JP2008142739A - Ultrasonic bonding apparatus and its control method, and ultrasonic bonding bonding inspection apparatus and its bonding inspection method - Google Patents

Abstract

Ultrasonic bonding capable of directly measuring the contact resistance of a product, not a substitute characteristic, and accurately determining a bonding state in a short time based on the contact resistance and feeding back the determination result to a vibration control unit Providing equipment.
An ultrasonic device that pressurizes two pieces of material to be bonded between a horn 30 and an anvil 20 that apply ultrasonic vibrations, and applies ultrasonic vibration parallel to the contact surface of the materials to be bonded for solid phase bonding. The sonic bonding apparatus 1 includes a control device 60 having a vibration control unit 70 and a bonding inspection unit 80. The bonding inspection unit 80 includes a voltage applying unit 82 for applying a voltage between the horn 30 and the anvil 20, and a horn. The contact resistance is calculated from the measured values of the voltmeter 83 that measures the applied voltage between the horn 30 and the anvil 20, the ammeter 84 that measures the current flowing between the horn 30 and the anvil 20, and the voltmeter 83 and the ammeter 84. And an electric resistance measurement circuit 81 for determining the joining state.
[Selection] Figure 1

Description

  The present invention relates to an ultrasonic bonding apparatus and a control method thereof for superimposing a bonding surface of two materials to be bonded and applying ultrasonic vibration while applying pressure, and a bonding inspection apparatus for ultrasonic bonding and the same The present invention relates to a bonding inspection method.

  The ultrasonic bonding apparatus pressurizes two metal plates sandwiched between an anvil as a support member and a horn that applies ultrasonic vibrations, and applies ultrasonic vibrations parallel to the contact surfaces of the two metal plates. This is a device that performs bonding by destroying oxides between the interfaces with frictional heat caused by vibrations to produce a new surface. For example, Patent Document 1 discloses a technique that can detect a bonding state with high accuracy regardless of the surface properties of the bonding surface using the amplitude of high-frequency vibration as a substitute characteristic of the bonding state.

  The bonding state by this ultrasonic bonding apparatus is solid-phase bonding, and since there is little generation of brittle intermetallic compounds by melting, it is particularly suitable for bonding between different metals. For example, when joining electrode tabs of a lithium ion secondary battery, the material of the negative electrode tab is aluminum (Al), and the material of the positive electrode tab is copper (Cu), which is a joining of dissimilar metals.

  In joining the electrode tabs, it is necessary to maintain a joint strength of a certain level or more so as not to break when a load is applied. As the method for inspecting the bonding strength, the following three methods are used alone or in combination. The first is a method of joining a test piece under the same conditions as production and measuring the joining strength by a tensile test. The second is a method of measuring the power (voltage × current) applied to the vibrator during ultrasonic bonding. If the integral value (energy) of the power is equal to or greater than a predetermined value, it is determined that the strength is good. The third is a method of measuring the power (voltage × current) applied to the vibrator during ultrasonic bonding. If the maximum value of power (peak power) is equal to or greater than a predetermined value, it is determined that the strength is good. .

In addition, the bonding of the electrode tab functions as a current path as an electrode, and thus it is necessary to keep the electric resistance below a certain level. There are the following two methods for inspecting the electrical resistance. The first is a method in which a test piece is joined under the same conditions as production, a current is applied by applying a voltage, and an electric resistance value is measured therefrom. The second is a method in which a measurement probe is connected to a product, a current is applied by applying a voltage, and an electric resistance value is measured by these.
JP-A-6-99289

  By the way, in the conventional inspection method of the bonding strength in ultrasonic bonding, the first method is a destructive inspection, so that there is a problem that a product at the time of production cannot be inspected. In addition, since the second and third methods are determinations based on substitute characteristics, there is a problem that determination accuracy is inferior and erroneous determination may occur.

