JP2008037898A - Curable resin composition for inkjet, cured material of the same and printed circuit board by using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a curable resin composition for an ink jet, excellent in heat resistance and repeated coating property useful for the production of a printed circuit board, a cured material of the same and the printed circuit board by using the same. <P>SOLUTION: This curable resin composition for the inkjet is characterized by including (A) a bisarylnadiimide compound expressed by general formula (1) [wherein, R<SP>1</SP>is a 2-18C alkyl, an aryl or an aralkyl], (B) dispersion obtained by diluting silica or alumina fine particles having 5 to 100 nm mean particle diameter with a diluent and (C) the diluent, and having ≤150 mPa s viscosity at 25°C. The cured material formed by using the composition and the printed circuit board having a solder resist formed by using the composition are also provided. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a curable resin composition for inkjet that is useful as a solder resist or a marking ink material used in the production of printed wiring boards. Specifically, the cured coating film has a low viscosity and excellent heat resistance. The present invention relates to a curable resin composition for inkjet having good adhesion to a resist ink or marking ink applied later and excellent in overcoatability.

  At present, resist ink compositions for some consumer printed wiring boards and most industrial printed wiring boards, from the viewpoint of high accuracy and high density, form images by developing after irradiation with ultraviolet rays, heat and A liquid development type solder resist that is finish-cured (mainly cured) by light irradiation is used. In consideration of environmental problems, an alkali development type liquid solder resist using a dilute alkaline aqueous solution as a developing solution is mainly used. Examples of the alkali development type resist ink composition using such a dilute aqueous alkali solution include, for example, a carboxyl group-containing photosensitive resin obtained by adding an acid anhydride to a reaction product of a novolak type epoxy resin and an unsaturated group-containing monocarboxylic acid. , A resist ink composition comprising a photopolymerization initiator, a diluent and an epoxy resin is disclosed (for example, see Patent Document 1).

  However, these solder resist compositions are disadvantageous in that they are two-pack type due to the high reactivity of the carboxyl group-containing photosensitive resin and the epoxy resin, and therefore must be mixed and used within a few days before use. .

  In addition, these solder resist compositions require many processes such as coating, drying, exposure, development, and thermal curing. In these processes, a coating machine, a dryer, an exposure machine, a developing machine, and a thermal curing process. There is a drawback in that equipment such as a furnace is required and manufacturing costs are high.

  For this reason, it has been proposed to create a solder resist pattern by drawing with an inkjet printer and drying (see, for example, Patent Document 2). However, the viscosity of the ink for inkjet printing is as low as 10 to 150 mPa · s (25 ° C.), compared to the viscosity of 2,000 to 15,000 mPa · s (25 ° C.) for the screen printing method. Therefore, in such a method, the viscosity of the ink further decreases due to heat during drying, and blurring occurs, so that sufficient accuracy cannot be obtained and practical use has not been achieved.

  In addition, in order to reduce the viscosity, a composition using a low molecular weight compound, for example, an epoxy resin such as trimethylolpropane triglycidyl ether or triallyl isocyanurate (TAIC) as a diluent, has heat resistance and curability. There was a problem of lacking.

On the other hand, a cured coating formed using a solder resist is used to apply a resist ink or marking ink over the cured coating later for the purpose of repairing scratches in the coating or applying marking ink. There are many cases to do. For this reason, the solder resist cured film is required to have good adhesion to the resist ink or marking ink, but a conventional leveling agent or antifoaming agent such as an acrylic or silicon surfactant is included. Solder resists have the problem that the resist ink or marking ink to be overcoated is low in viscosity, so that the ink is repelled and pinholes are likely to occur, or the adhesiveness is not sufficient, so that it is easy to peel off during thermal curing. It was confirmed by the inventors.
JP 61-243869 (Claims) JP-A-7-263845 (Claims)

  The present invention has been developed in view of the above problems, and its main purpose is a low-viscosity curable resin composition for inkjet that is excellent in heat resistance and overcoatability useful for the production of printed wiring boards, And a cured product thereof and a printed wiring board using the cured product.

