JP2008147505A - Processing machine with cleaning device for chuck table - Google Patents

Abstract

A processing machine including a cleaning device that can reliably remove dust and the like adhering to a holding surface of a chuck table that holds a workpiece.
A roller support frame 21 supported so as to be movable in a direction perpendicular to a holding surface of a chuck table, a first adhesive roller 22 supported rotatably on the roller support frame, and a first A second adhesive roller 23 disposed in contact with the adhesive roller and rotatably supported by the roller support frame body and having an adhesive force greater than the adhesive force of the first adhesive roller; It comprises an operating position where the adhesive roller contacts the holding surface of the chuck table, an advancing / retracting means 24 for moving the retracting position away from the holding surface, and a moving means 25 for moving the roller support frame parallel to the holding surface of the chuck table. . The dust on the chuck table adheres to the outer peripheral surface of the first adhesive roller, and the dust adhered to the first adhesive roller adheres to the outer peripheral surface of the second adhesive roller.
[Selection] Figure 2

Description

  The present invention relates to a processing machine including a chuck table cleaning device that cleans a holding surface of a chuck table that holds a workpiece such as a wafer.

  In the semiconductor device manufacturing process, a plurality of regions are partitioned by division lines arranged in a lattice pattern on the surface of a substantially disc-shaped semiconductor wafer, and devices such as ICs and LSIs are formed in the partitioned regions. . Then, the semiconductor wafer is cut along the streets to divide the region in which the device is formed to manufacture individual semiconductor chips. In addition, optical device wafers with gallium nitride compound semiconductors laminated on the surface of a sapphire substrate are also divided into individual optical devices such as light emitting diodes and laser diodes by cutting along the streets, and are widely used in electrical equipment. ing.

As a method of dividing a wafer such as a semiconductor wafer or an optical device wafer along a street, a method of performing ablation processing by irradiating a pulsed laser beam along a division planned line formed on a workpiece and cutting the wafer Has been proposed. (For example, refer to Patent Document 1.)
JP-A-10-305420

In addition, as a method of dividing a wafer such as a semiconductor wafer or an optical device wafer along a street, a pulse laser beam having a wavelength that is transparent to the wafer is used, and a condensing point is set inside the region to be divided. A laser processing method for irradiating a pulsed laser beam has been proposed. The division method using this laser processing method is to divide the inside of the wafer by irradiating a pulse laser beam in the infrared region having transparency to the wafer by aligning the condensing point inside from one side of the wafer. The wafer is divided into individual chips by continuously forming a deteriorated layer along the planned line and applying an external force along the planned split line whose strength has decreased due to the formation of the deteriorated layer. . (For example, see Patent Document 2.)
Japanese Patent No. 3408805

As described above, in order to laser-process a wafer, it is necessary to position the condensing point of the laser beam with high accuracy with respect to the thickness direction of the wafer.
However, if dust or the like adheres to the holding surface of the chuck table that holds the wafer, dust or the like is interposed between the holding surface of the chuck table and the wafer, and the wafer slightly rises, and the focal point of the laser beam is increased. There is a problem that it cannot be positioned at a predetermined position in the thickness direction, and the processing accuracy is lowered.
Thus, the problem that the processing accuracy is lowered due to the presence of dust or the like between the holding surface of the chuck table and the wafer occurs not only in the laser processing machine but also in processing machines such as an exposure machine and a stepper.

  The present invention has been made in view of the above-mentioned facts, and the main technical problem thereof is that dust and the like adhering to a holding surface of a chuck table that holds a workpiece such as a wafer can be reliably removed. It is providing the processing machine provided with the cleaning apparatus of the chuck table.

In order to solve the main technical problem, according to the present invention, a chuck table having a holding surface for holding a workpiece, and a processing means for performing predetermined processing on the workpiece held on the chuck table, In the processing machine equipped,
A roller support frame that is supported so as to be movable in a direction perpendicular to the holding surface of the chuck table, a first adhesive roller that is rotatably supported by the roller support frame, and the first adhesive roller A second adhesive roller disposed in contact with the roller support frame and rotatably supported by the roller support frame, and having an adhesive force greater than that of the first adhesive roller; and the roller support frame is attached to the first support roller. An action position where the adhesive roller contacts the holding surface of the chuck table, an advancing / retracting means for moving the first adhesive roller to a retracted position separated from the holding surface of the chuck table, the roller support frame, and the chuck table; A cleaning device comprising a moving means that relatively moves in parallel with the holding surface,
A processing machine having a chuck table cleaning device is provided.

