JP2008015314A - Exposure equipment - Google Patents

Abstract

An exposure apparatus capable of reliably preventing damage to a mask due to interference with a substrate.
A division sequential proximity exposure apparatus PE emits a laser beam LB that passes in a substantially horizontal direction at a predetermined position between a mask M held on a mask stage 1 and a substrate W held on a work stage 2. When the amount of received light of the laser beam LB in the laser monitoring device 70 having the light emitting units 71 and 72 and the light receiving units 73 and 74 that receive the laser beam LB and the light receiving units 73 and 74 becomes a predetermined value or less, And a control device 80 for stopping the upward movement of the work stage.
[Selection] Figure 1

Description

  The present invention relates to an exposure apparatus suitable for performing proximity exposure transfer of a mask pattern of a mask onto a substrate of a large flat panel display such as a liquid crystal display or a plasma display by a divided sequential exposure method.

  Conventionally, various exposure apparatuses for producing color filters for flat panel display devices such as liquid crystal display devices and plasma display devices have been devised (see, for example, Patent Documents 1 and 2). The exposure apparatus described in Patent Document 1 uses a mask smaller than a substrate as an exposed material, holds the mask on a mask stage, holds the substrate on a work stage, and closes them to face each other. In this state, the work stage is moved stepwise with respect to the mask, and the substrate is irradiated with light for pattern exposure from the mask side at each step, whereby a plurality of mask patterns drawn on the mask are exposed and transferred onto the substrate. A plurality of displays and the like are created on a single substrate. When the substrate and the mask are arranged to face each other, after the substrate positioning operation is completed, the adjustment operation for the target gap is performed while detecting the gap between the substrate and the mask using a gap sensor.

The exposure apparatus described in Patent Document 2 is provided with a non-contact type measurement device and a gate in the middle of the movement path of the substrate, and when the substrate is to be contacted with the mask at a position that is not detected by the measurement device, the substrate is In contact with the metal gate, the mask is protected.
JP 2000-35676 A JP 2004-272139 A

  By the way, with the recent increase in size of flat panel display devices, masks for producing color filters are also increasing (for example, 1400 mm × 1200 mm), and the price per mask is also increasing. For this reason, it is desired to reliably prevent the substrate from coming into contact with the mask and damaging the mask.

  The exposure apparatus described in Patent Document 1 performs gap adjustment while detecting the gap between the substrate and the mask. Due to a non-contact type gap sensor, the substrate comes into contact with the mask due to an operation error or the like. There was a possibility.

  In addition, since the exposure apparatus described in Patent Document 2 uses a non-contact type gap sensor, the above-described problems exist and the operator confirms the movement of the work stage when the substrate comes into contact with the gate. Needed to be controlled.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide an exposure apparatus that can reliably prevent damage to a mask.

The above object of the present invention is achieved by the following configurations.
(1) A work stage that holds a substrate as an exposure target, a mask stage that is disposed opposite to the substrate and holds a mask, and an irradiation unit that irradiates the substrate with light for pattern exposure through the mask; An exposure apparatus comprising: a feed mechanism for relatively step-moving the work stage and the mask stage so that the mask pattern of the mask faces a plurality of predetermined positions on the substrate;
A laser having a light emitting unit that emits a laser beam that passes through a predetermined position between a mask held on a mask stage and a substrate held on a work stage in a substantially horizontal direction, and a light receiving unit that receives the laser beam. A monitoring device;
A control device that stops the vertical movement of at least one of the mask stage and the work stage when the amount of laser beam received by the light receiving unit is equal to or less than a predetermined value;
An exposure apparatus comprising:
(2) a work stage that holds a substrate as an exposed material, a mask stage that is arranged opposite to the substrate and holds a mask, and irradiation means that irradiates the substrate with light for pattern exposure through the mask; An exposure apparatus comprising: a feed mechanism for relatively step-moving the work stage and the mask stage so that the mask pattern of the mask faces a plurality of predetermined positions on the substrate;
A mask disposed in the vicinity of the edge of the mask on the mask stage, having a light emitting portion for emitting a laser beam toward the substrate and a light receiving portion for receiving the laser beam reflected by the substrate, and a mask held on the mask stage; A laser monitoring device that monitors the gap by measuring the gap between the substrate and the substrate held on the work stage;
A control device that stops the vertical movement of at least one of the mask stage and the work stage when the gap is equal to or less than a predetermined value;
An exposure apparatus comprising:

  According to the present invention, when the laser monitoring device detects that the gap between the mask and the substrate is equal to or less than the predetermined value, the control device stops the vertical movement of at least one of the mask stage and the work stage. Therefore, it is possible to avoid contact between the mask and the substrate adjacent to each other at the time of exposure, and reliably prevent damage to the mask.

