JP2008004634A - Semiconductor package, method of connecting the same with printed board, board, and electronic instrument - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor package with improved noise resistance by providing a plane for a specific signal in the semiconductor package and connecting the plane with a printed board via a platelike flat plane terminal provided on a side face of the package, to provide a board, to provide an electronic instrument, and to provide a method of connecting the semiconductor package with the printed board. <P>SOLUTION: The semiconductor package 10 has a semiconductor chip 11 mounted. The package is equipped on its rear face with balls 14 serving as a plurality of signal terminals for electrically connecting an input/output pin of the semiconductor chip 11 to the outside, a power supply plane 12 connected with a power source of the semiconductor chip 11 in parallel to the rear face of the chip 11, a ground plane 13 connected with the ground of the chip 11 in parallel to the rear face of the chip 11, a platelike flat plate terminal 15-1 electrically connecting the plane 12 with the outside on the side face, and a platelike flat plate terminal 15-2 electrically connecting the plane 13 with the outside on the side face. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a semiconductor package, a board, an electronic device, and a method for connecting a semiconductor package and a printed board, and more particularly to a technique for improving noise resistance of a specific signal such as a power supply or a ground.

  As the degree of integration of semiconductor integrated circuits increases, the number of signals increases, and further, the number of power supply pins and ground pins increase due to the increase in types of necessary power supplies and the increase in required current capacity, and the number of pins is further increased. Semiconductor integrated circuit packages (referred to as semiconductor packages) have also increased in number of pins, and as a package having a structure in which a large number of pins are efficiently mounted on a printed board, a PGA (pin grid array) type or BGA (pin grid array) type in which pins are arranged in a grid pattern. Ball grid array) type packages are used.

  The PGA and BGA packages have a large number of power pins and ground pins arranged between signal pins in order to supply necessary power and ensure noise tolerance. Many printed boards on which PGA and BGA packages are mounted are of a laminated type, and a power supply layer and a ground layer are laminated together with a signal layer. The semiconductor pins mounted on the PGA or BGA package are electrically connected to the connection portion of the printed board mounting surface via the inner lead and the package lead or ball in the package, and further via each via hole. Electrical connection with wiring.

  In addition, since the BGA package has a large number of signal pins, the printed board under the BGA package mounting area is provided with a large number of signal via holes. FIG. 7 is a diagram showing the pattern of the power supply layer of the printed circuit board in the vicinity of the area where the BGA package is mounted. The white circle in FIG. 7 is a hole for passing a via hole for a signal line, and the black circle is a via hole for a power supply. It is. The power source is connected to the ball of the BGA package through a black circle via hole. Although FIG. 7 shows the power supply layer, the ground layer is the same.

  As the number of pins increases, the semiconductor package operates at high speed, and the semiconductor package has been devised to reduce noise. For example, the invention disclosed in Japanese Patent Laid-Open No. 3-120748 has a structure in which a power plane and a ground plane are arranged on an inner lead in order to solve a noise problem of a dual in-line package. The invention disclosed in Japanese Patent Laid-Open No. 11-74308 has a structure in which a grounding wiring layer is disposed on the opposite side of the signal line layer surface of the insulating equipment on the semiconductor mounting surface with respect to the BGA package, and is low in cost and noise resistant. Realize the sex.

JP-A-3-120748 JP-A-11-74308

  As described above, the conventional technology has a problem that the power supply layer and the ground layer of the printed board in the mounting region of the multi-pin semiconductor package are perforated as shown in FIG. In the invention of the above-mentioned patent document, the power supply plane and the ground plane are provided in the semiconductor package, but there is a problem that the deterioration of the noise resistance cannot be improved only by providing the power supply plane and the ground plane in the semiconductor package.

  An object of the present invention is to provide a semiconductor package by providing a plane for a specific signal (power supply or ground) in the semiconductor package and connecting the plane to a printed board by a plate-like flat plate terminal provided on the side of the package. An object of the present invention is to provide a semiconductor package, a board, an electronic device, and a method for connecting a semiconductor package and a printed board with improved noise resistance.

