JP2008028247A - Substrate processing method and substrate processing apparatus - Google Patents

Abstract

A substrate is efficiently processed while preventing occurrence of processing unevenness.
After developing a developing solution by supplying a developing solution to a horizontally oriented substrate in the developing treatment chamber, cleaning is performed by supplying a cleaning solution to the substrate in an inclined posture in a cleaning processing chamber. Process. At this time, after the development processing, the substrate S is converted from a horizontal posture to a temporary inclined posture (an posture having a lower inclination than the inclined posture of the substrate S suitable for the cleaning process) in the development processing chamber 3, and the state of the temporary inclined posture is obtained. Then, the substrate S is transferred from the development processing chamber 3 to the cleaning processing chamber 4. Then, in the cleaning processing chamber 4, the cleaning process is performed by changing the posture of the substrate S from the temporary inclined posture to the main inclined posture.
[Selection] Figure 1

Description

  The present invention performs processing by supplying a processing solution such as a developing solution, an etching solution, and a cleaning solution such as a rinsing solution to a substrate such as an FPD (Flat Panel Display) glass substrate such as a liquid crystal display or a semiconductor substrate. The present invention relates to a substrate processing method and a substrate processing apparatus.

Conventionally, as a substrate processing apparatus (method), while transporting a substrate,
(1) A process (liquid layer forming process) of performing processing in a state where a liquid layer is formed on the substrate by supplying the processing liquid to the substrate in a horizontal posture;
(2) a step of converting the posture of the substrate into an inclined posture (posture changing step);
(3) supplying a cleaning solution to the substrate in an inclined posture and cleaning it (cleaning step);
Is known to be implemented continuously (for example, Patent Document 1).

  Such an apparatus is widely applied as an apparatus for developing a substrate, for example. That is, a developer liquid layer is formed on a horizontal substrate to proceed with the development process, and then the substrate is converted into an inclined posture and washed with the rinse liquid flowing down along the substrate. The efficiency of replacement with the rinsing liquid is improved, and the cleaning process can be carried out efficiently.

By the way, in this type of substrate processing apparatus, the processing liquid is reused from the viewpoint of reduction of the production cost of the substrate and effective use of resources. By performing the conversion (posture changing process) in advance in the developing section (chamber), the developer on the substrate is caused to flow down and collected for reuse.
JP-A-11-87210

  However, when the substrate is transferred from the developing unit to the cleaning unit after the development processing is changed to a posture suitable for the cleaning processing as described above, it is dried on the upper side of the substrate by the flow of the developing solution. It is conceivable that so-called uneven development occurs in which a difference in the progress of the process occurs between the upper side and the lower side of the substrate before the cleaning process is started. In particular, it is considered that the frequency of occurrence is higher in a large-sized substrate in which a difference in height between the upper side and the lower side is large.

  Therefore, it is considered to prevent the substrate from drying by quickly transporting the substrate to the cleaning unit and starting the cleaning process after changing the posture of the substrate. In this case, the cleaning unit receiving the substrate is considered. Also on the side, it is necessary to increase the substrate conveyance speed, and the processing time in the swift cleaning section is shortened, so that the replacement efficiency between the developer and the rinsing liquid is impaired. Further, there is a possibility that damage to the substrate is increased by increasing the conveyance speed, which is not a good idea.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to efficiently process a substrate while preventing the occurrence of so-called processing unevenness without particularly increasing the conveyance speed of the substrate. .

  In order to solve the above problems, the present invention provides a first process for supplying a processing liquid to a substrate in a horizontal posture in a first processing unit while transporting the substrate, and a substrate in an inclined posture in a second processing unit. A substrate processing method for sequentially performing a second process of supplying a processing liquid to the substrate, wherein after the first process, the substrate is set to a predetermined tilted attitude from a horizontal attitude and suitable for the second process. A first posture converting step for converting to a temporary inclined posture having a lower inclination than a predetermined main inclined posture; a conveying step for transferring a substrate in the temporary inclined posture from the first processing unit to the second processing unit; A second posture conversion step for converting the posture of the substrate from the temporary tilt posture to the main tilt posture in the two processing units; and a substrate that performs the second processing on the substrate in the main tilt posture after the second posture conversion step. And a processing step (claim 1).

  As described above, the posture of the substrate after the first processing until it is carried into the second processing unit is set to a tilted posture (temporary tilted posture) having a smaller inclination than the main tilted posture suitable for the second processing. In this case, it is possible to suppress the drying of the processing liquid on the substrate while flowing down. That is, drying of the substrate surface can be suppressed by setting the inclination of the temporary inclined posture as small as possible within a range in which the developer can flow down. In the second processing unit, the second processing is performed in a state where the substrate is tilted at an ideal inclination (mainly tilted posture). Therefore, the processing can be efficiently advanced.

  In this method, it is preferable to include a first preceding processing step in which the second processing is performed prior to the substrate processing step with respect to the substrate transported in a temporary inclined posture.

