施の形態では、このとき、接続部116aと前記載置凸部Xd(空隙形成溝Xiが形成された部分を除く)とで導線Dの導線接続部Mb(導線本体Da)を軸方向に挟む。   Next, in the “joining step”, first, the commutator 108 is positioned in the axial direction with respect to the armature core 107, thereby bringing the connecting portion 116 a into contact with the conducting wire D in the axial direction. Specifically, in the present embodiment, the commutator 108 is fixed by press-fitting to the rotating shaft 106 to which the armature core 107 is fixed, thereby positioning in the axial direction, thereby connecting the connection portion 116a to the conductor D. The exposed conductor main body Da in the part Mb is contacted in the axial direction (see FIGS. 8 and 9). Further, at this time, as shown in FIG. 9, the first opening 116c of the through hole 116b in the connection portion 116a is arranged so as to be closed by the conductor main body Da in the conductor connection portion Mb. Further, in this embodiment, at this time, the connecting portion 116a and the mounting convex portion Xd (excluding the portion where the gap forming groove Xi is formed) are used to connect the conducting wire connecting portion Mb (the conducting wire main body Da) of the conducting wire D to the shaft. Hold in the direction.

そして、図8及び図9に示すように、レーザ光LBを接続部116aにおける貫通孔116bの第2の開口部116dの周囲に照射するとともに貫通孔116bを介して前記導線本体Daに照射して接続部116aと導線本体Daとをレーザ溶接によって接合し、それらを電気的に接続固定する。尚、本実施の形態の「皮膜除去工程」と「接合工程」では、同一のレーザ光照射装置を用いてレーザ光LBを照射する。   Then, as shown in FIGS. 8 and 9, the laser beam LB is irradiated around the second opening 116d of the through hole 116b in the connecting portion 116a and is also irradiated to the conductor main body Da through the through hole 116b. The connecting portion 116a and the conductor main body Da are joined by laser welding, and they are electrically connected and fixed. In the “film removal process” and the “bonding process” of the present embodiment, the laser beam LB is irradiated using the same laser beam irradiation apparatus.

このように構成された電機子103においては、前記巻線M1〜M8は、全部で1つの閉ループを構成する。尚、本実施の形態の巻線M1〜M8は、M1、M4、M7、M2、M5、M8、M3、M6、M1…の順で閉ループを構成している。即ち、図4(a)における巻線M1〜M8によって形成される回路を視覚的に分かり易く展開すると図4(b)のようになる。   In the armature 103 configured as described above, the windings M1 to M8 constitute one closed loop in total. Note that the windings M1 to M8 of this embodiment form a closed loop in the order of M1, M4, M7, M2, M5, M8, M3, M6, M1,. That is, when the circuit formed by the windings M1 to M8 in FIG. 4A is developed in a visually easy-to-understand manner, it is as shown in FIG. 4B.

次に、上記実施の形態の特徴的な作用効果を以下に記載する。
(1)「接合工程」にて、レーザ光LBが、接続部116aにおける貫通孔116bの第2の開口部116dの周囲に照射されるとともに貫通孔116bを介して導線接続部Mbにおける導線本体Daに照射され、接続部116a及び導線本体Daがそれぞれ直接レーザ光LBのエネルギーを受ける。又、導線本体Daに照射されたレーザ光LBの一部は反射してしまうが、反射したレーザ光LBの一部は貫通孔116bの内面に照射され、該内面においてもレーザ光LBのエネルギーを受ける。これらのことから、接続部116aと導線接続部Mbにおける導線本体Daとを低エネルギーで良好に接合することができる。しかも、接続部116a側に貫通孔116bを設けたため、接合部分における破損を低減することができる。詳しくは、導線D(導線本体Da)は径が一定であることや緊縛力を有するように設けられることから、導線本体Daに貫通孔を設けると切断されてしまうといった可能性が高くなるが、比較的自由に設計でき剛性を保つことが容易な接続部116a側に貫通孔116bを設けたため、前記切断等の接合部分における破損を低減することができる。又、導線D(導線本体Da)は、一定量の電流を流すことになるため、導線本体Daに貫通孔を設けるとその部分で断面積が小さく、即ち抵抗が大きくなり発熱する可能性が高くなってその発熱に基づいて切断されてしまうといった可能性も高くなるが、この原因に基づく破損をも低減することができる。
Next, characteristic effects of the above embodiment will be described below.
(1) In the “joining step”, the laser beam LB is irradiated around the second opening 116d of the through hole 116b in the connecting portion 116a and the conductor main body Da in the conductor connecting portion Mb through the through hole 116b. The connection part 116a and the conductor main body Da receive the energy of the laser beam LB directly. Further, a part of the laser beam LB irradiated to the conductor main body Da is reflected, but a part of the reflected laser beam LB is irradiated to the inner surface of the through hole 116b, and the energy of the laser beam LB is also applied to the inner surface. receive. From these things, the connection part 116a and the conducting wire main body Da in the conducting wire connection part Mb can be favorably joined with low energy. And since the through-hole 116b was provided in the connection part 116a side, the damage in a junction part can be reduced. In detail, since the conducting wire D (the conducting wire body Da) has a constant diameter and is provided with a binding force, there is a high possibility that the conducting wire body Da will be cut if a through hole is provided in the conducting wire body Da. Since the through-hole 116b is provided on the side of the connecting portion 116a that can be designed relatively freely and can easily maintain rigidity, it is possible to reduce breakage at the joint portion such as cutting. In addition, since a certain amount of current flows through the conductor D (conductor body Da), if a through hole is provided in the conductor body Da, the cross-sectional area is small at that portion, that is, the resistance increases and the possibility of heat generation is high. Therefore, the possibility of being cut based on the heat generation is increased, but the damage due to this cause can also be reduced.

