JP2008159345A - Pattern forming device and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress unevenness produced on a pattern, when forming the pattern of a phosphor by applying phosphor paste in grooves between a plurality of ribs. <P>SOLUTION: A pattern forming device includes a nozzle part 5 having a plurality of discharge openings 52, and a mechanism to move a substrate 9 to the nozzle part 5. While phosphor paste 8 is continuously discharged from the discharge port 52, the nozzle part 5 moves relatively to a scanning direction, and the phosphor paste 8 is applied between ribs 92 arranged on the substrate 9 thereby. This pattern forming device 1 also includes a mechanism to minutely move the nozzle part 5 in a direction perpendicular to the scanning direction, and the nozzle part 5 is irregularly and minutely moved in the direction perpendicular to the scanning direction while the nozzle part 5 is scanning. Thereby, the phosphor paste 8 is prevented from continuing to partially adhere to one side of the ribs 91 on both sides, and unevenness of the phosphor paste on the pattern is suppressed. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a technique for forming a pattern composed of a plurality of linear pattern elements on a substrate by moving the nozzle portion while discharging a pattern forming material from a plurality of discharge ports of the nozzle portion. .

  In recent years, in the manufacture of plasma display devices, a technique has been proposed in which a phosphor paste is discharged from a nozzle and the phosphor paste is applied between ribs on a substrate. In this method, if the phosphor paste is biased and adhered to one rib, unevenness occurs in the pattern of the phosphor paste, and various proposals for improving such unevenness have been made.

  For example, in Patent Document 1, when a phosphor liquid is discharged from a nozzle to a groove between ribs formed on a substrate for a plasma display device, the air is emitted from the vicinity of the nozzle outlet, thereby causing fluorescence at the center of the groove. Techniques for applying body fluids are disclosed. Moreover, in A of FIG. 7 of Patent Document 2, the phosphor ink is applied so as to collide with the side surface of one partition wall of the rear glass substrate, and then reapplied so as to collide with the side surface of the other partition wall. Thus, a technique for uniformly forming a phosphor layer in a groove between barrier ribs has been proposed. Patent Document 2 further discloses a technique for causing the phosphor ink applied to the groove to adhere to the side wall by jetting air or using a stirring rod. Patent Document 3 discloses a technique for applying the phosphor paste without unevenness while touching the ribs on both sides by making the discharge port of the phosphor paste horizontally long.

Although it is not a technique for preventing unevenness, in Patent Document 4, when forming the pattern of the partition wall on the substrate, the pattern forming material discharged in a charged state is neutralized by an ionizer, thereby causing static electricity. A technique for preventing the deformation of the pattern forming material, the occurrence of abnormal discharge, and the like is disclosed. Further, Patent Document 5 discloses a technique for forming a meandering partition wall by swinging a discharge portion largely and periodically while discharging a partition wall material.
JP 2001-357780 A JP-A-11-96911 JP 2001-347210 A Japanese Patent Laid-Open No. 2004-199975 JP 2003-187694 A

  By the way, it is difficult to accurately position all the discharge ports and other structures as in Patent Documents 1 to 3 in a plurality of grooves between ribs arranged at a pitch of several hundred μm, A lot of money is required to realize these technologies.

  The present invention has been made in view of the above problems, and when a pattern forming material having fluidity is discharged from a plurality of discharge ports to form a pattern that is an array of a plurality of pattern elements on a substrate, the pattern is formed into a pattern. The object is to suppress the generated unevenness, and in particular, to suppress the unevenness with a simple structure.

  The invention according to claim 1 is a pattern forming apparatus for forming a pattern on a substrate, wherein a nozzle portion for discharging a pattern forming material having fluidity from a plurality of discharge ports onto the substrate, and a pattern from the nozzle portion. While the forming material is discharged, by moving the nozzle part relative to the substrate in the moving direction along the substrate, a plurality of linear pattern elements extending in the moving direction. While the pattern forming material is ejected from the nozzle section, the moving mechanism for forming the configured pattern, and substantially all or a plurality of application positions of the pattern forming material on the substrate corresponding to the plurality of ejection openings And an application position changing unit that irregularly changes the portion in a direction perpendicular to the moving direction, and is parallel to the moving direction and perpendicular to the moving direction on the substrate. A plurality of planned pattern lines arranged at equal pitches in the direction are set in advance, and the nozzle portion moves relative to the substrate while the pattern forming material is discharged from the nozzle portion, thereby The plurality of pattern elements extending in the moving direction are formed along a plurality of planned pattern lines or along every predetermined number of the plurality of planned pattern lines, and are changed by the application position changing unit. The change range of each application position is 5% or more and 40% or less of the pitch of the plurality of planned pattern lines in the direction perpendicular to the moving direction.

  A second aspect of the present invention is the pattern forming apparatus according to the first aspect, wherein the application position changing unit irregularly changes the position of the nozzle unit in a direction perpendicular to the moving direction.

  Invention of Claim 3 is the pattern formation apparatus of Claim 1, Comprising: The pattern formation material discharged from the said nozzle part is electrically charged, The said application position change part is these discharge ports Is a mechanism for irregularly moving a member having a plurality of charging portions arranged along the vicinity of the plurality of discharge ports.

  According to a fourth aspect of the present invention, in the pattern forming apparatus according to the first aspect, the application position changing unit causes an irregular gas flow to act on the pattern forming material discharged from the nozzle unit.

  A fifth aspect of the present invention is the pattern forming apparatus according to any one of the first to fourth aspects, wherein a plurality of ribs are formed on the substrate and are formed between the plurality of ribs. In the phosphor paste, a plurality of grooves correspond to the plurality of planned pattern lines, and a pattern forming material is applied to the plurality of grooves or every predetermined number of the plurality of grooves.

  A sixth aspect of the present invention is the pattern forming apparatus according to any one of the first to fourth aspects, wherein each of the plurality of pattern elements has a rib shape.

  The invention according to claim 7 is a pattern forming apparatus that forms a pattern of the phosphor paste by applying the phosphor paste onto a substrate on which a plurality of ribs are formed in parallel at an equal pitch. A nozzle portion that discharges a pattern forming material, which is a phosphor paste, from a discharge port onto the substrate, and the nozzle portion is moved to the substrate in a moving direction along the substrate while the pattern forming material is discharged from the nozzle portion. A movement mechanism that applies a pattern forming material to a groove between the plurality of ribs or every other predetermined groove among the grooves between the plurality of ribs by moving relatively and continuously with respect to the groove; While the pattern forming material is discharged from the nozzle portion, substantially all or a plurality of portions of the plurality of pattern forming material application positions on the substrate corresponding to the plurality of discharge ports are moved in the moving direction. And a applying position changing unit that changes a straight direction.

  The invention according to claim 8 is a pattern forming method for forming a pattern on a substrate, wherein a) a step of discharging a pattern forming material having fluidity from a plurality of discharge ports of a nozzle portion onto the substrate; b ) In parallel with the step a), by moving the nozzle part relative to the substrate in the movement direction along the substrate, a plurality of linear pattern elements extending in the movement direction are obtained. C) forming a pattern constituted by: c) parallel to the step a), substantially all or a plurality of portions of a plurality of application positions of the pattern forming material on the substrate corresponding to the plurality of ejection openings. A step of irregularly changing in a direction perpendicular to the moving direction, and a plurality of parallel arrangements on the substrate parallel to the moving direction and arranged at equal pitches in a direction perpendicular to the moving direction. Pattern schedule In is set in advance, in the moving direction along the plurality of planned pattern lines in the steps a) and b), or along every other predetermined pattern of the plurality of planned pattern lines. The plurality of extending pattern elements are formed, and the change range of each application position changed in the step c) is not less than 5% and not more than 40% of the pitch of the plurality of planned pattern lines in the direction perpendicular to the moving direction. is there.

