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JP2008039431A - Humidity detector - Google Patents

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JP2008039431A
JP2008039431A JP2006210288A JP2006210288A JP2008039431A JP 2008039431 A JP2008039431 A JP 2008039431A JP 2006210288 A JP2006210288 A JP 2006210288A JP 2006210288 A JP2006210288 A JP 2006210288A JP 2008039431 A JP2008039431 A JP 2008039431A
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substrate
housing
humidity detection
sensitive film
detection device
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JP4984723B2 (en
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Kazuo Usui
和男 臼井
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Denso Corp
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Denso Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a humidity detector capable of efficiently heating a humidity-sensitive film. <P>SOLUTION: The humidity detector is equipped with a substrate 2 attached to a housing 1, a pair of the electrodes 4 installed on the substrate 2, the humidity-sensitive film 5 formed between at least a pair of the electrodes 4 and changed in either one of a specific dielectric constant and a resistance value corresponding to a humidity change, the heating part 3 installed on the substrate 2 to heat the humidity-sensitive film 5, and an air layer 8 for thermally separating the housing 1 and the substrate 2. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、湿度検出装置に関するものである。特に、本発明は、感湿膜を加熱する加熱部を備える湿度検出装置に関するものである。   The present invention relates to a humidity detection device. In particular, the present invention relates to a humidity detection device including a heating unit that heats a moisture sensitive film.

従来、特許文献１に示すように、加熱部を備える湿度検出装置があった。特許文献１に示す湿度検出装置は、基板の一面側に感湿膜と電極が形成され、基板の他面側に基板を介して感湿膜と対向する部位に感湿膜を加熱する加熱部が形成される。
特開２００２−３９９８３号公報 Conventionally, as shown in Patent Document 1, there has been a humidity detection device including a heating unit. The humidity detection apparatus shown in Patent Document 1 is a heating unit in which a moisture-sensitive film and an electrode are formed on one surface side of a substrate, and the moisture-sensitive film is heated to a portion facing the moisture-sensitive film through the substrate on the other surface side of the substrate. Is formed.
JP 2002-39983 A

通常、特許文献１に示す湿度検出装置は、筐体に取付けられて使用される場合が多い。この湿度検出装置を筐体に取付ける場合、加熱部側を筐体に取り付けることとなる。ところが、湿度検出装置を筐体に取付けた場合、加熱部が発生する熱の一部は、筐体に逃げてしまい、効率的に感湿膜を加熱できない可能性があった。   Usually, the humidity detection device shown in Patent Document 1 is often used while attached to a housing. When attaching this humidity detection apparatus to a housing | casing, the heating part side will be attached to a housing | casing. However, when the humidity detection device is attached to the housing, part of the heat generated by the heating section escapes to the housing, and there is a possibility that the moisture sensitive film cannot be efficiently heated.

本発明は、上記問題点に鑑みなされたものであり、効率的に感湿膜を加熱することができる湿度検出装置を提供することを目的とする。   This invention is made | formed in view of the said problem, and it aims at providing the humidity detection apparatus which can heat a moisture sensitive film | membrane efficiently.

上記目的を達成するために請求項１に記載の湿度検出装置は、筐体に取付けられる基板と、基板上に設けられる一対の電極と、少なくとも前記一対の電極間に形成され湿度変化に応じて比誘電率及び抵抗値のいずれか一方が変化する感湿膜と、基板に設けられるものであり感湿膜を加熱する加熱部と、筐体と基板とを熱的に分離する熱分離部とを備えることを特徴とするものである。   In order to achieve the above object, a humidity detection device according to claim 1 is formed according to a change in humidity formed between a substrate attached to a housing, a pair of electrodes provided on the substrate, and at least the pair of electrodes. A moisture-sensitive film in which one of the relative permittivity and the resistance value changes, a heating unit that is provided on the substrate and heats the moisture-sensitive film, and a thermal separation unit that thermally separates the housing and the substrate It is characterized by providing.

このように、筐体と基板とを熱的に分離する熱分離部を備えることによって、加熱部が発生する熱が筐体に逃げることを抑制でき、効率的に感湿膜を加熱することができる。   Thus, by providing the heat separation part that thermally separates the housing and the substrate, the heat generated by the heating part can be prevented from escaping to the housing, and the moisture sensitive film can be efficiently heated. it can.

また、加熱部は、請求項２に示すように基板の内部に形成されるようにしてもよいし、請求項３に示すように基板の表面である電極外に形成されるようにしてもよい。さらに、加熱部は、請求項４に示すように基板の表面であり電極間に形成されるようにしてもよい。   Further, the heating unit may be formed inside the substrate as shown in claim 2 or may be formed outside the electrode which is the surface of the substrate as shown in claim 3. . Furthermore, as shown in claim 4, the heating part may be formed on the surface of the substrate and between the electrodes.

特に、請求項４に示すように、加熱部を基板の表面であり電極間に形成することによって、感湿膜の近傍に加熱部を配置することが可能となり、効率的に感湿膜を加熱することができる。また、請求項２又は請求項３に示すように、加熱部を基板内部又は基板表面における電極外に設けることによって、電極間に加熱部を設ける場合に比べて検出感度を向上させることができる。   In particular, as shown in claim 4, by forming the heating part on the surface of the substrate and between the electrodes, it becomes possible to dispose the heating part in the vicinity of the moisture sensitive film and efficiently heat the moisture sensitive film. can do. Further, as shown in claim 2 or claim 3, by providing the heating part inside the substrate or outside the electrode on the substrate surface, the detection sensitivity can be improved as compared with the case where the heating part is provided between the electrodes.