  In addition, prior to the substrate processing step, it is also effective to have a second preceding processing step for performing the second processing on the substrate whose posture is being changed in the second posture changing step.

  According to these methods, it is possible to obtain a certain processing effect by performing the second process in advance on the substrate in the inclined posture although not in the main inclined posture, and to start the second processing at an early stage. It becomes possible to more reliably suppress drying of the substrate surface.

  In the above method, the substrate posture is temporarily held at a tilt posture having a lower inclination than the temporary tilt posture at the time of the substrate posture change in the first posture changing step, and thereafter, the temporary tilt posture is changed to the temporary tilt posture. It is preferable to convert (Claim 4).

  According to this method, the flow of the processing liquid when the substrate is converted from the horizontal posture to the tilted posture becomes gentle, and so-called flow unevenness (flow path unevenness) can be suppressed.

  On the other hand, a substrate processing apparatus according to the present invention supplies a processing liquid to a substrate in an inclined posture, and a first processing unit that performs the first processing by supplying the processing liquid to the substrate in a horizontal posture in the substrate transport direction. In the substrate processing apparatus that sequentially arranges the first processing and the second processing on the substrate, the second processing portion that performs the second processing is arranged in the first processing portion, and after the first processing, the substrate A first attitude converting means for converting the horizontal attitude from a horizontal attitude to a provisional inclination attitude having a predetermined inclination attitude and an inclination smaller than the main inclination attitude predetermined as the attitude suitable for the second processing; Inclined transport means for transporting from the first processing unit to the second processing unit while maintaining the temporary tilted posture, and the second processing unit, respectively, convert the posture of the substrate from the temporary tilted posture to the main tilted posture. By the second posture changing means and the second posture changing means A processing liquid supplying means for supplying a processing liquid for the converted substrate in this inclined position in which has a (claim 5).

  According to this apparatus, the first processing is performed by supplying the processing liquid to the substrate in the horizontal posture, and after the first processing is finished, the posture of the substrate is changed from the horizontal posture to the temporary inclined posture by the first posture changing means. Converted. The first processing and the orientation change of the substrate are performed in the first processing unit. Then, after the substrate is transported from the first processing unit to the second processing unit by the tilt transport unit in the temporary tilt posture, the posture of the substrate is converted from the temporary tilt posture to the main tilt posture by the second posture conversion unit. After the conversion, the processing liquid is supplied to the substrate by the processing liquid supply means, and the second processing is performed. Therefore, the substrate processing method according to claim 1 can be suitably performed.

  In this apparatus, prior to the supply of the processing liquid by the processing liquid supply means to the second processing section, the processing liquid for the second processing is supplied to the substrate transported in a temporary inclined posture. It is preferable that one preceding processing liquid supply means is provided (Claim 6).

  Further, prior to supplying the processing liquid by the processing liquid supply means to the second processing section, a second processing liquid for supplying the second processing liquid to the substrate undergoing attitude change by the second attitude changing means is provided. It is preferable that a pretreatment liquid supply means is provided (claim 7).

  According to these apparatuses, the second process can be performed in advance on a substrate that is not in the tilted posture but in a tilted posture or a substrate that is being converted from the temporary tilted posture to the tilted posture. Therefore, the substrate processing method according to claims 2 and 3 can be suitably implemented.

  Further, in each of the above apparatuses, the first posture changing means temporarily holds the posture of the substrate in a tilt posture having a lower inclination than the temporary tilt posture, and thereafter converts the substrate posture to the temporary tilt posture. (Claim 8).

  According to this apparatus, the posture change of the substrate by the first posture changing means is performed in two stages. Therefore, the substrate processing method according to claim 4 can be suitably performed.

  In the present invention, a first process for supplying a processing liquid to a substrate in a horizontal position in a first processing unit and a second process for supplying a processing liquid to a substrate in an inclined position in a second processing unit are continuously performed. In this case, the posture of the substrate after the first processing until it is carried into the second processing unit is set to a tilted posture (temporary tilted posture) having a lower inclination than the main tilted posture suitable for the second processing. Therefore, after the first treatment, it is possible to effectively suppress the drying of the substrate surface during the transfer of the substrate from the first treatment unit to the second treatment unit, while tilting the substrate and causing the treatment liquid to flow down. It becomes. Therefore, the substrate can be processed efficiently while preventing the occurrence of so-called processing unevenness without particularly increasing the substrate transport speed.

  Embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a side view showing an overall configuration of a substrate processing apparatus according to the present invention (a substrate processing apparatus in which a substrate processing method according to the present invention is used). The substrate processing apparatus 1 supplies a developing solution, which is a processing solution, to a surface of a rectangular LCD glass substrate (hereinafter simply referred to as a substrate) S to perform a developing process, and then supplies a cleaning solution to perform a cleaning process. is there. The development process corresponds to the first process according to the present invention, and the cleaning process corresponds to the second process according to the present invention.

