JP2008030329A - Manufacturing method for metal-foiled laminated plate, and metal-foiled laminated plate obtained by it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a metal-foiled laminated plate by which the metal-foiled laminated plate, which has an excellent bonding strength while being thin, and at the same time, is uniform for the overall surface and has a sufficient bending resistance, can be obtained, and to provide the metal-foiled laminated plate which is obtained by the manufacturing method. <P>SOLUTION: This manufacturing method is used for the metal-foiled laminated plate including a base material film 13, and a metal foil 11 which is laminated on the base material film 13 through an adherent layer having a thickness of 6 μm or lower consisting of an adhesive containing an urethane resin and an epoxy resin. The manufacturing method for the metal-foiled laminated plate includes an imparting process, a pasting process and a heat-pressing process. In this case, in the imparting process, the adhesive is imparted on one surface of the metal foil 11 and/or the base film 13. In the pasting process, the metal foil 11 and the base material film 13 are pasted through the adhesive to form a laminated body 15. In the heat-pressing process, the laminated body 15 is pinched by a pair of confronted metal plates 41 and is heated, and at the same time, the laminated body 15 is pressed through the metal plates 41. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for producing a metal foil-clad laminate and a metal foil-clad laminate obtained thereby.

  Conventionally, metal foil-clad laminates are used in electronic devices such as cameras, personal computers, and liquid crystal displays. In recent years, as electronic devices have been reduced in size and increased in density, development of thin metal foil-clad laminates that adapt to this and have higher adhesive strength and electrical properties than conventional metal foil-clad laminates has progressed. It has been.

For example, as a method for producing such a thin metal foil-clad laminate, an adhesive layer is formed on a heat-resistant film, a copper foil with a carrier is disposed on the surface of the adhesive layer, and the resulting laminate is heated. A method for producing a copper clad laminate is disclosed in which the adhesive layer in the laminate and the copper foil with a carrier are bonded to each other and the carrier is peeled off (see, for example, Patent Document 1).
According to this method, it is possible to obtain a copper clad laminate having excellent properties such as adhesive strength, moisture absorption characteristics, and heat resistance.

In addition, as a method for producing a thin metal foil-clad laminate that improves properties such as adhesive strength and electrical properties, a copper-clad laminate using a thermocompression-bonding aromatic polyimide layer and a high-heat-resistant aromatic polyimide layer And a method for producing a flexible metal foil polyimide laminate using a polyamic acid solution (see, for example, Patent Document 3).
JP 2002-316386 A JP 2004-42579 A JP 2005-271426 A

  However, in the conventional method for producing a metal foil-clad laminate including the method for producing a metal foil-clad laminate described in Patent Document 1 described above, since the laminate is thin when the laminate is pressed, It is difficult to press evenly. For this reason, the obtained metal foil-clad laminate tends to have a non-uniform adhesive strength over the entire surface.

  In addition, since the laminate is thin, even if it is pressed with a press roll or the like, for example, the pressure tends not to be sufficiently transmitted to the laminate. For this reason, it exists in the tendency for the adhesive strength of copper foil and a heat resistant film to become inadequate.

  Moreover, in the metal foil tension laminated board of the said patent documents 2 and 3, in addition to the subject mentioned above, since polyimide and polyamic acid are used as an adhesive agent, folding resistance becomes especially inadequate. For this reason, a metal foil-clad laminate using a cured polyimide or polyamic acid is often used when the metal foil-clad laminate is bent during installation when used in miniaturized and densified electronic devices. Electrical characteristics tend to be unstable.

  The present invention has been made in view of the above circumstances, and has a metal foil tension that can provide a metal foil tension laminate having excellent adhesive strength while being thin and uniform over the entire surface and having sufficient folding resistance. It aims at providing the manufacturing method of a laminated board, and the metal foil tension laminated board obtained by it.

  The inventors of the present invention have intensively studied to solve the above-mentioned problems, and by heating and pressing a thin laminate in which a metal foil and a base film are bonded together through an adhesive, the above-mentioned The present inventors have found that the problems can be solved and have completed the present invention.

  That is, the present invention provides a metal comprising: (1) a base film, and a metal foil laminated on the base film through an adhesive layer having a thickness of 6 μm or less made of an adhesive containing a urethane resin and an epoxy resin. A method for producing a foil-clad laminate, in which an application step of applying an adhesive to one side of a metal foil and / or a base film and a metal foil and a base film are bonded together via an adhesive A metal foil-clad laminate comprising: a laminating step, and a heating and pressing step in which the laminate is sandwiched between a pair of metal plates facing each other and heated, and simultaneously pressed through the pair of metal plates. Lies in the manufacturing method.

