JP2008033998A - Disk device equipped with cooling mechanism - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress heat generation from electronic components mounted on a circuit board utilizing a clamper which clamps and rotates a disk. <P>SOLUTION: The circuit board 4 is mounted on the tops of side wall parts 5B and 5B while bridging between them, and the clamper 10 is mounted to the circuit board 4. Cooling fins 15 are formed integrally with the clamper 10 and when the clamper 10 is rotated, the cooling fins 15 are rotated to generate a stream of air to release the heat radiated from the electronic components 7. Thus, the heat does not fill the surrounding of the electronic components 7, so that a cooling effect can be improved. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a disk device that records / reproduces a disk by irradiating the recording surface of the disk with laser light, and in particular, heat generated from an electronic component mounted on a circuit board using the rotation of a clamper that holds the disk. The present invention relates to a disk device including a cooling mechanism that is effectively suppressed.

  In recent years, disk devices are not limited to DVD players, CD players, etc., and are used in a television receiver body in response to various needs of users. These disk devices are becoming smaller and thinner year by year, and there is no space in the interior, and various devices and parts are mounted at high density, while the IC of the drive control circuit housed inside The heat generation density from electronic parts is increasing. For this reason, it has become an important issue to prevent malfunctions due to temperature rise in disk writing and reading operations.

  As such a heat dissipation structure of the disk device of the prior art, for example, in Patent Document 1, a circuit board is arranged in a housing of the disk device, and in order to suppress heat generation of an electronic component mounted on the circuit board, An electronic component is formed by projecting a shaft on the upper surface of a clamper that sandwiches the disk device, and integrally forming a rotating blade on the shaft, and generating air with the rotating blade to circulate air in the housing by rotating the clamper. A heat radiating structure in a disk device with enhanced heat radiating action is disclosed. In Patent Documents 2 and 3, fins are formed on a turntable on which a disk is placed for the purpose of preventing dust and dirt from adhering to the lens surface of the pickup, and when the turntable (disk) is rotated, A disk device that generates an airflow by fins is disclosed.

JP 2002-230962 A JP 2002-56663 A JP 2002-56664 A

  As described above, the disk devices disclosed in Patent Documents 1 to 3 can improve the cooling of electronic components on the circuit board or the dust-proof property of the pickup by using the rotation of the clamper or the turntable that holds the disk. In Document 1, not only the circuit board and the clamper are separated from each other, but also the circuit board is disposed in a tightly closed casing. It can be said that it is easy to go into a narrow housing, and as a result, the heat dissipation effect of the electronic component is low. The disk devices shown in Patent Documents 2 and 3 are mainly used for dust prevention to prevent dust and dust from adhering to the lens of the pickup, and even if they are used for cooling electronic components mounted on a circuit board, In Documents 2 and 3, since the fin is formed on the turntable, when the disc is placed, it is covered with the disc. Therefore, it is difficult to efficiently blow the wind by the fins formed on the turntable toward the electronic components mounted on the circuit board, and the wind by the fins can be blown to the electronic parts of the circuit board. However, there is a problem that the structure becomes extremely complicated and the production cost increases.

  The present invention has been made in view of the above-described problems, and a disk device provided with a cooling mechanism capable of enhancing the cooling effect of electronic components by directly sending air to the electronic components mounted on a circuit board. The purpose is to provide.

  A disk device provided with the cooling mechanism according to claim 1, a turntable on which a disk conveyed inside the disk device is mounted and rotationally driven, a clamper that holds the disk opposite to the turntable, and A disk device comprising a circuit board for controlling the disk device and a frame for assembling these components, wherein a circuit board for mounting various electronic components is arranged on the upper surface side of the frame, and the upper surface side of the frame The clamper is disposed in the vicinity of the electronic component, the cooling fin is integrally formed with the clamper, and the flow of air for cooling the electronic component is generated by the rotation of the cooling fin by the rotation of the clamper. It is configured as described above.