In order to achieve the above object, as a basic aspect of the present invention, (A) a bisallylnadiimide compound represented by the following general formula (1):

(Wherein R ¹ represents an alkyl group having 2 to 18 carbon atoms, an aryl group or an aralkyl group.), (B) Disperser obtained by dispersing silica or alumina fine particles having an average particle diameter of 5 to 100 nm in a diluent. John and (C) a curable resin composition for inkjet which contains a diluent and has a viscosity of 150 mPa · s or less at 25 ° C. are provided.

  As a preferred embodiment, the silica or alumina fine particles of the dispersion (B) are surface-treated with a silicone-based surface treatment agent.

  Moreover, as another suitable aspect, the curable resin composition for inkjets in which the diluent (C) is an organic solvent (C-1) and / or a polymerizable monomer (C-2) is provided. Here, it is more preferable that the polymerizable monomer (C-2) has an acryloyl group and / or a methacryloyl group.

As another embodiment, there is further provided (D) a curable resin composition for inkjet containing a bismaleimide compound represented by the following general formula (2).

Wherein, ^{R 2} represents an alkyl group, an aryl group or an aralkyl group having 2 to 32 carbon atoms.

  Further, according to another aspect of the present invention, the ink-jet curable resin composition is drawn in a desired pattern with an ink-jet printer and thermally cured, or is irradiated with ultraviolet rays and photocured and then further heat-cured. A cured product obtained and a printed wiring board having a solder resist made of these cured products are provided.

  The ink-jet curable resin composition of the present invention can be applied with an ink-jet printer because of its low viscosity, and is further cured by thermosetting the ink-jet curable resin composition of the present invention. Since the product is excellent in heat resistance, it can be used as a solder resist or marking ink for printed wiring boards. Thus, by forming a solder resist with an inkjet printer, productivity can be improved and it can also contribute to the cost reduction of a printed wiring board.

  Furthermore, by using the ink-jet curable resin composition of the present invention to form a solder resist with an ink-jet printer, the process can be simplified, productivity can be improved, and equipment maintenance costs can be reduced. Can be realized.

  Moreover, since the curable resin composition for inkjet of the present invention is excellent in overcoatability, repair such as repair of scratches on the cured coating film is easy, and pinholes and peeling are not easily caused in marking ink coating. .

  As a result of intensive studies to solve the above-mentioned problems, the present inventors have obtained (A) a bisallylnadiimide compound represented by the general formula (1), (B) silica having an average particle diameter of 5 to 100 nm, or In a state where the dispersion in which the alumina fine particles are dispersed in the diluent and the compound containing the (C) diluent maintain the characteristics such as heat resistance necessary for the solder resist and the marking ink used for the printed wiring board The viscosity can be 150 mPa · s or less at 25 ° C., which can be applied by inkjet, and the cured coating film made of the composition has excellent adhesion to resist ink and marking ink applied later. And the present invention has been completed.

  That is, the bisallyl nadiimide compound (A) represented by the general formula (1) is excellent in heat resistance and has a relatively low molecular weight, so that it is required to have low viscosity in addition to heat resistance. It is suitable as a thermosetting resin component constituting a resist ink or marking ink material. Furthermore, the bisallyl nadiimide compound (A) is generally used in the production of printed wiring boards from about 250 ° C. alone when used together with the optional bismaleimide compound (D). It becomes possible to make it 100-200 degreeC, Preferably it is 140-180 degreeC. Further, by using the bisallylnadiimide compound (A) in combination with the bismaleimide compound (D), the crystallinity of the bismaleimide compound (D) is lowered, and by adding a diluent (C), the viscosity is reduced. It becomes possible to provide a liquid composition having excellent storage stability.