  The invention according to claim 9 is a pattern forming method in which a phosphor paste is applied on a substrate on which a plurality of ribs are formed in parallel at equal pitches to form a pattern of the phosphor paste. A step of discharging a pattern forming material, which is a phosphor paste, from the plurality of discharge ports of the nozzle portion onto the substrate; and b) the substrate in the moving direction along the substrate in parallel with the step a). A step of applying a pattern forming material to grooves between the plurality of ribs or every other predetermined number of grooves between the plurality of ribs by moving relatively and continuously with respect to c) In parallel with the step a), substantially all or a plurality of portions of the plurality of application positions of the pattern forming material on the substrate corresponding to the plurality of ejection openings are changed in a direction perpendicular to the moving direction. With.

  According to the present invention, unevenness that occurs in a pattern formed on a substrate can be suppressed. According to the second aspect of the present invention, unevenness can be easily suppressed. According to the third and fourth aspects of the invention, the occurrence of unevenness can be further suppressed.

  FIG. 1 is a diagram showing a pattern forming apparatus 1 according to a first embodiment of the present invention. The pattern forming apparatus 1 is an apparatus that forms a phosphor pattern by applying a phosphor paste on a glass substrate (hereinafter referred to as “substrate”) 9 on which a rib 91 for a plasma display device is formed. A plurality of ribs 91 parallel to the Y direction in FIG. 1 are previously formed on the substrate 9 at an equal pitch in the X direction. In the pattern forming apparatus 1, a pattern forming material having fluidity from a plurality of discharge ports. A pattern is formed by continuously discharging the phosphor paste 8 that is to the grooves between the ribs 91. The formed phosphor pattern has a plurality of linear elements (hereinafter referred to as “pattern elements”) arranged at an equal pitch. In the pattern forming apparatus 1, the phosphor paste of any one of red (R), green (G), and blue (B) is applied, and two grooves are formed between two adjacent pattern elements. Thus, application | coating is performed. The phosphor pastes of other colors are applied to the uncoated grooves by other similar pattern forming apparatuses.

  In the pattern forming apparatus 1, the stage moving mechanism 2 is provided on the base 11, and the stage moving mechanism 2 allows the stage unit 20 that holds the substrate 9 to be continuously moved in the moving direction that is the Y direction. A frame 12 is fixed to the base 11 so as to straddle the stage portion 20, and the head portion 4 is attached to the frame 12 via the minute movement mechanism 3.

  The stage moving mechanism 2 has a structure in which a ball screw 22 is connected to a motor 21 and a nut 23 fixed to the stage unit 20 is attached to the ball screw 22. When the guide rail 24 is fixed above the ball screw 22 and the motor 21 rotates, the stage portion 20 moves smoothly along the guide rail 24 in the scanning direction which is the Y direction along with the nut 23 (that is, the head portion 4). Scans relative to the substrate 9).

  The minute moving mechanism 3 includes a motor 31 supported by the frame 12, a ball screw 32 connected to the rotation shaft of the motor 31, and a nut 33 attached to the ball screw 32. The position 33 is changed very minutely in the X direction perpendicular to the scanning direction and parallel to the substrate 9. The base 40 of the head portion 4 is attached to the nut 33, and the position of the head portion 4 together with the nut 33 is slightly changed in the X direction. The motor 31 is a stepping motor, and the position of the head unit 4 is changed to a position slightly deviated in the (+ X) direction and a position slightly deviated in the (−X) direction by the input pulse. Is done.

  The head unit 4 includes a discharge unit 42 that discharges the phosphor paste 8 on the substrate 9, and the discharge unit 42 is attached to a lower part of an elevating mechanism 41 that is fixed to the base 40. A nozzle portion 5 having a plurality of discharge ports arranged in the X direction is detachably provided below the discharge portion 42. The nozzle unit 5 is connected to a container 442 through a supply pipe 441, and the container 442 is connected to a pressurizing unit 443 that supplies high-pressure air. The phosphor paste 8 in the container 442 is supplied from the container 442 to the nozzle unit 5 using the pressure of air from the pressurizing unit 443 and discharged.

  The motor 21 of the stage moving mechanism 2, the motor 31 of the minute moving mechanism 3, and the lifting mechanism 41 of the head unit 4 are connected to the control unit 10, and these configurations are controlled by the control unit 10, whereby the pattern forming apparatus 1 is formed on the substrate 9. That is, the substrate 9 is moved by the stage moving mechanism 2 while the phosphor paste 8 is discharged from the nozzle unit 5, so that the nozzle unit 5 is relatively and continuously with respect to the substrate 9 in the moving direction along the substrate 9. And a pattern composed of a plurality of linear pattern elements extending in the scanning direction is formed.

  FIG. 2 is a diagram illustrating a state in which the phosphor paste 8 is discharged, and a state in which the pole tip of the nozzle unit 5 and the substrate 9 are viewed from the (−Y) side in FIG. 1 toward the (+ Y) direction. Show. In FIG. 2, for easy understanding, the phosphor paste 8 is indicated by thick parallel oblique lines. The nozzle unit 5 has a plurality of discharge ports 52 arranged in the X direction perpendicular to the relative movement direction of the nozzle unit 5 at the tip, and each discharge port is an opening of a flow path 51 in the nozzle unit 5. . A plurality of ribs 91 are formed on the substrate 9 in parallel with the moving direction of the nozzle portion 5 and arranged at an equal pitch in a direction perpendicular to the moving direction. The discharge ports 52 are close to the upper surface of the substrate 9 by about 400 μm, and the pitch between the discharge ports 52 is three times the pitch of the ribs 91 (for example, 900 μm). Therefore, the phosphor paste 8 discharged from the plurality of discharge ports 52 in accordance with the movement of the nozzle unit 5 is discharged into every other two of the grooves 92 between the ribs 91 (that is, two filled Two other grooves 92 are sandwiched between the grooves 92.), and the top portion 911 of the rib 91 is filled. The height of the plurality of ribs 91 formed on the substrate 9 is about a few hundreds of μm.

  As shown in FIG. 2, each discharge port 52 is arranged so that the center thereof coincides with the center of the groove 92, but the discharged phosphor paste is due to the relatively high wettability of the phosphor paste 8 with respect to the rib 91. 8 does not evenly adhere to the ribs 91 on both sides of the groove 92, and adheres to only one of the ribs 91 to the vicinity of the top portion 911. Such bias in the application of the phosphor paste 8 depends on the processing error of the discharge port 52 and the surface condition in the vicinity of the discharge port 52, but usually the phosphor paste 8 is accurately discharged to the center between the ribs 91. It will occur even if it is done.

  FIG. 3 is a plan view showing a comparative example when the position of the nozzle portion 5 of the pattern forming apparatus 1 is fixed, that is, the phosphor paste 8 is applied without using the minute movement mechanism 3. It is. In FIG. 3, the nozzle part 5 and the discharge port 52 are also shown, and the phosphor paste 8 is shaded in parallel (the same applies to FIG. 4). As shown in FIG. 2, the phosphor paste 8 discharged into each groove 92 is biased and adhered to the side surface of one rib 91 among the ribs 91 on both sides. The paste 8 is continuously discharged from the start to the end. As a result, the distance between the linear pattern elements of the phosphor paste 8 is not constant, and the pattern is uneven. In FIG. 3, the boundary between the rib 91 and the substrate 9 that is hidden under the phosphor paste 8 because the phosphor paste 8 is biased is indicated by a broken line.