  The present invention provides (2) a metal foil tension comprising: a base film; and a metal foil laminated on the base film with an adhesive layer having a thickness of 6 μm or less made of an adhesive containing a urethane resin and an epoxy resin. It is a manufacturing method of a laminated board, Comprising: The grant process which gives an adhesive agent on both sides of metal foil and / or a substrate film, and pasting together metal foil and a substrate film via an adhesive agent to make a layered product A method for producing a metal foil-clad laminate comprising: a mating step; and a heating and pressing step in which the laminate is sandwiched between a pair of metal plates facing each other and heated, and simultaneously pressed through the pair of metal plates. Exist.

  The present invention further comprises (3) a cooling and pressing step in which the laminated body after the heating and pressing step is sandwiched between a pair of metal plates facing each other and cooled, and simultaneously pressed through the pair of metal plates. It exists in the manufacturing method of the metal foil tension laminated board as described in (1) or (2).

  In the (4) heating and pressing step, the present invention is characterized in that the laminate and the pair of metal plates are conveyed at the same speed while the laminate is held between the pair of metal plates. ) In the method for producing a metal foil-clad laminate.

  This invention exists in the manufacturing method of the metal foil tension laminated board of the said (3) description characterized by performing a cooling press process continuously, after performing a heat press process to (5) laminated bodies.

  The present invention resides in (6) the method for producing a metal foil-clad laminate as described in (1) or (2) above, wherein the pressing applies a hydraulic pressure or an air pressure directly to the metal plate.

  The present invention resides in (7) the method for producing a metal foil-clad laminate as described in (1) or (2) above, wherein the base film is a polyimide film or a polyamide film.

  The present invention provides (8) the metal foil-clad laminate as described in (1) or (2) above, wherein the weight mixing ratio of urethane resin and epoxy resin is 2: 1 to 5: 1 Lies in the way.

  The present invention resides in (9) the method for producing a metal foil-clad laminate as described in (1) or (2) above, wherein the metal plate is a stainless steel plate.

  In addition, as long as the objective of this invention is met, the structure which combined said (1)-(9) suitably is also employable.

  Moreover, this invention exists in the metal foil tension laminated board obtained by the manufacturing method as described in any one of (10) said (1)-(9).

According to the method for producing a metal foil-clad laminate of the present invention, the adhesive contains a urethane resin and an epoxy resin, and the thickness of the adhesive layer made of the adhesive is 6 μm or less. In addition, a metal foil-clad laminate having excellent adhesive strength, folding resistance, and flexibility can be obtained.
As described above, the metal foil-clad laminate obtained by the above-described manufacturing method is excellent in adhesive strength, folding resistance, and flexibility, and thus is suitably used for electronic devices that are miniaturized and densified.

  Moreover, in the said manufacturing method, since a laminated body is clamped between a pair of metal plates which face each other, and it heat-presses, it can press uniformly and can fully convey a pressure to a laminated body. Therefore, the obtained metal foil-clad laminate has a uniform adhesive strength over the entire surface. Moreover, according to the said manufacturing method, since a sticking process can be performed efficiently, productivity of a metal foil tension laminated board improves.

  Therefore, according to the said manufacturing method, the metal foil tension laminated board which is excellent in adhesive strength while being thin, is uniform in the whole surface, and has sufficient folding resistance can be obtained.

  In the method for producing a metal foil-clad laminate according to the present invention, if the laminate after the heating and pressing step is sandwiched between a pair of metal plates facing each other and provided with a cooling and pressing step for cooling and pressing, the resulting metal foil-clad laminate is Adhesive strength and folding resistance are further improved. Moreover, the productivity of the metal foil-clad laminate is also improved.

In the method for producing a metal foil-clad laminate of the present invention, when the laminate and the pair of metal plates are conveyed at the same speed while the laminate is sandwiched between the pair of metal plates, the heating and pressing step is continuously and efficiently performed. It can be carried out.
Moreover, when performing a cooling press process, a heating press process and a cooling press process can be performed using the same metal plate.

  In the method for producing a metal foil-clad laminate according to the present invention, after the heating and pressing step is performed on the laminate, the resulting metal foil-clad laminate is further improved in adhesive strength and folding resistance when subjected to a cooling and pressing step. It will be excellent. Moreover, the productivity of the metal foil-clad laminate is further improved.

  In the method for producing a metal foil-clad laminate of the present invention, if the pressing is to directly apply a hydraulic pressure or air pressure to the metal plate, the laminate can be pressed more uniformly and the pressure can be sufficiently applied to the laminate. Can tell. Therefore, in this case, the obtained metal foil-clad laminate has a more uniform adhesive strength over the entire surface.

  In the method for producing a metal foil-clad laminate of the present invention, when the substrate film is a polyimide film or a polyamide film, the resulting metal foil-clad laminate has more excellent heat resistance.

