JP2008021884A - Inspection device - Google Patents

Abstract

An inspection apparatus capable of improving the efficiency of inspection is provided.
A rotating support portion (rotating table) 20 that supports and rotates an inspection object (semiconductor wafer) 10 and an eccentric state between the center of the inspection object and the rotation center of the rotation support portion are detected. The eccentric state detecting units 32 and 33, the defect detecting unit 40 for detecting a defect in the peripheral region 10a of the inspection object, and the peripheral region of the inspection object and the defect detecting unit based on the eccentric state And an adjustment unit (positioning mechanism 30) for adjusting the relative positional relationship.
[Selection] Figure 1

Description

  The present invention relates to an inspection apparatus for inspecting defects such as resist residues, cracks, chipping, and particle adhesion at peripheral portions of an inspection object such as a semiconductor wafer or a liquid crystal glass substrate.

  A lithography process for manufacturing a semiconductor chip includes a resist coating process, an exposure process, a cleaning process, an etching process, a resist removal process, and the like. Usually, a defect inspection is performed for each of these processes. During this defect inspection, there are various defects occurring at the peripheral portion of the semiconductor wafer, such as resist residues, cracks, chips, and adhesion of particles. This defect inspection at the peripheral portion is important because the defect extends to the chip region in the vicinity thereof and greatly affects the yield of the semiconductor chip.

  As an apparatus for inspecting defects at the peripheral portion of a semiconductor wafer, for example, the semiconductor wafer is taken out from a cassette that temporarily stores the semiconductor wafer that has undergone the etching process, etc., and is transferred to an alignment mechanism for alignment. Then, an apparatus has been proposed in which a defect is inspected by being transferred onto an inspection table (rotary table) of an inspection apparatus and returned from the rotary table to the cassette after the inspection is completed (Patent Document 1).

WO03 / 028089 Publication

  In the above-described inspection apparatus, the semiconductor wafer taken out from the cassette is transferred to the alignment mechanism, aligned by the alignment mechanism, and then transferred onto the rotary table of the inspection apparatus. This was an obstacle to improving the efficiency of the inspection. In addition, the semiconductor wafer may be displaced in the process of being transferred from the alignment mechanism onto the rotary table of the inspection apparatus, which may cause a situation where alignment is necessary again. This also increases the efficiency of the inspection. It was an obstacle.

  An object of the present invention is to provide an inspection apparatus capable of increasing the efficiency of inspection.

  The inspection apparatus according to claim 1 of the present invention that achieves the above object includes a rotation support portion that supports and rotates an object to be inspected, and a center between the center of the inspection object and a rotation center of the rotation support portion. An eccentric state detection unit that detects an eccentric state, a defect detection unit that detects a defect in a peripheral part of the inspection object, and a relative relationship between the peripheral part of the inspection object and the defect detection unit based on the eccentric state And an adjusting unit for adjusting the target positional relationship.

  Examples of the inspection object include a semiconductor wafer such as a silicon wafer, a liquid crystal glass substrate, and the like.

  As the eccentric state detection unit, for example, in the peripheral part of the inspection object, a light emitting part that irradiates light toward the peripheral part is arranged on the back side of the inspection object, and light from the light emitting part is disposed on the front side. Based on the output change of the light receiving unit during rotation of the test object by the rotation support unit so that the peripheral part of the test object crosses the optical path between the light emitting unit and the light receiving unit. However, the present invention is not limited to this.

  In the eccentric state, for example, the amount of eccentricity between the center of the object to be inspected (the point at which the deviation of the distance from the peripheral edge in the direction perpendicular to the rotation axis is minimum) and the rotation center of the rotation support portion, The eccentric direction is included.

  Examples of the adjustment unit include a mechanism for moving the rotation support unit with respect to the inspection object based on the eccentric state, or a mechanism for moving the defect detection unit with respect to the inspection object. However, the present invention is not limited to this.

  The defect detection unit includes, for example, an illumination unit that irradiates light to the peripheral part of the inspection object and a light receiving unit that receives scattered light from the peripheral part (see FIG. 4). It is not limited to this.

  The inspection apparatus according to claim 2 of the present invention is characterized in that the eccentricity detection unit and the defect detection unit are arranged along the periphery of the inspection object on the rotation support unit.