  The substrate processing apparatus 1 cleans a loader chamber 2 that receives a substrate S, a development processing chamber 3 that performs development processing on the substrate S (corresponding to a first processing unit according to the present invention), and a substrate S after development processing. A cleaning processing chamber 4 (corresponding to a second processing unit according to the present invention), a drying chamber 5 for drying the substrate S after cleaning, and an unloader chamber 6 for carrying out the substrate to the next process. .

  The loader chamber 2 is provided with a transport roller 21 so that the substrate S is received on the transport roller 21 and transported in a horizontal posture.

  The development processing chamber 3 includes a liquid layer forming chamber 3A that supplies a developer to the surface of the substrate S conveyed in a horizontal posture and forms a liquid layer of the developer on the surface of the substrate S by the surface tension of the developer. The substrate S on which the liquid layer is formed is held and the processing of the liquid layer with the developing solution is advanced, and the developing chamber 3B for converting the posture of the substrate S after the processing from the horizontal posture to the inclined posture is partitioned. ing.

  In the liquid layer forming chamber 3A, a transport roller 31 that receives the substrate S transported from the loader chamber 2 and transports the substrate S in a horizontal posture, and a developer on the surface of the substrate S transported in a horizontal posture by the transport roller 31. There is provided a developer supply nozzle 32 for supplying and forming a developer layer on the surface (upper surface) thereof. The developer stored in the developer tank 11 is supplied to the developer supply nozzle 32 by the pump 12.

  FIG. 2 is a schematic perspective view of the development processing chamber 3. The development replacement chamber 3B is provided with a transport roller 33 that receives and holds the substrate S transported by the transport roller 31 in a state in which a developer liquid layer is formed from the liquid layer forming chamber 3A. In addition, the tilt mechanism that can switch the posture of the transport roller 33 between a state in which the substrate S is held in a horizontal posture and a state in which the substrate S is held in a tilted posture that is one of left and right in the substrate transport direction, in this example, a downwardly inclined posture. 34 (corresponding to the first posture changing means according to the present invention) is provided. The tilt mechanism 34 includes a roller frame 35 that rotatably supports the left and right sides of the transport roller 33, and a substrate transport that rotatably supports the roller frame 35 on the right side in the substrate transport progress direction (substrate transport direction). A shaft 36 provided in parallel with the direction and a cylinder 37 that is coupled to the roller frame 35 and moves up the left side of the roller frame 35 on the left side in the substrate transport direction. That is, by this tilting mechanism 34, in the development changing chamber 3B, the substrate S transported in the horizontal posture from the liquid layer forming chamber 3A by the transport roller 31 with the transport roller 33 in the horizontal posture as shown in FIG. After the acceptance, as shown in FIG. 3, the cylinder 37 is extended to incline the transport roller 33, and the substrate S is tilted downward in the right direction toward the substrate transport direction. The substrate S can be transported in the state.

  As shown in FIG. 1, receptacles T1 and T2 for collecting the developer are provided below the liquid layer forming chamber 3A and the development changing chamber 3B, and the developer collected by these receptacles T1 and T2 is provided. Is collected in the developer tank 11 and reused.

  The cleaning processing chamber 4 receives the substrate S transported in an inclined posture from the development processing chamber 3 (development replacement chamber 3B), and supplies the cleaning liquid to the substrate S to clean the substrate S and the posture of the substrate S. Cleaning chamber 4A for converting the substrate S into an inclined posture having a higher inclination and the substrate S after the posture change, and supplying the processing liquid to the substrate S while transporting the substrate S in the inclined posture. Further, it is divided into a main cleaning chamber 4B to be cleaned.

  The cleaning replacement chamber 4A includes a transport roller 41 that receives and holds the substrate S transported in an inclined posture from the development replacement chamber 3B, and a shower-type cleaning liquid supply nozzle 43 that supplies cleaning liquid to the upper and lower surfaces of the substrate S. 44 (first and second preceding processing liquid supply means according to the present invention). Each cleaning liquid supply nozzle 43, 44 is connected to an ultrapure water supply source 45.

  Further, in the cleaning replacement chamber 4A, a tilting mechanism (not shown) that switches the posture of the transport roller 41 between a tilting posture in which the substrate S can be received from the developing replacement chamber 3B and a tilting posture having a greater inclination than that posture. (Corresponding to the second attitude changing means according to the present invention). Since this tilting mechanism is the same as the tilting mechanism 34 of the development changing chamber 3B, its details are omitted. In this embodiment, the transport rollers 33 and 41, the tilt mechanism 34, and the like constitute an inclined transport mechanism according to the present invention.