A first semiconductor package of the present invention has a semiconductor chip mounted thereon, a plurality of signal terminals that electrically connect input / output pins of the semiconductor chip to the outside, and a plane that is connected to a specific signal of the semiconductor chip. A semiconductor package provided in parallel to the back surface of the semiconductor chip,
A plate-like plate terminal for electrically connecting the plane and the outside is provided on the side surface.

  According to a second semiconductor package of the present invention, in the first semiconductor package of the present invention, the plate terminal is bent out at an obtuse angle in the direction of the signal terminal from the side surface of the semiconductor package, and further, It is characterized by a bent shape at an extended position on the surface where the signal terminals are arranged.

  According to a third semiconductor package of the present invention, in the first semiconductor package of the present invention, the specific signal is a ground or a power supply.

A fourth semiconductor package of the present invention includes a semiconductor chip, a plurality of signal terminals that electrically connect input / output pins of the semiconductor chip to the outside, and a power plane that is connected to the power source of the semiconductor chip. A semiconductor package provided in parallel to the back surface of the chip and a ground plane connected to the ground of the semiconductor chip in parallel to the back surface of the semiconductor chip,
A plate-like first plate terminal that electrically connects the power plane and the outside is provided on the side surface, and a plate-like second plate terminal that electrically connects the ground plane and the outside is a side surface different from the first plate terminal. It is characterized by being provided in.

  According to a fifth semiconductor package of the present invention, in the fourth semiconductor package of the present invention, the semiconductor chip has a second power source in addition to the power source, and is connected to the second power source of the semiconductor chip. The power plane is provided in parallel to the back surface of the semiconductor chip, and the plate-like third plate terminal that electrically connects the second power plane and the outside is different from the first plate terminal or the second plate terminal. It is provided on the side.

  According to a sixth semiconductor package of the present invention, in the fourth semiconductor package of the present invention, the semiconductor chip has a second power source in addition to the power source, and the power plane is connected to the power source of the semiconductor chip. A first power supply plane and a second power supply plane connected to the second power supply of the semiconductor chip, and a third plate terminal and a second power supply connecting the first plate terminal to the first power supply plane. It is characterized by being divided into fourth plate terminals connected to the plane.

The first board of the present invention is a board having a semiconductor package mounted on a printed board,
A semiconductor package is mounted with a semiconductor chip, and a plurality of signal terminals for electrically connecting the input / output pins of the semiconductor chip to the printed board are provided on a surface facing the printed board, and a plane for connecting with a specific signal of the semiconductor chip is provided. Provided in parallel to the back of the semiconductor chip, plate-like plate terminals that electrically connect the plane and the outside are provided on the side,
A signal of the semiconductor chip is connected to the printed board through a plurality of signal terminals, and a specific signal is connected to the printed board through the plate terminal.

  According to a second board of the present invention, in the first board of the present invention, a specific signal of the semiconductor chip is connected to the printed board through the plate terminal, and the printed board through the signal terminal. It is characterized by connecting to.

The third board of the present invention is a board having a semiconductor package mounted on a printed board,
A semiconductor package is equipped with a semiconductor chip, and a plurality of signal terminals for electrically connecting input / output pins of the semiconductor chip to the outside are provided on the back surface, and a power plane connected to the power source of the semiconductor chip is parallel to the back surface of the semiconductor chip. Provide a ground plane connected to the ground of the semiconductor chip in parallel to the back surface of the semiconductor chip,
A plate-like first plate terminal that electrically connects the power plane and the outside is provided on the side surface, and a plate-like second plate terminal that electrically connects the ground plane and the outside is a side surface different from the first plate terminal. Provided in
The signal of the semiconductor chip is connected to the printed board through a plurality of signal terminals, the power source of the semiconductor chip is connected to the printed board through the power plane and the first plate terminal, and the ground of the semiconductor chip is connected to the ground plane and the second board. It connects to a printed circuit board via the plate terminal of this.

  According to a tenth board of the present invention, in the third board of the present invention, the printed board has a signal, a power supply layer, and a ground layer, and the power supply layer is connected to the first plate terminal through a plurality of via holes. The ground layer is connected to the second plate terminal through a plurality of via holes.

