JP2008011309A - Piezoelectric oscillator - Google Patents

Abstract

When an integrated circuit element is bonded to the inner surface of a recessed space, a bonding member easily adheres to a holding jig that holds and conveys the integrated circuit element. Secondary adhesion occurs on the surface of the integrated circuit element.
A container body in which a recessed space is formed, a step portion is formed, and a piezoelectric vibration element connection electrode pad and an integrated circuit element connection electrode pad are formed, a piezoelectric vibration element, an integrated circuit element, In the piezoelectric oscillator constituted by the lid body, a convex mounting base portion is formed on the bottom surface of the bottom of the container body in the concave space toward the concave space opening for firmly mounting the integrated circuit element. It is a piezoelectric oscillator.
[Selection] Figure 2

Description

  The present invention relates to a piezoelectric oscillator that is one of electronic components used in an electronic device such as a portable communication device.

  2. Description of the Related Art Conventionally, in an electronic device such as a portable communication device, a piezoelectric oscillator is used as a reference signal generation source or the like in the electronic device as one of the electronic components constituting the electronic device.

  As shown in FIG. 7, such a conventional piezoelectric oscillator has excitation electrodes on both front and back main surfaces of a plate-like piezoelectric element plate 91 made of a piezoelectric material such as quartz, lithium tantalate, lithium niobate, or piezoelectric ceramics. 92, an integrated circuit element 94 and an electronic component element (not shown) that are connected to the piezoelectric vibration element 93 to form an oscillation circuit, a piezoelectric vibration element 93, an integrated circuit element 94, and an electronic circuit. The container body 96 is formed with a recessed space 95 for housing the component elements, and the lid body 97 covers the opening of the recessed space 95 formed in the container body 96 and hermetically seals the recessed space 95. The integrated circuit element 94 is electrically connected to an integrated circuit element connection pad 98 formed in the container body 96 by a wire bonding method, and is mechanically connected to the bottom surface in the recessed space 95 of the container body 96 by a bonding member 99. It is fixed to.

The piezoelectric oscillator as described above is disclosed in the following prior art documents.
JP 2004-15441 A

  In addition, the applicant did not come to discover prior art documents related to the present invention by the time of the filing of the application other than the prior art documents specified by the prior art document information described above.

  However, in the conventional piezoelectric device, the integrated circuit element is conveyed to a predetermined arrangement position in the recessed space of the container body while holding the surface of the integrated circuit element by vacuum suction with a holding jig such as a pyramid collet. After that, a bonding member formed on the inner surface of the recessed space or the bonding surface of the integrated circuit element is mechanically bonded to the inner surface of the recessed space, and when the integrated circuit element is bonded to the inner surface of the recessed space. In addition, a bonding member protruding from between the integrated circuit element and the inner surface of the recessed space easily adheres to the holding jig that holds and conveys the integrated circuit element, and the adhered bonding member attaches the holding jig to the integrated circuit element. When they are separated from each other, they are secondarily attached to the inner surface of the recess space, the surface of the integrated circuit element or the like. In particular, when the thickness of the integrated circuit element is thin or the amount of the bonding member for fixing the integrated circuit element is large, the risk of adhesion of the bonding member to the holding jig increases.

  For example, when the portion where the bonding member has been attached to the surface adheres to the electrode pad for connecting an integrated circuit element formed on the inner surface of the recess space, the wire bonding formation failure may occur during wire bonding in the subsequent process. It will contribute. In addition, if the bonding member that has been secondarily adhered peels off from the location where it has adhered and moves freely in the recess space and adheres to the surface of the piezoelectric vibration element or a bonding wire, it will interfere with normal excitation vibration of the piezoelectric vibration element and vibrate. There is a possibility of causing a characteristic defect or causing an electric characteristic defect as a piezoelectric oscillator.

  The present invention has been devised in view of the above-described drawbacks, and its purpose is to provide a configuration in which the bonding member does not adhere to the holding jig of the integrated circuit element when the integrated circuit element is placed in the recessed space of the container body. Accordingly, an object of the present invention is to provide a piezoelectric oscillator that can suppress the occurrence of product defects low.