The first adhesive roller and the second adhesive roller have a length equal to or greater than the diameter of the holding surface of the chuck table, and the moving means connects the roller support frame and the chuck table to the first adhesive roller and the first adhesive roller. It is moved relatively in a direction orthogonal to the axial direction of the two adhesive rollers.
The first adhesive roller and the second adhesive roller have a length longer than the radius of the holding surface of the chuck table, and one end of the first adhesive roller is positioned at the center of the holding surface of the chuck table. Is positioned beyond the outer periphery of the holding surface of the chuck table, and the moving means is configured to rotate the chuck table.
Furthermore, the cleaning device preferably includes ionized air supply means for ejecting ionized air onto the holding surface of the chuck table.

  A processing machine equipped with a chuck table cleaning device according to the present invention brings the outer peripheral surface of the first adhesive roller supported by the roller support frame into contact with the holding surface of the chuck table so that the roller support frame and the chuck table are relative to each other. The first adhesive roller supported by the roller support frame rolls on the holding surface of the chuck table, so that the dust adhering to the holding surface of the chuck table is removed from the outer periphery of the first adhesive roller. Adhere to the surface. On the other hand, since the outer peripheral surface of the second adhesive roller is in contact with the outer peripheral surface of the first adhesive roller, the second adhesive roller is rotated with the rotation of the first adhesive roller. At this time, since the adhesive force of the second adhesive roller is set to be larger than the adhesive force of the first adhesive roller, the dust adhered to the outer peripheral surface of the first adhesive roller is peeled off and the second adhesive roller is peeled off. Affixed to the outer peripheral surface of the roller. By carrying out the cleaning process in this way, dust adhering to the holding surface of the chuck table is removed. Therefore, when the semiconductor wafer to be processed next is sucked and held on the holding surface, the holding surface workpiece There is no dust between them. Therefore, it is possible to prevent a reduction in processing accuracy caused by the dust intervening between the holding surface of the chuck table and the workpiece.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, a preferred embodiment of a processing machine provided with a chuck table cleaning device configured according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of a laser processing machine as a processing machine provided with a chuck table cleaning device according to a first embodiment configured in accordance with the present invention.
The laser beam machine shown in FIG. 1 includes a device housing 2 having a substantially rectangular parallelepiped shape. In the apparatus housing 2, a chuck table 3 for holding a semiconductor wafer, which will be described later, as a workpiece is disposed so as to be movable in a machining feed direction indicated by an arrow X and an index feed direction Y orthogonal to the machining feed direction X. Has been. The chuck table 3 includes a holding surface 31 for holding a workpiece on the upper surface, and holds a semiconductor wafer, which will be described later, as a workpiece on the holding surface 31 by suction means (not shown). The chuck table 3 is configured to be rotatable by a rotation mechanism (not shown). The chuck table 3 configured as described above is provided with a clamp 32 for fixing an annular frame described later. The laser machining apparatus 1 includes a machining feed means (not shown) for feeding the chuck table 3 in the machining feed direction X and an index feed means (not shown) for indexing and feeding in the index feed direction Y.

  The illustrated laser beam machine includes a laser beam irradiation means 4 for performing laser beam processing on a semiconductor wafer, which will be described later, as a workpiece held on the chuck table 3. The laser beam application unit 4 includes a laser beam oscillation unit 41 that oscillates a laser beam, and a condenser 42 that collects the laser beam oscillated by the laser beam oscillation unit 41. The laser processing apparatus 1 includes a condensing point position adjusting unit (not shown) that moves the laser beam oscillation unit 41 in a direction indicated by an arrow Z that is perpendicular to the holding surface 31 that is the upper surface of the chuck table 3. .

  The illustrated laser processing machine images the surface of a workpiece placed on a suction chuck 32 of the chuck table 3 provided on a support 2 a provided in the apparatus housing 2, and collects the laser beam irradiation means 4. An imaging means 5 for detecting a region to be processed by a laser beam emitted from the optical device 42 is provided. The imaging unit 5 includes an infrared illumination unit that irradiates a workpiece with infrared rays, an optical system that captures infrared rays emitted by the infrared illumination unit, in addition to a normal imaging device (CCD) that captures visible light. An image sensor (infrared CCD) that outputs an electrical signal corresponding to the infrared rays captured by the optical system is used, and the captured image signal is sent to a control means to be described later. The illustrated laser beam machine includes a display unit 6 that displays an image captured by the imaging unit 5.

  Continuing the description with reference to FIG. 1, the illustrated laser beam machine includes a cassette mounting portion 8a on which a cassette for housing a semiconductor wafer as a workpiece is mounted. A cassette table 8 is disposed on the cassette mounting portion 8a so as to be movable up and down by lifting means (not shown). A cassette 9 is mounted on the cassette table 8. The wafer accommodated in the cassette 9 is composed of a semiconductor wafer 10 in the illustrated embodiment. The semiconductor wafer 10 has a plurality of devices 101 formed in a matrix on the surface 10 thereof. Each device 101 is partitioned by streets 102 formed in a lattice shape. The semiconductor wafer 10 is bonded to a protective tape 12 mounted on an annular frame 11 with the back surface of the processing wafer 10 facing upward. When processing the semiconductor wafer 10 from the back side, the front surface 10 a of the semiconductor wafer 10 is stuck to the protective tape 12. As described above, the semiconductor wafer 10 is accommodated in the cassette 9 in a state of being supported by the annular frame 11 via the protective tape 12.