  FIG. 4 is a plan view showing a pattern formed by the pattern forming apparatus 1 while using the minute movement mechanism 3. In the pattern forming apparatus 1, while the head unit 4 scans in the Y direction, the minute movement mechanism 3 moves the position of the nozzle unit 5 in the (+ X) direction and the (−X) direction (that is, perpendicular to the relative movement direction of the nozzle unit 5). Change slightly irregularly). Specifically, the position of each discharge port 52 of the nozzle unit 5 is positioned on the center line of any one of the grooves 92 by design, and the (+ X) direction and the (−X) direction for a short time around this position. ) The positions of the plurality of ejection ports 52 are irregularly changed to a position separated by a minute distance in the direction. Thereby, all the positions (hereinafter referred to as “applying positions”) where the phosphor paste 8 reaches the substrate 9 corresponding to the plurality of ejection ports 52 are irregularly short in a direction perpendicular to the scanning direction. Be changed. Thus, in the pattern forming apparatus 1, the minute movement mechanism 3 functions as an application position changing unit that changes the application position of the phosphor paste 8 irregularly.

  In the following description, the three application positions corresponding to the above three positions of the discharge port 52 are referred to as “center position”, “(+ X) position”, and “(−X) position”. The rib 91 located on the (+ X) side of 91 is called “(+ X) rib 91”, and the rib 91 located on the (−X) side is called “(−X) rib 91”.

  Here, it is assumed that the phosphor paste 8 is attached to the (−X) rib 91 while paying attention to one groove 92, and the nozzle portion 5 moves slightly to the (+ X) side and the application position is changed. When the center position is changed to the (+ X) position, the phosphor paste 8 is separated from the vicinity of the top portion 911 of the (−X) rib 91 and attached to the vicinity of the top portion 911 of the (+ X) rib 91. Thereafter, the nozzle portion 5 is returned to the original position, and the application position is returned to the center position in a short time, but the state where the phosphor paste 8 is biased and adhered to the (+ X) rib 91 is maintained in the groove 92.

  Subsequently, when the application position is changed from the center position to the (−X) position at an irregular timing, the phosphor paste 8 that is biased and adhered to the (+ X) rib 91 is transferred to the (−X) rib 91. Even if it adheres unevenly and the application position is returned to the center position in a short time, the state where the phosphor paste 8 is unevenly attached to the (−X) rib 91 is maintained. Thereafter, the application position is irregularly changed alternately to the (+ X) position and the (−X) position only for a short time, whereby the phosphor paste 8 is formed in the groove 92 in the (+ X) rib 91 as shown in FIG. And (−X) the ribs 91 are applied alternately and irregularly.

  In the pattern forming apparatus 1, the positions of the plurality of ejection ports 52 are simultaneously changed by the minute movement of the nozzle unit 5, and therefore the plurality of application positions on the substrate 9 corresponding to the plurality of ejection ports 52 are also simultaneously changed in the same direction. The Therefore, when attention is paid to each position in the Y direction, the bias of the phosphor paste 8 in each groove 92 is the same at that position.

  FIG. 5 is an enlarged sectional view showing the discharge port 52 and the rib 91, and corresponds to FIG. The change range D of the position of the ejection port 52 when the application position is changed is that the width of the ejection port 52 (width in the direction perpendicular to the scanning direction) is A, the pitch of the ribs 91 is P, and the width of the top portion 911 of the ribs. Is determined as a value satisfying the condition shown in Equation 1. The change range D of the discharge port 52 is substantially the same as the change range of the application position of the phosphor paste 8, and the maximum value of the change range D is that the phosphor paste 8 is discharged inside the adjacent groove 92. It corresponds to the range that is not.

(Equation 1)
0 <D ≦ P + W−A

  The change range D is actually about half of the maximum value of Equation 1. For example, when the width A of the discharge ports 52 is 200 μm, the pitch P is 300 μm, and the width W of the top portion 911 is 60 μm, the change range D is about 80 μm (about 27% of the pitch P) or less. That is, the discharge port 52 is changed by about 40 μm from the center of the groove 92 in the (± X) direction.

  As shown in Equation 1, the change range D is determined depending on the pitch P of the ribs 91 and does not depend on the pitch of the discharge ports 52. Accordingly, the change range D is similarly set even when the nozzle portion 5 for applying the phosphor paste 8 simultaneously to all the grooves 92 is prepared. In other words, the plurality of grooves 92 formed between the plurality of ribs 91 are to form pattern elements of the phosphor paste 8 (including pattern elements of other colors that are finally formed). If this line is defined as a plurality of “pattern scheduled lines” that are parallel to the scanning direction and arranged at equal pitches in a direction perpendicular to the scanning direction, the line is changed. The range D is determined based on the pitch of the planned pattern line. The change range D of the application position of the phosphor paste 8 is more generally 5% or more and 40% or less (more preferably 10% or more and 30% or less) of the pitch of the planned pattern line. The same applies to the embodiment).

  In the pattern forming apparatus 1, while the phosphor paste 8 is ejected from the nozzle unit 5, the nozzle unit 5 moves relative to the substrate 9 and follows every other two of the plurality of planned pattern lines. By forming the phosphor pattern elements extending linearly in the moving direction, a phosphor pattern in which a plurality of pattern elements are arranged in the X direction at a pitch three times the pitch of the planned pattern line is formed on the substrate 9. Formed on top. In addition, the bias of each pattern element changes irregularly when the application position is changed in the change range when the pattern element is formed.

  The change in the bias of the phosphor paste 8 is preferably controlled so as to be changed once to 1 to 100 times (preferably 5 to 10 times) the pitch of the planned pattern line (that is, the pitch of the ribs 91). For example, when the pitch of the planned pattern line is 300 μm, the application position is irregularly temporarily changed once from the center position to the (+ X) or (−X) position between 2 and 3 mm, and the phosphor The ribs 91 to which the paste 8 is unevenly attached are changed.

  FIG. 6 is a diagram showing a flow of operations of the pattern forming apparatus 1. In the pattern formation, first, the substrate 9 is placed on the stage unit 20 shown in FIG. 1, and the substrate 9 is positioned with respect to the head unit 4 by a positioning mechanism (not shown). At this time, the substrate 9 is positioned on the (+ Y) side of the head portion 4 (as shown in FIG. 1 with a part being indicated by a two-dot chain line). Then, when the substrate 9 starts to move in the (−Y) direction by the stage moving mechanism 2, the nozzle portion 5 moves relatively along the main surface of the substrate 9 at, for example, 70 mm / second (+ Y). Move in the direction (ie, scan) (step S11).

  When the nozzle unit 5 reaches the discharge start position on the substrate 9, the pressurizing unit 443 is activated and the phosphor paste 8 is transferred from the nozzle unit 5 to every other groove 92 between the plurality of ribs 91. Discharge is started (step S12). Further, the motor 31 of the minute movement mechanism 3 also starts irregular rotation, and as described above, the position of the nozzle unit 5 is repeatedly and irregularly changed for a short time in a (± X) direction from the reference position. (Step S13). As a result, the phosphor paste 8 is continuously applied on the substrate 9 and the application position of the discharged phosphor paste 8 on the substrate 9 is irregularly changed. The unevenness of the phosphor paste 8 is irregularly changed.

  When the above operation is continued and the nozzle unit 5 reaches the discharge stop position on the substrate 9, the rotation of the motor 31 is stopped and the change of the position of the nozzle unit 5 is stopped (step S14). Is stopped (step S15). Thereafter, when the substrate 9 completely passes through the nozzle portion 5, the relative movement of the nozzle portion 5 with respect to the substrate 9 is also stopped (step S16). With the above operation, a pattern composed of the phosphor paste 8 discharged into the plurality of grooves 92 is formed over almost the entire area of the substrate 9 in the Y direction.