  Furthermore, by adding a dispersion (B) in which silica or alumina fine particles having an average particle size of 5 to 100 nm are dispersed in a diluent, it is excellent in overcoatability, and at the same time has excellent leveling properties and excellent coating properties with little repelling. can get.

Hereinafter, each component of the curable resin composition for inkjet of the present invention will be described in detail.
First, the bisallyl nadiimide compound (A) used in the present invention has the following general formula (1):

(Wherein R ¹ represents an alkyl group having 2 to 18 carbon atoms, an aryl group, or an aralkyl group), and R ¹ is preferably represented by the following formula ( 3), (4) and (5):

Specific examples thereof include BANI-M, BANI-H, and BANI-X (all of which are product grade names) manufactured by Maruzen Petrochemical Co., Ltd.

  These bisallylnadiimide compounds (A) may be used alone or in combination of two or more, and the blending amount thereof is in the composition excluding the organic solvent used for the diluent (C) described later, The range which becomes 30-96 mass% is preferable.

  In addition, you may mix | blend monoallyl nadiimide with a dilution effect, for example, ANI-HP (product grade name) by Maruzen Petrochemical Co., Ltd. etc. as needed.

The bismaleimide compound (D) used in the present invention has the following general formula (2):

(In the formula, R ² represents an alkyl group having ^{2 to} 32 carbon atoms, an aryl group, or an aralkyl group.)
It is preferable that R ² is represented by the following formulas (6), (7), (8) and (9):

Specifically, BMI, BMI-70, BMI-80 (all are product grade names) manufactured by Kay Kasei Co., Ltd., BMI-1000, BMI manufactured by Daiwa Kasei Kogyo Co., Ltd. -3000, BMI-4000, BMI-5000 (all are product grade names).

  These bismaleimide compounds (D) may be used alone or in admixture of two or more, and the blending amount thereof is 4 to 45 parts by mass with respect to 100 parts by mass of the bisallylnadiimide compound (A), Preferably it is 15-35 mass parts. When the amount of the bismaleimide compound (D) is less than 4 parts by mass with respect to 100 parts by mass of the bisallylnadiimide compound (A), the curability is lowered, which is not preferable. On the other hand, when it exceeds 45 parts by mass with respect to 100 parts by mass of the bisallylnadiimide compound (A), the heat resistance and curability are lowered, the crystallinity is increased, and the inkjet nozzle is clogged. This is not preferable.

  In addition, if necessary, a monomaleimide compound having a diluting effect, such as phenylmaleimide or cyclohexylmaleimide, a polyfunctional maleimide compound derived from an aniline resin having an effect of improving curability, such as BMI-2000 (product grade name), etc. You may mix.

  In the present invention, the dispersion of silica or alumina fine particles having an average particle diameter in a specific range (B) is replaced with a conventional leveling agent or antifoaming agent such as an acrylic or silicon surfactant, Or it is used with these. As described above, by adding the dispersion (B), the adhesiveness with a resist ink or marking ink to be overcoated later on the cured coating film is improved, and a curable resin having excellent overcoatability. A composition can be obtained.

  This is because the resin composition to which the dispersion (B) of the present invention is added lowers the surface tension of the coating liquid (ink), but does not lower the surface tension of the coating film, as shown in the Examples below. This is thought to be caused by this.

  In the present invention, the average particle diameter of silica or alumina fine particles is 5 to 100 nm, preferably 10 to 30 nm. Such fine particles are preferably surface-treated with a silicone-based surface treatment agent in which silicone or silicone is modified with polyester, modified with polyether or the like, and the compatibility is controlled. The surface treatment agent is preferably one having a silanol group so as to strongly adsorb to silica or alumina fine particles, or one having an ethoxy group or a methoxy group that gives a silanol group by hydrolysis.

  As the surface treatment method, the silicone surface treatment agent may be sprayed while stirring the silica or alumina fine particles before dispersion, or may be added when the silica or alumina fine particles and the diluent are blended.

