JP2008071954A - Light source device - Google Patents

Abstract

A light source device having excellent heat dissipation and heat resistance is provided.
A light source device includes a case, an element mounting substrate, and an exit window plate. The case 2 is made of a metal having thermal conductivity, and has an opening 5 penetrating from the bottom 2a toward the surface 2b. The bottom 2a side of the opening 5 forms a substrate housing recess 6. The element mounting substrate 3 is made of a material having thermal conductivity, and the semiconductor light emitting element 11 is mounted on the surface 3 a, and is housed and fixed in the substrate housing recess 6 so that the semiconductor light emitting element 11 faces the opening 5. The exit window plate 4 is fixedly opposed to the element mounting substrate 3 so as to form a gap 12 in the opening 5. In the gap portion 12, a silicone gel 37 containing a phosphor 36 is enclosed.
[Selection] Figure 4

Description

  The present invention relates to a light source device capable of efficiently emitting light from a semiconductor light-emitting element, and particularly suitable as a power LED (LED: Light Emitting Diode) having excellent heat resistance and heat dissipation and high light extraction efficiency. It relates to the device.

  LEDs (light emitting diodes) are attracting attention as next-generation lighting because they do not consume extra heat and have an extremely long life compared to display bulbs and fluorescent lamps. For example, mobile phones and digital video cameras Widely used for display of electronic devices such as backlights of PDAs and other electronic devices, large displays, and road indicators.

  The light emission principle of a light emitting diode is that an n-type semiconductor to which an impurity (donor) for supplying electrons is added and a p-type semiconductor to which an impurity (acceptor) for supplying holes is added are joined (pn junction), and an anode (anode ) And the cathode (cathode), the voltage is applied in the forward direction. At this time, electrons and holes injected from the electrode into the semiconductor flow through different energy bands (conduction band and valence band) and recombine beyond the forbidden band near the PN junction. The energy corresponding to the forbidden band width (band gap) is emitted as photons, that is, light. In addition, the wavelength (color) of the emitted light is related to the band gap of the material forming the pn junction. Therefore, the band gap corresponding to the wavelength ranging from near infrared rays, visible light, and ultraviolet rays is selected depending on the application. A semiconductor material is used.

A light emitting body (LED chip) of an LED generally has a hexahedral shape (die shape) with an area of the upper surface of the chip of about 0.1 mm ² , and is small, has a small amount of light emission, and is close to a point light source. Has optical properties. Therefore, in designing and manufacturing an LED using an LED chip having such characteristics as a light source, the ratio of the amount of light emitted from the LED chip to the amount of light emitted from the active layer of the LED chip (external quantum efficiency). ) And the light emitted from the LED chip and emitted to the outside of the LED is collected in one direction to increase the on-axis luminous intensity of the LED.

In recent years, as a new LED, development of a large-sized power LED capable of supplying large power has been promoted. This power LED is a large LED chip with an area of the upper surface of the chip of 0.6 mm ² or more, which reduces the thermal resistance of the package so that a large current exceeding 200 mA can be input. It has become. This power LED is expected to be replaced with a light bulb, and deployed to industrial devices, analyzers, medical devices, and the like. Also in this power LED, a transparent substrate type power LED in which an InGaAlP-based material is used for an active layer and a transparent GaP substrate is bonded has been put into practical use (for example, see Patent Document 1 below).

  Further, various light source devices using a color conversion material for converting the light from this type of LED into a desired color and emitting it have been proposed. FIG. 24 is a cross-sectional view of a light source device disclosed in Patent Document 2 below as an example of a light source device using this type of color conversion material.

As shown in FIG. 24, a light source device 51 disclosed in Patent Document 2 is obtained by attaching a lamp house 55 on a printed circuit board 54 in which a circuit conductor 53 is formed on a substrate 52 made of an insulating base material. The lamp house 55 is provided with a cup 56 having a reflective surface, and a blue LED chip 58 that emits blue light is fixed to a bottom surface 57 of the cup 56. The electrodes formed on the LED chip 58 and the circuit conductor 53 formed on the printed circuit board 54 are individually connected by bonding wires 59. The cup 56 of the lamp house 55 is filled with a silicone resin 61 in which a color conversion material 60 is dispersed.
JP 2004-128041 A Japanese Patent Laid-Open No. 2005-229048

  By the way, a conventionally known light source device includes a case in which a resin is inserted into a metal lead frame and insert-molded, and this resin forms a case. At that time, as the resin to be inserted into the lead frame, for example, an organic material containing carbon such as PBT resin or PPA resin has been generally used.

  However, since the resin used in this type of conventional light source device uses an organic material containing carbon, it lacks durability due to heat. For this reason, when the light source device is made to function as a power LED, the input voltage becomes larger than that of a general LED, so that a larger amount of thermal energy is generated, and this thermal energy causes deterioration of the resin portion. There is a problem that it does not function as a light source device.

  In addition, the light output of the LED increases as the wavelength of the emitted light becomes shorter, such as blue or near ultraviolet. For this reason, in the conventional light source device, in addition to insufficient heat resistance, there is a problem that the molded resin is likely to deteriorate. In addition, since the heat dissipation structure of the element is insufficient in the structure of the conventional light source device, the heat generated from the element cannot be sufficiently dissipated during driving, and the deterioration of the element is accelerated by this trapped heat. was there. For this reason, when making a light source device function as power LED, provision of the light source device excellent in heat resistance and heat dissipation was desired.

  Further, in a conventional light source device, for example, a semiconductor light emitting element mounted on a lead frame or a substrate is generally a so-called face-up mounting in which wiring connection is performed by wire bonding. For this reason, there is a possibility that extra stress is applied to the wire by the resin material filled on the wire-bonded semiconductor light emitting element, and the wire is cut and damaged.

