JP2008078066A - Ring-like lighting system and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a ring-like lighting system that can prevent electrical contact failure between an LED lead and a printed circuit board and be easily manufactured; and to provide a method of manufacturing the same. <P>SOLUTION: This system includes a plurality of LEDs 8, a ring-like base plate 10 that supports the plurality of LEDs 8, and the printed circuit board 12 to which the plurality of LEDs 8 are electrically connected, wherein the base plate 10 contains a plurality of penetrating holes 24 extending from a first face to a second face thereof and an inclined plane 20 that is inclined radially inwardly in a downward direction is also placed on one face thereof. Each lead 16 of the plurality of LEDs 8 is passed and soldered through the plurality of the penetrating holes 24 of the base plate 10 into a plurality of through-holes 32 of the printed circuit board 12, and each light-emitting portion 14 of the plurality of LEDs 8 is supported on the inclined plane 20 of the base plate 10 in a nearly vertical direction. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a ring illumination device used for illuminating an object to be inspected, for example, in an image processing inspection or the like, and a manufacturing method thereof.

  Conventionally, when inspecting the quality of industrial products such as printed wiring boards and semiconductors, such as defective soldering, adhesion of foreign matter, or printing errors such as the date of manufacture printed on beverage cans on the production line In addition, an image processing inspection using imaging by a CCD camera or the like is performed. In this image processing inspection, a ring-shaped illumination device for illuminating an object to be inspected arranged in an illumination area is used.

  The ring-shaped illumination device as described above includes a ring-shaped light source that emits light in a ring shape, and the ring-shaped light source includes a plurality of LEDs and a bendable printed wiring board in which the plurality of LEDs are electrically connected. (For example, refer to Patent Document 1). This ring illumination device is manufactured as follows, for example. The printed wiring board is configured in a ring shape having a notch, and the leads of each of the plurality of LEDs are soldered to one side of the printed wiring board in a state where the printed wiring board is held flat. After that, the printed wiring board is bent in a truncated cone shape so that one side of the printed wiring board is on the inside, and both ends thereof are joined to each other. It is disposed on the truncated conical concave surface side of the substrate.

Japanese Patent No. 2975893

  However, the above-described conventional ring illumination device has the following problems. Since the mounting density of the plurality of LEDs on the printed wiring board is relatively high, it is not easy to bend the printed wiring board into a truncated cone, and therefore, the ring-shaped lighting device cannot be easily manufactured. There is. In addition, if the printed wiring board is bent in a truncated conical shape as described above, stress will act on the printed wiring board, which will cause stress on the LED leads soldered to the printed wiring board. There is a problem that cracks occur in the soldered portions of the LED leads, and there is a risk of poor electrical contact between the LED leads and the printed wiring board.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a ring illumination device that can prevent electrical contact failure between an LED lead and a printed wiring board and can be easily manufactured, and a method for manufacturing the same.

A ring-shaped illumination device according to claim 1 of the present invention includes a plurality of LEDs and a printed wiring board to which the plurality of LEDs are electrically connected, and each of the plurality of LEDs is covered with a resin. A plurality of through holes corresponding to each of the leads of the plurality of LEDs, and the plurality of LEDs. In the ring-shaped illumination device in which each of the leads is soldered by being inserted into the plurality of through holes of the printed wiring board,
The printed wiring board is configured in a flat plate shape and a ring shape, and an insulating ring-shaped base plate is interposed between the printed wiring board and the light emitting portion of each of the plurality of LEDs, The base plate is provided with a plurality of through holes extending from one surface to the other surface, and on one surface thereof is provided with an inclined surface that is inclined downward inward in the radial direction.
The leads of each of the plurality of LEDs are inserted into the plurality of through holes of the printed wiring board through the plurality of through holes of the base plate and soldered, and the light emitting portion of each of the plurality of LEDs is The support plate is supported in a substantially vertical direction on the inclined surface of the base plate.

  Moreover, in the ring-shaped illumination device according to claim 2 of the present invention, the other surface of the base plate is a ring for accommodating solder sucked up on one surface thereof through the plurality of through holes of the printed wiring board. A concave portion is provided.

  Furthermore, in the ring-shaped illumination device according to claim 3 of the present invention, a tapered portion that extends outward is provided at each open end of the plurality of through holes on the inclined surface side of the base plate. It is characterized by that.