  According to the first aspect of the present invention, the disk is transported into the frame by the transport mechanism, and the disk stops in a state where the center of the disk is disposed on the turntable. The turntable moves upward in a state where the disk is placed in conjunction with the movement operation of the disk, and the disk is held between the clamper and the turntable. Then, the turntable is rotated, the recording surface of the rotated disk is irradiated with laser light from the pickup unit, and the laser light reflected from the recording surface of the disk is received by the pickup unit so that it is recorded in advance on the disk. Information is read and reproduced, or information is recorded on the disc. At this time, the clamper rotates in unison with the turntable via the disk, and an air flow is generated by the cooling fins by the rotation of the clamper. Since the electronic component mounted on the circuit board and the clamper are arranged close to each other, the air flow generated by the cooling fins directly acts on the electronic component mounted on the circuit board and is mounted on the circuit board. The heat is efficiently dissipated without causing heat around the electronic component.

  According to a second aspect of the present invention, there is provided a disk device having the cooling mechanism according to the first aspect, wherein the clamper is mounted on the circuit board.

  According to the configuration of claim 2, by mounting the clamper on the circuit board, the electronic component mounted on the circuit board and the clamper can be arranged on the same plane in a state of being close to each other. This air can be directly blown to the electronic components on the circuit board.

  A disk device comprising the cooling mechanism according to claim 3 is the disk device comprising the cooling mechanism according to claim 1, wherein a support plate is constructed on the upper surface side of the frame, and the clamper is mounted on the support plate. The circuit board is disposed adjacent to the support plate.

  According to the configuration of the third aspect, even when the clamper and the circuit board are separately attached to the frame, the electronic components mounted on the circuit board and the clamper can be arranged in a state of being close to each other.

  The disk device provided with the cooling mechanism according to claim 4 is the disk device provided with the cooling mechanism according to any one of claims 1 to 3, wherein the clamper includes a pressing portion for holding the disk, It has a plurality of fixing claws and a plurality of cooling fins that are integrally formed on the presser part, and is integrally formed of synthetic resin.

  According to the configuration of the fourth aspect, the plurality of locking claws formed on the presser portion can be elastically locked to the circuit board or support attached to the frame, and can be attached by the cooling fin formed on the clamper. The electronic components mounted on the circuit board can be efficiently cooled.

  According to the disk device provided with the cooling mechanism of the first aspect of the present invention, the turntable on which the disk conveyed inside the disk device is placed and driven to rotate, and the disk is sandwiched so as to face the turntable. A disk device including a clamper, a circuit board for controlling the disk device, and a frame for assembling these components, and disposing a circuit board for mounting various electronic components on the upper surface side of the frame, Air that is positioned on the upper surface side of the frame and that is disposed in the vicinity of the electronic component, that has a cooling fin integrally formed with the clamper, and that cools the electronic component by rotation of the cooling fin caused by rotation of the clamper Since the configuration is configured to generate the flow of the electronic component, the periphery of the electronic component mounted on the circuit board is in an open state, During rotation of the disk, it is possible to dissipate heat emanating from the electronic components by rotating the clamper by the air from the cooling fins to be formed on the clamper effective. Thereby, it is possible to prevent deterioration of the electronic component due to heat without causing heat around the electronic component.

  According to the disk device having the cooling mechanism of claim 2, in the disk device having the cooling mechanism of claim 1, since the clamper is mounted on the circuit board, the clamper and the circuit board are mounted. The electronic components can be arranged as close as possible, and the heat dissipated from the electronic components can be effectively dissipated.

  According to the disk device having the cooling mechanism of claim 3, a support plate is installed on the upper surface side of the frame, the clamper is mounted on the support plate, and the circuit board is disposed adjacent to the support plate. Therefore, even if the clamper and the circuit board are separately attached to the frame, the air can be efficiently blown to the electronic component mounted on the circuit board.

  According to the disk device provided with the cooling mechanism of claim 4, the clamper includes a pressing portion that holds the disk, and a plurality of fixing claws and a plurality of cooling fins that are integrally formed with the pressing portion. The clamper can be easily molded on the circuit board or the support plate attached to the frame by a plurality of locking claws, and the clamper can be easily molded. The electronic components mounted on the circuit board can be efficiently cooled by the cooling fins formed on the substrate.

  Specific embodiments of the present invention will be described below with reference to the accompanying drawings. The following embodiment is one form when the present invention is embodied, and is not intended to limit the present invention within the scope thereof.