  Conventionally, when a light source device is configured using a plurality of LEDs having the same light emission color, color unevenness occurs if the LEDs do not emit light evenly. Therefore, the LEDs are preliminarily set according to the degree of color variation for each light emission color. The operation | work which classify | categorizes for every group was performed, and LED of the same group was mounted in the light source device.

  When the light source device is configured using the color conversion material 60 as in the light source device 51 of FIG. 24, in addition to the above-described prior LED classification, adjustment of the amount of phosphor mixed into the resin to be filled is performed. I was going.

  However, in the light source device using this type of color conversion material, the color of the color conversion light is determined by the combination of the light emission color of the LED and the color conversion material. Color variation also occurs in the color-converted light that is finally emitted depending on the thickness of the resin and how the color conversion material is mixed with the filling resin.

  However, in the conventional light source device including the light source device 51 of FIG. 24, since the resin in which the color conversion material is dispersed and mixed is filled, the thickness of the filling resin including the color conversion material is difficult to be uniform, and the desired color is not obtained. It was difficult to obtain color converted light.

  In addition, the color conversion light varies depending not only on the thickness of the filling resin containing the color conversion material described above but also on how the color conversion material is mixed with the filling resin and the type of the color conversion material. Color conversion light could not be obtained. In addition, in the conventional configuration including the light source device 51 of FIG. 24, the filling resin containing the color conversion material cannot be handled as one component. For this reason, in order to obtain uniform color-converted light of a desired color, the light source device as a finished product must be classified, and there is a problem in that there are many useless finished products.

  The present invention has been made in order to solve the above-described problems, and has an object to provide a light source device that is excellent in heat resistance and heat dissipation and is particularly suitable as a power LED.

A light source device according to claim 1 of the present invention is a light source device that mounts a semiconductor light emitting element and emits light from the semiconductor light emitting element to the outside.
A substrate made of a material having thermal conductivity, the semiconductor light-emitting element placed on a surface pattern,
It is made of a metal having thermal conductivity, has an opening that penetrates from the bottom toward the surface, and accommodates the substrate on the bottom side of the opening so that the semiconductor light emitting element faces the opening. And a case in which a recessed portion to be fixed is formed.

The light source device according to claim 2 is the light source device according to claim 1,
An emission window plate having translucency is fixed to the case so as to face the substrate so as to form a gap in the opening.
The case is formed with a through hole facing the gap,
A phosphor-containing silicone gel for color-converting light from the semiconductor light emitting element is sealed in the gap from the through hole, and the through hole is sealed.

The light source device according to claim 3 is the light source device according to claim 1,
A color conversion plate containing a phosphor for color-converting light from the semiconductor light emitting element is fixed to the case so as to face the substrate so as to form a gap in the opening.
The case is formed with a through hole facing the gap,
A transparent silicone gel is sealed in the gap from the through hole, and the through hole is sealed.

The light source device according to claim 4 is the light source device according to claim 3,
The color conversion plate is characterized in that a phosphor is dispersed and mixed in silicone rubber or silicone resin to have a uniform thickness.

The light source device according to claim 5 is the light source device according to claim 3,
The color conversion plate includes a pair of transparent plates disposed to face each other,
A frame-shaped spacer member fixed between the pair of transparent plates so as to form a space sealed in an even thickness,
A phosphor is attached to a wall surface through which light in the space is transmitted.

The light source device according to claim 6 is the light source device according to claim 3,
The color conversion plate includes a pair of transparent plates disposed to face each other,
A frame-shaped spacer member fixed between the pair of transparent plates so as to form a space portion hermetically sealed with a uniform thickness, and having a through hole that leads to the space portion;
Silicone gel in which a phosphor is dispersed and mixed is sealed from the through hole into the space, and the through hole is sealed.

The light source device according to claim 7 is the light source device according to claim 6,
The spacer member is made of a screen printing layer.

The light source device according to claim 8 is the light source device according to any one of claims 3 to 7,
Fine convex and / or concave dot portions are formed on the light exit surface of the color conversion plate.

The light source device according to claim 9 is the light source device according to any one of claims 1 to 8,
The case is characterized in that a radiating fin for radiating heat generated during light emission driving of the semiconductor light emitting element from the substrate to the outside through the case is integrally formed.

  A light source device according to a tenth aspect is characterized in that the light source device according to any one of the first to ninth aspects is planarly mounted on a heat sink in a line shape or a matrix shape.

  According to the light source device of the present invention, since the substrate on which the semiconductor light emitting element is mounted and the case for housing and fixing the substrate are made of a material having thermal conductivity, heat generated when the semiconductor light emitting element is driven to emit light is generated. It can be discharged from the substrate to the outside through the case. Thereby, large power can be input to the semiconductor light emitting element, and a light source device as a power LED can be provided.

  If a metal with high mechanical strength and good workability, thermal conductivity, and light reflectivity is selected as the case for housing and fixing the substrate, the three functions of the substrate housing function, reflector function, and heat dissipation function are provided. It can be realized with one component.

  Furthermore, according to the structure in which the gel material (phosphor-containing silicone gel or transparent silicone gel) is sealed in the gaps on the semiconductor light emitting device, even when the face-up mounting by wire bonding is adopted, excessive stress is applied to the wire. The wire can be prevented from being broken without being added. As a result, it is possible to provide both a face-up mounting and a flip-chip mounting and provide a low stress and highly reliable device. In addition, if a gel material (silicone gel) having fluidity is used as the material in which the phosphor is mixed, the phosphor can be mixed uniformly with the gel material to reduce variations.

  Further, according to the configuration using the color conversion plate, the color conversion plate can be easily handled as one component. Before the light source device is completed, the color conversion plate is provisionally mounted on the light source device and the semiconductor light emitting element is driven to emit light, thereby subdividing the excitation wavelength, and pre-adjusting the color conversion plate for each group according to the degree of variation. Therefore, it is possible to supply an optimum product according to the wavelength of the semiconductor light emitting element and for each application.