  A temporary placement region 13a is set in the apparatus housing 2, and the position of the semiconductor wafer 10 in which a workpiece is temporarily placed in the temporary placement region 13a and supported on the annular frame 11 via a protective tape 12 is provided. A temporary placement table 13 for alignment is provided. A laser beam machine in the illustrated embodiment includes a semiconductor wafer 10 (hereinafter referred to as a semiconductor wafer) supported on an annular frame 11 accommodated in a cassette 9 placed on the cassette placement table 8 via a protective tape 12. The wafer 10 is carried out on the temporary table 13, the semiconductor wafer 10 carried on the temporary table 13 is conveyed on the chuck table 3, and the chuck table 3 is laser processed. A cleaning means 16 for cleaning the semiconductor wafer 10; and a cleaning transport means 17 for transporting the semiconductor wafer 10 laser-processed on the chuck table 3 disposed on the support portion 2a provided in the apparatus housing 2 to the cleaning means 16. It has.

  The laser beam machine in the illustrated embodiment includes a cleaning device 20 that cleans the holding surface 31 of the chuck table 3. The cleaning device 20 will be described with reference to FIGS. 2 to 5. The cleaning device 20 in the illustrated embodiment includes a roller support frame 21, a first adhesive roller 22 and a second adhesive roller 23 that are rotatably supported by the roller support frame 21, and the roller support frame. Advancing / retracting means 24 for supporting the roller 21 in a direction perpendicular to the holding surface 31 of the chuck table 3 and a moving means 25 for moving the roller support frame 21 parallel to the holding surface 31 of the chuck table 3 are provided. .

  As shown in FIG. 3, the roller support frame 21 includes an upper wall 211 and side walls 212 and 213 that protrude downward from both ends of the upper wall 211. The side walls 212 and 213 of the roller support frame 21 thus formed are provided with circular roller support holes 212a and 213a that are provided opposite to each other and rotatably support the first adhesive roller 22. In addition, elliptical roller support holes 212b and 213b for rotatably supporting the second adhesive roller 23 are provided. The elliptical roller support holes 212b and 213b are formed at a predetermined angle obliquely above the roller support holes 212a and 213a, respectively.

  As shown in FIG. 4, the first adhesive roller 22 includes a rotating shaft 221 and an adhesive roller portion 222 attached to the outer periphery of the rotating shaft 221. At one end (left end in FIG. 4) of the rotation shaft 221, a support shaft 223 is provided so as to protrude from the center of the shaft. On the other hand, a support shaft 224 is disposed at the other end portion (the right end portion in FIG. 4) of the rotating shaft 221 so as to be able to advance and retract in the axial direction. That is, a circular recess 221a is formed at the other end (right end in FIG. 4) of the rotating shaft 221, and a sliding flange 224a provided on the support shaft 224 is slidably disposed in the recess 221a. Has been. A snap ring 225 is attached to the right end of the recess 221a in FIG. 4 to restrict the movement of the support shaft 224 to the right in FIG. 4, and between the bottom surface of the recess 221a and the sliding flange 224a. A compression coil spring 226 is disposed and the support shaft 224 is biased to move rightward in FIG. The adhesive roller portion 222 constituting the first adhesive roller 22 is made of synthetic rubber having adhesive force, and dust or the like is adhered to the outer peripheral surface thereof. In the illustrated embodiment, the adhesive roller portion 222 has a length L1 that is equal to or larger than the diameter of the holding surface 31 of the chuck table 3. The adhesive roller portion 222 is adapted to recover the adhesive force by washing and removing dust adhering to the outer peripheral surface. As such an adhesive roller, for example, Carboless MIMOSA (registered trademark) ULT manufactured and sold by Kakuda Brush Co., Ltd. can be used.