また、請求項５に示すように、熱分離部は、筐体と基板との間に配置される空気層とすることができる。このようにすることによって、特別に部材を用意することなく筐体と基板とを熱的に分離することができ、効率的に感湿膜を加熱することができる。   Moreover, as shown in claim 5, the heat separation part can be an air layer disposed between the housing and the substrate. By doing in this way, a housing | casing and a board | substrate can be thermally isolate | separated without preparing a member specially, and a moisture sensitive film | membrane can be heated efficiently.

具体的には、請求項６に示すように、基板は、筐体に対向する面であり感湿膜に対応する領域に基板側凹部を備えることによって筐体と基板との間に熱分離部である空気層を構成することができる。また、請求項７に示すように、筐体は、基板に対向する面であり感湿膜に対応する領域に筐体側凹部を備えることによっても筐体と基板との間に熱分離部である空気層を構成することができる。このように、感湿膜に対応する領域に熱分離部である空気層を構成することによって、効率よく筐体と基板とを熱的に分離することができ、より一層効率的に感湿膜を加熱することができる。   Specifically, as shown in claim 6, the substrate is a surface facing the housing and includes a substrate-side concave portion in a region corresponding to the moisture-sensitive film, so that the heat separating unit is provided between the housing and the substrate. An air layer can be formed. Moreover, as shown in claim 7, the housing is a surface that faces the substrate, and is provided with a housing-side concave portion in a region corresponding to the moisture-sensitive film, and is also a heat separation portion between the housing and the substrate. An air layer can be constructed. In this way, by forming the air layer that is the heat separation part in the region corresponding to the moisture sensitive film, the housing and the substrate can be efficiently thermally separated, and the moisture sensitive film is more efficiently produced. Can be heated.

さらに、請求項８に示すように、基板と筐体とは、複数の柱状部材を介して形成することによっても筐体と基板との間に熱分離部である空気層を構成することができる。このようにすることによって、感湿膜に対応する領域に熱分離部である空気層を構成する場合よりも、効率的に感湿膜を加熱することができると共に、基板と筐体とを安定した取付け状態とすることができる。   Furthermore, as shown in claim 8, the substrate and the case can be formed through a plurality of columnar members to form an air layer that is a heat separating portion between the case and the substrate. . In this way, the moisture sensitive film can be heated more efficiently and the substrate and the housing can be more stable than when an air layer that is a heat separation unit is configured in a region corresponding to the moisture sensitive film. The installed state can be obtained.

また、柱状部材としては、請求項９に示すように基板に形成された基板側突起としてもよいし、請求項１０に示すように筐体に形成された筐体側突起としてもよい。   The columnar member may be a substrate-side protrusion formed on the substrate as shown in claim 9 or a housing-side protrusion formed on the housing as shown in claim 10.

また、請求項１１に示すように、筐体は、外部装置に電気的に接続される外部接続端子を備えるものであり、柱状部材は、導電性部材からなり、電極と外部接続端子とに電気的に接続されるようにしてもよい。   According to another aspect of the present invention, the housing includes an external connection terminal that is electrically connected to an external device, and the columnar member is made of a conductive member, and is electrically connected to the electrode and the external connection terminal. May be connected to each other.

このようにすることによって、筐体と基板との間に熱分離部である空気層を構成して効率的に感湿膜を加熱することができると共に、ボンディングワイヤなどを用いることなく湿度検出装置と外部装置とを電気的に接続することができる。   By doing so, an air layer which is a heat separation part can be formed between the housing and the substrate to efficiently heat the moisture sensitive film, and the humidity detecting device without using a bonding wire or the like And an external device can be electrically connected.

また、請求項１２に示すように、熱分離部は、筐体と基板との間に配置される断熱部材としてもよい。このようにすることによって、基板と筐体とを安定した取付け状態とすることができると共に、加熱部が発生する熱が筐体に逃げることを抑制でき、効率的に感湿膜を加熱することができる。   According to a twelfth aspect of the present invention, the heat separating unit may be a heat insulating member disposed between the housing and the substrate. By doing in this way, while being able to make a board | substrate and a housing | casing into the stable attachment state, it can suppress that the heat | fever which a heating part generate | occur | produces to a housing | casing, and heats a moisture sensitive film efficiently. Can do.

具体的には、請求項１３に示すように、基板は、筐体に対向する面であり感湿膜に対応する領域に基板側凹部を備え、断熱部材は、基板側凹部と筐体との間に配置されるようにすることによって、筐体と基板との間に熱分離部である断熱部材を配置することができる。また、請求項１４に示すように、筐体は、基板に対向する面であり感湿膜に対応する領域に筐体側凹部を備え、断熱部材は、筐体側凹部と基板との間に配置されるようにすることによっても、筐体と基板との間に熱分離部である断熱部材を配置することができる。   Specifically, as shown in claim 13, the substrate is a surface facing the housing and includes a substrate-side recess in a region corresponding to the moisture sensitive film, and the heat insulating member is formed between the substrate-side recess and the housing. By arrange | positioning between, the heat insulation member which is a heat separation part can be arrange | positioned between a housing | casing and a board | substrate. In addition, according to a fourteenth aspect, the casing includes a casing-side recess in a region corresponding to the moisture-sensitive film that is a surface facing the substrate, and the heat insulating member is disposed between the casing-side recess and the substrate. By doing so, it is also possible to dispose a heat insulating member as a heat separating portion between the housing and the substrate.

さらに、請求項１５に示すように、断熱部材は、筐体と基板とが対向する領域全面に配置されるようにしてもよい。このようにすることによって、断熱部材を感湿膜に対応する領域に配置する場合よりも、より一層加熱部が発生する熱が筐体に逃げることを抑制でき、効率的に感湿膜を加熱することができる。   Furthermore, as shown in claim 15, the heat insulating member may be disposed over the entire region where the housing and the substrate face each other. By doing so, it is possible to suppress the heat generated by the heating unit from escaping to the housing more efficiently than when the heat insulating member is disposed in the region corresponding to the moisture sensitive film, and efficiently heat the moisture sensitive film. can do.

