JP2008147567A - Solar-battery module and method of manufacturing solar-battery module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solar-battery module for reducing deterioration in module output and improving reliability. <P>SOLUTION: In the solar-battery module, two or more solar cells are provided between a surface protection material and a backside protective material, and each bus bar electrode 20 of the solar cell is interconnected electrically with a tab 40 in constitution. The tab 40 has protrusions on the front face on the side of the bus bar electrode 20. The protrusion of the tab 40 is touched with the bus bar electrode 20, and the tab 40 and the and bus bar electrode 20 are bonded with resin 60. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention provides a solar cell module and a solar cell in which a plurality of solar cells are disposed between a front surface protective material and a back surface protective material, and the connection electrodes of the solar cells are electrically connected to each other by tabs. The present invention relates to a method for manufacturing a battery module.

  Conventionally, in the HIT solar cell module, as shown in FIG. 13, the bus bar electrodes 20 of a plurality of solar cells are electrically connected to each other by a tab 40 made of a conductive material such as copper foil, and the glass, translucent plastic is used. And a back surface protective material made of a film such as PET (Poly Ethylene Terephthalate) and the like, and sealed with a light-transmitting sealing material such as EVA.

  The solar battery cell is produced by forming the bus bar electrode 20 and the finger electrode 30 on the surface of the photoelectric conversion unit 10 with a conductive paste. And it is common to connect the photovoltaic cell in series by adhere | attaching the tab 40 on the bus-bar electrode 20 with solder (for example, refer patent document 1).

  The manner of soldering will be described with reference to FIG. 14 is a cross-sectional view taken along line AA in FIG.

The tab 40 is made of a metal material such as copper foil, and the periphery thereof is coated with a solder plating 90 in advance. When soldering the tab 40 to the bus bar electrode 20 made of silver paste, a flux is applied to the surface of the bus bar electrode 20 or the solar cell side surface of the tab 40, and the tab 40 is disposed on the surface of the bus bar electrode 20 and heated. . At this time, while removing the oxide layer on the surface of the bus bar electrode 20, soldering is performed by the alloy layer 50 in which the solder portion of the tab 40 and the silver paste are alloyed to fix the tab 40 to the bus bar electrode 20.
JP 2005-217184 A

 However, according to the prior art, since the bus bar electrode 20 and the tab 40 are electrically connected via the alloy layer 50, there is a problem that the series resistance increases and the output decreases.

 In recent years, in order to reduce the cost, it has been studied to reduce the thickness of a Si wafer that is generally used as a base material for solar cells. However, if the thickness of the Si wafer is reduced, the wafer is likely to warp due to the influence of the temperature when soldering the tab, and the tab is easily peeled off, so that there is a problem that the output is reduced.

 These problems are not limited to HIT solar cell modules, but also exist for solar cell modules using ordinary crystalline solar cells in which pn junctions are formed by thermal diffusion using single crystal Si or polycrystalline Si wafers. It was.

 In addition, it is known that the surface of the tab on the bus bar electrode side surface is provided with a concavo-convex shape to improve the efficiency of the solar cell module. It was.

 Then, in view of said problem, this invention aims at providing the manufacturing method of the solar cell module which suppresses the fall of a module output and improves reliability, and a solar cell module.

  A first feature of the present invention is that a plurality of solar cells are disposed between a front surface protective material and a back surface protective material, and the connection electrodes of the solar cells are electrically connected to each other by a tab. In the solar cell module, the tab has a convex portion on the surface on the side of the connecting electrode, the convex portion of the tab is in contact with the connecting electrode, and the tab and the connecting electrode are bonded with resin. The gist is that it is a battery module.

