JP2008146997A - Manufacturing method of display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a display panel capable of forming an excellent structure on a substrate. <P>SOLUTION: This manufacturing method of a display panel is characterized by comprising: a structure formation process of forming a structure including an inorganic substance and an organic substance on a substrate; a heat treatment process of removing the organic substance by applying a heat treatment to the structure; and an inspection process of inspecting a remaining state of the organic substance by irradiating the structure with light after the heat treatment process to measure absorbency at a predetermined wavelength of the irradiated light. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a display panel manufacturing method for forming a structure on a substrate.

Examples of the display panel include a plasma display panel, a liquid crystal display panel, an organic EL (Electro Luminescence) panel, an FED (Field Emission Display), and an electrophoretic display panel. These display panels are provided with a front substrate constituting a display surface and a rear substrate provided on the back side, and various structures constituting a light emitting region are appropriately provided on these substrates.
As such a structure, for example, in a plasma display panel, these electrodes, such as a partition partitioning a light emitting region into a plurality of unit light emitting regions, an address electrode and a bus electrode for causing discharge light emission in each unit light emitting region, etc. Examples thereof include a dielectric layer to be coated.

For example, when forming a partition on a substrate, first, a glass paste is applied and dried on the substrate, and then a sandblast resistant mask is formed on a portion of the glass paste that becomes a partition. Subsequently, a portion of the glass paste where the mask is not formed is cut by sandblasting to form a predetermined pattern, and then fired to obtain a partition wall having the predetermined pattern.
Here, the glass paste contains glass frit, a solvent, a binder, and the like. After the solvent is removed from the glass paste in the drying step after coating, the binder is decomposed and removed in the firing step, and the glass frit is fused to form the partition walls.

  For example, a conventional method for manufacturing a plasma display panel as described in Patent Document 1 includes a low melting point glass frit, a curable organic binder whose cured product has a burning point temperature lower than the softening point of the low melting point glass frit, and black inorganic A glass paste composition for forming a black matrix layer containing fine particles is formed on a transparent substrate in a cured film layer having a predetermined pattern. This is baked to form a black matrix layer.

No. 2000-67750

However, in the conventional method for manufacturing a display panel as described in Patent Document 1, when drying or baking is not sufficient, there is a possibility that a solvent, a binder, or the like may remain in the structure.
For example, when a glass paste layer is applied to a substrate and dried to form a glass paste layer that forms the basis of a partition wall, if the drying is insufficient, drying unevenness occurs in the surface of the glass paste layer, which forms a fine pattern. The problem that hinders this is an example. On the other hand, if firing is insufficient and a binder remains in the partition, gas is generated from the partition after manufacture, and the luminous efficiency and lifetime are reduced as an example. Further, as an example, there is a problem that the solvent remaining in the glass paste layer or the partition wall is released in the subsequent processes of the drying and baking processes and the device used in the subsequent processes is contaminated.

Such residual solvent can be measured by thermogravimetric analysis or the like, but it was necessary to destroy the display panel during the measurement.
Therefore, conventionally, by inspecting that the pattern is properly formed before firing, it is possible to determine the product in which drying unevenness has occurred due to residual solvent, and to perform lighting inspection after the display panel is completed. The product in which a defect occurred due to the remaining binder was determined.
However, because the product with the defect has already been patterned or completed as a panel, it can be dried and fired again to completely remove the solvent and binder. I had to throw it away. As a result, the problem that the apparatus and the material are wasted is cited as an example.

  In view of such circumstances, it is an object of the present invention to provide a display panel manufacturing method capable of forming a favorable structure on a substrate.

  The invention according to claim 1 performs a structure forming step of forming a structure including an inorganic material and an organic material on a substrate, and a heat treatment step of removing the organic material by performing a heat treatment on the structure. A method for manufacturing a display panel, wherein after the heat treatment step, the structure is irradiated with light, and an inspection step of inspecting a residual state of the organic substance by measuring absorbance at a predetermined wavelength of the irradiated light is performed. This is a method for manufacturing a display panel.