また、請求項１６に示すように、断熱部材は、筐体と基板との間の複数個所に配置されるようにしてもよい。このようにすることによって、筐体と基板との間には、空気層と断熱部材とが形成されることとなり、断熱部材を筐体と基板とが対向する領域全面に配置する場合よりも、より一層加熱部が発生する熱が筐体に逃げることを抑制でき、効率的に感湿膜を加熱することができる。   According to a sixteenth aspect of the present invention, the heat insulating member may be disposed at a plurality of locations between the housing and the substrate. By doing so, an air layer and a heat insulating member are formed between the housing and the substrate, and than when the heat insulating member is disposed over the entire region where the housing and the substrate face each other, The heat generated by the heating unit can be further prevented from escaping to the housing, and the moisture sensitive film can be efficiently heated.

以下、本発明の実施の形態を図に基づいて説明する。図１は、本発明の実施の形態における湿度検出装置の概略構成を示す図面であり、（ａ）は平面図であり、（ｂ）は（ａ）のＡＡ断面図である。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1A and 1B are diagrams showing a schematic configuration of a humidity detection apparatus according to an embodiment of the present invention, in which FIG. 1A is a plan view and FIG. 1B is a cross-sectional view taken along line AA in FIG.

図１に示すように、本実施の形態における湿度検出装置１００は、筐体１、基板２、加熱部３、電極４、感湿膜５、ボンディングワイヤ６、端子７などを備える。   As shown in FIG. 1, the humidity detection apparatus 100 according to the present embodiment includes a housing 1, a substrate 2, a heating unit 3, an electrode 4, a moisture sensitive film 5, a bonding wire 6, a terminal 7, and the like.

基板２は、例えば、Ａｌ２Ｏ３などからなる絶縁基板である。そして、この基板２の内部には、後ほど説明する感湿膜５を加熱するための加熱部３を備える。この加熱部３は、酸化錫等の抵抗体が例えば蛇行する形状に配置され、この抵抗体の端部に通電するための電極（図示省略）が形成されている。 The substrate 2 is an insulating substrate made of, for example, Al 2 O 3 . And inside this board | substrate 2, the heating part 3 for heating the moisture sensitive film | membrane 5 demonstrated later is provided. The heating unit 3 is arranged in a shape in which a resistor such as tin oxide meanders, for example, and an electrode (not shown) for energizing the end of the resistor is formed.

感湿膜５を構成する高分子は、結露状態のような高湿度雰囲気で長く使用すると、吸湿により感湿膜の変形や流出を生じ易く、長期的な安定性に欠ける場合がある。又、水との吸着性が強いと湿度変化に対して電気的特性変化の感度が低下し、吸湿過程と乾燥過程で電気的特性変化のヒステリシスが生じて湿度コントロール性が不良となる場合がある。したがって、この加熱部３は、感湿膜５を加熱して乾燥させることによって、このような不具合を抑制するものである。   When the polymer constituting the moisture-sensitive film 5 is used for a long time in a high-humidity atmosphere such as a dew condensation state, the moisture-sensitive film is likely to be deformed or outflowed due to moisture absorption, and long-term stability may be lacking. Also, if the adsorptivity with water is strong, the sensitivity of the change in electrical characteristics with respect to changes in humidity is reduced, and hysteresis of the change in electrical characteristics may occur in the moisture absorption process and drying process, resulting in poor humidity controllability. . Therefore, this heating part 3 suppresses such a malfunction by heating and drying the moisture sensitive film 5.

また、半導体基板２の上面に、酸化シリコン膜などの絶縁膜（図示省略）を介して検出電極である一対の電極４（以下、検出電極４とも称する）が同一平面において、離間して対向配置されている。   In addition, a pair of electrodes 4 (hereinafter also referred to as detection electrodes 4), which are detection electrodes, are arranged on the upper surface of the semiconductor substrate 2 so as to face each other with an insulating film (not shown) such as a silicon oxide film spaced apart on the same plane. Has been.

電極４は、例えばアルミ、銅、金、白金、ｐｏｌｙＳｉ等の配線材料を基板２上に蒸着やスパッタリング等の手法によって付着させ、その後、フォトリソグラフィー処理により、櫛歯形状パターンにパターニングすることによって形成される。本実施形態において、検出電極４はアルミを用いて形成されている。また、電極４は、ボンディングワイヤ６を介して端子７に電気的に接続されている。そして、湿度検出装置１００は、出力を補正する補正回路や静電容量の変化量を検出するための信号処理回路等の外部装置（図示省略）と電気的に接続されている。   The electrode 4 is formed, for example, by attaching a wiring material such as aluminum, copper, gold, platinum, polySi, or the like on the substrate 2 by a technique such as vapor deposition or sputtering, and then patterning it into a comb-like pattern by photolithography. Is done. In the present embodiment, the detection electrode 4 is formed using aluminum. The electrode 4 is electrically connected to the terminal 7 through the bonding wire 6. The humidity detection device 100 is electrically connected to an external device (not shown) such as a correction circuit for correcting the output and a signal processing circuit for detecting the amount of change in capacitance.

