JP2008157668A - Mounting substrate inspection device, and inspection method therein - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To shorten an inspection time while preventing a mounting substrate from condensing dew from the start of inspection till the finish thereof, in a mounting substrate inspection system and an inspection method in the system. <P>SOLUTION: This mounting substrate inspection system 10 is provided with a conveyable inspection box 30 provided with a heat-insulated casing 31 for supporting the mounting substrate to be carried in and out from its inside, and an introducing port 36 provided in the heat-insulated casing 31 to introduce a heating medium for regulating a temperature in an inside of the heat-insulated casing 31, and closable by a closing means, at least one temperature regulator 50 connected disconnectably to the inspection box 30 stored with the mounting substrate 20, and used for regulating a temperature of the mounting substrate 20, and at least one inspection device 40 electrically connected disconnectably to the inspection box 30 stored with the mounting substrate 20, and used for inspecting an electric characteristic of the mounting substrate 20. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a mounting board inspection system and an inspection method in the system.

  2. Description of the Related Art Conventionally, a mounting substrate inspection system and an inspection method in the system are disclosed in Patent Document 1. As shown in FIG. 1 and FIG. 2 of Patent Document 1, the mounting board inspection system includes an inspection chamber 3 that is constituted by a heat insulating member and houses a control board 14 to be inspected, and a control board 14. The temperature adjustment devices 2 and 4 that change the temperature in a temperature range in which the control board 14 may be exposed in an actual use state, and devices connected to the control board 14 in the actual use state of the control board 14 The operation of the control board 14 is performed with the peripheral device connected to the control board 14 while changing the temperature of the corresponding peripheral equipment (for example, a solenoid coil or a yaw rate sensor) and the control board 14 within the temperature range. And an inspection device 1 for inspecting whether or not it is normal.

In the inspection process in this system, first, in step S1, an inspection is performed by a test program which is a level determination of the ON voltage, the OFF voltage, etc. with the substrate temperature of the mounting substrate 14 being a room temperature. Next, in step S2, the mounting substrate 14 is inspected in an actual use state while changing the substrate temperature of the mounting substrate 14 from room temperature to a low temperature for a predetermined time. Thereafter, in step S4 and step S7, inspection is performed by a test program at low and high temperatures. Then, in step S5, an inspection in the actual use state is performed while changing the substrate temperature from the low temperature to the high temperature in a predetermined time. In step S8, the substrate temperature is changed from the high temperature to the normal temperature in a predetermined time. Perform an inspection.
JP 2005-127806 A

  By the way, in the mounting board inspection system and the inspection method in the system described above, the process of heating / cooling the mounting board (heating) until the inspection is completed after the control board 14 is set in the inspection chamber 3. -Since the cooling process) and the process (inspection process) for inspecting the mounting substrate using the inspection device are carried out continuously (in series), there is a problem that the inspection time becomes long.

  On the other hand, it is conceivable to shorten the inspection time by using a constant temperature bath for the heating / cooling process and using the inspection apparatus for the inspection process separately and in parallel. However, when the mounting board cooled in the thermostat is transported from the thermostat to the inspection device and mounted and inspected, the mounting board exposed to the outside air during the transport is condensed, and as a result, the measurement accuracy of the electrical characteristics is reduced. There is a risk that it may be difficult to maintain, and condensation may cause migration.

  The present invention has been made to solve the above-described problems, and in the mounting board inspection system and the inspection method in the system, the inspection time is shortened while preventing the mounting board from condensing from the start to the end of the inspection. The purpose is to time.

  A feature of the mounting board inspection system according to claim 1 is that a heat insulating housing that supports the mounting board so as to be able to enter and exit, and an inspection probe for measuring electrical characteristics of the mounting board that is supported in the heat insulating housing. And a closing means that introduces a connector to which the inspection probe is electrically connected and can be electrically connected to an external device, and a heat medium provided in the heat insulating casing for adjusting the temperature in the heat insulating casing. And a plurality of transportable inspection boxes provided with an inlet that can be closed by means of, and an inspection box in which the mounting board is housed, which is detachably connected and used for adjusting the temperature of the mounting board. At least one temperature control device and a test box in which the mounting board is housed are detachably electrically connected, and are used to perform an inspection of the electrical characteristics of the mounting board. Also is that with a single test device.

