JP2008015143A - Photosensitive paste - Google Patents

Abstract

A partition that can form a pattern with a single exposure even with a thick film, has a small dimensional variation before and after baking, and has excellent adhesion to a substrate and has no residue in an unexposed portion. The photosensitive paste which can manufacture is provided.
[1] A photosensitive paste containing (A) inorganic particles, (B) an alkali-soluble resin, (C) a crosslinking agent, (D) an acid generator, and (E) an organic solvent, ) Is an organic solvent (EA) having a boiling point of 100 ° C. or higher and lower than 195 ° C. at 1 atm.
[2] The (E) contains, as essential components, an organic solvent (EA) having a boiling point of less than 195 ° C. at 1 atm and an organic solvent (EB) having a boiling point of 195 ° C. or more at 1 atm [1] ] A photosensitive paste.
[3] A partition for plasma display using any one of the above photosensitive pastes.
[4] A member for a plasma display, comprising the partition wall according to [3].
[Selection figure] None

Description

  The present invention relates to a photosensitive paste. More specifically, the present invention relates to a photosensitive paste suitable for forming partition walls on a plasma display back plate.

  In recent years, miniaturization and high definition have progressed in displays, and accordingly, improvement of pattern processing technology is desired. As a pattern processing technique, for example, a photosensitive paste method is known, which is used for forming a partition wall of a back plate that is a member of a plasma display.

  Examples of the photosensitive paste for forming the partition walls so far include, for example, a photosensitive paste containing a photoacid generator, a crosslinking agent, and a novolac resin. The photosensitive paste is applied onto a substrate, exposed, A method is known in which a partition pattern is formed by development and baked to form a partition. It is disclosed that the partition thus obtained is excellent in adhesion to a substrate (see Patent Document 1). ).

JP 11-338144 A

In the photosensitive paste disclosed in Patent Document 1, since a triazine-based initiator is used as an acid generator, device contamination may occur due to chlorine desorption during the production of the partition walls. In addition, there has been a concern that unexposed portions are likely to remain during development and become residues.
An object of the present invention is to provide a photosensitive paste capable of forming a pattern without a residue in an unexposed portion without impairing adhesion to a substrate, and causing no problems such as device contamination. Furthermore, another object of the present invention is to provide a partition using the photosensitive paste, a plasma display member including the partition, and a plasma display panel.

  As a result of intensive studies to find a photosensitive paste that can solve the above-mentioned problems, the present inventors have completed the present invention.

That is, the present invention is a photosensitive paste containing [1] (A) inorganic particles (B) alkali-soluble resin (C) crosslinking agent (D) acid generator (E) organic solvent, Provided is a photosensitive paste characterized by containing an organic solvent (EA) having a boiling point at 1 atm of 100 ° C. or higher and lower than 195 ° C. as an essential component.

（式中、Ｑ₂、Ｑ₃は、それぞれ独立に式（４）で表される基であり、Ｑ₁は式（５ａ）または式（５ｂ）で示される基である。）

（式中、Ｔ₁は炭素数１〜６のアルキレン基、炭素数１〜６のアルキレンオキシアルキレン基またはフェニレン基を表す。ｍは０または１である。）

（式中、Ｔ₂〜Ｔ₇は、それぞれ独立にメチル基またはフェニル基を表す。Ｔ₈は酸素原子、メチレン基、エテニレン基、エチニレン基、フェニレン基、ナフタレンジイル基およびビフェニルジイル基からなる群から選ばれる。）
［８］前記（Ｅ）を構成する全ての有機溶媒が、２５℃における屈折率が１．４０〜１．８０の有機溶媒である、［１］〜［７］のいずれかに記載の感光性ペースト
［９］前記（Ａ）が、軟化点が４００℃〜６００℃の低融点ガラス粒子を含む無機粒子である、［１］〜［８］のいずれかに記載の感光性ペースト Furthermore, the present invention provides the following [2] to [9] as preferred embodiments according to the above [1].
[2] The content ratio of (A) to (E) with respect to the photosensitive paste is (A) 20 to 95% by mass, (B) 2 to 30% by mass, (C) 1 to 30% by mass, (D) The photosensitive paste according to [1], which is 0.01 to 20% by mass and (E) 1 to 40% by mass.
[3] The photosensitive paste [3] according to [1] or [2], wherein (EA) is 70% by weight to 95% by weight when the total amount of (E) is 100% by weight. The photosensitive paste [4] according to [3], wherein (E) includes (EA) and an organic solvent (EB) having a boiling point at 1 atm of 195 ° C. or more and 400 ° C. or less as essential components. The photosensitive paste according to any one of [1] to [4], wherein (EA) is ethylene glycol diacetate. [5] The (EB) is 1,2-propanediol diacetate. The photosensitive paste [6] according to [3] or [4], which is benzoate and / or gamma-butyrolactone, [6] wherein the (B) is a novolak resin and / or a phenolic hydroxyl group of a part of the novolak resin as an OR ₃ group ( Here, R ₃ has 1 to 2 carbon atoms. 0 represents a monovalent organic group), and (C) is an epoxy-containing silicon compound represented by formula (3), according to any one of [1] to [6] Photosensitive paste

(Wherein Q ₂ and Q ₃ are each independently a group represented by the formula (4), and Q ₁ is a group represented by the formula (5a) or the formula (5b)).

(In the formula, T ₁ represents an alkylene group having 1 to 6 carbon atoms, an alkyleneoxyalkylene group having 1 to 6 carbon atoms, or a phenylene group. M is 0 or 1.)

(Wherein T _{2 to} T ₇ each independently represents a methyl group or a phenyl group. T ₈ is a group consisting of an oxygen atom, a methylene group, an ethenylene group, an ethynylene group, a phenylene group, a naphthalenediyl group, and a biphenyldiyl group. Selected from.)
[8] The photosensitive property according to any one of [1] to [7], wherein all organic solvents constituting the (E) are organic solvents having a refractive index of 1.40 to 1.80 at 25 ° C. Paste [9] The photosensitive paste according to any one of [1] to [8], wherein (A) is an inorganic particle containing low melting point glass particles having a softening point of 400 ° C to 600 ° C.

The present invention also provides the following [10] to [12] using any of the above-described photosensitive pastes.
[10] A plasma display panel comprising the plasma display panel barrier rib [11] [10], which is produced using any one of the photosensitive pastes described above.
[12] A plasma display panel comprising the plasma display member according to [11].