In the method for producing a metal foil-clad laminate of the present invention, when the weight mixing ratio of the urethane resin and the epoxy resin is 2: 1 to 5: 1, the resulting metal foil-clad laminate has excellent heat resistance and is flexible. Excellent tea.
The flexibility can be adjusted by adjusting the blending amount of an epoxy resin having excellent heat resistance based on a urethane resin having excellent flexibility.

  In the manufacturing method of the metal foil clad laminated board of this invention, since a metal plate is a stainless steel plate, it has the advantage that it is excellent in thermal conductivity and it is hard to rust.

  Since the metal foil-clad laminate of the present invention is obtained by the above-described manufacturing method, it is excellent in adhesive strength while being thin, uniform over the entire surface, and has sufficient folding resistance.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings as necessary. In the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted. Further, the positional relationship such as up, down, left and right is based on the positional relationship shown in the drawings unless otherwise specified. Further, the dimensional ratios in the drawings are not limited to the illustrated ratios.

[First Embodiment]
First, a first embodiment of the metal foil-clad laminate of the present invention will be described.
FIG. 1 is a cross-sectional view schematically showing an example of a metal foil-clad laminate according to the present embodiment.
As shown in FIG. 1, a metal foil-clad laminate 10 according to this embodiment includes a base film 13 and a metal foil laminated on one surface of the base film 13 with an adhesive layer 12 made of an adhesive. 11.
That is, the metal foil-clad laminate 10 has a metal foil 11, an adhesive layer 12, and a base film 13 laminated in this order.

  Examples of the metal used for the metal foil 11 include copper, aluminum, and silver. Among these, copper which is excellent in versatility is preferable.

The surface of the metal foil 11 on the adhesive layer 12 side is preferably a rough surface.
In this case, since the adhesive enters the rough portion of the metal foil 11, the metal foil-clad laminate 10 that is superior in adhesive strength can be obtained.

The adhesive layer 12 is obtained by curing the adhesive.
Such adhesives include urethane resins and epoxy resins. For this reason, the metal foil tension laminated board 10 excellent in adhesive strength, folding resistance, and flexibility is obtained.

In addition to urethane resin and epoxy resin, adhesives include melamine resin, phenol resin, unsaturated polyester resin, vinyl chloride resin, epoxy resin, phenol resin, polyimide resin, urea resin, acrylic resin, polyolefin resin, polyester Resin, polycarbonate resin, polyamide resin or urethane resin may be contained.
In addition, it is preferable that resin contained in an adhesive agent is halogen-free resin from a viewpoint of environmental conservation.
The adhesive may contain not only a resin but also a flame retardant, a light resistance improver, a conductor, a pigment, a filler, a crosslinking agent, and the like.

The weight mixing ratio of the urethane resin and the epoxy resin in the adhesive is preferably 2: 1 to 5: 1.
In this case, the heat resistance and flexibility (folding resistance, flexibility) of the metal foil-clad laminate 10 can be achieved by adjusting the blending amount of the epoxy resin having excellent heat resistance based on urethane resin having excellent flexibility. An excellent adhesive layer can be obtained.

  The thickness of the adhesive layer 12 is 6 μm or less, and preferably 1 to 6 μm. When the thickness is less than 1 μm, the adhesive strength between the metal foil 11 and the substrate film 13 may be insufficient, and when the thickness exceeds 6 μm, flexibility tends to be insufficient.

The material of the base film 13 is not particularly limited, but is preferably a polyimide film or a polyamide film from the viewpoint of heat resistance.
When the weight mixing ratio of the urethane resin and the epoxy resin described above is 2: 1 to 5: 1 and the material of the base film 13 is a polyimide film or a polyamide film, heat resistance and flexibility are particularly excellent. It becomes.

Next, a method for manufacturing the metal foil-clad laminate 10 according to this embodiment will be described.
The manufacturing method of the metal foil-clad laminate 10 according to the present embodiment includes an application step of applying an adhesive to at least one surface of the metal foil 11 and / or the base film 13, and bonding the metal foil 11 and the base film 13. A laminating step of laminating the laminated body through an agent, and sandwiching the laminated body between a pair of metal plates facing each other, heating the laminated body and simultaneously pressing the laminated body via the metal plate; A cooling and pressing step of cooling through the metal plate at the same time as cooling the laminated body after the heating and pressing step.

  According to the method for manufacturing the metal foil-clad laminate 10 according to the present embodiment, the metal foil-clad laminate 10 is obtained that is thin but has excellent adhesive strength and is uniform over the entire surface and has sufficient folding resistance. Can do.

Hereinafter, each step will be described in more detail.
(Granting process)
The application step is a step of applying an adhesive to at least one surface of the base film 13.