  Hereinafter, embodiments of the exposure apparatus of the present invention will be described in detail with reference to the accompanying drawings.

(First embodiment)
First, the divided sequential exposure apparatus PE of the present invention will be described. As shown in FIG. 1, the division sequential exposure apparatus PE of this embodiment includes a mask stage 1 that holds a mask M, a work stage 2 that holds a glass substrate (exposed material) W, and light for pattern exposure. An exposure illumination optical system 3 as irradiation means for irradiating, and an apparatus base 4 for supporting the mask stage 1 and the work stage 2 are provided.

  A glass substrate W (hereinafter simply referred to as “substrate W”) is placed on the mask M so as to be exposed to the surface (opposite surface of the mask M) so that the mask pattern P drawn on the mask M is exposed and transferred. An agent is applied to make it translucent.

  For convenience of explanation, the illumination optical system 3 will be described. The illumination optical system 3 is, for example, a high-pressure mercury lamp 31 that is a light source for ultraviolet irradiation, and a concave mirror 32 that collects light emitted from the high-pressure mercury lamp 31. Two types of optical integrators 33 that are switchably arranged in the vicinity of the focal point of the concave mirror 32, plane mirrors 35 and 36, and a spherical mirror 37, and are arranged between the plane mirror 36 and the optical integrator 33 to change the irradiation optical path. An exposure control shutter 34 that controls opening and closing is provided.

  When the exposure control shutter 34 is controlled to be opened during exposure, the light irradiated from the high-pressure mercury lamp 31 passes through the optical path L shown in FIG. 1 and is held on the mask M held on the mask stage 1 and thus on the work stage 2. Irradiated as parallel light for pattern exposure perpendicularly to the surface of the substrate W. Thereby, the mask pattern P of the mask M is exposed and transferred onto the substrate W.

  Next, the mask stage 1 and the work stage 2 will be described in this order. First, the mask stage 1 is provided with a mask stage base 10, and the mask stage base 10 is disposed above the work stage 2 while being supported by a mask stage column 11 protruding from the apparatus base 4.

  As shown in FIG. 2, the mask stage base 10 has a substantially rectangular shape and has an opening 10a at the center. A mask holding frame 12 is mounted on the opening 10a so as to be movable in the X and Y directions. ing.

  As shown in FIG. 3A, the mask holding frame 12 has a flange 12 a provided on the outer periphery of the upper end thereof placed on the upper surface in the vicinity of the opening 10 a of the mask stage base 10. It is inserted through a predetermined gap between the inner periphery. Thereby, the mask holding frame 12 can be moved in the X and Y directions by this gap.

  A chuck portion 16 for holding the mask M is fixed to the lower surface of the mask holding frame 12 via a spacer 20 and moves together with the mask holding frame 12 in the X and Y directions with respect to the mask stage base 10. Is possible. A plurality of suction nozzles 16 a are formed on the lower surface of the chuck portion 16 for sucking the peripheral edge, which is the end of the mask M on which the mask pattern P is drawn. Thereby, the mask M is detachably held by the vacuum suction device (not shown) through the suction nozzle 16a.

  Further, in FIG. 2, the mask holding frame 12 is moved on the upper surface of the mask stage base 10 in the XY plane based on a detection result by an alignment camera 15 described later or a measurement result by a laser length measuring device 60 described later. A mask position adjusting means 13 for adjusting the position and posture of the mask M held by the mask holding frame 12 is provided.

  The mask position adjusting means 13 includes an X-axis direction driving device 13x attached to one side of the mask holding frame 12 along the Y-axis direction, and two Y-axes attached to one side of the mask holding frame 12 along the X-axis direction. And a direction driving device 13y.