Moreover, the following [13] suitable for manufacturing the partition of the plasma display panel is provided.
[13] Manufacturing method of plasma display panel partition comprising the following steps: (a) Step of forming a coating film by applying any of the above photosensitive pastes on a substrate (b) Heating the coated coating film Step (c) Step of exposing the coating film obtained in the above (b) (d) Step of heating the coated film after exposure (e) Step of developing the coating film (f) After development, the substrate is 450 The process of baking at a temperature of ℃ to 600 ℃

  According to the present invention, it is possible to obtain a photosensitive paste that has a practical adhesiveness and does not cause device contamination, and enables pattern formation without generating a residue in an unexposed portion. Furthermore, the photosensitive paste can form a pattern with a single exposure even with a thick film exceeding 50 μm, and the dimensional fluctuation before and after firing is small (top width dimension, bottom width dimension and high height before and after firing). Therefore, it is possible to manufacture suitable partition walls in the back plate for plasma display, which is industrially useful.

Hereinafter, preferred embodiments of the present invention will be described.

The photosensitive paste of the present invention is
(A) Inorganic particles (B) Alkali-soluble resin (C) Crosslinker (D) Acid generator (E) Contains an organic solvent, and (E) has a boiling point of 100 ° C. or higher and lower than 195 ° C. at 1 atm. It is a photosensitive paste characterized by comprising an organic solvent (EA) as an essential component.
The inventors of the present invention have found that when an organic solvent as described above is used in the photosensitive paste (E), the partition wall obtained from the photosensitive paste significantly improves the adhesion to the substrate. It was.

Specifically, (EA) will be described. (EA) can be selected in consideration of the boiling point at 1 atm. Specifically, for example, a known document such as a solvent handbook (Asahara Teruzo, Senao Manabu et al., Kodansha, 1976) ) Etc., a suitable solvent can be easily selected from boiling point data.
Specific examples of suitable organic solvents include dipropylene glycol methyl ether (boiling point 190 ° C), dipropylene glycol dimethyl ether (boiling point 175 ° C), ethylene glycol diacetate (boiling point 186 ° C), ethylene glycol monoacetate (boiling point 187 ° C). ), Ethylene glycol monomethyl ether (boiling point 194 ° C.) and the like. Among these, it is preferable to use ethylene glycol diacetate as (EA) from the viewpoint of the transparency of the coating film obtained by applying the photosensitive paste.

Furthermore, when an organic solvent (EB) having a boiling point at 1 atm of 195 ° C. or more and 400 ° C. or less is added in addition to (EA), a slight amount of solvent is present in the coating film after pre-baking the coating film. It is preferable because it remains and the transparency of the coating film is improved. Such (EB) can be selected from the boiling point data of the same literature as the above (EA). Specifically, gamma-butyrolactone (boiling point 204 ° C.), 1,2- Propanediol dibenzoate (boiling point 232 ° C / 12mmHg, boiling point when converted to 1 atm is about 380 ° C), dipropylene glycol butyl ether (boiling point 222 ° C), dipropylene glycol methyl ether acetate (boiling point 200 ° C), etc. Can be mentioned.
Among the examples of (EB), gamma-butyrolactone and 1,2-propanediol dibenzoate are particularly preferable because the transparency of the coating film obtained by applying the photosensitive paste is better.

  Furthermore, in addition to the above (EA) and (EB), all the organic solvents constituting (E) are preferably organic solvents having a refractive index of 1.40 to 1.80 at 25 ° C. Furthermore, an organic solvent having a refractive index of 1.41-1.70 is preferable, and an organic solvent having a refractive index of 1.42-1.60 is particularly preferable. When the refractive index of all the organic solvents constituting (E) is in the above range, the transparency of the coating film after pre-baking tends to be good. The refractive index of the organic solvent can be measured at a measurement temperature of 25 ° C. using a refractometer (for example, RA-520N manufactured by Kyoto Electronics Industry Co., Ltd.). The refractive index is described, for example, in documents such as revised 4th edition, Chemical Handbook, Basics II, pages 514-520 (edited by the Chemical Society of Japan, Maruzen Co., Ltd., issued on September 30, 1993).

  Here, the preferred (EA) ethylene glycol diacetate has a refractive index of 1.42, and the preferred (EB), gamma-butyrolactone, has a refractive index of 1.44. 1,2-propanediol dibenzoate has a refractive index of 1.54, and all satisfy the range of refractive index of 1.40 to 1.80.

  As content of (E) in the photosensitive paste of this invention, it is a mass fraction with respect to the photosensitive paste total amount, and is 1-40 mass% normally, Preferably it is 3-30 mass%, More preferably, it is 5 ˜20 mass%.

  Further, when the total amount of (E) is 100% by weight, (EA) is preferably 70% by weight or more and 95% by weight or less. The minimum value of (EA) is more preferably 75% by weight or more, and particularly preferably 80% by weight or more. On the other hand, the maximum value of (EA) is more preferably 90% by weight or less, and particularly preferably 85% by weight or less. It is preferable that the content of (EA) with respect to the total amount of (E) is in the above range since the adhesion of the pattern after development becomes better.

Next, (A) inorganic particles will be described.
The relative dielectric constant of (A) is preferably 4.0 or more and 9.5 or less, and more preferably 4.0 or more and 9.0 or less at a measurement temperature of 20 ° C. When the relative dielectric constant is in the above-mentioned range, it is preferable because a partition wall that reduces reactive power when driven as a plasma display panel can be obtained. Here, the relative dielectric constant can be measured using a commercially available bridge-type dielectric constant measuring device (for example, model number TR-10C manufactured by Ando Electric Co., Ltd. can be mentioned).

  In addition, the refractive index of (A) is preferably 1.40 to 2.50, more preferably 1.43 to 2.20, and particularly preferably 1.43 to 1.2. 80. When the refractive index of the inorganic particles is in the above range, light scattering is small at the time of exposure, and a good pattern tends to be formed, which is preferable. The refractive index can be measured using a commercially available prism refractive index measuring device (for example, model number GP1-P manufactured by OPTEC).

  Furthermore, the volume average particle diameter of (A) is preferably in the range of 0.01 to 40 μm at a measurement temperature of 25 ° C., more preferably in the range of 0.1 to 10 μm, and particularly preferably in the range of 1 to 8 μm. It is. When the average particle size is in the above range, the amount of inorganic particles in the partition formed using the photosensitive paste can be increased, so that the shrinkage during firing is small, and the exposure is preferably performed. This is preferable because a good pattern tends to be formed because of the small scattering of light. The volume average particle diameter can be measured using a commercially available light scattering particle diameter measuring apparatus (for example, model number DLS-7000 manufactured by Otsuka Electronics Co., Ltd.).

  In the photosensitive paste of the present invention, inorganic particles having different volume average particle diameters may be mixed at an arbitrary ratio and used as (A).

