JP2008078464A - Printed wiring board manufacturing method and drilling device - Google Patents

Abstract

To solve the problem that the position of an alignment mark 10 shifts due to expansion and contraction of a core substrate 1 and the position of a via hole 13 formed in accordance with the alignment mark shifts with respect to an outer layer land 25 formed on the substrate in a later step.
A first step of forming an inner land and an alignment mark on a metal layer of an organic resin insulating layer substrate, a second step of forming an insulating resin layer on both surfaces of the substrate, and the alignment mark A third step of forming an alignment hole of a through-hole in each nearby position; and a positional shift amount of the alignment mark with respect to the alignment hole in the alignment target group; and a value half of the positional shift amount 4th step of calculating the drilling position coordinate data which corrected the expansion and contraction and distortion of the substrate, and forming the via hole by drilling, and the outer layer land and the via hole plating made of the metal plating layer on the insulating resin layer A printed wiring board is manufactured by the 5th process to form.
[Selection] Figure 5

Description

  The present invention relates to a method for manufacturing a printed wiring board, and more particularly to a method for manufacturing a printed wiring board that increases the accuracy of a drilling position in the drilling operation and a punching device used for the drilling operation.

  6A and 6B are diagrams schematically showing a printed wiring board. FIG. 6A is a plan view and FIG. 6B is a side sectional view. In the conventional method for manufacturing a printed wiring board, predetermined inner layer lands 9 and alignment marks 10 are formed by etching the metal layers on both sides of the core substrate 1 having copper foil adhered on both sides. The alignment marks 10 are formed at the four corners of the core substrate 1 as shown in the plan view of FIG. Next, insulating resin layers 12 are formed on both surfaces of the core substrate 1, and alignment holes are formed using an X-ray drilling apparatus. Next, the position of the alignment mark 10 on the metal layer under the insulating resin layer 12 is detected by a drilling device, and the expansion / contraction of the core substrate 1 is grasped from the measurement result of the position of the alignment mark 10. Calculate the corrected drilling position coordinate data. Next, via hole holes are formed by a drilling operation in which a laser beam is projected onto the insulating resin layer 12 on the inner land 9 based on the drilling position coordinate data. Next, a metal plating layer is formed on the surface of the insulating resin layer 12, and a via hole plating 27 is formed in the via hole. Next, a photosensitive etching resist film is affixed on both surfaces of the substrate, a mask is aligned with respect to the alignment hole, and the transferred etching resist pattern is formed by exposing and developing the pattern. Next, the metal plating layer is etched to form a wiring pattern and an outer layer land 25 to which the etching resist pattern is transferred.

  In the technique of Patent Document 1, the drilling device accurately measures the long distance between the alignment marks 10 at the four corners over a wide range of the entire surface of the core substrate 1 using a CCD camera or a length measuring means using an X-ray length measuring method. did. Then, the difference between the measured distance and the design value (theoretical data) is calculated, the amount of positional deviation of the expansion / contraction of the core substrate 1 is grasped, and the position deviation is multiplied by a coefficient K (about 0.5). The amount of position correction was calculated. As a result, corrected drilling position coordinate data was calculated, and via hole holes were formed based on the drilling position coordinate data.

The known literature is described below.
JP 2003-8238 A

  In the prior art, the via hole 13 is formed in alignment with the alignment mark 10 formed in the metal layer 4 of the core substrate 1. That is, the metal layer 4 was formed in alignment with the inner land 9. On the other hand, since the core substrate 1 expands and contracts, the position of the alignment mark 10 shifts, and there is a problem that the position of the via hole 13 formed accordingly shifts with respect to the outer layer land 25 formed on the substrate in a later step.

  Further, in the technique of Patent Document 1, since the long distance between the alignment marks 10 at the four corners is accurately measured over a wide range of the entire surface of the core substrate 1, the measurement mechanism for the position becomes large, and the drilling device There was a problem of high costs. Further, there is a problem that it takes a lot of time to measure the position of the alignment mark 10.