[First Embodiment]
A first embodiment according to the present invention will be described below with reference to the drawings.
In the first to third embodiments described below, a plasma display panel is exemplified as the display panel. However, the present invention is not limited thereto, and the present invention is not limited to this, but a liquid crystal display panel, an organic EL panel, an FED, an electrophoretic display panel, and the like. It can be applied to other display panels.

[Display panel configuration]
First, a schematic configuration of the plasma display panel manufactured in the present embodiment will be described below.
In general, in a plasma display panel, a front substrate and a rear substrate are disposed to face each other through a discharge space.
On the inner surface side of the front substrate, for example, a plurality of transparent electrodes, a plurality of bus electrodes, a plurality of black stripes, a dielectric layer, and a protective film are provided.
For example, on the inner surface side of the rear substrate, a plurality of address electrodes are provided in parallel on the rear substrate, and an address electrode protection layer that is an insulator layer is provided on the inner surface side of the rear substrate so as to cover these address electrodes. Further, stripe-shaped barrier ribs are provided on the address electrode protective layer, and a plurality of discharge cells are partitioned by these barrier ribs.
For example, phosphor layers of three primary colors of red (R), green (G), and blue (B) are sequentially formed in the plurality of discharge cells. The inside of the discharge space, that is, the inside of each discharge cell, is filled with a discharge gas such as neon gas and sealed with the outside air.
Such a plasma display panel is, for example, a device that displays an image by selectively emitting light in a plurality of discharge cells.

[Apparatus used to manufacture display panels]
In this embodiment, at least a structure forming apparatus for forming a structure including an inorganic substance and an organic substance on a substrate, a heat treatment apparatus for performing heat treatment on the structure, and a residual state of the organic substance are inspected. And an absorbance measuring device for use.
As the structure forming apparatus, for example, the structure is formed on the substrate by various printing methods such as offset printing method, relief printing method, intaglio printing method, gravure printing method, dispenser method, die coater method, spin coating method, knife coating method, etc. Examples of the apparatus include a printing machine, a dispenser, a die coater, a spin coater, and a knife coater configured to be able to apply a material forming material. In addition, for example, an apparatus such as a laminator for laminating a material for forming a structure formed in a film shape on a substrate can be used.
Examples of the heat treatment apparatus include apparatuses such as a dryer and a baking furnace configured to be able to dry and fire the structure under various conditions.

As a heat treatment apparatus, for example, a cart-type heat treatment apparatus 100 as shown in FIGS. 1 and 2 is preferably used. Hereinafter, the configuration of the cart-type heat treatment apparatus 100 will be described with reference to the drawings.
[Configuration of cart type heat treatment equipment]
As shown in FIG. 1, the cart-type heat treatment apparatus 100 has a basic configuration including an outward rail 1 a and a backward rail 1 b, a cart 3, traversers 5 and 6, a continuous furnace 9, and a control unit 10.
The forward rail 1a and the return rail 1b are laid substantially in parallel with each other, and the cart 3 travels on the rails 1a and 1b. The traversers 5 and 6 are arranged so as to communicate between the ends of the rails 1a and 1b, and transfer the cart 3 from one rail to the other rail. The continuous furnace 9 is constructed so that the forward rail 1a passes through the inside, and its heating operation and the like are controlled by the control unit 10. The cart-type heat treatment apparatus 100 heats the substrate by transferring the cart 3 on which the substrate to be processed is mounted into the continuous furnace 9 during the heating operation.