  The mounting board inspection system according to claim 2 is characterized in that, in claim 1, the closing means is an opening / closing device that opens the inlet when the heat medium is introduced and closes the inlet when the heat medium is not introduced. That is.

  The mounting board inspection system according to claim 3 is characterized in that, in claim 1 or claim 2, a sensor for detecting a physical quantity is mounted on the mounting board, and the inspection apparatus is provided with an inspection box and a motion corresponding to the physical quantity. Is equipped with an inspection table that can generate

  The feature of the inspection method in the mounting substrate inspection system according to claim 4 is to measure the electrical characteristics of the heat insulating housing that supports the mounting substrate so as to be able to enter and exit, and the mounting substrate that is supported in the heat insulating housing. The inspection probe, a connector to which the inspection probe is electrically connected and electrically connectable to an external device, and a heat medium provided in the heat insulation case for adjusting the temperature in the heat insulation case In addition, in order to adjust the temperature of the mounting board, it is detachably connected to a plurality of transportable inspection boxes having an introduction port that can be closed by closing means, and an inspection box in which the mounting board is stored. At least one temperature control device to be used and an inspection box in which the mounting board is stored are electrically connected in a detachable manner, and are used to inspect the electrical characteristics of the mounting board. An inspection method in a mounting board inspection system comprising at least one inspection apparatus, wherein an inspection box is connected to a temperature adjustment device, and one of heating and cooling of the mounting substrate is performed by the temperature adjustment device, and then The inspection box is transported from the temperature adjustment device to the inspection device and connected, and the inspection device inspects the electrical characteristics of the mounting board, and then the inspection box is transported from the inspection device to the temperature adjustment device and connected to the temperature. The other of heating and cooling of the mounting substrate is performed by the adjusting device, and then the inspection box is transported from the temperature adjusting device to the inspection device and connected, and the electrical characteristics of the mounting substrate are inspected by the inspection device.

  In the invention according to claim 1 configured as described above, the electrical characteristics of the mounting substrate are inspected according to temperature (normal temperature (for example, 25 ° C.), low temperature (for example, −40 ° C.), high temperature (for example, 100 ° C.)). In carrying out the inspection box, a process for heating / cooling the mounting board using a temperature adjusting device (heating / cooling process) and a process for inspecting the mounting board using an inspection device (inspection process) are performed. It can be done in units, which makes it possible to carry out these steps separately and in parallel. Therefore, the inspection time can be shortened.

  In addition, it is possible to suppress the outside air from flowing into the inspection box by closing the inlet of the inspection box during conveyance from the temperature adjusting device to the inspection device. Thereby, it is possible to suppress the mounting substrate from being condensed particularly during the transport of the cooled mounting substrate. Therefore, the occurrence of migration can be prevented, and the measurement accuracy of electrical characteristics can be maintained high.

  In addition, when an inspection box heated or cooled by a temperature adjusting device is connected to the inspection apparatus for inspection, the inspection box is insulated, so that the mounting substrate rapidly lowers or rises from the temperature at which the inspection starts during inspection. Can be suppressed. Therefore, the low temperature inspection and the high temperature inspection of the mounting substrate can be stably performed.

  In the invention according to claim 2 configured as described above, in the invention according to claim 1, the closing means opens the inlet when the heat medium is introduced, and introduces the inlet when the heat medium is not introduced. Therefore, it is possible to reliably suppress the outside air from flowing into the examination box with a simple configuration.

  In the invention according to claim 3 configured as described above, in the invention according to claim 1 or claim 2, when a sensor for detecting a physical quantity is mounted on the mounting board, the physical quantity corresponds to the inspection box unit. By generating the movement, the inspection of the electrical characteristics for each temperature can be performed with an easy and simple configuration.

