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JP2008085021A - Electronic circuit and its manufacturing method, and mobile terminal with electronic circuit - Google Patents

Electronic circuit and its manufacturing method, and mobile terminal with electronic circuit Download PDF

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Publication number
JP2008085021A
JP2008085021A JP2006262088A JP2006262088A JP2008085021A JP 2008085021 A JP2008085021 A JP 2008085021A JP 2006262088 A JP2006262088 A JP 2006262088A JP 2006262088 A JP2006262088 A JP 2006262088A JP 2008085021 A JP2008085021 A JP 2008085021A
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wiring board
flexible printed
printed wiring
reinforcing plate
ground
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Japanese (ja)
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Kenji Watanabe
健志 渡辺
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Sony Corp
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Sony Ericsson Mobile Communications Japan Inc
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Priority to JP2006262088A priority Critical patent/JP2008085021A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To effectively suppress an electromagnetic wave noise without blocking its light weight and without raising its cost. <P>SOLUTION: A flexible printed wiring board 1 includes a ground layer 4 exposing outside on the back side corresponding to the surface side with an electronic component 2 mounted. A conductor-made reinforced board 10 has an opening 11 and adhered to the backside of the electronic component mounted surface of the flexible printed wiring board 1. A conductor-made cushion material 30 is arranged so as to be sandwiched between the exposed ground layer 4 and conductor-made reinforced board 10 of the flexible wiring board 1 and a ground layer 21 of a main wiring board 20 to ground the exposed ground layer 4 and the conductor-made reincorced board 10 of the flexible printed wiring board 1 to the ground layer 21 of the main wiring board 20. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、回路部品が実装されたフレキシブルプリント配線板を有する電子回路と、その電子回路の製造方法、及び、その電子回路を備えた携帯端末に関する。   The present invention relates to an electronic circuit having a flexible printed wiring board on which circuit components are mounted, a method for manufacturing the electronic circuit, and a portable terminal including the electronic circuit.

従来より、携帯電話端末などの小型・軽量化が求められている携帯端末には、リジッドな回路基板に比べて薄型化及び軽量化に有利なフレキシブルプリント配線板が多く使用されている。また、携帯端末内のフレキシブルプリント配線板は、配線パターンの引き回しだけでなく、ICチップ等の電子部品の実装にも用いられている。   2. Description of the Related Art Conventionally, mobile terminals that are required to be small and light, such as mobile phone terminals, have often used flexible printed wiring boards that are advantageous in reducing thickness and weight compared to rigid circuit boards. Moreover, the flexible printed wiring board in a portable terminal is used not only for routing a wiring pattern but also for mounting an electronic component such as an IC chip.

一方、携帯電話端末などのような多機能化及び小型化が進んだ携帯端末では、内部の様々な電子部品等から発生する不要輻射や干渉波などのノイズが、他の電子部品や信号等に悪影響を与えることが多くなる。このため、従来より、携帯端末においては、その内部に電磁波遮断用のシールド部材を各所に配置するようなノイズ対策が施されている。   On the other hand, in mobile terminals that have become multifunctional and downsized, such as mobile phone terminals, noise such as unwanted radiation and interference waves generated from various internal electronic components can cause other electronic components and signals. It often has an adverse effect. For this reason, conventionally, in mobile terminals, noise countermeasures have been taken such that shield members for blocking electromagnetic waves are arranged in various places.

ここで、特にフレキシブルプリント配線板におけるノイズ対策としては、従来より、フレキシブルプリント配線板の配線部分の片面或いは両面にグランド(GND)パターンを形成して不要輻射や干渉波をシールドすることでノイズ耐性を高めるような技術が知られている。その他にも、フレキシブルプリント配線板の片面の部品実装部分の裏側に設けられる補強板を金属製とすることでノイズ耐性を高めるようにした技術も知られている。   Here, as a noise countermeasure especially for flexible printed wiring boards, noise resistance is conventionally achieved by forming a ground (GND) pattern on one or both sides of the wiring portion of the flexible printed wiring board to shield unwanted radiation and interference waves. Techniques that improve the performance are known. In addition, there is also known a technique in which noise resistance is improved by making a reinforcing plate made of metal on the back side of the component mounting portion on one side of the flexible printed wiring board.

特開平7−154038号の公開特許公報(特許文献1)には、フレキシブルプリント回路基板の部品実装部の平坦度を維持するための補強板を金属製とし、フレキシブルプリント回路基板の導体部分と金属製補強板とを金属製のネジを介して筐体座部に固定することで、コネクタやリード線類を用いることなく、上記金属製補強板を筐体のグランドに接地させ、その補強板をシールド板として利用することでノイズの抑制対策を実現したフレキシブルプリント回路基板とその製造方法及びこの回路基板を用いた小型電子機器が開示されている。   In Japanese Patent Laid-Open No. 7-1554038 (Patent Document 1), a reinforcing plate for maintaining the flatness of a component mounting portion of a flexible printed circuit board is made of metal, and a conductor portion of the flexible printed circuit board and metal By fixing the reinforcing plate to the housing seat via a metal screw, the metal reinforcing plate is grounded to the housing ground without using a connector or lead wires, and the reinforcing plate is A flexible printed circuit board that realizes a noise suppression measure by using it as a shield plate, a manufacturing method thereof, and a small electronic device using the circuit board are disclosed.

特開平7−154038号公報(図7)Japanese Patent Laid-Open No. 7-1554038 (FIG. 7)

上述のように、補強板を金属製とした場合、上記フレキシブルプリント配線板のグランドと金属製補強板との間の距離が非常に近くなり、さらにその上で当該金属製補強板等を金属製ネジ等により筐体に接地すれば、或る程度高いシールド効果を得ることができるようになる。   As described above, when the reinforcing plate is made of metal, the distance between the ground of the flexible printed wiring board and the metal reinforcing plate becomes very close, and further, the metal reinforcing plate is made of metal. If it is grounded to the housing with screws or the like, a somewhat higher shielding effect can be obtained.