  In other words, in parallel with the process in which the nozzle portion 5 from step S11 to step S16 moves relative and continuously with respect to the substrate 9, the phosphor paste 8 from step S12 to step S15 is nozzleed. A process of discharging from the unit 5 is executed, whereby a pattern extending in the relative movement direction is formed on the substrate 9 and, in parallel with the pattern forming process, between the step S13 and the step S14, the discharge port The application position on the substrate 9 where the phosphor paste 8 from 52 reaches is irregularly changed in the X direction.

  By the above operation, the phosphor paste 8 is always prevented from being unevenly applied to one of the ribs 91 on both sides of the groove 92, and unevenness in the phosphor pattern can be suppressed. Further, by changing the application position of the phosphor paste 8 with the micro-movement mechanism 3 having a ball screw or the like, it is possible to easily suppress unevenness at a low cost.

  Since the application position of the phosphor paste 8 is changed to only the three positions of the center position, the (+ X) position, and the (−X) position, it is easy to control the change of the application position, and (+ X) or By setting the time at the (−X) position to be a short time, the discharged phosphor paste 8 is prevented from spreading and adhering to the entire top portion 911 of the rib, and the phosphor paste 8 is disposed in the adjacent groove 92. Can be reliably prevented from entering.

  Next, a pattern forming apparatus according to a second embodiment will be described. FIG. 7 is an enlarged plan view showing a part of the nozzle unit 5 and the substrate 9 of the pattern forming apparatus according to the second embodiment, and FIG. 8 shows the nozzle unit at the position of the arrow AA in FIG. 5 is a diagram showing a cross section of the tip of 5 and a protrusion 351 described later, and shows a state in which the phosphor paste 8 is discharged.

  In the pattern forming apparatus according to the second embodiment, the fine moving mechanism 3 is omitted from the pattern forming apparatus 1 according to the first embodiment, and as shown in FIG. A member 35, a power source 71 electrically connected to the rod-shaped member 35, and a charging unit moving mechanism 72 that moves the rod-shaped member 35 in the X direction are provided. The basic operation of the pattern forming apparatus according to the second embodiment is the same as that of the first embodiment, and while the nozzle unit 5 is relatively scanned in the (+ Y) direction from the (−Y) side, The phosphor paste 8 is discharged from the nozzle portion 5 along every other two of the grooves 92 between the ribs 91 (that is, the planned pattern lines).

  The rod-shaped member 35 is formed of a conductor, and is disposed on the front side in the traveling direction of the nozzle portion 5 (that is, the (+ Y) side of the nozzle portion 5), and a plurality of protrusions 351 arranged along the plurality of discharge ports 52. As a charging unit. In FIG. 7, only one protrusion 351 is shown for convenience of illustration. The pitch of the projections 351 is about several times to several tens of times the pitch of the discharge ports 52, and when a voltage is applied to the rod-shaped member 35 from the power supply 71, the whole including the projections 351 is positively charged.

  The charging unit moving mechanism 72 includes a stepping motor, a ball screw, a nut, and the like, similarly to the minute moving mechanism 3 of FIG. 1, and a plurality of rod-like members 35 including protrusions 351 are generated when the stepping motor rotates irregularly. Is irregularly moved in the X direction in the vicinity of the discharge port 52.

  On the other hand, the phosphor paste 8 is charged as shown in FIG. 8 by friction with the member forming the flow path 51 until the phosphor paste 8 is discharged from the discharge port 52 (the nozzle portion 5 is formed of ceramics, for example). In the following description, it is assumed that the phosphor paste 8 is positively charged.) Accordingly, electrostatic forces repelling each other are generated between the positively charged protrusion 351 and the phosphor paste 8, and the liquid column of the phosphor paste 8 is distorted. In FIG. 7, the magnitude and direction of the force that the phosphor paste 8 discharged from each discharge port 52 receives from the protrusion 351 is indicated by an arrow 6 starting from the discharge port 52.

  The phosphor paste 8 discharged from the discharge port 52 near the protrusion 351 receives the largest electrostatic force, and the electrostatic force gradually decreases as the distance from the protrusion 351 increases. Further, the direction of repulsive force due to static electricity gradually changes from the (−Y) direction to the (+ X) direction or the (−X) direction as the distance from the protrusion 351 increases. Thus, the phosphor paste 8 discharged from each discharge port 52 in the vicinity of the protrusion 351 receives electrostatic forces of different sizes and directions, and the application position of the phosphor paste 8 on the substrate 9 is set in each groove. It is biased to one of the ribs 91 on both sides of 92.

  Here, when the protruding portion 351 is moved in the arrangement direction of the discharge ports 52 by the charging portion moving mechanism 72, the magnitude and direction of the electrostatic force that the liquid column of the phosphor paste 8 receives from the protruding portion 351 changes in a complicated manner. As a result, the application position of the phosphor paste 8 discharged from the discharge port 52 is irregularly changed (in a direction having a component in a direction perpendicular to the scanning direction) around each protrusion 351. In particular, the application position of the phosphor paste 8 from the discharge port 52 where the protrusion 351 crosses the front is shifted from the position biased to the (+ X) side to the position biased to the (−X) side, or (−X). It changes from a position biased to the side to a position biased to the (+ X) side. As described above, in the pattern forming apparatus according to the second embodiment, the mechanism for irregularly moving the protrusion 351 as the charging portion (that is, the protrusion 351, the power source 71, and the charging portion moving mechanism 72) is a phosphor. It functions as an application position changing unit that changes the application position of the paste 8 on the substrate 9.

  In addition, since the change of the application position occurs only in the vicinity of the protrusions 351, the application positions corresponding to almost all the ejection ports 52 are changed when the pitch of the protrusions 351 is small, but the application position when the pitch is large. A plurality of portions in the vicinity of the protruding portion 351 in the set are irregularly changed.

  The phosphor paste 8 that is changed between a position where the application position is biased toward the (+ X) side and a position where the position is biased toward the (−X) side is biased to adhere to one of the ribs 91 on both sides of the groove 92. The state changes from the state to the state of being attached to the other rib 91 in an uneven manner. Then, by irregularly moving the protrusions 351, the bias of the phosphor paste 8 is irregularly changed between the ribs 91 on both sides from the discharge start time to the end time. The moving distance of the protrusion 351, the distance between the discharge port 52 and the protrusion 351, and the like are set within a range in which the change in the bias of the adhesion of the phosphor paste 8 is surely generated, and the phosphor paste 8 and the rib 91 are set. Depending on the characteristics of the ribs 91 and the pitch of the ribs 91, the maximum value of the change in the application position of most of the phosphor paste 8 affected by the protrusions 351 is usually the pitch of the ribs 91 (that is, the pitch of the planned pattern line). Is set to 5% or more and 40% or less.

  The operation of the pattern forming apparatus according to the second embodiment is the same as that of the first embodiment except that the application position of the phosphor paste 8 is changed by the movement of the rod-shaped member 35, and the nozzle unit. The phosphor paste 8 is ejected until 5 reaches the ejection stop position from the ejection start position on the substrate 9, so that the pattern constituted by the pattern elements of the phosphor paste 8 is substantially in the Y direction of the substrate 9. In parallel with this operation, the irregular position of the application position of the phosphor paste 8 on the substrate 9 by the rod-shaped member 35, the power source 71 and the charging unit moving mechanism 72 is continuously performed. .

  As described above, in the pattern forming apparatus according to the second embodiment, the charging unit moving mechanism 72 irregularly moves the plurality of protrusions 351 in the vicinity of the plurality of ejection ports 52 to apply the phosphor paste 8. By irregularly changing the plurality of portions (or almost the whole), unevenness of the phosphor pattern can be suppressed as in the first embodiment. Furthermore, in the pattern forming apparatus according to the second embodiment, the phosphor paste 8 discharged from all the discharge ports 52 is not biased in the same direction at each point in the course of pattern formation. The occurrence of unevenness is further suppressed.