(2)貫通孔116bは、導線接続部Mb(導線本体Da)が配置されて閉塞される側の第1の開口部116cが第2の開口部116dより小さく設定されるため、レーザ光LBが貫通孔116bの内面にも直接照射される。よって、接続部116aと導線接続部Mbにおける導線本体Daとを更に低エネルギーで良好に接合することができる。   (2) The through hole 116b is set so that the first opening 116c on the side where the conducting wire connecting portion Mb (the conducting wire main body Da) is disposed and closed is smaller than the second opening 116d. The inner surface of the through hole 116b is also directly irradiated. Therefore, the connection part 116a and the conducting wire main body Da in the conducting wire connection part Mb can be satisfactorily joined with lower energy.

(3)「接合工程」の前の「皮膜除去工程」にて絶縁皮膜が除去されるため、「接合工程」で絶縁皮膜を溶かしながら接合を行う場合に比べて、接合不良を低減することができる。又、「皮膜除去工程」と「接合工程」では、同一のレーザ光照射装置を用いてレーザ光LBを照射するため、「皮膜除去工程」と「接合工程」とで異なるレーザ光照射装置を用いた場合に比べて、設備、即ち電機子103の製造装置の小スペース化及び低コスト化を図ることができる。   (3) Since the insulation film is removed in the “film removal process” before the “bonding process”, bonding defects can be reduced compared to the case where the bonding is performed while melting the insulation film in the “bonding process”. it can. In the “film removal process” and the “bonding process”, the same laser beam irradiation apparatus is used to irradiate the laser beam LB. Therefore, different laser beam irradiation apparatuses are used in the “film removal process” and the “bonding process”. Compared with the case where it exists, the space-saving and cost reduction of an installation, ie, the manufacturing apparatus of the armature 103, can be achieved.

(4)「導線配設工程」では、導線Dによって巻線M1〜M8を構成する過程で(即ち巻回作業中に)その一部が接続部116aと対応した位置に配置される。即ち、「導線配設工程」では、導線Dによって巻線M1〜M8や渡り線110を構成する過程とかけ離れた動作である「導線を接続部に巻き付ける」といった動作を行わず、単に巻線M1〜M8を構成する一連の過程でその一部(端巻線Maの導線接続部Mb)が接続部116aと対応した位置に配置される。よって、「導線を接続部に巻き付ける」場合に比べて製造工程の簡略化を図ることができ、ひいては製造時間の短縮化等を図ることができる。又、「接合工程」では、接続部116aと導線Dとがレーザ溶接によって電気的に接続されるため、上記したように導線D(導線接続部Mb)を接続部116aと対応した位置に配置するだけ(本実施の形態のように重なるように当接させるだけ)の「導線配設工程」で十分となる。言い換えると、治具を接触させて溶接を行う場合では、治具(例えば一対の電極)を当接させるスペースを(例えば導線を接続部に巻き付けることでその周辺に)確保するといった必要がある。これに対してレーザ溶接の場合では前記スペースが不要となるため、簡単な(本実施の形態のように重なるように当接させるだけの)前記「導線配設工程」としながら、接続部116aと導線Dとを容易に電気的に接続することができる。   (4) In the “conductive wire arranging step”, in the process of forming the windings M1 to M8 by the conductive wire D (that is, during the winding operation), a part thereof is arranged at a position corresponding to the connecting portion 116a. That is, in the “conductive wire arranging step”, an operation such as “winding the conductive wire around the connecting portion”, which is an operation far from the process of forming the windings M1 to M8 and the crossover wire 110 by the conductive wire D, is not performed, but simply the winding M1. In a series of processes constituting .about.M8, a part thereof (conductive wire connecting part Mb of the end winding Ma) is arranged at a position corresponding to the connecting part 116a. Therefore, the manufacturing process can be simplified as compared with the case where “the conductive wire is wound around the connecting portion”, and the manufacturing time can be shortened. Further, in the “joining step”, since the connecting portion 116a and the conducting wire D are electrically connected by laser welding, the conducting wire D (the conducting wire connecting portion Mb) is disposed at a position corresponding to the connecting portion 116a as described above. Only “the conductor arrangement step” is sufficient (just contacting them so as to overlap each other as in the present embodiment). In other words, when welding is performed by bringing a jig into contact with each other, it is necessary to secure a space for contacting the jig (for example, a pair of electrodes) (for example, by winding a conducting wire around the connecting portion). On the other hand, in the case of laser welding, the space becomes unnecessary, and therefore, the connection portion 116a and the connection portion 116a The lead wire D can be easily electrically connected.