  Arrangement of the eccentricity detection unit and the defect detection unit along the periphery of the object to be inspected on the rotation support unit is, for example, the inspection with rotation of the object to be inspected on the rotation support unit. This means that the eccentric state detection unit and the defect detection unit are arranged so that the peripheral part of an object can move to the eccentric state detection unit and then move to the defect inspection unit (see FIG. 1).

  According to a third aspect of the present invention, there is provided an inspection apparatus including an alignment mechanism that aligns a center of the inspection object and a rotation center of the rotation support portion based on the eccentric state.

  As the alignment mechanism, for example, the rotation support unit is configured to be movable up and down, a support pin that temporarily holds the inspection object on the rotation support unit, and an XY table that moves and adjusts the rotation support member The rotation support part is lowered and the inspection object on the rotation support part is temporarily supported by a support pin. In this state, the rotation support part is moved based on the eccentric state by the XY table. After adjusting and eliminating the eccentricity between the center of the object to be inspected and the center of rotation of the rotation support part, the rotation support part is raised and the object to be inspected is placed on the rotation support part from the support pin. Although there is what is mounted again (refer FIG. 3), it is not limited to this.

  The inspection apparatus according to claim 4 of the present invention is such that the defect detection unit irradiates light to a peripheral part of the inspection object, and scatters from the peripheral part irradiated with light by the illumination part. And a light receiving unit for detecting light.

  When detecting the defect by receiving the scattered light, the scattered light is emitted from the peripheral portion by irradiation of illumination light when the peripheral portion is not in the specular state, so that the non-specular state is detected. Become. This non-mirror surface state includes, in addition to the original defect, clouding of the peripheral portion that does not actually cause a problem.

  The illumination unit is, for example, a unit that irradiates a peripheral portion of the inspection object with laser light or spot light, but is not limited thereto. Examples of the light receiving unit include, but are not limited to, a silicon photodiode (SPD) that receives scattered light from the peripheral portion.

  According to a fifth aspect of the present invention, there is provided an inspection apparatus including a defect observation unit that acquires surface information of a defect portion in a peripheral portion of the inspection object detected by the defect detection unit.

  Examples of the defect observing unit include an illuminating unit that illuminates a defective part, a CCD camera that photographs the illuminated defective part, an image processing unit that performs image processing on a photographed image of the CCD camera, and the image processing part. Or a display that displays a photographed image that has been subjected to image processing in FIG. 5, or an illumination unit that illuminates a defective portion and a display that displays an enlarged display of the defective portion (see FIG. 5). It is not limited.

  The inspection apparatus according to claim 6 of the present invention is characterized in that the eccentric state detection unit detects an index unit provided on the inspection object.

  Examples of the indicator part include a notch part in which a peripheral part of the inspection object is cut out in a substantially V shape, an orientation flat in which a part of the peripheral part is cut out to be flat, and the like. It is not limited to this.

  The inspection apparatus according to claim 7 of the present invention includes a storage unit that stores position information of the inspection object from the index unit to the defective part.

  The position information is, for example, a pulse signal generated from the encoder as the rotation support unit rotates from the time when the index support unit is detected to the time when the defect is detected after the rotation support unit is equipped with an encoder. However, the present invention is not limited to this. In addition to being used in the inspection apparatus of the present invention, the position information can also be used when the inspection object is inspected by being transported to another inspection apparatus.

  The inspection apparatus according to claim 8 of the present invention is characterized in that the rotation support unit moves the defect portion to the defect observation unit based on position information stored in the storage unit.

  According to the inspection apparatus of the present invention, it is possible to improve the efficiency of inspection.

  An embodiment of the surface inspection apparatus of the present invention will be described below with reference to FIGS.

  FIG. 1 is a schematic plan view showing an embodiment of the inspection apparatus of the present invention, and FIG. 2 is a schematic front view thereof.

  As shown in FIG. 1, the inspection apparatus 100 includes an alignment mechanism 30 having the functions of an eccentricity detection unit and an index detection unit around an object to be inspected (semiconductor wafer) 10 on a rotary table 20 as a rotation support unit. The defect detection unit 40 and the defect observation unit 50 are sequentially arranged in the rotation direction of the semiconductor wafer 10.