A first electronic device of the present invention is an electronic device on which a board having a semiconductor package mounted on a printed board is mounted,
A semiconductor package has a semiconductor chip mounted thereon, a plurality of signal terminals that electrically connect input / output pins of the semiconductor chip to the outside, and a plane that is connected to a specific signal of the semiconductor chip and is provided in parallel on the back surface of the semiconductor chip And a plate-like plate terminal for electrically connecting the plane and the outside of the semiconductor package is provided on the side surface of the semiconductor package.

  According to a second electronic device of the present invention, in the first electronic device of the present invention, a specific signal of the semiconductor chip is connected to the printed board via the plate terminal, and the print terminal is connected via the signal terminal. It is connected to a board.

A third electronic device of the present invention is an electronic device on which a board on which a semiconductor package is mounted on a printed board is mounted,
A semiconductor package is equipped with a semiconductor chip, and a plurality of signal terminals for electrically connecting input / output pins of the semiconductor chip to the outside are provided on the back surface, and a power plane connected to the power source of the semiconductor chip is parallel to the back surface of the semiconductor chip. Provide a ground plane connected to the ground of the semiconductor chip in parallel to the back surface of the semiconductor chip,
A plate-like first plate terminal that electrically connects the power plane and the outside is provided on the side surface, and a plate-like second plate terminal that electrically connects the ground plane and the outside is a side surface different from the first plate terminal. Provided in
The signal of the semiconductor chip is connected to the printed board through a plurality of signal terminals, the power source of the semiconductor chip is connected to the printed board through the power plane and the first plate terminal, and the ground of the semiconductor chip is connected to the ground plane and the second board. It connects to a printed circuit board via the plate terminal of this.

The first connection method of the present invention is a connection method between a semiconductor package and a printed board,
A semiconductor package is equipped with a semiconductor chip, and a plurality of signal terminals for electrically connecting the input / output pins of the semiconductor chip to the printed board are provided on a surface facing the printed board, and a plane for connecting with a specific signal of the semiconductor chip is provided. Provided in parallel to the back of the semiconductor chip, plate-like plate terminals that electrically connect the plane and the outside are provided on the side,
A signal of the semiconductor chip is connected to the printed board through a plurality of signal terminals, and a specific signal is connected to the printed board through the plate terminal.

  According to a second connection method of the present invention, in the first connection method of the present invention, a specific signal of the semiconductor chip is connected to the printed board via the plate terminal, and the print terminal is connected via the signal terminal. It is connected to a board.

A third connection method of the present invention is a connection method between a semiconductor package and a printed board,
A semiconductor package is equipped with a semiconductor chip, and a plurality of signal terminals for electrically connecting input / output pins of the semiconductor chip to the outside are provided on the back surface, and a power plane connected to the power source of the semiconductor chip is parallel to the back surface of the semiconductor chip. Provide a ground plane connected to the ground of the semiconductor chip in parallel to the back surface of the semiconductor chip,
A plate-like first plate terminal that electrically connects the power plane and the outside is provided on the side surface, and a plate-like second plate terminal that electrically connects the ground plane and the outside is a side surface different from the first plate terminal. Provided in
The signal of the semiconductor chip is connected to the printed board through a plurality of signal terminals, the power source of the semiconductor chip is connected to the printed board through the power plane and the first plate terminal, and the ground of the semiconductor chip is connected to the ground plane and the second board. It connects to a printed circuit board via the plate terminal of this.

  The present invention provides a plane plate terminal for a specific signal such as a power plane or a ground plane in a semiconductor package, and a plate-like plate terminal that can be connected to the printed board from the side of the package with a sufficient width. It has a provided structure. Therefore, according to the present invention, a specific signal such as a power supply or a ground can be connected to the printed board with a flat plate terminal having a higher noise resistance than that of a conventional signal terminal, so that the noise resistance can be improved. effective.