上記実施の形態は、以下のように変更してもよい。
・上記実施の形態では、接続部116aの貫通孔116bを1つとしたが、貫通孔の数を複数としてもよく、例えば、図12に示すように、接続部201に、貫通孔201aを導線D(前記導線接続部Mb)に沿って複数(この例では3つ)設けてもよい。このようにすると、接合部分が導線Dに沿って複数となるため、接続部201と導線D(前記導線接続部Mb)とが容易且つ強固に接合される。
The above embodiment may be modified as follows.
In the above embodiment, the number of through-holes 116b of the connecting portion 116a is one, but the number of through-holes may be plural. For example, as shown in FIG. A plurality (three in this example) may be provided along (the conductor connecting portion Mb). If it does in this way, since a joined part will become plural along with conducting wire D, connecting part 201 and conducting wire D (the above-mentioned conducting wire connecting part Mb) will be joined easily and firmly.

・上記実施の形態では、第1の金属部材を接続部116aとし、第2の金属部材を導線接続部Mb(導線本体Da)としたが、これに限定されず、他の第1の金属部材と他の第2の金属部材とをレーザ溶接によって接合する金属の接合方法としてもよい。   In the above embodiment, the first metal member is the connecting portion 116a and the second metal member is the conductive wire connecting portion Mb (conductive wire main body Da). However, the present invention is not limited to this, and other first metal members It is good also as a metal joining method which joins and other 2nd metal members by laser welding.

例えば、図13に示すように、第1の金属部材としての第1の金属板301と第2の金属部材としての第2の金属板302とをレーザ溶接によって接合する金属の接合方法に具体化してもよい。詳しくは、第1の金属板301に予め貫通孔303を設け、その貫通孔303の第1の開口部を第2の金属板302で塞ぐように配置し、レーザ光を第1の金属板301における貫通孔303の第2の開口部の周囲の少なくとも一部に照射するとともに貫通孔303を介して第2の金属板302に照射して接合する接合工程を備えた方法としてもよい。尚、この例では、貫通孔303を3つ設けている。   For example, as shown in FIG. 13, the present invention is embodied in a metal joining method in which a first metal plate 301 as a first metal member and a second metal plate 302 as a second metal member are joined by laser welding. May be. Specifically, the first metal plate 301 is provided with a through-hole 303 in advance, and the first opening of the through-hole 303 is disposed so as to be closed by the second metal plate 302, and laser light is emitted from the first metal plate 301. It is good also as a method provided with the joining process of irradiating and joining to the 2nd metal plate 302 through the through-hole 303 while irradiating at least one part around the 2nd opening part of the through-hole 303 in FIG. In this example, three through holes 303 are provided.

このようにしても、「接合工程」にて、レーザ光が、第1の金属板301における貫通孔303の第2の開口部の周囲の少なくとも一部に照射されるとともに貫通孔303を介して貫通孔303の第1の開口部を塞ぐ第2の金属板302に照射され、第1及び第2の金属板301,302がそれぞれ直接レーザ光のエネルギーを受ける。又、第2の金属板302に照射されたレーザ光の一部は反射してしまうが反射したレーザ光の一部は貫通孔303の内面に照射され、該内面においてもレーザ光のエネルギーを受ける。これらのことから、第1の金属板301と第2の金属板302とを低エネルギーで良好に接合することができる。尚、この例では、貫通孔303を3つ設け3箇所で接合したが、勿論その数は変更してもよいし、更に第1の金属板301の側面(即ち、厚さ方向の直交方向の面)と第2の金属板302の平面とに直接レーザ光を同時に照射してその部分でも接合するようにしてもよい。又、この例に限らず貫通孔を設ける位置は、対象物など(その大きさや形状や周りに配置される部材)に応じて適宜設定可能であるため、レーザ光を照射する位置、ひいては接合位置を適宜設定することができる。よって、例えば、レーザ光を照射することがスペース的に困難となってしまうことを回避することができ、全体としての接合強度を強くすることができる。   Even in such a case, in the “joining step”, the laser beam is applied to at least a part of the periphery of the second opening of the through hole 303 in the first metal plate 301 and through the through hole 303. The second metal plate 302 that closes the first opening of the through hole 303 is irradiated, and each of the first and second metal plates 301 and 302 directly receives the energy of the laser beam. In addition, a part of the laser light applied to the second metal plate 302 is reflected, but a part of the reflected laser light is applied to the inner surface of the through hole 303 and receives the energy of the laser light also on the inner surface. . From these things, the 1st metal plate 301 and the 2nd metal plate 302 can be favorably joined by low energy. In this example, three through-holes 303 are provided and joined at three positions. Of course, the number may be changed, and the side surface of the first metal plate 301 (that is, in the direction orthogonal to the thickness direction). Surface) and the flat surface of the second metal plate 302 may be directly irradiated with laser light at the same time, and the portion may be bonded. In addition, the position where the through hole is provided is not limited to this example, and can be set as appropriate according to the object (the size and shape of the object and the members disposed around it). Can be set as appropriate. Therefore, for example, it can be avoided that it is difficult to irradiate the laser beam in terms of space, and the overall bonding strength can be increased.