  3A and 3B, the X-axis direction drive device 13x includes a drive actuator (for example, an electric actuator) 131 having a rod 131r that expands and contracts in the X-axis direction, and a mask holding frame 12. And a linear guide (linear motion bearing guide) 133 attached to a side portion along the Y-axis direction. The guide rail 133r of the linear guide 133 extends in the Y-axis direction and is fixed to the mask holding frame 12. A slider 133 s movably attached to the guide rail 133 r is connected to the tip of a rod 131 r fixed to the mask stage base 10 via a pin support mechanism 132.

  On the other hand, the Y-axis direction drive device 13y has the same configuration as the X-axis direction drive device 13x, and includes a drive actuator (for example, an electric actuator) 131 having a rod 131r that expands and contracts in the Y-axis direction, and the mask holding frame 12 And a linear guide (linear motion bearing guide) 133 attached to a side portion along the X-axis direction. The guide rail 133r of the linear guide 133 extends in the X-axis direction and is fixed to the mask holding frame 12. A slider 133s attached to the guide rail 133r so as to be movable is connected to the tip of the rod 131r via a pin support mechanism 132. The X-axis direction driving device 13x adjusts the mask holding frame 12 in the X-axis direction. The two Y-axis direction driving devices 13y adjust the mask holding frame 12 in the Y-axis direction and the θ-axis direction (oscillation around the Z-axis). ).

  Further, inside the two sides facing each other in the X-axis direction of the mask holding frame 12, as shown in FIG. 2, a gap sensor 14 as a means for measuring the gap between the opposing surfaces of the mask M and the substrate W, An alignment camera 15 is provided as means for detecting a plane deviation amount between the mask M and the alignment reference. Both the gap sensor 14 and the alignment camera 15 are movable in the X-axis direction via a moving mechanism 19.

  The moving mechanism 19 has a holding frame 191 for holding the gap sensor 14 and the alignment camera 15 extending in the Y-axis direction on the upper surfaces of the two sides facing each other in the X-axis direction of the mask holding frame 12. The end of the holding base 191 that is separated from the Y-axis direction drive device 13 y is supported by a linear guide 192. The linear guide 192 includes a guide rail 192r that is installed on the mask stage base 10 and extends along the X-axis direction, and a slider (not shown) that moves on the guide rail 192r. The end portion of 191 is fixed.

  Then, the gap sensor 14 and the alignment camera 15 are moved in the X-axis direction via the holding frame 191 by driving the slider by a driving actuator 193 including a motor and a ball screw.

  As shown in FIG. 4, the alignment camera 15 optically detects the mask side alignment mark 101 on the surface of the mask M (mask pattern surface Mm) held on the lower surface of the mask stage 1 from the mask back surface side. Yes, the focus adjustment mechanism 151 moves toward and away from the mask M to perform focus adjustment.

  The focus adjustment mechanism 151 includes a linear guide 152, a ball screw 153, and a motor 154. The linear guide 152 includes a guide rail 152r and a slider 152s. Of these, the guide rail 152r is attached to the holding frame 191 of the moving mechanism 19 of the mask stage 1 so as to extend in the vertical direction. The alignment camera 15 is fixed to the slider 152s via a table 152t. A nut screwed to the screw shaft of the ball screw 153 is connected to the table 152t, and the screw shaft is rotated by a motor 154.

  Further, in this embodiment, as shown in FIG. 5, the work side alignment mark 100 is projected from below with a light source 781 and a condenser lens 782 below the work chuck 8 provided on the work stage 2. An optical system 78 is disposed integrally with the Z-axis fine movement stage 24 in accordance with the optical axis of the alignment camera 15. A through hole corresponding to the optical path of the projection optical system 78 is formed in the work stage 2 and the Y-axis feed base 52.

  Further, in this embodiment, as shown in FIG. 6, the best focus of the alignment image that detects the position of the surface (mask pattern surface Mm) having the mask side alignment mark 101 of the mask M and prevents the alignment camera 15 from being out of focus. An adjustment mechanism 150 is provided. In addition to the alignment camera 15 and the focus adjustment mechanism 151, this best focus adjustment mechanism 150 uses the gap sensor 14 as a focus deviation detection means. That is, the measured value of the mask lower surface position measured by the gap sensor 14 is compared with the focus position preset by the control device 80 to obtain a difference, and the relative focus position change amount from the set focus position is calculated from the difference. The alignment camera 15 is moved by controlling the motor 154 of the focus adjustment mechanism 151 according to the calculated change amount, thereby adjusting the focus of the alignment camera 15.