  The average particle size can be measured by measuring the particle size with a field emission SEM at 100,000 times using a laser scattering method or a laser Doppler electrophoresis method. preferable.

  In the present invention, the inorganic fine particles are added as a dispersion uniformly dispersed in a diluent. One of the advantages of adding the dispersion as a dispersion is that the secondary aggregation of the inorganic fine particles can be suppressed, and the resin It exists in being able to disperse | distribute uniformly in a composition. The diluent can be used without particular limitation, such as an organic solvent and a photopolymerizable monomer, as long as it can uniformly disperse silica and alumina. As specific examples of the organic solvent and the photopolymerizable monomer, In addition to PMA, TPGDA, and HDDA listed below, the compounds exemplified in the diluent (C) described below can be used.

  As such a dispersion (B), a well-known thing can be used. For example, BYK Chemie's NANOBYK-3650 (trade name) with silica fine particles dispersed in methoxypropyl acetate (PMA), tripropylene diacrylate (TPGDA), hexanediol diacrylate (HDDA), or PMA with alumina fine particles NANOBYK-3601, 3602, 3610 (trade names) in which NO is dispersed, NANOCRYL C145, C146, C350, C140, C150 (trade names) manufactured by Hanse-Chemie, in which silica fine particles are dispersed in a photopolymerizable monomer, and the like. Can be mentioned. These can be used alone or in combination of two or more. Among these, NANOBYK-3650 and NANOBYK-3610 in which fine particles surface-treated with silicone or a derivative thereof are dispersed are preferably used.

  The amount of the dispersion (B) is preferably 0.05 to 10 parts by mass, more preferably 0.1 to 5 parts by mass with respect to 100 parts by mass of the curable resin composition.

  As the diluent (C) used in the present invention, an organic solvent (C-1) and / or a polymerizable monomer (C-2) is used, and an acryloyl group and / or a polymerizable monomer (C-2) is used. Or what has a methacryloyl group is preferable.

  Examples of the organic solvent (C-1) include ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methylcarbitol, butylcarbi Toluene, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, tripropylene glycol monomethyl ether and other glycol ethers; ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl Carbitol acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether Seteto, esters such as propylene carbonate; octane, aliphatic hydrocarbons decane; petroleum ether, petroleum naphtha, and petroleum solvents such as solvent naphtha, organic solvents conventionally known can be used. These organic solvents can be used alone or in combination of two or more.

Examples of the polymerizable monomer (C-2) include styrene derivatives such as styrene, chlorostyrene, and α-methylstyrene; vinyl esters such as vinyl acetate, vinyl butyrate, and vinyl benzoate; vinyl isobutyl ether, vinyl-n-butyl ether. Vinyl ethers such as vinyl-t-butyl ether, vinyl-n-amyl ether, vinyl isoamyl ether, vinyl-n-octadecyl ether, vinyl cyclohexyl ether, ethylene glycol monobutyl vinyl ether, triethylene glycol monomethyl vinyl ether; acrylamide, methacrylamide, N-hydroxymethylacrylamide, N-hydroxymethylmethacrylamide, N-methoxymethylacrylamide, N-ethoxymethylacrylamide, N-but (Meth) acrylamides such as dimethyl acrylamide; allyl compounds such as triallyl isocyanurate, diallyl phthalate, diallyl isophthalate; 2-ethylhexyl (meth) acrylate, lauryl (meth) acrylate, isostearyl (meth) acrylate, 2 -Hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-methoxyethyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, butoxyethyl (meth) acrylate, methyltriglycol (Meth) acrylate, cyclohexyl acrylate, 2-ethylhexyl carbitol acrylate, 4-hydroxybutyl (meth) acrylate, isobornyl (meth) acrylate, metho Xylidiethylene glycol (meth) acrylate, ethoxydiethylene glycol (meth) acrylate, 3-methoxybutyl (meth) acrylate, methoxypropylene glycol (meth) acrylate, benzyl (meth) acrylate, phenoxyethyl (meth) acrylate, 1,3-butylene glycol Di (meth) acrylate, 1,5-pentanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6 Hexanediol di (meth) acrylate, 1,9 nonanediol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate 4- (meth) acryloyloxymethyl-2-methyl-2-ethyl-1,3-dioxolane, 4- (meth) acryloyloxymethyl-2-isobutyl-2-ethyl-1,3-dioxolane, 4- (meth) acryloyloxymethyl Ro-2-cyclohexyl 1,3-dioxolane, trimethylolpropane tri (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa ( Examples thereof include compounds having one or more acryloyl groups and / or methacryloyl groups in one molecule, such as (meth) acrylate and dipentaerythritol penta (meth) acrylate.