  According to the solar cell module according to the first feature, since the bonding is performed using the resin, it is not necessary to perform the treatment at a high temperature. Therefore, even when the thickness of the Si wafer is reduced, the warpage of the wafer due to the thermal effect at the time of tab attachment can be reduced, and a decrease in output due to the warpage of the wafer is suppressed. Further, a convex portion is provided on the surface of the tab on the connection electrode side, and the convex portion is in contact with the connection electrode, whereby electrical connection between the tab and the connection electrode is performed. For this reason, the fall of the output accompanying presence of the conventional alloy layer can be suppressed, and reliability can be improved.

  In the solar cell module according to the first feature, the curing temperature of the resin is preferably equal to or lower than the bonding temperature of the solder.

  According to this solar cell module, since it can process at low temperature rather than a soldering process, the output fall of a module can further be suppressed.

  In the solar cell module according to the first feature, it is preferable that the convex portion of the tab is made of a material softer than the connection electrode.

  According to this solar cell module, when the tab and the connection electrode are pressure-bonded, the unevenness of the tab surface is deformed along the connection electrode, and a sufficient contact pressure and contact area can be obtained.

  In the solar cell module according to the first feature, the resin preferably contains fine particles.

  According to this solar cell module, internal stress can be relaxed in the resin region disposed on the side wall of the connection electrode.

  In the above solar cell module, the size of the fine particles is preferably smaller than the height of the convex portion of the tab.

  According to this solar cell module, it is possible to contribute to relaxation of internal stress without hindering adhesion between the tab and the connection electrode.

  The second feature of the present invention is that a plurality of solar cells are disposed between the front surface protective material and the back surface protective material, and the connection electrodes of the solar cells are electrically connected to each other by a tab. A method for manufacturing a solar cell module, the step of forming a connection electrode on the surface of a plurality of photoelectric conversion units, the step of applying a resin on the surface on which the connection electrode is formed, and on the resin And a method for manufacturing a solar cell module including a step of arranging a tab with a surface having a convex portion, and a step of applying pressure and heating so that the convex portion of the tab is in contact with the connection electrode. .

  According to the manufacturing method of the solar cell module according to the second feature, since it is bonded using a resin, it is not necessary to process at a high temperature, and the tab has a convex portion, so that the tab and the connecting resin are not connected. The resistance can be reduced. For this reason, the fall of a module output can be suppressed and reliability can be improved.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the solar cell module which suppresses the fall of a module output and improves reliability and a solar cell module can be provided.

  Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic and ratios of dimensions and the like are different from actual ones. Accordingly, specific dimensions and the like should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

(Solar cell module)
As a solar cell according to the present embodiment, a solar cell having a HIT structure will be described as an example, and the following will be described. FIG. 1 is a cross-sectional view of a solar battery cell according to the present embodiment, and FIG. 2 is a top view.

  As shown in FIG. 1, the solar cell according to this embodiment includes a p-type amorphous silicon layer 10b on an upper surface side of an n-type single crystal silicon substrate 10d via an i-type amorphous silicon layer 10c. In addition, an ITO film 10a is formed on the upper surface thereof. On the other hand, an n-type amorphous silicon layer 10f is formed on the lower surface side of the n-type single crystal silicon substrate 10d via an i-type amorphous silicon layer 10e, and an ITO film 10g is further formed on the upper surface. . ITO film 10a, p-type amorphous silicon layer 10b, i-type amorphous silicon layer 10c, n-type single crystal silicon substrate 10d, i-type amorphous silicon layer 10e, n-type amorphous silicon layer 10f, ITO film The photoelectric conversion unit 10 is configured by 10 g. On the ITO films 10a and 10g, as shown in FIGS. 1 and 2, a collector electrode including a bus bar electrode 20 and finger electrodes 30 is formed. The collector electrode is formed from a thermosetting conductive paste using an epoxy resin as a binder and silver particles as a filler.

  In the solar cell module according to the present embodiment, the bus bar electrodes 20 (connection electrodes) of a plurality of solar cells are electrically connected to each other by tabs, and have translucency such as glass and translucent plastic. Between the surface protective material and a back surface protective material made of a film such as PET (Poly Ethylene Terephthalate), sealing is performed with a light-transmitting sealing material such as EVA. For the tab, for example, a tin-plated copper foil is used.