Next, the best mode for carrying out the present invention will be described in detail with reference to the drawings.
1A and 1B are views showing the structure of a semiconductor package 10 according to the present invention. FIG. 1A is a sectional view of the semiconductor package 10 viewed from the side, and FIG. 1B is a view of the semiconductor package 10 viewed from the top. It is a figure. In FIG. 1, a BGA package is shown as an example of the semiconductor package 10. However, the semiconductor package 10 is not limited to the BGA package, and any signal terminals may be provided as long as the PGA package is provided.

  Referring to FIG. 1, a semiconductor package 10 includes a semiconductor chip 11, a power plane 12, a ground plane 13, balls 14, flat plate terminals 15-1, and flat plate terminals 15-2. In addition, when calling flat plate terminal 15-1 and flat plate terminal 15-2 without distinguishing, it describes as flat plate terminal 15.

  The semiconductor chip 11 is a semiconductor bare chip such as an LSI (Large Scale Integrated circuit). Although not shown, each input / output pin of the semiconductor chip 11 is connected to the corresponding ball 14 by an inner lead and is not shown via the ball 14. It can be connected to a printed board.

  The balls 14 are signal terminals arranged in a grid pattern on the back surface (the surface facing the printed board) of the semiconductor package 10 according to the number of pins of the semiconductor chip 11. It adheres to the conductive parts provided in The semiconductor package 10 is electrically connected and fixed to the printed board by the balls 14. When the signal terminal is a rod-like lead as in the PGA package, it is bonded to the printed board with solder.

  The power plane 12 and the ground plane 13 are thin plate-like conductors having a size that covers the semiconductor chip 11, and are arranged on the back surface (upward in FIG. 1) of the semiconductor chip 11. However, the magnitude relationship among the power plane 12, the ground plane 13, and the semiconductor chip 11 is not particularly limited, and the arrangement relationship does not need to be centered, and may be determined in consideration of the efficiency of power / ground wiring manufacturing. .

  Although not shown, a wiring pattern for connecting the signal pins of the semiconductor chip 11 and the balls 14 is disposed on the surface of the semiconductor chip 11 (downward in FIG. 1). The power plane 12 is connected to all the power pins of the semiconductor chip 11 and supplies power to the semiconductor chip 11 from the printed board via the flat plate terminal 15-1. The ground plane 13 is connected to all the ground pins of the semiconductor chip 11 and is connected to the ground of the printed board via the flat plate terminal 15-2.

  The flat plate terminal 15 is a thin plate-like plate terminal, has conductivity, and is formed in a shape as shown in FIG. Since the flat plate terminal 15 connects the power plane 12 or the ground plane 13 and the printed board in a plate shape, the flat plate terminal 15 is excellent in noise resistance and can supply a sufficient power capacity to the semiconductor chip 11.

  In FIG. 1, the flat plate terminal 15 having a width according to the size of the power plane 12 or the ground plane 13 is shown, but the width of the flat plate terminal 15 is matched to the size of the power plane 12 or the ground plane 13. There is no need, and the width may be determined according to the required noise resistance and power supply capacity.

  Next, a printed board on which the semiconductor package 10 is mounted will be described. Although not shown, the printed board has a part that adheres to the ball 14 of the semiconductor package 10 and a component that adheres to the flat plate terminal 15. The component bonded to the ball 14 is connected to one via hole of the printed board and connected to the wiring of the signal layer of the printed board through the via hole. A portion to be bonded to the flat plate terminal 15 is connected to a plurality of via holes of the printed board and connected to a power supply layer or a ground layer of the printed board.

  FIG. 2 is a diagram showing a pattern of the power supply layer of the printed board. The black circle is a hole for a signal via hole, and the white circle is a portion connected to a via hole for power supply. In the example of FIG. 2, power supply via holes are gathered in the right part of the drawing, but this is a via hole for connection to the power supply flat plate terminal 15-1.

  In the example of FIG. 2, power is supplied to the semiconductor package 10 mainly using the via holes in this portion, and supplementarily supplied using several balls 14. All the power to be supplied may be supplied from the flat plate terminal 15-1. Although the power supply layer pattern has been described with reference to FIG. 2, the ground layer pattern is also the same, and a description thereof will be omitted.