  Next, a pattern forming apparatus according to a third embodiment will be described. FIG. 9 is a cross-sectional view showing a state in which the phosphor paste 8 is discharged from the nozzle portion 5 of the pattern forming apparatus according to the third embodiment onto the substrate 9, and corresponds to FIG. In the pattern forming apparatus according to the third embodiment, instead of the rod-shaped member 35, the power source 71, and the charging unit moving mechanism 72 of the pattern forming apparatus according to the second embodiment, an air nozzle 36 adjacent to the nozzle unit 5, An air nozzle moving mechanism (not shown) and an air supply unit 73 are provided, and the air nozzle 36 is movable in the X direction by the air nozzle moving mechanism. The basic operation of the pattern forming apparatus according to the third embodiment is the same as that of the first embodiment, and along every second of the grooves 92 (that is, the planned pattern lines) between the ribs 91. The phosphor paste 8 is discharged (see FIG. 4).

  The air nozzle 36 is located on the front side in the traveling direction of the nozzle unit 5, has a plurality of outlets 361 arranged in parallel to the array of the discharge ports 52 of the nozzle unit 5, and moves in the scanning direction as the nozzle unit 5 moves. . The air supply unit 73 connected to the air nozzle 36 supplies air of a predetermined pressure (for example, the pressure is set to 0.02 to 0.05 MPa in the air supply unit 73) to the air nozzle 36, and sends out the air. An air flow is applied to the phosphor paste 8 from 361. As a result, as in the case of the electrostatic force from the protrusion 351 of the second embodiment, a force acts on the phosphor paste 8 discharged from the discharge port 52 in the vicinity of the delivery port 361, and these discharge ports The application position of the phosphor paste 8 corresponding to 52 on the substrate 9 is changed.

  The air nozzle 36 is irregularly moved in the X direction by the air nozzle moving mechanism while the phosphor paste is being applied to the substrate 9. Thereby, the application position of the phosphor paste 8 from the discharge port 52 across which the delivery port 361 crosses the front changes irregularly between a position biased toward the (+ X) side and a position biased toward the (−X) side (that is, , And irregularly changes in a direction having a component perpendicular to the scanning direction), and from the state in which the phosphor paste 8 is biased to adhere to one rib 91 as in the second embodiment, it is biased to the other rib 91. It is changed to the state to adhere. Thus, in 3rd Embodiment, the air nozzle 36, the air nozzle moving mechanism, and the air supply part 73 are the application position change parts which change the application position of the fluorescent substance paste 8 irregularly.

  Further, the change in the application position of the phosphor paste 8 to the substrate 9 due to the irregular flow of air occurs for the application positions corresponding to almost all the discharge ports 52 when the pitch of the delivery ports 361 is small. However, when the pitch is large, it occurs in a plurality of portions in the vicinity of the delivery port 361 in the set of applied positions. Then, air irregularly acts on the phosphor paste 8 from the start to the end of the discharge, whereby the bias of the adhesion state of the phosphor paste 8 changes irregularly in the entire pattern elements. Further, the pressure of air from the air supply unit 73, the arrangement of the air nozzle 36, and the like are determined so that the maximum value of the change in the application position of the phosphor paste 8 is 5% or more and 40% or less with respect to the pitch of the ribs 91. Is done.

  As described above, also in the pattern forming apparatus according to the third embodiment, the bias of the phosphor paste 8 filled in each groove 92 is irregularly changed by applying an air flow to the phosphor paste 8. The occurrence of unevenness in the entire pattern is suppressed. In addition, since the phosphor paste 8 discharged from all the discharge ports 52 is not biased in the same direction at each time during pattern formation, the occurrence of pattern unevenness can be further suppressed with a simple structure.

  FIG. 10 is a diagram showing a part of a pattern forming apparatus 1a according to the fourth embodiment of the present invention. The pattern forming apparatus 1a discharges a rib forming material, which is a pattern forming material having fluidity, from a plurality of discharge ports 52 of the nozzle portion 5a, and forms ribs 93, which are linear and rib-shaped pattern elements, on the substrate 9. This is an apparatus for forming a striped pattern by arranging at an equal pitch. The rib forming material contains a photoinitiator that starts curing (crosslinking reaction) by ultraviolet rays, a resin that is a binder, and a low softening point glass frit that is a glass powder, and is irradiated with light. Thus, the rib 93 is cured in a short time.

  The pattern forming apparatus 1 a is provided with a dedicated nozzle part 5 a for discharging a rib forming material instead of the nozzle part 5 of the pattern forming apparatus 1 of FIG. 1, and further includes a light irradiation part 43 and a light source unit 430. The other configuration is the same as that of the pattern forming apparatus 1 and will be described below with the same reference numerals.

  In the pattern forming apparatus 1a, as in the first embodiment, the stage unit 20 holding the substrate 9 is moved in the Y direction by the stage moving mechanism, and the micro moving mechanism 3 and the frame 12 fixed to the base 11 are moved. A nozzle portion 5 a is attached via the head portion 4. Then, while the rib forming material is discharged from the nozzle portion 5a, the substrate 9 is moved by the stage moving mechanism, so that the nozzle portion 5a is relatively and continuously with respect to the substrate 9 in the moving direction along the substrate 9. A pattern composed of a plurality of linear ribs 93 that move and extend in the scanning direction is formed on the substrate 9.

  A plurality of discharge ports arranged in a direction (X direction) perpendicular to the scanning direction is provided at the tip of the nozzle portion 5 a, and the discharge ports are in a state of being very close to the substrate 9. Further, a rib forming material is supplied to the nozzle portion 5a by a material supply mechanism (not shown), and the rib forming material is discharged from the plurality of discharge ports onto the upper surface of the substrate 9 in accordance with the movement of the nozzle portion 5a.

  The light irradiation unit 43 is disposed on the rear side in the movement direction of the nozzle unit 5a, and is attached to a position fixed relative to the nozzle unit 5a. The light irradiation unit 43 is connected to the light source unit 430 through the optical fiber 431. The light source unit 430 includes a light source 432 (for example, a xenon lamp) that emits light that is ultraviolet light, and a shutter 433 that controls ON / OFF of light emission from the light source 432. Light from the light source 432 is guided to the light irradiation unit 43 by the optical fiber 431 and is emitted from the light irradiation unit 43 toward the substrate 9 on the (−Y) side of the nozzle unit 5. The light source unit 430 is connected to the control unit 10, and light irradiation is controlled in synchronization with the discharge of the rib forming material and the movement of the substrate 9.

  In the pattern forming apparatus 1a, while the rib forming material is discharged from the nozzle portion 5a, the nozzle portion 5a is in the (+ Y) direction relative to the substrate 9, so that the rib forming material from each discharge port is It is applied on the substrate 9 in a straight line extending in the Y direction. At this time, the rib forming material immediately after discharge from the nozzle portion 5a is cured in a shape almost immediately after discharge by being irradiated with ultraviolet rays from the light irradiation portion 43, and becomes a rib 93 which is a pattern element. In the case of the pattern forming apparatus 1a, since all the ribs 93 to be formed on the substrate 9 (scanning range of the nozzle portion 5a) are formed at a time by the movement of the nozzle portion 5a, pattern elements are formed on the substrate 9. Assuming a planned pattern line to be performed, the planned pattern line is parallel to the scanning direction and arranged at an equal pitch in a direction perpendicular to the scanning direction. Further, the pitch of the planned pattern line is determined by the nozzle portion 5a. This corresponds to the pitch of the discharge port.