  After each process such as a resist coating process, an exposure process, and a cleaning process in the lithography process, the semiconductor wafer 10 as the inspection object stored in the uninspected wafer storage cassette 70 is taken out by the transfer arm 60 and rotated. It is transferred onto the table 20. As the turntable rotates, the semiconductor wafer 10 is first moved to the alignment mechanism 30, then moved to the defect detection unit 40, and then moved to the defect observation unit 50. After the observation is completed, the rotary table 20 is rotated to move the semiconductor wafer 10 to the carry-out position. The semiconductor wafer 10 is taken out of the rotary table 10 by the transfer arm 60 and stored in the inspected wafer storage cassette 75. The inspected wafer storage cassette 75 is transported to another process of the lithography process or transported to another inspection apparatus.

  Next, the alignment mechanism 30, the defect detection unit 40, and the defect observation unit 50 described above will be described in detail.

  As described above, the alignment mechanism 30 has the functions of the eccentricity detection unit and the index detection unit. As shown in FIGS. 3 and 5, the mounting table 21 on which the semiconductor wafer 10 is mounted can be moved up and down. The rotary table 20, an XY table 31 (rotary XY stage) on which the rotary table 20 is mounted, and a light emitting diode (LED) that emits light from the back side of the semiconductor wafer 10 at the peripheral portion of the semiconductor wafer 10. A light emitting unit 32, a light receiving unit 33 comprising a CCD or the like for receiving light from the light emitting unit 32 from the front side, and a temporary peripheral portion of the semiconductor wafer 10 instead of the mounting table 21 when the mounting table 21 is lowered. A plurality of (for example, three) support pins 34 to be supported in general, and an encoder 35 for generating a pulse signal as the turntable 20 rotates.

  The light emitting unit 32 and the light receiving unit 33 function as an eccentric state detecting unit and an index detecting unit. That is, the semiconductor wafer 10 is mounted on the mounting table 21 of the turntable 20 so that the peripheral portion 10a of the semiconductor wafer 10 crosses the optical path between the light emitting unit 32 and the light receiving unit 33. In this state, the turntable 20 The eccentric state can be detected and the notch 11 can be detected by monitoring the output change of the light receiving unit 33 while rotating the semiconductor wafer 10 by driving.

  For example, when the center of the semiconductor wafer 10 and the rotation center of the turntable 20 are not coincident with each other and are shifted (eccentric), they are blocked by the peripheral portion 10 a of the semiconductor wafer 10 as the semiconductor wafer 10 rotates. The amount of light from the light emitting unit 32 to the light receiving unit 33 changes, and the output of the light receiving unit 33 changes in a sine wave (cosine wave) as shown by a two-dot chain line in FIG. The difference between the maximum value and the minimum value of the output of the light receiving unit 33 is proportional to the amount of eccentricity. On the other hand, when the center portion of the semiconductor wafer 10 and the rotation center of the turntable 20 coincide (is not eccentric), the light emitting portion 32 to the light receiving portion 33 blocked by the peripheral portion 10a of the semiconductor wafer 10 is obtained. The amount of light is constant, and the output of the light receiving unit 33 is constant and linear as shown by the solid line in FIG. The eccentric direction is detected based on the output of the light receiving unit 33 when it is not decentered, whether it exceeds or falls below this.

  Further, when the portion of the notch 11 of the semiconductor wafer 10 moves to the optical path between the light emitting portion 32 and the light receiving portion 33, the amount of light blocked by the portion of the notch 11 changes greatly compared to other portions. Therefore, the notch 11 can be detected from the output change of the light receiving unit 33 (see the portion where the output change of the solid line portion in FIG. 6A). Note that the output change of the light receiving unit 33 at the notch 11 portion is omitted in the two-dot chain line of FIG. 6A showing the output change of the light receiving unit 33 when it is eccentric. .

  The output of the light receiving unit 33 includes information on the eccentric state (the amount of eccentricity and the eccentric direction) and detection information on the notch 11, and controls the entire inspection apparatus 100 via an AD converter (not shown) and the interface 80. Input to the CPU 82 to perform. In the CPU 82, based on the output from the light receiving unit 33, first, the mounting table 21 is lowered by a predetermined amount, then the XY table 31 is driven by a predetermined amount in a predetermined direction, and thereafter, a driving signal for raising the mounting table 21 by a predetermined amount. And output to the alignment mechanism 30 via a DA converter and interface 80 (not shown). Further, the detection information of the notch 11 is stored in the storage unit 84.