  Among these, compounds having 1 to 4 acryloyl groups and / or methacryloyl groups in one molecule are preferable, and compounds having a viscosity of 300 mPa · s or less at 25 ° C. are particularly preferable.

  These polymerizable monomers (C-2) may be used alone or in admixture of two or more.

  In addition, in this specification, (meth) acrylate is a term that collectively refers to acrylate, methacrylate, and mixtures thereof, and the same applies to other similar expressions.

  As a compounding quantity of these diluents (C), Preferably it is 25-1900 mass parts with respect to 100 mass parts of said bisallyl nadiimide compounds (A), More preferably, it is 40-400 mass parts. However, it is preferable that the compounding quantity of the polymerizable monomer (C-2) in all the diluents (C) is 25-200 mass parts with respect to 100 mass parts of bisallyl nadiimide compounds (A). When the blending amount of the diluent (C) is less than 25 parts by mass with respect to 100 parts by mass of the bisallylnadiimide compound (A), poor dissolution of the bisallylnadiimide compound (A) may occur. It is not preferable because it becomes too viscous to be applied. On the other hand, when the diluent (C) is the organic solvent (C-1) alone and the blending amount thereof exceeds 1900 parts by mass with respect to 100 parts by mass of the bisallylnadiimide compound (A), the solid content Therefore, it becomes difficult to ensure the film thickness. Moreover, when the compounding quantity of the polymerizable monomer (C-2) in all the diluents (C) exceeds 200 mass parts with respect to 100 mass parts of the said bisallyl nadiimide compound (A), it coats at the time of hardening. It is not preferable because the film easily breaks.

  In order to improve curability, the curable resin composition for inkjet of the present invention may contain a radical polymerization initiator (E) that generates radicals by irradiation with heat or active energy rays. As such radical polymerization initiator (E), known and conventional polymerization initiators excluding peroxides that oxidize metal surfaces such as copper foil can be used. For example, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl Benzoin and benzoin alkyl ethers such as ether; acetophenones such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone; 2-methyl-1 -[4- (methylthio) phenyl] -2-morpholino-propan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, N, N-dimethylamino Aminoacetophenones such as acetophenone; 2- Anthraquinones such as tilanthraquinone, 2-ethylanthraquinone, 2-t-butylanthraquinone, 1-chloroanthraquinone; 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-diisopropylthioxanthone, etc. Thioxanthones; ketones such as acetophenone dimethyl ketal and benzyl dimethyl ketal; benzophenones and xanthones such as benzophenone and 4,4′-bisdiethylaminobenzophenone; 2,4,6-trimethylbenzoyldiphenylphosphine oxide and 2-trichloro Halomethyl esters such as methyl-5-styryl-1,3,4-oxadiazole and 2-trichloromethyl-5- (p-cyanostyryl) -1,3,4-oxadiazole Sadiazole compounds; 2,4-bis (trichloromethyl) -6- (p-methoxy-phenylvinyl) -1,3,5-triazine, 2,4-bis (trichloromethyl) -6-p-methoxystyryl- and halomethyl-s-triazine compounds such as s-triazine and 2,4-bis (trichloromethyl) -6- (1-p-dimethylaminophenyl-1,3-butadienyl) -s-triazine.