  As a color conversion plate, in a configuration in which a silicone gel containing a phosphor is sealed in a space formed between a pair of transparent plates and a frame-shaped spacer member, water vapor permeates into the space even if a silicone gel is used. And high yield strength and high reliability in a high temperature and high humidity environment.

  In addition, as a color conversion plate, in a configuration in which a phosphor is attached to a wall surface through which light in the space is transmitted or a silicone gel containing a phosphor is sealed in the space, the thickness of the space is a pair of transparent plates and a frame shape. The spacer member always maintains a constant thickness, so that there is little variation in excitation wavelength.

  Furthermore, if the spacer member is formed of a screen printing layer as a color conversion plate, it can be produced using an existing established screen printing technique, and mass productivity can be improved.

  Further, if a fine convex or concave dot portion is formed on the light exit surface of the color conversion plate, the extraction efficiency of the color converted light can be improved by refraction and reflection at the dot portion.

  And if it is set as the structure which mounts a some light source device in the shape of a line or a matrix on a heat sink, the plane light source of the desired light emission area can be obtained. Further, heat generated for each light source device when the semiconductor light emitting element is driven to emit light can be efficiently released to the outside through a common heat sink.

Hereinafter, the best mode of the present invention will be described in detail with reference to the accompanying drawings.
1 is a plan view of a first embodiment of a light source device according to the present invention, FIG. 2 is a side view of FIG. 1, FIG. 3 is a cross-sectional view taken along line AA in FIG. 5 is a circuit diagram showing an example of a connection configuration of semiconductor light emitting elements, FIG. 6 is a plan view of a second form of the light source device according to the present invention, FIG. 7 is a bottom view of FIG. 6, and FIG. 9 is a rear view of FIG. 6, FIG. 10 is a cross-sectional view taken along the line CC of FIG. 6, FIG. 11 is a cross-sectional view taken along the line DD of FIG. FIG. 13 is a cross-sectional view taken along line EE of FIG. 12, FIG. 14 is a cross-sectional view taken along line FF of FIG. 12, and FIG. 15 is a case where a plurality of light source devices according to the present invention are mounted on a heat sink. 16 is a partial plan view showing an example, FIG. 16 is a sectional view taken along the line GG of FIG. 15, FIG. 17 is a diagram showing an example of a color conversion plate employed in the light source device of the third embodiment, and FIGS. c) Light source device of the third form FIG. 19A to FIG. 19C are explanatory diagrams of the manufacturing process of the color conversion plate of FIG. 18, and FIG. 20 is adopted in the light source device of the third embodiment. FIG. 21 is a partial sectional view of the color conversion plate of FIG. 20, and FIG. 22 is another configuration example of the color conversion plate employed in the light source device of the third embodiment. FIG. 23 is a partial cross-sectional view showing another configuration example of the color conversion plate employed in the light source device of the third embodiment.

  First, the configuration of the light source device 1 (1A) according to the first embodiment will be described with reference to FIGS. As shown in FIGS. 1 to 4, the light source device 1 (1 </ b> A) of the first form is roughly configured to include a case 2, an element mounting substrate 3, and an exit window plate 4 that form a main body.

  The case 2 is made of a metal material having good thermal conductivity such as copper (Cu), aluminum (Al), stainless steel, or the like. In addition, when copper (Cu) is selected as the metal material of the case 2, at least a wall surface portion of the opening 5 described later is subjected to a treatment such as Ni plating or Ag plating to improve the reflectance. The case 2 has a housing function for housing the element mounting board 3, a reflector function for reflecting light from the semiconductor light emitting element mounted on the element mounting board 3 and efficiently emitting the light to the outside, and driving the semiconductor light emitting element It has a heat dissipation function to dissipate the heat. The case 2 is formed into a predetermined shape using a known method such as press working, die casting, or diffusion bonding in order to realize the above functions.

  As shown in FIGS. 3 and 4, the case 2 is formed with a rectangular opening 5 penetrating with a step from the bottom 2 a toward the surface 2 b. On the bottom 2a side of the opening 5, a substrate housing recess 6 for housing and fixing the element mounting substrate 3 is formed.

  As shown in FIGS. 1 and 3, rectangular window holes 7 are formed at both ends in the longitudinal direction of the case 2. From this window hole 7, a pair of electrodes 9 (9a, 9b) of the element mounting substrate 3 to be described later are exposed.

  Further, as shown in FIG. 2, a through-hole 8 is formed on one side surface of the case 2 (on the right side surface in the example of FIG. 2) so as to face the gap 12 described later.

  In FIG. 1, attachment pieces 9 for fixing the light source device 1 </ b> A to a heat radiating plate 15 to be described later are integrally formed with the bottom 2 a at four positions in the longitudinal direction of the case 2. Each attachment piece 9 is formed with a receiving portion 9a cut out in a substantially semicircular arc. The receiving portion 9a is formed in accordance with the diameter of the screw portion of the mounting screw 16 used when the light source device 1A is fixed to the heat radiating plate 15 described later.

The element mounting substrate 3 is made of a material having good thermal conductivity, such as aluminum nitride (AlN), LTCC containing a large amount of glass components, and alumina ceramics (Al ₂ O ₃ ). A wiring pattern (not shown) having a predetermined shape is formed on the surface 3 a of the element mounting substrate 3 according to the circuit configuration. This wiring pattern is formed by stacking, for example, titanium (Ti), platinum (Pt), and gold (Au) in this order.