  The second adhesive roller 23 has the same configuration as the first adhesive roller 22, and as shown in FIG. 5, a rotating shaft 231 and an adhesive roller portion 232 mounted on the outer periphery of the rotating shaft 231. It is made up of. A support shaft 233 is provided at one end (left end in FIG. 5) of the rotation shaft 231 so as to protrude from the center of the shaft. On the other hand, a support shaft 234 is disposed at the other end of the rotating shaft 231 (the right end in FIG. 5) so as to be able to advance and retract in the axial direction. That is, a circular recess 231a is formed at the other end (right end in FIG. 5) of the rotating shaft 231, and a sliding flange 234a provided on the support shaft 234 is slidably disposed in the recess 231a. Has been. A snap ring 235 is attached to the right end of the recess 231a in FIG. 5 to restrict the movement of the support shaft 234 to the right in FIG. 5, and between the bottom surface of the recess 231a and the sliding flange 234a. A compression coil spring 236 is disposed and the support shaft 234 is biased to move rightward in FIG. The adhesive roller portion 232 constituting the second adhesive roller 23 is made of synthetic rubber having an adhesive force larger than the adhesive force of the adhesive roller portion 222 of the first adhesive roller 22, and the first outer peripheral surface has a first It is possible to peel off and adhere dust or the like adhering to the adhesive roller portion 222 of the adhesive roller 22. The adhesive roller portion 232 has the same length as the adhesive roller portion 222 of the first adhesive roller 22 in the illustrated embodiment. The adhesive roller portion 232 also recovers the adhesive force by cleaning and removing dust adhering to the outer peripheral surface. As such an adhesive roller, for example, Carboless MIMOSA (registered trademark) ST manufactured and sold by Kakuda Brush Co., Ltd. can be used.

  As shown in FIG. 2, the first adhesive roller 22 configured as described above first inserts the support shaft 223 into the circular roller support hole 212 a provided in the side wall 212 of the roller support frame 21, and then By inserting the support shaft 224 into a circular roller support hole 213 a provided in the side wall 213 of the roller support frame body 21, the support shaft 224 is rotatably supported by the roller support frame body 21. When the support shaft 224 is inserted into the circular roller support hole 213a provided on the side wall 213 of the roller support frame 21, the support shaft 224 is pushed against the spring force of the compression coil spring 226, and the tip thereof Can be easily inserted into the circular roller support hole 213a by moving to the inside of the side wall 213.

  As shown in FIG. 2, the second adhesive roller 23 first inserts the support shaft 233 into an elliptical roller support hole 212 b provided in the side wall 212 of the roller support frame 21, and then supports the shaft 234. Is inserted into an elliptical roller support hole 213b provided in the side wall 213 of the roller support frame 21, so that the roller support frame 21 is rotatably supported. When the support shaft 234 is inserted into the elliptical roller support hole 213b provided on the side wall 213 of the roller support frame 21, the support shaft 234 is pushed against the spring force of the compression coil spring 236, By moving the tip to the inside of the side wall 213, it can be easily inserted into the elliptical roller support hole 213b. The second adhesive roller 23 rotatably supported by the roller support frame 21 in this manner is inserted into elliptical roller support holes 212b and 213b in which support shafts 233 and 234 are formed at an oblique predetermined angle. Therefore, it descends along the elliptical roller support holes 212 b and 213 b by its own weight, and the outer peripheral surface of the adhesive roller portion 232 contacts the outer peripheral surface of the adhesive roller portion 222 constituting the first adhesive roller 22.

  Continuing the description with reference to FIG. 2, the advancing / retracting means 24 that supports the roller support frame 21 so as to be movable in a direction perpendicular to the holding surface 31 of the chuck table 3 includes a support arm 241 in the illustrated embodiment. The air cylinder 242 is attached to one end of the support arm 241, and the piston rod 242 a of the air cylinder 242 is attached to the upper wall 211 of the roller support frame 21. The advancing / retreating means 24 configured in this way includes an operating position where the adhesive roller portion 222 constituting the first adhesive roller 22 contacts the holding surface 31 of the chuck table 3 and the first adhesive roller 22. Is moved to a retracted position separated from the holding surface 31 of the chuck table 3. The roller support frame 21 supported by the advance / retreat means 24 is moved in parallel with the holding surface 31 of the chuck table 3 by the moving means 25.

  In the illustrated embodiment, the moving means 25 includes a guide rail 26 that movably supports the support arm 241 and an operating means 27 that moves the support arm 241 along the guide rail 26. The guide rail 26 includes a guide portion 261 formed in a channel shape, and is disposed on a support portion 2a provided in the apparatus housing 2 in parallel with the holding surface 31 of the chuck table 3 as shown in FIG. The The guide rail 26 is arranged so that the guide portion 261 extends along an indexing feed direction Y orthogonal to the machining feed direction X. A guided portion 241a provided at the other end of the support arm 241 is movably engaged with the guide portion 261 of the guide rail 26 thus configured. Therefore,