  Here, the inclination (angle formed by the horizontal plane and the upper surface of the substrate) of the substrate S after the conversion in the cleaning replacement chamber 4A is the optimum inclination for the cleaning process based on the relationship between the type of the cleaning liquid and the type of the substrate S. In other words, the inclination is the most efficient replacement between the developing solution and the cleaning solution, and is set to an inclination (3 ° to 9 ° in the present embodiment) obtained in advance based on a test or the like. On the other hand, the slope of the substrate S after conversion in the development switching chamber 3B described above is such that the developer formed on the substrate S flows down, but the substrate surface does not get wet and dry. Therefore, the inclination (in this embodiment, 0 ° to 5 °) obtained in advance based on a test or the like is set. That is, after the development processing, the substrate S is tilted to let the processing liquid flow down, while effectively drying the substrate surface during the transfer of the substrate from the development processing chamber 3 to the cleaning processing chamber 4 and cleaning. In the processing chamber 4, the replaceability between the developer and the cleaning liquid can be satisfactorily exhibited by setting the posture of the substrate S to the optimum inclination for the cleaning process. In the following description, the post-conversion substrate S posture in the development replacement chamber 3B is referred to as a “temporary tilt posture”, and the post-conversion substrate S posture in the cleaning replacement chamber 4A is referred to as “main tilt posture” as necessary. I will call it.

  The main cleaning chamber 4 </ b> B receives the substrate S transported by the transport roller 41 from the cleaning replacement chamber 4 </ b> A after the posture change, and transports the substrate S in the same posture, and the substrate S transported in an inclined posture by the transport roller 47. The cleaning liquid supply nozzle 48 supplies a cleaning liquid to the upper surface of the substrate S, and the cleaning liquid supply nozzle 49 supplies the cleaning liquid to the lower surface of the substrate S. These cleaning liquid supply nozzles 48 and 49 (processing liquid supply means according to the present invention) are connected to the ultrapure water supply source 45.

  The drying chamber 5 receives the substrate S transported from the cleaning processing chamber 45 and transports the substrate S in the same inclined posture, and blows air onto the upper surface of the substrate S transported in the inclined posture by the transport roller 51. An air knife 52 that blows and dries the cleaning liquid, and an air knife 53 that blows air against the lower surface of the substrate S to blow and dry the cleaning liquid. These air knives 52 and 53 are connected to an air supply source 55.

  The unloader chamber 6 is provided with a transport roller 61 that receives and holds the substrate S transported by the transport roller 51 from the drying chamber 5. Further, in the unloader chamber 6, the posture of the transport roller 61 can be switched between a state in which the substrate S is held in a horizontal posture and a state in which the substrate S is held in a downwardly inclined posture in the substrate transport direction. A tilt mechanism is provided. That is, the tilted substrate S received from the drying chamber 5 is converted into a horizontal posture by the tilt mechanism and carried out to the next process. The configuration of this tilting mechanism is the same as that of the tilting mechanism 34 provided in the development changing chamber 3B, and therefore the details are omitted.

  Although not shown in FIG. 1, each chamber is partitioned by a partition that partitions the mists of the processing liquid so as not to enter each other. In addition, the substrate processing apparatus 1 is provided with a controller that comprehensively controls the operation thereof, and drives each of the transport rollers 21, 31, 33, 41, 47, 51, 61, and the operation of the tilt mechanism 34, etc. The operation of the entire substrate processing apparatus 1 including the supply stop of the developing solution and the like is controlled by a controller (not shown).

  Next, the operation (substrate processing method) of the substrate processing apparatus 1 based on the control of the controller will be described together with the operation thereof with reference to FIGS.

  The substrate S supplied to the loader chamber 2 from a substrate supply device (not shown) is transported in a horizontal posture by the transport roller 21, transferred to the transport roller 31 in the liquid layer forming chamber 3 </ b> A, and transported into the development processing chamber 3. Then, the developer passes through the liquid layer forming chamber 3A at a constant speed, while the developer is supplied from the developer supply nozzle 32 to the surface of the substrate S, and the developer liquid layer is formed on the surface of the substrate S by the surface tension of the developer. It is formed.

  The substrate S on which the developer layer has been formed in the liquid layer forming chamber 3A is transferred from the transport roller 31 to the transport roller 33 and transported to the development replacement chamber 3B. The substrate S carried into the development changing chamber 3 </ b> B is temporarily brought into a stationary state when the transport roller 33 is stopped. In the meantime, so-called paddle development is performed in which processing proceeds with a developer of a liquid layer formed on the upper surface.

  When this paddle development is performed for a predetermined time, the cylinder 37 of the tilt mechanism 34 is then extended and the transport roller 33 is tilted. Accordingly, the posture of the substrate S is changed from a horizontal posture to a temporary inclined posture inclined to the right in the substrate transport direction (corresponding to the first posture changing step according to the present invention).

  By this attitude change of the substrate S, almost all of the developer in the liquid layer on the upper surface of the substrate S flows down and is collected in the lower tray T2. That is, the developer is reused in the development processing chamber 3 without being taken out to the subsequent process.