  Also in the pattern forming apparatus 1a according to the fourth embodiment, while the nozzle portion 5a scans in the scanning direction and the pattern of the rib 93 is formed along all the planned pattern lines, the micro movement mechanism 3 performs the scanning direction. The nozzle portion 5a is irregularly finely moved in the direction perpendicular to the X direction (X direction). That is, in the pattern forming apparatus 1a, the minute movement mechanism 3 is an application position changing unit that irregularly changes the application position of the rib forming material to the substrate 9. Similar to the first embodiment, the minute movement mechanism 3 includes a stepping motor and a ball screw mechanism, and each discharge port is slightly separated from the reference position along the planned pattern line to the (+ X) side and (−X). However, unlike the first embodiment, after moving to a position away from the reference position, the position does not return immediately to the reference position.

  FIG. 11 is a diagram illustrating how the pattern of the rib 93 is formed. The operation of the pattern forming apparatus 1a is the same as that in FIG. 6 except that the rib forming material is discharged and cured, and the timing of the minute movement of the nozzle portion 5a in the X direction is different. The description will be given with reference to the reference numerals in FIG.

  In pattern formation, first, the substrate 9 is moved in the (−Y) direction by the stage moving mechanism, so that the nozzle portion 5a is relatively in the (+ Y) direction with respect to the substrate 9 at 4 mm / second, for example. When the movement is started (step S11) and the nozzle portion 5a reaches the discharge start position on the substrate 9, the discharge of the rib forming material from the discharge port 52 is started (step S12). Further, while the rib forming material is being discharged, the nozzle portion 5a is irregularly and smoothly moved in the direction perpendicular to the scanning direction by the minute movement mechanism 3. Thereby, all the application positions of the rib forming material to the substrate 9 are irregularly and smoothly changed in the X direction perpendicular to the scanning direction (step S13). The rib forming material is cured in the shape immediately after ejection by the light irradiation unit 43. As a result, as shown in FIG. 11, ribs 93 that are slightly distorted in the direction perpendicular to the scanning direction are formed.

  The change range of the application position is determined on the condition that it is equal to or less than the width of the discharge port 52, and is actually about half the width of the discharge port 52. For example, when the width of the discharge port 52 is 200 μm, the change range is about 100 μm (about 33% of the pitch when the pitch of the ribs 93 is 300 μm). That is, the position of the discharge port 52 is changed by about 50 μm in each of the (+ X) direction and the (−X) direction. More generally, the change range of the application position of the rib forming material is 5% or more and 40% or less (more preferably, 10% or more and 30% or less) of the pitch of the ribs 93 (that is, the pitch of the planned pattern line). The

  Further, the variation in the position where the rib forming material is applied with respect to the scanning direction is (+ X) or (−X) while the nozzle portion 5a moves by 1 to 100 times (preferably 5 to 10 times) the pitch of the rib 93. It is preferable that the application position is controlled so as to move once to the side. For example, when the pitch of the planned pattern line is 0.3 mm, the rib 93 is on the (+ X) side or (−X) between 2 and 3 mm. ) Is controlled to be biased to the side.

  When the nozzle portion 5a reaches the discharge stop position on the substrate 9 while discharging and curing the rib forming material, the irregular minute X-direction movement of the nozzle portion 5a is stopped (step S14), and further rib formation is performed. Material discharge and relative movement of the nozzle portion 5a are also stopped (steps S15 and S16). As a result, a pattern constituted by a plurality of ribs 93 is formed over substantially the entire area of the substrate 9 in the Y direction.

  In other words, the rib forming material from Step S12 to Step S15 is discharged from the nozzle portion 5a in parallel with the process in which the nozzle portion 5a from Step S11 to Step S16 moves relative and continuously with respect to the substrate 9. As a result, a linear pattern element (that is, the rib 93) extending in the moving direction of the nozzle portion 5a is formed approximately along a plurality of planned pattern lines, and in parallel with the pattern forming process. The application position where the rib forming material from the discharge port 52 arrives between step S13 and step S14 is irregularly changed minutely in the X direction.

  FIG. 12 is a diagram showing a pattern 90a according to a comparative example formed by the pattern forming apparatus 1a when the minute movement mechanism 3 is not moved, and FIG. 13 uses the minute movement mechanism 3. It is a figure which illustrates the pattern 90b formed in this way.

  In FIG. 12, the sixth rib 93a from the right is thicker than the other ribs 93 due to processing errors in manufacturing the nozzle portion 5a, and the position of the sixth rib 93b from the left is the processing error of the nozzle portion 5a. It shows a state in which it is formed at a pitch shifted with respect to the other ribs 93 depending on the surface state of the discharge ports 52. Due to the difference between the ribs 93a and 93b and the other ribs 93, unevenness is observed in the vicinity of the ribs 93a and 93b in the pattern 90a.

  FIG. 13 shows a pattern 90b formed by the same nozzle portion 5a as in the formation of the pattern 90a of FIG. 12, and the ribs corresponding to the ribs 93a and 93b of FIG. The rib 93a is slightly thick and the rib 93b is slightly displaced from the ideal position. In the pattern 90b, since all the ribs 93 including the ribs 93a and 93b are irregularly displaced in a direction perpendicular to the scanning direction (left and right direction on the paper surface), the space between the ribs 93a and 93b and the other ribs 93 is reduced. This difference is visually distracted, and the overall unevenness is reduced in the pattern 90b compared to the pattern 90a. Thus, in the pattern forming apparatus 1a, it is possible to suppress unevenness that occurs in the pattern of the rib 93. Further, the movement of the nozzle portion 5a can suppress unevenness easily and at low cost.

  Next, a pattern forming apparatus according to a fifth embodiment of the present invention will be described. The pattern forming apparatus according to the fifth embodiment is an apparatus for forming a rib pattern on a substrate as in the fourth embodiment, and FIG. 14 is an enlarged side view showing the vicinity of the nozzle portion 5a. FIG. 15 is a view showing the vicinity of the nozzle portion 5a from the light irradiation unit 43 side (that is, viewed from the left side of FIG. 14 toward the right direction). However, illustration of the nozzle part 5a and the light irradiation part 43 is abbreviate | omitted in FIG.

  In the pattern forming apparatus according to the fifth embodiment, the fine moving mechanism 3 is omitted from the pattern forming apparatus 1a according to the fourth embodiment, and as shown in FIGS. 14 and 15, the substrate 9 of the nozzle portion 5a. A conductive plate member 35a is provided adjacent to the rear side in the relative movement direction. The plate-like member 35a is connected to a power source 71 (see FIG. 15) similarly to the rod-like member 35 of the second embodiment, and can be moved in the X direction perpendicular to the scanning direction by the charging unit moving mechanism 72. The Other structures and basic operations are the same as those of the pattern forming apparatus 1a according to the fourth embodiment, and in the following description, the same reference numerals are given as appropriate.

  The plate-like member 35a is disposed between the light irradiation part 43 and the nozzle part 5a, and as shown in FIG. 15, a plurality of protrusions 351 are provided at the lower end in parallel with the array of the discharge ports 52. Similar to the rod-shaped member 35 (see FIG. 7) of the second embodiment, when a voltage is applied from the power source 71 to the plate-shaped member 35a, the entire plate-shaped member 35a including the protruding portion 351 is positively charged. On the other hand, the rib forming material is positively charged by friction with a member that forms a flow path until it is discharged from the discharge port 52. Accordingly, an electrostatic force is generated between the rib forming material and the protruding portion 351 that is the charging portion, and the rib forming material immediately after being discharged from the nozzle portion 5a is distorted (or inclined) in the height direction. . Then, the rib forming material is cured by ultraviolet rays from the light irradiation unit 43 in a distorted state, and as shown in FIG. 15, the (+ X) side or the (−X) side in the vicinity of the projection 351 in the height direction. A rib 93 that is distorted is formed.