In order to solve this problem, the present invention provides a first step of forming wiring patterns and inner lands of a metal layer on an insulating layer substrate of an organic resin, alignment marks at four corners of the substrate, and both surfaces of the substrate. A second step of forming an insulating resin layer on the substrate, forming an alignment hole of a through hole at each position near the alignment mark, forming an alignment target group together with the alignment mark, and determining a distance between the alignment holes in advance A third step of forming at a predetermined distance, and measuring a positional shift amount of the alignment mark with respect to the alignment hole in the alignment target group, and correcting expansion / contraction and distortion of the substrate with a value half the positional shift amount. By calculating the drilled position coordinate data and drilling with the drilled position coordinate data, A printed wiring board manufacturing method comprising: a fourth step of forming; and a fifth step of forming an outer layer land made of a metal plating layer, a wiring pattern, and via hole plating on the insulating resin layer. .

  In the present invention, the fourth step determines that the substrate is defective and stops drilling when the positional deviation amount of the alignment mark with respect to the alignment hole exceeds a predetermined limit length. It is a manufacturing method of said printed wiring board characterized by the above-mentioned.

  In addition, the present invention provides an XY table for installing a substrate and moving it in the XY direction, a galvano scanner unit, an alignment camera, a laser oscillator, an optical system for converging laser light, and projecting a hole by projecting laser light onto the substrate. A galvano scanner unit that scans the position to be scanned, the image processing means that processes the image read by the alignment camera and measures the position of the alignment target, and the position of the alignment target are used to calculate the drilling position correction amount. The position of the alignment mark with respect to the alignment hole is provided for each alignment target group consisting of the alignment mark and the alignment hole of the substrate for controlling the drilling by correcting the position and controlling the movement position of the XY table. Means for measuring the amount of deviation, But, by calculating the projective transformation from the positional displacement amount, a drilling device, characterized in that to calculate the drilling positional coordinate data corrected stretch and distortion of the substrate.

  Further, in the present invention, the control means determines that the substrate is defective when the positional deviation amount of the alignment mark at each of the four corners of the substrate exceeds a predetermined limit length, It is said drilling apparatus characterized by stopping drilling.

  Since the position of the via hole 13 drilled according to the drilling position coordinate data of the present invention is corrected by the position deviation of half the amount of the positional deviation of the alignment mark 10, the position of the via hole 13 to be formed is The positional deviation amount is distributed to the same extent as the positional deviation of 25 and the positional deviation of the inner land 9 and the via hole 13 with the minimized positional deviation can be formed.

  When the position of the alignment mark 10 is measured by the drilling device, the drilling position correction amount can be obtained only by measuring the position of the alignment mark 10 based on the position of the alignment hole 14 within a narrow range for each alignment target group. Since the calculation can be performed, the measurement mechanism of the position of the alignment mark 10 of the drilling device can be simplified, and the cost of the device can be reduced, and the measurement time can be shortened.

  Below, the manufacturing method of the printed wiring board which concerns on this embodiment is demonstrated, referring drawings. In the following description, the same elements are denoted by the same reference numerals and description thereof is omitted.

Hereinafter, the manufacturing method of this printed wiring board is shown.
(Step 1) As shown in FIG. 1 (a), copper is coated on both surfaces of an insulating layer 3 of an organic resin such as glass fiber epoxy resin or polyimide resin having a thickness of 50 μm to 100 μm and a length and width of 500 mm × 600 mm. A substrate in which thousands to tens of thousands of cylindrical through holes 2 having a diameter of 200 μm to 2 mm are drilled on the core substrate 1 having the metal layer 4 is manufactured using a drilling apparatus. In this step, the cylindrical through-hole 2 is opened in the core substrate 1 made of glass fiber-containing organic resin. In addition to this, aramid fiber, small-diameter glass fiber, or flat glass fiber is contained. Alternatively, an organic resin core substrate 1 containing a flaky inorganic filler may be used. The through-hole 2 and the shape of the through-hole 2 may be formed by using a drilling device with a laser beam such as a carbon dioxide laser or a YAG laser in addition to the drill. .