しかしながら、携帯電話端末などのように軽量化が求められている携帯端末において、或る程度の重量を有する金属製のネジを用いることは軽量化の妨げになり好ましくない。また、補強板と一緒にフレキシブル配線板をもネジにより固定する場合、当該フレキシブルプリント配線板上の配線パターンや実装される電子部品を避けるようなネジ配置設計、或いは逆に、ネジを避けるような配線パターン設計や電子部品実装設計が必要になり、設計自由度の低下と設計コストの上昇を招いてしまうことになる。また、上記補強板についても、ネジを貫通させるための部位を別途設けなければならず、したがってこの場合の補強板は、上記フレキシブルプリント配線板上の電子部品実装部分よりも可成り大きく(つまり補強板を必要以上に大きく)しなければならなくなる。さらに、ネジを用いる場合には、筐体側にもネジ止め用の座部が必要になるだけでなく、製造時にもネジ止めのための工程が加わり、コストの上昇を招くことになる。このように、金属製補強板をネジにより固定するようなノイズ対策は、携帯端末の軽量化に不利であり、またコストの面でも不利となる。   However, it is not preferable to use a metal screw having a certain weight in a portable terminal such as a cellular phone terminal that is required to be lightweight. Also, when fixing a flexible wiring board together with a reinforcing plate with screws, a screw arrangement design that avoids wiring patterns on the flexible printed wiring board and electronic components to be mounted, or conversely, avoiding screws. Wiring pattern design and electronic component mounting design are required, leading to a reduction in design freedom and an increase in design cost. Also, the reinforcing plate must be provided with a part for allowing the screw to pass through. Therefore, the reinforcing plate in this case is considerably larger than the electronic component mounting portion on the flexible printed wiring board (that is, the reinforcing plate). You will have to make the board bigger than necessary. Further, in the case of using screws, not only a seat portion for screwing is required on the housing side, but also a step for screwing is added at the time of manufacturing, which causes an increase in cost. Thus, noise countermeasures such as fixing the metal reinforcing plate with screws are disadvantageous for reducing the weight of the mobile terminal and also disadvantageous in terms of cost.

本発明は、このような実情に鑑みて提案されたものであり、軽量化を妨げず且つコストの上昇をも招くことなく、不要輻射や干渉波などにより発生するノイズを効果的に抑制することが可能な、電子回路とその製造方法、及び電子回路を備えた携帯端末を提供することを目的とする。   The present invention has been proposed in view of such circumstances, and effectively suppresses noise generated by unnecessary radiation, interference waves, and the like without impeding weight reduction and increasing costs. It is an object of the present invention to provide an electronic circuit, a method for manufacturing the same, and a portable terminal including the electronic circuit.

本発明の電子回路は、電子部品が実装される表面に相対応した裏面側に、外部へ露出した状態のグランド面を設けたフレキシブルプリント配線板と、フレキシブルプリント配線板の電子部品が実装される表面に相対応した裏面側に設けられ、当該フレキシブルプリント配線板の電子部品の実装面を補強すると共に、フレキシブルプリント配線板のグランド面を臨めるように配置された開口部を備えた導電性の補強板と、形状復元性及び可撓性を備えた導電性を有する可撓性導電材と、主となる安定的なグランド面を備えた主グランド部とを有し、可撓性導電材を、補強板及び当該補強板の開口部内のフレキシブルプリント配線板のグランド面と、主グランド部のグランド面とで挟み込み、この可撓性導電材により、補強板と該補強板の開口部内のフレキシブルプリント配線板のグランド面とを、主グランド部のグランド面に接地させて成ることにより、上述した課題を解決する。   In the electronic circuit of the present invention, a flexible printed wiring board provided with a ground surface exposed to the outside on the back side corresponding to the surface on which the electronic component is mounted, and the electronic component of the flexible printed wiring board are mounted. Conductive reinforcement provided with an opening provided on the back side corresponding to the front surface to reinforce the electronic component mounting surface of the flexible printed wiring board and to face the ground surface of the flexible printed wiring board A plate, a flexible conductive material having conductivity having shape recovery and flexibility, and a main ground portion having a main stable ground surface, and the flexible conductive material, The reinforcing plate and the ground surface of the flexible printed wiring board in the opening of the reinforcing plate and the ground surface of the main ground portion are sandwiched between the reinforcing plate and the opening of the reinforcing plate by the flexible conductive material. A ground plane of the flexible printed wiring board, by comprising by grounded to the ground plane of the main ground portion, to solve the problems described above.

また、本発明の電子回路の製造方法は、電子部品が実装される表面に相対応した裏面側に、外部へ露出した状態のグランド面を設けたフレキシブルプリント配線板と、フレキシブルプリント配線板の電子部品が実装される表面に相対応した裏面側に設けられ、当該フレキシブルプリント配線板の電子部品の実装面を補強すると共に、フレキシブルプリント配線板のグランド面を臨めるように配置された開口部を備えた導電性の補強板と、形状復元性及び可撓性を備えた導電性を有する可撓性導電材と、主となる安定的なグランド面を備えた主グランド部とを有する電子回路を製造する方法であって、可撓性導電材を、補強板及び当該補強板の開口部内のフレキシブルプリント配線板のグランド面と、主グランド部のグランド面とで挟み込む工程と、可撓性導電材により、補強板と当該補強板の開口部内のフレキシブルプリント配線板のグランド面とを、主グランド部のグランド面に接地させる工程とを有することにより、上述した課題を解決する。   The electronic circuit manufacturing method of the present invention includes a flexible printed wiring board provided with a ground surface exposed to the outside on the back side corresponding to the surface on which the electronic component is mounted, and the electronic circuit of the flexible printed wiring board. Provided on the back side corresponding to the surface on which the component is mounted, has an opening arranged to reinforce the electronic component mounting surface of the flexible printed wiring board and face the ground surface of the flexible printed wiring board Manufacturing an electronic circuit having a conductive reinforcing plate, a flexible conductive material having conductivity having shape recovery and flexibility, and a main ground portion having a main stable ground plane The flexible conductive material is sandwiched between the ground plane of the reinforcing plate and the flexible printed wiring board in the opening of the reinforcing plate and the ground plane of the main ground portion. And the step of grounding the reinforcing plate and the ground surface of the flexible printed wiring board in the opening of the reinforcing plate to the ground surface of the main ground portion by using a flexible conductive material. To do.