  By using the best focus adjustment mechanism 150, it is possible to perform high-precision focus adjustment of the alignment image regardless of the plate thickness change of the mask M and the plate thickness variation. That is, when a plurality of types of masks M are exchanged and used, proper focus can always be obtained even if the thicknesses of the individual masks are different. Note that the focus adjustment mechanism 151, the projection optical system 78, the best focus adjustment mechanism 150, and the like not only correspond to the high accuracy of the alignment of the first layer divided pattern, but also the high accuracy of the alignment after the second layer. If the thickness of the mask M is known, the best focus adjustment mechanism 150 may be omitted and the focus adjustment mechanism 151 may be moved according to the thickness.

  Note that masking apertures (shielding plates) 17 that shield both ends of the mask M as necessary are disposed at both ends in the Y-axis direction of the opening 10a of the mask stage base 10 so as to be positioned above the mask M. The masking aperture 17 can be moved in the Y-axis direction by a masking aperture driving device 18 including a motor, a ball screw, and a linear guide so that the shielding areas at both ends of the mask M can be adjusted.

  Next, the work stage 2 is installed on the apparatus base 4, and a work chuck 8 having a chuck surface 8 a on the upper surface for detachably holding the substrate W by a vacuum suction device (not shown) or the like, and a mask A Z-axis feed base (gap adjusting means) 2A that adjusts the gap between the opposing surfaces of M and the substrate W to a predetermined amount, and a work stage 2 that is disposed on the Z-axis feed base 2A and moves in the XY-axis direction. And a work stage feed mechanism 2B.

  As shown in FIG. 7, the Z-axis feed base 2A includes a Z-axis coarse movement stage 22 supported by a vertical coarse movement device 21 erected on the apparatus base 4 so as to be capable of coarse movement in the Z-axis direction. A Z-axis fine movement stage 24 supported by a vertical fine movement device 23 is provided on the coarse axis movement stage 22. For example, an electric actuator composed of a motor and a ball screw or a pneumatic shilling is used for the vertical movement device 21, and the Z-axis coarse movement stage 22 is moved to a preset position by performing a simple vertical movement. Then, it is moved up and down without measuring the gap between the mask M and the substrate W.

  On the other hand, the vertical fine movement device 23 shown in FIG. 1 includes a movable wedge mechanism in which a motor, a ball screw, and a wedge are combined. In this embodiment, for example, the motor 231 installed on the upper surface of the Z-axis coarse movement stage 22. The screw shaft 232 of the ball screw is driven to rotate, the ball screw nut 233 is formed in a wedge shape, and the slope of the wedge nut 233 protrudes from the lower surface of the Z-axis fine movement stage 24. Thus, a movable wedge mechanism is configured.

  When the screw shaft 232 of the ball screw is driven to rotate, the wedge-shaped nut 233 is finely moved in the Y-axis direction. The

  The vertical fine movement device 23 composed of the movable wedge mechanism includes a total of three units, two on one end side (front side in FIG. 1) in the Y-axis direction and one on the other end side (not shown) of the Z-axis fine movement stage 24. It is installed and each is driven and controlled independently. Accordingly, the vertical fine movement device 23 also has a tilt function. Based on the measurement results of the gaps between the mask M and the substrate W by the three gap sensors 14, the mask M and the substrate W are parallel and predetermined. The height of the Z-axis fine movement stage 24 is finely adjusted so as to face each other through the gap. Note that the vertical coarse motion device 21 and the vertical fine motion device 23 may be provided in the Y-axis feed base 52.

  As shown in FIG. 7, the work stage feed mechanism 2B is a kind of two sets of rolling guides that are spaced apart from each other in the Y-axis direction and extended along the X-axis direction on the upper surface of the Z-axis fine movement stage 24. A linear guide 41, an X-axis feed base 42 attached to a slider 41a of the linear guide 41, and an X-axis feed drive device 43 that moves the X-axis feed base 42 in the X-axis direction. An X-axis feed base 42 is connected to a ball screw nut 433 that is screwed to a ball screw shaft 432 that is rotationally driven by a motor 431 of the shaft feed driving device 43.