(Step 2) Next, as shown in FIG. 1B, through the electroless copper plating process and the subsequent electrolytic copper plating process on this substrate, the through-hole plating 5 on the wall surface of the through-hole 2 and the metal layer 4 A substrate on which the metal plating layer 6 overlaid is formed. In addition, the shape of this through-hole plating 5 can also be formed in the structure which filled the through-hole 2 with copper plating.
(Step 3) Next, as shown in FIG. 1 (c), a photosensitive etching resist film is pasted on the metal plating layers 6 on both sides of the substrate, and an exposure process is performed to transfer the mask pattern to the development process. Then, an etching resist pattern 7 is formed.
(Step 4) Next, as shown in FIG. 1 (d), the pattern is transferred by etching the metal plating layer 6 and the metal layer 4 of this substrate, leaving a portion protected by the etching resist pattern 7, Thereafter, the etching resist pattern 7 is peeled off and removed. Thus, a substrate on which the wiring pattern 8 of the metal layer 4 and the metal plating layer 6, the inner layer land 9, and the alignment mark 10 are formed is manufactured. The alignment marks 10 are formed at the four corners of the substrate as shown in the plan view of FIG. In FIG. 3, symbols A, B, C, and D are attached to the alignment mark 10.

  (Step 5) Next, the through hole 2 of this substrate is filled with a resin filler 11. Next, a blackening process is performed on the surface of the metal plating layer 6 such as the wiring pattern 8 and the inner land 9 on both sides of the substrate. By performing the blackening treatment on the surface of the metal plating layer 6, the adhesion with the insulating resin layer 12 placed on the surface is improved. Next, as shown in FIG. 1E, a substrate having the insulating resin layers 12 formed on both sides of the substrate is manufactured. As a method for forming the insulating resin layer 12, the thermosetting film-like insulating resin layer 12 is bonded to both surfaces of the core substrate 1, and heated and pressed to be laminated and cured. Alternatively, a liquid resin is applied to both surfaces of the core substrate 1 and dried and cured. Alternatively, it may be formed by laminating a photosensitive resin film on both surfaces of the core substrate 1 and exposing and developing.

  As another method for forming the insulating resin layer 12, a copper foil with resin in which the insulating resin layer 12 is previously formed on the copper foil is overlapped on both surfaces of the core substrate 1 with the insulating resin layer 12 inside, The insulating resin layer 12 is cured by heating and pressing. An etching resist pattern is formed on the surface of the copper layer of the copper foil, and the copper foil is selectively removed at a place where the via hole hole 13 is to be formed later by covering and etching. Is removed entirely to produce a substrate with the insulating resin layer 12 exposed.

  (Step 6) Next, as shown in FIG. 1 (f), an alignment hole 14 with symbols E, F, G, H on the plan view of FIG. The center of gravity is made to coincide with the center of gravity of the alignment mark 10 with the symbols A, B, C, D, and holes are formed in the four corners of the substrate. At that time, for each alignment mark 10, a through hole alignment hole 14 is formed at a position within 10 mm from the alignment mark 10, and an alignment target group is formed by the alignment mark 10 and the alignment hole 14 formed in the vicinity thereof. . The distance between the alignment holes 14 is set to a predetermined distance regardless of expansion / contraction of the distance between the alignment marks 10.

  (Step 7) Next, as shown in FIG. 2G, the insulating resin layer 12 of the substrate is formed by the following procedure using a drilling device that drills holes by converging a laser beam such as an ultraviolet laser or a YAG harmonic laser. A substrate 16 having a via hole 13 formed in the inner layer land 9 is formed.

  (Embodiment of Drilling Device) FIG. 4 shows the configuration of the drilling device used in this embodiment. The drilling device includes an XY table 17 on which a substrate 16 is installed and moved in the XY direction, a galvano scanner unit 18, an alignment camera 19 using a CCD camera or an X-ray observation means, a laser oscillator 20, and a laser beam converged. An optical system 21 for performing the above operation and a reflection mirror 22 for guiding the laser light to the galvano scanner unit 18. The galvano scanner unit 18 scans the position where the laser light is converged, projected onto the substrate 16 and drilled, with a galvanometer mirror. Then, the drilling device calculates the drilling position correction amount based on the image processing means 23 that processes the image read by the alignment camera 19 and measures the position of the alignment target, and the position of the alignment target, and corrects the drilling position. The control unit 24 controls the movement distance of the XY table 17 to control drilling. The image processing means 23 and the control means 24 can use different hardware, but can also be configured by the same computer calculation program.