FIG. 2 is a schematic view schematically showing an example of the applying step in the method for manufacturing a metal foil-clad laminate according to the present embodiment.
As shown in FIG. 2, in the application step, the pair of first rolls 21 facing each other, the second roll 22 that contacts one of the first rolls 21, and the second roll 22 are provided with an adhesive. The applicator 23 is provided.
Further, the base film 13 is sandwiched between a pair of rolls facing the first roll 21.

  In the application step, when the adhesive is applied from the applicator 23 to the second roll 22, the second roll 22 rotates in the direction of arrow A. At this time, a part of the adhesive applied to the second roll 22 is transferred to the first roll 21 at the contact portion where the first roll 21 and the second roll 22 contact.

  And when the 1st roll 21 rotates, while the base film 13 which contacts the 1st roll 21 advances in the direction of arrow B, in the contact part of the base film 13 and the 1st roll 21, it is 1st. An adhesive is applied from the roll 21 to the base film 13.

  Thus, in the application step, since the first roll 21 and the second roll are used for applying the adhesive to the base film 13, the adhesive is uniformly applied to the surface of the base film 13. The

The amount of the adhesive applied at this time is adjusted so that the thickness of the adhesive layer 12 is 6 μm or less. Thereby, the metal foil-clad laminate 10 is sufficiently thin.
When the thickness of the adhesive layer 12 exceeds 6 μm, it tends to be unsuitable for electronic devices that are miniaturized and densified.

(Lamination process)
The bonding step is a step in which the metal foil 11 and the base film 13 are bonded together with an adhesive to form a laminate.

FIG. 3 is a schematic view schematically showing an example of a bonding step in the method for manufacturing a metal foil-clad laminate according to the present embodiment.
As shown in FIG. 3, in the bonding step, the third roll 31 around which the metal foil 11 is wound, the guide roll that guides the metal foil 11, and the metal foil 11 and the base film 13 are bonded together. And a pair of fourth rolls 32 facing each other.

In the bonding step, the metal foil 11 wound around the third roll 31 is guided to the fourth roll by the guide roll, and bonded to the base film 13 to which an adhesive has been applied.
In addition, the adhesive agent is provided to the bonding surface of the metal foil 11 and the base film 13 at this time.

(Heat pressing process)
The heating and pressing step is a step of sandwiching the laminate between a pair of metal plates facing each other, heating the laminate, and simultaneously pressing the laminate via the metal plate.

FIG. 4 is a schematic view schematically showing an example of a heating and pressing step in the method for manufacturing a metal foil-clad laminate according to the present embodiment.
As shown in FIG. 4, in the heating and pressing step, a pair of metal plates 41a facing each other is provided, and the laminated body 15 in which the metal foil 11 and the base film 13 are bonded in the bonding step is the pair of metal plates 41a. It is sandwiched between the metal plates 41a.

And the laminated body 15 and a pair of metal plate 41a are conveyed at the same speed, with the laminated body 15 being clamped between a pair of metal plates 41a.
At this time, the laminated body 15 is heated and pressed in the direction of the arrow on the surface in contact with the laminated body 15.
In addition, each metal plate 41a after the laminated body 15 is heated and pressed is guided in a loop shape by a plurality of guide rolls.

  Thus, since the laminated body 15 and the pair of metal plates 41a are conveyed at the same speed while the laminated body 15 is sandwiched between the pair of metal plates 41a, the heating and pressing step can be performed continuously and efficiently. it can.

Moreover, since the laminated body 15 is pressed simultaneously with heating, the bubble etc. which are contained in an adhesive agent are removed and the metal foil tension laminated board 10 which has a more stable electrical property is obtained.
In addition, when pressing the laminated body 15, it is preferable to deaerate simultaneously. In other words, it is preferable to press the laminate 15 in a reduced pressure atmosphere.
In this case, since the bubbles are reliably removed, the metal foil-clad laminate 10 having more stable electrical characteristics can be obtained.

  As described above, by performing the heating and pressing step on the laminate 15, the adhesive applied in the applying step is cured to become the adhesive layer 12, and then cooled, thereby the metal foil-clad laminate according to the present embodiment. A plate 10 is obtained.

Here, it is preferable that the pressing applies a hydraulic pressure or an air pressure directly to the metal plate 41a.
In this case, the laminate can be pressed more uniformly, and the pressure can be sufficiently transmitted to the laminate. Therefore, in this case, the obtained metal foil-clad laminate 10 has a more uniform adhesive strength over the entire surface.
In addition, it is preferable that the liquid of a hydraulic pressure or air of a pneumatic pressure has a thermal energy. In this case, the laminate 15 can be heated and pressed at a time. Specific examples include water vapor and the like.

As the metal plate 41a, iron, copper, silver, stainless steel, or the like can be used. Among these, it is preferable that the metal plate 41a is a stainless steel plate.
If the metal plate 41a is a stainless steel plate, it has the advantages of excellent thermal conductivity and resistance to rust.