  Further, on the upper surface of the X-axis feed base 42, a linear guide 51 which is a kind of two sets of rolling guides that are spaced apart from each other in the X-axis direction and extend along the Y-axis direction, and the linear guide Y-axis feed base 52 attached to 51 slider 51a, and Y-axis feed drive device 53 that moves Y-axis feed base 52 in the Y-axis direction, and is rotated by motor 531 of Y-axis feed drive device 53. A Y-axis feed base 52 is connected to a ball screw nut (not shown) screwed to the ball screw shaft 532 to be driven. The work stage 2 is attached to the upper surface of the Y-axis feed base 52.

  A laser length measuring device 60 as a moving distance measuring unit that detects the X-axis and Y-axis positions of the work stage 2 is provided on the device base 4. In the work stage 2 configured as described above, due to errors such as the shape of the ball screw or the linear guide itself, mounting errors thereof, etc., when the work stage 2 is moved, positioning errors, yawing, straightness, etc. Occurrence is inevitable. The laser length measuring device 60 is intended to measure these errors.

  As shown in FIG. 1, the laser length measuring device 60 is provided with a pair of Y-axis interferometers 62 and 63 each provided with a laser so as to face the Y-axis direction end of the work stage 2, and One X-axis interferometer 64 provided at the end of the direction and provided with a laser, a Y-axis mirror 66 disposed at a position facing the Y-axis interferometers 62 and 63 of the work stage 2, and the X of the work stage 2 The X-axis mirror 68 is disposed at a position facing the axial interferometer 64.

  As described above, by providing two Y-axis interferometers 62 and 63 in the Y-axis direction, not only information on the position of the work stage 2 in the Y-axis direction but also a difference in position data between the Y-axis interferometers 62 and 63. You can also know yawing error. The position in the Y-axis direction can be calculated by appropriately correcting both the average value of the two in consideration of the position in the X-axis direction of the work stage 2 and the yawing error.

  Then, when the next divided pattern is connected and exposed following the exposure of the work stage 2 in the XY direction and the Y-axis feed base 52 and the previous divided pattern, each interference is performed at the stage of sending the substrate W to the next area. The detection signals output from the total 62 to 64 are input to the control device 80 as shown in FIG. The control device 80 controls the X-axis feed driving device 43 and the Y-axis feed driving device 53 in order to adjust the amount of movement in the XY direction for the divided exposure based on the detection signal, and also the X-axis interferometer 64. And the detection results of the Y-axis interferometers 62 and 63 are used to calculate a positioning correction amount for joint exposure, and the calculated result is used as the mask position adjustment means 13 (and the vertical fine movement device 23 as required). Output to. As a result, the mask position adjusting means 13 and the like are driven in accordance with the correction amount, and the influence of positioning error, straightness error, yawing and the like caused by the X-axis feed driving device 43 or the Y-axis feed driving device 53 is eliminated.

  As shown in FIGS. 1 and 7, the apparatus base 4 includes a laser monitoring apparatus 70 that monitors a gap between the mask M held on the mask stage 1 and the substrate W held on the work stage 2. Is provided. The laser monitoring device 70 includes light emitting units 71 and 72 that emit a laser beam LB that passes through a predetermined position between the mask M and the substrate W in a substantially horizontal direction, and light receiving units 73 and 74 that receive the laser beam LB. And having. The light emitting units 71 and 72 and the light receiving units 73 and 74 are arranged outside the two-dimensional region in which the work stage 2 moves stepwise, and are set so as to pass through two opposing sides of the mask M, respectively (see FIG. 9).

  For example, when the exposure is performed with the gap g between the mask M and the substrate W being 150 μm, the light emitting units 71 and 72 of the present embodiment pass the laser beam LB to a position about 80 μm away from the lower surface of the mask M. Arrange as follows. For this reason, when the gap between the mask M and the substrate W becomes 80 μm or less, the laser beam LB from the light emitting units 71 and 72 is blocked, and the amount of light received by the light receiving unit 73 changes. When the amount of light received by the light receiving unit 73 is input to the control device 80 and the amount of received light is equal to or less than a predetermined value, it is determined that the substrate W and the mask M are in danger of collision, and the Z-axis feed base 2A ( The motor drive of the vertical coarse motion device 21 or the vertical fine motion device 23) is stopped and controlled.