・上記実施の形態及び別例では、貫通孔116b,303は、貫通方向から見て円形であるとしたが、これに限定されず、他の形状の貫通孔としてもよい。
例えば、図14(a)に示すように、第1の金属板401と第2の金属板402とをレーザ溶接によって接合する場合における第1の金属板401の貫通孔403を、貫通方向から見て四角形に形成してもよい。尚、この場合においても、レーザ光LBを第1の金属板401における貫通孔403の第2の開口部404の周囲の少なくとも一部に照射する。尚、図14では、レーザ光LBを照射する範囲と対応させて2点鎖線で図示している。そして、この例では、レーザ光LBを貫通孔403の第2の開口部404の一部の周囲であって、軸方向から見て各辺(2つの対向する辺)に対応した周囲それぞれを含むように照射するようにしている。又、レーザ光LBは、この例に限らず、貫通孔の少なくとも一部の対向面と対応した第2の開口部の周囲を含むように照射することが望ましく、その効果が顕著となる。
In the above embodiment and other examples, the through holes 116b and 303 are circular when viewed from the through direction, but are not limited thereto, and may be through holes of other shapes.
For example, as shown in FIG. 14A, when the first metal plate 401 and the second metal plate 402 are joined by laser welding, the through-hole 403 of the first metal plate 401 is viewed from the penetration direction. It may be formed in a quadrangular shape. Even in this case, the laser beam LB is irradiated to at least a part of the periphery of the second opening 404 of the through hole 403 in the first metal plate 401. In FIG. 14, it is shown by a two-dot chain line in correspondence with the range irradiated with the laser beam LB. In this example, the laser beam LB is included around each part of the second opening 404 of the through hole 403 and corresponding to each side (two opposing sides) when viewed from the axial direction. I am trying to irradiate. Further, the laser beam LB is not limited to this example, and it is desirable to irradiate the laser beam LB so as to include the periphery of the second opening corresponding to at least a part of the opposing surface of the through hole, and the effect becomes remarkable.

又、例えば、図14(b)に示すように、第1の金属板501と第2の金属板502とをレーザ溶接によって接合する場合における第1の金属板501の貫通孔503を、貫通方向から見て楕円形に形成してもよい。   Further, for example, as shown in FIG. 14B, when the first metal plate 501 and the second metal plate 502 are joined by laser welding, the through hole 503 of the first metal plate 501 is formed in the penetration direction. It may be formed in an oval shape when viewed from the top.

又、例えば、図14(c)に示すように、第1の金属板601と第2の金属板602とをレーザ溶接によって接合する場合における第1の金属板601の貫通孔603を、貫通方向の直交方向(図中、右方向)に一部が延びて(第1の金属板601の)外側に連通し周方向に閉じていないものとしてもよい。   Further, for example, as shown in FIG. 14C, when the first metal plate 601 and the second metal plate 602 are joined by laser welding, the through hole 603 of the first metal plate 601 is formed in the penetration direction. It is good also as what is partly extended in the orthogonal direction (right direction in a figure), and is connected to the outer side (1st metal plate 601), and is not closed in the circumferential direction.