  On the other hand, in the method for inspecting electrical resistance, the first method is directed to test pieces, so that there is a problem that a product at the time of production cannot be inspected. In addition, since the second method requires connection of a measurement probe, it takes time to inspect, and there is a problem that it is not possible to perform 100% inspection at the time of mass production.

  The present invention was devised in view of the above circumstances, and it is possible to directly measure the electrical resistance of a product, not a substitute characteristic, and to determine the bonding state with high accuracy in a short time based on this electrical resistance, and the determination It is an object of the present invention to provide an ultrasonic bonding apparatus capable of feeding back a result to a vibration control unit and a control method thereof, and an ultrasonic bonding bonding inspection apparatus and a bonding inspection method thereof.

  In order to achieve the above object, an ultrasonic bonding apparatus according to the present invention pressurizes two bonded materials between a horn and an anvil that provide ultrasonic vibrations, and contacts the contact surfaces of these bonded materials. In an ultrasonic bonding apparatus that applies solid-state bonding by applying ultrasonic vibration in parallel, the ultrasonic bonding apparatus includes a control device having a vibration control unit and a bonding inspection unit, and the bonding inspection unit applies a voltage between the horn and the anvil. The contact resistance is calculated from the measured values of the application unit, the voltmeter for measuring the applied voltage between the horn and the anvil, the ammeter for measuring the current flowing between the horn and the anvil, and the measured values of the voltmeter and the ammeter. And an electric resistance measuring circuit for determining the joining state.

  According to the ultrasonic bonding apparatus according to the present invention as described above, since the control apparatus includes the bonding inspection unit including the voltage application unit, the voltmeter, the ammeter, and the electric resistance measurement circuit, the product is not a substitute characteristic, but a product. The electrical resistance can be directly measured, and the joining state can be determined with high accuracy in a short time based on the electrical resistance. Therefore, a good joining state can be obtained by feeding back the determination result to the vibration control unit and correcting the joining conditions.

  The best mode for carrying out the present invention will be described below in detail with reference to the drawings.

  First, an ultrasonic bonding apparatus according to the present invention and a bonding inspection apparatus for ultrasonic bonding will be described.

  FIG. 1 is a block diagram showing the overall configuration of the ultrasonic bonding apparatus. FIG. 2 is a schematic diagram showing a positive electrode mounting portion of a voltage application unit to the horn. FIG. 3A is a conceptual diagram showing a state of resistance measurement in a state where a material to be joined is sandwiched in the ultrasonic bonding apparatus, and FIG. 3B is a conceptual diagram showing a state of measurement of basic resistance.

  With reference to FIGS. 1 to 3, the ultrasonic bonding apparatus 1 includes an apparatus main body 10 and a control device 60 provided therein. The apparatus main body 10 includes an anvil 20 that sandwiches two members to be joined (plate-like members) 51 and 52 and a joining tool called a horn 30. For example, when joining electrode tabs of a lithium ion secondary battery, the material of the negative electrode tab is aluminum (Al) and the material of the positive electrode tab is copper (Cu), which is a joining of different metals.

  The anvil 20 is a pedestal (support member) on which two plate-like members (for example, a negative electrode tab and a positive electrode tab) 51 and 52 to be joined are placed, and a plurality of protrusions 22 are formed on the holding surface. Yes.

  The horn 30 can adjust the relative position with respect to the anvil 20 as appropriate, and a horn tip 31 is projected from the extended end side of the horn body 33. For example, ultrasonic vibration oscillated by a vibrator 41 such as a piezoelectric vibrator is transmitted to the horn chip 31 via a booster 42, and a plurality of protrusions 32 are formed on the holding surface.

  Further, the horn 30 is provided with a pressing means (not shown) that presses the horn 30 from behind (upward) in the clamping direction. That is, at the time of ultrasonic bonding, the transducer 41 ultrasonically applies to the horn 30 via the booster 42 while pressurizing the plate-like members 51 and 52 on which the horn 30 is placed on the anvil 20 by a pressurizing means. Generate vibration.