  The control device 80 of the present embodiment controls the opening of the exposure control shutter 34, the feed control of the work stage 2, the calculation of the correction amount based on the detection values of the laser interferometers 62 to 64, and the driving of the mask position adjusting means 13. In addition to control, calculation of the correction amount at the time of alignment adjustment, drive control of a workpiece automatic supply device (not shown), etc., driving of most actuators incorporated in the divided sequential proximity exposure apparatus PE and predetermined calculation processing, It is executed based on sequence control using a microcomputer or sequencer.

  Next, a process for avoiding a collision between the substrate W and the mask M in the divided successive proximity exposure apparatus PE of the present embodiment will be described with reference to FIG.

  In a state where the mask M is held on the mask stage 1 and alignment adjustment is performed, the substrate W is placed on the work stage 2 by the transport mechanism, and the substrate W is vacuum-sucked by the work chuck. Then, the gap sensor 14 drives the Z-axis feed base 2A so that the gap between the lower surface of the mask M and the upper surface of the substrate W becomes a predetermined value (for example, 150 μm) necessary for exposure. It is adjusted while monitoring. At the same time, the laser beam LB emitted from the light emitting units 71 and 72 passes through the lower surface in the vicinity of the two sides of the mask M, and the received light amounts are detected by the light receiving units 73 and 74.

  As indicated by the alternate long and short dash line in the figure, when the Z-axis feed base 2A rises and the substrate W blocks the laser beam LB from the light emitting units 71 and 72, the amount of light received by the light receiving units 73 and 74 changes. . When the control device 80 detects that the amount of received light is equal to or less than a predetermined value, the control device 80 determines that the substrate W and the mask M are in a collision risk state, and the Z-axis feed base 2A (the vertical coarse motion device 21 or the vertical fine motion 21). The motor drive of the device 23) is stopped. Thereby, the contact between the substrate W and the mask M is avoided.

  Since the laser beam LB passes through the lower surfaces near the two sides of the mask M, the gap between the substrate W and the mask M is the narrowest even when the substrate W approaches the mask M in a tilted state. Any vertex of the substrate W can be detected, so that contact between the substrate W and the mask M can be reliably avoided. In the above description, the laser monitoring device 70 is configured by two sets of light emitting units 71 and 72 and light receiving units 73 and 74. However, an area between two sides is also monitored using a larger number of light emitting units and light receiving units. By doing so, it is possible to detect partial protrusions of the substrate W and foreign matters on the substrate W, and it is possible to more reliably prevent damage to the mask M due to the protrusions and foreign matters.

  Therefore, according to the divided successive proximity exposure apparatus PE of the present embodiment, a laser that passes through a predetermined position between the mask M held on the mask stage 1 and the substrate W held on the work stage 2 in a substantially horizontal direction. A laser monitoring device 70 having light emitting units 71 and 72 for emitting the beam LB and light receiving units 73 and 74 for receiving the laser beam LB; and the amount of light received by the laser beam LB at the light receiving units 73 and 74 is less than a predetermined value. Since the control device 80 that stops the upward movement of the work stage is provided, contact between the mask M and the substrate W that are close to each other during exposure can be avoided, and damage to the mask M can be reliably prevented.

(Second Embodiment)
Next, a divided successive proximity exposure apparatus according to the second embodiment of the present invention will be described with reference to FIGS. Note that the exposure apparatus of this embodiment is different from that of the first embodiment only in the configuration of the laser monitoring apparatus. Therefore, the same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted or simplified. Turn into.

  As shown in FIGS. 10 and 11, the exposure apparatus of the present embodiment has a mask M held on the mask stage 1 and a substrate held on the work stage 2 in the vicinity of the four vertices of the mask M on the mask stage 1. A laser monitoring device 90 is provided for measuring a gap between the laser and W and monitoring the gap. The laser monitoring device 90 includes a light emitting unit 91 that emits a laser beam LB obliquely downward toward the substrate W and a light receiving unit 92 that receives the laser beam LB reflected by the upper surface of the substrate W. The light receiving unit 91 monitors the gap by measuring the gap between the mask M held on the mask stage 1 and the substrate W held on the work stage 2 according to the position of the received laser beam LB. Yes. Note that the position of the lower surface of the mask M held by suction is known in advance, and the gap between the mask M and the substrate W is determined by the position of the laser beam LB detected by the light receiving unit 92 and the lower surface of the mask M. Given by considering the position.