  The shape of the inorganic particles is not particularly limited and may be crushed or spherical, but is preferably spherical.

  Examples of the inorganic particles include silica particles derived from colloidal silica, silica particles such as aerosil and silica gel, low melting glass particles having a softening point of 400 ° C. to 600 ° C., or glass particles having a softening temperature of 601 ° C. or higher. Or mixtures thereof. In particular, a photosensitive paste containing inorganic particles containing low-melting glass particles as (A) is preferable because the obtained partition walls have high strength. Here, examples of the low melting point glass particles include zinc oxide glass, tin oxide phosphate glass, bismuth oxide glass, and lead glass.

  The addition ratio of (A) used in the photosensitive paste of the present invention is preferably 20 to 95% by mass and more preferably 40 to 95% by mass with respect to the total amount of the photosensitive paste.

  When the addition ratio of (A) is in the above range, the film shrinkage during firing tends to be small and it tends to be difficult to peel off from the substrate, and the light scattering during exposure tends to be small and a good pattern can be formed. Is preferable.

Next, (B) the alkali-soluble resin will be described.
Here, in the alkali-soluble resin, the alkali-soluble notation indicates that it can be dissolved in either an alkaline aqueous solution, an alkaline organic solvent, or an alkaline organic solvent-water mixed solution. Examples of the alkali-soluble group that exhibits such alkali-solubility include a carboxyl group (—COOH), a phenolic hydroxyl group, a phosphonic acid group (—PO ₃ H ₂ ), a sulfonic acid group (—SO ₃ H), and a sulfonic imide group (— SO ₂ NHSO ₂ —) is at least one acid group selected from the group consisting of a carboxylic acid anhydride group, a group in which a phenolic hydroxyl group is protected by esterification or etherification, and the like. Mention may be made of groups which are converted into groups. As the resin having an alkali-soluble group, known resins can be used. For example, novolak resins and derivatives thereof, styrene-maleic anhydride copolymers, polyvinylhydroxybenzoates and derivatives thereof, polyhydroxystyrene and derivatives thereof, Examples thereof include carboxyl group-containing acrylic resins and derivatives thereof, polystyrene sulfonic acid and derivatives thereof, and the like.

（式中、ｎは０以上２以下の整数を表わす。Ｒ₁は炭素数１〜２０の一価の有機基を表し、ｎが２の場合、２つあるＲ₁は同一あるいは異なっていてもよい。）

（式中、Ｒ₂は、水素原子又は炭素数１〜２０の一価の有機基を表す）
（ｂ）ノボラック樹脂（ａ）のフェノール性水酸基の一部をＯＲ₃基に置換した樹脂（ここで、Ｒ₃は炭素数１〜２０のアルキル基または炭素数６〜２０のアリール基を表す。） In particular, among the examples of the alkali-soluble resin, (B) applied to the present invention includes a novolak resin having a phenolic hydroxyl group, or a modification in which a part of the phenolic hydroxyl group of the novolak resin is protected by etherification. A novolac resin is preferred.
Specifically, it is preferable to use one or more selected from (a) and (b) below as (B).

(A) A novolak resin obtained by polycondensation of a phenol compound represented by formula (1) and an aldehyde compound represented by formula (2)

(In the formula, n represents an integer of 0 or more and 2 or less. R ₁ represents a monovalent organic group having 1 to 20 carbon atoms, and when n is 2, two R _{1 s} may be the same or different. Good.)

(Wherein R ₂ represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms)
(B) A resin in which a part of the phenolic hydroxyl group of the novolak resin (a) is substituted with an OR ₃ group (where R ₃ represents an alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 20 carbon atoms). )

The (a) is a novolak resin obtained by polycondensation of the phenol compound represented by the above formula (1) and the aldehyde compound represented by the formula (2), where R ₁ in the formula (1) is carbon. The monovalent organic group of number 1-20 is represented. The monovalent organic group having 1 to 20 carbon atoms may be linear, branched or cyclic, and examples thereof include a linear aliphatic hydrocarbon group having 1 to 20 carbon atoms and 3 to 20 carbon atoms. A branched aliphatic hydrocarbon group, a cyclic aliphatic hydrocarbon group having 3 to 20 carbon atoms, an aromatic hydrocarbon group having 6 to 20 carbon atoms, and the like. The aromatic hydrocarbon group having 6 to 20 carbon atoms may be substituted with an alkyl group, an alkenyl group or the like.

  Among these, a straight hydrocarbon group having 1 to 6 carbon atoms, a branched hydrocarbon group having 3 to 6 carbon atoms, a cyclic hydrocarbon group having 3 to 6 carbon atoms, and an aromatic carbon atom having 6 to 20 carbon atoms. A hydrogen group is preferred.

  Examples of the linear aliphatic hydrocarbon group having 1 to 20 carbon atoms include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, and dodecyl. Group, undecyl group, tridecyl group, tetradecyl group, pentadecyl group, hexadecyl group, heptadecyl group, octadecyl group, nonadecyl group, icosyl group and the like, in particular, methyl group, ethyl group, propyl group, butyl group, pentyl group, A hexyl group is preferred.

  Examples of the branched aliphatic hydrocarbon group having 3 to 20 carbon atoms include isopropyl group, isobutyl group, tertiary butyl group, tertiary octyl group, and the like, and isopropyl group and isobutyl group are particularly preferable.

  Examples of the cycloaliphatic hydrocarbon group having 3 to 20 carbon atoms include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclooctyl group, and the like. In particular, a cyclopentyl group and a cyclohexyl group are exemplified. preferable.

  The aromatic hydrocarbon group having 6 to 20 carbon atoms represents a group having an aromatic ring constituting the group or a group having a group in which a hydrocarbon group is substituted on the aromatic ring, and the number of carbon atoms constituting the group The sum is 6-20. Examples of aromatic ring substituents include alkyl groups such as methyl, ethyl, propyl, and butyl groups, alkenyl groups such as allyl groups and vinyl groups, alkenyloxy groups such as allyloxy groups, and ethynyl groups. Examples include alkynyloxy groups such as alkynyl group and ethynyloxy group.

  Specific examples of the aromatic hydrocarbon group having 6 to 20 carbon atoms include phenyl group, naphthyl group, anthryl group, tolyl group, xylyl group, trimethylphenyl group, ethylphenyl group, diethylphenyl group, triethylphenyl group, propyl A phenyl group, a butylphenyl group, a methyl naphthyl group, a dimethyl naphthyl group, a trimethyl naphthyl group, a vinyl naphthyl group, a methyl anthryl group, an ethyl anthryl group and the like can be mentioned, and a phenyl group, a tolyl group and a xylyl group are particularly preferable.

