[go: up one dir, main page]

JP2008165028A - Liquid crystal display - Google Patents

Liquid crystal display Download PDF

Info

Publication number
JP2008165028A
JP2008165028A JP2006355656A JP2006355656A JP2008165028A JP 2008165028 A JP2008165028 A JP 2008165028A JP 2006355656 A JP2006355656 A JP 2006355656A JP 2006355656 A JP2006355656 A JP 2006355656A JP 2008165028 A JP2008165028 A JP 2008165028A
Authority
JP
Japan
Prior art keywords
region
tft
film transistor
thin film
liquid crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006355656A
Other languages
Japanese (ja)
Inventor
Yasumasa Goto
康正 後藤
Masataka Yamamoto
昌伯 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Display Central Inc
Original Assignee
Toshiba Matsushita Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Matsushita Display Technology Co Ltd filed Critical Toshiba Matsushita Display Technology Co Ltd
Priority to JP2006355656A priority Critical patent/JP2008165028A/en
Publication of JP2008165028A publication Critical patent/JP2008165028A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Liquid Crystal (AREA)
  • Thin Film Transistor (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To stabilize the operation of a drive circuit, while suppressing deterioration of display contrast in a liquid crystal display device having drive circuit elements integrated on the same substrate. <P>SOLUTION: In the display device 1, which is equipped with a first thin-film transistor (TFT) 20 for driving a pixel electrode 44, and a second TFT 50 for supplying the drive signal to the first TFT 20 on a transparent substrate 12, the liquid crystal display is provided with the first TFT 20 and the second TFT 50, respectively having semiconductor layers 22, 52 provided with low concentration impurity regions 30, 31, 60, 61 arranged between channel regions 28, 58 and drain regions 34, 64 and source regions 32, 62; and where a gap Ld between opposing end portions of the channel region 58 and the drain region 64 of the second TFT 50 is shorter than the gap Lp, between opposing end portions of the channel region 28 and the drain region 34 of the first TFT 20. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、液晶表示装置に関し、特に、薄膜トランジスタ(TFT)を用いたアクティブマトリックス型液晶表示装置に関する。   The present invention relates to a liquid crystal display device, and more particularly to an active matrix liquid crystal display device using thin film transistors (TFTs).

液晶表示装置は、表示部の薄型化が可能であり、事務機器やコンピュータ等の表示装置あるいは特殊な表示装置への用途として要求が高まっている。   The liquid crystal display device can have a thin display portion, and there is an increasing demand for use as a display device such as office equipment and a computer or a special display device.

これらの中で、アモルファスシリコン(a−Si)またはポリシリコン(p−Si)を用いたTFTをスイッチング素子としてマトリクス上に配した液晶表示装置は、表示品位が高く、低消費電力であるため、その開発が盛んに行われている。   Among these, a liquid crystal display device in which a TFT using amorphous silicon (a-Si) or polysilicon (p-Si) is arranged on a matrix as a switching element has high display quality and low power consumption. Its development is actively underway.

特にp−Siを用いたTFT(p−SiTFT)は、a−Siを用いたTFT(a−SiTFT)よりも移動度が10から100倍程度高く、その利点を利用して画素スイッチング素子して用いるだけでなく、周辺駆動回路にp−SiTFTを用いて、画素TFTと駆動回路TFTを同一基板上に一体的に形成する駆動回路一体型の液晶表示装置が知られている。   In particular, a TFT using p-Si (p-Si TFT) has a mobility about 10 to 100 times higher than that of a TFT using a-Si (a-Si TFT). In addition to the use, a liquid crystal display device integrated with a drive circuit in which a pixel TFT and a drive circuit TFT are integrally formed on the same substrate by using a p-Si TFT in a peripheral drive circuit is known.

また、p−Siには結晶成長プロセス温度の相違により、高温ポリシリコンと低温ポリシリコンに分類される。高温ポリシリコンは、高温でSPC(固相成長)により形成されるため均一な半導体層を容易に得ることができるが、石英基板など耐熱性に優れた基板上に形成する必要がある。このような耐熱性に優れた基板は通常高価で基板自体が小さいため、高温ポリシリコンからなるTFTは、プロジェクタのような投射型の液晶表示装置において好適に用いられる。   Further, p-Si is classified into high-temperature polysilicon and low-temperature polysilicon depending on the difference in crystal growth process temperature. High-temperature polysilicon is formed by SPC (solid phase growth) at a high temperature, so that a uniform semiconductor layer can be easily obtained. However, it needs to be formed on a substrate having excellent heat resistance such as a quartz substrate. Since such a substrate having excellent heat resistance is usually expensive and the substrate itself is small, a TFT made of high-temperature polysilicon is suitably used in a projection-type liquid crystal display device such as a projector.

一方、TFTでは、シリコンなどの半導体層に光が照射されるとリーク電流が流れる。そのため、液晶表示装置では、バックライトからの光によって画素TFTにリーク電流が発生し、表示のコントラスト等を劣化させる問題があり、特に強い光を照射するプロジェクタの場合では上記の問題が生じやすい。そこで、画素TFTの上層側及び下層側に金属製の遮光層を設けることで、半導体層に光が照射されるのを防ぎリーク電流を抑えることがなされている。   On the other hand, in a TFT, a leak current flows when light is applied to a semiconductor layer such as silicon. Therefore, in the liquid crystal display device, there is a problem that a leak current is generated in the pixel TFT due to light from the backlight, and the display contrast and the like are deteriorated. In the case of a projector that emits particularly intense light, the above problem is likely to occur. Therefore, by providing a metal light-shielding layer on the upper layer side and lower layer side of the pixel TFT, it is possible to prevent the semiconductor layer from being irradiated with light and to suppress the leakage current.