  While the pattern of the rib 93 is formed, the plate-like member 35 a is irregularly moved in the X direction by the charging unit moving mechanism 72. As a result, the rib forming material with the protruding portion 351 traversing the upper portion acts on the (−X) side after the force that distorts it to the (+ X) side, or on the (−X) side. After the distorting force acts, the (+ X) side distorting force acts, and the rib forming material is cured in an irregularly distorted state. As a result, a rib 93 is formed in which the top portion 931 of the rib 93 is irregularly displaced on the (+ X) side and the (−X) side with respect to the planned pattern line (that is, the bottom portion of the rib 93).

  As described above, in the pattern forming apparatus according to the fifth embodiment, a part of the rib forming material on the substrate 9 (corresponding to the top 931 of the rib 93) while the rib forming material is discharged from the nozzle portion 5a. The mechanism for moving the protrusions 351 irregularly (that is, the protrusions 351, the power supply 71 and the charging part moving mechanism 72) is irregularly changed in a direction perpendicular to the scanning direction. It functions as a grant position changing unit that irregularly changes the grant position.

  Since the change in the application position occurs only in the vicinity of the protrusion 351, as in the second embodiment, when the pitch of the protrusions 351 is small, the application positions corresponding to almost all the ejection ports 52 are changed. However, when the pitch is large, a plurality of portions in the vicinity of the protrusion 351 in the set of applied positions are irregularly changed. The plate member 35a, the power source 71, and the charging portion moving mechanism 72 are designed so that the maximum value of the change in the position of the top portion 931 of the rib 93 is not less than 5% and not more than 40% with respect to the pitch of the planned pattern line. Designed.

  FIG. 16 is a diagram illustrating a pattern 90c formed by the pattern forming apparatus according to the fifth embodiment. In FIG. 16, only the position of the top 931 of the rib 93 is indicated by a line. Hereinafter, the change of the position of the top portion 931 will be described as the change of the application position of the rib forming material.

  The pattern 90 c shown in FIG. 16 includes ribs 93 a that are thicker than the other ribs 93 and ribs 93 b that are slightly shifted from the pitch of the other ribs 93, as in the case of FIGS. 12 and 13. On the other hand, in the left and right portions of the pattern 90c, the application position of the rib forming material is irregularly changed due to the influence of electrostatic force from different projections 351 during pattern formation, and the ribs 93 meandering irregularly minutely are formed. Is formed. The ribs 93 formed near the center of the pattern 90c are not affected by the protrusions 351, and the ribs 93 are linearly formed along the planned pattern line.

  In the pattern 90c, a plurality of portions of the set of application positions corresponding to the ejection ports 52 are irregularly changed, so that the difference between the ribs 93a and 93b and the other ribs 93 is visually confused. As a result, unevenness of the entire pattern 90c is alleviated. In addition, since all the ribs 93 are not biased in the same direction at each position in the scanning direction, the occurrence of pattern unevenness can be further suppressed with a simple structure.

  In the rib 93 formed in the fifth embodiment, the bottom portion is linear along the planned pattern line, and only the top portion 931 deviates from the planned pattern line. However, in the plasma display device, the rib 93 is positioned at the top portion 931. Thus, since the light emitting region of the light emitting element is determined, it is possible to suppress unevenness of the display device.

  FIG. 17 is a view showing a part of the pattern forming apparatus according to the sixth embodiment, and corresponds to FIG. In the pattern forming apparatus according to the sixth embodiment, the plate-like member 35a in the fifth embodiment is used as an application position changing unit that changes the application position of the rib forming material (application position corresponding to the top of the rib 93). In place of the power source 71, an air nozzle 36a for applying an air flow to the rib forming material immediately after discharge and an air supply unit for supplying air to the air nozzle 36a are provided, and the air nozzle 36a is movable in the X direction perpendicular to the scanning direction. It is said. The rest is the same as the configuration and operation of the pattern forming apparatus according to the fifth embodiment.

  The air nozzle 36a has a plurality of outlets 361 arranged in parallel to the arrangement of the discharge ports 52 of the nozzle part 5a, and the ribs 93 in the vicinity of the outlet 361 are the same as in FIG. 15 due to the action of air from the outlet 361. Are distorted in the (+ X) side or (−X) side with respect to the height direction. Then, as the air nozzle 36a moves in the X direction perpendicular to the scanning direction, the rib forming material is discharged from the nozzle portion 5a by the action of the irregular air flow as in the fifth embodiment. Further, the application position of a part of the rib forming material (the part corresponding to the top of the rib 93) is irregularly changed in a direction perpendicular to the scanning direction. In addition, since the change of the application position occurs in a plurality of portions near the plurality of delivery ports 361 among all the application positions, the pattern forming apparatus according to the sixth embodiment also has a simple structure and occurs in the pattern. It is possible to effectively suppress unevenness.

  Also in the sixth embodiment, the maximum value of the change in the application position (shift amount in the X direction of the top of the rib 93) is 5% or more and 40% or less with respect to the pitch of the pattern planned line. The air nozzle 36a, which is a position changing unit, an air supply unit, a moving mechanism of the air nozzle 36a, and the like are designed.

  Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made.

  In the first embodiment, it has been described that the phosphor paste 8 is applied along every two of the grooves 92 that are the pattern planned lines. However, all the phosphor pastes of three colors are used. The phosphor paste 8 may be applied to the grooves 92 simultaneously. Depending on the application, pattern elements may be formed along every predetermined number of lines other than two of the planned pattern lines.

  In the first embodiment, the discharge port 52 has three positions (i.e., the position at which the discharge port 52 is located at the center of the groove 92, the position biased toward the (+ X) side, and the position biased toward the (-X) side. However, even if the position of the discharge port 52 is changed only between two positions, a position biased toward the (+ X) side and a position biased toward the (−X) side. Good. Further, the position of the discharge port 52 may be continuously changed.

  In the first to third embodiments, unevenness can be alleviated even when the application position of the phosphor paste 8 is regularly changed. Furthermore, even if the application position of the nozzle portion 5 and the phosphor paste 8 is moved beyond the range shown in the above embodiment (for example, if the movement is performed for a short time), the phosphor paste 8 is moved to the adjacent groove 92. It is also possible to apply without protruding.

  In the fine movement mechanism 3 of the first and fourth embodiments, other mechanisms such as a cylinder, a cam, and a piezo may be employed for moving the nozzle portion.

  In the second, third, fifth, and sixth embodiments, the charged protrusion 351 and the air nozzles 36 and 36a may be disposed on the rear side in the traveling direction of the nozzle portions 5 and 5a. Further, the protrusion 351 and the air nozzles 36, 36a may be moved up and down or back and forth. The charging of the protrusion 351 is not limited to plus, and may be minus.

  In the third and sixth embodiments, instead of moving the air nozzles 36, 36a, the pressure of the air sent from each outlet 361 is independently and irregularly changed, so that the phosphor paste 8 is not changed. By applying a regular air flow, the application position of the phosphor paste 8 or the rib forming material may be changed. An inert gas such as nitrogen may be used instead of air.

  In the pattern forming apparatus according to the fourth to sixth embodiments, a lattice pattern may be formed. In this case, for example, first, a pattern composed of a plurality of striped ribs 93 is formed on the substrate 9, and then the nozzle portion 5 a is changed to one having a different pitch of the discharge ports 52, and the orientation of the substrate 9 is changed. Is changed 90 degrees to form a pattern composed of a plurality of new ribs 93 on the existing pattern. FIG. 18 is a diagram showing a part of a grid-like pattern 90d according to a comparative example in the case where the rib 93 is a straight line, and FIG. 19 is a position where a rib forming material is applied using the pattern forming apparatus according to the above embodiment. It is a figure which shows a part of the grid | lattice-like pattern 90e formed changing this. 18 and 19, the rib denoted by reference numeral 93 c is thicker than the other ribs 93, and in FIG. 19, the ribs are minutely and irregularly distorted to reduce unevenness. In the case of a lattice pattern, the occurrence of unevenness can be more effectively suppressed by using the above-described minute variation technique of the application position.