電極４の形状は、特に限定されるものではないが、図１（ａ）に示すようにこのように、一対の電極４の形状として櫛歯形状を採用することにより、電極４の配置面積を小さくしつつ、互いに対向する面積を大きくすることができる。これにより、周囲の湿度変化に伴って変化する電極４間の静電容量の変化量が大きくなり、湿度検出装置１００の感度が向上する。   Although the shape of the electrode 4 is not particularly limited, the arrangement area of the electrode 4 can be reduced by adopting a comb shape as the shape of the pair of electrodes 4 as shown in FIG. The area facing each other can be increased while reducing the size. As a result, the amount of change in capacitance between the electrodes 4 that changes with changes in the surrounding humidity increases, and the sensitivity of the humidity detection device 100 is improved.

図１（ｂ）に示すように、少なくとも一対の電極４間を覆うように、例えばポリイミド系ポリマーからなる吸湿性を備えた感湿膜５が形成されている。感湿膜５は、ポリイミド系ポリマーをスピンコート法や印刷法にて塗布後、加熱硬化することにより形成することができる。   As shown in FIG. 1B, a moisture sensitive film 5 having a hygroscopic property made of, for example, a polyimide polymer is formed so as to cover at least the pair of electrodes 4. The moisture sensitive film 5 can be formed by applying a polyimide polymer by spin coating or printing and then heat curing.

感湿膜５中に水分が浸透すると、水分は比誘電率が大きいため、その浸透した水分量に応じて、感湿膜５の比誘電率が変化する。その結果、感湿膜５を誘電体の一部として検出電極４によって構成されるコンデンサの静電容量が変化する。したがって、湿度検出装置１００は、この静電容量の変化から湿度を検出することができる。   When moisture permeates into the moisture sensitive film 5, the relative permittivity of the moisture sensitive film 5 changes according to the amount of moisture permeated because the moisture has a large relative dielectric constant. As a result, the capacitance of the capacitor constituted by the detection electrode 4 with the moisture sensitive film 5 as a part of the dielectric changes. Therefore, the humidity detection apparatus 100 can detect humidity from the change in capacitance.

このように検出電極４、感湿膜５などが形成された基板２は、接着材（図示省略）などによって筐体１に取付けられる。この筐体１は、例えばＡＢＳ樹脂等のプラスチックからなる。この筐体１は、図１（ｂ）に示すように、箱形状をなすものであり、端子７がインサート成形されている。また、筐体１は、図１（ｂ）に示すように、基板２に対向する面、すなわち底部（基板２の取付面）に、基板２が取り付けられた際に基板２に形成された感湿膜５に対応する領域に筐体側凹部１ａが形成される。   The substrate 2 on which the detection electrode 4, the moisture sensitive film 5 and the like are thus formed is attached to the housing 1 by an adhesive (not shown) or the like. The housing 1 is made of plastic such as ABS resin. As shown in FIG. 1B, the housing 1 has a box shape, and terminals 7 are insert-molded. Further, as shown in FIG. 1B, the housing 1 has a feeling formed on the substrate 2 when the substrate 2 is attached to the surface facing the substrate 2, that is, the bottom (attachment surface of the substrate 2). A housing side recess 1 a is formed in a region corresponding to the wet film 5.

筐体側凹部１ａを設けることによって、基板２は、図１（ｂ）に示すように、筐体１に片持ち梁のように取り付けられることとなる。したがって、基板２を筐体１に取り付けた際に、基板２と筐体１との間に空間（空気層８）が構成される。このように、感湿膜５に対応する領域における基板２と筐体１との間に空気層８を構成することによって、感湿膜５に対応する領域における基板２と筐体１とを熱的に分離することができる。すなわち、この空気層８は、基板２と筐体１とを熱的に分離する熱分離部をなすものである。   By providing the housing-side recess 1a, the substrate 2 is attached to the housing 1 like a cantilever as shown in FIG. Therefore, when the substrate 2 is attached to the housing 1, a space (air layer 8) is formed between the substrate 2 and the housing 1. Thus, by forming the air layer 8 between the substrate 2 and the housing 1 in the region corresponding to the moisture sensitive film 5, the substrate 2 and the housing 1 in the region corresponding to the moisture sensitive film 5 are heated. Can be separated. That is, the air layer 8 forms a thermal separation part that thermally separates the substrate 2 and the housing 1.

このように、筐体１と基板２とを熱的に分離する空気層８を備えることによって、特別に部材を用意することなく加熱部３が発生する熱が筐体１に逃げることを抑制でき、効率的に感湿膜５を加熱することができる。したがって、感湿膜５を効率的に乾燥させることができる。特に、感湿膜５に対応する領域に空気層８を構成することによって、より一層効率的に感湿膜５を加熱することができる。   Thus, by providing the air layer 8 that thermally separates the housing 1 and the substrate 2, the heat generated by the heating unit 3 can be prevented from escaping to the housing 1 without preparing a special member. The moisture sensitive film 5 can be efficiently heated. Therefore, the moisture sensitive film 5 can be efficiently dried. In particular, by forming the air layer 8 in a region corresponding to the moisture sensitive film 5, the moisture sensitive film 5 can be heated more efficiently.