また、TFTでは、チャネル領域とソース領域の間やチャネル領域とドレイン領域の間に低濃度不純物(LDD:lightly doped drain)領域を設けることでドレイン端での高電界を緩和してリーク電流の発生を抑制することがなされている。このようなLDD領域を備えたTFTにおいて、リーク電流の電流経路の一部であるLDD領域を狭小化することで更なるリーク電流の抑制を図ることがなされている(例えば、下記特許文献1参照)。   In addition, in a TFT, a low-concentration impurity (LDD: lightly doped drain) region is provided between a channel region and a source region or between a channel region and a drain region, thereby relaxing a high electric field at the drain end and generating leakage current. Has been made to suppress. In a TFT having such an LDD region, the leakage current is further suppressed by narrowing the LDD region that is a part of the current path of the leakage current (see, for example, Patent Document 1 below). ).

しかしながら、画素TFTと駆動回路TFTを同一基板上に一体的に形成する駆動回路一体型の表示装置において、上記のようなLDD領域を狭小化した場合、次のような問題がある。すなわち、LDD領域はドレイン端での高電界を緩和しTFTのオフ時のリーク電流を低くする機能を有しており、その長さが長いほど電界が緩和され、リーク電流の低減が図られるため、極端な狭小化を図ることはできない。一方で、LDD領域はTFTのオン状態において直列に付加された抵抗として作用するため、このLDD領域の抵抗によりTFTのオン電流が低下するおそれがある。このようなTFTを駆動回路TFTに用いると、オン電流の低下により駆動回路の動作が不安定になる問題がある。   However, in a drive circuit integrated display device in which the pixel TFT and the drive circuit TFT are integrally formed on the same substrate, there are the following problems when the LDD region is narrowed as described above. That is, the LDD region has a function of relaxing a high electric field at the drain end and reducing a leakage current when the TFT is turned off. The longer the length, the more the electric field is relaxed and the leakage current is reduced. It is not possible to achieve extreme narrowing. On the other hand, since the LDD region acts as a resistance added in series in the on state of the TFT, the on-current of the TFT may be reduced by the resistance of the LDD region. When such a TFT is used for the drive circuit TFT, there is a problem that the operation of the drive circuit becomes unstable due to a decrease in on-current.

また、低温ポリシリコンからなるTFTでは、高温ポリシリコンに比べLDD領域を寸法精度よく形成することができないため、LDD領域のソース−ドレイン方向の長さ、すなわち相対向するチャネル端とドレイン端の間隔やチャネル端とソース端の間隔が小さいものが製造されるおそれがある。LDD領域のソース−ドレイン方向の長さが小さいTFTが画素TFTに用いられると、ドレイン端における電界が充分に緩和されずリーク電流が増大して液晶表示のコントラスト等を劣化させることから、低温ポリシリコンからなるTFTにおいてはLDD領域の長さにマージンが設けられている。   Also, in a TFT made of low-temperature polysilicon, the LDD region cannot be formed with high dimensional accuracy compared to high-temperature polysilicon, so the length of the LDD region in the source-drain direction, that is, the distance between the opposite channel end and drain end. In addition, a device having a small gap between the channel end and the source end may be manufactured. If a TFT with a small length in the source-drain direction of the LDD region is used for the pixel TFT, the electric field at the drain end is not sufficiently relaxed and the leakage current increases to deteriorate the contrast of the liquid crystal display. In a TFT made of silicon, a margin is provided for the length of the LDD region.

しかしながら、画素TFTと駆動回路TFTを同一基板上に一体的に形成する駆動回路一体型の表示装置において、画素TFTと駆動回路TFTに対してLDD領域のソース−ドレイン方向の長さを一律に設定した場合、駆動回路TFTのオン電流が低下することとなり、駆動回路の動作が不安定になる問題がある。
特開2005−259782号公報
However, in a display device integrated with a drive circuit in which the pixel TFT and the drive circuit TFT are integrally formed on the same substrate, the length in the source-drain direction of the LDD region is uniformly set with respect to the pixel TFT and the drive circuit TFT. In this case, the on-current of the drive circuit TFT is lowered, and there is a problem that the operation of the drive circuit becomes unstable.
JP 2005-259882 A

本発明は上記問題に鑑みてなされたものであり、画素TFTと駆動回路TFTを同一基板上に一体的に形成する駆動回路一体型の液晶表示装置において、画素TFTのリーク電流を抑制して表示コントラストの劣化を抑えるとともに、駆動回路TFTのオン電流の低下を抑えて駆動回路を安定動作させることができる液晶表示装置を提供することを目的とする。   The present invention has been made in view of the above problems, and in a liquid crystal display device integrated with a drive circuit in which a pixel TFT and a drive circuit TFT are integrally formed on the same substrate, display is performed while suppressing leakage current of the pixel TFT. An object of the present invention is to provide a liquid crystal display device capable of suppressing the deterioration of the contrast and suppressing the decrease of the on-current of the driving circuit TFT to stably operate the driving circuit.

本発明の液晶表示装置は、アレイ基板と対向基板との間に液晶層を挟持して構成された液晶表示装置において、前記アレイ基板は、表示領域及び駆動回路領域に区画された透明基板と前記表示領域に形成され表示領域にマトリクス状に配置された画素電極を駆動する第1薄膜トランジスタと、前記透明基板の前記駆動回路領域に形成され前記第1薄膜トランジスタに駆動信号を供給する第2薄膜トランジスタと、を備え、前記第1薄膜トランジスタ及び第2薄膜トランジスタは、チャネル領域と、前記チャネル領域を挟んで対向するソース領域及びドレイン領域と、少なくとも前記チャネル領域と前記ドレイン領域との間に配された低濃度不純物領域とを備える半導体層をそれぞれ有し、前記第2薄膜トランジスタの前記チャネル領域と前記ドレイン領域の間隔が、前記第1薄膜トランジスタの前記チャネル領域と前記ドレイン領域の間隔より短いことを特徴とする。   The liquid crystal display device of the present invention is a liquid crystal display device configured by sandwiching a liquid crystal layer between an array substrate and a counter substrate, wherein the array substrate includes a transparent substrate partitioned into a display region and a drive circuit region, and A first thin film transistor that drives pixel electrodes arranged in a matrix in the display region, and a second thin film transistor that is formed in the drive circuit region of the transparent substrate and supplies a drive signal to the first thin film transistor; The first thin film transistor and the second thin film transistor include a channel region, a source region and a drain region facing each other with the channel region interposed therebetween, and at least a low-concentration impurity disposed between the channel region and the drain region. A semiconductor layer comprising a region, and the channel region of the second thin film transistor and the Interval rain region is characterized by shorter than the interval of the channel region and the drain region of the first TFT.