  Further, the node (node) 34 of the horn 30 is provided with a reinforcing member (nodal support) (not shown) that supports the node 34 from above. A positive electrode of the voltage application unit 82 is attached to the node 34. On the other hand, the negative electrode of the voltage application unit 82 is attached to an appropriate part of the anvil 20.

  That is, the ultrasonic bonding apparatus 1 causes the two plate-like members 51 and 52 to reciprocate linearly by ultrasonic vibration by the horn 30, and the contact surfaces of the plate-like members 51 and 52 are rubbed together. Impurities such as an oxide film on the surface are removed to expose and contact a new metal surface, and the plate-like members 51 and 52 are solid-phase bonded by frictional heat generated at that time.

  The control device 60 includes a vibration control unit 70 that controls the vibration state of the vibrator 41 based on the stored bonding conditions, and a bonding inspection unit (bonding inspection) that controls voltage application to the horn 30 based on the stored resistance value. Device) 80.

  The vibration control unit 70 includes an oscillation control circuit 71, a power module 72, and a power monitor 73. An initial joining condition is input to the oscillation control circuit 71, and the oscillation control circuit 71 instructs the power module 72 on a current / voltage value based on the stored joining condition. The power module 72 vibrates the vibrator 41 with the current / voltage value instructed from the oscillation control circuit 71, and the operating power of the vibrator 41 is monitored by the power monitor 73 and fed back to the oscillation control circuit 71.

  The bonding inspection unit (bonding inspection device) 80 includes an electrical resistance measurement circuit 81, a voltage application unit 82, a voltmeter 83, an ammeter 84, and a display device 85. An initial resistance value is input to the electrical resistance measurement circuit 81. The electrical resistance measurement circuit 81 instructs the applied voltage to the voltage application unit 82 based on the stored resistance value. In addition, the electrical resistance measurement circuit 81 calculates the contact resistance from the measured values of the voltmeter 83 and the ammeter 84 to determine the joining state. The voltage application unit 82 applies a voltage to the anvil 20 and the horn 30 based on an instruction from the electrical resistance measurement circuit 81. The voltmeter 82 measures the voltage applied to the anvil 20 and the horn 30 and feeds back the measured value to the electric resistance measurement circuit 81. The ammeter 83 measures the current flowing through the anvil 20 and the horn 30 and feeds back the measured value to the electric resistance measurement circuit 81. The display device 84 is an image display device such as a CRT or a liquid crystal display device, and displays a determination result of good (OK) / defective (NG) based on a resistance reference value based on a flow described later (see FIG. 7). ).

  The electrical resistance measurement probe may be embedded in the horn 30 and the anvil 20 or may be detachable as a separate body. In particular, if a structure in which the measurement probe is embedded in the horn 30 and the anvil 20 is employed, the work of attaching the voltage application line to the tool (the horn 30 and the anvil 20) is not required when changing the tool.

  The oscillation control circuit 71 and the electrical resistance measurement circuit 81 are electrically connected to transmit the junction sequence information from the oscillation control circuit 71 to the electrical resistance measurement circuit 81, and the connection condition of the electrical resistance measurement circuit 81 to the oscillation control circuit 71 is determined. Send correction instructions. Here, the “joining sequence information” is information indicating which state the joint is currently in, and includes idle, horn lowering, squeeze, oscillating, hold, and horn rising states.

  According to the ultrasonic bonding apparatus 1 configured as described above, the control apparatus 60 includes the bonding inspection unit 80 including the voltage application unit 82, the voltmeter 83, the ammeter 84, and the electric resistance measurement circuit 81. The electrical resistance (joining resistance) of the product can be directly measured instead of the substitute characteristics, and the joining state can be determined with high accuracy in a short time based on the joining resistance. Therefore, a favorable bonding state can be obtained by correcting the bonding condition by feeding back the determination result of the bonding inspection unit (bonding inspection apparatus) 80 to the vibration control unit.

  Next, a control method for an ultrasonic bonding apparatus and a bonding inspection method for ultrasonic bonding according to the present invention will be described.