The piezoelectric oscillator according to the present invention has been invented in order to solve the above problems, and as one form thereof, one recessed space is formed, and in this recessed space, a convex step toward the recessed opening. A container body in which a piezoelectric vibration element connection electrode pad and an integrated circuit element connection electrode pad are formed on the plane of the stepped portion, and the piezoelectric vibration element connection electrode pad are mounted on And at least an oscillation circuit that is electrically connected to the piezoelectric vibration element is mounted on the bottom surface of the lowermost step in the recess space, and a container body connection electrode is formed on one main surface, and the other main An integrated circuit element mounted with the surface facing the bottom surface of the bottom step, and a recess space opening side top of the side wall portion surrounding the recessed space in which the piezoelectric vibration element is mounted in the recessed space formed in the container body Sealing conductor provided on the surface Fixed a turn, in the piezoelectric oscillator is configured by a lid for hermetically sealing the concave space equipped with piezoelectric vibrating element therein,
The piezoelectric oscillator is characterized in that a convex mounting base is formed on the bottom surface of the lowermost step in the concave space of the container body toward the concave space opening for firmly mounting the integrated circuit element.

As another aspect of the invention, an upright first side wall is formed on the entire periphery of the edge of one main surface of the flat insulating substrate. The first side wall and the insulating substrate A first recess space surrounded by one main surface is formed, and an electrode pad for connecting a piezoelectric vibration element is formed on the inner bottom surface of the first recess space, and the side of the other main surface of the substrate An upright second side wall portion is formed on the entire periphery of the edge portion, and a second concave space is formed in the second concave space surrounded by the second side wall portion and the other main surface of the insulating substrate. A step having a convex step toward the opening is formed, and a container body in which an electrode pad for connecting an integrated circuit element is formed on the plane of the step, and a piezoelectric vibration formed on the bottom surface in the first recess space A piezoelectric vibration element mounted on an electrode pad for element connection, and a piezoelectric vibration element on the bottom surface of the lowermost step in the second recess space An integrated circuit element having at least an electrically connected oscillation circuit mounted thereon, a container body connecting electrode formed on one main surface, and the other main surface facing the bottom bottom surface; and a container body The piezoelectric vibration element formed on the inside is fixed to the sealing conductor pattern provided on the top surface on the recess space opening side of the first side wall that surrounds the first recess space in which the piezoelectric vibration element is mounted. A piezoelectric oscillator configured by a lid that hermetically seals the first recess space mounted on
A convex mounting base is formed on the bottom surface of the lowermost step in the second recess space of the container body so as to project toward the second recess space opening for firmly mounting the integrated circuit element. This is a piezoelectric oscillator.

Furthermore, as another aspect of the invention, a first container body in which one first recess space is formed, and a piezoelectric vibration element connection electrode pad is formed on the inner bottom surface of the first recess space, and one A second recess space is formed, a convex step portion is formed in the second recess space toward the second recess opening, and an integrated circuit element connecting electrode pad is formed on the plane of the step portion. The formed second container body, the piezoelectric vibration element mounted on the piezoelectric vibration element connecting electrode pad formed on the bottom surface in the first recess space, and the bottommost bottom surface in the second recess space On top of this, at least an oscillation circuit electrically connected to the piezoelectric vibration element is mounted, a container body connection electrode is formed on one main surface, and the other main surface is mounted in a form facing the bottom surface of the lowermost stage. An integrated circuit element and a piezoelectric vibration element formed in a container body are mounted inside. A lid that hermetically seals the first concave space in which the piezoelectric vibration element is mounted, which is fixed to the sealing conductor pattern provided on the concave space opening side top surface of the first side wall portion surrounding the first concave space. In the piezoelectric oscillator constituted by the body,
A convex mounting base is formed on the bottom surface of the lowermost step in the second recess space of the second container body so as to protrude toward the second recess space opening for firmly mounting the integrated circuit element. A piezoelectric oscillator characterized by the following.