  The heating temperature is preferably 100 to 200 ° C. from the viewpoint of heat resistance. Moreover, it is preferable that the pressure pressed at this time is 1.5-7.0 Mpa from a viewpoint of adhesive strength.

  As described above, in the method for manufacturing the metal foil-clad laminate 10 according to the present embodiment, the laminate 15 is sandwiched between the pair of metal plates 41a facing each other and heated and pressed in the heating and pressing step. And the pressure can be sufficiently transmitted to the laminate.

  Therefore, the obtained metal foil-clad laminate 10 has a uniform adhesive strength over the entire surface. Moreover, according to the said manufacturing method, since a sticking process can be performed efficiently, the productivity of the metal foil tension laminated board 10 improves.

(Cooling pressing process)
The cooling and pressing step is a step in which the laminated body after the heating and pressing step is sandwiched between a pair of metal plates facing each other, cooled and simultaneously pressed through the metal plate.

In the cooling and pressing step, the same device as the heating and pressing step described above is used.
FIG. 5 is a schematic view schematically showing an example of the cooling and pressing step in the method for manufacturing a metal foil-clad laminate according to the present embodiment.
As shown in FIG. 5, in the cooling and pressing step, similarly to the heating and pressing step described above, a pair of metal plates 41 b facing each other is provided, and the laminate 15 after the heating and pressing step includes the pair of metal plates 41 b. Is sandwiched between.

And the laminated body 15 and a pair of metal plate 41b are conveyed at the same speed, with the laminated body 15 being clamped between a pair of metal plates 41b.
At this time, the laminated body 15 is cooled and pressed in the direction of the arrow on the surface in contact with the laminated body 15.
In addition, each metal plate 41b after cooling and pressing the laminated body 15 is guided in a loop shape by a plurality of guide rolls.

  As described above, since the laminate 15 and the pair of metal plates 41b are conveyed at the same speed while the laminate 15 is sandwiched between the pair of metal plates 41b, the cooling and pressing step can be performed continuously and efficiently. it can.

Moreover, since the metal plate 41b is pressed simultaneously with cooling, the obtained metal foil-clad laminate 10 is maintained in a deaerated state, and the adhesive strength, folding resistance, and flexibility are further improved. Moreover, since it can cool in a short time, the productivity of the metal foil-clad laminate 10 is also improved.
In addition, when pressing the laminated body 15, it is preferable to deaerate simultaneously. In other words, it is preferable to press the laminate 15 in a reduced pressure atmosphere.
In this case, since the bubbles are more reliably removed, the metal foil-clad laminate 10 having more stable electrical characteristics can be obtained.

  In the method for manufacturing the metal foil-clad laminate 10 according to the present embodiment, it is preferable that the device for heating and pressing and the device for cooling and pressing are continuous and integrated. That is, it is preferable to manufacture the metal foil-clad laminate 10 using an apparatus having a heating pressing part and a cooling pressing part.

In this case, since the heating pressing process and the cooling pressing process can be performed continuously, the productivity of the metal foil-clad laminate 10 is further improved.
In addition, after giving the heating press process to the laminated body 15, it is preferable to give a cooling press process continuously. In this case, the obtained metal foil-clad laminate 10 is further excellent in adhesive strength, folding resistance, and flexibility.

The pressing is preferably performed by directly applying hydraulic pressure or air pressure to the metal plate 41b.
In this case, the laminate can be pressed more uniformly, and the pressure can be sufficiently transmitted to the laminate. Therefore, in this case, the obtained metal foil-clad laminate 10 has a more uniform adhesive strength over the entire surface.
In addition, it is preferable that the liquid of a hydraulic pressure or air of a pneumatic pressure takes away heat energy. In this case, the laminated body 15 can be cooled and pressed at a time. Specific examples include cold water.

As the metal plate 41b, iron, copper, silver, stainless steel, or the like can be used. Among these, it is preferable that the metal plate 41b is a stainless steel plate.
When the metal plate 41b is a stainless steel plate, it has an advantage that it is excellent in thermal conductivity and hardly rusts.
In addition, the metal plate 41b in the cooling and pressing step may be the same as or different from the metal plate 41a in the heating and pressing step described above.

  The cooling temperature is preferably 0 to 20 ° C. The pressure to be pressed at this time is preferably 1.5 to 7.0 MPa.

  Thus, the manufacturing method of the metal foil-clad laminate 10 according to the present embodiment presses more uniformly because the laminate 15 is sandwiched between the pair of metal plates 41b facing each other and cooled and pressed in the cooling and pressing step. And the pressure can be sufficiently transmitted by the laminate.

  Therefore, the obtained metal foil-clad laminate 10 has a more uniform adhesive strength over the entire surface. Moreover, according to the said manufacturing method, since an affixing process can be performed efficiently, the productivity of the metal foil tension laminated board 10 improves more.