  In the illustrated embodiment, the operating means 27 for moving the support arm 241 along the guide rail 26 is mounted on the electric motor 271 that can rotate forward and reverse as a driving source and on the drive shaft 271a of the electric motor 271. The driving pulley 272 includes a driving pulley 273 disposed at a predetermined interval from the driving pulley 272, and a driving wire 274 wound around the driving pulley 272 and the driven pulley 273. Both ends of the 274 are connected to the guided portion 241 a of the support arm 241. The electric motor 271 of the actuating means 27 configured as described above is mounted on a support portion 2a provided on the apparatus housing 2 on one side of the guide rail 26, and the driven pulley 273 is mounted on the guide rail 26. On the other side, it is rotatably supported by a support shaft 275 attached to a support portion 2 a provided in the apparatus housing 2. When the electric motor 271 is driven to rotate forward, the actuating means 27 configured in this way moves the guided portion 241a of the support arm 241 that is rolled around the drive wire 274 along the guide rail 26 in the direction indicated by the arrow Y1 in FIG. When the electric motor 271 is driven in the reverse direction, the guided portion 241a of the support arm 241 that is rolled around the drive wire 274 moves along the guide rail 26 in the direction indicated by the arrow Y2 in FIG. .

The laser beam machine in the illustrated embodiment is configured as described above, and the operation thereof will be described below.
As shown in FIG. 1, a semiconductor wafer 10 (hereinafter, referred to as a semiconductor wafer 10) supported on an annular frame 11 via a protective tape 12 is accommodated in a predetermined position of a cassette 9. The semiconductor wafer 10 accommodated in a predetermined position of the cassette 9 is positioned at the unloading position when the cassette table 8 is moved up and down by a lifting means (not shown). Next, the wafer carry-out / carry-in means 14 moves forward and backward, and the semiconductor wafer 10 positioned at the carry-out position is carried out to the alignment means 13 disposed in the temporary placement portion 13a. The semiconductor wafer 10 carried out to the alignment means 13 is aligned at a predetermined position by the alignment means 13. Next, the semiconductor wafer 10 aligned by the alignment means 13 is conveyed onto the holding surface 31 of the chuck table 3 by the conveying means 15 and sucked and held on the holding surface 31. The chuck table 3 that sucks and holds the semiconductor wafer 10 in this way is positioned directly below the imaging means 5 by a processing feed means (not shown).

  When the chuck table 3 is positioned immediately below the image pickup means 5, a division line 101 formed in a predetermined direction on the semiconductor wafer 10 by the image pickup means 5 and a control means (not shown), and a laser beam is emitted along the division line 101. Image processing such as pattern matching for performing alignment with the condenser 42 of the laser beam irradiation means 4 is performed, and alignment of the laser beam irradiation position is performed. Similarly, the alignment of the laser beam irradiation position is also performed on the division line 101 formed on the semiconductor wafer 10 and extending at right angles to the predetermined direction.

  As described above, when the planned division line 101 formed on the semiconductor wafer 10 held on the chuck table 3 is detected and the laser beam irradiation position is aligned, the light is irradiated from the condenser 42. The condensing point of the laser beam is aligned with a predetermined position in the thickness direction of the semiconductor wafer 10 and the laser beam is irradiated along the planned division line 101 to form a laser processing groove along the planned division line 101 or to be divided inside. Laser processing such as forming a deteriorated layer along the line 101 is performed. If such laser processing is carried out along all the division lines 101 of the semiconductor wafer 10, the chuck table 3 holding the semiconductor wafer 10 is first moved to the semiconductor wafer 10 by the operation of a processing feed means (not shown). 1 is returned to the workpiece attaching / detaching position shown in FIG. 1, where the suction holding of the semiconductor wafer 10 is released. Then, the semiconductor wafer 10 is transported to the cleaning unit 16 by the cleaning transport unit 17. The semiconductor wafer 10 conveyed to the cleaning means 16 is cleaned and dried here. The semiconductor wafer 10 that has been cleaned and dried by the cleaning means 16 is carried out by the transport means 15 to the alignment means 13 disposed in the temporary placement portion 13a. The semiconductor wafer 10 carried out to the alignment means 13 is stored in a predetermined position of the cassette 9 by the wafer carry-out / carry-in means 14.

  As described above, after laser processing is performed on the semiconductor wafer 10 while being held on the chuck table 3, when the semiconductor wafer 10 is transported to the cleaning means 16, it is scattered and floated on the holding surface 31 of the chuck table 3 during laser processing. The attached dust adheres to the holding surface 31. If dust adheres to the holding surface 31, dust or the like is interposed between the holding surface 31 and the semiconductor wafer 10 when the semiconductor wafer 10 to be processed next is sucked and held on the holding surface 31, so that the semiconductor wafer 10 is slightly There is a problem that the laser beam is focused and the focusing point of the laser beam cannot be positioned at a predetermined position in the thickness direction of the wafer, and the processing accuracy is lowered. Therefore, it is desirable to remove dust adhering to the holding surface 31 before the semiconductor wafer 10 to be processed next is conveyed to the chuck table 3.