  The formation of the via hole 13 by the drilling device is performed as follows. First, the substrate is fixed to the XY table 17 by a vacuum suction method. Next, the control means 24 of the drilling apparatus reads the alignment mark 10 and the alignment hole 14 which are the alignment targets stored in advance in the storage means, their position coordinate design values from the storage means, and drives the XY table 17. By doing so, the position of the alignment camera 19 and the position of the alignment target are matched. Next, the alignment camera 19 observes the alignment target and creates image data thereof. Next, the image processing means 23 calculates the position coordinates of the alignment target by processing the image data. By sequentially observing the alignment mark 10 and the alignment hole 14 with the alignment camera 19 in this way, their position coordinates are calculated. By forming the alignment mark 10 and the alignment hole 14 in the same alignment target group close to within 10 mm, both of them can be observed and the position coordinates can be calculated in a short time. Next, the control means 24 calculates the positional deviation amount of the alignment mark 10 based on the positional coordinates of the alignment hole 14 in the same alignment target group by the following program procedure. This process is performed on the alignment target groups at the four corners of the substrate 16. Then, the control means 24 calculates the drilling position coordinate data of the via hole 13 in which the expansion / contraction and distortion of the substrate are corrected by the positional deviation amount of the alignment marks 10 at the four corners.

  The program procedure for calculating the drilling position coordinate data is specifically performed as follows. First, the control means 24 of the drilling device measures the positional deviation amount of the alignment mark 10 based on the positional coordinates of the alignment hole 14 for each alignment target group. Here, when the positional shift amount of the alignment mark 10 with respect to the alignment hole 14 exceeds a predetermined limit length, it is determined to stop drilling the substrate. Thereby, it is possible to detect a case where the expansion and contraction of the substrate 16 deviates from the management range, prevent unnecessary drilling, and reduce the manufacturing cost of the printed wiring board.

  Next, the control means 24 calculates projective transformation calculation parameters for correcting expansion / contraction and distortion of the substrate 16 from the positional deviation amount of the alignment marks 10 at the four corners for each alignment target group at the four corners. Next, by performing a projective transformation calculation using the projective transformation calculation parameters, drilling position coordinate data with corrected positional deviation is created. Here, only half of the positional deviation amount of the substrate 16 is corrected. As a result, the position of the drilled via hole 13 with respect to the inner land 9 is shifted, and the position of the via hole 13 and the outer land 25 formed in a later process (formed with a mask aligned with the alignment hole 14). There is an effect that it is possible to perform a well-balanced correction in which the positional deviation is uniformly distributed. In addition, the drilling device can obtain the amount of misalignment of the alignment mark 10 only by measuring the positions of the alignment mark 10 and the alignment hole 14 of the alignment target group within a narrow range of a short distance within 10 mm. Then, the drilling position can be corrected only by acquiring the positional deviation amount with the four alignment target groups. For this reason, there is an effect that the cost of the mechanism necessary for measuring the position of the alignment target of the drilling device can be reduced, and the position of the alignment target can be measured in a short time.

In the following, as shown in FIG. 3, an example of the calculation formula of the drilling position coordinate data is shown for the case where the alignment holes 14 are installed at the four corners of the rectangle. In the previous step 6, as shown in FIG. 3, the alignment holes 14 marked with E, F, G, H at the four corners of the substrate 16 are marked with symbols A, B, C, D at the center of gravity. The alignment mark 10 is formed so as to coincide with the center of gravity. The position coordinates of the alignment hole 14 are expressed by the following equation with the center of gravity as the origin.
Position coordinates of upper left alignment hole E = (-Ex, Ey)
Upper right alignment hole F position coordinates = (Ex, Ey)
Position coordinates of lower right alignment hole G = (Ex, -Ey)
Position coordinates of lower left alignment hole H = (-Ex, -Ey).