  Next, in the solar cell module according to the present embodiment, the adhesion between the bus bar electrode and the tab will be described in detail.

  As shown in FIG. 3A, the tab 40 has a convex portion on the surface on the bus bar electrode 20 side, and the convex portion of the tab 40 is in contact with the bus bar electrode 20. Further, the tab 40 and the bus bar electrode 20 are bonded by a resin 60.

  The resin 60 interposed between the tab 40 and the bus bar electrode 20 may be a material having higher flexibility than the material used for the tab 40 for the purpose of alleviating stress due to expansion and contraction due to the temperature cycle of the tab 40. preferable. In view of the fact that the tab 40 is also bonded at the same time, it is preferable to use a thermosetting resin material. In addition, in order to maintain reliability, it is required to have excellent moisture resistance and heat resistance, and examples thereof include epoxy resins, acrylic resins, polyimide resins, phenol resins, urethane resins, and silicone resins. It is preferable to use at least one selected from the above, or a mixture or copolymerization of these resins. Furthermore, considering the adhesive compatibility with the bus bar electrode 20, it is more preferable to select the same type of resin as the resin material used for the bus bar electrode 20. In view of being able to be cured at a low temperature and in a short time, it is more preferable in production to use an epoxy resin or an acrylic resin. The curing temperature of the resin 60 is preferably not higher than the bonding temperature of solder. For example, the curing temperature of the resin 60 is preferably 200 ° C. or lower.

  Further, the resin 60 may contain fine particles. In the resin region disposed on the side wall of the bus bar electrode 20, since the residual internal stress exists due to shrinkage when the resin is cured, the internal stress is likely to cause separation of the interface between the tab 40 and the resin 60. A relaxed configuration is preferred. By containing the fine particles in the resin, the molecular bond between the resins is broken, so that the shrinkage due to the curing of the resin can be reduced and the residual stress can be reduced. Further, the fine particles may be conductive particles in order to further increase electrical conductivity. When conductive particles are used as the fine particles, at least one metal particle selected from silver, copper, nickel, gold, tin, aluminum, or the like, or an alloy or a mixture thereof can be applied. In addition, it may be one in which at least one inorganic oxide selected from alumina, silica, titanium oxide, glass, etc. is coated with a metal, epoxy resin, acrylic resin, polyimide resin, phenol resin, urethane resin, silicone At least one selected from resins or the like, or a mixture or copolymer of these resins may be provided with a metal coating. Insulating particles may be used as the fine particles.

  Further, the conductive particles can be devised to increase electrical conductivity by mixing flakes and spheres or mixing different sizes. Furthermore, these resins may be in the form of a film and can be welded by heating.

  Further, the convex portion of the tab 40 is preferably made of a material softer than the bus bar electrode 20. With this configuration, when the tab 40 is bonded to the bus bar electrode 20, as shown in FIG. 3B, the convex portion of the tab 40 is crushed and the contact area between the tab 40 and the bus bar electrode 20 is widened. . When the bus bar electrode 20 is formed of a thermosetting conductive paste using an epoxy resin as a binder and silver particles as a filler, the softer materials include Sn, Au, Cu, Zn, Pb, Mg, or those An alloy containing

  The height of the convex portion of the tab 40 is preferably larger than the surface roughness of the bus bar electrode 20. Here, the height of the convex portion refers to the distance in the vertical direction from the concave and convex valleys to the peak. The size of the conductive particles is preferably smaller than the height of the convex portion of the tab 40.