The substitution position of R ₁ in the formula (1) is preferably _one in which at least two positions are not substituted among the 2-position, 4-position, and 6-position from the phenol hydroxyl group. Specific examples include phenol (hydroxybenzene), o-cresol, m-cresol, p-cresol, o-ethylphenol, m-ethylphenol, p-ethylphenol, o-propylphenol, m-propylphenol, p-propylphenol, o-isopropylphenol, m-isopropyl Phenol, p-isopropylphenol, o-tert-butylphenol, m-tertiarybutylphenol, o-hexylphenol, m-hexylphenol, o-decylphenol, m-decylphenol, o-dodecylphenol, m-dodecylphenol, o -Hexadeci Ruphenol, m-hexadecylphenol, o-icosylphenol, m-icosylphenol, o-cyclopentylphenol, m-cyclopentylphenol, o-cyclohexylphenol, m-cyclohexylphenol, o-cycloheptylphenol, m-cyclo Heptylphenol, o-phenylphenol, m-phenylphenol, o-toluylphenol, m-toluylphenol, o-naphthylphenol, m-naphthylphenol,
2,5-xylenol, 2,3-xylenol, 3,5-xylenol, 2-ethyl-5-methylphenol, 2-ethyl-3-methylphenol, 3-ethyl-5-methylphenol, 2-isopropyl-5 -Methylphenol, 2-isopropyl-3-methylphenol, 3-isopropyl-5-methylphenol, 2-tertiarybutyl-5-methylphenol, 2-tertiarybutyl-3-methylphenol, 3-tertiarybutyl- 5-methylphenol, 2-hexyl-5-methylphenol, 2-hexyl-3-methylphenol, 3-hexyl-5-methylphenol, 2-cyclohexyl-5-methylphenol, 2-cyclohexyl-3-methylphenol, 3-cyclohexyl-5-methylphenol, 2-phenyl Nyl-5-methylphenol, 2-phenyl-3-methylphenol, 3-phenyl-5-methylphenol, 2-naphthyl-5-methylphenol, 2-naphthyl-3-methylphenol, 3-naphthyl-5-methyl Phenol, 2,5-diethylphenol, 2,3-diethylphenol, 3,5-diethylphenol, 2,5-dipropylphenol, 2,3-dipropylphenol, 3,5-dipropylphenol, 2,5 -Biscyclohexylphenol, 2,3-biscyclohexylphenol, 3,5-biscyclohexylphenol, 2,5-diphenylphenol, 2,3-diphenylphenol, 3,5-diphenylphenol and the like.
In particular, phenol (hydroxybenzene), o-cresol, m-cresol, p-cresol, 2,5-xylenol, 3,5-xylenol, 2,3-xylenol, 2-butylphenol, 2-isobutylphenol, 2-cyclohexyl Phenol and 2-phenylphenol are preferable, and phenol (hydroxybenzene), o-cresol, m-cresol, and p-cresol are particularly preferable.

The R ₂ group in the formula (2) is selected from a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms, and examples of the monovalent organic group include those equivalent to the R ₁ group. Specific examples of the aldehyde compound represented by the formula (2) include formaldehyde, acetaldehyde, propanal, butanal, hexanal, octanal, decanal, dodecanal, hexadecanal, icosanal, 2-methylpropanal, 2-methylbutanal. 2-ethylbutanal, 2,2-dimethylpropanal, acrolein, 2-butenal, 2-hexenal, 2-octenal, acetylenic aldehyde, 2-butynal, 2-hexinal, 2-octynal, cycloheptylcarbalaldehyde, Examples include cyclohexyl carbaldehyde, benzaldehyde, 1-naphthyl aldehyde, 2-naphthyl aldehyde, and styryl aldehyde. As the aldehyde compound, a depolymerizable polymer precursor can be used, and the aldehyde group may be protected with an acetal group or a hemiacetal group.

  Among the aldehyde compounds represented by the formula (2), formaldehyde and acetaldehyde are particularly preferable, and formaldehyde is particularly preferable. As formaldehyde, paraformaldehyde which is a depolymerizable polymer or formalin which is an aqueous solution can also be used.

  The polycondensation method of the compound represented by the formula (1) and the aldehyde compound represented by the formula (2) is not particularly limited. For example, an acid catalyst or an alkali catalyst is used in the presence or absence of a reaction solvent. Can be achieved. The reaction temperature is 0 to 200 ° C., preferably 50 to 150 ° C., and the reaction time is 0.1 to 30 hours, preferably 1 to 20 hours. Examples of the acid catalyst include sulfuric acid, hydrochloric acid, nitric acid, phosphoric acid, acetic acid, oxalic acid, malonic acid, and toluenesulfonic acid. Examples of the alkali catalyst include sodium hydroxide, potassium hydroxide, cesium hydroxide, sodium carbonate, and carbonic acid. Examples include sodium hydride, ammonia, tetramethylammonium hydroxide, triethylamine, morpholine, and pyridine.

  Examples of the reaction solvent used in the polycondensation reaction include alcohols such as methanol, ethanol, isopropanol, and tertiary butyl alcohol; ketones such as methyl ethyl ketone, methyl isobutyl ketone, methyl hexyl ketone, methyl heptyl ketone, and cyclohexyl ketone; propyl acetate, acetic acid Esters such as butyl, isobutyl acetate, methyl propionate, ethyl lactate, propylene glycol acetate; ethers such as dibutyl ether, tetrahydrofuran, tetrahydropyran, dioxane; aromatic hydrocarbons such as benzene, toluene, xylene; dichloromethane, chloroform Halogenated hydrocarbons such as carbon tetrachloride and bromoform; hydrocarbons such as hexane, heptane, decane and petroleum ether can be used, It can be used as a mixture of at least species. In addition, water may coexist in the reaction solvent, and in the case of a reaction solvent that is incompatible with water, a reaction solvent separated into two layers may be used. Water may be removed by distillation dehydration or the like.

  In the above polycondensation reaction, ketones, esters, aromatic hydrocarbons are used as a reaction solvent, organic acids such as acetic acid, oxalic acid, malonic acid, toluenesulfonic acid or ammonia, tetramethylammonium hydroxide, It is preferable to use an alkali such as triethylamine as a catalyst. The catalyst may or may not dissolve in the reaction solvent used.

In the above (b), a part of the phenolic hydroxyl group of the novolak resin (a) obtained as described above is substituted with an OR ₃ group. Here, R ₃ represents a monovalent organic group having 1 to 20 carbon atoms, and examples equivalent to R ₁ or R ₂ can be given.