The alignment marks 10 were placed at the four corners of the rectangle so that they have the same center of gravity as the alignment hole 14. In this case, the position coordinates of the alignment mark 10 are respectively defined as follows.
Position coordinates of alignment mark A and their design values = (Ax, Ay), (-Lxo, Lyo)
Position coordinates of alignment mark B and their design values = (Bx, By), (Lxo, Lyo)
Position coordinates of alignment mark C and their design values = (Cx, Cy), (Lxo, -Lyo)
Position coordinates of alignment mark D and their design values = (Dx, Dy), (-Lxo, -Lyo)
Alignment amount of alignment mark A = 2 (Mxm, Mym) = (Ax, Ay)-(-Lxo, Lyo)
Misalignment amount of alignment mark B = 2 (Nxm, Nym) = (Bx, By) − (Lxo, Lyo)
Position shift amount of alignment mark C = 2 (Pxm, Pym) = (Cx, Cy) − (Lxo, −Lyo)
Position shift amount of the alignment mark D = 2 (Qxm, Qym) = (Dx, Dy) − (− Lxo, −Lyo)
Upper left alignment target drilling position correction amount = (Mxm, Mym)
Upper right alignment target drilling position correction amount = (Nxm, Nym)
Lower right alignment target drilling position correction amount = (Pxm, Pym)
Lower left alignment target drilling position correction amount = (Qxm, Qym)
These drilling position correction amounts in each alignment target group can be calculated using only the measurement results of the position of the alignment hole 14 and the position of the alignment mark 10 only in each alignment target group. Further, the amount of correction for the drilling positions at the four corners is set to be half the amount of positional deviation of the alignment marks 10 at the four corners.

  Next, the control means 24 detects the positional deviation amounts 2 (Mxm, Mym), 2 (Nxm, Nym), 2 (with respect to the position of the alignment hole 14 of the alignment mark 10 at each of the four corners of the substrate. When calculating (Pxm, Pym), 2 (Qxm, Qym), if the amount of positional deviation exceeds a predetermined limit length, it is determined that the substrate is defective, and drilling is stopped. As a result, it is possible to discriminate a substrate in which the position of the alignment mark 10 is greatly displaced due to expansion or contraction or distortion that deviates from the standard of the substrate, and to prevent unnecessary work for further drilling the substrate 16 to be discarded as a defective product. There is.

Next, the control means 24 calculates the following formula from the drilling position coordinate design value (Uxo, Uyo) with the center of gravity of the alignment hole 14 at the four corners as the origin, thereby producing the drilling position coordinate data (Tx, Ty). Calculate First, since the alignment hole 14 is formed in alignment with the origin of the alignment mark 10, the following equation is established.
(Mxm, Mym) + (Nxm, Nym) + (Pxm, Pym) + (Qxm, Qym) = 0
Drilling position coordinate design value = (Uxo, Uyo)
Based on this relationship, the drilling position correction amount at a predetermined drilling position is calculated by projective transformation from the drilling position correction amount at the position of the alignment mark 10 at each position by the following formula. Then, the drilling position coordinate data (Tx, Ty) is calculated by adding the drilling position correction amount to the drilling position coordinate design value (Uxo, Uyo).
(Tx, Ty) ＝ (Uxo + Uyo)
+ (Projection transformation calculation parameter 1) x Uxo / (2Lxo)
+ (Projection transformation calculation parameter 2) x Uyo / (2Lyo)
+ (Projection transformation calculation parameter 3) x Uxo x Uyo / (2Lxo x Lyo)
Projection transformation calculation parameter 1 = (Nxm, Nym) + (Pxm, Pym) = − (Mxm, Mym) − (Qxm, Qym)
Projection transformation calculation parameter 2 = (Mxm, Mym) + (Nxm, Nym) = − (Pxm, Pym) − (Qxm, Qym)
Projective transformation calculation parameter 3 = (Nxm, Nym) + (Qxm, Qym) = − (Mxm, Mym) − (Pxm, Pym)
By this calculation, the amount of misalignment of the four alignment marks 10 is reflected in the drilling position correction amount for correcting the expansion / contraction and distortion of the substrate for each drilling position by projective transformation, and the drilling corrected thereby. The position coordinate data (Tx, Ty) is calculated. Further, this punching position correction amount is corrected by a half of the positional deviation amount of the substrate 16.

  Thus, for each alignment target group, a drilling position coordinate in which the expansion / contraction and distortion of the substrate are corrected only by measuring the position of the alignment mark 10 with reference to the position of the alignment hole 14 within a narrow range of a short distance of 10 mm or less. Data (Tx, Ty) can be calculated, and the positional deviation amount can be measured in a short time. The reason why this effect is possible is that the distance between the alignment holes 14 formed in step 6 is set to a constant value that is not affected by the expansion and contraction of the substrate in the manufacturing process so far. This also simplifies the measurement mechanism for the position of the alignment mark 10 of the drilling device, thereby reducing the cost of the drilling device.