Therefore, in the laser beam machine in the illustrated embodiment, the cleaning device 20 is operated to clean the holding surface 31 of the chuck table 3. The cleaning operation of the holding surface 31 will be described with reference to FIGS. 1, 2, and 6.
The cleaning operation of the holding surface 31 of the chuck table 3 is performed in a state where the chuck table 3 is positioned at the workpiece attaching / detaching position shown in FIG. First, the air cylinder 242 constituting the advancing / retreating means 24 of the cleaning device 20 is operated, and the roller support frame 21 positioned at the retracted position indicated by the two-dot chain line in FIG. ), The outer peripheral surface of the adhesive roller portion 222 constituting the first adhesive roller 22 is brought into contact with the left end portion of the outer peripheral portion of the holding surface 31 of the chuck table 3. Next, the first adhesive roller 22 and the second adhesive roller 23 disposed on the roller support frame 21 are shown in FIG. 6A by driving the electric motor 271 of the moving means 25 in the normal direction. Move in the direction indicated by Y1. As a result, the first adhesive roller 22 in which the outer peripheral surface of the adhesive roller portion 222 is in contact with the holding surface 31 of the chuck table 3 rolls the holding surface 31 and adheres dust adhering to the holding surface 31. Therefore, the holding surface 31 is cleaned (cleaning process).

  On the other hand, since the outer peripheral surface of the adhesive roller portion 232 is in contact with the outer peripheral surface of the adhesive roller portion 222 constituting the first adhesive roller 22, the second adhesive roller 23 is rotated by the rotation of the first adhesive roller 22. It can be rotated together. At this time, the adhesive force of the adhesive roller portion 232 constituting the second adhesive roller 23 is set to be larger than the adhesive force of the adhesive roller portion 222 constituting the first adhesive roller 22, and therefore the first adhesive roller 22. The dust adhered to the outer peripheral surface of the adhesive roller portion 222 that constitutes the second adhesive roller 23 is peeled off and adhered to the outer peripheral surface of the adhesive roller portion 232 that constitutes the second adhesive roller 23. As a result, the outer peripheral surface of the adhesive roller portion 222 constituting the first adhesive roller 22 is cleaned, and the first adhesive roller 22 in which the outer peripheral surface of the adhesive roller portion 222 is in contact with the holding surface 31 of the chuck table 3 is used. Cleaning of the holding surface 31 can be reliably continued.

  When the cleaning process described above is performed and the outer peripheral surface of the adhesive roller portion 222 constituting the first adhesive roller 22 reaches the right end portion of the outer peripheral portion of the holding surface 31 of the chuck table 3, the electric motor 271 of the moving means 25 While stopping the driving, the air cylinder 242 constituting the advance / retreat means 24 is operated, and the roller support frame 21 is raised in the direction indicated by Z1 and positioned at the retracted position as shown in FIG. 6 (b). Then, by rotating the electric motor 271 of the moving means 25 in the reverse direction, the first adhesive roller 22 and the second adhesive roller 23 disposed on the roller support frame 21 are moved along the arrow Y2 in FIG. Move in the direction shown and return to the cleaning process start position.

  Since the dust adhering to the holding surface 31 of the chuck table 3 is removed by carrying out the cleaning process as described above, the semiconductor wafer 10 to be processed next is held when sucked and held on the holding surface 31. There is no dust or the like between the surface 31 and the semiconductor wafer 10. Therefore, it is possible to prevent a reduction in processing accuracy caused by the presence of dust between the holding surface 31 of the chuck table 3 and the semiconductor wafer 10.

  In addition, if the said cleaning process is implemented in multiple times, the adhesive force of the outer peripheral surface of the adhesive roller part 222 which comprises the 1st adhesive roller 22, and the outer peripheral surface of the adhesive roller part 232 which comprises the 2nd adhesive roller 23 will fall. Come. Therefore, for example, when the work for one day is completed, the first adhesive roller 22 and the second adhesive roller 23 are removed from the roller support frame 21 to remove the dust adhering to the outer peripheral surface. It is desirable to restore power.