本発明によれば、画素TFTと駆動回路TFTを同一基板上に一体的に形成する駆動回路一体型の液晶表示装置において、表示コントラストの劣化を抑えつつ駆動回路を安定動作させることができる。   According to the present invention, in a drive circuit integrated liquid crystal display device in which a pixel TFT and a drive circuit TFT are integrally formed on the same substrate, the drive circuit can be stably operated while suppressing deterioration of display contrast.

以下、本発明の一実施形態について図面を参照して説明する。   Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

図1は、本発明の一実施形態に係る液晶表示装置1を概略的に示す断面図であり、図2は同液晶表示装置1の要部拡大断面図である。   FIG. 1 is a cross-sectional view schematically showing a liquid crystal display device 1 according to an embodiment of the present invention, and FIG. 2 is an enlarged cross-sectional view of a main part of the liquid crystal display device 1.

この液晶表示装置1は、図1に示すように、アレイ基板10と、このアレイ基板10に対向配置された対向基板100と、アレイ基板10と対向基板100との間に配置された液晶層90とを備えている。これらアレイ基板10と対向基板100とは、液晶層90を挟持するための所定のギャップを形成するシール部材(不図示)によって貼り合わせられている。   As shown in FIG. 1, the liquid crystal display device 1 includes an array substrate 10, a counter substrate 100 disposed to face the array substrate 10, and a liquid crystal layer 90 disposed between the array substrate 10 and the counter substrate 100. And. The array substrate 10 and the counter substrate 100 are bonded together by a seal member (not shown) that forms a predetermined gap for sandwiching the liquid crystal layer 90.

液晶層90は、アレイ基板10と対向基板100との間に封入された液晶組成物によって構成されている。またこの液晶表示装置1の両面には偏光板18、110がそれぞれ貼り付けられており、その背面には図示しない光源が配置されている。   The liquid crystal layer 90 is composed of a liquid crystal composition sealed between the array substrate 10 and the counter substrate 100. Further, polarizing plates 18 and 110 are respectively attached to both surfaces of the liquid crystal display device 1, and a light source (not shown) is disposed on the back thereof.

アレイ基板10は、画像を表示する表示領域R1と、その外周部において駆動回路が形成される駆動回路領域R2に区画されており、表示領域R1は、互いに交差してなる複数の信号線(図示せず)とゲート線(図示せず)との交差部に画素電極44と接続されたスイッチング素子であるn型のp−SiTFT(以下、画素TFTという)20をマトリクス状に有し、駆動回路領域R2は、駆動回路素子であるn型のp−SiTFT(以下、駆動回路TFTという)50を有する。この画素TFT20は駆動回路TFT50からの映像信号やゲート信号等の駆動信号によって駆動される。例えば、駆動回路TFT50が信号線ドライバ用の駆動回路TFT50の場合には映像信号が、また走査線ドライバ用の駆動回路TFT50の場合にはゲート信号が、夫々の駆動回路TFT50から画素TFT20に供給される。   The array substrate 10 is divided into a display region R1 for displaying an image and a drive circuit region R2 in which a drive circuit is formed on the outer periphery thereof, and the display region R1 includes a plurality of signal lines (see FIG. The driving circuit includes an n-type p-Si TFT (hereinafter referred to as a pixel TFT) 20 which is a switching element connected to the pixel electrode 44 at a crossing portion between a gate line (not shown) and a gate line (not shown). The region R2 includes an n-type p-Si TFT (hereinafter referred to as a drive circuit TFT) 50 that is a drive circuit element. The pixel TFT 20 is driven by a drive signal such as a video signal or a gate signal from the drive circuit TFT 50. For example, when the driving circuit TFT 50 is a driving circuit TFT 50 for a signal line driver, a video signal is supplied to the pixel TFT 20 from each driving circuit TFT 50, and when the driving circuit TFT 50 is a driving circuit TFT 50 for a scanning line driver. The

より詳細には、アレイ基板10は、ガラス基板などの透明基板12を有しており、この透明基板12上面の表示領域R1には、モリブデン−タングステン合金などの金属材料からなる下部遮光層14及びSiOなどの絶縁層16を介して画素TFT20の半導体層22、ゲート絶縁層24、ゲート電極26が順次積層されており、トップゲート型の画素TFT20が形成されている。また、透明基板12上面の駆動回路領域R2には、モリブデン−タングステン合金などの金属材料からなる下部遮光層14及びSiOなどの絶縁層16を介して駆動回路TFT50の半導体層52、ゲート絶縁層24、ゲート電極56が順次積層されており、トップゲート型の駆動回路TFT50が形成されている。 More specifically, the array substrate 10 includes a transparent substrate 12 such as a glass substrate. The display region R1 on the upper surface of the transparent substrate 12 includes a lower light shielding layer 14 made of a metal material such as molybdenum-tungsten alloy and the like. A semiconductor layer 22, a gate insulating layer 24, and a gate electrode 26 of the pixel TFT 20 are sequentially stacked via an insulating layer 16 such as SiO 2 to form a top gate type pixel TFT 20. Further, transparent substrate 12 upper surface of the driving circuit region R2, molybdenum - lower shielding layer 14 and semiconductor layer 52 of the drive circuit TFT50 via an insulating layer 16 such as SiO 2 made of a metal material such as tungsten alloy, a gate insulating layer 24 and the gate electrode 56 are sequentially laminated to form a top gate type drive circuit TFT50.