  Next, as shown in FIG. 2G, the position of the inner layer land 9 of the insulating resin layer 12 of the substrate 16 is set at the position specified by the drilling position coordinate data (Tx, Ty) by the galvano scanner unit 18. The via hole 13 is formed by scanning, converging and projecting the drilling laser beam. In this step, the via hole 13 can be drilled with a drilling device.

  The position of the via hole 13 drilled by the drilling position coordinate data is drilled by the drilling position coordinate data corrected by half the displacement amount of the alignment mark 10, and as shown in FIG. Via hole plating 27 is formed at an intermediate position between the position of the outer layer land 25 and the position of the inner layer land 9 formed in accordance with the position of the alignment hole 14. That is, there is an effect that the position of the via hole plating 27 can be formed at the best position where the positional deviation is small in both the outer layer land 25 and the inner layer land 9 and the positional deviation is equally divided between both.

(Step 8) Next, as shown in FIG. 2 (h), copper having a thickness of about 20 μm is formed on the insulating resin layer 12 by electroless copper plating treatment on the insulating resin layer 12 and subsequent electrolytic copper plating treatment. The metal plating layer 26 is formed, and the via hole plating 27 in which the via hole 13 is filled with the electrolytic copper plating layer is formed.
(Step 9) Next, a photosensitive etching resist film is affixed on the metal plating layer 26, and a mask aligned with the alignment hole 14 as a reference is placed thereon. As the mask, an organic resin film mask or a glass dry plate mask can be used. By exposing and developing from above the mask, an etching resist pattern 15 to which the mask pattern is transferred is formed as shown in FIG. Here, since the distance between the alignment holes 14 formed in step 6 is set to a constant value that is not affected by the expansion and contraction of the substrate in the manufacturing process so far, in this step 9, the position of the alignment hole 14 is set. There is an effect that the mask for forming the etching resist pattern 15 can be accurately aligned with respect to the reference.

(Step 10) Next, as shown in FIG. 2 (j), the metal plating layer 26 is etched and the etching resist pattern 15 is peeled off to transfer the etching resist pattern 15 and leave the via hole plating 27. And a wiring pattern 28 is formed.
Thereafter, the same manufacturing operation is performed according to the number of stacked layers.

As described above, the etching resist pattern 15 is aligned with the alignment hole 14 as a reference, and the via hole 13 is formed by correcting the positional deviation of the alignment mark 10 of the metal plating layer 6 on which the inner layer land 9 is formed by half correction. did. Therefore, as shown in a plan view in FIG. 5A and a cross-sectional side view in FIG. 5B, the via-hole plating 27 is formed at an intermediate position between the outer land 25 and the inner land 9. If the positions of the outer layer land 25 and the inner layer land 9 are so shifted that they cannot be aligned as described above, the drilling operation has been stopped in the processing of the previous step 5, so the position of the via hole plating 27 is Both the outer land 25 and the inner land 9 could be matched within an allowable limit. And the position of the via-hole plating 27 was formed in the intermediate position of the outer layer land 25 and the inner layer land 9, and the position shift amount with respect to both was formed in the appropriate position equally distributed to both.
(Step 11) Next, as shown in FIG. 2 (k), the solder resist pattern 29 is printed and the outer shape is processed to produce a printed wiring board.

  In the above embodiment, the example in which the center of gravity of the alignment hole 14 is formed in step 6 so as to coincide with the center of gravity of the alignment mark 10 has been described. However, the center of gravity of the alignment hole 14 is the center of gravity of the alignment mark 10. Even when not formed in conformity with the above, the effects of the present invention can be obtained as follows. First, in step 6, the distance between the alignment holes is formed at a predetermined distance. In step 7, the four corner drilling position correction amounts are set to half the positional deviation amount of the four corners of the substrate 16. Then, in the calculation of the projective transformation in step 7, the projective transformation including the correction of the center of gravity is calculated using the four corner drilling position correction amounts. As a result, the position of the drilled via hole 13, that is, the position of the via hole plating 27 can be formed at an intermediate position between the outer layer land 25 and the inner layer land 9. Further, as the mask used for forming the etching resist pattern 15 in Step 9 of the above embodiment, a plurality of masks in which the expansion / contraction correction amount is changed in accordance with the expansion / contraction amount stage between the alignment marks 10 may be used. In that case, in step 6, the amount of expansion / contraction of the distance between the alignment marks 10 may be measured with an X-ray drilling apparatus, and the mask to be used in step 9 may be determined according to the amount of expansion / contraction. Then, the distance between the alignment holes 14 formed in step 6 may be changed according to the mask to be used in step 9.