また、本発明の携帯端末は、電子部品が実装される表面に相対応した裏面側に、外部へ露出した状態のグランド面を設けたフレキシブルプリント配線板と、フレキシブルプリント配線板の電子部品が実装される表面に相対応した裏面側に設けられ、当該フレキシブルプリント配線板の電子部品の実装面を補強すると共に、フレキシブルプリント配線板のグランド面を臨めるように配置された開口部を備えた導電性の補強板と、形状復元性及び可撓性を備えた導電性を有する可撓性導電材と、主となる安定的なグランド面を備えた主グランド部とを有し、可撓性導電材を、補強板及び当該補強板の開口部内のフレキシブルプリント配線板のグランド面と、主グランド部のグランド面とで挟み込み、可撓性導電材により、補強板と当該補強板の開口部内のフレキシブルプリント配線板のグランド面とを、主グランド部のグランド面に接地させて成る電子回路を有することにより、上述した課題を解決する。   In addition, the portable terminal of the present invention has a flexible printed wiring board having a ground surface exposed to the outside on the back side corresponding to the surface on which the electronic component is mounted, and the electronic component of the flexible printed wiring board is mounted. Conductive with an opening provided on the back side corresponding to the front surface to reinforce the mounting surface of the electronic component of the flexible printed wiring board and to face the ground surface of the flexible printed wiring board A flexible conductive material, a flexible conductive material having conductivity having shape recovery and flexibility, and a main ground portion having a main stable ground surface Are sandwiched between the ground plane of the flexible printed wiring board and the ground plane of the main ground section in the reinforcing plate and the opening of the reinforcing plate, and the reinforcing plate and the reinforcing plate are opened by a flexible conductive material. A ground plane of the flexible printed circuit board portion, by having an electronic circuit formed by the ground on the ground surface of the main ground portion, to solve the problems described above.

すなわち本発明によれば、補強板と、その補強板の開口部内のフレキシブルプリント配線板のグランド面と、主グランド部のグランド面との少なくとも三つの面を、互いに導通状態に接続するための手段として、形状復元性及び可撓性を備えた導電性を有する可撓性導電材を用いているため、電子回路設計や筐体設計の自由度を妨げることなく、高いシールド効果を得ることが可能となっている。   That is, according to the present invention, means for connecting at least three surfaces of the reinforcing plate, the ground surface of the flexible printed wiring board in the opening of the reinforcing plate, and the ground surface of the main ground portion to each other in a conductive state. As a flexible conductive material that has conductivity with shape recovery and flexibility, it is possible to obtain a high shielding effect without hindering the freedom of electronic circuit design and housing design. It has become.

本発明においては、形状復元性及び可撓性を備えた導電性を有する可撓性導電材により、補強板及びその補強板の開口部内のフレキシブルプリント配線板のグランド面を、主グランド部のグランド面に接地させるようにしているため、軽量化を妨げず且つコストの上昇をも招くことなく、不要輻射や干渉波などにより発生するノイズを効果的に抑制することが可能となっている。   In the present invention, the ground surface of the flexible printed wiring board in the opening of the reinforcing plate and the reinforcing plate is connected to the ground of the main ground portion by the flexible conductive material having conductivity having shape restoration property and flexibility. Since the surface is grounded, it is possible to effectively suppress noise generated by unnecessary radiation, interference waves, or the like without impeding weight reduction and increasing costs.

以下、図面を参照しながら、本発明の電子回路とその製造方法、及び電子回路を備えた携帯端末の一実施形態について説明する。   Hereinafter, an embodiment of an electronic circuit of the present invention, a method for manufacturing the same, and a mobile terminal including the electronic circuit will be described with reference to the drawings.

なお、本実施形態では、本発明にかかる携帯端末の一例として、携帯電話端末を挙げているが、勿論、ここで説明する内容はあくまで一例であり、本発明はこの例に限定されないことは言うまでもない。   In the present embodiment, a mobile phone terminal is cited as an example of the mobile terminal according to the present invention. Of course, the content described here is merely an example, and it goes without saying that the present invention is not limited to this example. Yes.

〔フレキシブルプリント配線板の概要〕
図1、図2には、本発明実施形態にかかる電子回路、特にフレキシブルプリント配線板近傍の回路部を拡大して示す。
[Outline of flexible printed wiring board]
1 and 2 are enlarged views of an electronic circuit according to an embodiment of the present invention, particularly a circuit portion in the vicinity of a flexible printed wiring board.

なお、図1は、本実施形態のフレキシブルプリント配線板1の表裏両面のうち、ICチップ等の電子部品2が実装されている表面側の一部を拡大して示している。図2は、本実施形態のフレキシブルプリント配線板1の表裏両面のうち、上記電子部品2が実装されている表面に相対応した裏面側の一部を拡大して示している。   FIG. 1 is an enlarged view of a part of the surface side on which an electronic component 2 such as an IC chip is mounted, of the front and back surfaces of the flexible printed wiring board 1 of the present embodiment. FIG. 2 shows an enlarged part of the back surface side corresponding to the surface on which the electronic component 2 is mounted, of the front and back surfaces of the flexible printed wiring board 1 of the present embodiment.

本実施形態において、上記フレキシブルプリント配線板1の裏面側には、上記表面側の電子部品2の実装部に相対応した部分に、補強板10が貼り付けられている。また、本実施形態において、上記補強板10は、少なくとも上記フレキシブルプリント配線板1の表面側電子部品2の実装部分をカバーできるだけの大きさを有した金属等の導体により形成されている。そして、当該導体製補強板10には、図2に示すような開口部11が設けられている。   In this embodiment, on the back side of the flexible printed wiring board 1, a reinforcing plate 10 is attached to a portion corresponding to the mounting portion of the electronic component 2 on the front side. Moreover, in this embodiment, the said reinforcement board 10 is formed with conductors, such as a metal which has the magnitude | size which can cover at least the mounting part of the surface side electronic component 2 of the said flexible printed wiring board 1. FIG. The conductor reinforcing plate 10 is provided with an opening 11 as shown in FIG.