  Furthermore, the shape of the integrated circuit element mounting surface of the mounting base part described in each paragraph is substantially similar to the shape of the container fixing surface of the integrated circuit element, and the area of the integrated circuit element mounting surface of the mounting base part. Is also a piezoelectric oscillator characterized by being smaller than the area of the container body fixing surface of the integrated circuit element.

  According to the piezoelectric oscillator of the present invention, in the concave space where the integrated circuit element of the container is mounted, the mounting base portion having a convex shape in the concave space opening portion where the integrated circuit element for mounting the integrated circuit element is mounted. The integrated circuit element is bonded and mounted on the mounting base portion by a bonding member. Even when an excess joining member overflows between the main surface of the integrated circuit element and the upper surface of the mounting base at the time of mounting, the overflowing joining member flows out onto the bottom surface of the recessed space under the mounting base, so that a pyramid collet, etc. The possibility that a bonding member overflowing from between the main surface of the integrated circuit element and the upper surface of the mounting table will adhere to the holding jig is significantly reduced, and various problems as a piezoelectric oscillator caused by the bonding member adhering to the holding jig are reduced. Occurrence can be prevented.

  Further, in the piezoelectric oscillator of the present invention, the shape of the integrated circuit element mounting surface of the mounting base is substantially similar to the shape of the container fixing surface of the integrated circuit element, and the area of the integrated circuit element mounting surface of the mounting base is Is smaller than the area of the container body fixing surface of the integrated circuit element, so that even when the integrated circuit element is mounted, even if an excess joining member overflows from between the main surface of the integrated circuit element and the upper surface of the mounting base, it overflows. Since the joining member flows out to the bottom surface of the recess space below the mounting base without being exposed to the side surface of the integrated circuit element, particularly when the thickness of the integrated circuit element is thin or for joining the integrated circuit element. Even when the amount of members is large, the possibility that a joining member overflowing from between the main surface of the integrated circuit element and the upper surface of the mounting base adheres to the holding jig such as a pyramid collet is remarkably reduced and adheres to the holding jig Pressure caused by bonded parts A variety of occurrence of problems as an oscillator can be prevented.

  Therefore, according to the present invention, it is possible to provide a piezoelectric oscillator in which the occurrence of product defects is extremely small.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, the same code | symbol in each figure shall show the same object. Moreover, in each figure, in order to clarify explanation, a part of the structural body is not shown, and a part of the dimensions is exaggerated. In particular, the thickness dimension of each component is exaggerated.

  FIG. 1 is a schematic exploded perspective view showing an embodiment of a piezoelectric oscillator according to the present invention. FIG. 2 is a schematic cross-sectional view of the piezoelectric oscillator shown in FIG. 1 cut along a virtual cutting line that bisects two short sides of the piezoelectric oscillator. FIG. 3 is an explanatory diagram showing a form in which the integrated circuit element is mounted in the container in the piezoelectric oscillator shown in FIG. 1 or FIG. The piezoelectric oscillators shown in these drawings are roughly constituted by a container body 1, a piezoelectric vibration element 5 using quartz as a piezoelectric material, and an integrated circuit element 6 in which at least an oscillation circuit and a frequency adjusting circuit are formed. Has been.

  That is, the container body 1 is made of, for example, a ceramic material such as glass-ceramic or alumina ceramic, and a recessed space 7 having an opening on one main surface of the container body 1 is formed therein. Further, a metallized layer such as tungsten (W) or molybdenum (Mo) is formed on the opening side top surface of the side wall portion surrounding the recessed space 7 of the container body 1, and nickel (Ni) is formed on the upper surface of the metallized layer. ), And a sealing conductor pattern 3 plated with gold (Au). Further, an external connection electrode terminal 10 for electrically and mechanically connecting to an external substrate such as a mother board of an electronic device is formed on the outer bottom surface of the container body 1.