As described above, the metal foil-clad laminate 10 according to the present embodiment is obtained.
Such a metal foil-clad laminate 10 is thin but has excellent adhesive strength and is uniform over the entire surface, and has sufficient folding resistance and flexibility.

The metal foil-clad laminate 10 obtained by the above manufacturing method is suitably used for electronic devices that are miniaturized and densified. Specifically, the metal foil-clad laminate 10 is used for electronic devices such as cameras, personal computers, and liquid crystal displays, and is particularly preferably used for electronic devices that are miniaturized and densified.
The metal foil-clad laminate 10 is also used as a printed wiring board by forming a conductor pattern by applying resist, exposing, etching, and the like. Such a printed wiring board has sufficient folding resistance while being thin.

[Second Embodiment]
Next, a second embodiment of the metal foil-clad laminate of the present invention will be described.
FIG. 6 is a cross-sectional view schematically showing an example of a metal foil-clad laminate according to this embodiment.
As shown in FIG. 6, a metal foil-clad laminate 20 according to this embodiment includes a base film 13 and a metal foil 11 laminated on both surfaces of the base film 13 with an adhesive layer 12 made of an adhesive. .
That is, the metal foil-clad laminate 20 is formed by laminating the metal foil 11, the adhesive layer 12, the base film 13, the adhesive layer 12, and the metal foil 11 in this order.

  As described above, the metal foil-clad laminate 20 according to the present embodiment is a metal foil-clad laminate according to the first embodiment in that the metal foil 11 is laminated on both surfaces of the base film 13 via the adhesive layer 12. Different from the plate 10.

Therefore, in the metal foil-clad laminate 20 according to the present embodiment, the metal foil 11 and the adhesive layer 12 are synonymous with the metal foil 11 and the adhesive layer 12 of the metal foil-clad laminate 10 according to the first embodiment described above. .
In the metal foil-clad laminate 20 according to this embodiment, the adhesive layer 12 and the metal foil 11 laminated on one surface of the base film 13 and the adhesive layer 12 and the metal foil 11 laminated on the other surface. Is not necessarily the same component.

Next, a method for manufacturing the metal foil-clad laminate 20 according to this embodiment will be described.
The manufacturing method of the metal foil-clad laminate 20 according to the present embodiment includes an applying step of applying an adhesive to both surfaces of the metal foil 11 and / or the base film 13, and the metal foil 11 and the base film 13 with the adhesive. A laminating process for laminating the laminated body, sandwiching the laminated body between a pair of metal plates facing each other, heating the laminated body, and simultaneously pressing the laminated body via the metal plate, heating A cooling and pressing step in which the laminated body after the pressing step is cooled and simultaneously pressed through a metal plate.

  According to the method for manufacturing the metal foil-clad laminate 20 according to the present embodiment, the metal foil-clad laminate 20 is obtained that is thin but has excellent adhesive strength and is uniform over the entire surface and has sufficient folding resistance. Can do.

Hereinafter, each step will be described in more detail.
(Granting process)
The application step is a step of applying an adhesive to both surfaces of the base film 13.

FIG. 7 is a schematic view schematically showing an example of the applying step in the method for manufacturing a metal foil-clad laminate according to the present embodiment.
As shown in FIG. 7, the application process according to the present embodiment includes a pair of first rolls 21 that face each other, a second roll 22 that contacts both rolls of the first roll 21, and a second roll 22, respectively. And an applicator 23 for applying an adhesive.
That is, it differs from the application | coating process in the manufacturing method of the metal foil tension laminated board 10 which concerns on 1st Embodiment by the point which equips the both sides of the base film 13 with the 2nd roll 22 and the application tool 23. FIG.

  Therefore, in the coating process according to the present embodiment, the adhesive is uniformly applied to both surfaces of the base film 13.

Note that the amount of adhesive applied at this time is adjusted so that the thickness of the adhesive layers 12 on both sides is 6 μm or less. Thereby, the metal foil-clad laminate 10 is sufficiently thin.
When the thickness of the adhesive layer 12 exceeds 6 μm, it tends to be unsuitable for electronic devices that are miniaturized and densified.

(Lamination process)
The bonding step is a step in which the metal foil 11 and the base film 13 are bonded together with an adhesive to form a laminate.

FIG. 8 is a schematic view schematically showing an example of a bonding step in the method for manufacturing a metal foil-clad laminate according to the present embodiment.
As shown in FIG. 8, in the bonding step, the third roll 31 around which the metal foil 11 is wound, the guide roll that guides the metal foil 11, and the metal foil 11 and the base film 13 are bonded together. Are provided on both sides of the base film 13.
That is, it differs from the application | coating process in the manufacturing method of the metal foil tension laminated board 10 which concerns on 1st Embodiment by the point provided with the 3rd roll 31 by which the metal foil 11 was wound on both sides of a base film.