図3は、上記フレキシブルプリント配線板1と、当該フレキシブルプリント配線板1の表面側に実装された電子部品2(回路部分)と、当該フレキシブルプリント配線板1の裏面側に貼り付けられた導体製補強板10の断面を拡大して示している。なお、図3の断面図において、フレキシブルプリント配線板1や導体製補強板10の図面上の厚み、開口部11の幅等は、図示を容易にするために適宜誇張して示しており、実際の縮尺に対応しているものではない。また、この図3には、当該携帯端末のメイン配線板20と後述する導体製クッション材30の断面も示している。   3 shows the flexible printed wiring board 1, the electronic component 2 (circuit portion) mounted on the front side of the flexible printed wiring board 1, and a conductor made of affixed to the back side of the flexible printed wiring board 1. The cross section of the reinforcing plate 10 is shown enlarged. In the cross-sectional view of FIG. 3, the thickness of the flexible printed wiring board 1 and the conductor reinforcing board 10 in the drawing, the width of the opening 11 and the like are exaggerated as appropriate for easy illustration. It does not correspond to the scale of. FIG. 3 also shows a cross section of the main wiring board 20 of the portable terminal and a conductor cushion material 30 described later.

この図3に示すように、本実施形態にかかるフレキシブルプリント配線板1は、絶縁性で且つ可撓性を備えたフィルム状の樹脂からなる基材5と、当該基材5の両面に形成された導電性配線パターンからなる配線層4,6と、それら配線層4,6の上に形成された絶縁性のレジスト層7,8とにより構成されている。上記配線層4,6のうち、特に上記導体製補強板10が貼り付けられる側で且つ前記表面側に電子部品2が設けられている部分の配線層4は、グランド層となされている。   As shown in FIG. 3, the flexible printed wiring board 1 according to the present embodiment is formed on a base material 5 made of an insulating and flexible film-like resin, and on both surfaces of the base material 5. The wiring layers 4 and 6 are formed of conductive wiring patterns, and the insulating resist layers 7 and 8 are formed on the wiring layers 4 and 6. Of the wiring layers 4 and 6, the wiring layer 4 in the portion where the electronic component 2 is provided on the surface side where the conductor reinforcing plate 10 is particularly attached is a ground layer.

また、上記フレキシブルプリント配線板1は、表裏両面共に絶縁性のレジスト層7,8を備えているが、本実施形態においては、少なくとも、上記導体製補強板10の開口部11に相対応した部分にはレジスト層7が形成されておらず、上記グランド層である配線層4が外部に露出するようになされている。すなわち言い換えると、本実施形態によれば、上記導体製補強板10は、上記開口部11が上記グランド層の外部露出部分に略々合致するように、つまり開口部11から上記グランド層の外部露出部分が臨めるように位置合わせを行った上で、上記フレキシブルプリント配線板1に貼り付けられている。さらに言い換えると、本実施形態において、フレキシブルプリント配線板1には、電子部品2が実装される部分に相対応した裏面側で且つ補強板10が貼り付けられる面内の少なくとも一部に、上記グランド層を外部へ露出させる部分が設けられており、そのグランド層の外部露出部分に略々合致するように上記開口部11の位置合わせが行われて上記導体製補強板10が貼り付けられている。   The flexible printed wiring board 1 includes insulating resist layers 7 and 8 on both front and back surfaces. In the present embodiment, at least a portion corresponding to the opening 11 of the conductor reinforcing plate 10 is provided. The resist layer 7 is not formed on the wiring layer 4 so that the wiring layer 4 as the ground layer is exposed to the outside. That is, in other words, according to the present embodiment, the conductor reinforcing plate 10 is formed so that the opening 11 substantially matches the externally exposed portion of the ground layer, that is, the external exposure of the ground layer from the opening 11. After being aligned so that the portion can be seen, it is affixed to the flexible printed wiring board 1. In other words, in the present embodiment, the flexible printed wiring board 1 is provided with at least a part of the ground on the back side corresponding to the portion where the electronic component 2 is mounted and on the surface where the reinforcing plate 10 is attached. A portion for exposing the layer to the outside is provided, and the opening 11 is aligned so as to substantially match the externally exposed portion of the ground layer, and the conductor reinforcing plate 10 is attached. .

〔フレキシブル配線板のグランド及び補強板をメイン基板のグランドへ接地させる手法〕
ここで、本実施形態のように、電子部品等が実装されたフレキシブルプリント配線板において不要輻射や干渉波をシールドしてノイズ耐性を高めるためには、当該フレキシブルプリント配線板のグランド層に対して非常に近い距離に設けられる補強板を金属製等の導電性を有するものとし、さらに、それらフレキシブルプリント配線板のグランド層と金属製等の補強板とを、例えば携帯端末のメイン配線板のグランドなどに接地(つまり携帯端末の筐体に接地)させる必要がある。なお、フレキシブルプリント配線板のグランド層と金属製等の補強板を、例えば金属製のネジ等を介してメイン配線板のグランドに接地させるようなことは、前述したように、軽量化やコストの面で好ましくない。
[Method of grounding flexible wiring board ground and reinforcing board to main board ground]
Here, as in the present embodiment, in order to increase the noise resistance by shielding unwanted radiation and interference waves in the flexible printed wiring board on which electronic components and the like are mounted, the ground layer of the flexible printed wiring board The reinforcing plate provided at a very close distance has conductivity such as metal, and further, the ground layer of the flexible printed wiring board and the reinforcing plate such as metal are connected to the ground of the main wiring board of the mobile terminal, for example. Must be grounded (that is, grounded to the casing of the portable terminal). Note that grounding the ground layer of the flexible printed wiring board and the reinforcing plate made of metal, for example, to the ground of the main wiring board through a metal screw or the like, as described above, reduces weight and costs. It is not preferable in terms of the aspect.