・上記別例(図13、図14(a)〜(c)等)では、1つの部材である第1の金属板301,401,501,601と第2の金属板302,402,502,602とをレーザ溶接によって接合する金属の接合方法に具体化したが、第1の金属部材としての第1の金属板が複数の金属部材としての複数の金属板からなるものとしてもよい。例えば、図14(d)に示すように、第1の金属部材としての第1の金属板651が2つの金属板651a,651bからなり、それら2つの金属板651a,651bの間に擬似的な(各金属板651a,651bに分割して形成されたものを合わせることで)貫通孔652を設けて実施してもよい。即ち、上記した貫通孔652の第1の開口部を第2の金属板653で塞ぐように配置し、レーザ光LBを第1の金属板651(2つの金属板651a,651b)における貫通孔652の第2の開口部の周囲に照射するとともに貫通孔652を介して第2の金属板653に照射して接合する接合工程を備えた方法としてもよい。このようにすると、第1の金属板651(2つの金属板651a,651b)と第2の金属板653とを低エネルギーで良好に接合することができる。又、勿論、第1の金属部材としての第1の金属板が3つ以上の金属板からなり、それらの金属板の間に擬似的な貫通孔を設けて同様に実施してもよい。   In the other examples (FIGS. 13, 14A to 14C, etc.), the first metal plates 301, 401, 501, 601 and the second metal plates 302, 402, 502, which are one member, However, the first metal plate as the first metal member may be composed of a plurality of metal plates as a plurality of metal members. For example, as shown in FIG. 14 (d), the first metal plate 651 as the first metal member is composed of two metal plates 651a and 651b, and the two metal plates 651a and 651b are simulated. You may implement by providing the through-hole 652 (by combining what was divided | segmented and formed in each metal plate 651a, 651b). That is, the first opening of the through hole 652 is arranged so as to be closed by the second metal plate 653, and the laser beam LB is passed through the through hole 652 in the first metal plate 651 (two metal plates 651a and 651b). It is good also as a method provided with the joining process of irradiating the 2nd metal plate 653 through the through-hole 652, and irradiating the circumference | surroundings of the 2nd opening part. If it does in this way, the 1st metal plate 651 (two metal plates 651a and 651b) and the 2nd metal plate 653 can be joined favorably with low energy. Of course, the first metal plate as the first metal member may be composed of three or more metal plates, and a pseudo through hole may be provided between the metal plates.

・上記実施の形態では、貫通孔116bは、導線接続部Mb(導線本体Da)が配置されて閉塞される側の第1の開口部116cが第2の開口部116dより小さく設定されるとしたが、これに限定されず、例えば、第1及び第2の開口部が同じ大きさに設定された貫通孔に変更してもよい。又、例えば、図15に示すように、第1の金属板701と第2の金属板702とをレーザ溶接によって接合する場合における第1の金属板701の貫通孔703を、第2の開口部704が第2の金属板702にて塞がれる側の第1の開口部705より小さくなるように設定してもよい。尚、この例の貫通孔703は、貫通方向から見て円形であって、その直径が第1の開口部705から第2の開口部704に向かうほど小さくなるように設定されている。   In the above embodiment, the through-hole 116b is set such that the first opening 116c on the side where the conductive wire connecting portion Mb (conductive wire main body Da) is arranged and closed is smaller than the second opening 116d. However, it is not limited to this, For example, you may change into the through-hole by which the 1st and 2nd opening part was set to the same magnitude | size. Further, for example, as shown in FIG. 15, when the first metal plate 701 and the second metal plate 702 are joined by laser welding, a through hole 703 of the first metal plate 701 is formed as a second opening. You may set so that 704 may become smaller than the 1st opening part 705 by the side closed with the 2nd metal plate 702. FIG. The through hole 703 in this example is circular when viewed from the penetrating direction, and the diameter thereof is set so as to decrease from the first opening 705 toward the second opening 704.

このようにすると、第2の金属板702にて反射したレーザ光LBの一部が貫通孔703の内面と第2の金属板702とで反射を繰り返しやすくなり、レーザ光LBが外部に反射してしまうことを低減することができる。尚、図15では、反射を繰り返すレーザ光LBaを矢印にて模式的に図示している。よって、第1の金属板701と第2の金属板702とを更に低エネルギーで良好に接合することができる。   In this way, a part of the laser beam LB reflected by the second metal plate 702 can be easily reflected by the inner surface of the through hole 703 and the second metal plate 702, and the laser beam LB is reflected to the outside. Can be reduced. In FIG. 15, the laser beam LBa that repeats reflection is schematically shown by an arrow. Therefore, the first metal plate 701 and the second metal plate 702 can be favorably bonded with lower energy.