また、例えば図２に示すように、基板側に凹部を設けて空気層を構成するようにしてもよい。図２は、本発明の変形例１における湿度検出装置の概略構成を示す断面図である。この変形例１の場合、筐体１１の基板２１に対向する面、すなわち底部（基板２１の取付面）は、略平坦面とする。そして、基板２１は、感湿膜５が形成された面の裏面、すなわち筐体１１に対向する面であり、感湿膜５に対応する領域に基板側凹部２１ａを備える。このように空気層８１が形成されることで、加熱部３が発生する熱が筐体１１に逃げることを抑制でき、効率的に感湿膜５を加熱することができる。なお、変形例１においては、上述の実施の形態と同一箇所に関しては、同一の符号を付与して説明を省略する。   For example, as shown in FIG. 2, you may make it comprise an air layer by providing a recessed part in the board | substrate side. FIG. 2 is a cross-sectional view showing a schematic configuration of a humidity detection apparatus according to Modification 1 of the present invention. In the case of the first modification, the surface of the housing 11 facing the substrate 21, that is, the bottom portion (mounting surface of the substrate 21) is a substantially flat surface. The substrate 21 is the back surface of the surface on which the moisture sensitive film 5 is formed, that is, the surface facing the housing 11, and includes a substrate-side recess 21 a in a region corresponding to the moisture sensitive film 5. By forming the air layer 81 in this way, it is possible to suppress the heat generated by the heating unit 3 from escaping to the housing 11 and to efficiently heat the moisture sensitive film 5. In the first modification, the same portions as those in the above-described embodiment are given the same reference numerals and description thereof is omitted.

（変形例２）
また、例えば図３に示すように、複数の柱状部材によって空気層を構成するようにしてもよい。図３は、本発明の変形例２における湿度検出装置の概略構成を示す図面であり、（ａ）は、図１（ｂ）に対応する図面であり、（ｂ）は（ａ）のＢＢ断面図である。この変形例２の場合、筐体１２の基板２に対向する面、すなわち底部（基板２の取付面）における、基板２に対向する領域には、複数個所に筐体側突起１２ｂを備える。変形例２においては、図３（ｂ）に示すように、３箇所に筐体側突起１２ｂを備える。そして、基板２は、この筐体側突起１２ｂに接着材（図示省略）などによって取り付けられる。このように、基板２と筐体１２とを複数の柱状部材（筐体側突起１２ｂ）を介して形成することによっても、基板２と筐体１２との間に熱分離部である空気層８２を構成することができる。このようにすることによって、感湿膜５に対応する領域に空気層を構成する場合よりも、効率的に感湿膜を加熱することができると共に、基板２と筐体１２とを安定した取付け状態とすることができる。なお、変形例２においては、上述の実施の形態と同一箇所に関しては、同一の符号を付与して説明を省略する。 (Modification 2)
For example, as shown in FIG. 3, you may make it comprise an air layer by a some columnar member. FIG. 3 is a drawing showing a schematic configuration of a humidity detection device according to Modification 2 of the present invention, (a) is a drawing corresponding to FIG. 1 (b), and (b) is a BB cross section of (a). FIG. In the case of the second modification, the surface of the housing 12 facing the substrate 2, that is, the bottom (the mounting surface of the substrate 2), the region facing the substrate 2 is provided with housing-side protrusions 12b at a plurality of locations. In the modified example 2, as shown in FIG. 3B, the housing side protrusions 12b are provided at three locations. And the board | substrate 2 is attached to this housing | casing side protrusion 12b with an adhesive material (illustration omitted). As described above, the air layer 82 as a heat separation portion is also formed between the substrate 2 and the housing 12 by forming the substrate 2 and the housing 12 via the plurality of columnar members (housing-side protrusions 12b). Can be configured. Thus, the moisture sensitive film can be heated more efficiently than the case where the air layer is formed in the region corresponding to the moisture sensitive film 5, and the substrate 2 and the housing 12 can be stably attached. State. In the second modification, the same portions as those in the above-described embodiment are given the same reference numerals and description thereof is omitted.

（変形例３）
また、例えば図４に示すように、柱状部材を基板に設けるようにしてもよい。図４は、本発明の変形例３における湿度検出装置の概略構成を示す断面図である。この変形例３の場合、筐体１１の基板２２に対向する面、すなわち底部（基板２２の取付面）は、略平坦面とする。そして、基板２２における筐体１１と対向する面の複数個所に基板側突起２２ｂを設ける。このようにすることによっても、基板２２と筐体１１との間に熱分離部である空気層８２を構成することができる。なお、変形例３においては、上述の実施の形態と同一箇所に関しては、同一の符号を付与して説明を省略する。 (Modification 3)
For example, as shown in FIG. 4, a columnar member may be provided on the substrate. FIG. 4 is a cross-sectional view showing a schematic configuration of a humidity detection apparatus according to Modification 3 of the present invention. In the case of Modification 3, the surface of the housing 11 facing the substrate 22, that is, the bottom (mounting surface of the substrate 22) is a substantially flat surface. And the board | substrate side protrusion 22b is provided in several places of the surface facing the housing | casing 11 in the board | substrate 22. As shown in FIG. Also by doing in this way, the air layer 82 which is a heat separation part can be comprised between the board | substrate 22 and the housing | casing 11. FIG. In the third modification, the same portions as those in the above-described embodiment are denoted by the same reference numerals and the description thereof is omitted.

（変形例４）
また、例えば図５に示すように、柱状部材を断熱部材で設けるようにしてもよい。図５は、本発明の変形例４における湿度検出装置の概略構成を示す断面図である。この変形例４の場合、筐体１１の基板２に対向する面、すなわち底部（基板２の取付面）、及び、基板２における筐体１１と対向する面は、略平坦面とする。そして、筐体１１と基板２との間の複数個所に断熱部材９を配置する。このようにすることによって、筐体１１と基板２との間には、空気層８２と断熱部材９とが形成されることとなり、より一層加熱部３が発生する熱が筐体１１に逃げることを抑制でき、効率的に感湿膜を加熱することができる。なお、変形例４においては、上述の実施の形態と同一箇所に関しては、同一の符号を付与して説明を省略する。 (Modification 4)
Further, for example, as shown in FIG. 5, the columnar member may be provided by a heat insulating member. FIG. 5 is a cross-sectional view showing a schematic configuration of a humidity detection apparatus according to Modification 4 of the present invention. In the case of this modification 4, the surface of the housing 11 that faces the substrate 2, that is, the bottom (the mounting surface of the substrate 2), and the surface of the substrate 2 that faces the housing 11 are substantially flat surfaces. And the heat insulation member 9 is arrange | positioned in the several places between the housing | casing 11 and the board | substrate 2. FIG. By doing so, an air layer 82 and a heat insulating member 9 are formed between the casing 11 and the substrate 2, and heat generated by the heating unit 3 further escapes to the casing 11. And the moisture sensitive film can be efficiently heated. In the fourth modification, the same portions as those in the above-described embodiment are given the same reference numerals and description thereof is omitted.