  The substrate S which has been temporarily inclined in the development changing chamber 3B and is transferred by the transfer roller 33 is transferred to the transfer roller 41 in the cleaning changing chamber 4A and is carried into the cleaning processing chamber 4 while maintaining the same inclined posture. (Corresponding to the conveying step according to the present invention). The substrate S is transported from the development processing chamber 3 to the cleaning processing chamber 4 in a temporarily inclined posture. The inclination of the substrate S at this time is such that the surface of the substrate S is dried as described above. The inclination is set to a level (0 ° to 5 °), so that the transfer from the development processing chamber 3 to the cleaning processing chamber 4 is not performed at a particularly high speed and is almost the same as other transfer operations. Done at a speed of.

  When the substrate S is completely carried into the cleaning replacement chamber 4A, the transport roller 41 is stopped, and then the cylinder (not shown) of the tilting mechanism is extended to further tilt the transport roller 41, whereby a temporary tilting posture is achieved. The posture of the substrate S is converted from (0 ° to 5 °) to the main inclined posture (3 ° to 9 °) (corresponding to the second posture changing step according to the present invention). Further, almost simultaneously with the operation of the tilt mechanism, the cleaning liquid is supplied from the cleaning liquid supply nozzles 43 and 44 to the upper surface and the lower surface of the substrate S, whereby the substrate S is cleaned during the posture change (second embodiment according to the present invention). Corresponds to the preceding processing step).

  When the posture conversion of the substrate S to the main tilted posture is completed, the substrate S is transferred from the transport roller 41 to the transport roller 47 of the main cleaning chamber 4B, and is transported at a constant speed with the main tilt posture. In the main cleaning chamber 4B, the cleaning liquid is supplied from the cleaning liquid supply nozzles 48 and 49 to the upper surface and the lower surface of the substrate S to be cleaned (corresponding to the substrate processing step according to the present invention). At this time, the cleaning liquid quickly flows down along the inclined substrate S, and the cleaning liquid does not stay near the center of the substrate S, and is sufficiently cleaned in a short time. Particularly, since the inclination of the substrate S at this time is set to an inclination (the main inclination posture) at which the replacement of the developer and the cleaning liquid is most efficiently performed as described above, efficient cleaning is performed.

  The substrate S transferred from the cleaning processing chamber 4 by the transfer roller 47 in an inclined posture is transferred to the transfer roller 51 and transferred to the drying chamber 5 in the same inclined posture. In the drying chamber 5, air is blown from the air knives 52, 53 onto the upper and lower surfaces of the substrate S transported in an inclined posture, whereby the cleaning liquid is blown off and the drying proceeds.

  The substrate S transported from the drying chamber 5 by the transport roller 51 is transferred to the transport roller 61 and transported to the unloader chamber 6 in the same inclined posture. When the substrate S is completely carried into the unloader chamber 6, the substrate S is converted from the inclined posture to the horizontal posture by the tilt mechanism. After the posture changing operation, the substrate S is carried out to the next process (not shown) by driving the transport roller 61. Note that the position of the substrate S may be recognized by the driving time of the transport roller or the like, or a sensor that detects the passage of the substrate S may be provided at the entrance / exit of each processing chamber.

  As described above, in this substrate processing apparatus 1 (substrate processing method), after the development processing, the posture of the substrate S is not immediately converted into a posture suitable for the cleaning process (mainly inclined posture), but once this main inclination is made. The temporary inclined posture having a smaller inclination than the posture, that is, a posture having a gentle inclination that prevents the substrate S from being dried while the developing solution is allowed to flow down, is maintained in this state from the development processing chamber 3 to the cleaning processing chamber. 4, the substrate S is transported. Therefore, as described above, it is possible to effectively prevent the drying of the substrate S during the transfer without performing the transfer from the development processing chamber 3 to the cleaning processing chamber 4 at a high speed.

  Therefore, while enjoying the benefit of efficiently performing the cleaning process of the substrate S while supplying the cleaning liquid to the inclined substrate S, the development accompanying the drying of the surface of the substrate S after the development process until the cleaning process is started. The occurrence of unevenness can be effectively prevented without the risk of increasing the speed of substrate conveyance.

  In particular, in the substrate processing apparatus 1, while the substrate S is changed from the temporary inclined posture to the main inclined posture in the cleaning replacement chamber 4A, the cleaning liquid is supplied by the cleaning liquid supply nozzles 43 and 44 to thereby maintain the main cleaning chamber 4B. Since the cleaning process is performed prior to the cleaning process, it is possible to more reliably prevent the substrate surface from drying between the development process and the start of the cleaning process in the inclined position. Also, there is an advantage that a higher cleaning effect can be obtained by starting the cleaning process of the substrate S earlier.

  The substrate processing apparatus 1 (substrate processing method) described above is an exemplification of a specific embodiment of the substrate processing apparatus (substrate processing method) according to the present invention, and includes a specific configuration of the substrate processing apparatus, Alternatively, the substrate processing method can be appropriately changed without departing from the gist of the present invention. For example, the following configuration (method) may be adopted.