  Thus, since there is no signal via hole for connecting to the ball 14 in the vicinity of the flat plate terminal 15, it is not necessary to make many holes in the power supply layer / ground layer in this region, and the power supply / ground is supplied. A more suitable pattern can be realized. Therefore, it is possible to supply power / ground having excellent noise resistance.

  In addition, since the power / ground is greatly strengthened by the flat plate terminal 15, the number of balls 14 used for supplying the power / ground is greatly reduced if the same level of noise resistance as that of the prior art is ensured. can do. Therefore, since the reduced power / ground balls 14 can be used as signals other than the power and ground, the number of signal lines of the semiconductor package 10 can be increased.

  In the above description, the power source is assumed to be one type, but some semiconductors require the supply of two or more types of power source. In this case, a case where two types of power supplies are required will be described as an example. In FIG. 3, a first power plane 22-1 and a second power plane 22-2 that receive two types of power supplies are stacked, and further, a first ground plane 23-1 and a second ground plane 23-2 are stacked. 1 is a diagram showing a structure of a semiconductor package 20 in which are stacked. 3A is a cross-sectional view seen from the side, and FIG. 3B is a perspective view seen from the top.

  The first power plane 22-1 is connected to the flat plate terminal 25-1 arranged on the right side of the figure, and the first ground plane 23-1 is connected to the flat plate terminal 25-2 arranged on the left side of the figure. To do. The structure so far is the same as FIG. In FIG. 3, the second power plane 22-2 is further connected to a flat plate terminal 25-3 disposed on the lower side of the drawing, and the second ground plane 23-2 is a flat plate disposed on the upper side of the drawing. Connect to terminal 25-4.

  As described above, the semiconductor package 20 shown in FIG. 3 has the flat plate terminals 25 on all sides. However, the connection with the printed board and the pattern of the power supply layer / ground layer of the printed board are shown in FIG. Since this is the same as the case of FIG. However, since the printed board needs to supply two types of power, it is different in that it has two or more power layers or needs to be divided into two regions.

  FIG. 4 is a perspective view showing the structure of the semiconductor package 30 in which the first power plane 32-1 and the second power plane 32-2 that receive two types of power supplies are disposed in the same layer as seen from above. It is. 4 employs a structure in which the power plane 12 of FIG. 1 is divided into a power plane 32-1 and a second power plane 32-2, and the power plane 32-1 is connected to the flat plate terminal 35-1, and the second The power plane 32-2 is connected to the flat plate terminal 35-2 and is connected to the printed board by the flat plate terminals 35-1 and 35-2. The ground plane 13 is connected to the printed board via a flat plate terminal 35-3.

  As described above, in the semiconductor package of the present invention, the power source and the ground can be connected to the printed board by the flat plate terminals 15, 25, 35 in any configuration of the semiconductor package 10, the semiconductor package 20, and the semiconductor package 30. it can. Since the flat plate terminals 15, 25, and 35 extend in the outer peripheral direction of the semiconductor package and are connected to the printed board, the power supply layer and the ground layer of the printed board have a perforated shape to avoid signal via holes. By avoiding the mounting area, it is possible to connect to the power supply layer and the ground layer of the printed board. Thereby, the semiconductor package of this invention can connect a power supply and a ground stably between printed boards, and can improve noise resistance.

  Further, since the power source and the ground can be connected to the printed board by the flat plate terminals 15, 25, and 35 instead of the balls 14, it is possible to reduce the number of power and ground balls 14 that have been assigned to the balls 14 in the past. As a result, the reduced area of the ball 14 can be used as the wiring area of the printed board, and the wiring efficiency of the printed board is improved. Alternatively, since the reduced power supply and ground balls 14 can be used as normal signals, the semiconductor chip 11 can use more signals as input / output pins.

  In the above description, a plane dedicated to the power supply and the ground is provided in the semiconductor package, and a flat plate terminal is provided according to the dedicated plane. The present invention can also be applied to a configuration in which a dedicated plane and a flat plate terminal are provided. Even when a special signal layer is not provided on the printed board, the dedicated plane and the flat plate terminal can be connected to the printed board more stably than the ball 14.