画素TFT20の半導体層22は、図2(a)に示すように、チャネル領域28と、このチャネル領域28に隣接しリン(P+ )イオンを低濃度でドーピングしたLDD領域30,31と、LDD領域30,31に隣接しリン(P+ )イオンを高濃度でドーピングしてなるソース領域32及びドレイン領域34とを有している。また、駆動回路TFT50の半導体層52は、図2(b)に示すように、チャネル領域58と、このチャネル領域58に隣接しリン(P+ )イオンを低濃度でドーピングしたLDD領域60,61と、LDD領域60,61に隣接しリン(P+ )イオンを高濃度でドーピングしてなるソース領域62及びドレイン領域64とを有している。   As shown in FIG. 2A, the semiconductor layer 22 of the pixel TFT 20 includes a channel region 28, LDD regions 30 and 31 doped with phosphorus (P +) ions at a low concentration adjacent to the channel region 28, LDD A source region 32 and a drain region 34, which are adjacent to the regions 30 and 31, are doped with phosphorus (P +) ions at a high concentration. Further, as shown in FIG. 2B, the semiconductor layer 52 of the driving circuit TFT 50 includes a channel region 58 and LDD regions 60 and 61 adjacent to the channel region 58 and doped with phosphorus (P +) ions at a low concentration. And a source region 62 and a drain region 64 which are adjacent to the LDD regions 60 and 61 and are doped with phosphorus (P +) ions at a high concentration.

画素TFT20のチャネル領域28に隣接したLDD領域30,31のソース−ドレイン方向の長さLp,Lp、すなわち、画素TFT20のチャネル領域28と、ドレイン領域34及びソース領域32との相対向する端部の間隔Lp,Lpは、画素TFT20のリーク電流の発生を抑えるため、例えば、3μmに設けられている。   The lengths Lp and Lp in the source-drain direction of the LDD regions 30 and 31 adjacent to the channel region 28 of the pixel TFT 20, that is, the opposite ends of the channel region 28, the drain region 34 and the source region 32 of the pixel TFT 20. The intervals Lp and Lp are set to 3 μm, for example, in order to suppress the occurrence of leakage current of the pixel TFT 20.

一方、駆動回路TFT50のチャネル領域58に隣接したLDD領域60,61のソース−ドレイン方向の長さLd,Ld、すなわち、駆動回路TFT50のチャネル領域58と、ドレイン領域64及びソース領域62との相対向する端部の間隔Ld,Ldは、駆動回路TFT50のオン電流の低下を抑えるため、画素TFT20におけるLDD領域30,31のソース−ドレイン方向の長さLp,Lpより短く設けられており、例えば、2μmに設けられている。   On the other hand, the lengths Ld and Ld in the source-drain direction of the LDD regions 60 and 61 adjacent to the channel region 58 of the drive circuit TFT 50, that is, relative to the channel region 58 of the drive circuit TFT 50, the drain region 64 and the source region 62. The distances Ld and Ld between the facing ends are shorter than the lengths Lp and Lp in the source-drain direction of the LDD regions 30 and 31 in the pixel TFT 20 in order to suppress a decrease in the on-current of the drive circuit TFT 50. 2 μm.

ゲート絶縁層24、ゲート電極26,56上には、SiOなどからなる層間絶縁層36が設けられており、その上には、表示領域R1において半導体層22に接続されるソース電極38及びドレイン電極40が形成され、駆動回路領域R2において半導体層52に接続されるソース電極68及びドレイン電極70が形成されている。 An interlayer insulating layer 36 made of SiO 2 or the like is provided on the gate insulating layer 24 and the gate electrodes 26 and 56, and a source electrode 38 and a drain connected to the semiconductor layer 22 in the display region R1 thereon. An electrode 40 is formed, and a source electrode 68 and a drain electrode 70 connected to the semiconductor layer 52 are formed in the drive circuit region R2.

画素TFT20のソース電極38とドレイン電極40の一端は、層間絶縁層36に設けられたコンタクトホールを介して画素TFT20のソース領域32とドレイン領域34にそれぞれ接続されており、ドレイン電極40の他端は、パッシベーション層42を介してソース電極38とドレイン電極40の上に配設されたITOからなる画素電極44と接続されている。また、ソース電極38は、ドレイン電極40側の端部が少なくともドレイン電極40側のLDD領域31を覆うように両LDD領域30,31に跨って延設されており、上方から半導体層22に向かう光を遮光するようになっている。また、駆動回路TFT50のソース電極68とドレイン電極70の一端は、層間絶縁層36に設けられたコンタクトホールを介して画素TFT50のソース領域62とドレイン領域64にそれぞれ接続されており、ソース電極68は、ドレイン電極70側の端部が少なくともドレイン電極70側のLDD領域61を覆うように両LDD領域60,61に跨って延設されており、上方から半導体層52に向かう光を遮光するようになっている。なお、46はパッシベーション層42の上に積層されている配向膜である。   One end of the source electrode 38 and the drain electrode 40 of the pixel TFT 20 is connected to the source region 32 and the drain region 34 of the pixel TFT 20 via a contact hole provided in the interlayer insulating layer 36, and the other end of the drain electrode 40. Is connected to the pixel electrode 44 made of ITO disposed on the source electrode 38 and the drain electrode 40 through the passivation layer 42. The source electrode 38 extends across the LDD regions 30 and 31 so that the end on the drain electrode 40 side covers at least the LDD region 31 on the drain electrode 40 side, and faces the semiconductor layer 22 from above. The light is shielded. Further, one end of the source electrode 68 and the drain electrode 70 of the drive circuit TFT 50 is connected to the source region 62 and the drain region 64 of the pixel TFT 50 through a contact hole provided in the interlayer insulating layer 36, respectively. Is extended over both LDD regions 60 and 61 so that the end on the drain electrode 70 side covers at least the LDD region 61 on the drain electrode 70 side, and shields light from above toward the semiconductor layer 52. It has become. Reference numeral 46 denotes an alignment film laminated on the passivation layer 42.