  In addition to the shape shown in FIG. 4A, the concavo-convex shape of the cross-sectional shape may be a shape in which the concave portion is rounded as shown in FIG. 4B or a convex shape as shown in FIG. The shape in which the part is rounded, or the shape in which the concave part and the convex part are rounded as shown in FIG. Furthermore, the shape which compounded these shapes may be sufficient. Moreover, the shape which provided the partial protrusion on the flat surface may be sufficient.

(Method for manufacturing solar cell module)
Next, the manufacturing method of the solar cell module according to this embodiment will be described.

  First, a finger electrode and a bus bar electrode are formed on the photoelectric conversion portion with an epoxy thermosetting silver paste. Specifically, a silver paste is printed by screen printing on the light-receiving surface side of the photoelectric conversion unit, and is temporarily cured by heating at 150 ° C. for 5 minutes. Then, a silver paste is printed by screen printing on the back surface side of the photoelectric conversion part, and the silver paste is completely cured by heating the solar battery cell at 200 ° C. for 1 hour.

  Next, using a dispenser, an epoxy resin containing about 5% by volume of nickel particles is applied on the bus bar electrode so as to have a thickness of about 30 μm, and is applied so as to cover the outside of the bus bar electrode by about 100 μm.

  Next, a copper foil (tab) plated with tin having a convex portion on the surface is prepared. The convex portion may be formed by any method, but can be formed, for example, by pressing a mold having a concavo-convex structure against the surface of tin plating.

  Next, after applying the above-described epoxy resin on both the light-receiving surface side and the back surface side of the plurality of solar cells, the tabs are arranged on the applied resin, with the surfaces having convex portions facing each other, While pressing at about 2 MPa, heat at 200 ° C. for 1 hour. At this time, pressure is applied until the convex portion of the tab comes into contact with the bus bar electrode.

  Next, tabs of adjacent solar cells are connected, glass, a sealing sheet, solar cells to which the tabs are connected, a sealing sheet, and a back sheet are laminated in this order, and thermocompression bonding is performed at 150 ° C. for 10 minutes in a vacuum state. To do. Then, it is completely cured by heating at 150 ° C. for 1 hour.

  Next, a solar cell module can be manufactured by attaching a terminal box and a metal frame.

  In addition, here, the epoxy resin paste was applied onto the bus bar electrode by a dispenser, and a tab was disposed thereon, but a resin film containing metal particles was disposed on the bus bar electrode, and the tab was disposed thereon. Also good.

  In addition, the solar cell module which concerns on this invention is not limited to the solar cell module using the photovoltaic cell which has a HIT structure. For example, the present invention can be applied to a solar cell module using a solar cell using a p-type polycrystalline Si substrate and having a pn junction formed by thermal diffusion.

  Hereinafter, the solar cell module according to the present invention will be specifically described with reference to examples. However, the present invention is not limited to those shown in the following examples, and the gist thereof is not changed. It can be implemented with appropriate modifications.

= Experiment 1 =
(Example 1)
As a solar cell according to Example 1 of the present invention, the solar cell shown in FIGS. 1 to 3 was produced as follows. In the following manufacturing method, a process is divided into steps 1 to 4 and described.

<Step 1> Photoelectric Conversion Part Formation First, as shown in FIG. 1, an n-type single crystal silicon substrate 10d having a resistivity of about 1 Ω · cm from which impurities have been removed and a thickness of about 300 μm is removed by cleaning. Got ready. Next, an RF plasma CVD method is used to form an i-type amorphous silicon layer 10c having a thickness of about 5 nm and a p-type amorphous material having a thickness of about 5 nm on the upper surface of the n-type single crystal silicon substrate 10d. The silicon layer 10b was formed in this order. The specific formation conditions of the i-type amorphous silicon layer 10c and the p-type amorphous silicon layer 10b by the RF plasma CVD method are as follows: frequency: about 13.56 MHz, formation temperature: about 100 to 250 ° C., reaction pressure : About 26.6-80.0 Pa, RF power: About 10-100W.