  Moreover, in the ring-shaped illumination device according to claim 4 of the present invention, the base plate and the printed wiring board are each provided with positioning means for positioning them so as to overlap each other. And

  Furthermore, in the ring-shaped illumination device according to claim 5 of the present invention, the positioning means is engaged with the positioning projection or recess provided on the base plate and the positioning projection or recess. It is comprised from the recessed part or protrusion for positioning provided in the said printed wiring board which is characterized by the above-mentioned.

  The ring-shaped illumination device according to claim 6 of the present invention further includes a housing for holding the base plate and the printed wiring board, and is provided between the other surface of the printed wiring board and the housing. Further, a heat radiating member having flexibility is interposed, and a tip portion of each lead of each of the plurality of LEDs is in thermal contact with the heat radiating member.

Furthermore, in the manufacturing method of the ring-shaped illuminating device according to claim 7 of the present invention, the plurality of LEDs, the ring-shaped base plate having insulating properties for supporting the plurality of LEDs, and the plurality of LEDs are electrically connected. And a printed wiring board connected to
Each of the plurality of LEDs has a light emitting portion covered with a resin and a lead extending from the light emitting portion, the printed wiring board is configured in a flat plate shape and a ring shape, A plurality of through holes are provided corresponding to the leads of each of the plurality of LEDs, the base plate is provided with a plurality of through holes extending from one surface to the other surface, and one surface has a radial direction. A method of manufacturing a ring-shaped illumination device provided with an inclined surface that inclines downward toward the inside,
Bending the leads of each of the plurality of LEDs, cutting the leads of each of the plurality of LEDs to a predetermined length, the plurality of through holes in the base plate, and the printed wiring board. A step of matching a plurality of through holes, a step of superimposing the other side of the base plate and one side of the printed wiring board so as to face each other, and the light emission of each of the plurality of LEDs Supporting the portion on the inclined surface of the base plate, and inserting the leads of the plurality of LEDs into the plurality of through holes of the base plate and the plurality of through holes of the printed wiring board, And soldering the lead inserted into the through hole and the through hole to the through hole.

  According to the ring illumination device of the present invention, the leads of each of the plurality of LEDs are inserted into the plurality of through holes of the printed wiring board through the plurality of through holes of the base plate and soldered. Since each light emitting portion of the LED is supported in a substantially vertical direction on the inclined surface of the base plate, each light emitting portion of the plurality of LEDs is ring-shaped as required without bending the printed wiring board as in the prior art. It is possible to easily manufacture the ring-shaped lighting device, and it is possible to arrange a plurality of LEDs with a predetermined angle inclined accurately by the inclined surface. Furthermore, no stress is applied to the printed wiring board, so that cracks do not occur in the soldered portions of the LED leads, and it is possible to prevent poor electrical contact between the LED leads and the printed wiring board. Is possible.

  Moreover, according to the ring-shaped illumination device of the present invention, the other surface of the base plate is provided with a ring-shaped recess, so that the leads of the plurality of LEDs are inserted into the plurality of through holes of the printed wiring board. When soldering, the solder sucked up to one side through a plurality of through holes of the printed wiring board is accommodated in the ring-shaped recess. Therefore, the LED leads can be securely soldered to the printed wiring board on both sides of the printed wiring board, and the electrical connection between the LED leads and the printed wiring board can be kept good.

  Furthermore, according to the ring-shaped illumination device of the present invention, since the opening end portion of each of the plurality of through holes on the inclined surface side of the base plate is provided with a taper portion that extends outward, the LED lead is attached to the base plate. When the LED light-emitting portion is molded with resin, the resin protrusion formed at the lower end of the light-emitting portion is accommodated in the accommodating space formed inside the tapered portion. Thereby, the lower end surface of the light emitting portion of the LED comes into contact with the inclined surface of the base plate, and the light emitting portion of the LED can be stably supported on the inclined surface in the through hole portion of the base plate. .

  Further, according to the ring illumination device of the present invention, the base plate and the printed wiring board are provided with positioning means for positioning them by superimposing each other, so that a plurality of through holes in the base plate are provided. It is possible to easily perform positioning when the base plate and the printed wiring board are overlapped with each other so that the plurality of through holes of the printed wiring board coincide with each other. Further, the positioning means includes a positioning protrusion or recess provided on the base plate, and a positioning recess or protrusion provided on the printed wiring board that is mutually engaged with the positioning protrusion or recess. Therefore, positioning when the base plate and the printed wiring board are superposed on each other can be performed more easily and reliably.