  In the invention according to claim 4 configured as described above, the inspection box is connected to the temperature adjustment device, and the mounting substrate is heated and cooled by the temperature adjustment device, and then the inspection box is inspected from the temperature adjustment device. Carrying and connecting to the device, inspecting the electrical characteristics of the mounting board with the inspection device, then transporting and connecting the inspection box from the inspection device to the temperature adjustment device, and heating and mounting of the mounting substrate with the temperature adjustment device The other cooling is performed, and then the inspection box is transported from the temperature adjustment device to the inspection device and connected, and the inspection device inspects the electrical characteristics of the mounting substrate. Therefore, when the inspection of the electrical characteristics of the mounting board is performed for each temperature (normal temperature (for example, 25 ° C.), low temperature (for example, −40 ° C.), high temperature (for example, 100 ° C.)), The process of heating / cooling (heating / cooling process) and the process of inspecting the mounting board using the inspection device (inspection process) can be performed in units of inspection boxes. It is possible to implement in parallel. Therefore, the inspection time can be shortened.

  In addition, it is possible to suppress the outside air from flowing into the inspection box by closing the inlet of the inspection box during conveyance from the temperature adjusting device to the inspection device. Thereby, it is possible to suppress the mounting substrate from being condensed particularly during the transport of the cooled mounting substrate. Therefore, the occurrence of migration can be prevented, and the measurement accuracy of electrical characteristics can be maintained high.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS An embodiment of a mounting board inspection system and an inspection method in the system according to the invention will be described below with reference to the drawings. 1 is a schematic view showing a mounting board inspection system, FIG. 2 is an external perspective view showing an inspection box, FIG. 3 is an enlarged sectional view showing the vicinity of an air inlet, and FIG. 4 is an outline showing an inspection apparatus. FIG. 5 is a schematic view showing a temperature adjusting device.

  As shown in FIG. 1, the mounting board inspection system 10 includes a plurality of inspection boxes 30 that support the mounting board 20 so as to be able to enter and exit, at least one inspection device 40, and at least one temperature adjustment device 50. It has.

  The mounting substrate 20 is a printed circuit board on which a large number of electronic components and electrical components are mounted, and sensors 21 and 22 for detecting physical quantities are also mounted. The physical quantity is a longitudinal acceleration, a lateral acceleration, a yaw rate, or the like of the vehicle, and the sensors are an acceleration sensor 21, a yaw rate sensor 22, or the like.

  As shown in FIG. 2, the inspection box 30 includes a heat insulating casing 31, a mounting board inlet / outlet 32, a lid 33, an inspection probe 34, a connector 35, an air inlet 36, an air outlet 37, and an opening / closing device 38. Yes.

  The heat insulating casing 31 is formed of a heat insulating material in a box shape. Examples of the heat insulating material include foamed plastic heat insulating materials (for example, polystyrene foam, urethane foam, phenol foam), inorganic fiber heat insulating materials (for example, glass wool), and the like. On the upper wall surface of the heat insulating casing 31, a mounting board entrance / exit 32 for inserting and removing the mounting board 20 is formed. The mounting board entrance / exit 32 is hermetically closed by a lid 33 that can be freely opened and closed. The lid 33 is also formed of a heat insulating material in the same manner as the heat insulating casing 31. The mounting board entrance / exit 32 is opened when the mounting board 20 enters and exits, and is closed during temperature adjustment, transportation, and inspection in an inspection box 30 described later.

  A mounting board support mechanism (not shown) is provided in the heat insulating casing 31, and the mounting board 20 is supported in the heat insulating casing 31 by the mounting board support mechanism. A plurality of inspection probes 34 for measuring the electrical characteristics of the mounting substrate 20 supported by the mounting substrate support mechanism are provided in the heat insulating casing 31. In addition, the thermal insulation casing 31 is provided with a connector 35 to which the inspection probe 34 is electrically connected and can be electrically connected to an external device. The connector 35 can be attached to and detached from a cable connected to an external device.