  (1) As the cleaning processing chamber 4 of the substrate processing apparatus 1 shown in FIG. 1, a cleaning processing chamber 4 as shown in FIG. 5 may be adopted. The cleaning processing chamber 4 includes a preceding processing chamber 4A ′ on the upstream side of the cleaning replacement chamber 4A in addition to the cleaning replacement chamber 4A and the main cleaning chamber 4B. In the preceding processing chamber 4A ′, a transport roller 40 that receives and holds the substrate S transported in an inclined posture from the developing replacement chamber 3B, and transports the surface of the substrate S transported by the transport roller 40. For example, a slit-type cleaning liquid supply nozzle 42 (corresponding to the first preceding processing liquid supply means according to the present invention) capable of supplying a large amount of cleaning liquid or supplying a high pressure from the upstream side to the downstream side in the direction is provided. That is, the substrate processing apparatus 1 is configured to perform the cleaning process of the substrate S prior to the cleaning process in the cleaning replacement chamber 4A and the main cleaning chamber 4B (the second preceding processing step according to the present invention). Equivalent to According to such an apparatus, since the cleaning process can be immediately performed on the substrate S carried out from the development changing chamber 3B, the substrate surface can be prevented from drying and the cleaning time can be secured as compared with the apparatus of FIG. More advantageous. In this case, a slit type cleaning liquid supply nozzle that supplies the cleaning liquid to the substrate S from the downstream side in the transport direction toward the upstream side is provided on the downstream side of the cleaning liquid supply nozzle 42, although not particularly described in FIG. It is more preferable that a cleaning liquid supply nozzle that is disposed opposite to the nozzle 42 and further supplies a cleaning liquid to a position between the nozzles and on the upper side of the inclination with respect to the substrate S is more preferable. According to this configuration, it is possible to clean the substrate S while preventing reattachment of contamination.

  In place of separately providing the preceding processing chamber 4A ′ in the cleaning processing chamber 4 as shown in FIG. 5, for example, in the cleaning replacement chamber 4A in FIG. 1, in the vicinity of the substrate receiving port separately from the cleaning liquid supply nozzles 43 and 44. A slit-type cleaning liquid supply nozzle may be provided, and the cleaning liquid may be supplied to the substrate S conveyed from the development processing chamber 3 to the cleaning replacement chamber 4A by the cleaning liquid supply nozzle. According to such a configuration, the same effect as in FIG. 5 can be obtained.

  (2) In the embodiment, the cleaning liquid is supplied by the cleaning liquid supply nozzles 43 and 44 to the substrate S whose posture is changed from the temporary inclined posture to the main inclined posture in the cleaning replacement chamber 4A. It may be omitted to simplify the apparatus. That is, only the posture change of the substrate S may be performed in the cleaning replacement chamber 4A.

  (3) In the development changing chamber 3B, the substrate S is temporarily stopped in the process of changing the posture of the substrate S from the horizontal posture to the temporary inclined posture (inclination 2 °) (for example, the posture having an inclination of 1.5 °). Then, the substrate S may be tilted to the temporary tilt posture. In this way, there is an advantage that the flow of the developer when the substrate S is converted from the horizontal posture to the temporary inclined posture becomes gentle, and so-called flow unevenness (flow path unevenness) can be suppressed. is there.

  (4) Further, in the substrate processing apparatus 1 of FIG. 1, the inclined posture of the substrate S is inclined to the left and right sides (that is, the width direction of the substrate S) toward the substrate transport direction, but tilted in the substrate transport direction. It may be a posture. 6 and 7 schematically show the configuration of the development processing chamber 3 and the cleaning processing chamber 4 in that case.

  First, the configuration of FIG. 6 will be described. As shown in FIG. 5A, the developing roller 3B includes a transport roller 33 in a state in which the substrate S is transported in a horizontal posture and a state in which the substrate S is transported in an inclined posture that rises toward the substrate transport direction. An inclination mechanism capable of switching the posture (the direction in which the respective transport rollers 33 are arranged) is provided. Although not shown in detail, this tilting mechanism is orthogonal to the substrate transport direction, in which a roller frame that rotatably supports the left and right of the transport roller 33 and a roller frame that rotatably supports the rear end of the substrate transport direction. And a cylinder 71 which is coupled to the roller frame at the front end in the substrate transport direction and lifts the front end of the roller frame. As shown in FIG. After receiving the substrate S transported in a horizontal posture from the liquid layer forming chamber 3A, the cylinder 37 is extended to tilt the roller frame, and the substrate S is tilted upward in the substrate transport direction, that is, It can be transported in a state of being converted into a temporary inclined posture (inclination of 0 ° to 5 °).