（変形例５）
また、例えば図６に示すように、柱状部材を導電性部材で設けるようにしてもよい。図６は、本発明の変形例５における湿度検出装置の概略構成を示す断面図である。この変形例５の場合、筐体１１の基板２に対向する面、すなわち底部（基板２の取付面）、及び、基板２における筐体１１と対向する面は、略平坦面とする。そして、筐体１１と基板２との間の複数個所に導電性部材１０を配置する。さらに、２つの導電性部材１０は、基板２を貫通するスルーホール（図示省略）などによって電極４と電気的に接続されると共に、端子７とも電気的に接続される。このようにすることによって、筐体１１と基板２との間に熱分離部である空気層８２を構成して効率的に感湿膜を加熱することができると共に、ボンディングワイヤなどを用いることなく湿度検出装置１００と外部装置とを電気的に接続することができる。なお、変形例５においては、上述の実施の形態と同一箇所に関しては、同一の符号を付与して説明を省略する。 (Modification 5)
For example, as shown in FIG. 6, a columnar member may be provided by a conductive member. FIG. 6 is a cross-sectional view showing a schematic configuration of a humidity detection apparatus according to Modification 5 of the present invention. In the case of this modified example 5, the surface of the housing 11 that faces the substrate 2, that is, the bottom (the mounting surface of the substrate 2) and the surface of the substrate 2 that faces the housing 11 are substantially flat surfaces. Then, the conductive member 10 is disposed at a plurality of locations between the housing 11 and the substrate 2. Further, the two conductive members 10 are electrically connected to the electrode 4 through a through hole (not shown) penetrating the substrate 2 and are also electrically connected to the terminal 7. By doing in this way, the air layer 82 which is a heat separation part is comprised between the housing | casing 11 and the board | substrate 2, and while being able to heat a moisture sensitive film | membrane efficiently, without using a bonding wire etc. The humidity detection device 100 and an external device can be electrically connected. Note that in the fifth modification, the same portions as those in the above-described embodiment are given the same reference numerals and the description thereof is omitted.

（変形例６）
また、例えば図７に示すように、熱分離部を断熱部材としてもよい。図７は、本発明の変形例６における湿度検出装置の概略構成を示す断面図である。この変形例６の場合、筐体１は、基板２に対向する面、すなわち底部（基板２の取付面）に、基板２が取り付けられた際に基板２に形成された感湿膜５に対応する領域に筐体側凹部１ａが形成される。また、基板２における筐体１１と対向する面は、略平坦面とする。そして、基板２を筐体１に取り付けた際に、基板２と筐体１との間に空間に熱分離部である断熱部材８３を配置する。このようにすることによっても、加熱部３が発生する熱が筐体１に逃げることを抑制でき、効率的に感湿膜５を加熱することができる。なお、変形例６においては、上述の実施の形態と同一箇所に関しては、同一の符号を付与して説明を省略する。 (Modification 6)
Further, for example, as shown in FIG. 7, the heat separation part may be a heat insulating member. FIG. 7 is a cross-sectional view showing a schematic configuration of a humidity detection apparatus according to Modification 6 of the present invention. In the case of this modified example 6, the housing 1 corresponds to the moisture sensitive film 5 formed on the substrate 2 when the substrate 2 is attached to the surface facing the substrate 2, that is, the bottom (the attachment surface of the substrate 2). A housing-side recess 1a is formed in the area to be processed. Further, the surface of the substrate 2 facing the housing 11 is a substantially flat surface. And when the board | substrate 2 is attached to the housing | casing 1, the heat insulation member 83 which is a heat separation part is arrange | positioned in the space between the board | substrate 2 and the housing | casing 1. FIG. Also by doing in this way, it is possible to suppress the heat generated by the heating unit 3 from escaping to the housing 1, and the moisture sensitive film 5 can be efficiently heated. In the modified example 6, the same parts as those in the above-described embodiment are given the same reference numerals and the description thereof is omitted.

（変形例７）
例えば図８に示すように、筐体と基板とが対向する領域全面に断熱部材を配置してもよい。図８は、本発明の変形例７における湿度検出装置の概略構成を示す断面図である。この変形例６の場合、筐体１１の基板２に対向する面、すなわち底部（基板２の取付面）、及び、基板２における筐体１１と対向する面は、略平坦面とする。そして、筐体１１と基板２とが対向する領域全面に熱分離部である断熱部材８４を形成する。このようにすることによって、断熱部材を感湿膜に対応する領域に配置する場合よりも、より一層加熱部が発生する熱が筐体に逃げることを抑制でき、効率的に感湿膜を加熱することができる。なお、変形例７においては、上述の実施の形態と同一箇所に関しては、同一の符号を付与して説明を省略する。 (Modification 7)
For example, as shown in FIG. 8, a heat insulating member may be disposed over the entire region where the housing and the substrate face each other. FIG. 8 is a cross-sectional view showing a schematic configuration of a humidity detection apparatus according to Modification 7 of the present invention. In the case of the sixth modification, the surface of the housing 11 that faces the substrate 2, that is, the bottom (the mounting surface of the substrate 2) and the surface of the substrate 2 that faces the housing 11 are substantially flat surfaces. And the heat insulation member 84 which is a heat separation part is formed in the whole area | region where the housing | casing 11 and the board | substrate 2 oppose. By doing so, it is possible to suppress the heat generated by the heating unit from escaping to the housing more efficiently than when the heat insulating member is disposed in the region corresponding to the moisture sensitive film, and efficiently heat the moisture sensitive film. can do. In the modified example 7, the same parts as those in the above-described embodiment are given the same reference numerals and the description thereof is omitted.