  FIG. 4A is a conceptual diagram showing a calculation method of resistance measurement in a state where a material to be joined is sandwiched, and FIG. 4B is a conceptual diagram showing a calculation method of basic resistance. FIG. 5 is an explanatory diagram showing the relationship between surface roughness, contact resistance, and ultrasonic bonding. FIG. 6 is a time chart showing an operation state of the ultrasonic bonding apparatus. FIG. 7 is a flowchart showing a control method of the ultrasonic bonding apparatus. FIG. 8 is a flowchart of resistance measurement in FIG.

  First, referring to FIG. 4, as a premise concept of the ultrasonic bonding apparatus control method and ultrasonic bonding inspection method according to the present invention, resistance measurement and basic resistance measurement with a material to be bonded interposed therebetween. explain.

  As shown in FIG. 4B, the positive electrode of the voltage application unit 82 is connected to the horn 30 and the negative electrode is connected to the anvil 20, and pressure is applied between the horn 30 and the anvil 20 in a state where no material to be bonded is sandwiched in advance. Apply voltage and current values. The resistance value is calculated by measuring resistance = applied voltage ÷ measured current, and this is used as the basic resistance. This basic resistance is the sum of the horn conductor resistance A, the tool contact resistance B, and the anvil conductor resistance C.

  On the other hand, as shown in FIG. 4A, the measurement resistance is a resistance measured during production, and is measured in a state where the materials 51 and 52 are sandwiched between the horn 30 and the anvil 20, and the junction resistance and the basic resistance are measured. It is obtained by adding. The junction resistance is the sum of the upper plate conductor resistance X, the material contact resistance Y, and the lower plate conductor resistance Z. That is, junction resistance = measured resistance−basic resistance.

  Moreover, with reference to FIG. 5, an upper limit of resistance and a lower limit of resistance will be described as a premise concept of the method for controlling the ultrasonic bonding apparatus and the ultrasonic bonding inspection method according to the present invention.

  Three kinds of materials to be joined having different surface roughness are prepared in advance, and the contact resistance is measured (see FIG. 4). When the surface roughness of the material to be joined is large, the surface of the member is uneven and the contact area is small, so that the contact resistance between the members before joining increases, resulting in weak ultrasonic joining and slow joining time. Become. Therefore, when bonding is performed under the bonding conditions at the time of production, the bonding lowers and the bonding resistance increases.

  On the other hand, when the surface roughness of the material to be joined is small, the surface of the member is smooth and the contact area is large, so that the contact resistance between the members before joining is reduced, and as a result, ultrasonic joining is strengthened and the joining time is increased. Will be faster. Therefore, when joining is performed under the joining conditions at the time of production, adhesion and cracking occur. Here, “adhesion” means a state where the joining conditions are strong and the material to be joined adheres to the tool, and “crack” means a state where the joining conditions are strong and a hole is opened in the material to be joined. .

  In the case of a normal material to be joined having a medium surface roughness, the contact resistance and ultrasonic bonding are also medium. Therefore, when joining is performed under the joining conditions at the time of production, the joining strength does not decrease and the joining resistance does not increase.

  From these considerations, the contact resistance value at which the surface roughness becomes the boundary between large and medium is defined as the upper limit of resistance in the flowchart of FIG. Further, a contact resistance value at which the surface roughness is a boundary between medium and small is defined as a lower resistance limit in the flowchart of FIG.

  With reference to FIG. 6, the operation | movement time chart of the ultrasonic bonding apparatus 1 is demonstrated.

  The joining sequence of the ultrasonic joining apparatus 1 includes the following steps: 1) idle, 2) horn descending, 3) squeeze, 4) oscillation, 5) hold, and 6) horn ascending. In the idle process, the horn 30 stands by at the original position (initial position). The horn descending process is started by the start of joining, and the horn 30 descends from the original position to the descending end. In the squeeze process, the material to be joined is pressurized by the horn 30 and the anvil 20 before the ultrasonic oscillation. In the oscillation process, the vibration of the vibrator 41 is transmitted to the horn 30 through the booster 42, and the horn 30 reciprocates in parallel with the contact surface of the material to be joined. In the holding step, the material to be joined is pressurized by the horn 30 and the anvil 20 after the end of the ultrasonic oscillation. When the joining is completed, a horn raising process is performed, and the horn 30 is raised from the descending end to the original position. And it transfers to an idle process again.