That is, the continuous furnace 9 has a configuration in which 17 compartments # 1 to # 17 are continuously arranged along the transport direction of the cart 3. Each of the compartments # 1 to # 17 defines a space for heat treatment into which the cart 3 can be loaded, and is a minimum unit processing chamber that performs predetermined heat treatment on the substrate on the cart 3 that has been loaded. It will be. Each of the compartments # 1 to # 17 has a common size, and has a size in which one cart 3 can enter.
Further, the length L1 of each compartment # 1 to # 17 in the cart conveyance direction is set to be substantially equal to the length L2 of the cart 3 in the conveyance direction, and as shown in FIG. The partition wall 23 in the continuous furnace that divides the area is equipped with an opening 23a that allows the cart 3 to enter and exit.
In addition, a partition wall 25 is provided at the end of the first first compartment # 1 on the traverser 5 side and the end of the rearmost compartment on the traverser 6 side to partition the compartment from the outside. However, similarly to the partition wall 23, the partition wall 25 is also equipped with an opening that allows the cart 3 to enter and exit.

FIG. 2 shows a cross-sectional view of each of the compartments # 1 to # 17 and the cart 3 as seen from the direction along the rail 1a.
As shown in FIG. 2, the cart 3 has a substantially flat vehicle body 3a on which a substrate (not shown) is placed, and a vehicle body 3a, that is, a substrate, which is engaged with the rail 1a and rotates around a direction perpendicular to the rail 1a. And a wheel 3b transported along the rail 1a.
As shown in FIG. 2, both side surfaces, top surfaces, and bottom surfaces of the compartments # 1 to # 17 are covered with a furnace body upper wall 32, a furnace body bottom wall 33, and furnace body side walls 34 and 35 that constitute the furnace body 31. ing.
That is, each of the compartments # 1 to # 17 is a processing space independent of each other except for the opening 23a.
And the heat insulating material is stuck on the entire inner surface of each furnace body upper wall 32, furnace body bottom wall 33, and furnace body side walls 34, 35.
As shown in FIG. 2, each compartment # 1 to # 17 is heated by heaters 37 and 38 provided on the furnace body upper wall 32 and the furnace body bottom wall 33, respectively. Each substrate accommodated in # 17 is heated to a predetermined temperature.
Further, in each of the compartments # 1 to # 17, a heat-resistant glass upper plate 32a and glass side plates 34a and 35a are provided so as to cover the rail 1a and the path of the cart 3. The glass upper plate 32a and the glass side plates 34a and 35a prevent contamination of each substrate due to the fall of foreign matter from the heater 37, the furnace body upper wall 32, or the like.

For example, as a plasma display panel manufacturing process, the continuous furnace 9 is, for example, a heating process, a main process, an exhaust process, and a cooling process for a substrate mounted on a cart and carried into the continuous furnace 9. Steps are performed in order. Here, the control unit 10 assigns each process to each of the compartments # 1 to # 17, and controls the temperature increase / decrease in the compartments # 1 to # 17 by the heaters 37 and 38, the conveyance of the substrate by the cart 3, and the like. .
On the return rail 1b, a loading / unloading work area 11 for unloading the processed substrate from the cart 3 returning after finishing the processing in the continuous furnace 9, and a substrate to be processed in the cart 3 after unloading. Is mounted with a panel mounting area 13 for loading.

  Examples of the absorbance measuring apparatus include an irradiating unit that irradiates light of a predetermined wavelength to a structure, a light receiving unit that receives transmitted light that has been irradiated from the irradiating unit and transmitted through the structure, and the intensity and transmitted light of the irradiated light. An apparatus that includes a calculation unit that calculates the absorbance of the structure at a predetermined wavelength from the difference between the intensity and the intensity can be used, for example, a Fourier transform infrared spectrophotometer.

[Display Panel Manufacturing Method]
The display panel manufacturing method of the present embodiment includes a structure forming process for forming a structure including an inorganic substance and an organic substance on a substrate, a heat treatment process for removing the organic substance by performing a heat treatment on the structure, and a heat treatment process. And a test process of irradiating the structure with light and measuring the absorbance of the irradiated light at a predetermined wavelength to inspect the residual state of the organic substance.