一方、対向基板100は、ガラス基板などの透明基板102上にカラーフィルター層104、共通電極106及び配向膜108が順次積層されている。   On the other hand, in the counter substrate 100, a color filter layer 104, a common electrode 106, and an alignment film 108 are sequentially stacked on a transparent substrate 102 such as a glass substrate.

次に、上記した液晶表示装置1におけるアレイ基板10の製造方法について説明する。   Next, a method for manufacturing the array substrate 10 in the liquid crystal display device 1 described above will be described.

アレイ基板10の製造工程では、まず、ガラス基板(透明基板)12上にモリブデン−タングステン合金などの金属膜をスパッタリング法などにより成膜し、所定の形状にパターニングすることにより、下部遮光層14を形成する。   In the manufacturing process of the array substrate 10, first, a metal film such as a molybdenum-tungsten alloy is formed on a glass substrate (transparent substrate) 12 by a sputtering method or the like, and patterned into a predetermined shape, whereby the lower light shielding layer 14 is formed. Form.

次いで、SiOなどの絶縁層16を形成し、その上に、アモルファスシリコン(a−Si)膜を形成し、レーザ光を照射するエキシマレーザアニール法によりa−Si膜を多結晶化してp−Si膜を形成した後、所定の形状にパターニングすることにより、画素TFT20の半導体層22と駆動回路TFT50の半導体層52を形成する。 Next, an insulating layer 16 such as SiO 2 is formed, an amorphous silicon (a-Si) film is formed thereon, and the a-Si film is polycrystallized by an excimer laser annealing method that irradiates laser light. After forming the Si film, the semiconductor layer 22 of the pixel TFT 20 and the semiconductor layer 52 of the drive circuit TFT 50 are formed by patterning into a predetermined shape.

次いで、半導体層22,52上にSiOなどのゲート絶縁層24を形成した後、所定形状のレジストパターンをマスクとして用いて半導体層22,52中に比較的高い濃度でリンイオンをドープすることで、半導体層22,52中にソース領域32,62とドレイン領域34,64を形成する。その際、駆動回路TFT50のドレイン領域64及びソース領域62のチャネル領域側端部が、画素回路TFT20のドレイン領域34及びソース領域32のチャネル領域側端部より、チャネル領域側に位置するように上記レジストパターンを形成する。 Next, after forming a gate insulating layer 24 such as SiO 2 on the semiconductor layers 22 and 52, the semiconductor layers 22 and 52 are doped with phosphorus ions at a relatively high concentration using a resist pattern of a predetermined shape as a mask. Source regions 32 and 62 and drain regions 34 and 64 are formed in the semiconductor layers 22 and 52. At that time, the drain region 64 and the source region 62 of the drive circuit TFT 50 are positioned on the channel region side from the drain region 34 and the source region 32 of the pixel circuit TFT 20 on the channel region side. A resist pattern is formed.

次いで、レジストパターンを除去し、その後、モリブデンやタングステンなどの金属膜をスパッタリング法などにより成膜し、所定の形状にパターニングすることにより、ゲート絶縁層24を介して半導体層22,52の上にソース−ドレイン方向の幅寸法が略等しいゲート電極26,56を形成する。   Next, the resist pattern is removed, and then a metal film such as molybdenum or tungsten is formed by a sputtering method or the like, and is patterned into a predetermined shape, thereby being formed on the semiconductor layers 22 and 52 via the gate insulating layer 24. Gate electrodes 26 and 56 having substantially the same width in the source-drain direction are formed.

次いで、ゲート電極26,56をマスクとして用いて半導体層22,52に比較的低い濃度でリンなどの不純物をドープすることで、半導体層22,52中にチャネル領域28,58とLDD領域30,31,60,61を形成した後、基板全体をアニールすることにより不純物を活性化する。このようにして駆動回路TFT50のチャネル領域58に隣接したLDD領域60,61のソース−ドレイン方向の長さLd,Ldが2μmに形成され、画素TFT20におけるLDD領域30,31のソース−ドレイン方向の長さLp,Lpが3μmに形成され長さLd,Ldより長く設けられる(Lp>Ld)。   Next, by doping the semiconductor layers 22 and 52 with an impurity such as phosphorus at a relatively low concentration using the gate electrodes 26 and 56 as a mask, the channel regions 28 and 58 and the LDD regions 30 and 52 are incorporated in the semiconductor layers 22 and 52. After forming 31, 60, 61, the entire substrate is annealed to activate the impurities. Thus, the lengths Ld and Ld in the source-drain direction of the LDD regions 60 and 61 adjacent to the channel region 58 of the drive circuit TFT 50 are formed to 2 μm, and the LDD regions 30 and 31 of the pixel TFT 20 in the source-drain direction are formed. The lengths Lp and Lp are formed to be 3 μm and are longer than the lengths Ld and Ld (Lp> Ld).