  Further, according to the ring-shaped illumination device of the present invention, since a flexible heat dissipating member is interposed between the other surface of the printed wiring board and the housing, the leading end portion of each lead of the plurality of LEDs Is covered with the heat radiating member so as to be in heat transfer contact, and heat from the lead is transmitted to the housing through the heat radiating member and radiated. Therefore, it is possible to efficiently dissipate heat generated in the light emitting units of the plurality of LEDs. Further, the lead is not pressed by the heat radiating member and an external force does not act on the lead, thereby preventing the lead from being cracked in the soldered portion.

  Furthermore, according to the manufacturing method of the ring-shaped illumination device of the present invention, each lead of the plurality of LEDs is bent and cut into a predetermined length, and the plurality of through holes and the plurality of through holes are made to coincide with each other. And the printed wiring board are overlapped with each other, the light emitting portions of the plurality of LEDs are supported on the inclined surface of the base plate, and the leads of the plurality of LEDs are passed through the plurality of through holes of the base plate. Since it is inserted through multiple through holes and soldered, the light emitting portions of each of the multiple LEDs can be arranged in a ring shape as required without bending the printed wiring board as in the past. It is possible to easily manufacture the illuminating device, and it is possible to dispose the plurality of LEDs accurately inclined at a predetermined angle by the inclined surface. Furthermore, no stress is applied to the printed wiring board, so that cracks do not occur in the soldered portions of the LED leads, and it is possible to prevent poor electrical contact between the LED leads and the printed wiring board. Is possible.

  Hereinafter, various embodiments of a ring illumination device and a method for manufacturing the same according to the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view showing a ring-shaped illumination device according to a first embodiment of the present invention, FIG. 2 is an exploded perspective view showing the ring-shaped illumination device of FIG. 1, and FIG. FIG. 4 is a schematic cross-sectional view of the ring-shaped illumination device, and FIG. 4 is an enlarged cross-sectional view showing the configuration of the through hole of the base plate of FIG.

  1 to 4, the illustrated ring-shaped illumination device 2 includes a ring-shaped light source 4 that emits light in a ring shape, and a housing 6 that holds the ring-shaped light source 4. Hereinafter, each of these components will be described in detail.

The ring-shaped light source 4 includes a plurality of LEDs 8, a ring-shaped base plate 10 that supports the plurality of LEDs 8, and a printed wiring board 12 to which the plurality of LEDs 8 are electrically connected.
The LED 8 includes a light emitting unit 14 and a pair of leads 16 extending from the light emitting unit 14. The light emitting unit 14 is formed into a shell shape by molding a chip (not shown) as a light emitter with a transparent resin or the like, and each of the pair of leads 16 extends from the lower end of the light emitting unit 14 to the outside. Yes. Further, at the lower end portion of the light emitting portion 14 (that is, the portion where the lead 16 is led out from the light emitting portion 14), there is a resin protruding portion 18 in which the transparent resin forming the light emitting portion 14 is somewhat protruded in a mountain shape. (See FIG. 4). The resin protruding portion 18 is formed when the light emitting portion 14 is molded. In FIG. 2, only one LED 8 is shown.

  The base plate 10 is made of a material having high heat resistance and insulation, such as polycarbonate, and is configured in a ring shape. On one surface of the base plate 10, there is provided an inclined surface 20 that is inclined downward inward in the radial direction at an angle θ1 (for example, about 72 degrees) (see FIG. 3) with respect to the axis C of the ring-shaped illumination device 2. In addition, a ring-shaped recess 22 is provided on the other surface. Further, the base plate 10 is provided with a plurality of through holes 24 through which the leads 16 of the plurality of LEDs 8 are inserted so as to extend in the direction of the axis C from one surface to the other surface. A plurality of rows (4 rows in this embodiment) are provided concentrically. A tapered portion 26 that extends outward is provided at the opening end portion of the through hole 24 on the inclined surface 20 side of the base plate 10 (see FIG. 4), and the size of the tapered portion 26 is inward in the radial direction of the base plate 10. From the inside of the taper portion 26, an accommodation space 28 for accommodating the resin protrusion 18 of the light emitting portion 14 of the LED 8 is formed. Further, a positioning projection 30 (see FIGS. 2 and 4) is provided on the outer peripheral portion of the other surface of the base plate 10 as positioning means.