  In the above embodiment, the substrate 9 moves with respect to the nozzle portions 5 and 5 a, but the nozzle portions 5 and 5 a may move with respect to the substrate 9. Further, the pattern forming apparatus according to the above embodiment may be used for pattern formation of a substrate of a flat display device other than a plasma display device, for example, a flat display device such as a field emission display device or an organic EL display device, Furthermore, it may be used when a pattern having other functions such as a circuit or an insulating layer is formed on a glass substrate, a circuit substrate, a ceramic substrate, a semiconductor substrate or the like used for other than the display device.

It is a figure which shows the pattern formation apparatus which concerns on 1st Embodiment. It is a figure which shows a mode that fluorescent substance paste is discharged. It is a top view which shows a mode that the fluorescent substance paste which concerns on a comparative example is apply | coated. It is a top view which shows a mode that a fluorescent substance paste is apply | coated. It is a figure which expands and shows a discharge outlet and a rib. It is a figure which shows the flow of operation | movement of a pattern formation apparatus. It is a top view which shows a part of pattern formation apparatus which concerns on 2nd Embodiment. It is a figure which shows a mode that fluorescent substance paste is discharged. It is a figure which shows a mode that fluorescent substance paste is discharged in the pattern formation apparatus which concerns on 3rd Embodiment. It is a figure which shows a part of pattern formation apparatus which concerns on 4th Embodiment. It is a top view which shows a mode that a rib formation material is discharged. It is a figure which shows the pattern of the rib which concerns on a comparative example. It is a figure which shows the pattern of a rib. It is a figure which shows a mode that a rib formation material is discharged in the pattern formation apparatus which concerns on 5th Embodiment. It is a figure which shows the protrusion part and rib which are charging parts. It is a figure which shows the pattern of a rib. It is a figure which shows a mode that the rib formation material is discharged in the pattern formation apparatus which concerns on 6th Embodiment. It is a figure which shows the grid | lattice-like pattern which concerns on a comparative example. It is a figure which shows a grid | lattice pattern.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 1a Pattern formation apparatus 2 Stage moving mechanism 3 Minute moving mechanism 5, 5a Nozzle part 8 Phosphor paste 9 Substrate 35 Bar-shaped member 35a Plate-shaped member 36, 36a Air nozzle 52 Discharge port 71 Power supply 72 Charging part moving mechanism 73 Air supply part 90b, 90c, 90e Pattern 91 Rib 92 Groove 351 Protrusion 361 Outlet S11-S16 Step

Claims (9)

A pattern forming apparatus for forming a pattern on a substrate,
A nozzle part that discharges a pattern forming material having fluidity from a plurality of discharge ports onto a substrate;
While the pattern forming material is discharged from the nozzle portion, a plurality of linear shapes extending in the moving direction by moving the nozzle portion relative to the substrate in the moving direction along the substrate. A moving mechanism for forming a pattern composed of the pattern elements;
While the pattern forming material is discharged from the nozzle portion, substantially all or a plurality of portions of the plurality of application positions of the pattern forming material on the substrate corresponding to the plurality of discharge ports are set in a direction perpendicular to the moving direction. A grant position changing section that changes irregularly;
With
On the substrate, a plurality of planned pattern lines that are parallel to the moving direction and arranged at an equal pitch in a direction perpendicular to the moving direction are preset,
While the pattern forming material is discharged from the nozzle portion, the nozzle portion moves relative to the substrate, so that a predetermined number of the plurality of planned pattern lines can be provided along the plurality of planned pattern lines. The plurality of pattern elements extending in the moving direction along every other one are formed;
The change range of each application position changed by the application position changing unit is 5% or more and 40% or less of the pitch of the plurality of planned pattern lines in the direction perpendicular to the moving direction. . The pattern forming apparatus according to claim 1,
The pattern forming apparatus, wherein the application position changing unit irregularly changes the position of the nozzle unit in a direction perpendicular to the moving direction. The pattern forming apparatus according to claim 1,
The pattern forming material discharged from the nozzle part is charged,
The pattern forming apparatus, wherein the application position changing unit is a mechanism that irregularly moves a member having a plurality of charging units arranged along the plurality of ejection ports in the vicinity of the plurality of ejection ports. The pattern forming apparatus according to claim 1,
The pattern forming apparatus, wherein the application position changing unit causes an irregular gas flow to act on the pattern forming material discharged from the nozzle unit. The pattern forming apparatus according to any one of claims 1 to 4,
A plurality of ribs are formed on the substrate, and a plurality of grooves formed between the plurality of ribs correspond to the plurality of planned pattern lines,
The pattern forming apparatus, wherein the pattern forming material is a phosphor paste applied to the plurality of grooves or every predetermined number of the plurality of grooves. The pattern forming apparatus according to any one of claims 1 to 4,
Each of the plurality of pattern elements has a rib shape. A pattern forming apparatus for forming a phosphor paste pattern by applying a phosphor paste on a substrate having a plurality of ribs formed in parallel at equal pitches,
A nozzle part for discharging a pattern forming material, which is a phosphor paste, from a plurality of discharge ports onto the substrate;
While the pattern forming material is being discharged from the nozzle portion, the nozzle portion is moved relative to the substrate in a moving direction along the substrate, so that grooves between the plurality of ribs, Or, a moving mechanism for applying a pattern forming material to every predetermined number of grooves between the plurality of ribs,
While the pattern forming material is discharged from the nozzle portion, substantially all or a plurality of portions of the plurality of application positions of the pattern forming material on the substrate corresponding to the plurality of discharge ports are set in a direction perpendicular to the moving direction. A grant position changing section to be changed;
A pattern forming apparatus comprising: A pattern forming method for forming a pattern on a substrate,
a) discharging a pattern forming material having fluidity from a plurality of discharge ports of the nozzle part onto the substrate;
b) In parallel with the step a), a plurality of linear pattern elements extending in the moving direction by moving the nozzle part relative to the substrate in the moving direction along the substrate. Forming a pattern comprising:
c) In parallel with the step a), substantially all or a plurality of portions of the plurality of application positions of the pattern forming material on the substrate corresponding to the plurality of ejection openings are irregularly formed in a direction perpendicular to the moving direction. A process to change,
With
On the substrate, a plurality of planned pattern lines that are parallel to the moving direction and arranged at an equal pitch in a direction perpendicular to the moving direction are preset,
The plurality of pattern elements extending in the movement direction along the plurality of planned pattern lines or along every other predetermined pattern of the plurality of planned pattern lines are formed by the steps a) and b). And
The pattern forming method, wherein a change range of each application position changed in the step c) is 5% or more and 40% or less of a pitch of the plurality of planned pattern lines in a direction perpendicular to the moving direction. A pattern forming method for forming a phosphor paste pattern by applying a phosphor paste on a substrate having a plurality of ribs formed in parallel at equal pitches,
a) a step of discharging a pattern forming material, which is a phosphor paste, onto the substrate from a plurality of discharge ports of the nozzle portion;
b) In parallel with the step a), the nozzle portion is moved relative to the substrate in the movement direction along the substrate, so that the grooves between the plurality of ribs or the Applying a pattern forming material to every predetermined number of grooves between the plurality of ribs;
c) In parallel with the step a), substantially all or a plurality of portions of the plurality of application positions of the pattern forming material on the substrate corresponding to the plurality of ejection openings are changed in a direction perpendicular to the moving direction. When,
A pattern forming method comprising:

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