このようなことから、本実施形態では、図3に示すように、形状復元性及び可撓性を備え且つ少なくともその表面が導電性を有する導体製クッション材30を上記導体製補強板10の開口部11に架かるように配設し、その導体製クッション材30を、上記電子部品2が実装されたフレキシブルプリント配線板1及び導体製補強板10と、当該携帯端末のメイン配線板20のグランド層(配線層21)とで挟み込むようにして、上記フレキシブルプリント配線板1の上記外部露出したグランド層(配線層4)の表面と、上記導体製補強板10の表面及び開口部11側面と、上記メイン配線板20のグランド層(配線層21)の少なくとも三箇所を、当該導体製クッション材30を通じて電気的な導通状態とすることにより、上記フレキシブルプリント配線板1のグランド層(配線層4)と導体製補強板10を、上記メイン配線板20のグランド層(配線層21)に接地させるようにしている。   For this reason, in this embodiment, as shown in FIG. 3, the conductor cushioning material 30 having shape restoring property and flexibility and at least the surface of which is conductive is provided in the opening of the conductor reinforcing plate 10. The conductor cushioning material 30 is arranged so as to hang over the portion 11, and the flexible printed wiring board 1 and the conductor reinforcing board 10 on which the electronic component 2 is mounted and the ground layer of the main wiring board 20 of the portable terminal. (The wiring layer 21), the surface of the ground layer (wiring layer 4) exposed to the outside of the flexible printed wiring board 1, the surface of the reinforcing plate 10 made of the conductor and the side surface of the opening 11, and the above By making at least three places of the ground layer (wiring layer 21) of the main wiring board 20 into an electrically conductive state through the conductor cushioning material 30, the above flexible Ground layer of printed wiring board 1 and the conductor-made reinforcing plate 10 (wiring layer 4) so as to be grounded to the ground layer of the main circuit board 20 (wiring layer 21).

なお、本実施形態において、上記導体製クッション材30には、一例として、円筒形状や楕円形状のスポンジや発砲ゴム等の形状復元性及び可撓性を備えたクッション材の外周部に、導電性材料(例えば金属糸或いは金属布)等が巻き付け若しくは貼り付けられて形成されたものを挙げることができる。勿論、本発明において、上記導体製クッション材30の形状は円筒形状に限定されるものではなく、材質についても限定されず、表面だけでなく内部も導電性を有していても良い。また、当該導体製クッション材30を配設する際には、例えば上記フレキシブルプリント配線板1のグランド層、導体製補強板10、メイン配線板20のグランド層(配線層21)の少なくとも何れかに、当該導体製クッション材30を例えば導電性接着材やそれを用いた導電性両面テープ等にて貼り付けることで、組み付け後に導体製クッション材30がズレてしまうのを防止することが望ましい。   In the present embodiment, the conductive cushion material 30 has, as an example, a conductive material on the outer peripheral portion of the cushion material having shape restoring property and flexibility such as a cylindrical or elliptical sponge or foam rubber. The material (for example, metal thread | yarn or metal cloth) etc. can be mentioned by being wound or stuck. Of course, in the present invention, the shape of the conductor cushion material 30 is not limited to a cylindrical shape, and the material is not limited, and not only the surface but also the inside may have conductivity. When the conductor cushion material 30 is disposed, for example, at least one of the ground layer of the flexible printed wiring board 1, the conductor reinforcing board 10, and the ground layer (wiring layer 21) of the main wiring board 20. It is desirable to prevent the conductor cushion material 30 from being displaced after assembly by attaching the conductor cushion material 30 with, for example, a conductive adhesive or a conductive double-sided tape using the conductive adhesive material.

上述のように、本実施形態によれば、例えば円筒形状のクッション材の外円周部に導電性材料が貼り付け等された導体製クッション材30を、上記フレキシブルプリント配線板1及び導体製補強板10とメイン配線板20のグランド層により挟み込むようにすることで、当該導体製クッション材30の外円周部が変形しつつ上記フレキシブルプリント配線板1のグランド層露出部と導体製補強板10の表面と上記メイン配線板20のグランド層に接触するようになされているため、それらフレキシブルプリント配線板1のグランド層露出部及び導体製補強板10の表面と上記メイン配線板20のグランド層との接地面積を大きくとることが可能となり、その結果、より高いシールド効果が得られるようになっている。   As described above, according to the present embodiment, for example, the conductor cushion material 30 in which a conductive material is attached to the outer circumferential portion of a cylindrical cushion material, the flexible printed wiring board 1 and the conductor reinforcement are used. By sandwiching between the board 10 and the ground layer of the main wiring board 20, the outer circumferential part of the conductor cushioning material 30 is deformed and the ground layer exposed part of the flexible printed wiring board 1 and the conductor reinforcing board 10 are deformed. And the ground layer exposed portion of the flexible printed wiring board 1 and the surface of the conductor reinforcing board 10, the ground layer of the main wiring board 20, and the ground layer of the main wiring board 20. As a result, a higher shielding effect can be obtained.

また、本実施形態によれば、どのような場所にも配置可能な導体製クッション材30を介して、フレキシブルプリント配線板1のグランド層露出部及び導体製補強板10の表面をメイン配線板20のグランド層に接地させるようにしているため、例えば金属製ネジを用いて筐体に接地させる場合のように、特別なネジ配置設計や配線パターン設計,電子部品実装設計を行う必要がなく、またネジ止め等の工程が不要であるため、コストの上昇を抑えることができ、さらに、導体製クッション材30は金属製ネジに比べて遙かに軽量であるため、携帯端末の軽量化にも効果的となっている。   Further, according to the present embodiment, the ground layer exposed portion of the flexible printed wiring board 1 and the surface of the conductor reinforcing board 10 are connected to the main wiring board 20 via the conductor cushioning material 30 that can be disposed at any place. Since it is grounded to the ground layer, there is no need to perform special screw layout design, wiring pattern design, and electronic component mounting design, for example, when using metal screws to ground the housing. Since a process such as screwing is not required, an increase in cost can be suppressed, and the conductor cushion material 30 is much lighter than a metal screw, which is also effective in reducing the weight of the mobile terminal. It is the target.