In the present embodiment, the structure is a partition wall of the plasma display panel.
The structure forming step is a step of forming a structure by applying a glass paste containing an inorganic glass frit and an organic solvent and a binder onto the substrate using the above-described structure forming apparatus. . Here, the solvent includes acetone.
In the heat treatment process, after the structure forming process, the structure is heated and dried to remove the solvent, and the structure is heated to decompose and remove the binder, and the glass frit is fused to form the structure as a partition. And a firing step. The heat treatment step is performed using the above-described heat treatment apparatus, that is, a dryer and a baking furnace. In the heat treatment process, in particular, a cart-type heat treatment apparatus 100 as shown in FIGS. 1 and 2 is preferably used.
In addition, after the drying process, a patterning process is performed in which a mask having sandblast resistance is formed on the structure, and sandblasting is performed on the mask to form the structure in a predetermined pattern.

The inspection step is a step of inspecting the residual state of the organic substance by irradiating the structure with light and measuring the absorbance of the irradiated light at a predetermined wavelength. The inspection process is carried out using a Fourier transform infrared spectrophotometer (hereinafter abbreviated as FTIR) which is the above-described absorbance measuring apparatus. Therefore, the light used for absorbance measurement is infrared.
In the inspection process, the FTIR irradiation means and the light receiving means are moved in a lattice pattern on the structure 1 as indicated by arrows in FIG. During this movement, infrared rays are emitted from the FTIR irradiation means to the structure 1 at a predetermined position, and the transmitted infrared rays transmitted through the structure 1 are received by the FTIR light receiving means. The calculation unit of FTIR calculates the infrared absorbance at a predetermined wavelength of the structure 1 from the difference between the intensity of the irradiated infrared ray and the intensity of the transmitted infrared ray.
The predetermined wavelength of the infrared ray includes at least a specific wavelength near the absorption peak wavelength of the organic substance, and this specific wavelength is a wavelength different from the absorption peak wavelength of the inorganic substance.

The inspection process includes a first inspection process performed after the drying process and before the patterning process, and a second inspection process performed after the baking process.
The specific wavelength measured in the first inspection step is a wavelength near the absorption peak wavelength of acetone as a solvent and different from the absorption peak wavelengths of other organic substances. Specifically, a wavelength in the vicinity of 2.25 μm at which absorption based on vibrational transition of acetone C—O bond is observed is preferable.
As the specific wavelength measured in the second inspection step, a wavelength in the vicinity of 2.1 μm where absorption based on vibrational transition of C—H bond in the organic substance is observed is preferable.

[Operational effects of the first embodiment]
In the first embodiment described above, the following operational effects can be achieved.

  After the heat treatment step, the structure 1 is irradiated with light, and an inspection step of inspecting the residual state of the organic substance by measuring the absorbance of the irradiated light at a predetermined wavelength is provided. Therefore, the residual state of the organic substance without destroying the product Can be inspected. If organic matter remains in the inspection step, the organic matter can be sufficiently removed by performing a heat treatment step again. Therefore, the device and material are not wasted, and a display panel having a good structure 1 can be efficiently manufactured.

In the inspection process, the irradiated light is infrared, and the predetermined wavelength of the light for measuring the absorbance includes at least a specific wavelength near the absorption peak wavelength of the organic substance, and the absorbance at this specific wavelength varies greatly depending on the residual organic substance. Therefore, by measuring the absorbance at a specific wavelength, it is possible to easily and reliably inspect the residue of organic matter.
In the inspection process, the specific wavelength of infrared rays for measuring the absorbance is different from the absorption peak wavelength of the inorganic substance, so the absorption peak wavelength of the inorganic substance and the specific wavelength do not overlap, and the organic residue can be inspected more easily and reliably. Can do.