  Therefore, in the bonding process according to the present embodiment, the metal foil 11 is bonded to both surfaces of the base film 13.

(Heat pressing process)
The heating and pressing step is a step of sandwiching the laminate between a pair of metal plates facing each other, heating the laminate, and simultaneously pressing the laminate via the metal plate.

FIG. 9 is a schematic view schematically showing an example of a heating and pressing step in the method for manufacturing a metal foil-clad laminate according to the present embodiment.
As shown in FIG. 9, in the heating and pressing step, a pair of metal plates 41a facing each other is provided, and the laminate 15 in which the metal foil 11 and the base film 13 are bonded in the bonding step is the above-described pair of metal plates 41a. It is sandwiched between the metal plates 41a.
That is, it differs from the application | coating process in the manufacturing method of the metal foil tension laminated board 10 which concerns on 1st Embodiment by the point which uses the laminated body 15 by which the metal foil 11 is bonded together on both surfaces of the base film 13. FIG.

  Therefore, by performing the heating and pressing step on the laminate 15, the adhesive on both sides of the base film applied in the applying step is cured to become the adhesive layer 12, and then cooled to thereby relate to the present embodiment. A metal foil-clad laminate 20 is obtained.

  The heating temperature is preferably 100 to 200 ° C. from the viewpoint of heat resistance. Moreover, it is preferable that the pressure pressed at this time is 1.5-7.0 Mpa from a viewpoint of adhesive strength.

  Thus, the manufacturing method of the metal foil-clad laminate 20 according to the present embodiment presses uniformly because the laminate 15 is sandwiched between the pair of metal plates 41a facing each other and heated and pressed in the heating and pressing step. And the pressure can be sufficiently transmitted to the laminate.

  Therefore, the obtained metal foil-clad laminate 20 has a uniform adhesive strength over the entire surface. Moreover, according to the said manufacturing method, since an affixing process can be performed efficiently, productivity of the metal foil tension laminated board 20 improves.

(Cooling pressing process)
The cooling and pressing step is a step in which the laminated body after the heating and pressing step is sandwiched between a pair of metal plates facing each other, cooled and simultaneously pressed through the metal plate.

In the cooling and pressing step, the same device as the heating and pressing step described above is used.
FIG. 10 is a schematic view schematically showing an example of the cooling and pressing step in the method for manufacturing the metal foil-clad laminate according to the present embodiment.
As shown in FIG. 10, the cooling and pressing step includes a pair of metal plates 41b facing each other as in the above-described heating and pressing step, and the laminate 15 after the heating and pressing step includes the pair of metal plates 41b. Is sandwiched between.
That is, it differs from the application | coating process in the manufacturing method of the metal foil tension laminated board 10 which concerns on 1st Embodiment by the point which uses the laminated body 15 by which the metal foil 11 is bonded together on both surfaces of the base film 13. FIG.

  Therefore, by performing a cooling and pressing step on the laminate 15, the obtained metal foil-clad laminate 20 is maintained in a degassed state, and the adhesive strength, folding resistance, and flexibility are further improved. Moreover, since it can cool in a short time, the productivity of the metal foil-clad laminate 20 is also improved.

  The cooling temperature is preferably 0 to 20 ° C. The pressure to be pressed at this time is preferably 1.5 to 7.0 MPa.

  Thus, in the manufacturing method of the metal foil-clad laminate 20 according to the present embodiment, the laminate 15 is sandwiched between the pair of metal plates 41b facing each other and cooled and pressed in the cooling and pressing step. And the pressure can be sufficiently transmitted by the laminate.

  Therefore, the obtained metal foil-clad laminate 20 has a more uniform adhesive strength over the entire surface. Moreover, according to the said manufacturing method, since an affixing process can be performed efficiently, the productivity of the metal foil tension laminated board 10 improves more.

As described above, the metal foil-clad laminate 20 according to the present embodiment is obtained.
The metal foil-clad laminate 20 is thin but has excellent adhesive strength and is uniform over the entire surface, and has sufficient folding resistance and flexibility.

The metal foil-clad laminate 20 obtained by the above production method is suitably used for electronic devices that are miniaturized and densified. Specifically, the metal foil-clad laminate 20 is used for electronic devices such as cameras, personal computers, and liquid crystal displays, and is particularly preferably used for electronic devices that are miniaturized and densified.
The metal foil-clad laminate 20 is also used as a printed wiring board by forming a conductor pattern by applying resist, exposing, etching, and the like. Such a printed wiring board has sufficient folding resistance while being thin.

  The preferred embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment.