  As shown in FIG. 1, an anode electrode 10 a and a cathode electrode 10 b forming a pair of electrodes 10 are formed to face each other at both ends in the longitudinal direction of the element mounting substrate 3. The pair of electrodes 10 (the anode electrode 10a and the cathode electrode 10b) are connected to a wiring pattern (not shown).

  Further, a number of semiconductor light emitting elements (LEDs) 11 corresponding to the circuit configuration are mounted on a wiring pattern (not shown). In the example of FIG. 1, twelve semiconductor light emitting elements 11 are mounted and fixed in a staggered manner in the longitudinal direction of the element mounting substrate 3, and the three semiconductor light emitting elements 11 are formed so as to form the circuit shown in FIG. 5. Are connected in series, and four sets of semiconductor light emitting element groups are interconnected via a wiring pattern (not shown) between the anode electrode 10a and the cathode electrode 10b.

  Note that the light source device 1 of this example includes face-up mounting in which wiring connection is made between the terminals of the semiconductor light emitting element 11 and the wiring pattern using wire bonding, and bumps (projections) arranged in an array on the back surface of the semiconductor light emitting element 11. It corresponds to any flip chip mounting which is connected to the wiring pattern by a terminal.

  Further, a Zener diode connected in parallel with the semiconductor light emitting element group between the anode electrode 10a and the cathode electrode 10b in FIG. 5 may be connected in parallel for each semiconductor light emitting element group or for each semiconductor element 11.

  The element mounting substrate 3 is accommodated so that the semiconductor light emitting element 11 faces the opening 5 and the pair of electrodes 10 are exposed from the window hole 7 so that the back surface 3b is flush with the bottom 2a of the case 2. It is housed and fixed in the recess 6.

  The exit window plate 4 is made of a light-transmitting material such as a rectangular transparent glass so that the light from the semiconductor light emitting element 11 is transmitted and emitted to the outside. The exit window plate 4 protrudes toward the surface 2b of the case 2 so as to face the element mounting substrate 3 so as to cover the surface of the opening 5 of the case 2 and form a gap 12 in the opening 5. Established.

  A special thermally conductive silicone gel is used for fixing the case 2 and the element mounting substrate 3, fixing the case 2 and the emission window plate 4, and fixing the light source device 1 to the heat sink 15 described later. This special heat conductive silicone gel is made of a silicone gel mixed with diamond powder at a predetermined ratio.

  As shown in FIGS. 3 and 4, in the gap portion 12, a silicone gel 37 in which a phosphor 36 for color-converting light from the semiconductor light emitting element 11 is dispersed and mixed in a predetermined ratio is sealed from the through hole 8. The through hole 8 is sealed in a state in which the inside of the gap 12 is filled with the silicone gel 37 containing the phosphor 36.

  For the phosphor 36 dispersed and mixed in the silicone gel 37, a material that can obtain desired color conversion light is selected depending on the combination with the semiconductor light emitting element 11. For example, in order to obtain white light as color-converted light, when the semiconductor light emitting device 11 made of a material that emits blue light (InGaN-based compound) or a material that emits near ultraviolet light is used, an orange fluorescent pigment or an orange fluorescent dye is used as the phosphor 36. Selected.

More specifically, the fluorescent material 36 is preferably an inorganic phosphor, and color-converts (wavelength-converts) the light incident from the semiconductor light emitting element 11. As a material suitable as the inorganic phosphor constituting the fluorescent material 36, for example, A ₃ B ₅ O ₁₂ : M phosphor (A: Y, Gd, Lu, Tb, B: Al, Ga, M: Ce ³⁺ , Tb ³⁺ , Eu ³⁺ , Cr ³⁺ , Nd ³⁺ or Er ³⁺ ), rare earth-doped barium-aluminum-magnesium compound phosphor (BAM phosphor), Y ₂ O ₂ S: Eu ³⁺ And sulfide-based compound phosphors typified by ZnS: Cu, Al or the like, or rare earth such as (Sr, Ca) S: Eu ²⁺ , CaGa ₂ S ₄ : Eu ²⁺ or SrGa ₂ S ₄ : Eu ²⁺ Doped thiogallate phosphor, phosphor containing at least one composition of aluminate such as TbAlO ₃ : Ce ³⁺ , or YAG such as (Y, Gd) ₃ (Al, Ga) ₅ O ₁₂ Orange made of yttrium, aluminum, garnet) There are fluorescent pigments and orange fluorescent dyes.

  Moreover, in order to assist reflection of each inorganic phosphor, excitation light, and wavelength-converted light, for example, scattering materials such as barium sulfate, magnesium oxide, and silicon oxide may be mixed as necessary. Further, a mixed inorganic phosphor in which a plurality of inorganic phosphors having different characteristics are mixed may be used.

  Next, the configuration of the light source device 1 (1B) according to the second embodiment will be described with reference to FIGS. In addition, the same number is attached | subjected to the same or equivalent component as 1 A of light source devices of 1st form, and the description is abbreviate | omitted.

  As shown in FIGS. 6 to 11, the light source device 1 (1 </ b> B) of the second form is the same as the light source device 1 </ b> A of the first form described above, the case 2, the element mounting substrate 3, and the emission window plate 4. It is comprised roughly with. This light source device 1B of the second form is similar to the light source device 1A of the first form. Silicone containing a phosphor 36 is inserted into the gap 12 between the element mounting substrate 3 fixed to the case 2 and the emission window plate 4. The gel 37 is sealed. Below, only the structure different from the light source device 1A of the first embodiment will be described.

  First, in the light source device 1B of the second form, the exit window plate 4 faces the element mounting substrate 3 in the plate receiving recess 13 formed in the opening 5 so as to be flush with the surface 2b of the case 2. It is fixed. Further, as shown in FIG. 6 to FIG. 8, the heat generated when the semiconductor light emitting element 11 is driven to emit light is released from the element mounting substrate 3 to the outside through the case 2 at the upper and lower positions in the longitudinal direction of the case 2. The fins 14 are integrally formed.