さらに、本実施形態によれば、導体製クッション材30には、或る程度の厚みを持たせることができるため、例えば、フレキシブルプリント配線板1のグランド層露出部及び導体製補強板10の表面から、上記メイン配線板20のグランド層21までの間に、何らかの別の非導電性部材等を配設しなければならないような設計が必要になった場合であっても、少なくとも上記導体製クッション材30を配置できる空間を当該別の非導導電性部材に設けることのみで、上記フレキシブルプリント配線板1のグランド層露出部及び導体製補強板10の表面とメイン配線板20のグランド層との接地を確保しつつ、上記別の非導導電性部材を配設することが可能となる。   Furthermore, according to the present embodiment, since the conductor cushion material 30 can have a certain thickness, for example, the ground layer exposed portion of the flexible printed wiring board 1 and the surface of the conductor reinforcing plate 10 are used. To the ground layer 21 of the main wiring board 20, at least the conductor cushion is required even when a design that requires some other non-conductive member or the like to be disposed is required. Only by providing a space in which the material 30 can be placed in the other nonconductive member, the ground layer exposed portion of the flexible printed wiring board 1 and the surface of the conductor reinforcing plate 10 and the ground layer of the main wiring board 20 It is possible to dispose another non-conductive member while ensuring grounding.

図4、図5には、導体製クッション材30の他の配置例を示している。   4 and 5 show other arrangement examples of the conductor cushion material 30. FIG.

図4は、導体製クッション材30を導体製補強板10の開口部11の略々中央に配置した例を示している。すなわち、前述の図3では、導体製クッション材30を導体製補強板10の開口部11の縁部に配置することで、導体製補強板10と導体製クッション材30の接地面積を大きくした例を示したが、図4では、導体製クッション材30を導体製補強板10の開口部11の略々中央に配置することで、フレキシブルプリント配線板1のグランド層と導体製クッション材30の接地面積を大きくしている。   FIG. 4 shows an example in which the conductor cushioning material 30 is disposed approximately at the center of the opening 11 of the conductor reinforcing plate 10. That is, in FIG. 3 described above, the conductor cushioning material 30 is arranged at the edge of the opening 11 of the conductor reinforcing plate 10 so that the ground contact area between the conductor reinforcing plate 10 and the conductor cushioning material 30 is increased. In FIG. 4, the conductor cushion material 30 is disposed substantially in the center of the opening 11 of the conductor reinforcing plate 10, so that the ground layer of the flexible printed wiring board 1 and the conductor cushion material 30 are grounded. The area is increased.

図5は、導体製補強板10の厚みが図3や図4の例よりも大きい場合の例を示している。すなわち、図3や図4の例のように、導体製補強板10が薄いものである場合には、導体製クッション材30により導体製補強板10の表面を接地させることが可能であるが、例えば図5のように導体製補強板10が厚い場合には、導体製クッション材30により導体製補強板10の表面を接地させられなくなる可能性がある。このような場合、図5に示すように、導体製補強板10の開口部11に導体製クッション材30を嵌め込むようにし、当該導体製補強板10の開口部11の壁面を接地させるようにする。   FIG. 5 shows an example in which the thickness of the conductor reinforcing plate 10 is larger than those in the examples of FIGS. 3 and 4. That is, as in the example of FIG. 3 and FIG. 4, when the conductor reinforcing plate 10 is thin, it is possible to ground the surface of the conductor reinforcing plate 10 by the conductor cushion material 30. For example, when the conductor reinforcing plate 10 is thick as shown in FIG. 5, there is a possibility that the surface of the conductor reinforcing plate 10 cannot be grounded by the conductor cushion material 30. In such a case, as shown in FIG. 5, the conductor cushioning material 30 is fitted into the opening 11 of the conductor reinforcing plate 10, and the wall surface of the opening 11 of the conductor reinforcing plate 10 is grounded. To do.

なお、図3〜図5では、導体製補強板10がフレキシブルプリント配線板1のレジスト層7に貼り付けられている例を挙げているが、上記配線層4のグランド層と導体製補強板10とに挟まれている部分のレジスト層7のみを無くし、例えば導電性接着材やそれを用いた導電性両面テープ等により、上記導体製補強板10を配線層4(グランド層)に貼り付けることで、フレキシブルプリント配線板1のグランド層と導体製補強板10の接地面積をより大きくとるようにしても良い。   3 to 5 exemplify the case where the conductor reinforcing plate 10 is attached to the resist layer 7 of the flexible printed wiring board 1, the ground layer of the wiring layer 4 and the conductor reinforcing plate 10 are exemplified. Only the resist layer 7 sandwiched between the two is removed, and the conductive reinforcing plate 10 is attached to the wiring layer 4 (ground layer) with, for example, a conductive adhesive or a conductive double-sided tape using the conductive adhesive. Thus, the ground area of the flexible printed wiring board 1 and the conductor reinforcing plate 10 may be made larger.

また、フレキシブルプリント配線板1のグランド層を接地させる相手方は、メイン配線板20のグランド層の他に、携帯端末の筐体のグランド端子等のような安定的なグランドであっても良い。   In addition to the ground layer of the main wiring board 20, the other party that grounds the ground layer of the flexible printed wiring board 1 may be a stable ground such as the ground terminal of the casing of the portable terminal.

〔まとめ〕
以上説明したように、本実施形態によれば、フレキシブルプリント配線板1の片面部品実装部の裏側に導通面(グランド)を設け、且つ、導体製補強板10に導電性を備えた開口部11を設け、それら両者に接触するように、少なくともその表面が導電性を有する導体製クッション材30を配置し、その導体製クッション材30を上記フレキシブルプリント配線板1及び導体製補強板30とメイン配線板20とにより挟み込むようにすることで、上記フレキシブルプリント配線板1の片面部品実装部裏側の導通面と、導体製補強板10の開口部11とを、メイン配線板20のグランドに接触させることで接地することにより、上記フレキシブルプリント配線板1上の配線パターンに強電界の信号が放射された場合などにより誘起されるノイズを効果的に抑制することができ、耐ノイズ性、特に外部からの放射に対する耐性を高めることが可能となっている。
[Summary]
As described above, according to the present embodiment, the opening 11 provided with a conductive surface (ground) on the back side of the single-sided component mounting portion of the flexible printed wiring board 1 and the conductive reinforcing plate 10 having conductivity. The conductive cushioning material 30 having at least the surface of the conductive material is disposed so as to be in contact with both of them, and the conductive cushioning material 30 is connected to the flexible printed wiring board 1, the conductive reinforcing plate 30, and the main wiring. The conductive surface on the back side of the single-sided component mounting portion of the flexible printed wiring board 1 and the opening 11 of the conductive reinforcing plate 10 are brought into contact with the ground of the main wiring board 20 by being sandwiched between the boards 20. Noise induced by a strong electric field signal radiated to the wiring pattern on the flexible printed wiring board 1 by being grounded at It can be effectively suppressed, noise resistance, in particular it is possible to increase resistance to radiation from outside.