  Referring to FIG. 7, in the control method of ultrasonic bonding apparatus 1, first, it is determined whether or not the bonding sequence of ultrasonic bonding apparatus 1 is in the “squeeze” process (step 1; hereinafter “S1”). Notation.)

  If it is determined in step 1 that the process is in the “squeeze” process, the electrical resistance measurement circuit 81 of the bonding inspection unit (bonding inspection apparatus) 80 performs resistance measurement (S2).

  Referring to FIG. 8, when resistance measurement (S2) is started, electrical resistance measurement circuit 81 instructs voltage application unit 82 to apply a voltage between anvil 20 and horn 30 (S21). Next, the ammeter 83 is instructed to measure current, and the measured value is input to the electric resistance measuring circuit 81 (S22). Furthermore, the electrical resistance measurement circuit 81 calculates the measurement resistance by dividing the applied voltage by the measurement current (current measurement value) (S23). Then, the electrical resistance measurement circuit 81 instructs the voltage application unit 82 to end the voltage application between the anvil 20 and the horn 30 (S24). Further, the electric resistance measurement circuit 81 instructs the ammeter 83 to end the current measurement (S25), ends the resistance measurement, and proceeds to step 3 in FIG.

  Then, the basic resistance is subtracted from the measured resistance obtained in the flow of FIG. 8 to obtain the contact resistance (S3). Here, the basic resistance is obtained by the calculation method of FIG.

  Next, it is determined whether or not the contact resistance obtained in step 3 is smaller than the lower resistance limit stored in the electric resistance measurement circuit 81 (contact resistance <resistance lower limit) (S4).

  In step 4, when the contact resistance is equal to or higher than the lower limit of resistance (contact resistance ≧ resistance lower limit), it is determined whether or not the contact resistance exceeds the upper limit of resistance (contact resistance> upper limit of resistance) (S5). On the other hand, when the contact resistance is less than the lower limit of resistance (contact resistance <lower limit of resistance), an instruction to reduce the amplitude of the vibrator 41 (for example, an instruction to lower the amplitude by 10% from a predetermined production condition) or / After instructing to shorten the oscillation time of the vibrator 41 (S6), the process proceeds to step 8.

  In step 5, when the contact resistance is equal to or lower than the upper limit of resistance (contact resistance ≦ upper limit of resistance), the process proceeds to step 8. On the other hand, if the contact resistance exceeds the upper resistance limit (contact resistance> resistance upper limit), the vibrator 41 is instructed to increase the amplitude (for example, an instruction to increase the amplitude by 10% from a predetermined production condition), and / or After instructing to extend the oscillation time (S7), the process proceeds to step 8.

  As described above, the method for controlling the ultrasonic bonding apparatus 1 according to the present invention applies the voltage between the horn 30 and the anvil 20 during the squeeze process, and the measured value of the voltage applied between the horn 30 and the anvil 20, The contact resistance is calculated from the measured value of the current flowing between 30 and the anvil 20. If the contact resistance is less than the lower limit of resistance (contact resistance <lower limit of resistance), an instruction to decrease the amplitude of the vibrator 41 or / and an instruction to shorten the oscillation time of the horn 30 are given (S6). When the resistance is equal to or higher than the lower limit of resistance (contact resistance ≧ resistance lower limit), an instruction to increase the amplitude of the vibrator 41 and / or an instruction to extend the oscillation time is issued (S7), and the electric resistance measurement circuit 81 oscillates. An instruction to correct the joining condition is transmitted to the control circuit 71 to perform feedback control. That is, the determination result of the bonding inspection unit (bonding inspection device) 80 is fed back to the vibration control unit to correct the bonding condition. Therefore, when the initial contact resistance is small and the progress of ultrasonic bonding is fast, overbonding (adhesion) Adhesion and crack) can be suppressed, and when the contact resistance in the initial state is large and the progress of ultrasonic bonding is slow, insufficient bonding (insufficient strength, excessive electric resistance) can be suppressed.