Examples of the reaction for replacing the phenolic hydroxyl group with an OR ₃ group include strong alkalis such as sodium hydroxide, potassium hydroxide, metallic sodium, metallic lithium, metallic potassium, n-butyllithium, sodium naphthalate, and sodium methoxide. It can be used by converting the phenolic hydroxyl group into a metal phenolate group and reacting the compound represented by the formula (6).

（式中、Ｒ₃は前記と同等の定義である。Ｔはフッ素原子、塩素原子、臭素原子、ヨウ素原子、メシル基又はトシル基からなる群から選ばれる。）
式（６）で示される化合物は、使用するノボラック樹脂（ａ）のフェノール性水酸基１モル当量に対して、０．９９モル当量以下、好ましくは０．８モル当量以下、最も好ましくは０．５モル当量以下を使用する。
ここで、使用するノボラック樹脂（ａ）中のフェノール性水酸基のモル当量は、アルカリ滴定法を用いて求めることができる。

(In the formula, R ₃ has the same definition as above. T is selected from the group consisting of a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, a mesyl group or a tosyl group.)
The compound represented by the formula (6) is 0.99 molar equivalents or less, preferably 0.8 molar equivalents or less, most preferably 0.5 molar equivalents with respect to 1 molar equivalent of the phenolic hydroxyl group of the novolak resin (a) used. Use molar equivalents or less.
Here, the molar equivalent of the phenolic hydroxyl group in the novolak resin (a) to be used can be determined using an alkali titration method.

  Specific examples of the compound represented by the formula (6) are methyl fluoride, ethyl fluoride, decyl fluoride, hexyl fluoride, octyl fluoride, dodecyl fluoride, hexadecyl fluoride, icosyl fluoride, methyl chloride, ethyl chloride. , Decyl chloride, hexyl chloride, octyl chloride, dodecyl chloride, hexadecyl chloride, icosyl chloride, methyl bromide, ethyl bromide, decyl bromide, hexyl bromide, octyl bromide, dodecyl bromide, hexadecyl bromide, icosyl bromide , Benzyl bromide, methyl iodide, ethyl iodide, decyl iodide, hexyl iodide, octyl iodide, dodecyl iodide, hexadecyl iodide, icosyl iodide, benzyl iodide, methyl ethyl sulfonate, methyl butyl sulfonate , Methyl octyl sulfonate, methyl decyl sulfonate, toluyl ethyl sulfonate, buty Acid toluyl, octyl sulfonic acid toluyl, cited toluic decyl sulfonate and the like, methyl bromide, ethyl bromide, methyl iodide, ethyl iodide are preferred.

  Examples of the reaction solvent include alcohols such as methanol, ethanol, isopropanol, and tertiary butyl alcohol; ketones such as methyl ethyl ketone, methyl isobutyl ketone, methyl hexyl ketone, methyl heptyl ketone, and cyclohexyl ketone; dibutyl ether, tetrahydrofuran, tetrahydropyran, and dioxane. Ethers such as benzene, toluene, xylene, etc .; hydrocarbons such as dichloromethane, chloroform, carbon tetrachloride, bromoform; hydrocarbons such as hexane, heptane, decane, petroleum ether, etc. These may be used alone or in combination of two or more. In particular, ethers, aromatic hydrocarbons or halogenated hydrocarbons are preferred. In the reaction, water may coexist as long as the reactant used is not deactivated, but a dehydrated reaction solvent having a water content of 100 ppm or less is preferred. The reaction temperature is 0.1 to 20 hours, preferably 1 to 10 hours, and the reaction temperature is −60 to 100 ° C., preferably −20 to 50 ° C.

In particular, (B) of the present invention is particularly preferably a phenol novolak resin or a cresol novolak resin obtained by polycondensation of a compound in which R ₁ in formula (1) is a hydrogen atom or a methyl group with formaldehyde. Phenol novolac resins or cresol novolac resins can be preferably used because of high dissolution contrast. Moreover, the addition ratio of (B) used for the photosensitive paste of this invention becomes like this. Preferably it is 2-30 mass% with respect to the photosensitive paste total amount, More preferably, it is 3-20 mass%.

  The alkali-soluble resin obtained as described above is represented by the catalyst or catalyst residue used in the polycondensation reaction or the substitution reaction, the unreacted phenol compound represented by the formula (1), and the unreacted formula (2). It is preferable to remove the aldehyde compound or the unreacted compound represented by the formula (6) by a known method. The reaction solvent used in the above polycondensation reaction or the above substitution reaction can also be removed by a known method. (E) The organic solvent having a refractive index of 1.40 to 1.80 at 25 ° C. May be used for the preparation of the photosensitive paste of the present invention as a solution in which an alkali-soluble resin is dissolved, without being removed.

  The polystyrene-converted weight average molecular weight of the alkali-soluble resin (B) by gel permeation chromatography (hereinafter referred to as “GPC method”) is preferably 350 to 30,000, more preferably 350 to 10,000. It is. When the weight average molecular weight is in the above range, the curability of the exposed area tends to be high, the solubility of the unexposed area tends to be high, and the pattern formation characteristics tend to be favorable, which is preferable.

  The addition ratio of (B) used for the photosensitive paste of this invention becomes like this. Preferably it is 1-30 mass% with respect to the photosensitive paste total amount, More preferably, it is 5-20 mass%.

（式中、Ｑ₂、Ｑ₃は、それぞれ独立に式（４）で表される基であり、Ｑ₁は式（５ａ）または式（５ｂ）で示される基である。）

（式中、Ｔ₁は炭素数１〜６のアルキレン基、炭素数１〜６のアルキレンオキシアルキレン基またはフェニレン基を表す。ｍは０または１である。）

（式中、Ｔ₂〜Ｔ₇は、それぞれ独立にメチル基又はフェニル基を表す。Ｔ₈は酸素原子、メチレン基、エテニレン基、エチニレン基、フェニレン基、ナフタレンジイル基およびビフェニルジイル基からなる群から選ばれる。） Next, the crosslinking agent (C) will be described.
Examples of the crosslinking agent (C) include an epoxy-containing silicon compound represented by the formula (3).

(Wherein Q ₂ and Q ₃ are each independently a group represented by the formula (4), and Q ₁ is a group represented by the formula (5a) or the formula (5b)).

(In the formula, T ₁ represents an alkylene group having 1 to 6 carbon atoms, an alkyleneoxyalkylene group having 1 to 6 carbon atoms, or a phenylene group. M is 0 or 1.)

(Wherein T _{2 to} T ₇ each independently represents a methyl group or a phenyl group. T ₈ is a group consisting of an oxygen atom, a methylene group, an ethenylene group, an ethynylene group, a phenylene group, a naphthalenediyl group, and a biphenyldiyl group. Selected from.)