  Moreover, although the example of the side surface direction of each flat plate terminal 15, 25, 35 connected to each power plane 12, 22, 32 and each ground plane 13, 23 has been described, the flat plate terminals 15, 25, 35 are The direction of the side surface to be attached is not limited to the direction described with reference to FIGS.

  For example, the semiconductor package 10 of FIG. 1 may be attached in a side surface direction that does not face the flat plate terminal 15-1 for power supply and the flat plate terminal 15-2 for ground, or the two flats for power supply of FIG. The plate terminals 35-1 and 35-2 may be attached by being divided into two in the same side surface direction. The semiconductor package 20 of FIG. 3 is the same as the semiconductor package 10 and does not particularly limit the side surface direction to which the flat plate terminal is attached. The semiconductor package 30 of FIG. 4 divides the power planes 32-1 and 32-2 into the same layer, but the flat plate terminals 35-1 and 35-2 are divided and attached to the left side in the same side surface direction as shown in FIG. It is not necessary, and it may be attached in a shape having a lateral width in the lateral direction upward in FIG.

  Next, a board on which the above-described semiconductor package is mounted will be described. FIG. 5 is a diagram showing an example of a board on which a semiconductor package is mounted. In the example of FIG. 5, the semiconductor package mounting board 40 has a semiconductor package 10, a semiconductor package 20, a connector 42, and other electronic components mounted on a printed board 41. In the example of FIG. 5, two semiconductor packages of the present invention are mounted on the semiconductor package mounting board 40, but at least one of the semiconductor packages 10, 20, and 30 may be mounted.

  The printed board 41 has a power supply layer and a ground layer, and has a structure that can be electrically connected to the flat plates 15, 25, and 35 of the semiconductor packages 10, 20, and 30. The connector 42 is a connector for connecting to an electronic device on which the semiconductor package mounting board 40 is mounted. However, the connector 42 may be configured to be connected to the electronic device using a cable instead of the connector 42. In addition, when the semiconductor package mounting board 40 is a main board (motherboard) of an electronic device, there may be no connector or cable.

  FIG. 6 is a diagram showing an electronic device 50 on which the semiconductor package mounting board 40 of the present invention is mounted. The electronic device 50 has at least one semiconductor package mounting board 40 mounted thereon. Examples of the electronic device 50 include an information processing device, a communication device, an exchange, an electric appliance, an electronic device incorporated in various devices, and the like, and any device that has the semiconductor package mounting board 40 mounted thereon without any particular limitation. Can be applied.

  Since the electronic device 50 according to the present invention is equipped with the semiconductor package mounting board 40, and the semiconductor package mounting board 40 according to the present invention is mounted with any one or more of the semiconductor packages 10, 20, and 30, the electronic device 50 according to the present invention and the present invention. The semiconductor package mounting board 40 of the invention can improve the noise resistance of the power source and the ground, and can realize a stable operation resistant to noise.

  As described above, in the method of connecting the semiconductor package to the printed board, the present invention provides the printed board with the flat plate terminals 15, 25, and 35 that are exclusively provided with the power supply and the ground that are specific signals of the semiconductor chip 11. It can be connected, and can be connected to the printed board via both the signal terminals on the back surface of the semiconductor packages 10, 20, 30 and the flat plate terminals 15, 25, 35.

  Therefore, according to the present invention, the power source or the ground is connected to the printed board only through the flat plate terminals 15, 25, 35 or the power source or the ground is connected to the flat plate terminals 15, 25, 35 according to the required noise tolerance. A sufficient and efficient connection method can be selected by connecting to the printed board using signal terminals in the number corresponding to the noise tolerance that is insufficient.

  The present invention can be applied to a semiconductor package, a board on which the semiconductor package is mounted, and an electronic device in which the board is mounted. That is, the present invention can be applied to a device or apparatus on which a semiconductor is mounted.