  The printed wiring board 12 is configured in a flat plate shape and a ring shape, and the outer diameter and inner diameter thereof are substantially the same as the outer diameter and inner diameter of the base plate 10, respectively. The printed wiring board 12 is provided with a plurality of through holes 32 corresponding to the leads 16 of the plurality of LEDs 8 (that is, corresponding to the plurality of through holes 24 of the base plate 10). Conductive land portions (not shown) are provided at both ends of each of the plurality of through holes 32, and the conductive land portions are electrically connected to a wiring pattern (not shown) provided on the printed wiring board 12. Has been. One end of a power cable 34 extending from a power supply device (not shown) is electrically connected to the wiring pattern on the other surface side of the printed wiring board 12 by soldering. A positioning recess 36 (see FIGS. 2 and 4) as positioning means is provided on the outer peripheral portion of one side of the printed wiring board 12 corresponding to the positioning protrusion 30 of the base plate 10 for positioning. The base plate 10 and the printed wiring board 12 are overlapped with each other so that the protrusion 30 and the positioning recess 36 are engaged with each other. Then, the plurality of through holes 24 of the base plate 10 and the plurality of through holes 32 of the printed wiring board 12 are matched with each other.

  The housing 6 includes a cylindrical housing main body 38 and a ring-shaped cover 40 attached to one opening of the housing main body 38. The inner diameter of the housing main body 38 is substantially the same as or slightly larger than the outer diameters of the base plate 10 and the printed wiring board 12. A ring-shaped locking protrusion 42 protruding radially inward is provided on the inner peripheral surface of the housing body 38, and a power cable 34 extending from the printed wiring board 12 is inserted into one end thereof. A rectangular first cutout portion 44 and a plurality of screw insertion holes 46 arranged at predetermined intervals in the circumferential direction are provided.

  The outer diameter of the cover portion 40 is configured to be substantially the same as or slightly smaller than the inner diameter of the housing main body portion 38. A plurality of screw holes 48 are provided in the cover portion 40 at predetermined intervals in the circumferential direction, and a ring-shaped accommodation recess 52 for accommodating a heat radiating member 50 described later is provided on one surface thereof. Yes. A plurality of screw holes 54 are provided on the outer peripheral portion of the cover portion 40 corresponding to the plurality of screw insertion holes 46 of the housing main body portion 38, and corresponding to the first notch portion 44 of the housing main body portion 38. A second notch 56 is provided (see FIG. 2).

  The heat radiating member 50 accommodated in the accommodating recess 52 of the cover portion 40 is formed in a ring shape, and is formed of a deformable flexible material having electrical insulation and thermal conductivity, such as silicone, fluorosilicone, SEP or the like. .

  Next, a method for manufacturing the ring illumination device 2 will be described as follows. First, a portion near the resin protrusion 18 of the pair of leads 16 of the LED 8 is bent at an angle θ2 (for example, about 18 degrees) (see FIG. 3) with respect to the light emitting portion 14 using, for example, a tool. The pair of leads 16 of the LED 8 is cut into a predetermined length using, for example, a tool. For example, when the thickness D1 of the outermost through hole 24 portion of the base plate 10 is about 6 mm and the thickness D2 of the printed wiring board 12 is about 1.5 mm, a pair of LEDs 8 to be inserted into the through hole 24. The lead 16 of the LED 8 is cut into a length of about 8.5 to 9.0 mm, and the pair of leads 16 of the LED 8 inserted from the outside of the base plate 10 into the second row of through-holes 24 by a predetermined length. Cut into short lengths. Similarly, the length of the pair of leads 16 of the LEDs 8 inserted through the through holes 24 in the second row from the outside of the base plate 10, the through holes 24 in the third row from the outside, and the innermost through holes 24 is shortened in this order. Cut so that By cutting in this way, the lead 16 protruding from the other surface of the printed wiring board 12 when the lead 16 of the LED 8 is inserted into the through hole 32 of the printed wiring board 12 through the through hole 24 of the base plate 10 as will be described later. About 1.0 to 1.5 mm can be secured.