Both the residual state of the solvent and the binder can be inspected by the first inspection step performed after the drying step and before the patterning step and the second inspection step performed after the baking step.
The organic substance contains acetone as a solvent, and the specific wavelength for measuring the absorbance in the first inspection process is a wavelength near the absorption peak wavelength of acetone and different from the absorption peak wavelength of other organic substances. The removal can be reliably inspected in the first inspection step. If acetone remains in the first inspection process, the drying process can be performed again to sufficiently remove the solvent. Accordingly, there is little possibility that uneven drying occurs in the surface of the structure 1 due to insufficient drying, and there is little possibility that fine pattern formation of the structure 1 is hindered by the uneven drying.
In addition, since acetone with low toxicity is used as a solvent, adverse effects on the environment and workers can be reduced.

In the second inspection step, the absorbance at a specific wavelength in the vicinity of 2.1 μm at which the absorption due to the CH bond in the organic compound is observed is measured, so that the residue of the organic substance including the binder can be easily inspected. In the case where the organic matter remains, the baking process can be performed again to sufficiently remove the organic matter. Accordingly, since the firing is insufficient, it is possible to prevent the gas from being generated from the partition after the production, thereby reducing the light emission efficiency and the lifetime.
Further, as described above, it is possible to prevent the organic matter from remaining in the structure 1, so that the organic matter is released in the subsequent steps of the drying and firing steps, and the device used in the subsequent steps is prevented from being contaminated. it can.

By changing the conditions such as the heating time and temperature in the heat treatment step and performing the display manufacturing method of the present embodiment several times, the optimum conditions for the heat treatment step can be obtained. If the heat treatment process is carried out under the optimum conditions thus obtained, the possibility of occurrence of defects due to the remaining organic matter is reduced, so that the inspection process can be omitted in the subsequent display panel manufacturing.
Since the partition walls of the plasma display panel are manufactured by the manufacturing method as described above, a plasma display panel with good display performance can be obtained.
Since the inspection process is performed using a general FTIR as an absorbance measuring device, an inspection process can be added to the conventional display panel manufacturing method without using an expensive device or a special device. Various excellent effects as exemplified above can be obtained.

[Second Embodiment]
The second embodiment according to the present invention will be described below. The display panel manufacturing method according to the present embodiment and the third embodiment described below is the structure 1, the structure forming step, the heat treatment step, and the inspection of the display panel manufacturing method according to the first embodiment. Since the process has another configuration, the description of the same configuration as that of the first embodiment is omitted or simplified.

In the present embodiment, the structure 1 formed on the substrate is a dielectric layer of a plasma display panel.
The structure forming step is a step of laminating a film including a dielectric that is an inorganic substance and a binder that is an organic substance on a substrate.
In the heat treatment process of the present embodiment, the drying process is not performed, and the first inspection process is not performed in the inspection process. In the present embodiment, the patterning process is not performed.

[Operational effects of the second embodiment]
In the said 2nd Embodiment, in addition to the effect similar to 1st Embodiment, there can exist the effect shown below.
Since the dielectric layer of the plasma display panel is manufactured by the above-described manufacturing method, for example, there is a low possibility that the organic substance remains in the dielectric layer and the transparency and the like are reduced, and a plasma display panel with good display performance is obtained. Obtainable.

[Third Embodiment]
The third embodiment according to the present invention will be described below with reference to the drawings.
In the present embodiment, the structure 1 formed on the substrate is an electrode of a plasma display panel.

The structure forming step is a step of forming the structure 1 by applying a conductive paste in a predetermined pattern on the substrate using the above-described structure forming apparatus. The conductor paste includes a conductor that is an inorganic substance and a binder that is an organic substance.
In the heat treatment process of the present embodiment, the drying process is not performed, and the first inspection process is not performed in the inspection process.

[Operational effects of the third embodiment]
In the said 3rd Embodiment, in addition to the effect similar to 1st Embodiment, there can exist the effect shown below.

Since the electrodes of the plasma display panel are manufactured by the above-described manufacturing method, for example, it is unlikely that organic substances remain on the electrodes and adversely affect the electrical properties of the electrodes, and the plasma display panel has good display performance. Can be obtained.
[Modification of Embodiment]
In addition, this invention is not limited to embodiment mentioned above, The deformation | transformation shown below is included in the range which can achieve the objective of this invention.