  Furthermore, polymerization initiation aids such as tertiary amines such as N, N-dimethylaminobenzoic acid ethyl ester, N, N-dimethylaminobenzoic acid isoamyl ester, pentyl-4-dimethylaminobenzoate, triethylamine, triethanolamine, etc. An agent can be added.

  These radical polymerization initiators (E) may be used alone or in admixture of two or more, and the blending amount thereof is in the composition excluding the organic solvent (C-1) as the diluent (C). Furthermore, it is 10 mass% or less, Preferably it is 0.5-5 mass%. When the blending amount of the radical polymerization initiator (E) exceeds 10% by mass, the coating film characteristics are deteriorated, which is not preferable.

  Furthermore, the curable resin composition for inkjet according to the present invention includes, as necessary, guanamines such as dicyandiamide, o-tolylbiguanide, guanamine, acetoguanamine, benzoguanamine, and antioxidants such as melamine; anthraquinone type, perylene type Various additives such as organic pigments such as disazo, isoindoline, and phthalocyanine; antifoaming agents; adhesion-imparting agents; leveling agents; and pigment dispersants can also be blended.

  The compounding quantity of these additives is 5 mass parts or less with respect to 100 mass parts of non volatile matters of a resist composition. When the compounding amount of the additive exceeds 5 parts by mass, the viscosity of the resist composition is increased, which is not preferable because the ink jet coating property is deteriorated or the coating film property is deteriorated.

  The ink-jet curable resin composition of the present invention obtained by blending the above components is uniform using a stirrer or a disperser, for example, a disperser such as a roll mill, sand mill, ball mill, bead mill or attritor. Adjust until mixed.

  The curable resin composition for inkjet of the present invention thus obtained is 150 mPa · s or less, preferably 110 to 5 mPa · s at 25 ° C. with a diluent (C) so that it can be applied with an inkjet printer. Adjust the viscosity.

  The ink-jet curable resin composition of the present invention thus adjusted is drawn in a desired pattern with an ink-jet printer on the surface of a printed wiring board on which a circuit is formed, and then at 100 to 200 ° C., preferably 140 to 180 ° C. The resist pattern which consists of hardened | cured material excellent in heat resistance etc. can be obtained by thermosetting for 10 to 60 minutes. In addition, a circuit was formed in the case of a composition in which the polymerizable monomer (C-2) was used as the diluent (C) and the radical polymerization initiator (E) that generated radicals upon irradiation with active energy rays was blended. After drawing a desired pattern on the surface of the printed wiring board with an ink jet printer, a pattern with less blurring can be formed by irradiating with an active energy ray such as ultraviolet rays and photocuring, and then further 100 to 200 after that. A resist pattern made of a cured product having excellent heat resistance can be obtained by heat curing at 10 ° C., preferably 140 to 180 ° C. for 10 to 60 minutes.

  As the ink jet printer, an on-demand piezo ink jet printer is preferably used, and the nozzle can be applied at a room temperature or about 60 ° C. or less.

  Moreover, as the irradiation light source of the active energy ray, a low pressure mercury lamp, a medium pressure mercury lamp, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a xenon lamp, a metal halide lamp, or the like is suitable, and a laser beam or the like can also be used as the active energy ray.

  Thus, since a complicated process such as an alkali development type solder resist is not required, it is possible to provide a highly reliable printed wiring board at a low price and free from adhesion of an ionic substance or the like. .

  Hereinafter, the present invention will be specifically described with reference to examples and the like, but the present invention is not limited to these examples. In the following description, “part” means part by mass unless otherwise specified.

The blending components shown in Table 1 below were mixed and stirred, and filtered through a 1 μm filter to obtain a curable resin composition for inkjet.