なお、上述した実施形態の説明は、本発明の一例である。このため、本発明は上述した実施形態に限定されることなく、本発明に係る技術的思想を逸脱しない範囲であれば、設計等に応じて種々の変更が可能であることはもちろんである。   The above description of the embodiment is an example of the present invention. For this reason, the present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made according to the design or the like as long as the technical idea according to the present invention is not deviated.

例えば、本発明は、携帯電話端末に限らず、PDA(Personal Digital Assistants)や携帯型音楽プレーヤ、携帯型テレビジョン放送受信装置等の各種の携帯端末にも適用可能である。   For example, the present invention can be applied not only to mobile phone terminals but also to various mobile terminals such as PDAs (Personal Digital Assistants), portable music players, and portable television broadcast receivers.

本実施形態のフレキシブルプリント配線板の表裏両面のうち、電子部品が実装されている表面側の一部を拡大して示す図である。It is a figure which expands and shows a part of the surface side by which an electronic component is mounted among the front and back both surfaces of the flexible printed wiring board of this embodiment. 本実施形態のフレキシブルプリント配線板の表裏両面のうち、電子部品が実装されている表面に相対応した裏面側の一部を拡大して示す図である。It is a figure which expands and shows a part of the back surface side corresponding to the surface where the electronic component is mounted among the front and back both surfaces of the flexible printed wiring board of this embodiment. 本実施形態のフレキシブルプリント配線板とその表面側に実装された電子部品と裏面側に貼り付けられた導体製補強板等の断面を拡大して示す図である。It is a figure which expands and shows the cross section of the flexible printed wiring board of this embodiment, the electronic component mounted in the surface side, and the conductor reinforcement boards affixed on the back surface side. 導体製クッション材を導体製補強板の開口部の略々中央に配置した場合の接地状態を示す図である。It is a figure which shows the grounding state at the time of arrange | positioning the cushion material made from a conductor in the approximate center of the opening part of a conductor reinforcement board. 厚みが大きい導体製補強板の開口部の略々中央に導体製クッション材を配置した場合の接地状態を示す図である。It is a figure which shows the earthing | grounding state at the time of arrange | positioning the conductor cushioning material in the approximate center of the opening part of the conductor reinforcement board with large thickness.

符号の説明Explanation of symbols

1 フレキシブルプリント配線板、2 電子部品、4 フレキシブルプリント配線板の配線層(グランド層)、5 フレキシブルプリント配線板の基材、6 フレキシブルプリント配線板の配線層、7,8 フレキシブルプリント配線板のレジスト層、10 導体製補強板、11 開口部、20 メイン配線板、21 メイン配線板の配線層(グランド層)、30 導体製クッション材   DESCRIPTION OF SYMBOLS 1 Flexible printed wiring board, 2 Electronic components, 4 Wiring layer (ground layer) of flexible printed wiring board, 5 Base material of flexible printed wiring board, 6 Wiring layer of flexible printed wiring board, 7, 8 Resist of flexible printed wiring board Layer, 10 conductor reinforcing plate, 11 opening, 20 main wiring board, 21 wiring layer (ground layer) of main wiring board, 30 conductor cushioning material

Claims (6)