  In the recessed space 7 of the container body 1, a stepped portion 15 having a convex shape toward the opening is formed on the inner surface of the recessed space 7. Furthermore, a convex mounting base 12 for mounting the integrated circuit element 6 is provided on the bottom surface of the concave space 7 toward the opening of the concave space 7. Of the step portion 15, a piezoelectric vibration element connection for mounting a piezoelectric vibration element, which will be described later, is provided on the flat portion of the step portion 15 formed on the inner surface of one short side recess space 7 of the container body 1. A pair of electrode pads 11 are formed, and among the stepped portions 15, electrons in the integrated circuit element 6 to be described later are formed on the flat portion of the stepped portion 15 formed on the inner surface on the long side of the container body 1. An integrated circuit element connection electrode pad 13 is formed to be electrically connected to the circuit network. The piezoelectric vibration element connecting electrode pad 11 and a predetermined pad of the integrated circuit element connecting electrode pad 13 are electrically connected by a conductive wiring, a via hole, or the like formed in the container body 1.

  An appropriate amount of a joining member 14 such as an epoxy resin adhesive is applied to the mounting base 12 in the container body 1, and a pyramid collet 8 that is a holding jig is used on the joining member 14. The integrated circuit element 6 that is vacuum-sucked and held is transported to a predetermined position on the mounting unit 12 and arranged. When the integrated circuit element 6 is arranged, a certain amount of load may be applied from the integrated circuit element 6 side toward the mounting base 12. At this time, an extra joining member out of the joining members 14 between the mounting base 12 and the integrated circuit element 6 flows out from the mounting base 12 onto the bottom surface in the recessed space 7. Thus, the possibility that a joining member overflowing from between the main surface of the integrated circuit element and the upper surface of the mounting base will adhere to the holding jig such as the above is significantly reduced.

  The integrated circuit element 6 mounted on the mounting base 12 in such a form is integrated with a plurality of container connection electrode terminals 16 formed on the main surface opposite to the mounting base joint-side main surface. The circuit element connecting electrode pads 13 are electrically connected by wire bonding. Further, the piezoelectric vibration element 5 is mounted on the electrode pad 11 for connecting the piezoelectric vibration element formed on the flat portion of the side surface on one short side in the recessed space 7 of the step portion 15.

  For example, when the piezoelectric vibration element 5 uses quartz as a material of the piezoelectric material constituting the piezoelectric vibration element 5, the quartz base plate is cut from the artificial crystalline lens at a predetermined cut angle and is subjected to outline processing. It is a flat plate with a main surface of a circle or quadrangle, and a pair of excitation electrodes are deposited and formed on both the front and back main surfaces of the quartz base plate, and an alternating voltage from the outside is connected to the quartz crystal via the excitation electrode. When applied to the base plate, excitation occurs in a predetermined vibration mode and frequency. Such a piezoelectric vibration element 5 is formed by electrically and mechanically connecting the excitation electrode and the electrode pad 11 for connecting the piezoelectric vibration element, which are attached to both main surfaces thereof, through the conductive adhesive 9. Is mounted in the recessed space 7 of the container body 1.

  Thus, the lid 4 is formed on the sealing conductor pattern 3 formed on the opening side top surface of the side wall portion surrounding the recessed space 7 in which the integrated circuit element 6 and the piezoelectric vibration element 5 are mounted. It arrange | positions with the form which covers the space 7 opening part, it joins with the conductor pattern 3 for sealing by heat-melting the sealing member 2 formed cyclically | annularly in the container body side main surface edge part of the cover body 4, and the recessed part space 7 The inside is hermetically sealed. The piezoelectric oscillator 20 is configured as described above. The lid 4 is manufactured by adopting a conventionally well-known metal processing method and molding a metal such as 42 alloy into a predetermined shape, and a nickel (Ni) layer is formed on the surface of the lid 4. A gold tin (Au—Sn) layer as the sealing member 2 is formed at a position corresponding to the sealing conductor pattern 3 on the upper surface of the Ni layer. The thickness of the gold tin (Au—Sn) layer is 10 μm to 40 μm. For example, the component ratio is 80% gold and 20% tin. Such a sealing member 2 melts and deforms corresponding to the unevenness of the sealing conductor pattern 3, and it is possible to prevent a decrease in hermeticity.