  Next, an i-type amorphous silicon layer 10e having a thickness of about 5 nm and an n-type amorphous silicon layer 10f having a thickness of about 5 nm are formed in this order on the lower surface of the n-type single crystal silicon substrate 10d. Formed. The i-type amorphous silicon layer 10e and the n-type amorphous silicon layer 10f were formed by the same process as the i-type amorphous silicon layer 10c and the p-type amorphous silicon layer 10b, respectively.

Next, ITO films 10a and 10g having a thickness of about 100 nm were respectively formed on the p-type amorphous silicon layer 10b and the n-type amorphous silicon layer 10f by using a magnetron sputtering method. The specific formation conditions of the ITO films 10a and 10g are: formation temperature: about 50 to 250 ° C., Ar gas flow rate: about 200 sccm, O ₂ gas flow rate: about 50 sccm, power: about 0.5 to 3 kW, magnetic field strength: About 500 to 3000 Gauss.

<Step 2> Collector electrode formation Using a screen printing method, an epoxy thermosetting silver paste is transferred onto a predetermined region of the transparent conductive film on the light receiving surface side, and then dried. And after transferring also on the predetermined area | region of the back surface side, the collector electrode was formed by hardening a silver paste completely by heating at 200 degreeC for 1 hour. As a result, as shown in FIG. 2, a plurality of finger electrodes 30 formed so as to extend in parallel with each other at a predetermined interval on the upper surface of the transparent conductive film and the current collected by the finger electrodes 30 are gathered. A collector electrode composed of the bus bar electrode 20 to be formed was formed. Here, the bus bar electrode 20 had a width of about 1.0 mm and a height of about 50 μm.

<Step 3> String Formation First, an epoxy thermosetting nickel paste was applied onto the bus bar electrode 20 with a dispenser. Specifically, as shown in FIG. 5, it was applied on the bus bar electrode 20 so as to have a thickness of about 30 μm, and was applied so as to cover the outer side surface of the bus bar electrode 20 by about 100 μm. Moreover, as shown in FIG. 6, it apply | coated so that the base part of the finger electrode 30 might also be covered simultaneously. In addition, the nickel particle content in the nickel paste was about 5% by volume.

  After applying nickel paste on both the light-receiving surface side and the back surface side, a tin-plated copper foil having a width of about 1.5 mm to be a tab 40 was disposed on the bus bar electrode 20. Here, a concavo-convex shape is formed on the surface of the tab 40 on the bus bar electrode 20 side, as shown in FIG. The height of the convex part of the tab 40 was 100 μm. And the bus-bar electrode 20 and the tab 40 were crimped | bonded on the conditions of 180 degreeC, 3 Mpa, and 20 second.

  Next, as shown in FIG. 7, a plurality of solar cells are arranged so as to be connected, and the heating unit 80 is sandwiched from above and below for each solar cell, while applying a pressure of 2 MPa, about 200 ° C. The nickel paste was cured by heating for 1 hour to form a string. By curing while applying pressure in this manner, nickel particles can be sandwiched between the tin-plated copper foil and the bus bar electrode 20, so that good electrical conductivity was obtained. Also, the nickel paste was extended and spread to a width almost equal to that of the tab 40. Further, as shown in FIG. 8, the base portion of the finger electrode 30 was covered with a nickel paste having a thickness of about 20 μm over about 200 μm. Thus, the solar cell module according to Example 1 was produced.

(Comparative Example 1)
As a photovoltaic cell according to Comparative Example 1, a flat cell was used on which the concave and convex shapes were not formed on the surface of the tab 40 on the bus bar electrode 20 side. Other manufacturing conditions are the same as in Example 1.

(Evaluation methods)
The solar cell modules according to Example 1 and Comparative Example 1 were each subjected to a temperature cycle test (JIS C8917), and the tensile strength between the bus bar electrode and the tab before and after the test was compared. As shown in FIG. 9, in the tensile strength test, the tab 40 bonded to the bus bar electrode 20 is pulled up in the vertical direction by the tensile tester 100 via the resin 60 (epoxy thermosetting nickel paste). The peak intensity when peeling was measured.