Here, Q ₂ and Q ₃ each independently represent a group having an epoxy group or an oxetane group represented by the formula (4). Here, when T ₁ is an alkylene group, examples thereof include glycidyl group, 1,2-epoxybutyl group, 1,2-epoxyhexyl group, and when alkylene group is alkyleneoxyalkylene group, glycidyloxyethyl group, glycidyloxy Examples thereof include a propyl group, a glycidyloxybutyl group, a 1,3-epoxybutyl group, and a 1,3-epoxyhexyl group. When T ₁ is a phenylene group, 1,2-epoxyethylphenyl group, 1,3-epoxypropylphenyl group and the like can be mentioned. In particular, the case where T ₁ is an alkyleneoxyalkylene group is preferable since it is simple in production, and a glycidyloxypropyl group is particularly preferable.
Q ₁ is a divalent group having one or two silicon atoms represented by the formula (5a) or (5b), and is a dimethylsilanediyl group, diphenylsilanediyl group, 1,1,3,3 -Tetramethyldisiloxanediyl group, 1,1,3,3-tetraphenyldisiloxanediyl group, 1,1,3,3-tetramethyldisilamethylenediyl group, phenylenebis (dimethylsilylene) group, etc. 1,1,3,3-tetramethyldisiloxanediyl group is particularly preferred.
As (C), 1,3-di (3′-glycidyloxypropyl) -1,1,3,3, -tetramethyldisiloxane is particularly preferable. 1,3-di (3′-glycidyloxypropyl) -1,1,3,3, -tetramethyldisiloxane is commercially available for use as an epoxy resin modifier and is readily available. is there.

  The addition ratio of (C) used in the photosensitive paste of the present invention is preferably 1 to 30% by mass and more preferably 1 to 20% by mass with respect to the total amount of the photosensitive paste.

Next, (D) the acid generator will be described.
Examples of (D) include a photoacid generator and a photocationic polymerization initiator.

  Examples of the photoacid generator include [cyclohexyl- (2-cyclohexanonyl) -methyl] sulfonium trifluoromethanesulfonate, bis (p-tolylsulfonyl) diazomethane, bis (cyclohexylsulfonyl) diazomethane, and tertiary butylcarbonylmethyl. -Tetrahydrothiophenium trifluoromethanesulfonate etc. are mentioned. As the photoacid generator, in addition to the above, compounds described in JP-A-11-202495 can also be used.

  Examples of the photocationic polymerization initiator include iodonium salts, sulfonium salts, phosphate salts, and antimonate salts. Specifically, Rhodesyl Photoinitiator 2074 (manufactured by Rodel), Adekaoptomer SP-150, Adekaoptomer SP-152, Adekaoptomer SP-170, Adekaoptomer SP-172 (all Asahi Denka Kogyo Co., Ltd.) Etc.). In addition to the above, compounds described in JP-A-9-118663 can also be used.

  Content of (D) with respect to the photosensitive paste of this invention becomes like this. Preferably it is 0.01-20 mass% with respect to the photosensitive paste total amount, More preferably, it is 0.05-10 mass%.

  When the content of (D) is in the above range, there is a tendency that a pattern can be formed with good productivity, which is preferable.

  Furthermore, you may add additives, such as a light absorber, a photosensitizer, a plasticizer, a dispersing agent, a precipitation inhibitor, and surfactant, to the photosensitive paste of this invention as needed.

Next, a method for producing a partition for a plasma display by performing pattern processing using the photosensitive paste of the present invention will be described with an example, but the present invention is not limited to this method.
As a suitable example in this manufacturing method, the manufacturing method which has the process shown to the following (a)-(e) is mentioned.
(A) The process of apply | coating the photosensitive paste in any one of the above on a board | substrate, and forming a coating film (b) The process of heating the coating film after application | coating (c) The coating film obtained by said (b) (D) Step of heating the coated film after exposure (e) Step of developing the coated film (f) Step of baking the substrate at a temperature of 450 ° C. to 600 ° C. after development

  First, (a) will be described. On the substrate, the photosensitive paste of the present invention is applied over the entire surface or partially. As a coating method, for example, a bar coater, a roll coater, a die coater, a screen printing method or the like can be used. The coating thickness can be adjusted by selecting the number of coatings and the viscosity of the paste, and is usually about 5 to 500 μm.

  When applying the photosensitive paste on the substrate, the surface of the substrate may be treated with a surface treatment liquid in order to further improve the adhesion between the substrate and the coating film.

  Examples of the surface treatment liquid include silane coupling agents such as glycidyloxypropyltriethoxysilane, glycidyloxypropyltrimethoxysilane, and oxetanyloxypropyltriethoxysilane. As the silane coupling agent, it is preferable to use a silane coupling agent diluted to a concentration of 0.1 to 5% with an organic solvent such as ethylene glycol monomethyl ether, methyl alcohol, ethyl alcohol, propyl alcohol, or butyl alcohol.

  Examples of the surface treatment method include a method in which a surface treatment liquid is uniformly applied on a substrate with a spinner or the like and then dried at 80 to 140 ° C. for 5 to 60 minutes. As a drying method, a hot plate, a far-infrared oven, or the like is preferable.

  As described above, if necessary, a photosensitive paste is applied to the surface-treated substrate, and (b) is usually dried at 80 to 130 ° C. for 5 to 100 minutes using a far infrared oven or the like.

  After drying, (c) exposure is performed using an exposure apparatus. Examples of the exposure apparatus include a proximity exposure machine.

  When exposing a large area, a large area can be exposed with an exposure machine having a small exposure area by applying a photosensitive paste on a substrate and then performing exposure while moving the photosensitive paste. The exposure is to draw the mask pattern to be created on the photosensitive paste coating film with ionizing radiation. As the ionizing radiation, for example, ultraviolet rays, electron beams, X-rays, visible light, near infrared light, etc. are used. can do.

  The amount of irradiation in the exposure can be optimized as appropriate depending on the type of exposure source used or the type of (C) used in the photosensitive paste. As long as it does not interfere with this, there is no problem.

In particular, a light source having a wavelength of 365 nm using a high-pressure mercury lamp as an exposure source is preferably used, and the temperature is achieved at an exposure amount of 100 mJ / cm ² to 2000 mJ / cm ² at room temperature (25 ± 5 ° C.).

  After the exposure, (d) it is preferable to perform drying at 80 to 150 ° C. for 3 to 60 minutes using a far infrared oven or the like. Next, (e) development is performed. Development is usually carried out by a dipping method, a spray method, a brush method or the like.