  4 is a cross-sectional view showing an embodiment of the piezoelectric oscillator when the mounting base 12 shown in FIG. 1 is in another form, that is, the mounting base formed in the piezoelectric oscillator 40. The shape of the integrated circuit element mounting surface 41 is substantially similar to the shape of the container body fixing surface of the integrated circuit element 6, and the area of the integrated circuit element mounting surface of the mounting base 41 is the container body of the integrated circuit element 6. The area is smaller than the area of the fixing surface. By using the mounting base part 41 having such a configuration, an extra joining member 14 is attached to the main surface of the integrated circuit element 6 and the upper surface of the mounting base part 41 when the integrated circuit element 6 is mounted, compared to the mounting base part 12 shown in FIG. Since the overflowed joining member 14 flows out to the bottom surface of the recessed space below the mounting base 41 without being exposed to the side surface of the integrated circuit element 6, the thickness of the integrated circuit element is particularly large. Even when the thickness is thin or the amount of the bonding member for fixing the integrated circuit element is large, the bonding member overflowing from between the main surface of the integrated circuit element and the upper surface of the mounting base adheres to a holding jig such as a pyramid collet. Therefore, the possibility of the occurrence of various problems as a piezoelectric oscillator due to the joining member attached to the holding jig can be prevented.

  In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. In the embodiment described above, quartz is used as the piezoelectric material of the piezoelectric vibration element 5, but a piezoelectric vibration element formed from another piezoelectric material such as lithium tantalate, lithium niobate, or piezoelectric ceramics is used. Also good.

  In addition to the above-described embodiment, as shown in FIG. 5, a first side wall portion 52 is formed upright on the entire periphery of the edge portion of one main surface of the flat insulating substrate 51. A first recess space 53 surrounded by one side wall 52 and one main surface of the substrate 51 is formed, and a piezoelectric vibration element connection electrode pad 54 is formed on the bottom surface of the first recess space 53. Further, an upright second side wall 55 is formed around the entire periphery of the edge of the other main surface of the substrate 51, and the second side wall 55 is surrounded by the second main surface of the substrate 51 and the second main surface. A convex stepped portion 57 is formed in the concave portion space 56 toward the opening of the second concave portion space 56, and an integrated circuit element connecting electrode pad 58 is formed on the plane of the stepped portion 57. A container body 50, a piezoelectric vibration element 59 mounted on the electrode pad 54 for connecting the piezoelectric vibration element, and a second At least an oscillation circuit electrically connected to the piezoelectric vibration element 59 is mounted on the bottom surface of the lowermost step in the partial space 56, and the container body connection electrode 60 is formed on one main surface, and the other main surface is attached to the main surface. An integrated circuit element 61 mounted in a form facing the bottom surface of the lowermost stage and a first side wall 52 surrounding a first recess space 53 in which a piezoelectric vibration element 59 formed in the container body 50 is mounted. The lid 63 is fixed to the sealing conductor pattern 62 provided on the top surface of the concave space opening side and hermetically seals the first concave space 53 having the piezoelectric vibration element 59 mounted therein. Similarly, in the piezoelectric oscillator 65, a mounting base having a convex shape toward the opening of the second concave space 56 for fixing and mounting the integrated circuit element on the bottom surface of the bottom of the second concave space 56 of the container body 50. Portion 64 is formed, and its mounting base 6 By joining mounted by bonding member 66 the integrated circuit element 61 on the can it has the same effect as the piezoelectric oscillator 20 shown in FIGS.