(Experimental result)
Table 1 shows the tensile strength before and after the temperature cycle test.

  The tensile strength was normalized by setting the tensile strength in Comparative Example 1 at the initial stage (before the temperature cycle test) to 1. As shown in Table 1, it was found that the tensile strength in Example 1 was larger than that in Comparative Example 1.

= Experiment 2 =
In Example 1 described above, the bus bar electrode 20 and the tab 40 were pressure-bonded under the conditions of 180 ° C., 3 MPa, and 20 seconds. The tensile strength and resistance value were measured when this pressure was changed to 1 MPa and 2 MPa. did. Here, under the condition of 1 MPa, as shown in FIG. 3A, the convex portion of the tab 40 is in contact with the bus bar electrode 20, and under the conditions of 2 MPa and 3 MPa, as shown in FIG. The 40 convex portions were crushed along the shape of the bus bar electrode. Further, as a reference value, the tensile strength and the resistance value were also measured when the bus bar electrode 20 and the tab 40 were pressure-bonded by conventional soldering (see FIG. 14).

  Here, as shown in FIG. 10, the resistance value was obtained by bringing a probe into contact with bus bar electrodes and tabs arranged in parallel, applying a DC voltage, and detecting the current value at that time. The calculation of the resistance value is based on Ohm's law V = IR, which is very simple and easy to understand. On the other hand, in the case of a sample in which contact capacitance and parasitic capacitance cannot be ignored, as shown in FIG. Often does not become a straight line but becomes a curve indicating a Schottky, and in this case, it is difficult to obtain an accurate resistance value R. In other words, the ohmic property of the sample is important for utilizing this measurement method. In this case, the resistance value R is obtained from the slope of the IV measurement graph obtained from the DC bias measurement from Ohm's law.

  As described above, since it is necessary to reduce the relationship between the distance and the resistance in the measurement of the contact resistance, in Experiment 2, a sample as shown in FIG. 12 was prepared. 12A is a top view of the sample, and FIG. 12B is a cross-sectional view of the sample. An i-type amorphous silicon layer, a p-type amorphous silicon layer 81, and an ITO film 82 are formed on the upper surface of the silicon substrate 80, and bus bar electrodes 83 are formed at regular intervals. A tab 40 is formed on the bus bar electrode 20 as shown in FIG.

  Below, the calculation method of resistance value is demonstrated.

  One fret is formed between one bus bar electrode 83 and adjacent bus bar electrodes, the resistance between the first frets is R, and the contact resistance between the ITO film 82 / bus bar electrode 83 is r. Here, the interface resistance between the tab and the probe, the interface resistance between the ITO film and the bus bar electrode, and the resistance of the ITO film were assumed to be small and negligible. Here, for the sake of easy understanding, it is assumed that the current to the fret is very small and can be ignored. If the distance between 1 fret is l, the resistance between frets Rf can be expressed by the following equation.

Rf = nlR + 2r
In other words, nl represents the distance between the frets. Therefore, when the distance between the frets is taken on the horizontal axis and Rf is taken on the vertical axis, the contact resistance 2r becomes the y-intercept.

(Experimental result)
Table 2 shows the tensile strength and the resistance value. The tensile strength was measured by the same procedure as in Experiment 1.

  The tensile strength and resistance value were standardized with a sample pressure-bonded by soldering as 1. As shown in Table 2, it was found that sufficient tensile strength was exhibited at any of 1 MPa, 2 MPa, and 3 MPa. On the other hand, it was found that the resistance value was sufficiently small when the pressure was 2 MPa and 3 MPa, but the resistance was large when the pressure was 1 MPa. This is considered to be because the contact area between the bus bar electrode and the tab is small because the convex portion of the tab is not crushed at 1 MPa.