  On the other hand, in the cleaning replacement chamber 4A of the cleaning processing chamber 4, a state in which the substrate S is transported in a temporary tilted posture and a forward tilted posture having a greater slope toward the substrate transport direction, that is, a main tilted posture (gradient). An inclination mechanism is provided that can switch the posture of the conveying rollers 41 (the direction in which the conveying rollers 41 are arranged) to the state of conveying at 3 ° to 9 °. Further, the main cleaning chamber 4B has a posture of the transport roller 47 (a state of each transport roller 47) in a state in which the substrate S is transported in the main inclined posture that is advanced in the substrate transport direction and a state in which the substrate S is transported in the horizontal posture. An inclination mechanism capable of switching the direction of the alignment) is provided. The inclination mechanisms of the cleaning replacement chamber 4A and the main cleaning chamber 4B are basically the same as those of the development replacement chamber 3B, and are operated by cylinders 72 and 73, respectively.

  According to the substrate processing apparatus 1 shown in FIG. 6, the substrate S on which the liquid layer of the developer is formed in the liquid layer forming chamber 3A is transferred from the transport roller 31 to the transport roller 33 as shown in FIG. Passed to the development replacement chamber 3B for paddle development. Then, after the orientation of the tilting mechanism 71 is extended, the posture is changed from a horizontal posture to a temporary inclined posture inclined forward in the substrate transport direction (FIG. 6B), and then transported by the transport roller 33 to be in the tilted posture. As it is, it is transferred to the transport roller 41 of the cleaning replacement chamber 4A and carried into the cleaning processing chamber 4.

  When the substrate S is completely carried into the cleaning replacement chamber 4A, the transport roller 41 is stopped, and the posture of the substrate S is changed from the temporary inclined posture to the main inclined posture by the extension of the cylinder 72 of the tilt mechanism (FIG. 6 ( c)) Further, it is transported by the transport roller 41, is transferred to the transport roller 47 in the main inclined position, and is transported into the main cleaning chamber 4B. Then, after the cleaning process is performed in the main inclined position in the main cleaning chamber 4B, the attitude of the substrate S is converted from the main inclined position to the horizontal position by contraction of the cylinder 73 of the tilt mechanism (FIG. 6D). ), It is transferred to the drying chamber 5 by being transferred from the transfer roller 47 to the transfer roller 51.

  Next, the configuration of FIG. 7 will be described.

  As shown in FIG. 6A, the configuration of the development processing chamber 3 is the same as that shown in FIG.

  In the cleaning replacement chamber 4A of the cleaning processing chamber 4, the substrate S is transported in a provisional tilt posture that is advanced in the transport direction, and the main tilt posture is lowered toward the substrate transport direction (inclination of 3 ° to 9 °). An inclination mechanism is provided that can switch the posture of the conveying rollers 41 (the direction in which the conveying rollers 41 are arranged) to the state in which the conveying rollers 41 are conveyed. Further, the main cleaning chamber 4B has a posture of the transport roller 47 (a state of each transport roller 47) in a state in which the substrate S is transported in the main inclined posture that is first lowered toward the substrate transport direction and a state in which the substrate S is transported in the horizontal posture. An inclination mechanism capable of switching the direction of the alignment) is provided.

  The tilting mechanisms of the main cleaning chamber 4B and the main cleaning chamber 4B are basically the same as those described in FIG. 6, but the main cleaning chamber 4B has a substrate as shown in FIG. The configuration is different in that the roller frame is rotatably supported at the front end in the transport direction, and the roller frame and the cylinder 73 are coupled at the rear end in the substrate transport direction.

  According to the substrate processing apparatus 1 shown in FIG. 7, the substrate S on which the liquid layer of the developer is formed is tilted upward from the horizontal posture in the substrate transport direction as shown in FIGS. After the posture is changed to the temporary inclined posture, it is transferred by the transfer roller 33 and is transferred from the development changing chamber 3B to the transfer roller 41 in the cleaning changing chamber 4A while being in the inclined posture and is carried into the cleaning processing chamber 4. .

  When the substrate S is completely carried into the cleaning replacement chamber 4A, the transport roller 41 is stopped, and the posture of the substrate S is changed from the preliminarily inclined pre-tilt posture to the main tilted posture by the contraction of the cylinder 72 of the tilt mechanism. It is converted (FIG. 7 (c)), further conveyed by the conveying roller 41, passed to the conveying roller 47 in the main inclined position, and carried into the main cleaning chamber 4B. Then, after the cleaning process is performed in the main inclined position in the main cleaning chamber 4B, the attitude of the substrate S is converted from the main inclined position to the horizontal position by contraction of the cylinder 73 of the tilt mechanism (FIG. 7D). ), The substrate S is transferred to the drying chamber 5 by being transferred from the transfer roller 47 to the transfer roller 51.

  The configuration of the substrate processing apparatus 1 shown in FIGS. 6 and 7 can provide the same effects as the substrate processing apparatus 1 of the above embodiment.