It is the figure which showed the structure of the semiconductor package 10 of this invention. It is the figure which showed an example of the pattern of the power supply layer of the printed circuit board of this invention. It is the figure which showed the structure of the semiconductor package 20 with the 2 layer power supply plane of this invention. It is the figure which showed the structure of the semiconductor package 30 which has two power supply planes in 1 layer of this invention. It is the figure which showed an example of the semiconductor package mounting board 40 of this invention. It is the figure which showed the electronic device 50 carrying the semiconductor package mounting board 40 of this invention. It is the figure which showed an example of the pattern of the power supply layer of the printed circuit board carrying the conventional semiconductor package.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Semiconductor package 11 Semiconductor chip 12 Power plane 13 Ground plane 14 Ball | bowl 15-1, 15-2 Flat plate terminal 20 Semiconductor package 22-1, 22-2 Power plane 23-1, 23-2 Ground plane 25-1, 25 -2, 25-3, 25-4 Flat plate terminal 30 Semiconductor package 32-1, 32-2 Power plane 35-1, 35-2, 35-3 Flat plate terminal 40 Semiconductor package mounting board 41 Printed board 50 Electronic equipment

Claims (16)

A semiconductor with a semiconductor chip mounted, a plurality of signal terminals that electrically connect the input / output pins of the semiconductor chip to the outside, and a plane that connects a specific signal of the semiconductor chip to the back of the semiconductor chip A package,
A semiconductor package characterized in that a plate-like plate terminal for electrically connecting a plane and the outside is provided on a side surface. The plate terminal has a shape that protrudes from the side surface of the semiconductor package to the outside and is bent at an obtuse angle in the direction of the signal terminal, and further bent at a position on an extension of a surface where the plurality of signal terminals are arranged. Item 1. A semiconductor package according to item 1. 2. The semiconductor package according to claim 1, wherein the specific signal is a ground or a power source. A semiconductor chip is mounted, a plurality of signal terminals for electrically connecting the input / output pins of the semiconductor chip to the outside are provided on the back surface, and a power plane for connecting to the power source of the semiconductor chip is provided in parallel on the back surface of the semiconductor chip. A semiconductor package in which a ground plane connected to the ground of the semiconductor chip is provided in parallel to the back surface of the semiconductor chip,
A plate-like first plate terminal that electrically connects the power plane and the outside is provided on the side surface, and a plate-like second plate terminal that electrically connects the ground plane and the outside is a side surface different from the first plate terminal. A semiconductor package characterized by being provided in the above. The semiconductor chip has a second power source in addition to the power source, and a second power plane connected to the second power source of the semiconductor chip is provided in parallel to the back surface of the semiconductor chip, 5. The semiconductor package according to claim 4, wherein a plate-like third plate terminal for electrically connecting the outside is provided on a side surface different from the first plate terminal or the second plate terminal. The semiconductor chip has a second power source in addition to the power source, a first power plane connecting the power plane to the power source of the semiconductor chip, and a second power source connecting the second power source of the semiconductor chip. 5. The board is divided into planes, and the first plate terminal is divided into a third plate terminal connected to the first power plane and a fourth plate terminal connected to the second power plane. Semiconductor package. A board with a semiconductor package mounted on a printed board,
A semiconductor package is equipped with a semiconductor chip, and a plurality of signal terminals for electrically connecting the input / output pins of the semiconductor chip to the printed board are provided on a surface facing the printed board, and a plane for connecting with a specific signal of the semiconductor chip is provided. Provided in parallel to the back of the semiconductor chip, plate-like plate terminals that electrically connect the plane and the outside are provided on the side,
A board characterized in that a signal of a semiconductor chip is connected to a printed board through a plurality of signal terminals, and a specific signal is connected to the printed board through a plate terminal. 8. The board according to claim 7, wherein a specific signal of the semiconductor chip is connected to the printed board through the plate terminal and to the printed board through the signal terminal. A board with a semiconductor package mounted on a printed board,
A semiconductor package is equipped with a semiconductor chip, and a plurality of signal terminals for electrically connecting input / output pins of the semiconductor chip to the outside are provided on the back surface, and a power plane connected to the power source of the semiconductor chip is parallel to the back surface of the semiconductor chip. Provide a ground plane connected to the ground of the semiconductor chip in parallel to the back surface of the semiconductor chip,