  In the alignment mechanism 30, first, the drive table 21 is lowered by the drive signal output from the CPU 82 until the semiconductor wafer 10 is supported on the support pins 34 and the mounting table 21 is separated from the semiconductor wafer 10. Next, the XY table 31 is driven so that the rotation center of the turntable 20 is positioned on a vertical line passing through the center of the semiconductor wafer 10 in the direction in which the eccentric state is eliminated. Thereafter, the mounting table 21 is raised so that the semiconductor wafer 10 is lifted off the support pins 34.

  When the semiconductor wafer 10 is separated from the support pins 34, the turntable 20 is driven to move the peripheral portion 10 a of the semiconductor wafer 10 to the defect detection unit 40.

  As shown in FIG. 4, the defect detection unit 40 irradiates the peripheral portion 10a of the semiconductor wafer 10 with illumination light for defect detection such as laser light and spot light, and has a light source and the peripheral portion 10a. A light receiving portion 42 which may include a silicon photodiode (SPD) for receiving scattered light from the light. While the semiconductor wafer 10 is rotated by the turntable 20, the light receiving unit 42 detects (receives) scattered light from the peripheral part 10a while irradiating the peripheral part 10a with illumination light from the illumination unit 41. The light receiving unit 42 outputs a detection signal having an instantaneous peak value as shown in FIG. 6B when the scattered light is received from the peripheral portion 10a. When the peripheral portion 10a is in a mirror state, specularly reflected light is emitted from the peripheral portion 10a, scattered light is not emitted, and the output of the light receiving unit 42 remains at a zero level. The peripheral part 10a is not in a mirror state (non-specular part), for example, a non-specular part (defect part) in which resist residue, cracks, chips, particles are attached, and a rough surface that does not actually cause a problem. When there are non-specular portions such as cloudiness, scattered light is emitted from these non-specular portions. Since the regular reflection light has a reflection angle equal to the incident angle of the illumination light with respect to the normal line, if the light receiving unit 42 is installed at a position other than the reflection angle, only the scattered light is received without receiving the regular reflection light. Can do. There are various directions and angles at which scattered light is emitted, and it varies depending on the surface state of the non-specular surface. However, the general direction and angle can be experimentally determined, and the light receiving unit 42 is disposed at the experimentally determined location. By doing so, it becomes possible to reliably receive scattered light. If a plurality of light receiving units 42 are provided, the probability of receiving scattered light is improved, and it is possible to detect a non-specular surface without leaking.

  The output of the light receiving unit 42 is input to the CPU 82 via an AD converter and interface 80 (not shown). In the CPU 82, the output from the light receiving unit 33 and the output from the encoder 35 are input. When the output from the light receiving unit 42 is input, the distance (rotation angle θ) from the notch 11, that is, the light receiving unit 42 detects it. The position information of the non-specular surface is obtained. For example, by counting the pulse signal emitted from the encoder 35 from the time when the notch 11 is detected until the time when the detection signal from the light receiving unit 42 is input, the rotation angle of the rotary table 20 between them is calculated, and the non-specular surface location is calculated. Find location information. This position information is stored in the storage unit 84.

FIG. 6B shows the output of the light receiving unit 42 when there are a plurality (three) of non-specular surfaces, and the CPU 82 obtains position information θ ₁ , θ ₂ , θ ₃ from the notch 11 at each of these locations. The position information θ ₁ , θ ₂ , θ ₃ is stored in the storage unit 84.

  The CPU 82 reads the position information stored in the storage unit 84, controls the driving of the rotary table 20 based on this position information, moves the non-specular surface part to the defect observation unit 50, and stops the rotary table 20.

  As shown in FIG. 5, the defect observing unit 50 illuminates a non-specular surface with illumination light for photographing, a CCD camera 52 for photographing the illuminated portion, and a photographing signal of the CCD camera 52. An image processing unit 53 for processing and a display 54 for displaying a photographed image processed by the image processing unit 53 are provided.

  In the defect observing unit 50, when the non-specular portion is located in the imaging region (observation region) of the CCD camera 52, the CCD camera 52 captures this portion while irradiating illumination light from the illumination unit 51. When there are a plurality of non-specular portions, each portion is positioned in the photographing region and images are taken sequentially. The location detected by the defect detection unit 40 is a non-specular location that is not simply a mirror surface, and the peripheral portion 10a is clouded in addition to the original defects such as resist residue, cracks, chipping, and particle adhesion. Since there are cases where the surface is slightly rough and does not actually cause a problem, it is determined whether or not it is an original defect by subjecting the image signal of the CCD camera 52 to image processing by the image processing unit 53 and examining it. To do. If it is determined as a defect, it is determined whether the degree, type, and position are within an allowable range. The captured image that has undergone image processing is displayed on the display 54. Information such as the degree, type, and position of defects is stored in the storage unit 84.