  In the above-described embodiment, the inclination of the substrate S in the temporary inclination posture is set in the range of 0 ° to 5 °, and the inclination of the substrate S in the main inclination posture is set in the range of 3 ° to 9 °. The inclination is an example, and may be set as appropriate according to the type and size of the substrate S and the type of processing liquid. However, when the development process and the cleaning process are sequentially performed on the rectangular LCD glass substrate S as in the embodiment, the inclination of the temporary inclination posture is 0 ° to 5 °, and the inclination of the main inclination posture is 3 ° to 3 °. By setting each within the range of 9 °, it can be expected to obtain a generally good result. Further, as in the modified example (3), the inclination when the substrate S is temporarily stopped during the change of the posture of the development changing chamber 3B is 1 ° when the inclination of the temporary inclination posture is 0 ° to 5 °. It can be expected that generally good results can be obtained by setting the angle to ˜3 ° (substantially half of the temporary inclined posture).

1 is a schematic side view showing an overall configuration of a substrate processing apparatus according to the present invention (a substrate processing apparatus in which a substrate processing method of the present invention is used). It is a perspective view which shows the structure of a development processing chamber. It is a perspective view which shows the structure of a development processing chamber. It is a schematic perspective view which shows the relationship between the progress state of a process, and the attitude | position of a board | substrate. It is a typical side view which shows the whole structure of the other substrate processing apparatus (substrate processing apparatus in which the substrate processing method of this invention is used) based on this invention. It is a typical side view which shows the whole structure of the other substrate processing apparatus (substrate processing apparatus in which the substrate processing method of this invention is used) based on this invention. It is a typical side view which shows the whole structure of the other substrate processing apparatus (substrate processing apparatus in which the substrate processing method of this invention is used) based on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Loader chamber 3 Development processing chamber 3A Liquid layer formation chamber 3B Development replacement chamber 4 Cleaning processing chamber 4A Cleaning replacement chamber 4B Main cleaning chamber 5 Drying chamber 6 Unloader chamber

Claims (8)

While transporting the substrate, a first process for supplying the processing liquid to the substrate in the horizontal posture in the first processing unit, and a second process for supplying the processing liquid to the substrate in the tilted posture in the second processing unit. In the sequential substrate processing method,
After the first processing, the substrate is converted from a horizontal posture to a provisional tilt posture having a predetermined tilt posture and a tilt angle smaller than the main tilt posture predetermined as a posture suitable for the second process. Posture change process;
A transporting step of transporting the substrate in the temporarily inclined posture from the first processing unit to the second processing unit;
A second posture conversion step of converting the posture of the substrate from the temporary tilt posture to the main tilt posture in the second processing unit;
And a substrate processing step of performing the second processing on the substrate in the inclined posture after the second posture changing step. The substrate processing method according to claim 1,
A substrate processing method comprising: a first preceding processing step for performing the second processing on the substrate transported in a temporary inclined posture prior to the substrate processing step before the second posture changing step. In the substrate processing method of Claim 1 or 2,
Prior to the substrate processing step, there is provided a substrate processing method comprising a second preceding processing step for performing the second processing on a substrate whose posture is being changed in the second posture changing step. In the substrate processing method in any one of Claims 1 thru | or 3,
At the time of changing the posture of the substrate in the first posture changing step, the posture of the substrate is temporarily held at a tilt posture having a lower inclination than the temporary tilt posture, and then converted into the temporary tilt posture. Substrate processing method. A first processing unit that supplies a processing liquid to a horizontally oriented substrate in the substrate transfer direction to perform a first process, and a second processing unit that supplies a processing liquid to a substrate in an inclined position to perform a second process In a substrate processing apparatus for sequentially performing the first processing and the second processing on the substrate,
Arranged in the first processing unit, and after the first processing, the substrate is in a predetermined inclined posture from a horizontal posture, and has a lower inclination than the main inclined posture that is predetermined as a posture suitable for the second processing. First posture converting means for converting to a temporary inclined posture;
Inclined transport means for transporting the substrate from the first processing unit to the second processing unit in the temporary tilted posture;
A second attitude conversion unit that is provided in each of the second processing units and converts the attitude of the substrate from the temporary inclination attitude to the main inclination attitude, and the substrate converted into the main inclination attitude by the second attitude conversion means. And a processing liquid supply means for supplying the processing liquid. The substrate processing apparatus according to claim 5,
Prior to the supply of the processing liquid by the processing liquid supply means to the second processing section, a first preceding processing liquid supply means for supplying the processing liquid for the second processing to the substrate conveyed in a temporary inclined posture. The substrate processing apparatus characterized by the above-mentioned. In the substrate processing apparatus according to claim 5 or 6,
Prior to the supply of the processing liquid by the processing liquid supply means to the second processing section, a second preceding process for supplying the processing liquid for the second processing to the substrate undergoing attitude change by the second attitude changing means. A substrate processing apparatus, wherein a liquid supply means is provided. The substrate processing apparatus according to any one of claims 5 to 7,
The substrate processing apparatus is characterized in that the first posture changing means temporarily holds the posture of the substrate in a tilt posture having an inclination smaller than the temporary tilt posture, and then converts the substrate posture to the temporary tilt posture.

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