  An air introduction port 36 and an air discharge port 37 are provided on a pair of side wall surfaces of the heat insulating casing 31 facing each other. In the present embodiment, one and two air inlets 36 and two air outlets 37 are provided, respectively, but one or both may be provided, or two or more may be provided.

  A supply pipe 52 (described later) is detachably connected to the air introduction port 36, and low temperature air or high temperature air from the temperature adjustment device 50 is supplied into the inspection box 30. The low temperature air or the high temperature air is a heat medium for adjusting the temperature in the heat insulating casing 30. The air discharge port 37 is for discharging the gas in the inspection box 30 to the outside. As a result, the low-temperature air or high-temperature air introduced into the inspection box 30 from the air introduction port 36 passes through the inspection box 30, and the inside of the inspection box 30 and thus the mounting substrate 20 is cooled or heated to a low temperature. It is discharged from the outlet 37.

  As shown in FIG. 3, the air introduction port 36 and the air outlet port 37 are provided with an opening / closing device 38 that is a closing means capable of closing the air introduction port 36 and the air outlet port 37. The opening / closing device 38 includes a lid 38a, a hinge 38b, and an urging member 38c. The lid 38a closes the outlet side of the air inlet 36 (or the air outlet 37) so as to be freely opened and closed. The lid 38a is assembled to the air inlet 36 via a hinge 38b. The urging member 38c is, for example, a torsion coil spring, and urges the lid 38a to a closed state.

  Thereby, when low-temperature air or high-temperature air is supplied from the inlet side of the air introduction port 36 (when introduced), the lid 38a is opened against the urging force of the urging member 38c, and the air introduction port 36 is opened. Is opened. At this time, the air outlet 37 is similarly opened. On the other hand, when low-temperature air or high-temperature air is not supplied from the inlet side of the air introduction port 36 (when not introduced), the lid 38a is closed by the urging force of the urging member 38c, and the air introduction port 36 is closed. . At this time, the air outlet 37 is similarly closed. That is, the air introduction port 36 and the air outlet port 37 are opened when the temperature in the inspection box 30 described later is adjusted, and are closed during the conveyance and inspection of the inspection box 30 described later.

  The inspection box 30 configured in this manner is transportable. The term “conveyable” includes a case where the worker can carry the product with his / her hand and a case where the worker can carry the product automatically using a robot or the like.

  The inspection device 40 is detachably electrically connected to the inspection box 30 in which the mounting substrate 20 is accommodated, and is used for inspecting the electrical characteristics of the mounting substrate 20. . The inspection device 40 includes a control device 41, an inspection table 42 and a drive device 43.

  The control device 41 performs an inspection of the electrical characteristics of the mounting substrate 20 and drives the driving device 43. The inspection table 42 is installed so that the inspection box 30 can be electrically connected. The inspection table 42 is provided with a cable connector electrically connected to the control device 41, and this connector is detachably connected to the connector 35. The inspection table 42 is driven by a driving device 43.

  The driving device 43 receives a command from the control device 41, and rotates the inspection table 42, reciprocates linearly, or tilts the inspection table 42. By rotating the examination table 42, a motion corresponding to the yaw rate of the vehicle detected by the yaw rate sensor 22 can be generated. By causing the inspection table 42 to reciprocate in a straight line, a motion corresponding to the longitudinal acceleration or the lateral acceleration of the vehicle detected by the acceleration sensor 21 can be generated.

  The temperature adjusting device 50 is detachably connected to the inspection box 30 in which the mounting substrate 20 is stored, and is used to adjust the temperature of the mounting substrate 20. The temperature adjusting device 50 includes a heat medium supply source 51 and a supply pipe 52.