Next, a second embodiment of the cleaning device according to the present invention will be described with reference to FIG. The roller support frame 21, the first adhesive roller 22, and the second adhesive roller 23 in the cleaning device shown in FIG. 7 may be the same as those in the embodiment shown in FIGS.
In the cleaning device shown in FIG. 7, the first adhesive roller 22 and the second adhesive roller 23 supported by the roller support frame 21 are arranged in a direction in which the axial direction is orthogonal to the processing feed direction X. Then, the advancing / retreating means 24 is actuated to lower the roller support frame 21 to the working position, and the outer peripheral surface of the adhesive roller portion 222 constituting the first adhesive roller 22 as shown in FIG. 3 is brought into contact with the left end portion of the outer peripheral portion of the holding surface 31. Next, the machining feed means (not shown) is operated to move the chuck table 3 in the direction indicated by X1 as shown in FIG. As a result, the first adhesive roller 22 in which the outer peripheral surface of the adhesive roller portion 222 is in contact with the holding surface 31 of the chuck table 3 rolls and holds the holding surface 31 as in the embodiment shown in FIGS. The dust adhering to the surface 31 is stuck. Therefore, the holding surface 31 is cleaned (cleaning process).

  On the other hand, since the outer peripheral surface of the adhesive roller portion 232 is in contact with the outer peripheral surface of the adhesive roller portion 222 constituting the first adhesive roller 22, the second adhesive roller 23 is rotated by the rotation of the first adhesive roller 22. It can be rotated together. At this time, the adhesive force of the adhesive roller portion 232 constituting the second adhesive roller 23 is set to be larger than the adhesive force of the adhesive roller portion 222 constituting the first adhesive roller 22, so that FIG. 1 to FIG. In the same manner as in the embodiment shown in FIG. 1, the dust adhered to the outer peripheral surface of the adhesive roller portion 222 constituting the first adhesive roller 22 is peeled off to the outer peripheral surface of the adhesive roller portion 232 constituting the second adhesive roller 23. Affixed. As a result, the outer peripheral surface of the adhesive roller portion 222 constituting the first adhesive roller 22 is cleaned, and the first adhesive roller 22 in which the outer peripheral surface of the adhesive roller portion 222 is in contact with the holding surface 31 of the chuck table 3 is used. Cleaning of the holding surface 31 can be reliably continued.

  When the above-described cleaning process is performed and the right end portion of the outer peripheral portion of the holding surface 31 of the chuck table 3 reaches the first adhesive roller 22, the operation of the processing feed means (not shown) is stopped and the advance / retreat means 24 is operated. As shown in FIG. 7B, the roller support frame 21 is raised in the direction indicated by Z1 and positioned at the retracted position. Then, the machining feed means (not shown) is operated to move the chuck table 3 in the direction indicated by the arrow X2 in FIG. 7B and return to the cleaning process start position. Therefore, in the cleaning device in the embodiment shown in FIG. 7, the machining feed means (not shown) that moves the chuck table 3 in the machining feed direction indicated by the arrow X makes the roller support frame 21 and the chuck table 3 parallel to the holding surface 31. It functions as a moving means that moves.

Next, a third embodiment of the cleaning device according to the present invention will be described with reference to FIG.
In the cleaning device shown in FIG. 8, the length L2 of the first adhesive roller 22 and the second adhesive roller 23 supported by the roller support frame 21 is longer than the radius D1 of the chuck table 3 and shorter than the diameter D2. Is formed. Then, the advancing / retreating means 24 is actuated to lower the roller support frame 21 to the operating position, and the outer periphery of the adhesive roller portion 222 constituting the first adhesive roller 22 as shown in FIGS. 8 (a) and 8 (b). The surface is brought into contact with the holding surface 31 of the chuck table 3. At this time, one end of the first adhesive roller 22 is positioned at the center of the chuck table 3 and the other end is positioned beyond the outer periphery of the holding surface 31 of the chuck table 3. Next, a rotation mechanism (not shown) is operated to rotate the chuck table 3 once in the direction indicated by the arrow 3a as shown in FIGS. 8 (a) and 8 (b). As a result, the first adhesive roller 22 in which the outer peripheral surface of the adhesive roller portion 222 is in contact with the holding surface 31 of the chuck table 3 is rolled on the holding surface 31 and adheres to the holding surface 31 as in the above embodiments. Adhere dust. Therefore, the holding surface 31 is cleaned (cleaning process).

  On the other hand, since the outer peripheral surface of the adhesive roller portion 232 is in contact with the outer peripheral surface of the adhesive roller portion 222 constituting the first adhesive roller 22, the second adhesive roller 23 is rotated by the rotation of the first adhesive roller 22. It can be rotated together. At this time, the adhesive force of the adhesive roller portion 232 constituting the second adhesive roller 23 is set to be larger than the adhesive force of the adhesive roller portion 222 constituting the first adhesive roller 22, so that it is the same as in the above embodiments. The dust adhered to the outer peripheral surface of the adhesive roller portion 222 constituting the first adhesive roller 22 is peeled off and adhered to the outer peripheral surface of the adhesive roller portion 232 constituting the second adhesive roller 23. As a result, the outer peripheral surface of the adhesive roller portion 222 constituting the first adhesive roller 22 is cleaned.