  Examples of the developer include aqueous alkali solutions such as tetramethylammonium hydroxide, monoethanolamine, diethanolamine, sodium hydroxide, sodium carbonate, potassium hydroxide, and potassium carbonate.

  The alkali concentration in the aqueous solution is preferably 0.05 to 5% by mass, more preferably 0.1 to 5% by mass. When the alkali concentration is in the above range, the removability of the portion to be developed and removed is good, and the pattern to be left is less likely to be peeled off or eroded, which is preferable.

  The temperature during development is preferably 15 to 50 ° C. in terms of process control.

  After the pattern is formed as described above, the partition walls can be manufactured by (f) firing in a firing furnace. The firing atmosphere and firing temperature vary depending on the type of photosensitive paste and substrate, but can be usually fired at 450 to 600 ° C. in an atmosphere such as air or nitrogen. As the firing furnace, a batch-type firing furnace or a belt-type continuous firing furnace can be used.

  In particular, when a partition wall is produced on a glass substrate, firing is usually performed at a temperature of 450 to 600 ° C. for 10 to 60 minutes.

  A coat layer may be formed on the surface of the partition wall obtained as described above. The coating layer is formed by applying and drying a coating agent such as a paste agent or a ceramic coating agent composed of low melting point glass particles and a binder resin, and baking it to form on the surface of the partition wall, or after forming the pattern, the coating agent It may be formed on the surface of the partition simultaneously with the formation of the partition by baking after coating.

  Examples of the low melting point glass particles include the same examples as described above.

  Examples of the binder resin include butyral resin, polyvinyl alcohol, acrylic resin, and poly α-methylstyrene.

  As the ceramic coating agent, an aqueous metal salt coating agent, an alkoxy metal salt coating agent, or the like can be used. Specifically, as the aqueous metal salt coating agent, MS-1700, an alkoxy metal salt coating agent is used. Examples of the agent include G-301 and G-401 (both manufactured by Nippon Ceramic Co., Ltd.).

  The firing temperature of the coating layer is usually about 250 to 600 ° C. when a paste agent composed of low melting glass particles and a binder resin is used, and is usually room temperature to 500 ° C. when a ceramic coating agent is used.

  By the above patterning method including exposure and development, a practical partition can be obtained, and no residue is generated in an unexposed portion, and a good partition can be obtained. Further, the photosensitive paste of the present invention has a very low dimensional variation within ± 30%, more preferably within ± 10%, in each of the top width dimension, the bottom width dimension, and the height dimension before and after firing. Therefore, the partition walls can be obtained with a desired design pattern.

Said partition can be used suitably as a partition of the backplate which is a member for plasma displays. The manufacturing method of the back plate is achieved by subjecting the substrate on which the partition walls are formed to a known process such as forming a fluorescent layer.
The back plate manufactured in this way is sealed with a front plate for plasma display manufactured by a known method, and discharge gas is sealed in a space formed between the front plate and the back plate. A plasma display panel can be obtained.

  EXAMPLES Hereinafter, although an Example demonstrates this invention in detail, this invention is not limited by these Examples.

Moreover, the raw material used for photosensitive paste preparation in the following Example and comparative example is as follows, and in each example, a raw material is represented by an abbreviation.
(A-1) Spherical silica (manufactured by Admatechs; SO-C6)
(A-2) Low melting point lead-free glass particles (manufactured by Yamato Electronics Co., Ltd., YEB2-6701)
(B-1) Ethylene glycol diacetate 50 wt% solution of phenol novolac resin (manufactured by Gunei Chemical Industry Co., Ltd., PSM-4326)
(B-2) 50% by weight solution of polyacrylic acid (manufactured by Aldrich Mw: 1250) in 50% gamma-butyrolactone (B-3) 50% by weight solution of phenol novolac resin in gamma-butyrolactone (manufactured by Gunei Chemical Industry Co., Ltd., PSM) -4326)
(C-1) 1,3-di (3′-glycidyloxypropyl) -1,1,3,3, -tetramethyl-disiloxane (Rodel, SILCOLEASE PC-606PEX)
(D-1) Rhodosil Photoinitiator (Rodel, PI-2074)
(G-1) Sensitizer (manufactured by Kawasaki Chemical Industry Co., Ltd., DBA)
(E-1) Ethylene glycol diacetate (manufactured by Tokyo Chemical Industry)
(E-2) 1,2-propanediol dibenzoate (manufactured by Aldrich)
(E-3) Gamma-butyrolactone (H-1) titanium oxide particles (Ishihara Sangyo Co., Ltd., CR-EL)

Example 1
(A-1) 273.2 parts by mass (A-2) 409.7 parts by mass (B-1) 204.9 parts by mass (B-2) 17.1 parts by mass (C-1) 38.4 parts by mass (D-1) 9.8 parts by mass (G-1) 2.1 parts by mass (E-1) 21.3 parts by mass (E-2) 21.3 parts by mass (H-1) 2.1 parts by mass Was put in a polypropylene sealed container and stirred using a stirring defoaming machine (manufactured by Keyence Corporation; HM-500) to prepare a uniform photosensitive paste.
The composition weight ratio of the obtained photosensitive paste was (A) 68.29%, (B) 11.10%, (C) 3.84%, (D) 0.98%, (E) 15.36%. When the total amount of (E) was 100% by weight, (E-A) (E-1) was 81%.
The prepared photosensitive paste was applied once on a dielectric-coated glass substrate using a 200 μm gap applicator. After coating, the coating film was prepared by drying in an oven at 90 ° C. for 40 minutes.

Next, the dried coating film was exposed with a proximity exposure machine (Dainippon Screen Mfg. Co., Ltd .; MAP-1300) using a 45 μm line, 240 μm pitch mask. The irradiation exposure dose was 400 mJ / cm ² . After exposure, the substrate was baked at 140 ° C. for 10 minutes, and then developed with a 0.4% by mass aqueous sodium hydroxide solution to obtain a pattern having a pattern upper width of 48 μm, a pattern lower width of 85 μm, and a height of 94 μm. Furthermore, no residue was observed in the unexposed area, and the adhesion to the substrate was good.
Then, by baking for 30 minutes at 580 ° C. in a muffle furnace (Isuzu Seisakusho EPTS-312K), a pattern having a pattern upper width of 47 μm, a pattern lower width of 84 μm, and a height of 92 μm was obtained without peeling.
The change in pattern size after firing was within ± 10% of that before firing, and it was found that barrier ribs having a small change in pattern size before and after firing were obtained.