  The heat medium supply source 51 generates and derives low temperature air or high temperature air that is a heat medium supplied into the inspection box 30. The heat medium supply source 51 may be a type that can generate both low-temperature air and high-temperature air and that can selectively switch which one is generated, or may be a type that can generate either low-temperature air or high-temperature air. The low-temperature air is adjusted to a predetermined temperature (for example, −40 ° C.) and led out. Further, the high temperature air is adjusted to a predetermined temperature (for example, + 100 ° C.) and led out. Further, the low-temperature air and the high-temperature air are dehumidified and derived in a dry state.

  The supply pipe 52 includes a first connection end 52a connected to the outlet 51a of the heat medium supply source 51, and a plurality of second connection ends 52b connected to the air introduction ports 36 of the plurality of examination boxes 30 in a detachable manner. It has.

  Next, an inspection method in the mounting board inspection system 10 configured as described above will be described with reference to the flowchart of FIG. This inspection measures the electrical characteristics of the mounting substrate 20 at room temperature (for example, 20 ° C.), a predetermined low temperature (for example, −40 ° C.), and a predetermined high temperature (for example, 100 ° C.). Specifically, the inspection at room temperature (room temperature inspection) is performed first, the cooling process is performed, the inspection at low temperature (low temperature inspection) is performed, the overheating process is performed, and finally the inspection at high temperature (high temperature) (Inspection).

  In the room temperature inspection, first, the mounting substrate 20 is set in an inspectable state in the inspection box 30, and the inspection box 30 is connected to the inspection device 40 (step 102). Then, the electrical characteristics of the mounting substrate 20 are measured at room temperature with the inspection device 40 (step 104).

  When the normal temperature inspection is completed, the inspection box 30 is removed from the inspection device 40 and transported to and connected to the temperature adjustment device 50 set to supply low-temperature air (step 106). Then, the mounting substrate 20 is cooled by supplying low temperature air from the temperature adjusting device 50 (cooling step; step 108).

  When the mounting substrate 20 is cooled from room temperature to a predetermined low temperature, the inspection box 30 is removed from the temperature adjustment device 50 and is transported to and connected to the inspection device 40 (step 110). Then, the electrical characteristics of the mounting substrate 20 are measured at a low temperature by the inspection device 40 (step 112). During this conveyance, the air introduction port 36 and the air outlet port 37 are closed by the opening / closing device 38, so that it is possible to suppress the outside air from flowing into the inspection box 30, so that the mounting substrate 20 is condensed. Can be suppressed.

  When the low temperature inspection is completed, the inspection box 30 is removed from the inspection device 40 and conveyed to and connected to the temperature adjustment device 50 set to supply high temperature air (step 114). Then, the mounting substrate 20 is heated by supplying high-temperature air from the temperature adjusting device 50 (heating step; step 116).

  When the mounting board 20 is changed from a predetermined low temperature to a predetermined high temperature, the inspection box 30 is removed from the temperature adjusting device 50 and is transported to and connected to the inspection device 40 (step 118). Then, the electrical characteristics of the mounting substrate 20 are measured at a high temperature by the inspection device 40 (step 120).

  In the above inspection, the mounting substrate 20 is inspected in the order of normal temperature inspection, low temperature inspection, and high temperature inspection, but the order of low temperature inspection and high temperature inspection may be switched.

  As is clear from the above description, in the present embodiment, the electrical characteristics of the mounting substrate 20 are inspected according to temperature (normal temperature (for example, 25 ° C.), low temperature (for example, −40 ° C.), high temperature (for example, 100 ° C.)). In carrying out the process, a process of heating / cooling the mounting board 20 using the temperature adjusting device 50 (heating / cooling process) and a process of inspecting the mounting board 20 using the inspection device 40 (inspection) Process) can be carried out in units of 30 inspection boxes, which makes it possible to carry out these processes separately and in parallel. That is, the inspection process by the inspection apparatus 40 and the temperature adjustment process (cooling process and heating process) by the temperature adjustment apparatus 50 can be performed simultaneously in parallel. Accordingly, it is possible to shorten the time of the entire inspection process.