電子部品が実装される表面に相対応した裏面側に、外部へ露出した状態のグランド面を設けたフレキシブルプリント配線板と、
上記フレキシブルプリント配線板の上記電子部品が実装される表面に相対応した裏面側に設けられ、当該フレキシブルプリント配線板の上記電子部品の実装面を補強すると共に、上記フレキシブルプリント配線板のグランド面を臨めるように配置された開口部を備えた導電性の補強板と、
形状復元性及び可撓性を備えた導電性を有する可撓性導電材と、
主となる安定的なグランド面を備えた主グランド部とを有し、
上記可撓性導電材を、上記補強板、及び当該補強板の開口部内の上記フレキシブルプリント配線板のグランド面と、上記主グランド部のグランド面とで挟み込み、上記可撓性導電材により、上記補強板と当該補強板の開口部内の上記フレキシブルプリント配線板のグランド面とを、上記主グランド部のグランド面に接地させて成る、
ことを特徴とする電子回路。
A flexible printed wiring board having a ground surface exposed to the outside on the back side corresponding to the surface on which the electronic component is mounted;
Provided on the back side corresponding to the surface on which the electronic component of the flexible printed wiring board is mounted, reinforces the mounting surface of the electronic component of the flexible printed wiring board, and provides the ground surface of the flexible printed wiring board. A conductive reinforcing plate having an opening arranged to face the surface;
A flexible conductive material having electrical conductivity with shape restoration and flexibility;
A main ground portion having a main stable ground plane,
The flexible conductive material is sandwiched between the reinforcing plate and the ground surface of the flexible printed wiring board in the opening of the reinforcing plate and the ground surface of the main ground portion. The reinforcing plate and the ground surface of the flexible printed wiring board in the opening of the reinforcing plate are grounded to the ground surface of the main ground portion.
An electronic circuit characterized by that.
上記可撓性導電材は、少なくとも表面に導電性材料を設けたクッション材であることを特徴とする請求項1記載の電子回路。   2. The electronic circuit according to claim 1, wherein the flexible conductive material is a cushion material provided with a conductive material on at least a surface thereof. 上記クッション材の表面に設けられる導電性材料は金属糸により形成されていることを特徴とする請求項2記載の電子回路。   3. The electronic circuit according to claim 2, wherein the conductive material provided on the surface of the cushion material is formed of a metal thread. フレキシブルプリント配線板のグランド面と、上記補強板とを、導電性接着材により貼り付けて成ることを特徴とする請求項1記載の電子回路。   2. The electronic circuit according to claim 1, wherein the ground surface of the flexible printed wiring board and the reinforcing plate are attached with a conductive adhesive. 電子部品が実装される表面に相対応した裏面側に、外部へ露出した状態のグランド面を設けたフレキシブルプリント配線板と、
上記フレキシブルプリント配線板の上記電子部品が実装される表面に相対応した裏面側に設けられ、当該フレキシブルプリント配線板の上記電子部品の実装面を補強すると共に、上記フレキシブルプリント配線板のグランド面を臨めるように配置された開口部を備えた導電性の補強板と、
形状復元性及び可撓性を備えた導電性を有する可撓性導電材と、
主となる安定的なグランド面を備えた主グランド部とを有する電子回路を製造する製造方法であって、
上記可撓性導電材を、上記補強板、及び当該補強板の開口部内の上記フレキシブルプリント配線板のグランド面と、上記主グランド部のグランド面とで挟み込む工程と、
上記可撓性導電材により、上記補強板と当該補強板の開口部内の上記フレキシブルプリント配線板のグランド面とを、上記主グランド部のグランド面に接地させる工程とを有する、
ことを特徴とする電子回路の製造方法。
A flexible printed wiring board having a ground surface exposed to the outside on the back side corresponding to the surface on which the electronic component is mounted;
Provided on the back side corresponding to the surface on which the electronic component of the flexible printed wiring board is mounted, reinforces the mounting surface of the electronic component of the flexible printed wiring board, and provides the ground surface of the flexible printed wiring board. A conductive reinforcing plate having an opening arranged to face the surface;
A flexible conductive material having electrical conductivity with shape restoration and flexibility;
A manufacturing method for manufacturing an electronic circuit having a main ground portion having a main stable ground plane,
Sandwiching the flexible conductive material between the ground plane of the reinforcing plate and the flexible printed wiring board in the opening of the reinforcing plate and the ground plane of the main ground portion;
A step of grounding the reinforcing plate and the ground surface of the flexible printed wiring board in the opening of the reinforcing plate to the ground surface of the main ground portion by the flexible conductive material,
A method for manufacturing an electronic circuit.
電子部品が実装される表面に相対応した裏面側に、外部へ露出した状態のグランド面を設けたフレキシブルプリント配線板と、
上記フレキシブルプリント配線板の上記電子部品が実装される表面に相対応した裏面側に設けられ、当該フレキシブルプリント配線板の上記電子部品の実装面を補強すると共に、上記フレキシブルプリント配線板のグランド面を臨めるように配置された開口部を備えた導電性の補強板と、
形状復元性及び可撓性を備えた導電性を有する可撓性導電材と、
主となる安定的なグランド面を備えた主グランド部とを有し、
上記可撓性導電材を、上記補強板、及び当該補強板の開口部内の上記フレキシブルプリント配線板のグランド面と、上記主グランド部のグランド面とで挟み込み、上記可撓性導電材により、上記補強板と当該補強板の開口部内の上記フレキシブルプリント配線板のグランド面とを、上記主グランド部のグランド面に接地させて成る電子回路を有する、
ことを特徴とする携帯端末。
A flexible printed wiring board having a ground surface exposed to the outside on the back side corresponding to the surface on which the electronic component is mounted;
Provided on the back side corresponding to the surface on which the electronic component of the flexible printed wiring board is mounted, reinforces the mounting surface of the electronic component of the flexible printed wiring board, and provides the ground surface of the flexible printed wiring board. A conductive reinforcing plate having an opening arranged to face the surface;
A flexible conductive material having electrical conductivity with shape restoration and flexibility;
A main ground portion having a main stable ground plane,
The flexible conductive material is sandwiched between the reinforcing plate and the ground surface of the flexible printed wiring board in the opening of the reinforcing plate and the ground surface of the main ground portion. An electronic circuit formed by grounding a reinforcing plate and a ground surface of the flexible printed wiring board in the opening of the reinforcing plate to the ground surface of the main ground portion;
A portable terminal characterized by that.
JP2006262088A 2006-09-27 2006-09-27 Electronic circuit and its manufacturing method, and mobile terminal with electronic circuit Withdrawn JP2008085021A (en)

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Publications (1)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017099053A1 (en) * 2015-12-11 2017-06-15 Dic株式会社 Thermosetting material for reinforcing flexible printed wiring board, flexible printed wiring board with reinforcing part, method for manufacturing said board, and electronic device
JP2017112360A (en) * 2015-12-11 2017-06-22 Dic株式会社 Thermosetting material for reinforcing flexible printed wiring board, flexible printed wiring board with reinforcing portion, manufacturing method thereof, and electronic device
JP2017118102A (en) * 2015-12-18 2017-06-29 Dic株式会社 Thermosetting adhesive sheet, flexible printed wiring board with reinforcing portion, manufacturing method thereof, and electronic device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017099053A1 (en) * 2015-12-11 2017-06-15 Dic株式会社 Thermosetting material for reinforcing flexible printed wiring board, flexible printed wiring board with reinforcing part, method for manufacturing said board, and electronic device
JP2017112360A (en) * 2015-12-11 2017-06-22 Dic株式会社 Thermosetting material for reinforcing flexible printed wiring board, flexible printed wiring board with reinforcing portion, manufacturing method thereof, and electronic device
CN108353496A (en) * 2015-12-11 2018-07-31 Dic株式会社 Thermosetting material for reinforcing flexible printed wiring board, flexible printed wiring board with reinforced part, manufacturing method thereof, and electronic device
US20180352659A1 (en) * 2015-12-11 2018-12-06 Dic Corporation Thermosetting material used for reinforcing flexible printed circuit board, reinforced flexible printed circuit board, method for producing the reinforced flexible printed circuit board, and electronic device
JP2017118102A (en) * 2015-12-18 2017-06-29 Dic株式会社 Thermosetting adhesive sheet, flexible printed wiring board with reinforcing portion, manufacturing method thereof, and electronic device

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