  1 to 3 show a first embodiment of the present invention, FIG. 1 is a perspective view of a disk device showing a state where a circuit board is removed from a frame, FIG. 2 is a cross-sectional view showing a state where a disk is held, and FIG. It is a top view of a clamper. As shown in the figure, the disk device 1 of this embodiment includes a tray 2 for loading / unloading a disk a, a turntable 3 for rotating the disk, and a pickup lens provided so as to be able to advance and retract in the radial direction of the disk a. (Not shown), a circuit board 4 on which a circuit for driving and controlling the disk device 1 is formed as a main component, and these main components are assembled to a frame 5 made of synthetic resin.

  The frame 5 includes a support frame 5A extending in the horizontal direction and side wall portions 5B integrally formed on the left and right sides of the support frame 5A. The tray 2 is a guide rail (not shown) formed on the inner surface of the side wall portion 5B. Along the frame 5 in the front-rear direction. In addition, the circuit board 4 on which various electronic components 7 are mounted is provided between the side wall portions 5B of the frame 5 so as to be positioned on the upper surface side of the frame 5.

  The turntable 3 is rotationally driven by a spindle motor 8 disposed substantially at the center of the frame 5, and a clamper 10 is fixed to the circuit board 4 so as to be positioned above the turntable 3. The disc a is sandwiched between the turntable 3 and the turntable 3, and the disc a is rotated. That is, the circuit board 4 is constructed between the side wall portions 5B of the frame 5 so as to cover the upper side of the turntable 3, and an opening 11 for mounting the clamper 10 is formed facing the turntable 3.

  The clamper 10 is made of a synthetic resin, is opposed to the turntable 3 and has a disc-shaped presser part 12 that sandwiches the disk a, and is positioned near the outer periphery of the presser part 12 and is engaged with the opening part 11. It is composed of three locking claws 13, a trapezoidal convex portion 14 protruding from the center of the presser portion 12, and a plurality of cooling fins 15 extending radially from the convex portion 14 toward the outer periphery of the presser portion 12. ing. A plate 16 serving as a balance weight is disposed on the convex portion 14, and a plurality of hook claws 17 for fixing the plate 16 are integrally formed on the peripheral portion of the convex portion. Then, as shown in FIG. 2, the engaging claw 13 formed on the clamper 10 is fitted into the opening 11 formed on the circuit board 4 from the lower side of the circuit board 4, and then the engaging claw 13 is elastically restored. Thus, the claw portion 13A at the tip of the locking claw 13 is locked to the circuit board 4. As a result, the clamper 10 is held on the circuit board 4. At this time, the distance between the claw portion 13 </ b> A that is locked to the circuit board 4 and the holding portion 12 of the clamper 10 is set wider than the thickness of the circuit board 4, and the clamper 10 is held with respect to the circuit board 4 so as to be movable up and down. Then, the plate 16 held by the hook claw 17 is held in a state where the locking claw 13 is hooked on the opening 11 of the circuit board 4.

  As shown in FIG. 3, the cooling fin 15 formed on the presser portion 12 is curved from the outer periphery of the presser portion 12 toward the convex portion 14 protruding from the center of the presser portion 12, and is caused by the rotation of the clamper 10. As the cooling fins 15 rotate, air flows radially from the clamper 10. Further, as described above, the clamper 10 is fitted into the opening 11 of the circuit board 4 from below the circuit board 4, so that the cooling fins 15 and the circuit board 4 do not interfere with each other as shown in FIG. The outer peripheral edge of each cooling fin 15 is notched into an L shape.

  The disk device 1 configured as described above transports the disk a into the frame 5 by the tray 2, and the tray 2 stops in a state where the center of the disk a is arranged on the turntable 3. The turntable 3 moves upward in a state where the disk a is placed by a cam (not shown) in conjunction with the movement operation of the tray 2, and the disk a is sandwiched between the clamper 10 and the turntable 3. Then, the turntable 3 is rotated by the spindle motor 8, the recording surface of the rotated disk a is irradiated with laser light from a pickup unit (not shown), and the laser light reflected from the recording surface of the disk a is received by the pickup unit. Thus, information recorded in advance on the disk a is read and reproduced, or information is recorded on the disk a. At this time, the clamper 10 rotates in unison with the turntable 3 via the disk a, and the cooling fin 15 is rotated by the rotation of the clamper 10, and an air flow is generated by the cooling fin 15. In addition, by mounting the clamper 10 on the circuit board 4, the clamper 10 and the electronic component 7 mounted on the circuit board 4 can be arranged as close as possible to each other, and the electronic component 7 mounted on the circuit board 4 can be arranged. By generating the air flow by the cooling fins 15 around the heat, the heat dissipated from the electronic component 7 mounted on the circuit board 4 is efficiently released to the outside without spreading around the electronic component 7, and due to the heat. Deterioration of the electronic component 7 can be prevented.