  In addition, during the transfer from the temperature adjustment device 50 to the inspection device 40, the air introduction port 36 that is the introduction port of the inspection box 30 is closed to reduce the outside air from flowing into the inspection box 30. it can. Thereby, the rapid fluctuation | variation of the temperature in the inspection box 30 can be suppressed. In addition, it is possible to suppress the condensation of the mounting substrate 20 while the cooled mounting substrate 20 is being transported. Therefore, the occurrence of migration can be prevented, and the measurement accuracy of electrical characteristics can be maintained high.

  Further, when the inspection box 30 heated or cooled by the temperature adjusting device 50 is connected to the inspection device 40 for inspection, the inspection box 30 is insulated, so that the mounting substrate 20 suddenly starts from the inspection start temperature during the inspection. It is possible to suppress temperature drop or temperature rise. Therefore, the low temperature inspection and high temperature inspection of the mounting substrate 20 can be stably performed.

  The closing means is an opening / closing device 38 that opens the inlet (air inlet 36) when the heat medium is introduced and closes the inlet (air inlet 36) when the heat medium is not introduced. It is possible to reliably suppress the outside air from flowing into the examination box 30 with a simple configuration.

  In addition, when the sensors 21 and 22 for detecting the physical quantity are mounted on the mounting substrate 20, it is possible to easily and simply inspect the electrical characteristics for each temperature by generating a motion corresponding to the physical quantity in units of the inspection box 30. Can be implemented.

  Further, the inspection box 30 is connected to the temperature adjustment device 50, and the mounting substrate 20 is heated or cooled by the temperature adjustment device 50, and then the inspection box 30 is transported from the temperature adjustment device 50 to the inspection device 40 and connected. Then, the inspection device 40 inspects the electrical characteristics of the mounting substrate 20, and then the inspection box 30 is transported from the inspection device 40 to the temperature adjustment device 50 and connected, and the temperature adjustment device 50 heats the mounting substrate 20. Then, the other of the cooling is performed, and then the inspection box 30 is transported from the temperature adjusting device 50 to the inspection device 40 and connected thereto, and the inspection device 40 inspects the electrical characteristics of the mounting substrate 20. Therefore, when the inspection of the electrical characteristics of the mounting substrate 20 is performed for each temperature (normal temperature (for example, 25 ° C.), low temperature (for example, −40 ° C.), high temperature (for example, 100 ° C.)), the temperature adjustment device 50 is used. The process of heating / cooling the mounting substrate 20 (heating / cooling process) and the process of inspecting the mounting substrate 20 using the inspection device 40 (inspection process) can be performed in units of 30 inspection boxes, This makes it possible to carry out these processes separately and in parallel. Therefore, the inspection time can be shortened.

  In the above-described embodiment, the temperature adjustment device 50 is of a type in which low temperature air or high temperature air is actively blown into the inspection box 30. You may make it use the thermostat which can accommodate two or more. In this case, the thermostatic chamber can be adjusted to the predetermined low temperature and high temperature. In addition, by placing the mounting substrate 20 in the thermostatic chamber with the lid 33 of the inspection box 30 opened, the thermostatic chamber and the inspection box are detachably connected. When the mounting substrate 20 reaches a predetermined temperature, the lid 33 is closed and the mounting substrate 20 is taken out of the thermostatic chamber. In this case, the air inlet 36 and the air outlet 37 may be deleted. The introduction port is a mounting board entry / exit 32 of the inspection box 30.

  In the above-described embodiment, the opening / closing device is employed as the closing means. However, a simple lid that can be attached and detached by the operator's hand may be used.

  In the above embodiment, the mounting board 20 is mounted with sensors 21 and 22 that detect physical quantities. However, the mounting board 20 is not limited to this, and for example, a board on which such sensors are not mounted may be used.

  In the above embodiment, the inspection table 42 that is driven by the drive device 43 is employed. However, the present invention is not limited to this, and for example, an inspection table that is not driven may be employed.

  In the said embodiment, although the test | inspection apparatus 40 and the temperature control apparatus 50 were made into a different body, it is not restricted to this, For example, these apparatuses 40 and 50 may be integrated.