  The following steps 8 to 13 are carried out as a method for controlling the ultrasonic bonding apparatus 1 according to the present invention, but can also be carried out independently as a bonding inspection method for ultrasonic bonding according to the present invention.

  In step 8, it is determined whether or not the joining sequence of the ultrasonic joining apparatus 1 is in the “hold” process. If it is determined in step 13 that the process is a “hold” process, resistance measurement is performed according to S21 to S25 in the flow of FIG. 8 (S9). Then, the contact resistance is obtained by subtracting the basic resistance from the obtained measurement resistance (S10). Here, the basic resistance is obtained by the calculation method of FIG.

  Next, it is determined whether or not the junction resistance is equal to or less than the resistance reference value stored in the electrical resistance measurement circuit 81 (junction resistance ≦ resistance reference value) (S11).

  In step 11, when the junction resistance is equal to or less than the resistance reference value (junction resistance ≦ resistance reference value), a good (OK) determination is output to the display device 85 (S12), and the junction resistance is the resistance reference value. Is exceeded (junction resistance> resistance reference value), a failure (NG) determination is output to the display device 85 (S13).

  As described above, the control method of the ultrasonic bonding apparatus 1 and the ultrasonic bonding inspection method according to the present invention are performed between the horn 30 and the anvil 20 during the “hold” process, which is a pressurized state after the ultrasonic oscillation is finished. The contact resistance is calculated from the measured value of the voltage applied between the horn 30 and the anvil 20 and the measured value of the current flowing between the horn 30 and the anvil 20, and the contact resistance is less than the resistance reference value. In some cases (junction resistance ≦ resistance reference value), an OK determination is made, and when the resistance reference value is exceeded (junction resistance> resistance reference value), an NG determination is performed. In addition, since inspection can be performed in a short time during the bonding sequence of the ultrasonic bonding apparatus 1, it is possible to perform 100% inspection of the bonding resistance of products during production. Furthermore, since the junction resistance of the product is directly measured instead of the substitute characteristics, the determination accuracy is good.

It is a block diagram which shows the whole structure of an ultrasonic bonding apparatus. It is a schematic diagram which shows the positive electrode attachment site | part of the voltage application part to a horn. (A) is a conceptual diagram which shows the resistance measurement condition in the state which pinched | joined the to-be-joined material in an ultrasonic bonding apparatus, (b) is a conceptual diagram which shows the measurement condition of basic resistance. (A) is a conceptual diagram which shows the calculation method of resistance measurement in the state which pinched | interposed the to-be-joined material, (b) is a conceptual diagram which shows the calculation method of basic resistance. It is explanatory drawing which shows the relationship between surface roughness, contact resistance, and ultrasonic bonding. It is a time chart which shows the operation state of an ultrasonic bonding apparatus. It is a flowchart which shows the control method of an ultrasonic bonding apparatus. It is a flowchart of resistance measurement in FIG.

Explanation of symbols

1 ultrasonic bonding equipment,
10 device body,
20 Anvil,
30 horns,
31 Bonding tip,
34 sections,
51, 52 Joined material,
60 controller,
70 Vibration control unit,
80 Bonding inspection section,
81 electric resistance measurement circuit,
82 voltage application section,
83 Voltmeter,
84 Ammeter.