Example 2
(A-1) 273.2 parts by mass (A-2) 409.7 parts by mass (B-1) 204.9 parts by mass (B-2) 17.1 parts by mass (C-1) 38.4 parts by mass (D-1) 9.8 parts by mass (G-1) 2.1 parts by mass (E-1) 42.7 parts by mass (H-1) 2.1 parts by mass were placed in a polypropylene sealed container and stirred and removed. A uniform photosensitive paste was prepared by stirring using a foaming machine (manufactured by Keyence Corporation; HM-500).
The composition weight ratio of the obtained photosensitive paste was (A) 68.29%, (B) 11.10%, (C) 3.84%, (D) 0.98%, (E) 15.36%. Met. When the total amount of (E) was 100% by weight, (E-A) (E-1) was 94%.
The prepared photosensitive paste was applied once on a dielectric-coated glass substrate using a 200 μm gap applicator. After coating, the coating film was prepared by drying in an oven at 90 ° C. for 40 minutes.
Next, the dried coating film was exposed with a proximity exposure machine (Dainippon Screen Mfg. Co., Ltd .; MAP-1300) using a 45 μm line, 240 μm pitch mask. The irradiation exposure dose was 400 mJ / cm ² . After the exposure, the substrate was baked at 140 ° C. for 10 minutes and then developed with a 0.4 mass% sodium hydroxide aqueous solution to obtain a pattern having a pattern upper width of 56 μm, a pattern lower width of 84 μm, and a height of 95 μm. Furthermore, no residue was observed in the unexposed area, and the adhesion to the substrate was good.
Then, by baking for 30 minutes at 580 ° C. in a muffle furnace (Isuzu Seisakusho EPTS-312K), a pattern having a pattern upper width of 55 μm, a pattern lower width of 82 μm, and a height of 92 μm was obtained without peeling.
The change in pattern size after firing was within ± 10% of that before firing, and it was found that barrier ribs having a small change in pattern size before and after firing were obtained.

Comparative Example 1
(A-1) 273.2 parts by mass (A-2) 409.7 parts by mass (B-1) 204.9 parts by mass (B-2) 17.1 parts by mass (C-1) 38.4 parts by mass (D-1) 9.8 parts by mass (G-1) 2.1 parts by mass (E-2) 21.3 parts by mass (E-3) 21.3 parts by mass (H-1) 2.1 parts by mass Was put in a polypropylene sealed container and stirred using a stirring defoaming machine (manufactured by Keyence Corporation; HM-500) to prepare a uniform photosensitive paste.
The composition weight ratio of the obtained photosensitive paste was (A) 68.29%, (B) 11.10%, (C) 3.84%, (D) 0.98%, (E) 15.36%. Met. (E) (EA) is not included as an organic solvent.
The prepared photosensitive paste was applied once on a dielectric-coated glass substrate using a 200 μm gap applicator. After coating, the coating film was prepared by drying in an oven at 90 ° C. for 40 minutes.
Next, the dried coating film was exposed with a proximity exposure machine (Dainippon Screen Mfg. Co., Ltd .; MAP-1300) using a 45 μm line, 240 μm pitch mask. The irradiation exposure dose was 400 mJ / cm ² . After the exposure, the substrate was baked at 140 ° C. for 10 minutes, and then developed with a 0.4 mass% sodium hydroxide aqueous solution to obtain a pattern having a pattern upper width of 46 μm, a pattern lower width of 91 μm, and a height of 93 μm. The in-plane height variation was 4.5%, and a fluctuation was observed. Furthermore, a residue was observed in the unexposed area, and a part of the pattern was peeled off.

Claims (13)

(A) Inorganic particles (B) Alkali-soluble resin (C) Crosslinker (D) Acid generator (E) A photosensitive paste containing an organic solvent, wherein (E) has a boiling point of 100 ° C. or higher and 195 at 1 atm. A photosensitive paste comprising an organic solvent (EA) having a temperature of less than 0 ° C. as an essential component.   The content ratios of (A) to (E) to the photosensitive paste are (A) 20 to 95% by mass, (B) 2 to 30% by mass, (C) 1 to 30% by mass, and (D), respectively. The photosensitive paste according to claim 1, which is 0.01 to 20% by mass and (E) 1 to 40% by mass.   The photosensitive paste of Claim 1 or 2 whose said (EA) is 70 to 95 weight% when the total amount of said (E) is 100 weight%.   The photosensitive paste of Claim 3 in which the said (E) contains the said (EA) and the organic solvent (EB) whose boiling point in 1 atmosphere is 195 degreeC or more and 400 degrees C or less as an essential component.   The photosensitive paste in any one of Claims 1-4 whose said (EA) is ethylene glycol diacetate.   The photosensitive paste according to claim 4 or 5, wherein the (EB) is 1,2-propanediol dibenzoate and / or gamma-butyrolactone. (B) is a resin in which a novolac resin and / or a phenolic hydroxyl group of a part of the novolak resin is substituted with an OR ₃ group (where R ₃ represents a monovalent organic group having 1 to 20 carbon atoms). The photosensitive paste according to any one of claims 1 to 6, wherein (C) is an epoxy-containing silicon compound represented by formula (3).

(Wherein Q ₂ and Q ₃ are each independently a group represented by the formula (4), and Q ₁ is a group represented by the formula (5a) or the formula (5b)).

(In the formula, T ₁ represents an alkylene group having 1 to 6 carbon atoms, an alkyleneoxyalkylene group having 1 to 6 carbon atoms, or a phenylene group. M is 0 or 1.)

(Wherein T _{2 to} T ₇ each independently represents a methyl group or a phenyl group. T ₈ is a group consisting of an oxygen atom, a methylene group, an ethenylene group, an ethynylene group, a phenylene group, a naphthalenediyl group, and a biphenyldiyl group. Selected from.)
The photosensitive paste according to any one of claims 1 to 7, wherein all the organic solvents constituting the (E) are organic solvents having a refractive index of 1.40 to 1.80 at 25 ° C.   The photosensitive paste according to any one of claims 1 to 8, wherein (A) is an inorganic particle containing low melting point glass particles having a softening point of 400C to 600C.   The partition for plasma display panels manufactured using the photosensitive paste in any one of Claims 1-9.   The member for plasma displays provided with the partition for plasma display panels of Claim 10.   A plasma display panel comprising the member for plasma display according to claim 11. The manufacturing method of the partition for plasma display panels provided with the following process.
(A) The process of apply | coating the photosensitive paste in any one of Claims 1-9 on a board | substrate, and forming a coating film (b) The process of heating the coating film after application | coating (c) In said (b) Step (d) for exposing the obtained coating film (d) Step for heating the coated film after exposure (e) Step for developing the coating film (f) Step for baking the substrate at a temperature of 450 ° C. to 600 ° C. after development