After measuring the viscosity and surface tension of each of the curable resin compositions obtained as described above, the entire surface was printed on a printed wiring board (FR-4) formed with a circuit by an on-demand piezo ink jet printer. The coating was uniformly applied to a thickness of 20 μm, and the coating property was evaluated. After 2000 mJ / cm ² exposure in a UV conveyor furnace, it was thermally cured at 160 ° C. for 30 minutes in a hot-air circulating drying furnace. In the same manner, the obtained cured film was repeatedly applied to evaluate overcoatability. The results are shown in Table 2.

  The evaluation method of the performance test in Table 2 is as follows.

(1) Viscosity The viscosity of the curable resin composition for inkjet obtained as described above was measured at 23 ° C. using Viscomate VM-100A probe L manufactured by Vibrating Viscometer Co., Ltd.

(2) Ink surface tension Measured according to the platinum ring method using a dynamometer manufactured by Big Gardner.

(3) Surface tension of the coating film Kanto Kagaku Co., Ltd. Surface tension indicators of 27mN / m to 37mN / m are applied to the surface of the coating film with a cotton swab. Was recorded.

(4) Application property ○: There is no repelling pinhole, and it can be applied uniformly.

  X: A repelling pinhole has occurred.

(5) Overcoatability ○: There is no repelling pinhole and it can be applied uniformly.

  Δ: Repelling pinholes are partially generated.

  X: A repelling pinhole is intensely generated.

  From the results in Table 2, it was found that only Example 1 was excellent in overcoatability. When attention is paid to the surface tension, the surface tension of the ink in Example 1 is the same as that in Comparative Example 1, but the surface tension of the coating film is low, whereas the surface tension of the coating film is lower than in Comparative Examples 2 and 3. Although it is the same, it turns out that the surface tension of ink is low.

Claims (9)

(A) Bisallylnadiimide compound represented by the following general formula (1):

(Wherein R ¹ represents an alkyl group having 2 to 18 carbon atoms, an aryl group or an aralkyl group.), (B) Disperser obtained by dispersing silica or alumina fine particles having an average particle diameter of 5 to 100 nm in a diluent. A curable resin composition for inkjet, comprising John and a diluent (C) and having a viscosity of 150 mPa · s or less at 25 ° C.   The curable resin composition for inkjet according to claim 1, wherein the silica or alumina fine particles of the dispersion (B) are surface-treated with a silicone-based surface treatment agent.   The curable resin composition for inkjet according to claim 1 or 2, wherein the diluent (C) is an organic solvent (C-1) and / or a polymerizable monomer (C-2).   The curable resin composition for inkjet according to claim 3, wherein the polymerizable monomer (C-2) is a polymerizable monomer having an acryloyl group and / or a methacryloyl group. Further, (D) a bismaleide compound represented by the following general formula (2):

(In the formula, R ² represents an alkyl group having ^{2 to} 32 carbon atoms, an aryl group, or an aralkyl group.)
The curable resin composition for inkjet according to any one of claims 1 to 4, comprising:   Hardened | cured material obtained by apply | coating the curable resin composition for inkjets of any one of Claims 1 thru | or 5 with an inkjet printer, and thermosetting.   A cured product obtained by applying the curable resin composition for inkjet according to claim 3 or 4 with an inkjet printer, irradiating it with ultraviolet rays and photocuring it, and then thermally curing it.   The printed wiring board which has a soldering resist obtained by apply | coating the curable resin composition for inkjets of any one of Claim 1 thru | or 5 to a soldering resist pattern with an inkjet printer, and thermosetting.   The printed wiring which has the soldering resist obtained by apply | coating the curable resin composition for inkjets of Claim 3 or 4 to a soldering resist pattern with an inkjet printer, irradiating an ultraviolet-ray and carrying out photocuring, and also thermosetting Board.