A plate-like first plate terminal that electrically connects the power plane and the outside is provided on the side surface, and a plate-like second plate terminal that electrically connects the ground plane and the outside is a side surface different from the first plate terminal. Provided in
The signal of the semiconductor chip is connected to the printed board through a plurality of signal terminals, the power source of the semiconductor chip is connected to the printed board through the power plane and the first plate terminal, and the ground of the semiconductor chip is connected to the ground plane and the second board. A board characterized by being connected to a printed board via a plate terminal. The printed board includes a signal, a power supply layer, and a ground layer, the power supply layer is connected to the first plate terminal via a plurality of via holes, and the ground layer is connected to the second plate terminal and a plurality of via holes. The board of claim 9, wherein the board is connected. An electronic device equipped with a board having a semiconductor package mounted on a printed board,
A semiconductor package has a semiconductor chip mounted thereon, a plurality of signal terminals that electrically connect input / output pins of the semiconductor chip to the outside, and a plane that is connected to a specific signal of the semiconductor chip and is provided in parallel on the back surface of the semiconductor chip An electronic apparatus comprising: a plate-like plate terminal electrically connected to a plane and the outside of the semiconductor package on a side surface of the semiconductor package. 12. The electronic apparatus according to claim 11, wherein a specific signal of the semiconductor chip is connected to the printed board through the plate terminal and is connected to the printed board through the signal terminal. An electronic device equipped with a board having a semiconductor package mounted on a printed board,
A semiconductor package is equipped with a semiconductor chip, and a plurality of signal terminals for electrically connecting input / output pins of the semiconductor chip to the outside are provided on the back surface, and a power plane connected to the power source of the semiconductor chip is parallel to the back surface of the semiconductor chip. Provide a ground plane connected to the ground of the semiconductor chip in parallel to the back surface of the semiconductor chip,
A plate-like first plate terminal that electrically connects the power plane and the outside is provided on the side surface, and a plate-like second plate terminal that electrically connects the ground plane and the outside is a side surface different from the first plate terminal. Provided in
The signal of the semiconductor chip is connected to the printed board through a plurality of signal terminals, the power source of the semiconductor chip is connected to the printed board through the power plane and the first plate terminal, and the ground of the semiconductor chip is connected to the ground plane and the second board. An electronic device connected to a printed board through a plate terminal. A method for connecting a semiconductor package and a printed board,
A semiconductor package is equipped with a semiconductor chip, and a plurality of signal terminals for electrically connecting the input / output pins of the semiconductor chip to the printed board are provided on a surface facing the printed board, and a plane for connecting with a specific signal of the semiconductor chip is provided. Provided in parallel to the back of the semiconductor chip, plate-like plate terminals that electrically connect the plane and the outside are provided on the side,
A connection method comprising: connecting a signal of a semiconductor chip to a printed board through a plurality of signal terminals; and connecting a specific signal to the printed board through a plate terminal. The connection method according to claim 14, wherein a specific signal of the semiconductor chip is connected to the printed board through the plate terminal and is connected to the printed board through the signal terminal. A method for connecting a semiconductor package and a printed board,
A semiconductor package is equipped with a semiconductor chip, and a plurality of signal terminals for electrically connecting input / output pins of the semiconductor chip to the outside are provided on the back surface, and a power plane connected to the power source of the semiconductor chip is parallel to the back surface of the semiconductor chip. Provide a ground plane connected to the ground of the semiconductor chip in parallel to the back surface of the semiconductor chip,
A plate-like first plate terminal that electrically connects the power plane and the outside is provided on the side surface, and a plate-like second plate terminal that electrically connects the ground plane and the outside is a side surface different from the first plate terminal. Provided in
The signal of the semiconductor chip is connected to the printed board through a plurality of signal terminals, the power source of the semiconductor chip is connected to the printed board through the power plane and the first plate terminal, and the ground of the semiconductor chip is connected to the ground plane and the second board. Connecting to a printed board via a plate terminal.

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