Next, a fourth embodiment of the cleaning device according to the present invention will be described with reference to FIG.
The cleaning device shown in FIG. 9 is obtained by arranging ionized air ejection means 28 for ejecting ionized air on the holding surface 31 of the chuck table 3 in the cleaning device 20 in the embodiment shown in FIGS. 1 to 6. The ionized air ejection means 28 includes an ionized air ejection nozzle 281 disposed on the roller support frame 21 along the axial direction of the first adhesive roller 22 and the second adhesive roller 23 and having an outlet 281a facing downward. The ionized air ejection nozzle 281 and ionized air supply means 283 connected by a pipe 282 are included. The cleaning device configured as described above operates the ionized air supply means 283 in the above-described cleaning process, thereby introducing ionized air to the ionized air ejection nozzle 281 via the pipe 282, and the ionized air ejection nozzle 281. The ionized air is ejected to the holding surface 31 of the chuck table 3 from the ejection port 281a provided in the chamber. As a result, the static electricity of the dust adhering to the holding surface of the chuck table 3 is removed, so that the dust adhering to the holding surface of the chuck table 3 in the cleaning step is adhered to the first adhering roller 22. The roller portion 222 can be reliably adhered to the outer peripheral surface.

The perspective view of the laser processing machine comprised according to this invention. The perspective view of the cleaning apparatus of the chuck table in 1st Embodiment with which the laser beam machine shown in FIG. 1 is equipped. The perspective view of the roller support frame which comprises the cleaning apparatus of the chuck table shown in FIG. Sectional drawing of the 1st adhesion roller which comprises the cleaning apparatus of the chuck table shown in FIG. Sectional drawing of the 2nd adhesion roller which comprises the cleaning apparatus of the chuck table shown in FIG. Explanatory drawing of the cleaning process implemented by the cleaning apparatus of the chuck table shown in FIG. Explanatory drawing of the cleaning process implemented by 2nd Embodiment of the cleaning apparatus of the chuck table by this invention. Explanatory drawing of the cleaning process implemented by 3rd Embodiment of the cleaning apparatus of the chuck table by this invention. The perspective view which shows 4th Embodiment of the cleaning apparatus of the chuck table by this invention.

Explanation of symbols

2: Device housing 3: Chuck table 4: Laser beam irradiation means 41: Laser beam oscillation means 42: Condenser 5: Imaging mechanism 6: Display means 9: Cassette 10: Semiconductor wafer 11: Ring frame 12: Protection tape 13: Position Matching means 14: Wafer unloading / carrying means 15: Conveying means 16: Cleaning means 17: Cleaning and conveying means 20: Cleaning device 21: Roller support frame 22: First adhesive roller 23: Second adhesive roller 24: Advance / Retreat means 241: Support arm 242: Air cylinder 25: Moving means 26: Guide rail 27: Actuating means 271: Electric motor 272: Drive pulley 273: Driven pulley 274: Drive wire 28: Ionized air ejection means 281: Ionized air ejection nozzle 283 : Ionized air supply means

Claims (4)

In a processing machine comprising: a chuck table having a holding surface for holding a workpiece; and processing means for performing predetermined processing on the workpiece held on the chuck table.
A roller support frame that is supported so as to be movable in a direction perpendicular to the holding surface of the chuck table, a first adhesive roller that is rotatably supported by the roller support frame, and the first adhesive roller A second adhesive roller disposed in contact with the roller support frame and rotatably supported by the roller support frame, and having an adhesive force greater than that of the first adhesive roller; and the roller support frame is attached to the first support roller. An action position where the adhesive roller contacts the holding surface of the chuck table, an advancing / retracting means for moving the first adhesive roller to a retracted position separated from the holding surface of the chuck table, the roller support frame, and the chuck table; A cleaning device comprising a moving means that relatively moves in parallel with the holding surface,
A processing machine equipped with a chuck table cleaning device.   The first adhesive roller and the second adhesive roller have a length equal to or larger than the diameter of the holding surface of the chuck table, and the moving means moves the roller support frame and the chuck table to the first table. The processing machine provided with the chuck table cleaning device according to claim 1, wherein the chuck table is relatively moved in a direction orthogonal to the axial direction of the adhesive roller and the second adhesive roller.   The first adhesive roller and the second adhesive roller have a length longer than the radius of the holding surface of the chuck table, and one end of the first adhesive roller is positioned at the center of the holding surface of the chuck table. The chuck table cleaning device according to claim 1, wherein the end is configured to be positioned beyond the outer periphery of the holding surface of the chuck table, and the moving means is configured to rotate the chuck table. Processing machine equipped.   4. The processing machine provided with the chuck table cleaning device according to claim 1, wherein the cleaning device includes ionized air supply means for ejecting ionized air onto a holding surface of the chuck table.

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