  Furthermore, in addition to the above-described embodiment, as shown in FIG. 6, one first recess space 71 is formed, and an electrode pad 72 for connecting a piezoelectric vibration element is formed on the inner bottom surface of the first recess space 71. The formed first container body 73 and one second recessed space 74 are formed, and a stepped portion 75 convex toward the opening of the second recessed space 74 is formed in the second recessed space 74. On the plane of the stepped portion 75, the second container body 77 in which the integrated circuit element connecting electrode pads 76 are formed, and the piezoelectric vibrating element connecting formed on the bottom surface in the first recessed space 71 At least an oscillation circuit electrically connected to the piezoelectric vibration element 78 is mounted on the bottom surface of the piezoelectric vibration element 78 mounted on the electrode pad 72 and the second recess space 74, and one main The container connection electrode 79 is formed on the surface, and the other main surface is The first side wall portion surrounding the first recessed space 71 in which the integrated circuit element 80 mounted in a form directed toward the step bottom surface and the piezoelectric vibration element 78 formed in the first container body 73 is mounted. The first concave space 71 is fixed to a sealing conductor pattern 81 provided on the opening side top surface of the first concave space 71, and a lid 82 hermetically seals the first concave space 71 in which the piezoelectric vibration element 78 is mounted. Similarly, in the piezoelectric oscillator 70 formed by joining the first container 73 sealed with the lid 82 and the second container 77 having the integrated circuit element 80 mounted therein, the second container A convex mounting base 83 is formed on the bottom surface of the bottom of the second recess space 74 of the body 77 toward the opening of the second recess space 74 for firmly mounting the integrated circuit element 80. On the mounting base 83, the integrated circuit element 80 is bonded to the bonding member 84. By further bonding mounting, it has the same effect as the piezoelectric oscillator 20 shown in FIGS.

FIG. 1 is a schematic exploded perspective view showing an embodiment of a piezoelectric oscillator according to the present invention. FIG. 2 is a schematic cross-sectional view of the piezoelectric oscillator shown in FIG. 1 cut along a virtual cutting line that bisects two short sides of the piezoelectric oscillator. FIG. 3 is an explanatory view showing a form in which the integrated circuit element is mounted in the container in the piezoelectric oscillator shown in FIG. 1 or FIG. FIG. 4 is a cross-sectional view showing an embodiment of the piezoelectric oscillator when the mounting base 12 in the piezoelectric oscillator shown in FIG. FIG. 5 is a schematic exploded cross-sectional view showing another embodiment of the piezoelectric oscillator according to the present invention. FIG. 6 is a schematic exploded cross-sectional view showing another embodiment of the piezoelectric oscillator according to the present invention. FIG. 7 is a schematic exploded sectional view showing an embodiment of a conventional piezoelectric oscillator.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Container body, 2 ... Sealing member, 3 ... Conductive pattern for sealing, 4 ... Cover body, 5 ... Piezoelectric vibration element, 6 ... Integrated circuit element 7... Recessed space 9... Conductive adhesive material 10. Electrode terminal for external connection 11. Electrode pad for connecting piezoelectric vibration element 12. , 13... Integrated circuit element connection electrode pad, 14... Bonding member, 15... Stepped portion, 16. Oscillator, 41... Mounting base 50 .. container body, 51... Substrate, 52... First side wall part, 53. Electrode pad 55... Second side wall portion 56... Second recessed space 57. Step portion 58. 59... Piezoelectric vibration element 60... Electrode pad for connecting container body 61... Integrated circuit element 62... Conductive pattern for sealing 63. Mounting base, 65... Piezoelectric oscillator, 66... Bonding member 70... Piezoelectric oscillator, 71... First recess space, 72. First container body, 74... Second recessed space, 75... Step part, 76... Integrated circuit element connection electrode pad, 77. Vibration element, 79... Electrode pad for container connection, 80... Integrated circuit element, 81... Conductive pattern for sealing, 82.・ Joint material

Claims (4)