・上記実施の形態では、貫通孔116bが形成された接続部116aは径方向外側に延出するだけの形状であったが、これに限定されず、例えば、図16に示すように、導線Dの外周に沿った湾曲部801aを有する接続部801とし、前記湾曲部801aに貫通孔801bを設けてもよい。又、この例の貫通孔801bは、導線Dにて塞がれる側の第1の開口部801cより第2の開口部801dが小さくなるように、即ちその直径が第1の開口部801cから第2の開口部801dに向かうほど小さくなるように設定されている。よって、上記別例(図15参照)と同様に、導線Dにて反射したレーザ光LBの一部が貫通孔801bの内面と導線Dとで反射を繰り返しやすくなり、レーザ光LBが外部に反射してしまうことを低減することができる。尚、図16では、反射を繰り返すレーザ光LBaを矢印にて模式的に図示している。又、図12に示す上記した別例においては詳述しなかったが、図12に示す別例においても、接続部201は導線Dの外周に沿った湾曲部を有し、貫通孔201aは湾曲部に設けられている。このようにすると、接続部801(201)と導線Dとが広範囲に渡って密着するとともに、それらの位置ずれが防止されて接合される。よって、接続部801(201)と導線Dとを容易且つ強固に接合することができる。   In the above embodiment, the connecting portion 116a in which the through hole 116b is formed has a shape that only extends outward in the radial direction. However, the present invention is not limited to this. For example, as shown in FIG. A connecting portion 801 having a curved portion 801a along the outer periphery of the curved portion 801a may be provided, and a through hole 801b may be provided in the curved portion 801a. In addition, the through hole 801b in this example has a second opening 801d smaller than the first opening 801c on the side closed by the conducting wire D, that is, the diameter thereof is larger than that of the first opening 801c. It is set to become smaller toward the second opening 801d. Therefore, as in the other example (see FIG. 15), part of the laser beam LB reflected by the conducting wire D is easily reflected by the inner surface of the through hole 801b and the conducting wire D, and the laser beam LB is reflected to the outside. Can be reduced. In FIG. 16, the laser beam LBa that repeats reflection is schematically shown by an arrow. Although not described in detail in the other example shown in FIG. 12, in the other example shown in FIG. 12, the connecting portion 201 has a curved portion along the outer periphery of the conductor D, and the through hole 201a is curved. Provided in the department. If it does in this way, while connecting part 801 (201) and conducting wire D will adhere over a wide range, they will be joined, preventing the position gap. Therefore, the connection part 801 (201) and the conducting wire D can be joined easily and firmly.

又、この例(図16参照)では、図17に示すように、先端に向かうほど小径となる縮径部802aを備えた孔あけ治具としての錐802にて前記貫通孔801bを成形している(「孔成形工程」)。詳しくは、この「孔成形工程」では、図17に示すように、貫通孔801bが形成されていない接続部801の湾曲部801aの湾曲形状における凹側から該湾曲部801aに対して錐802の縮径部802aを貫通方向に相対移動させて貫通孔801bを成形している。又、勿論、錐802は、ドリル等の他の孔あけ治具に変更してもよい。このようにすると、前記貫通孔801bを容易に形成することができる。   In this example (see FIG. 16), as shown in FIG. 17, the through hole 801b is formed by a cone 802 as a drilling jig provided with a reduced diameter portion 802a that decreases in diameter toward the tip. ("Hole forming process"). Specifically, in this “hole forming step”, as shown in FIG. 17, the cone 802 is formed from the concave side of the curved shape of the curved portion 801a of the connecting portion 801 where the through-hole 801b is not formed to the curved portion 801a. The through hole 801b is formed by relatively moving the reduced diameter portion 802a in the penetration direction. Of course, the cone 802 may be changed to another drilling jig such as a drill. In this way, the through hole 801b can be easily formed.

・上記実施の形態では、「接合工程」の前の「皮膜除去工程」にて導線接続部Mbの絶縁皮膜を除去したが、これに限定されず、絶縁皮膜が残ったままの導線接続部Mbで貫通孔116bの第1の開口部116cを塞ぐように配置してレーザ光LBを照射し、絶縁皮膜を溶かしながら接合(「接合工程」)を行うようにしてもよい。   In the above embodiment, the insulating film of the conductive wire connecting part Mb is removed in the “film removing process” before the “joining process”, but the present invention is not limited to this, and the conductive wire connecting part Mb with the insulating film remaining remains. Then, the first opening 116c of the through-hole 116b may be closed and irradiated with the laser beam LB, and bonding (“bonding step”) may be performed while melting the insulating film.

・上記実施の形態では、「皮膜除去工程」と「接合工程」では、同一のレーザ光照射装置を用いてレーザ光LBを照射するとしたが、「皮膜除去工程」と「接合工程」とで異なるレーザ光照射装置を用いてもよい。又、例えば、上記実施の形態の「皮膜除去工程」を、レーザ光LBを照射せずに絶縁皮膜を他の方法で除去する他の「皮膜除去工程」としてもよい。   In the above embodiment, the “film removal process” and the “bonding process” are performed by irradiating the laser beam LB using the same laser light irradiation apparatus, but the “film removal process” and the “bonding process” are different. You may use a laser beam irradiation apparatus. Further, for example, the “film removal step” in the above embodiment may be another “film removal step” in which the insulating film is removed by another method without irradiating the laser beam LB.