  Next, the configuration of the light source device 1 (1C) according to the third embodiment will be described with reference to FIGS. In addition, the same number is attached | subjected to the component which is the same as that of the light source device 1A of 1st form, and the light source device 1B of 2nd form, or equivalent, and the description is abbreviate | omitted.

  As shown in FIGS. 12 to 14, the light source device 1 (1 </ b> C) of the third embodiment is schematically configured by including a case 2, an element mounting substrate 3, and a color conversion plate 31 that form a main body. That is, the first and second light source devices 1A and 1B seal the phosphor gel 36 containing silicone gel 37 in the gap 12 between the element mounting substrate 3 fixed to the case 2 and the exit window plate 4. In contrast, in the light source device 1 </ b> C of the third form, the element mounting substrate 3 and the color conversion plate 31 are fixed to the opening 5 so that the gap 12 is formed in the opening 5 of the case 2. The transparent silicone gel 15 is sealed in the gap 12.

  More specifically, in the light source device 1 </ b> C of the third embodiment, the element mounting substrate 3 is fixed so that the element mounting substrate 3 is fixed from the bottom 2 a of the case 2 to the opening 5 and the gap portion 12 is formed in the opening 5. The color conversion plate 31 is fixed to the plate receiving recess 16 formed in the opening 5 from the surface 2 b of the case 2.

  In the gap portion 12, a transparent silicone gel 15 is sealed from the through hole 8. The through hole 8 is sealed in a state where the space 12 is filled with the transparent silicone gel 15.

  Here, the configuration of the color conversion plate 31 employed in the light source device 1 </ b> C of the third embodiment will be described in detail with reference to FIGS. 17 to 23.

  First, the color conversion plate 31 (31A) shown in FIG. 17 is formed in a rectangular (rectangular) flat plate shape with a uniform thickness by dispersing and mixing the phosphor 36 described above into silicone rubber or silicone resin. The thickness of the color conversion plate 31A is preferably formed to a uniform thickness within a range of 0.3 to 1.5 mm in consideration of color conversion efficiency. In the color conversion plate 31A, one surface (back surface) is a light incident surface 31a from the semiconductor light emitting element, and the other surface (front surface) is a light emitting surface 31b that emits color converted light.

  The color conversion plate 31A configured as described above can be handled as a single component and can be used in the light source device 1 of the third embodiment. The color conversion plate 31A is placed in the plate receiving recess 16 before the light source device 1 is completed. To temporarily implement. If the semiconductor light emitting device is driven to emit light in this state, the color conversion light generated by mixing the light emission color of the semiconductor light emitting device itself and the light subjected to color conversion by the phosphor in the color conversion plate 31A is emitted from the color conversion plate 31A. The light is emitted from the surface 31b to the outside.

  If the operation of temporarily mounting the color conversion plate 31A and driving the semiconductor light emitting element to emit light is repeated for each light source device 1 by replacing the color conversion plate 31A, the excitation wavelength is subdivided before the light source device 1 is completed. Further, classification can be made in advance for each group according to the degree of variation. Thereby, color conversion board 31A can be classified beforehand for every luminescent color obtained by combination with a semiconductor light emitting element mounted in light source device 1. Then, it is possible to mount a color conversion plate 31A from which desired color conversion light can be obtained when the light source device 1 is completed.

  Next, the color conversion plate 31 (31B) shown in FIGS. 18 and 19 includes a pair of transparent plates 32 and 32 and a spacer member 33.

  The pair of transparent plates 32 (32A, 32B) has a flat plate shape of the same shape (rectangular shape in the examples of FIGS. 18 and 19), and is made of transparent glass such as borosilicate glass having a predetermined refractive index. The transparent plates 32A and 32B can be freely selected to some extent from those close to the refractive index of the silicone gel 37 to those having a high refractive index of 1.8. Further, the transparent plates 32A and 32B can be made of glass having different refractive indexes depending on the application.

  The spacer member 33 is made of, for example, transparent glass made of the same material as the transparent plates 32A and 32B, has an outer dimension substantially the same as that of the transparent plates 32A and 32B, and has a predetermined shape (in the example of FIGS. It is formed in a frame shape having an opening 33a penetrating in a rectangular shape. Further, the spacer member 33 is fixed in a state where the opening 33a is sandwiched between the pair of transparent plates 32A and 32B from both sides so as to form a space portion 34 that is hermetically sealed with a uniform thickness. Further, at least one through hole 35 (two in the example of FIGS. 18 and 19) that communicates with the space 34 is formed at a predetermined location on the side surface 33b of the spacer member 33.

  In addition, the spacer member 33 can also be comprised not only with transparent glass but with transparent resin. Further, the spacer member 33 does not necessarily have transparency.

  A silicone gel 37 having a predetermined viscosity (for example, 800 mPa · s) in which a phosphor 36 is dispersed and mixed is formed in a sealed space portion 34 of uniform thickness formed by the pair of transparent plates 32A and 32B and the spacer member 33. It is enclosed.

  In addition, it is preferable that the dimension in the thickness direction of the space portion 34 is a uniform dimension within the range of 0.3 to 1.5 mm in consideration of the color conversion efficiency. Further, as described above, the phosphor 36 dispersed and mixed in the silicone gel 37 is selected from a material that can obtain a desired color conversion light in combination with the semiconductor light emitting element. For example, when a blue light emitting material (InGaN compound) or a semiconductor light emitting element made of near ultraviolet light is used to obtain white light as color conversion light, an orange fluorescent pigment or an orange fluorescent dye is selected as the phosphor 6. Is done.