= Experiment 3 =
In Example 1 mentioned above, the tensile strength and resistance value were measured by changing the height of the convex portion of the tab from 0 to 500 μm. Other conditions are the same as those described in Example 1.

(Experimental result)
Table 3 shows the tensile strength and the resistance value. The tensile strength was measured by the same procedure as in Experiment 1 and the resistance value was measured by the same procedure as in Experiment 2.

  Tensile strength and resistance values were normalized with a sample having a tab height of 0 (that is, a tab having a flat surface, not an uneven shape) as 1. As shown in Table 3, the tensile strength did not change up to 30 μm, but when it was 40 μm or more, the adhesive strength was improved. Moreover, the effect was seen from the resistance value of 10 micrometers or more. Thus, it has been found that both the adhesive strength and the resistance can be improved by forming an uneven shape of 40 μm or more on the surface of the tab.

It is sectional drawing of the photovoltaic cell concerning this embodiment. It is a top view of the photovoltaic cell concerning this embodiment. It is sectional drawing of the adhesion surface of the tab and bus-bar electrode of the solar cell module which concerns on this embodiment. It is sectional drawing which shows the shape of the tab of the solar cell module which concerns on this embodiment. It is sectional drawing which shows the manufacturing method of the solar cell module which concerns on Example 1 (the 1). It is sectional drawing which shows the manufacturing method of the solar cell module which concerns on Example 1 (the 2). It is sectional drawing which shows the manufacturing method of the solar cell module which concerns on Example 1 (the 3). It is sectional drawing which shows the manufacturing method of the solar cell module which concerns on Example 1 (the 4). It is a figure for demonstrating the tensile strength measurement which concerns on an Example. It is a figure for demonstrating the resistance value measurement which concerns on an Example. It is a graph for demonstrating the ohmic property in the resistance value measurement which concerns on an Example. It is a figure which shows the detail of a sample about the resistance value measurement concerning an Example. It is sectional drawing of the conventional photovoltaic cell. It is an expanded sectional view of the conventional photovoltaic cell.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Photoelectric conversion part 10a ... ITO film 10b ... p-type amorphous silicon layer 10c ... i-type amorphous silicon layer 10d ... n-type single crystal silicon substrate 10e ... i-type amorphous silicon layer 10f ... n-type amorphous Quality silicon layer 10g ... ITO film 20 ... Bus bar electrode 30 ... Finger electrode 40 ... Tab 50 ... Alloy layer 60 ... Resin 80 ... Heating part 90 ... Solder plating

Claims (6)

Between the surface protective material and the back surface protective material, a plurality of solar cells are disposed, and the solar cell module is formed by electrically connecting the connection electrodes of the solar cells to each other by a tab,
The tab has a convex portion on the surface on the connection electrode side,
The convex portion of the tab is in contact with the connection electrode,
The said tab and the said electrode for a connection are adhere | attached with resin, The solar cell module characterized by the above-mentioned.   The solar cell module according to claim 1, wherein a curing temperature of the resin is equal to or lower than a bonding temperature of solder.   The solar cell module according to claim 1 or 2, wherein the convex portion of the tab is made of a material softer than the connection electrode.   The solar cell module according to claim 1, wherein the resin contains fine particles.   The solar cell module according to claim 4, wherein the size of the fine particles is smaller than the height of the convex portion of the tab. A solar cell module manufacturing method in which a plurality of solar cells are disposed between a front surface protective material and a back surface protective material, and the connection electrodes of the solar cells are electrically connected to each other by a tab. And
Forming a connection electrode on the surface of the plurality of photoelectric conversion parts;
Applying a resin on the surface on which the connection electrode is formed;
Placing the tab on the resin with the surface having the convex part facing;
Pressurizing and heating so that the convex portion of the tab is in contact with the connection electrode, and a method of manufacturing a solar cell module.

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