上記各実施の形態から把握できる技術的思想について、以下にその効果とともに記載する。
(イ)請求項1に記載の金属の接合方法において、前記貫通孔は、前記第1の開口部が前記第2の開口部より小さく設定されたことを特徴とする金属の接合方法。
The technical idea that can be grasped from the above embodiments will be described below together with the effects thereof.
(A) The metal bonding method according to claim 1, wherein the through hole is set such that the first opening is smaller than the second opening.

このようにすると、貫通孔は、第1の開口部が第2の開口部より小さく設定されるため、レーザ光が貫通孔の内面にも直接照射される。よって、第1の金属部材と第2の金属部材とを更に低エネルギーで良好に接合することができる。   If it does in this way, since a 1st opening part is set smaller than a 2nd opening part, a laser beam is directly irradiated also to the inner surface of a through-hole. Therefore, the first metal member and the second metal member can be favorably bonded with lower energy.

(ロ)請求項4乃至6のいずれか1項に記載の電機子の製造方法において、前記導線は、導電性金属よりなる導線本体と該導線本体を被覆する絶縁皮膜とを有するものであって、前記接合工程の前に、導線にレーザ光を照射して前記絶縁皮膜を除去する皮膜除去工程を備え、前記皮膜除去工程と前記接合工程では、同一のレーザ光照射装置を用いてレーザ光を照射することを特徴とする電機子の製造方法。   (B) In the armature manufacturing method according to any one of claims 4 to 6, the conductive wire has a conductive wire body made of a conductive metal and an insulating film covering the conductive wire body. Before the bonding step, a film removal step is performed to irradiate a lead wire with a laser beam to remove the insulating film, and in the film removal step and the bonding step, a laser beam is emitted using the same laser beam irradiation device. Irradiating an armature.

このようにすると、接合工程の前の皮膜除去工程にて絶縁皮膜が除去されるため、接合工程で絶縁皮膜を溶かしながら接合を行う場合に比べて、接合不良を低減することができる。又、皮膜除去工程と接合工程では、同一のレーザ光照射装置を用いてレーザ光を照射するため、皮膜除去工程と接合工程とで異なるレーザ光照射装置を用いた場合に比べて、設備、即ち電機子の製造装置の小スペース化及び低コスト化を図ることができる。   If it does in this way, since an insulating film is removed at the film removal process before a joining process, compared with the case where it joins, melt | dissolving an insulating film at a joining process, it can reduce joint defect. Also, in the film removal process and the bonding process, the same laser beam irradiation apparatus is used to irradiate the laser beam. Therefore, compared to the case where different laser beam irradiation apparatuses are used in the film removal process and the bonding process, It is possible to reduce the space and cost of the armature manufacturing apparatus.

本実施の形態におけるモータの概略構成図。1 is a schematic configuration diagram of a motor in the present embodiment. 本実施の形態におけるモータの要部断面図。FIG. 3 is a cross-sectional view of a main part of the motor in the present embodiment. 本実施の形態における短絡部材の平面図。The top view of the short circuit member in this Embodiment. (a)本実施の形態の電機子を平面状に展開して説明するための説明図。(b)本実施の形態の電機子の巻線によって形成される回路図。(A) Explanatory drawing for demonstrating the armature of this Embodiment expand | deployed planarly. (B) The circuit diagram formed with the coil | winding of the armature of this Embodiment. 本実施の形態の軸方向一端側のインシュレータ及び電機子コアの平面図。The top view of the insulator and armature core of the axial direction one end side of this Embodiment. 本実施の形態の軸方向他端側のインシュレータ及び電機子コアの底面図。The bottom view of the insulator and armature core of the axial direction other end side of this Embodiment. 本実施の形態における電機子の製造方法を説明するための要部拡大斜視図。The principal part expansion perspective view for demonstrating the manufacturing method of the armature in this Embodiment. 本実施の形態における電機子の製造方法を説明するための要部拡大斜視図。The principal part expansion perspective view for demonstrating the manufacturing method of the armature in this Embodiment. 本実施の形態における電機子の製造方法を説明するための要部拡大断面図。The principal part expanded sectional view for demonstrating the manufacturing method of the armature in this Embodiment. 本実施の形態における電機子を説明するための要部拡大底面図。The principal part expanded bottom view for demonstrating the armature in this Embodiment. 本実施の形態における電機子を説明するための斜視図。The perspective view for demonstrating the armature in this Embodiment. 別例における接続部を説明するための斜視図。The perspective view for demonstrating the connection part in another example. 別例における金属の接合方法を説明するための斜視図。The perspective view for demonstrating the joining method of the metal in another example. (a)〜(d)別例における貫通孔を説明するための平面図。(A)-(d) The top view for demonstrating the through-hole in another example. 別例における貫通孔を説明するための断面図。Sectional drawing for demonstrating the through-hole in another example. 別例における接続部を説明するための断面図。Sectional drawing for demonstrating the connection part in another example. 別例における電機子の製造方法を説明するための模式断面図。The schematic cross section for demonstrating the manufacturing method of the armature in another example.