  In the color conversion plate 31B, the back surface of one transparent plate 32A is a light incident surface 31a from the semiconductor light emitting element, the surface of the transparent plates 32A and 32B on the spacer member 33 side is a light transmitting surface 31c, and the other transparent plate is transparent. The surface of the plate 32B is a light emitting surface 31b that emits color-converted light.

  When assembling the color conversion plate 31B having the above-described configuration, as shown in FIG. 19A, the frame-shaped spacer member 33 having the through holes 35 formed at two locations on the side surface 33b is replaced with the transparent plate 32A and the transparent plate 32B. Place between. Then, as shown in FIG. 19B, a pair of transparent plates 32A is formed so that a sealed space 34 having a uniform thickness (preferably a uniform thickness within a range of 0.3 to 1.5 mm) is formed. , 32B and the spacer member 33 are fixed by optical bonding or the like. Thereafter, the two through holes 35 of the spacer member 33 are installed so as to be on the upper surface, and the silicone gel 37 containing the phosphor 36 is injected into the space portion 34 from the one through hole 35. The silicone gel 37 containing the phosphor 36 is injected until the silicone gel 37 containing the phosphor 36 overflows from the other through hole 35. And after injection | pouring of this silicone gel 37 containing the fluorescent substance 36, the two through-holes 35 are adhere | attached and sealed, for example with an ultraviolet curable resin. As a result, a color conversion plate 31B as shown in FIGS. 18 and 19C is completed.

  The color conversion plate 31B having the above-described configuration can be handled as one component and can be used for the light source device 1 of the third embodiment. Like the color conversion plate 31A of FIG. The color conversion plate 31B is placed in the plate receiving recess 16 and temporarily mounted. If the semiconductor light emitting device is driven to emit light in this state, the color conversion light generated by mixing the light emission color of the semiconductor light emitting device itself and the light whose color is converted by the phosphor 36 in the color conversion plate 31B is emitted from the color conversion plate 31B. The light is emitted to the outside from the emission surface 31b.

  Then, if the operation of temporarily mounting the color conversion plate 31B and driving the semiconductor light emitting element to emit light is repeated for each light source device 1 by replacing the color conversion plate 31B, the excitation wavelength is subdivided before the light source device 1 is completed. Further, classification can be made in advance for each group according to the degree of variation. Thereby, the color conversion board 31B can be classified beforehand for every luminescent color obtained by the combination with the semiconductor light-emitting element mounted in the light source device 1. And the color conversion board 31B from which desired color conversion light is obtained when completing the light source device 1 can be mounted.

  Moreover, although the silicone gel 37 which is easy to deteriorate under high temperature and high humidity that allows water vapor to pass well is used, the silicone gel 37 containing the phosphor 36 is sealed in a space 34 sealed by the pair of transparent plates 32A and 32B and the spacer member 33. Since the structure is sealed, there is no permeation of water vapor, and high durability and high reliability can be obtained even in a high temperature and high humidity environment.

  Further, the silicone gel 37 containing the phosphor 36 sealed in the space 34 is configured to always maintain a uniform thickness with good color conversion efficiency (a uniform thickness within a range of 0.3 to 1.5 mm). There is little variation.

  Next, in the color conversion plate 31 (31C) shown in FIG. 20 and FIG. 21, the spacer member 33 located between the pair of transparent plates 32A and 32B is formed of a frame-like screen printing layer made of glass frit. Further, a through hole 35 is formed in an unformed portion of the frame-shaped screen printing layer. In addition, the same number is attached | subjected to the component same as the color conversion board 31B shown in FIG.18 and FIG.19, and the description is abbreviate | omitted.

  When assembling the color conversion plate 31C having the above-described configuration, the glass frit is screen-printed in a state in which the positions where the through holes 35 of the pair of transparent plates 32A and 32B are formed and the positions where the space portions 34 are formed are masked. Thus, a frame-shaped screen printing layer (spacer member 33) is formed. The screen print layer has a uniform thickness (preferably within a range of 0.3 to 1.5 mm) when the sealed space portion 34 is formed by overlapping the screen print layers formed on the pair of transparent plates 32A and 32B. Of uniform thickness), and multilayer printing may be performed as necessary. Then, the pair of transparent plates 32A and 32B on which the screen printing layer is formed are baked under a predetermined condition (for example, 120 ° C. for 10 minutes) and temporarily baked. Thereafter, the screen print layers of the pair of transparent plates 32A and 32B are faced to form a sealed space 34 having a uniform thickness (preferably a uniform thickness within a range of 0.3 to 1.5 mm). Then, the pair of transparent plates 32A and 32B are superposed and baked under a predetermined condition (for example, 580 ° C.). Subsequently, the silicone gel 37 containing the phosphor 36 is injected from the through hole 35, and the through hole 35 is adhered and sealed with, for example, an ultraviolet curable adhesive. Thereby, a color conversion plate 31C as shown in FIG. 5 is completed. For the pair of transparent plates 32A and 32B, a material that matches the linear expansion coefficient of both is selected.

  The screen printing layer as the spacer member 33 has a uniform thickness on each of the pair of transparent plates 32A and 32B so that a predetermined thickness (preferably a uniform thickness within a range of 0.3 to 1.5 mm) is obtained. Alternatively, it may be formed only on one transparent plate 32A or 32B.

  The color conversion plate 31C having the above-described configuration can be handled as one component and can be used in the light source device 1 of the third embodiment. Like the color conversion plates 31A and 31B described above, the color conversion plate 31C can be used before the light source device 1 is completed. The color conversion plate 31C is placed in the receiving recess 16 and temporarily mounted. If the semiconductor light emitting element is driven to emit light in this state, the color conversion light obtained by mixing the emission color of the semiconductor light emitting element itself and the light whose color has been converted by the phosphor 36 in the color conversion plate 31C is emitted from the color conversion plate 31C. The light is emitted to the outside from the emission surface 31b.