  Thereafter, the positioning projections 30 of the base plate 10 and the positioning recesses 36 of the printed wiring board 12 are engaged with each other, whereby a plurality of through holes 24 of the base plate 10 and a plurality of through holes of the printed wiring board 12 are obtained. 32, and the other surface of the base plate 10 and one side of the printed wiring board 12 are opposed to each other so that they are integrated with each other, for example, with a temporary fixing tape (not shown). Secure to. Then, the pair of leads 16 of the LED 8 bent as described above are inserted into the corresponding pair of through holes 32 of the printed wiring board 12 through the corresponding pair of through holes 24 of the base plate 10. At the time of this insertion, the leading end portion of the lead 16 is inserted into the through hole 24 of the base plate 10 while being moved along the surface of the taper portion 26 radially outward of the base plate 10. 10 through holes 24 can be easily inserted. When the lead 16 of the LED 8 is thus inserted, the resin protruding portion 18 of the light emitting portion 14 of the LED 8 is accommodated in the accommodating space 28 inside the tapered portion 26, whereby the lower end surface of the light emitting portion 14 is the inclined surface of the base plate 10. The light emitting portion 14 can be stably supported on the inclined surface 20 in the through hole 24 portion.

  As described above, the lead 16 of the LED 8 is inserted into the through hole 32 of the printed wiring board 12 through the through hole 24 of the base plate 10, and the leading end of the lead 16 is connected to the conductive land part (through hole on the other surface side of the printed wiring board 12. Solder to 32). When soldering is performed in this manner, the solder 58 is sucked up from the other surface of the printed wiring board 12 to one side thereof through the through hole 32, and the sucked-up solder 58 is accommodated in the ring-shaped recess 22 of the base plate 10 (see FIG. 4), the lead 16 of the LED 8 can be reliably soldered to the conductive land portion even on one side of the printed wiring board 12.

  This soldering is performed by, for example, flow soldering, but a base plate 10 made of a material having high heat resistance such as polycarbonate is interposed between the light emitting portion 14 of the LED 8 and the printed wiring board 12. Therefore, when the other surface of the printed wiring board 12 is brought into contact with the upper surface of the solder tank (not shown), the heat of the molten solder in the solder tank is hardly transmitted to the light emitting portion 14 of the LED 8. The light emitting portion 14 of the LED 8 is prevented from being damaged by the heat of the solder.

  When soldering is performed in this manner, the base plate 10 and the printed wiring board 12 are sandwiched between the light emitting part 14 of the LED 8 and the tip part of the lead 16 soldered to the conductive land part of the printed wiring board 12. Therefore, the temporary fixing tape can be removed. Further, one end of the power cable 34 extending from the power supply device is soldered to the wiring pattern on the other surface side of the printed wiring board 12.

  The ring-shaped light source 4 assembled as described above is held in the housing 6 as follows. First, the ring-shaped light source 4 is inserted into one of the openings of the housing main body 38 and the outer peripheral portion on one side of the base plate 10 is locked to the locking protrusion 42 of the housing main body 38. Then, the heat radiating member 50 is accommodated in the accommodating recess 52 of the cover 40, and the cover 40 is inserted into one opening of the housing main body 38. When inserted, the heat radiating member 50 is interposed between the other surface of the printed wiring board 12 and one side of the cover portion 40, and the tip of the lead 16 protruding from the other surface of the printed wiring board 12 covers the heat radiating member 50. Thus, the lead 16 and the heat radiating member 50 come into thermal contact. Then, the power cable 34 extending from the printed wiring board 12 is pulled out through the second cutout portion 56 of the cover portion 40 and the first cutout portion 44 of the housing main body portion 38, and thereafter, a plurality of fixing screws 60 are inserted into the housing main body. The cover 38 is screwed into the plurality of screw holes 54 through the plurality of screw insertion holes 46 of the portion 38. As a result, the housing main body 38 and the cover 40 are fixed together, whereby the ring-shaped light source 4 is sandwiched between the locking projection 42 of the housing main body 38 and one surface of the cover 40. As described above, the manufacturing of the ring illumination device 2 is completed.

  In the ring-shaped illumination device 2 configured as described above, each light emitting portion 14 of the plurality of LEDs 8 is arranged in a ring shape on the inclined surface 20 of the base plate 10, and is ring-shaped at an angle θ 2 with respect to the axis C. The light source 4 faces inward in the radial direction (that is, substantially perpendicular to the inclined surface 20 of the base plate 10).