It is sectional drawing which shows the manufacturing method of the printed wiring board of this invention. It is sectional drawing which shows the manufacturing method of the printed wiring board of this invention. It is a top view which shows the position of the alignment mark and alignment hole of the printed wiring board of this invention. It is a block diagram which shows the structure of the drilling apparatus of this invention. It is the top view and side sectional drawing which show the arrangement | positioning position of the inner layer land of the printed wiring board of this invention, an outer layer land, and via-hole plating. It is the top view and side surface sectional view which show the arrangement | positioning position of the inner layer land of the prior art printed wiring board, the outer layer land, and via-hole plating. It is a top view which shows the position of the alignment mark of the printed wiring board of a prior art.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Core substrate 2 ... Through-hole 3 ... Insulating layer 4 ... Metal layer 5 ... Through-hole plating 6 ... Metal plating layer 7 ... Etching resist pattern 8 ... Wiring pattern DESCRIPTION OF SYMBOLS 9 ... Inner-layer land 10 ... Alignment mark 11 ... Filler material 12 ... Insulating resin layer 13 ... Via-hole hole 14 ... Alignment hole 15 ... Etching resist pattern 16 ... Substrate 17 XY table 18 Galvano scanner unit 19 Alignment camera 20 Laser oscillator 21 Optical system 22 Reflecting mirror 23 Image processing means 24 Control means 25 ... Outer land 26 ... Metal plating layer 27 ... Via hole plating 28 ... Wiring pattern 29 ... Solder resist pattern

Claims (4)

  A metal layer wiring pattern and inner lands on an organic resin insulating layer substrate; a first step of forming alignment marks at four corners of the substrate; and a second step of forming insulating resin layers on both sides of the substrate. A third step of forming an alignment hole of a through hole at each position near the alignment mark, forming an alignment target group together with the alignment mark, and forming a distance between the alignment holes at a predetermined distance; Measure the positional deviation amount of the alignment mark with respect to the alignment hole in the alignment target group, calculate the drilling position coordinate data in which expansion and contraction and distortion of the substrate are corrected by a value half the positional deviation amount, and the hole A fourth step of forming a via hole by drilling a hole based on the position coordinate data; and the insulating resin Method of manufacturing a printed wiring board characterized by having a fifth step of forming an outer layer land and the wiring pattern and via-hole plating comprising a metal plating layer thereon.   The fourth step is characterized in that when the amount of positional deviation of the alignment mark with respect to the alignment hole exceeds a predetermined limit length, it is determined that the substrate is defective and the drilling is stopped. Item 2. A method for producing a printed wiring board according to Item 1.   An XY table for installing the substrate and moving it in the XY direction, a galvano scanner unit, an alignment camera, a laser oscillator, an optical system for converging the laser beam, and a galvano for scanning the position where the laser beam is projected onto the substrate and drilled. It has a scanner unit, calculates the drilling position correction amount based on the image processing means that processes the image read by the alignment camera and measures the position of the alignment target, and the measurement data of the alignment target position, and corrects the drilling position. Control means for controlling the movement position of the XY table to control drilling, and for each alignment target group consisting of the alignment mark and the alignment hole of the substrate, the positional deviation amount of the alignment mark with respect to the alignment hole is set. Means for measuring, the control means Wherein the position by calculating the projective transformation from the shift amount, piercing apparatus characterized by calculating a drilling position coordinate data corrected stretch and distortion of the substrate.   The control means determines that the substrate is defective when the amount of misalignment of the alignment mark at each of the four corners of the substrate exceeds a predetermined limit length, and stops drilling. The drilling device according to claim 3.

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