  If the operation of temporarily mounting the color conversion plate 31C and driving the semiconductor light emitting element to emit light is repeated for each light source device 1 by replacing the color conversion plate 31C, the excitation wavelength is subdivided before the light source device 1 is completed. Further, classification can be made in advance for each group according to the degree of variation. Thereby, the color conversion board 31C can be classified in advance for each emission color obtained by the combination with the semiconductor light emitting element mounted on the light source device 1. Then, it is possible to mount a color conversion plate 31C from which desired color converted light can be obtained when the light source device 1 is completed.

  Moreover, although the silicone gel 37 which is easy to deteriorate under the high temperature and high humidity which allows water vapor to pass well is used, the phosphor 36 is provided in the space 34 sealed by the pair of transparent plates 32A and 32B and the spacer member 33 by the screen printing layer. Since the silicone gel 37 is sealed, there is no permeation of water vapor, and high durability and high reliability can be obtained even in a high temperature and high humidity environment.

  Further, the silicone gel 37 containing the phosphor 36 sealed in the space 34 is configured to always maintain a uniform thickness with good color conversion efficiency (a uniform thickness within a range of 0.3 to 1.5 mm). There is little variation.

  Next, the color conversion plate 31 (31D) shown in FIG. 22 is a pair of transparent plates that form a sealed space portion 34 having a uniform thickness (preferably a uniform thickness within a range of 0.3 to 1.5 mm). Only the phosphor 36 is applied in advance to the inner surfaces (light transmission surfaces 31c) of 32A and 32B, and an inert gas is sealed from the through hole 35 into the space 34 as necessary. Adhere with resin and seal. In addition, the same number is attached | subjected to the component same as the color conversion board 31B of FIG.18 and FIG.19, and the description is abbreviate | omitted.

  Similarly to the color conversion plates 31A to 31C described above, the color conversion plate 31D configured as described above can be handled as one component, and the color conversion plate 31D is temporarily mounted in the plate receiving recess 16 to drive the semiconductor light emitting element to emit light. If the operation to be performed is repeated for each light source device 1 by replacing the color conversion plate 31D, the excitation wavelength can be subdivided before the light source device 1 is completed, and classified in advance for each group according to the degree of variation. Thereby, the color conversion board 31D can be classified in advance for each emission color obtained by the combination with the semiconductor light emitting element mounted on the light source device 1. And color conversion board 31D from which a desired color conversion light is obtained when completing the light source device 1 can be mounted.

  Further, according to the color conversion plate 31D, stable color conversion light can be obtained without using unstable silicone in a high temperature and high humidity environment.

  Incidentally, in the configuration of the color conversion plates 31A to 31D described above, as shown in FIG. 23, a dot portion 38 having a fine convex shape may be formed on the light emitting surface 31b. The dot portion 38 is not limited to a fine convex shape, and may be formed by a fine concave shape or a combination of a fine convex shape and a fine concave shape. Thereby, the light color-converted by the color conversion plate 31 can be extracted at the light exit surface 31b by refraction or reflection at the dot portion 38, thereby improving the efficiency.

  Although not shown, the dot portion 38 can be formed on a wall surface in the space portion 34 (light transmission surface 31c, inner wall surface of the spacer member 33), and light can be refracted and reflected in the space portion 34. .

  In addition, the color conversion plates 31A to 31D described above have been described by taking an example in which the appearance shape is a rectangle, but the shape is not limited to a rectangle. For example, various shapes such as a square, a hexagon, and a circle are conceivable, and an optimal shape can be selected as appropriate according to the intended use.

  And the light source device 1 (1A-1C) comprised as mentioned above can be mounted in plane by arranging in multiple numbers on the one heat sink 17, as shown in FIG.15 and FIG.16.

  As shown in FIG. 16, the heat sink 17 is formed with screw holes 17a corresponding to the receiving portions 9a of the mounting pieces 9 of the respective light source devices 1 to be mounted. And when mounting the several light source device 1 in the heat sink 17, the receiving part 9a of the attachment piece 9 of each light source device 1 is aligned with the outer periphery of the screw hole 17a, and the bottom part 2a of the case 2 of each light source device 1 Is fixed with the above-mentioned special heat conductive silicone gel, the mounting screw 18 is screwed into the screw hole 17a from the mounting piece 9 side, and the mounting piece 9 of each light source device 1 is fastened to the heat radiating plate 17 with the mounting screw 18 and fixed. To do.

  15 and 16 show an example in which a plurality of light source devices 1 are mounted in a matrix on the heat dissipation plate 17, but can also be mounted in a line on a plane. Thereby, a planar light source having a desired light emitting area can be obtained with a simple configuration in which the light source device 1 is fixed onto the heat radiating plate 17 and screwed. Further, the heat generated for each light source device 1 when the semiconductor light emitting element 11 is driven to emit light can be efficiently released to the outside through the common heat radiating plate 17.

  Thus, according to the light source device 1 of the present example, the element mounting substrate 3 on which the semiconductor light emitting element 11 is mounted and the case 2 for accommodating and fixing the element mounting substrate 3 are made of a material having good thermal conductivity. Therefore, the heat generated when the semiconductor light emitting element 11 is driven to emit light can be released from the element mounting substrate 3 to the outside through the case 2. Thereby, large power can be input to the semiconductor light emitting element 11, and a light source device as a power LED can be provided.

  Further, since the bottom 2a of the case 2 accommodating and fixing the element mounting substrate 3 is flush with each other, it can be mounted in a plane on a device that requires a light source (for example, a liquid crystal display device) and is exposed to the surface 2b side of the case 2 Power can be driven by supplying power from the electrode 10.

  Further, as the case 2 for housing and fixing the element mounting substrate 3, if a metal having high mechanical strength and good workability, thermal conductivity and light reflectivity is selected, the housing function of the element mounting substrate 3, the reflector function, Three functions of the heat dissipation function can be realized by one component.