  It is also possible to check whether there is an abnormality in the resist cut width by sequentially acquiring images of the peripheral portion 10a by the CCD camera 52 while rotating the turntable 20 and performing image processing by the image processing unit 53. . This confirmation may be performed simultaneously with the detection of scattered light and the observation and inspection of the defective portion.

  FIG. 7 shows a flowchart of the operation of the inspection apparatus 100 of this embodiment.

  In step 100, after completion of each process such as a resist coating process, an exposure process, and a cleaning process in the lithography process, the semiconductor wafer 10 stored in the uninspected wafer storage cassette 70 (see FIG. 1) is transferred to the transfer arm 60 (see FIG. 1). ) And transported onto the rotary table 20.

  In step S <b> 101, the rotary table 20 is driven to move the semiconductor wafer 10 to the alignment mechanism 30. In step S102, the alignment mechanism 30 detects the peripheral portion 10a of the semiconductor wafer 10 and the notch 11, and obtains an eccentric state between the center portion of the semiconductor wafer 10 and the rotation center of the turntable 20, and this eccentric state is obtained. Based on this, the rotation stage 20 is moved and adjusted with respect to the semiconductor wafer 10 by the XY table 31 to perform alignment (center alignment) so that the eccentric state becomes zero. When the rotary table 20 is moved, the semiconductor wafer 10 is separated from the rotary table 20 as described above. In step S103, it is determined whether or not the alignment operation has been completed. If the alignment operation has not been completed, the alignment operation is continued. If it has been completed, the process proceeds to step S104.

  In step S104, the semiconductor wafer 10 is moved to the defect detection unit 40, and scattered light emitted from the peripheral portion 10a of the semiconductor wafer 10 is detected by illumination by the illumination unit 41. This scattered light is emitted from a non-mirror surface portion, for example, a portion having a defect such as a resist residue, crack, chipping, or particle adhesion. The detected position information of the non-specular portion including the defect is stored in the storage unit 84, and the rotary table 20 is driven based on this position information to move the non-specular portion to the defect observing unit 50.

  In step S105, it is determined whether or not a non-specular surface including a defect has reached the defect observing unit 50. If not, the driving of the rotary table 20 is continued. If it has reached, the process proceeds to step S106. Then, the rotary table 20 is stopped, and the non-specular surface portion is positioned within the imaging region by the CCD camera 52. In step S107, this part is photographed, and this is subjected to image processing by the image processing unit 53 and observed to determine whether or not it is a defect. When there are a plurality of non-specular portions detected by the defect detection unit 40, Steps S105, S106, and 107 are executed for each of these portions. In step S108, it is determined whether or not the observation with the defect observation unit 50 is finished. If not, the process returns to step S105, and steps S106 and 107 are repeated. If completed, the process proceeds to step S109. If the amount of eccentricity is small in step S102, one or both of defect detection and defect observation may be performed in step S102.

  In step S109, the turntable 20 is driven to move the semiconductor wafer 10 to the unloading position. In step S <b> 110, the semiconductor wafer 10 is taken out from the turntable 20 by the transfer arm 60 and stored in the inspected wafer storage cassette 75.

  In step S111, it is determined whether or not the inspection of the peripheral portion 10a of the semiconductor wafer 10 is to be continued. If so, the process returns to step S100 and the above-described operation is repeated. If it is not continued, the inspection is terminated. The determination of whether or not to continue the inspection is performed by, for example, inputting the number of semiconductor wafers 10 to be inspected previously stored in the uninspected wafer storage cassette 70 to the CPU 82 and determining the number of inspections every time inspection is completed. Counting is performed, and the inspection is terminated when the input number is reached.

  According to the inspection apparatus 100 of the present embodiment described above, the alignment mechanism 30, the defect detection unit 40, and the defect observation unit 50 are sequentially arranged around the semiconductor wafer 10 on the turntable 20 in the rotation direction of the semiconductor wafer 10. And the alignment mechanism 30 aligns the center of the semiconductor wafer 10 and the rotation center of the turntable 20, and then the defect detection unit 40 identifies the location including the defect, and then the location including the defect is determined as the defect observation unit. 50, the image is picked up by the CCD camera 52 and processed by the image processing unit 53 to detect and observe the defect in the peripheral portion 10a of the semiconductor wafer 10, so that the inspection time can be greatly shortened.