One concave space is formed, and a convex stepped portion is formed in the concave space toward the concave opening. On the plane of the stepped portion, an electrode pad for connecting a piezoelectric vibration element and an electrode pad for connecting an integrated circuit element A container body formed with,
A piezoelectric vibration element mounted on the electrode pad for connecting the piezoelectric vibration element;
At least an oscillation circuit electrically connected to the piezoelectric vibration element is mounted on the bottom surface of the lowermost step in the recess space, and a container body connection electrode is formed on one main surface, and the other main surface is formed on the uppermost surface. An integrated circuit element mounted in a form facing the bottom of the lower tier,
Of the concave space formed in the container body, the piezoelectric vibration element is fixed to a sealing conductor pattern provided on the concave space opening side top surface of the side wall portion surrounding the concave space in which the piezoelectric vibration element is mounted. In a piezoelectric oscillator constituted by a lid that hermetically seals a recessed space mounted inside,
A piezoelectric oscillator characterized in that a convex mounting base portion is formed on the bottom surface of the lowermost step in the concave space of the container body toward the concave space opening for securely mounting the integrated circuit element. An upright first side wall is formed around the entire periphery of the edge of one main surface of the flat insulating substrate, and is surrounded by the first side wall and one main surface of the insulating substrate. A first recess space is formed, an electrode pad for connecting a piezoelectric vibration element is formed on the bottom surface of the first recess space, and is upright on the entire periphery of the edge of the other main surface of the substrate. The second sidewall portion is formed, and the second sidewall portion surrounded by the second sidewall portion and the other main surface of the insulating substrate protrudes toward the second recess space opening. A container body in which an electrode pad for connecting an integrated circuit element is formed on a plane of the step portion,
A piezoelectric vibration element mounted on the piezoelectric vibration element connecting electrode pad formed on the bottom surface in the first recess space;
At least an oscillation circuit electrically connected to the piezoelectric vibration element is mounted on the bottom surface of the lowermost step in the second recess space, and a container body connection electrode is formed on one main surface, and the other main surface An integrated circuit element mounted in a form facing the bottom surface of the lowermost stage,
The piezoelectric vibration element formed in the container body is fixed to the sealing conductor pattern provided on the concave space opening side top surface of the first side wall portion surrounding the first concave space mounted therein, A piezoelectric oscillator comprising: a lid that hermetically seals the first recess space in which the piezoelectric vibration element is mounted;
A convex mounting base is formed on the bottom surface of the lowermost step in the second recess space of the container body so as to face the second recess space opening for firmly mounting the integrated circuit element. A piezoelectric oscillator characterized by the following. A first container body in which one first recess space is formed, and an electrode pad for connecting a piezoelectric vibration element is formed on the inner bottom surface of the first recess space;
One second recess space is formed, and a convex step portion is formed in the second recess space toward the second recess opening, and an integrated circuit element connection is formed on the plane of the step portion. A second container body on which electrode pads are formed;
A piezoelectric vibration element mounted on the piezoelectric vibration element connecting electrode pad formed on the bottom surface in the first recess space;
At least an oscillation circuit electrically connected to the piezoelectric vibration element is mounted on the bottom surface of the lowermost step in the second recess space, and a container body connection electrode is formed on one main surface, and the other main surface An integrated circuit element mounted in a form facing the bottom surface of the lowermost stage,
The piezoelectric vibration element formed in the container body is fixed to the sealing conductor pattern provided on the concave space opening side top surface of the first side wall portion surrounding the first concave space mounted therein, A piezoelectric oscillator comprising: a lid that hermetically seals the first recess space in which the piezoelectric vibration element is mounted;
A convex mounting base is formed on the bottom surface of the lowermost step in the second recess space of the second container body so as to project toward the second recess space opening for firmly mounting the integrated circuit element. A piezoelectric oscillator characterized by comprising:   The shape of the integrated circuit element mounting surface of the mounting base is substantially similar to the shape of the container fixing surface of the integrated circuit element, and the area of the integrated circuit element mounting surface of the mounting base is the integrated circuit element. 4. The piezoelectric oscillator according to claim 1, wherein the piezoelectric oscillator is smaller than an area of the container body fixing surface.

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