  That is, for example, in the first embodiment, acetone is exemplified as the solvent, but the present invention is not limited to this. Any organic substance that can dissolve the components of the structure 1 can be used as the solvent of the present invention. In particular, any organic substance having a characteristic absorption peak wavelength different from other organic substances and inorganic substances contained in the structure 1 can be preferably used. In addition, if the binder can dissolve the inorganic substance and the binder in a state in which the inorganic substance is dissolved can be applied to the substrate, the solvent may be omitted. In this case, the drying step can be omitted, and the display panel can be manufactured more efficiently.

  Further, in the inspection process of each embodiment, the FTIR irradiation means and the light receiving means are configured to be moved in a lattice pattern on the structure 1, but the present invention is not limited thereto. The inspection process only needs to measure the absorbance at a predetermined position on the structure 1, and the trajectory of the movement of the FTIR irradiation means and the light receiving means is not a problem. For example, when nine points on the structure 1 indicated by circles in FIG. 4 are defined as the predetermined absorbance measurement position 2, the absorbance at the absorbance measurement position 2 may be measured in any order. Regardless of the order in which the measurements are performed, it is possible to inspect the residue of the organic matter and obtain various excellent effects as in the above-described embodiment. However, in order to appropriately inspect the residue of the organic matter, the predetermined absorbance measurement position 2 is preferably arranged on the structure 1 in a well-balanced manner, and the predetermined absorbance measurement position 2 considers productivity and the like. However, it is preferable to set as many as possible.

  Further, the absorbance measuring apparatus used in the inspection process includes an irradiation unit that irradiates the structure 1 with light of a predetermined wavelength, a light receiving unit that receives the transmitted light that has been irradiated from the irradiation unit and transmitted through the structure 1, and the irradiated light. Provided that it includes a calculation unit that calculates the absorbance of the structure 1 at a predetermined wavelength from the difference between the intensity of the transmitted light and the intensity of the transmitted light, and is not limited to the FTIR exemplified in each embodiment. For example, the inspection process can be carried out with an ultraviolet-visible spectrophotometer, a Raman spectrophotometer, or the like, and the same excellent effects as those of the embodiments can be obtained.

In addition, the heat treatment process is performed using a heat treatment apparatus having an exhaust duct, and an absorbance measurement device is provided in the vicinity of the exhaust duct of the heat treatment apparatus to measure the absorbance of the gas exhausted from the heat treatment apparatus. It is good also as a structure which test | inspects whether the gas derived from the organic substance discharge | released from the structure 1 is contained in. In this case, if the gas derived from the organic matter is not contained in the exhausted gas, the organic matter is removed from the structure 1, and therefore, the residue of the organic matter can be inspected as in the above embodiment. it can.
Here, after the start of the heat treatment step, when the presence of the organic substance-derived gas is recognized even after a lapse of a predetermined time, the heat treatment temperature, supply / exhaust are automatically performed so as to quickly remove the organic matter remaining in the structure 1. Such a condition may be changed. According to this, organic matter residue on the structure 1 can be more reliably and automatically prevented.

The irradiation means and the light receiving means of the absorbance measuring apparatus can reciprocate in a direction perpendicular to the substrate transport direction above the glass upper plate 32a in the compartment # 17 of the cart-type heat treatment apparatus 100 described above, for example. It may be provided. Here, the glass upper plate 32a transmits light irradiated from the irradiation unit.
In this case, the inspection process as described above can be performed inside the cart-type heat treatment apparatus 100. Therefore, it is not necessary to prepare a separate absorbance measuring device in order to carry out the inspection process, so that work efficiency and space saving of the device can be achieved. In addition, in the inspection process, when organic matter remains, if the substrate in which the residue is recognized is not unloaded in the unloading work area 11 and is transported as it is into the continuous furnace 9 by the cart 3, special work is performed. It is possible to easily perform the heat treatment process again without performing it. Therefore, a display panel having a good structure 1 can be manufactured more efficiently.