  That is, since the semiconductor wafer 10 is taken out from the uninspected wafer cassette 70 by the transfer arm 60 and transferred onto the rotary table 20, the alignment is performed. Therefore, the semiconductor wafer taken out from the cassette is once transferred to the alignment mechanism and positioned. The transfer time of the semiconductor wafer 10 can be shortened as compared with the case where the wafers are aligned and then transferred onto the rotary table of the inspection apparatus (transferring the semiconductor wafer twice).

  Moreover, since the defect location is observed in detail after the defect location is specified in advance, the defect observation time can be shortened.

  Furthermore, there is no possibility that the semiconductor wafer is displaced in the process of being transferred from the alignment mechanism onto the rotary table of the inspection apparatus, and the alignment is required again.

  The present invention is not limited to the above embodiment. For example, without aligning the center of the semiconductor wafer 10 and the rotation center of the turntable 20, the defect detection unit 40 itself is moved while irradiating the peripheral portion 10 a of the semiconductor wafer 10 with illumination light from the illumination unit 41. Alternatively, the light receiving unit 42 may receive the scattered light and detect the defect.

  The defect detection unit 40 receives the scattered light to detect a non-specular state, and the defect observation unit 50 examines this to determine whether the defect is an original defect. Only the defect may be detected and observed.

  Further, a microscope may be installed in the defect observation unit 50 instead of the CCD camera 52, and an observation image obtained by the microscope may be enlarged and displayed on the display 54.

It is a schematic plan view which shows one Embodiment of the test | inspection apparatus of this invention. It is a schematic front view. It is a schematic side view of a rotary table and an alignment mechanism. It is a schematic side view of a defect detection part. It is a block diagram of the inspection apparatus shown in FIG. FIG. 6A is a graph showing a change in output of the light receiving unit constituting the alignment mechanism, and FIG. 6B is a graph showing a change in output of the light receiving unit constituting the defect detecting unit. It is a flowchart which shows operation | movement of the test | inspection apparatus shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Semiconductor wafer 10a Peripheral part 20 Rotary table 30 Positioning mechanism 31 XY table 32 Light emission part 33 Light reception part 34 Support pin 40 Defect detection part 41 Illumination part 42 Light reception part 50 Defect observation part 51 Illumination part 52 CCD camera 53 Image processing part 54 display

Claims (8)

A rotation support unit that supports and rotates the object to be inspected;
An eccentric state detection unit for detecting an eccentric state between the center of the inspection object and the rotation center of the rotation support unit;
A defect detection unit for detecting a defect in a peripheral portion of the inspection object;
An adjustment unit for adjusting a relative positional relationship between the peripheral portion of the inspection object and the defect detection unit based on the eccentric state;
An inspection apparatus comprising: The inspection apparatus according to claim 1,
An inspection apparatus comprising the eccentric state detection unit and the defect detection unit arranged along a periphery of the inspection object on the rotation support unit. The inspection apparatus according to claim 1 or 2,
An inspection apparatus comprising an alignment mechanism that aligns the center of the inspection object with the rotation center of the rotation support portion based on the eccentric state. The inspection apparatus according to any one of claims 1 to 3,
The defect detection unit includes an illumination unit that irradiates light to a peripheral part of the inspection object, and a light receiving unit that detects scattered light from the peripheral part irradiated with light by the illumination unit. Inspection device to do. The inspection apparatus according to any one of claims 1 to 4,
An inspection apparatus comprising: a defect observing unit that acquires surface information of a defect portion in a peripheral portion of the inspection object detected by the defect detection unit. In the inspection apparatus according to any one of claims 1 to 5,
The eccentric state detection unit detects an index unit provided on the inspection object. The inspection apparatus according to claim 6, wherein
An inspection apparatus comprising: a storage unit that stores position information of the inspection object from the index unit to the defective part. The inspection apparatus according to claim 7,
The said rotation support part moves the said defect location to the said defect observation part based on the positional information memorize | stored in the said memory | storage part, The inspection apparatus characterized by the above-mentioned.

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