  As described above, in the present invention, the circuit board 4 is installed on the upper end portion of the side wall 5B of the frame 5 and the electronic component 7 is mounted on the upper surface side of the circuit board 4, so that the electronic component 7 is sealed. The clamper 10 and the electronic component 7 mounted on the circuit board 4 can be brought as close as possible by opening the clamper 10 directly to the circuit board 4 without opening to the outside. Therefore, when the disk a is rotated, the clamper 10 is rotated integrally with the disk a, and the cooling fin 15 formed on the clamper 10 is rotated, so that air is directly blown from the cooling fin 15 to the electronic component 7. The heat dissipated from the electronic component 7 can be effectively dissipated. Thereby, the cooling effect of the electronic component 7 can be enhanced without heat spreading around the electronic component 7, and the deterioration of the electronic component 7 due to heat can be prevented.

  FIG. 4 is a perspective view of a disk device showing a second embodiment of the present invention. In the present embodiment, portions having the same functions as those in the first embodiment are denoted by the same reference numerals, description of overlapping portions is omitted, and only different portions are described.

  In the first embodiment, the example in which the clamper 10 is mounted on the circuit board 4 has been shown. However, in this embodiment, the support plate 20 is integrally formed so as to span between the side wall portions 5B of the frame 5, and this support is supported. The clamper 10 is attached to the plate 20. Then, by installing the circuit board 4 between the side walls 5B of the frame 5 adjacent to the support plate 20, the cooling fins 15 are rotated by the rotation of the clamper 10 during the rotation of the disk a as in the first embodiment. By rotating and blowing air directly from the cooling fin 15 to the electronic component 7, it is possible to effectively dissipate the heat without spreading around the electronic component 7.

  As mentioned above, although one Example of this invention was explained in full detail, this invention is not limited to the said Example, A various deformation | transformation implementation is possible within the range of the summary of this invention. For example, the mounting structure of the clamper 10 and the shape or number of the cooling fins 15 may be selected as appropriate.

1 is a perspective view of a disk device showing a state where a circuit board showing Embodiment 1 of the present invention is removed from a frame. It is sectional drawing which shows the state which clamped the disk same as the above. It is a top view of a clamper same as the above. It is a perspective view of the disc apparatus which shows Example 2 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Disc apparatus 3 Turntable 4 Circuit board 5 Frame 5B Side wall part 7 Electronic component 10 Clamper 13 Locking claw 15 Cooling fin 20 Support plate a Disk

Claims (4)

  A turntable on which a disk conveyed inside the disk device is placed and driven to rotate, a clamper that holds the disk opposite to the turntable, a circuit board that controls the disk device, and these components A disk device including a frame to be assembled, wherein a circuit board on which various electronic components are mounted is disposed on an upper surface side of the frame, and is positioned on the upper surface side of the frame and in the vicinity of the electronic component. A cooling mechanism is provided, wherein a clamper is arranged, a cooling fin is integrally formed on the clamper, and a flow of air for cooling the electronic component is generated by the rotation of the cooling fin by the rotation of the clamper. Disk unit.   2. The disk device having a cooling mechanism according to claim 1, wherein the clamper is mounted on the circuit board.   The cooling mechanism according to claim 1, wherein a support plate is installed on an upper surface side of the frame, the clamper is mounted on the support plate, and the circuit board is disposed adjacent to the support plate. Disk unit. The clamper has a pressing portion for holding the disk, and a plurality of fixing claws and a plurality of cooling fins integrally formed on the pressing portion, and is integrally formed of a synthetic resin. Item 4. A disk device comprising the cooling mechanism according to any one of Items 1 to 3.

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