In this case, the heat treatment apparatus is not limited to the cart-type heat treatment apparatus 100 including the cart-type substrate transfer means, and may be, for example, a heat treatment apparatus 200 including the roller-type substrate transfer means as illustrated in FIG.
FIG. 7 is a cross-sectional view of the compartments # 1 to # 17 of the heat treatment apparatus 200 as viewed from the direction along the substrate traveling direction. The heat treatment apparatus 200 differs from the cart-type heat treatment apparatus 100 only in the substrate transfer means, and the other configurations and operations are the same.
The heat treatment apparatus 200 includes a plurality of rollers 4 that are provided so as to penetrate the furnace body side walls 34 and 35 and rotate in the axial direction to convey the substrate. In the heat treatment apparatus 200, the cart 3 and the rail 1 a are not provided, and the substrate is placed directly on the roller 4 and conveyed by the rotation of the roller 4.
Even when such a heat treatment apparatus 200 is used, excellent effects similar to those of the above-described embodiments and comparative examples can be obtained.

[Effects of Embodiment]
Since the display panel manufacturing method includes an inspection step of irradiating the structure 1 with light after the heat treatment step and measuring the absorbance of the irradiated light at a predetermined wavelength to inspect the residual state of the organic matter, the product is destroyed. The residual state of the organic matter can be inspected without performing it, and when the residual organic matter is recognized in the inspection step, the organic matter can be sufficiently removed by performing the heat treatment step again. Therefore, the device and material are not wasted, and a display panel having a good structure 1 can be efficiently manufactured. In the inspection process, the predetermined wavelength of the infrared rays for measuring the absorbance includes at least a specific wavelength near the absorption peak wavelength of the organic substance, and the specific wavelength is different from the absorption peak wavelength of the inorganic substance. be able to.

  As an effect | action of an above-described test | inspection process, the experiment implemented about the relationship between the light absorbency of the structure 1 and the mass of the organic substance which remains in the structure 1 is demonstrated with reference to drawings. In addition, the display panel produced here is for description, and the present invention is not limited to these display panels.

[Example 1]
FIG. 5 is a graph showing the relationship between the infrared absorbance of the structure 1 and the mass of organic matter remaining in the structure 1 after the drying process is performed at different temperatures. In addition, the structure 1 in a present Example is a partition.

In this example, the composition of the glass paste used to form the structure 1 is shown below.
1) Glass frit 2) Solvent: Alcohol solvent 3) Binder: α-Terpineol
As the ethyl cellulose resin substrate, a glass substrate (10 cm square) was used. An electrode and an electrode protective layer are formed on the substrate. The electrode is composed of indium tin oxide. A glass paste was applied to such a substrate with a film thickness of 300 μm using a doctor blade.

After the substrate on which the structure 1 is formed in this manner is dried for 5 minutes at each temperature shown in FIG. 5 by a small hot plate drying apparatus, the infrared absorbance of the structure 1 and the organic matter remaining in the structure 1 The mass was measured. The infrared absorbance of the structure 1 was measured at 2.3 ± 0.5 μm (± 0.5 is a half width) using FTIR (IRMA 5121S manufactured by Chino Co., Ltd.). The glass paste peeled off and ground was subjected to thermogravimetric analysis.
The alcohol solvent alone has an absorbance of about 50%.

  According to FIG. 5, there is a correlation between the infrared absorbance of the structure 1 and the mass of the organic substance (solvent) remaining in the structure 1. The lower the infrared absorbance of the structure 1, the more the structure 1 It can be seen that the mass of the remaining organic matter is small. Accordingly, if the infrared absorbance of the structure 1 is measured in the inspection process, the mass of the organic matter remaining in the structure 1 can be estimated.