Claims (11)

In an ultrasonic bonding apparatus that pressurizes two bonded materials between a horn and anvil that apply ultrasonic vibration, and applies ultrasonic vibration parallel to the contact surfaces of these bonded materials to perform solid-phase bonding. ,
A control device having a vibration control unit and a joint inspection unit;
The joint inspection unit is
A voltage application unit for applying a voltage between the horn and the anvil;
A voltmeter for measuring an applied voltage between the horn and the anvil;
An ammeter for measuring the current flowing between the horn and the anvil;
An electrical resistance measurement circuit for calculating a contact resistance from each measurement value of the voltmeter and the ammeter and determining a bonding state;
An ultrasonic bonding apparatus comprising:   The electrical resistance measurement circuit is electrically connected to an oscillation control circuit of the vibration control unit so as to correct a bonding condition based on a determination result of the bonding inspection unit. Ultrasonic bonding device.   The ultrasonic bonding apparatus according to claim 1, wherein a positive electrode of the voltage application unit is connected to a node of the horn.   The ultrasonic bonding apparatus according to any one of claims 1 to 3, wherein a measurement probe is embedded in the horn and the anvil. An ultrasonic bonding apparatus that pressurizes two pieces of material to be bonded between a horn and an anvil that give ultrasonic vibrations, and applies ultrasonic vibration in parallel to the contact surface of these materials to be bonded to a solid phase. In the control method,
During the squeeze process, which is a pressurized state before ultrasonic oscillation, a voltage is applied between the horn and the anvil,
From the measured value of the voltage applied between the horn and the anvil, and the measured value of the current flowing between the horn and the anvil, the contact resistance is calculated,
If the contact resistance is less than the lower limit of resistance, the horn amplitude is reduced or / and the oscillation time is shortened.
When the contact resistance is larger than the lower limit of resistance, the control method of the ultrasonic bonding apparatus is characterized by performing feedback control by instructing an increase in amplitude of the horn or / and extending an oscillation time. During the hold process, which is a pressurized state after the end of ultrasonic oscillation, a voltage is applied between the horn and the anvil,
From the measured value of the voltage applied between the horn and the anvil, and the measured value of the current flowing between the horn and the anvil, the contact resistance is calculated,
6. The ultrasonic bonding apparatus control according to claim 5, wherein a bonding inspection is performed in which it is determined that the contact resistance is equal to or less than a resistance reference value, and is determined to be defective if the contact resistance exceeds the resistance reference value. Method. Bonding of ultrasonic bonding that pressurizes two bonded materials between a horn and anvil that apply ultrasonic vibration, and applies ultrasonic vibration parallel to the contact surface of these bonded materials to perform solid phase bonding An inspection device,
A voltage application unit for applying a voltage between the horn and the anvil;
A voltmeter for measuring an applied voltage between the horn and the anvil;
An ammeter for measuring the current flowing between the horn and the anvil;
An electrical resistance measurement circuit for calculating a contact resistance from each measurement value of the voltmeter and the ammeter and determining a bonding state;
A bonding inspection apparatus for ultrasonic bonding, comprising:   The bonding inspection apparatus for ultrasonic bonding according to claim 7, wherein a positive electrode of the voltage application unit is connected to a node of the horn.   The ultrasonic wave bonding inspection apparatus according to claim 7, wherein a measurement probe is embedded in the horn and the anvil.   The ultrasonic inspection apparatus for ultrasonic bonding according to any one of claims 7 to 9, wherein the ultrasonic inspection apparatus is provided in a control device of the ultrasonic bonding apparatus. Bonding of ultrasonic bonding that pressurizes two bonded materials between a horn and anvil that apply ultrasonic vibration, and applies ultrasonic vibration parallel to the contact surface of these bonded materials to perform solid phase bonding In the inspection method,
During the hold process, which is a pressurized state after the end of ultrasonic oscillation, a voltage is applied between the horn and the anvil,
From the measured value of the voltage applied between the horn and the anvil, and the measured value of the current flowing between the horn and the anvil, the contact resistance is calculated,
A bonding inspection method for ultrasonic bonding, wherein when the contact resistance is equal to or less than a resistance reference value, it is determined to be good, and when it exceeds the resistance reference value, it is determined to be defective.

Images