符号の説明Explanation of symbols

1〜24…セグメント、108…整流子、116a,201,801…接続部(第1の金属部材)、116b,201a,303,403,503,603,652,703,801b…貫通孔、116c,705,801c…第1の開口部、116d,404,704,801d…第2の開口部、301,401,501,601,651(651a,651b),701…第1の金属板(第1の金属部材)、302,402,502,602,653,702…第2の金属板(第2の金属部材)、801a…湾曲部、802…錐(孔あけ治具)、802a…縮径部、D…導線、LB…レーザ光、Mb…導線接続部(第2の金属部材)、M1〜M8…巻線。   1-24 ... Segment, 108 ... Commutator, 116a, 201, 801 ... Connection (first metal member), 116b, 201a, 303, 403, 503, 603, 652, 703, 801b ... Through-hole, 116c, 705, 801c ... 1st opening, 116d, 404, 704, 801d ... 2nd opening, 301, 401, 501, 601, 651 (651a, 651b), 701 ... 1st metal plate (1st (Metal member), 302, 402, 502, 602, 653, 702 ... second metal plate (second metal member), 801a ... curved portion, 802 ... cone (drilling jig), 802a ... reduced diameter portion, D ... conductive wire, LB ... laser beam, Mb ... conductive wire connection part (second metal member), M1 to M8 ... winding.

Claims (6)

第1の金属部材と第2の金属部材とをレーザ溶接によって接合する金属の接合方法であって、
前記第1の金属部材に予め貫通孔を設け、その貫通孔の第1の開口部を前記第2の金属部材で塞ぐように配置し、レーザ光を前記第1の金属部材における前記貫通孔の第2の開口部の周囲の少なくとも一部に照射するとともに前記貫通孔を介して前記第2の金属部材に照射して前記第1の金属部材と前記第2の金属部材とを接合する接合工程を備えたことを特徴とする金属の接合方法。
A metal joining method for joining a first metal member and a second metal member by laser welding,
A through hole is provided in the first metal member in advance, the first opening of the through hole is disposed so as to be closed with the second metal member, and laser light is emitted from the through hole in the first metal member. A joining step of irradiating at least a part of the periphery of the second opening and irradiating the second metal member through the through hole to join the first metal member and the second metal member. A method for joining metals, comprising:
請求項1に記載の金属の接合方法において、
前記貫通孔は、前記第2の開口部が前記第1の開口部より小さく設定されたことを特徴とする金属の接合方法。
The metal bonding method according to claim 1,
The metal joining method, wherein the through-hole is set such that the second opening is smaller than the first opening.
請求項2に記載の金属の接合方法において、
先端に向かうほど小径となる縮径部を備えた孔あけ治具にて前記貫通孔を成形する孔成形工程を備えたことを特徴とする金属の接合方法。
The metal bonding method according to claim 2,
A metal joining method, comprising: a hole forming step of forming the through hole with a drilling jig having a reduced diameter portion that decreases in diameter toward the tip.
請求項1乃至3のいずれか1項に記載の金属の接合方法における接合工程を備えた電機子の製造方法であって、
前記第1の金属部材は、整流子のセグメントから延出した接続部であって、
前記第2の金属部材は、巻線を構成する導線の一部であることを特徴とする電機子の製造方法。
A method for manufacturing an armature comprising a joining step in the metal joining method according to any one of claims 1 to 3,
The first metal member is a connecting portion extending from a commutator segment,
The method of manufacturing an armature, wherein the second metal member is a part of a conductive wire constituting a winding.
請求項4に記載の電機子の製造方法において、
前記接続部は導線の外周に沿った湾曲部を有し、前記貫通孔を前記湾曲部に設けることを特徴とする電機子の製造方法。
In the manufacturing method of the armature of Claim 4,
The connecting part has a curved part along the outer periphery of the conducting wire, and the through hole is provided in the curved part.
請求項4又は5に記載の電機子の製造方法において、
前記貫通孔を前記導線に沿って複数設けることを特徴とする電機子の製造方法。
In the manufacturing method of the armature according to claim 4 or 5,
A method of manufacturing an armature, wherein a plurality of the through holes are provided along the conducting wire.
JP2007007878A 2007-01-17 2007-01-17 Metal joining method and armature manufacturing method Pending JP2008173657A (en)

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CN115740744A (en) * 2021-09-03 2023-03-07 泰连德国有限公司 Semi-finished product with a window, method for producing an electrical contact element and electrical contact element

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