  The ring illumination device 2 is used for the following image processing inspection, for example. For example, by attaching a plurality of mounting screws (not shown) to the plurality of screw holes 48 of the cover portion 40, the ring-shaped illumination device 2 is mounted so that the inclined surface 20 of the ring-shaped light source 4 is on the lower side. Attach to inspection equipment (not shown). An illumination area (not shown) is positioned below the ring-shaped illumination device 2, and an object to be inspected (not shown) is arranged at the center of the illumination area. Further, a CCD camera (not shown) is installed above the ring-shaped illumination device 2, and this CCD camera is configured so that the inspection object can be seen through the opening 62 of the ring-shaped illumination device 2. .

  When predetermined power from the power supply device is supplied to the ring illumination device 2 via the power cable 34, this power is led to the LED 8 via the wiring pattern, the conductive land portion and the solder 58 of the printed wiring board 12. 16, each of the plurality of LEDs 8 emits light. Thereby, the surface of the inspection object arranged in the illumination area is illuminated, and the image processing inspection of the inspection object is performed in this way.

  Further, as described above, since the tip end portion of the lead 16 of the LED 8 is covered and in contact with the heat radiating member 50, when the light emitting portion 14 of the LED 8 emits light, the heat generated in the light emitting portion 14 is radiated from the lead 16. The heat is transmitted to the cover 40 and the housing main body 38 through 50, and is radiated, whereby the heat generated in the light emitting portion 14 can be efficiently radiated.

  In the ring-shaped lighting device 2 of the present embodiment, each lead 16 of the plurality of LEDs 8 is soldered to the printed wiring board 12 through the plurality of through holes 24 of the base plate 10, whereby each of the plurality of LEDs 8 emits light. Since the portion 14 is supported by the inclined surface 20 of the base plate 10, the light emitting portions 14 of the plurality of LEDs 8 are arranged in a ring shape as required without bending the printed wiring board 12 as in the prior art. Therefore, the ring illumination device 2 can be easily manufactured. In addition, no stress is applied to the printed wiring board 12, so that cracks do not occur in the soldered portion of the lead 16 of the LED 8, and poor electrical contact between the lead 16 of the LED 8 and the printed wiring board 12 occurs. Can be prevented. Moreover, the irradiation direction of the light from the plurality of LEDs 8 can be easily changed by appropriately changing the inclination angle θ1 of the inclined surface 20 of the base plate 10.

  Next, a second embodiment of the ring illumination device will be described with reference to FIG. FIG. 5 is a schematic perspective view showing a main part of a ring illumination device according to the second embodiment of the present invention. 5, the same components as those of the embodiment shown in FIGS. 1 to 4 are denoted by the same reference numerals, and the description thereof is omitted.

  In the ring-shaped lighting device 2A according to this embodiment, each of the plurality of through holes 24A provided in the base plate 10A is formed in a long hole shape, and a pair of leads 16 of the LED 8 are inserted into one through hole 24A. The The length of the through hole 24A is substantially the same as or slightly larger than the distance (pitch) between the pair of leads 16 of the LED 8.

  In the ring illumination device 2A of this other embodiment, the lead 16 of the LED 8 is inserted into one through hole 24A of the base plate 10A, so that the lead 16 can be easily inserted.

  As mentioned above, although various embodiment of the ring-shaped illuminating device according to this invention and its manufacturing method was described, this invention is not limited to this embodiment, Various deformation | transformation thru | or does not deviate from the scope of this invention. Correction is possible.

  For example, in each of the above embodiments, the positioning projection 30 is provided on the other surface of the base plate 10 and the positioning recess 36 is provided on one surface of the printed wiring board 12. Positioning recesses may be provided on the other surface of 10, and positioning protrusions may be provided on one surface of the printed wiring board 12. Alternatively, instead of providing the positioning protrusion 30 and the positioning recess 36, the positioning means is configured by markings provided on the other surface of the base plate 10 and one surface of the printed wiring board 12, respectively, and these markings match. In this way, the base plate 10 and the printed wiring board 12 may be overlapped and positioned.