（変形例８）
また、例えば図９に示すように、加熱部は電極間に設けるようにしてもよい。図９は、本発明の変形例８における湿度検出装置の概略構成を示す断面図である。図９に示すように、基板２３は、筐体１との対向面の裏面、すなわち電極４が形成される面であり、その電極４の間に加熱部３１を設ける。このようにすることによって、感湿膜５の近傍に加熱部３１を配置することが可能となり、効率的に感湿膜を加熱することができる。なお、変形例８においては、上述の実施の形態と同一箇所に関しては、同一の符号を付与して説明を省略する。 (Modification 8)
For example, as shown in FIG. 9, the heating unit may be provided between the electrodes. FIG. 9 is a cross-sectional view showing a schematic configuration of a humidity detection apparatus according to Modification 8 of the present invention. As shown in FIG. 9, the substrate 23 is the back surface opposite to the housing 1, that is, the surface on which the electrode 4 is formed, and the heating unit 31 is provided between the electrodes 4. By doing in this way, it becomes possible to arrange | position the heating part 31 in the vicinity of the moisture sensitive film | membrane 5, and a moisture sensitive film | membrane can be heated efficiently. In the modified example 8, the same portions as those in the above-described embodiment are given the same reference numerals and the description thereof is omitted.

なお、上述の実施の形態は、それぞれ個別で実施することも可能であるが、組み合わせて実施することも可能である。例えば、図１（ｂ）、図２に示す空気層８、８１に、柱状部材（筐体側突起、基板側突起など）を設けてもよい。また、基板２の表面であり電極４間に加熱部３１が設けられる変形例８を上述の実施の形態、変形例のいずれかに適用してもよい。   In addition, although the above-mentioned embodiment can also be implemented individually, it can also be implemented in combination. For example, columnar members (such as housing-side protrusions and substrate-side protrusions) may be provided in the air layers 8 and 81 shown in FIGS. Further, Modification 8 in which the heating unit 31 is provided between the electrodes 4 on the surface of the substrate 2 may be applied to any of the above-described embodiments and modifications.

また、上述の実施の形態においては、容量式の湿度検出装置を例として説明したが、本発明はこれに限定されるものではない。例えば、抵抗式の湿度検出装置であっても本発明の目的は達成できるものである。抵抗式の湿度検出装置の場合、感湿膜としては、湿度変化に応じて抵抗値が変化する高分子、例えばアミン系の高分子などを用いる。   In the above-described embodiment, the capacitive humidity detection device has been described as an example, but the present invention is not limited to this. For example, the object of the present invention can be achieved even with a resistance type humidity detecting device. In the case of a resistance-type humidity detection device, a polymer whose resistance value changes according to a change in humidity, such as an amine polymer, is used as the moisture sensitive film.

本発明の実施の形態における湿度検出装置の概略構成を示す図面であり、（ａ）は平面図であり、（ｂ）は断面図である。BRIEF DESCRIPTION OF THE DRAWINGS It is drawing which shows schematic structure of the humidity detection apparatus in embodiment of this invention, (a) is a top view, (b) is sectional drawing. 本発明の変形例１における湿度検出装置の概略構成を示す断面図である。It is sectional drawing which shows schematic structure of the humidity detection apparatus in the modification 1 of this invention. 本発明の変形例２における湿度検出装置の概略構成を示す断面図である。It is sectional drawing which shows schematic structure of the humidity detection apparatus in the modification 2 of this invention. 本発明の変形例３における湿度検出装置の概略構成を示す断面図である。It is sectional drawing which shows schematic structure of the humidity detection apparatus in the modification 3 of this invention. 本発明の変形例４における湿度検出装置の概略構成を示す断面図である。It is sectional drawing which shows schematic structure of the humidity detection apparatus in the modification 4 of this invention. 本発明の変形例５における湿度検出装置の概略構成を示す断面図である。It is sectional drawing which shows schematic structure of the humidity detection apparatus in the modification 5 of this invention. 本発明の変形例６における湿度検出装置の概略構成を示す断面図である。It is sectional drawing which shows schematic structure of the humidity detection apparatus in the modification 6 of this invention. 本発明の変形例７における湿度検出装置の概略構成を示す断面図である。It is sectional drawing which shows schematic structure of the humidity detection apparatus in the modification 7 of this invention. 本発明の変形例８における湿度検出装置の概略構成を示す断面図である。It is sectional drawing which shows schematic structure of the humidity detection apparatus in the modification 8 of this invention.