  The control device 80 measures the gap between the mask M and the substrate W based on the light receiving position at the light receiving unit 92, and determines that the collision state between the substrate W and the mask M is a dangerous state when the gap is equal to or less than a predetermined value. The motor drive of the Z-axis feed base 2A (vertical coarse motion device 21 or vertical fine motion device 23) is stopped and controlled. Thereby, the contact with the mask M and the board | substrate W can be avoided, and the damage of the mask M can be prevented reliably.

  Other configurations and operations are the same as those in the first embodiment. The laser monitoring device 90 of the present embodiment is provided in the vicinity of the four vertices of the mask M, but is not limited to this, and is disposed at any position near the edge of the mask M. What is necessary is just to arrange | position suitably according to the outline shape of the mask M.

  In addition, this invention is not limited to embodiment mentioned above at all, In the range which does not deviate from the summary, it can implement with a various form.

1 is a partially exploded perspective view of a divided sequential proximity exposure apparatus according to a first embodiment of the present invention. It is an expansion perspective view of a mask stage part. (A) is the III-III sectional view taken on the line of FIG. 2, (b) is a top view of the mask position adjustment means of (a). It is explanatory drawing for demonstrating the irradiation optical system of the workpiece | work side alignment mark. It is a block diagram which shows the focus adjustment mechanism of an alignment image. It is a side view which shows the basic structure of an alignment camera and the focus adjustment mechanism of this alignment camera. It is a front view of the division | segmentation successive proximity exposure apparatus shown in FIG. FIG. 2 is a block diagram showing an electrical configuration of the divided sequential proximity exposure apparatus shown in FIG. 1. It is a bottom view of the mask stage shown in FIG. It is explanatory drawing explaining the state which detects the gap of the mask and board | substrate of the exposure apparatus of 2nd Embodiment. It is a bottom view of the mask stage in FIG.

Explanation of symbols

1 Mask stage 2 Work stage 2A Z-axis feed base (gap adjusting means)
2B Work stage feed mechanism 3 Exposure illumination optical system (irradiation means)
70, 90 Laser monitoring devices 71, 72, 91 Light emitting portions 73, 74, 92 Light receiving portion 80 Control device g Gap LB Laser beam M Mask P Mask pattern PE Exposure device W Substrate (material to be exposed)

Claims (2)

A work stage for holding a substrate as a material to be exposed, a mask stage that is arranged opposite to the substrate and holds a mask, and irradiation means for irradiating the substrate with light for pattern exposure through the mask; An exposure apparatus comprising: a feed mechanism that relatively steps the work stage and the mask stage so that a mask pattern of the mask faces a plurality of predetermined positions on the substrate;
A light emitting unit that emits a laser beam that passes through a predetermined position between the mask held on the mask stage and the substrate held on the work stage in a substantially horizontal direction, and a light receiving unit that receives the laser beam; A laser monitoring device comprising:
A control device that stops the vertical movement of at least one of the mask stage and the work stage when the amount of received light of the laser beam in the light receiving unit is a predetermined value or less;
An exposure apparatus comprising: A work stage for holding a substrate as a material to be exposed, a mask stage that is arranged opposite to the substrate and holds a mask, and irradiation means for irradiating the substrate with light for pattern exposure through the mask; An exposure apparatus comprising: a feed mechanism that relatively steps the work stage and the mask stage so that a mask pattern of the mask faces a plurality of predetermined positions on the substrate;
The mask stage having a light emitting portion disposed near the edge of the mask on the mask stage and emitting a laser beam toward the substrate; and a light receiving portion receiving the laser beam reflected by the substrate. A laser monitoring device that monitors the gap by measuring the gap between the mask held on the substrate and the substrate held on the work stage;
A control device that stops the vertical movement of at least one of the mask stage and the work stage when the gap is equal to or less than a predetermined value;
An exposure apparatus comprising:

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