[Example 2]
FIG. 6 is a graph showing the relationship between the infrared absorbance of the structure 1 and the mass of the organic matter remaining in the structure 1 after performing the firing step at different temperatures. In addition, the structure 1 in a present Example is a dielectric material layer.
In this example, the composition of the film used to form the structure 1 is shown below. The film thickness is 50 μm.
1) Dielectric: Glass frit 2) Binder: Acrylic resin 3) Others: Plasticizer The substrate used was a glass substrate (10 cm square). An electrode is formed on the substrate. The electrode is composed of indium tin oxide. The above film was laminated on such a substrate.

Thus, the board | substrate which formed the structure 1 was baked for 15 minutes at each temperature shown in FIG. 6 with a small baking furnace. About these, the infrared absorption of the structure 1 and the mass of the organic substance remaining in the structure 1 were measured in the same manner as in Example 1 described above.
The acrylic resin alone has an absorbance of about 60%.

  According to FIG. 6, there is a correlation between the infrared absorbance of the structure 1 and the mass of the organic substance (binder) remaining in the structure 1, and the lower the infrared absorbance of the structure 1, It can be seen that the mass of the remaining organic matter is small. Accordingly, if the infrared absorbance of the structure 1 is measured in the inspection process, the mass of the organic matter remaining in the structure 1 can be estimated.

1 is a schematic plan view of a cart-type heat treatment apparatus suitably used for a display panel manufacturing method according to a first embodiment of the present invention. Sectional drawing of the cart type heat processing apparatus suitably used for the manufacturing method of the display panel which concerns on the 1st Embodiment of this invention. The figure which shows the locus | trajectory of the movement of the light absorbency measuring apparatus in a test | inspection process of the manufacturing method of the display panel which concerns on the 1st Embodiment of this invention. The figure which shows the light absorbency measurement position of the light absorbency measuring apparatus in a test | inspection process of the modification of the manufacturing method of the display panel which concerns on the 1st-3rd embodiment of this invention. The figure which shows the relationship between the infrared rays absorbance of a structure after giving a drying process in Example 1 in different temperature, and the mass of the organic substance which remains in a structure. The figure which shows the relationship between the infrared light absorbency of a structure after giving a baking process in Example 2 in different temperature, and the mass of the organic substance which remains in a structure. Sectional drawing of the heat processing apparatus used for the modification of the manufacturing method of the display panel which concerns on the 1st-3rd embodiment of this invention.

Explanation of symbols

1 Structure 2 Absorbance measurement position

Claims (8)

A structure forming step of forming a structure including an inorganic substance and an organic substance on a substrate;
A heat treatment step for removing the organic matter by subjecting the structure to a heat treatment;
A display panel manufacturing method for carrying out
After the heat treatment step, the display is manufactured by irradiating the structure with light and measuring the absorbance of the irradiated light at a predetermined wavelength to inspect the residual state of the organic matter. Method. A method of manufacturing a display panel according to claim 1,
The light is infrared;
The predetermined wavelength of the light includes at least a specific wavelength in the vicinity of the absorption peak wavelength of the organic substance. A method for manufacturing a display panel according to claim 2,
The specific wavelength is different from the absorption peak wavelength of the inorganic substance. It is a manufacturing method of the display panel according to claim 3,
The organic matter includes acetone,
The specific wavelength is different from the absorption peak wavelength of the acetone and near the absorption peak wavelength of the acetone. A method of manufacturing a display panel according to any one of claims 1 to 4,
The display panel is a plasma display panel. A method for producing a display panel. A method for manufacturing a display panel according to any one of claims 1 to 5,
The said structure is a partition. The manufacturing method of the display panel characterized by the above-mentioned. A method for manufacturing a display panel according to any one of claims 1 to 5,
The said structure is a dielectric material layer. The manufacturing method of the display panel characterized by the above-mentioned. A method for manufacturing a display panel according to any one of claims 1 to 5,
The said structure is an electrode. The manufacturing method of the display panel characterized by the above-mentioned.

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