次いで、層間絶縁層36を形成した後、ゲート絶縁層24及び層間絶縁層36を貫通するコンタクトホールを形成する。続いて、画素TFT20のソース電極38及びドレイン電極40と、駆動回路TFT50のソース電極68及びドレイン電極70を形成する。続いて、ソース電極38,68及びドレイン電極40,70上にSiNなどのパッシベーション層42を形成した後、ITOなどの画素電極44を形成し、ラビング処理が施されたポリイミド膜からなる配向膜46を形成することで、図1及び図2に示すようなアレイ基板10が得られる。 Next, after the interlayer insulating layer 36 is formed, a contact hole penetrating the gate insulating layer 24 and the interlayer insulating layer 36 is formed. Subsequently, the source electrode 38 and the drain electrode 40 of the pixel TFT 20 and the source electrode 68 and the drain electrode 70 of the drive circuit TFT 50 are formed. Subsequently, after forming a passivation layer 42 such as SiN x on the source electrodes 38 and 68 and the drain electrodes 40 and 70, a pixel electrode 44 such as ITO is formed, and an alignment film made of a polyimide film subjected to a rubbing process. By forming 46, the array substrate 10 as shown in FIGS. 1 and 2 is obtained.

以上のように、本発明によれば、駆動回路素子を同一基板上に一体的に有する駆動回路一体型であるアクティブマトリクス基板において、駆動回路TFT50のLDD領域60,61のソース−ドレイン方向の長さLd,Ldを画素TFT20のLDD領域30,31のソース−ドレイン方向の長さLp,Lpより短く設けることにより、画素TFT20のリーク電流の発生を抑えて表示コントラストの劣化を低減し良好な表示を得ることができると共に、駆動回路TFT50のオン電流値の低下を抑え駆動回路の駆動特性の安定化を図り表示品位の向上が得られる。また、液晶表示装置が300ppi以上の高精細画素の場合であっても、画素TFT20のリーク電流の発生を抑えることができる。   As described above, according to the present invention, the length of the LDD regions 60 and 61 of the drive circuit TFT 50 in the source-drain direction in the drive matrix integrated type active matrix substrate that integrally has the drive circuit elements on the same substrate. By providing the lengths Ld and Ld shorter than the lengths Lp and Lp in the source-drain direction of the LDD regions 30 and 31 of the pixel TFT 20, it is possible to suppress the occurrence of leakage current of the pixel TFT 20 and reduce deterioration of display contrast, thereby achieving good display. In addition, a reduction in the on-current value of the drive circuit TFT 50 can be suppressed, and the drive characteristics of the drive circuit can be stabilized to improve display quality. Further, even when the liquid crystal display device is a high-definition pixel of 300 ppi or more, generation of a leak current of the pixel TFT 20 can be suppressed.

本発明の一実施形態における液晶表示装置の構成を示す断面図である。It is sectional drawing which shows the structure of the liquid crystal display device in one Embodiment of this invention. 同液晶表示装置の一部を示す断面図である。It is sectional drawing which shows a part of the liquid crystal display device.

符号の説明Explanation of symbols

1…液晶表示装置
10…アレイ基板
12…透明基板
14…下部遮光層
16…絶縁層
20…画素TFT
22,52…半導体層
26,56…ゲート電極
28,58…チャネル領域
30,31,60,61…LDD領域
32,62…ソース領域
34,64…ドレイン領域
38,68…ソース電極
40,70…ドレイン電極
50…駆動回路TFT
Lp,Ld…間隔
DESCRIPTION OF SYMBOLS 1 ... Liquid crystal display device 10 ... Array substrate 12 ... Transparent substrate 14 ... Lower light shielding layer 16 ... Insulating layer 20 ... Pixel TFT
22, 52... Semiconductor layers 26, 56... Gate electrodes 28, 58... Channel regions 30, 31, 60, 61... LDD regions 32, 62. Drain electrode 50 ... Drive circuit TFT
Lp, Ld ... interval

Claims (5)

アレイ基板と対向基板との間に液晶層を挟持して構成された液晶表示装置において、
前記アレイ基板は、表示領域及び駆動回路領域に区画された透明基板と前記表示領域に形成され表示領域にマトリクス状に配置された画素電極を駆動する第1薄膜トランジスタと、前記透明基板の前記駆動回路領域に形成され前記第1薄膜トランジスタに駆動信号を供給する第2薄膜トランジスタと、を備え、
前記第1薄膜トランジスタ及び第2薄膜トランジスタは、チャネル領域と、前記チャネル領域を挟んで対向するソース領域及びドレイン領域と、少なくとも前記チャネル領域と前記ドレイン領域との間に配された低濃度不純物領域とを備える半導体層をそれぞれ有し、
前記第2薄膜トランジスタの前記チャネル領域と前記ドレイン領域の間隔が、前記第1薄膜トランジスタの前記チャネル領域と前記ドレイン領域の間隔より短いことを特徴とする液晶表示装置。
In a liquid crystal display device configured by sandwiching a liquid crystal layer between an array substrate and a counter substrate,
The array substrate includes a transparent substrate partitioned into a display region and a drive circuit region, a first thin film transistor for driving pixel electrodes formed in the display region and arranged in a matrix in the display region, and the drive circuit of the transparent substrate A second thin film transistor formed in a region and supplying a driving signal to the first thin film transistor,
The first thin film transistor and the second thin film transistor each include a channel region, a source region and a drain region facing each other with the channel region interposed therebetween, and at least a low-concentration impurity region disposed between the channel region and the drain region. Each having a semiconductor layer comprising,
A liquid crystal display device, wherein an interval between the channel region and the drain region of the second thin film transistor is shorter than an interval between the channel region and the drain region of the first thin film transistor.
前記各薄膜トランジスタの前記チャネル領域と前記ソース領域との間に低濃度不純物領域を配し、前記チャネル領域と前記ソース領域の間隔を前記各間隔と略等しくなるように設定したことを特徴とする請求項1に記載の液晶表示装置。   A low-concentration impurity region is disposed between the channel region and the source region of each thin film transistor, and the interval between the channel region and the source region is set to be substantially equal to the interval. Item 2. A liquid crystal display device according to item 1. 前記第1薄膜トランジスタ及び前記第2薄膜トランジスタの前記半導体層が、絶縁層を介して前記透明基板に積層された遮光層上に形成されていることを特徴とする請求項1又は2に記載の液晶表示装置。   3. The liquid crystal display according to claim 1, wherein the semiconductor layers of the first thin film transistor and the second thin film transistor are formed on a light shielding layer stacked on the transparent substrate via an insulating layer. apparatus. 前記第1薄膜トランジスタ及び第2薄膜トランジスタの夫々のソース領域に接続されたソース電極にて少なくとも前記低濃度不純物領域を遮光することを特徴とする請求項1〜3のいずれか1項に記載の液晶表示装置。   4. The liquid crystal display according to claim 1, wherein at least the low-concentration impurity region is shielded from light by a source electrode connected to a source region of each of the first thin film transistor and the second thin film transistor. apparatus. 前記第1薄膜トランジスタ及び第2薄膜トランジスタの半導体層がポリシリコンからなることを特徴とする請求項1〜4のいずれか1項に記載の液晶表示装置。   5. The liquid crystal display device according to claim 1, wherein the semiconductor layers of the first thin film transistor and the second thin film transistor are made of polysilicon.
JP2006355656A 2006-12-28 2006-12-28 Liquid crystal display Pending JP2008165028A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006355656A JP2008165028A (en) 2006-12-28 2006-12-28 Liquid crystal display