It is a schematic diagram showing a mounting board inspection system according to the present invention. It is an external appearance perspective view which shows the inspection box shown in FIG. It is an expanded sectional view which shows the air introduction port vicinity of the inspection box shown in FIG. It is a schematic diagram which shows the inspection apparatus shown in FIG. It is a schematic diagram which shows the temperature control apparatus shown in FIG. It is a flowchart which shows the inspection method in a mounting board inspection system.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Mounting board inspection system, 20 ... Mounting board, 21 ... Acceleration sensor (sensor), 22 ... Yaw rate sensor (sensor), 30 ... Inspection box, 31 ... Housing, 32 ... Mounting board entrance / exit, 33 ... Cover, 34 ... Inspection probe, 35 ... Connector, 36 ... Air inlet (inlet), 37 ... Air outlet, 38 ... Opening / closing device (blocking means), 40 ... Inspection device, 41 ... Control device, 42 ... Inspection table, 43 ... Driving device, 50 ... temperature adjusting device, 51 ... heat medium supply source, 52 ... supply pipe.

Claims (4)

A heat insulating housing (31) that supports the mounting substrate (20) so as to be able to enter and exit, and an inspection probe (34) for measuring electrical characteristics of the mounting substrate supported in the heat insulating housing; A connector (35) to which the inspection probe is electrically connected and can be electrically connected to an external device (40), and a heat medium provided in the heat insulation case for adjusting the temperature in the heat insulation case And a plurality of transportable inspection boxes (30) provided with an inlet (36) that can be closed by the closing means (38),
At least one temperature adjustment device (50) that is detachably connected to the inspection box in which the mounting substrate is housed, and is used to adjust the temperature of the mounting substrate;
At least one inspection device (40) that is detachably electrically connected to the inspection box in which the mounting substrate is housed, and is used to inspect the electrical characteristics of the mounting substrate; ,
A mounting board inspection system comprising:   2. The opening / closing device (38) according to claim 1, wherein the closing means is an opening and closing device (38) that opens the introduction port when the heat medium is introduced and closes the introduction port when the heat medium is not introduced. Mounting board inspection system.   3. The sensor (21, 22) for detecting a physical quantity is mounted on the mounting board according to claim 1 or 2, and the inspection apparatus is provided with the inspection box and can generate a motion corresponding to the physical quantity. A mounting board inspection system comprising an inspection table (42). A heat insulating housing (31) that supports the mounting substrate (20) so as to be able to enter and exit, and an inspection probe (34) for measuring electrical characteristics of the mounting substrate supported in the heat insulating housing; A connector (35) to which the inspection probe is electrically connected and can be electrically connected to an external device (40), and a heat medium provided in the heat insulation case for adjusting the temperature in the heat insulation case And a plurality of transportable inspection boxes (30) including an introduction port (36) that can be closed by the closing means (38), and the inspection box in which the mounting board is housed can be attached to and detached from the inspection box. At least one temperature adjustment device (50) that is connected and used to adjust the temperature of the mounting board, and the inspection box in which the mounting board is housed are detachably and electrically Connected, said At least one inspection device and is used to implement the inspection of the electrical characteristics of the instrumentation substrate (40), a testing method for mounting board inspection systems with,
The inspection box is connected to the temperature adjustment device (step 106), and one of heating and cooling of the mounting board is performed by the temperature adjustment device (step 108),
Thereafter, the inspection box is transported and connected from the temperature adjustment device to the inspection device (step 110), and the electrical characteristics of the mounting substrate are inspected by the inspection device (step 112),
Thereafter, the inspection box is transported and connected from the inspection device to the temperature adjusting device (step 114), and the mounting substrate is heated and cooled by the temperature adjusting device (step 116).
Thereafter, the inspection box is transported and connected from the temperature adjusting device to the inspection device (step 118), and the electrical characteristics of the mounting substrate are inspected by the inspection device (step 120). Inspection method for mounting board inspection system.

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