  Further, for example, in each of the above embodiments, the lead 16 of the LED 8 is soldered to the printed wiring board 12 by flow soldering, but may be soldered using, for example, a soldering iron.

It is a perspective view which shows the ring-shaped illuminating device by the 1st Embodiment of this invention. It is a disassembled perspective view which shows the ring-shaped illuminating device of FIG. It is a schematic sectional drawing of the ring-shaped illuminating device of FIG. It is an expanded sectional view which shows the through-hole of the baseplate of FIG. 3, and the structure of the periphery. It is a schematic principal part perspective view which shows the ring-shaped illuminating device by the 2nd Embodiment of this invention.

Explanation of symbols

2,2A Ring illumination device 4 Ring light source 6 Housing 8 LED
DESCRIPTION OF SYMBOLS 10,10A Base board 12 Printed wiring board 14 Light emission part 16 Lead 20 Inclined surface 22 Ring-shaped recessed part 24, 24A Through-hole 26 Tapered part 30 Positioning protrusion 32 Through hole 36 Positioning recessed part 50 Heat radiation member

Claims (7)

A plurality of LEDs, and a printed wiring board to which the plurality of LEDs are electrically connected, and each of the plurality of LEDs includes a light emitting portion covered with a resin, and a lead extending from the light emitting portion. The printed wiring board includes a plurality of through holes corresponding to the leads of the plurality of LEDs, and the leads of the plurality of LEDs are connected to the plurality of through holes of the printed wiring board. In the ring illumination device that is inserted into the hole and soldered,
The printed wiring board is configured in a flat plate shape and a ring shape, and an insulating ring-shaped base plate is interposed between the printed wiring board and the light emitting portion of each of the plurality of LEDs, The base plate is provided with a plurality of through holes extending from one surface to the other surface, and on one surface thereof is provided with an inclined surface that is inclined downward inward in the radial direction.
The leads of each of the plurality of LEDs are inserted into the plurality of through holes of the printed wiring board through the plurality of through holes of the base plate and soldered, and the light emitting portion of each of the plurality of LEDs is The ring illumination device is supported in a substantially vertical direction on the inclined surface of the base plate.   The ring-shaped recessed part for accommodating the solder sucked up to the single side | surface through the said several through-hole of the said printed wiring board is provided in the other surface of the said base plate. Ring-shaped lighting device.   The ring-shaped illuminating device according to claim 1 or 2, wherein a tapered portion that extends outward is provided at an opening end portion of each of the plurality of through holes on the inclined surface side of the base plate. .   The ring illumination device according to any one of claims 1 to 3, wherein the base plate and the printed wiring board are each provided with positioning means for positioning them by overlapping each other. .   The positioning means includes a positioning protrusion or recess provided on the base plate, and a positioning recess or protrusion provided on the printed wiring board that is mutually engaged with the positioning protrusion or recess. The ring-shaped illuminating device according to claim 4, comprising:   A housing for holding the base plate and the printed wiring board is further provided, and a heat radiating member having flexibility is interposed between the other surface of the printed wiring board and the housing, and the plurality of LEDs The ring-shaped illuminating device according to claim 1, wherein a tip end portion of each of the leads is in thermal contact with the heat radiating member. A plurality of LEDs, an insulating ring-shaped base plate that supports the plurality of LEDs, and a printed wiring board to which the plurality of LEDs are electrically connected,
Each of the plurality of LEDs has a light emitting portion covered with a resin and a lead extending from the light emitting portion, the printed wiring board is configured in a flat plate shape and a ring shape, A plurality of through holes are provided corresponding to the leads of each of the plurality of LEDs, the base plate is provided with a plurality of through holes extending from one surface to the other surface, and one surface has a radial direction. A method of manufacturing a ring-shaped illumination device provided with an inclined surface that inclines downward toward the inside,
Bending the leads of each of the plurality of LEDs, cutting the leads of each of the plurality of LEDs to a predetermined length, the plurality of through holes in the base plate, and the printed wiring board. A step of matching a plurality of through holes, a step of superimposing the other side of the base plate and one side of the printed wiring board so as to face each other, and the light emission of each of the plurality of LEDs Supporting the portion on the inclined surface of the base plate, and inserting the leads of the plurality of LEDs into the plurality of through holes of the base plate and the plurality of through holes of the printed wiring board, And a step of soldering the lead inserted into the through hole and the through hole to the through hole.

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