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006355656A JP2008165028A (en) 2006-12-28 2006-12-28 Liquid crystal display

Publications (1)

Publication Number Publication Date
JP2008165028A true JP2008165028A (en) 2008-07-17

Family

ID=39694608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006355656A Pending JP2008165028A (en) 2006-12-28 2006-12-28 Liquid crystal display

Country Status (1)

Country Link
JP (1) JP2008165028A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103376608A (en) * 2012-04-25 2013-10-30 乐金显示有限公司 Liquid crystal display device and method for manufacturing the same
US8643812B2 (en) 2009-10-19 2014-02-04 Samsung Display Co., Ltd. Display substrate, method of manufacturing the same and display device having the same
CN105408813A (en) * 2013-08-26 2016-03-16 苹果公司 Displays with silicon thin film transistors and semiconductor oxide thin film transistors
US9564478B2 (en) 2013-08-26 2017-02-07 Apple Inc. Liquid crystal displays with oxide-based thin-film transistors
US10032841B2 (en) 2014-09-24 2018-07-24 Apple Inc. Silicon and semiconducting oxide thin-film transistor displays
US10714009B2 (en) 2015-12-04 2020-07-14 Apple Inc. Display with light-emitting diodes

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0688972A (en) * 1992-09-08 1994-03-29 Sony Corp Liquid crystal display device
JPH07106594A (en) * 1993-10-01 1995-04-21 Semiconductor Energy Lab Co Ltd Semiconductor device and manufacturing method thereof
JPH07135323A (en) * 1993-10-20 1995-05-23 Semiconductor Energy Lab Co Ltd Thin film semiconductor integrated circuit and manufacturing method thereof
JPH07153971A (en) * 1993-10-01 1995-06-16 Semiconductor Energy Lab Co Ltd Semiconductor device and manufacturing method thereof
JPH08160464A (en) * 1994-12-09 1996-06-21 Sanyo Electric Co Ltd Liquid crystal display device
JPH09116167A (en) * 1994-12-27 1997-05-02 Seiko Epson Corp Thin film semiconductor device, liquid crystal display device and manufacturing method thereof, and electronic device
WO1998016868A1 (en) * 1996-10-16 1998-04-23 Seiko Epson Corporation Liquid crystal device substrate, liquid crystal device, and projection display
JPH10189998A (en) * 1996-12-20 1998-07-21 Sony Corp Display thin film semiconductor device and method of manufacturing the same
JPH11194360A (en) * 1997-10-31 1999-07-21 Seiko Epson Corp Liquid crystal device, electronic device, and projection display device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0688972A (en) * 1992-09-08 1994-03-29 Sony Corp Liquid crystal display device
JPH07106594A (en) * 1993-10-01 1995-04-21 Semiconductor Energy Lab Co Ltd Semiconductor device and manufacturing method thereof
JPH07153971A (en) * 1993-10-01 1995-06-16 Semiconductor Energy Lab Co Ltd Semiconductor device and manufacturing method thereof
JPH07135323A (en) * 1993-10-20 1995-05-23 Semiconductor Energy Lab Co Ltd Thin film semiconductor integrated circuit and manufacturing method thereof
JPH08160464A (en) * 1994-12-09 1996-06-21 Sanyo Electric Co Ltd Liquid crystal display device
JPH09116167A (en) * 1994-12-27 1997-05-02 Seiko Epson Corp Thin film semiconductor device, liquid crystal display device and manufacturing method thereof, and electronic device
WO1998016868A1 (en) * 1996-10-16 1998-04-23 Seiko Epson Corporation Liquid crystal device substrate, liquid crystal device, and projection display
JPH10189998A (en) * 1996-12-20 1998-07-21 Sony Corp Display thin film semiconductor device and method of manufacturing the same
JPH11194360A (en) * 1997-10-31 1999-07-21 Seiko Epson Corp Liquid crystal device, electronic device, and projection display device

Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10459261B2 (en) 2009-10-19 2019-10-29 Samsung Display Co., Ltd. Display substrate, method of manufacturing the same and display device having the same
US8643812B2 (en) 2009-10-19 2014-02-04 Samsung Display Co., Ltd. Display substrate, method of manufacturing the same and display device having the same
US11803073B2 (en) 2009-10-19 2023-10-31 Samsung Display Co., Ltd. Display substrate, method of manufacturing the same and display device having the same
US11353730B2 (en) 2009-10-19 2022-06-07 Samsung Display Co., Ltd. Display substrate, method of manufacturing the same and display device having the same
US9494811B2 (en) 2009-10-19 2016-11-15 Samsung Display Co., Ltd. Display substrate, method of manufacturing the same and display device having the same
US10871667B2 (en) 2009-10-19 2020-12-22 Samsung Display Co., Ltd. Display substrate, method of manufacturing the same and display device having the same
JP2013228668A (en) * 2012-04-25 2013-11-07 Lg Display Co Ltd Liquid crystal display device and method for manufacturing the same
US8988626B2 (en) 2012-04-25 2015-03-24 Lg Display Co., Ltd. Liquid crystal display device and method for manufacturing the same
TWI500164B (en) * 2012-04-25 2015-09-11 Lg Display Co Ltd Liquid crystal display device and method of manufacturing same
CN103376608B (en) * 2012-04-25 2016-03-02 乐金显示有限公司 Liquid crystal display and manufacture method thereof
CN103376608A (en) * 2012-04-25 2013-10-30 乐金显示有限公司 Liquid crystal display device and method for manufacturing the same
US10741588B2 (en) 2013-08-26 2020-08-11 Apple Inc. Displays with silicon and semiconducting oxide thin-film transistors
JP2016534390A (en) * 2013-08-26 2016-11-04 アップル インコーポレイテッド Display having silicon thin film transistor and semiconductor oxide thin film transistor
US12414378B2 (en) 2013-08-26 2025-09-09 Apple Inc. Displays with silicon and semiconducting oxide thin-film transistors
US10707237B2 (en) 2013-08-26 2020-07-07 Apple Inc. Displays with silicon and semiconducting oxide thin-film transistors
US11876099B2 (en) 2013-08-26 2024-01-16 Apple Inc. Displays with silicon and semiconducting oxide thin-film transistors
US9818765B2 (en) 2013-08-26 2017-11-14 Apple Inc. Displays with silicon and semiconducting oxide thin-film transistors
US9564478B2 (en) 2013-08-26 2017-02-07 Apple Inc. Liquid crystal displays with oxide-based thin-film transistors
CN105408813A (en) * 2013-08-26 2016-03-16 苹果公司 Displays with silicon thin film transistors and semiconductor oxide thin film transistors
US10998344B2 (en) 2013-08-26 2021-05-04 Apple Inc. Displays with silicon and semiconducting oxide thin-film transistors
US11177291B2 (en) 2013-08-26 2021-11-16 Apple Inc. Displays with silicon and semiconducting oxide thin-film transistors
US11587954B2 (en) 2013-08-26 2023-02-21 Apple Inc. Displays with silicon and semiconducting oxide thin-film transistors
US10096622B2 (en) 2013-08-26 2018-10-09 Apple Inc. Displays with silicon and semiconducting oxide thin-film transistors
US10032841B2 (en) 2014-09-24 2018-07-24 Apple Inc. Silicon and semiconducting oxide thin-film transistor displays
US11462163B2 (en) 2015-12-04 2022-10-04 Apple Inc. Display with light-emitting diodes
US11232748B2 (en) 2015-12-04 2022-01-25 Apple Inc. Display with light-emitting diodes
US11615746B2 (en) 2015-12-04 2023-03-28 Apple Inc. Display with light-emitting diodes
US10997917B2 (en) 2015-12-04 2021-05-04 Apple Inc. Display with light-emitting diodes
US10714009B2 (en) 2015-12-04 2020-07-14 Apple Inc. Display with light-emitting diodes
US11875745B2 (en) 2015-12-04 2024-01-16 Apple Inc. Display with light-emitting diodes
US12142220B2 (en) 2015-12-04 2024-11-12 Apple Inc. Display with light-emitting diodes
US12417743B2 (en) 2015-12-04 2025-09-16 Apple Inc. Display with light-emitting diodes

Similar Documents

Publication Publication Date Title
US8928044B2 (en) Display device, switching circuit and field effect transistor
US7682881B2 (en) Thin film transistor substrate and method of manufacturing the same
US8148726B2 (en) Display device and manufacturing method thereof
TWI418038B (en) Display device
JP5485517B2 (en) Display device and manufacturing method thereof
KR20120042031A (en) Thin film transistor and display divce using the same
US7755142B2 (en) Thin-film transistor and image display device
TWI447916B (en) Display device
US8058654B2 (en) Display device and manufacturing method thereof
US20090233392A1 (en) Liquid crystal display device and fabrication method thereof
US8124975B2 (en) Display device with multi-gate TFTs of a pixel region having different relative areas of gate regions with respect to channel regions of the TFTs
JP2008165028A (en) Liquid crystal display
JP5371377B2 (en) Display device
JP2008165029A (en) Liquid crystal display
US8441016B2 (en) Thin-film transistor, display device, and manufacturing method for thin-film transistors
JP5032077B2 (en) Display device and manufacturing method thereof
JP2009210681A (en) Display and manufacturing method therefor
JP5253990B2 (en) Thin film transistor
JP5312906B2 (en) Display device
JP2008166573A (en) Display device and manufacturing method thereof
JP4991282B2 (en) Liquid crystal display
JP2011187500A (en) Semiconductor device and method of manufacturing the same
JP2002083973A (en) Thin film transistor, method of manufacturing the same, and liquid crystal display device using the same
JP2009224396A (en) Thin film transistor substrate and method of manufacturing the same, and display device
KR20080039194A (en) A thin film transistor and its manufacturing method, and a liquid crystal display device and an organic light emitting diode display device using the same

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20091216

A977 Report on retrieval

Effective date: 20111109

Free format text: JAPANESE INTERMEDIATE CODE: A971007

A02 Decision of refusal

Effective date: 20120410

Free format text: JAPANESE INTERMEDIATE CODE: A02