For example, in the manufacturing method of the metal foil-clad laminates 10 and 20 according to the first and second embodiments, the laminate 15 after the heating and pressing step is cooled and pressed in the cooling and pressing step, but the cooling and pressing step is not necessarily performed. There is no need to do.
Moreover, only the cooling may be sufficient without pressing the laminated body 15, and it may be only air cooling without pressing and cooling.

  In the manufacturing method of the metal foil-clad laminates 10 and 20 according to the first and second embodiments, an adhesive is applied to the base film 13 using the first roll 21 and the second roll 22 in the application step. However, the application method is not particularly limited, and the adhesive may be applied to the base film 13 directly from the applicator.

  In the method for manufacturing the metal foil-clad laminates 10 and 20 according to the first and second embodiments, the metal foil 11 and the base film 13 are bonded together by the fourth roll 32 in the bonding step. The bonding method is not particularly limited.

FIG. 1 is a cross-sectional view schematically showing an example of a metal foil-clad laminate according to the present embodiment. FIG. 2 is a schematic view schematically showing an example of the applying step in the method for manufacturing a metal foil-clad laminate according to the present embodiment. FIG. 3 is a schematic view schematically showing an example of a bonding step in the method for manufacturing a metal foil-clad laminate according to the present embodiment. FIG. 4 is a schematic view schematically showing an example of a heating and pressing step in the method for manufacturing a metal foil-clad laminate according to the present embodiment. FIG. 5 is a schematic view schematically showing an example of the cooling and pressing step in the method for manufacturing a metal foil-clad laminate according to the present embodiment. FIG. 6 is a cross-sectional view schematically showing an example of a metal foil-clad laminate according to this embodiment. FIG. 7 is a schematic view schematically showing an example of the applying step in the method for manufacturing a metal foil-clad laminate according to the present embodiment. FIG. 8 is a schematic view schematically showing an example of a bonding step in the method for manufacturing a metal foil-clad laminate according to the present embodiment. FIG. 9 is a schematic view schematically showing an example of a heating and pressing step in the method for manufacturing a metal foil-clad laminate according to the present embodiment. FIG. 10 is a schematic view schematically showing an example of the cooling and pressing step in the method for manufacturing the metal foil-clad laminate according to the present embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10,20 ... Metal foil tension laminated board 11 ... Metal foil 12 ... Adhesive layer 13 ... Base film 15 ... Laminate 21 ... 1st roll 22 ... 2nd roll 23 ... Applicator 31 ... 3rd roll 32 ... 4th roll 41a, 41b ... Metal plate.

Claims (10)

A base film;
A metal foil laminated on the base film through an adhesive layer having a thickness of 6 μm or less made of an adhesive containing urethane resin and epoxy resin;
A method for producing a metal foil-clad laminate comprising:
An application step of applying the adhesive to one side of the metal foil and / or the base film;
A laminating step of laminating the metal foil and the base film through the adhesive; and
A heating and pressing step in which the laminate is sandwiched between a pair of metal plates facing each other and heated, and simultaneously pressed through the pair of metal plates,
A method for producing a metal foil-clad laminate, comprising: A base film;
A metal foil laminated on the base film through an adhesive layer having a thickness of 6 μm or less made of an adhesive containing urethane resin and epoxy resin;
A method for producing a metal foil-clad laminate comprising:
An application step of applying the adhesive to both surfaces of the metal foil and / or the base film;
A laminating step of laminating the metal foil and the base film through the adhesive; and
A heating and pressing step in which the laminate is sandwiched between a pair of metal plates facing each other and heated, and simultaneously pressed through the pair of metal plates,
A method for producing a metal foil-clad laminate, comprising:   The laminate after the heating and pressing step is sandwiched between a pair of metal plates facing each other and cooled, and at the same time, further includes a cooling and pressing step of pressing through the pair of metal plates, respectively. The manufacturing method of the metal foil tension laminated board of description.   3. The metal according to claim 1, wherein in the heating and pressing step, the laminated body and the pair of metal plates are conveyed at the same speed while the laminated body is sandwiched between the pair of metal plates. A method for producing a foil-clad laminate.   The method for producing a metal foil-clad laminate according to claim 3, wherein the cooling and pressing step is continuously performed after the heating and pressing step is performed on the laminate.   The method for producing a metal foil-clad laminate according to claim 1 or 2, wherein the pressing applies a hydraulic pressure or an air pressure directly to the metal plate.   The method for producing a metal foil-clad laminate according to claim 1 or 2, wherein the base film is a polyimide film or a polyamide film.   The method for producing a metal foil-clad laminate according to claim 1 or 2, wherein a weight mixing ratio of the urethane resin and the epoxy resin is 2: 1 to 5: 1.   The method for producing a metal foil-clad laminate according to claim 1 or 2, wherein the metal plate is a stainless steel plate. A metal foil-clad laminate obtained by the production method according to any one of claims 1 to 9.

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