符号の説明Explanation of symbols

１，１１，１２ 筐体、１ａ 筐体側凹部、１２ｂ 筐体側突起（柱状部材）、２，２１，２２，２３ 基板、２１ａ 基板側凹部、２２ｂ 基板側突起（柱状部材）、３，３１ 加熱部、４ 電極、５ 感湿膜、６ ボンディングワイヤ、７ 端子、８，８１，８２ 空気層（熱分離部）、８３，８４ 断熱部材（熱分離部）、９ 断熱部材、１０ 導電性部材（柱状部材） 1, 11, 12 Housing, 1a Housing-side recess, 12b Housing-side projection (columnar member), 2, 21, 22, 23 Substrate, 21a Substrate-side recess, 22b Substrate-side projection (columnar member), 3,31 Heating unit 4, electrodes, 5 moisture-sensitive film, 6 bonding wires, 7 terminals, 8, 81, 82 air layer (heat separation part), 83, 84 heat insulation member (heat separation part), 9 heat insulation member, 10 conductive member (columnar shape) Element)

Claims (16)

筐体に取付けられる基板と、
前記基板上に設けられる一対の電極と、
少なくとも前記一対の電極間に形成され、湿度変化に応じて比誘電率及び抵抗値のいずれか一方が変化する感湿膜と、
前記基板に設けられるものであり、当該感湿膜を加熱する加熱部と、
前記筐体と前記基板とを熱的に分離する熱分離部と、
を備えることを特徴とする湿度検出装置。 A substrate attached to the housing;
A pair of electrodes provided on the substrate;
A moisture-sensitive film that is formed at least between the pair of electrodes, and changes one of a relative dielectric constant and a resistance value in accordance with a humidity change;
A heating unit that is provided on the substrate and heats the moisture sensitive film;
A thermal separation unit that thermally separates the housing and the substrate;
A humidity detection device comprising: 前記加熱部は、前記基板の内部に形成されることを特徴とする請求項１に記載の湿度検出装置。   The humidity detection apparatus according to claim 1, wherein the heating unit is formed inside the substrate. 前記加熱部は、前記基板の表面であり、前記電極外に形成されることを特徴とする請求項１に記載の湿度検出装置。   The humidity detection apparatus according to claim 1, wherein the heating unit is a surface of the substrate and is formed outside the electrode. 前記加熱部は、前記基板の表面であり、前記電極間に形成されることを特徴とする請求項１に記載の湿度検出装置。   The humidity detection apparatus according to claim 1, wherein the heating unit is a surface of the substrate and is formed between the electrodes. 前記熱分離部は、前記筐体と前記基板との間に配置される空気層であることを特徴とする請求項１乃至請求項４のいずれかに記載の湿度検出装置。   The humidity detection device according to claim 1, wherein the heat separation unit is an air layer disposed between the housing and the substrate. 前記基板は、前記筐体に対向する面であり前記感湿膜に対応する領域に基板側凹部を備えることを特徴とする請求項５に記載の湿度検出装置。   The humidity detection apparatus according to claim 5, wherein the substrate includes a substrate-side recess in a region facing the housing and corresponding to the moisture sensitive film. 前記筐体は、前記基板に対向する面であり前記感湿膜に対応する領域に筐体側凹部を備えることを特徴とする請求項５に記載の湿度検出装置。   The humidity detection apparatus according to claim 5, wherein the housing includes a housing-side recess in a region facing the substrate and corresponding to the moisture sensitive film. 前記基板と前記筐体とは、複数の柱状部材を介して形成されることを特徴とする請求項５又は請求項６に記載の湿度検出装置。   The humidity detection apparatus according to claim 5, wherein the substrate and the housing are formed via a plurality of columnar members. 前記柱状部材は、前記基板に形成された基板側突起であることを特徴とする請求項８に記載の湿度検出装置。   The humidity detection apparatus according to claim 8, wherein the columnar member is a substrate-side protrusion formed on the substrate. 前記柱状部材は、前記筐体に形成された筐体側突起であることを特徴とする請求項８に記載の湿度検出装置。   The humidity detection device according to claim 8, wherein the columnar member is a case-side protrusion formed on the case. 前記筐体は、外部装置に電気的に接続される外部接続端子を備えるものであり、前記柱状部材は、導電性部材からなり、前記電極と前記外部接続端子とに電気的に接続されることを特徴とする請求項８に記載の湿度検出装置。   The housing includes an external connection terminal electrically connected to an external device, and the columnar member is made of a conductive member and is electrically connected to the electrode and the external connection terminal. The humidity detection device according to claim 8. 前記熱分離部は、前記筐体と前記基板との間に配置される断熱部材であることを特徴とする請求項１乃至請求項４のいずれかに記載の湿度検出装置。   The humidity detection device according to claim 1, wherein the heat separation unit is a heat insulating member disposed between the housing and the substrate. 前記基板は、前記筐体に対向する面であり前記感湿膜に対応する領域に基板側凹部を備え、前記断熱部材は、前記基板側凹部と前記筐体との間に配置されることを特徴とする請求項１２に記載の湿度検出装置。   The substrate is a surface facing the housing and includes a substrate-side recess in a region corresponding to the moisture sensitive film, and the heat insulating member is disposed between the substrate-side recess and the housing. The humidity detection device according to claim 12, characterized in that: 前記筐体は、前記基板に対向する面であり前記感湿膜に対応する領域に筐体側凹部を備え、前記断熱部材は、前記筐体側凹部と前記基板との間に配置されることを特徴とする請求項１２に記載の湿度検出装置。   The housing includes a housing-side recess in a region facing the substrate and corresponding to the moisture sensitive film, and the heat insulating member is disposed between the housing-side recess and the substrate. The humidity detection device according to claim 12. 前記断熱部材は、前記筐体と前記基板とが対向する領域全面に配置されることを特徴とする請求項１２に記載の湿度検出装置。   The humidity detection device according to claim 12, wherein the heat insulating member is disposed over the entire region where the casing and the substrate face each other. 前記断熱部材は、前記筐体と前記基板との間の複数個所に配置されることを特徴とする請求項１２に記載の湿度検出装置。   The humidity detection device according to claim 12, wherein the heat insulating member is disposed at a plurality of locations between the housing and the substrate.
JP2006210288A 2006-08-01 2006-08-01 Humidity detector Expired - Fee Related JP4984723B2 (en)

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