  Moreover, since the gel material (silicone gel 37 containing phosphor 36 or transparent silicone gel 15) is sealed in the gap 12 on the semiconductor light emitting element 11, even when face-up mounting by wire bonding is adopted. The wire can be prevented from being damaged without adding extra stress to the wire. As a result, it is possible to provide both a face-up mounting and a flip-chip mounting and provide a device with low stress and high reliability. In addition, since a fluid gel material (silicone gel 37) is used as the material into which the phosphor 36 is mixed, the phosphor 36 can be uniformly mixed with the gel material to reduce variations.

  Furthermore, according to the configuration in which the plurality of light source devices 1 are mounted on the heat radiating plate 17 in a line shape or a matrix shape, a planar light source having a desired light emitting area can be obtained. Further, the heat generated for each light source device 1 when the semiconductor light emitting element 11 is driven to emit light can be efficiently released to the outside through the common heat radiating plate 17.

  And if the structure as shown in FIGS. 17-23 is employ | adopted as the color conversion board 31 like 1 C of light source devices of 3rd form, the color conversion board 31 can be easily handled as one component. Before the light source device 1C is completed, the color conversion plate 31 is temporarily mounted on the light source device 1C and the semiconductor light emitting element 11 is driven to emit light, whereby the excitation wavelength is subdivided, and the color conversion plate 31 according to the degree of variation. Can be classified in advance for each group, so that the optimum one can be supplied according to the wavelength of the semiconductor light emitting element 11 and for each application.

  Further, as shown in FIGS. 18 to 21, a silicone gel 37 containing a phosphor 36 is sealed in a space 34 formed between a pair of transparent plates 32 </ b> A and 32 </ b> B and a frame-shaped spacer member 33. Therefore, even if silicone gel is used, there is no permeation of water vapor to the space 34, and high yield strength and high reliability in a high temperature and high humidity environment can be obtained.

  Further, the phosphor 36 is attached to the wall surface through which light in the space 34 sealed with a uniform thickness by the pair of transparent plates 32A, 32B and the frame-shaped spacer member 33 is transmitted, or the sealed space According to the configuration in which the silicone gel 37 containing the phosphor 36 is enclosed in 34, the thickness of the space 34 is always maintained constant by the pair of transparent plates 32A and 32B and the frame-like spacer member 33. There is little variation in excitation wavelength.

  Also, as shown in FIGS. 20 and 21, if the spacer member 33 is formed of a screen printing layer, it can be produced using an existing established screen printing technique, and mass productivity can be improved.

  Furthermore, as shown in FIG. 23, if a fine convex or concave dot portion 38 is formed on the light emitting surface 31b, the extraction efficiency of the color conversion light can be improved by refraction and reflection at the dot portion 38.

It is a top view of the 1st form of the light source device concerning the present invention. It is a side view of FIG. It is the sectional view on the AA line of FIG. It is the BB sectional view taken on the line of FIG. It is a circuit diagram which shows an example of the connection structure of a semiconductor light-emitting device. It is a top view of the 2nd form of the light source device concerning the present invention. FIG. 7 is a bottom view of FIG. 6. FIG. 7 is a side view of FIG. 6. FIG. 7 is a rear view of FIG. 6. It is CC sectional view taken on the line of FIG. It is the DD sectional view taken on the line of FIG. It is a top view of the 3rd form of the light source device concerning the present invention. It is the EE sectional view taken on the line of FIG. It is the FF sectional view taken on the line of FIG. It is a partial top view which shows an example at the time of mounting the light source device which concerns on this invention in multiple planes on a heat sink. It is the GG sectional view taken on the line of FIG. It is a figure which shows an example of the color conversion board employ | adopted as the light source device of a 3rd form. (A)-(c) It is a figure which shows the other structural example of the color conversion board employ | adopted as the light source device of a 3rd form. (A)-(c) It is explanatory drawing of the manufacturing process of the color conversion board of FIG. It is a figure which shows the other structural example of the color conversion board employ | adopted as the light source device of a 3rd form. It is a fragmentary sectional view of the color conversion board of FIG. It is a fragmentary sectional view which shows the other structural example of the color conversion board employ | adopted as the light source device of a 3rd form. It is a fragmentary sectional view which shows the other structural example of the color conversion board employ | adopted as the light source device of a 3rd form. It is sectional drawing of the conventional light source device using the color conversion material disclosed by patent document 2. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 (1A-1C) Light source device 2 Case 3 Element mounting board | substrate 4 Output window plate 5 Opening part 6 Substrate accommodation recessed part 7 Window hole 8 Through hole 9 Mounting piece 10 Electrode 11 Semiconductor light emitting element 12 Air gap part 13 Plate receiving recessed part 14 Radiation fin DESCRIPTION OF SYMBOLS 15 Silicone gel 16 Plate receiving recessed part 17 Heat sink 18 Mounting screw 31 (31A-31D) Color conversion board 32 Transparent board 33 Spacer member 34 Space part 35 Through-hole 36 Phosphor 37 Silicone gel 38 Dot part

Claims (10)

In a light source device that mounts a semiconductor light emitting element and emits light from the semiconductor light emitting element to the outside,
A substrate made of a material having thermal conductivity, the semiconductor light-emitting element placed on a surface pattern,
It is made of a metal having thermal conductivity, has an opening that penetrates from the bottom toward the surface, and accommodates the substrate on the bottom side of the opening so that the semiconductor light emitting element faces the opening. A light source device comprising a case in which a recessed portion to be fixed is formed. An emission window plate having translucency is fixed to the case so as to face the substrate so as to form a gap in the opening.
The case is formed with a through hole facing the gap,
2. The light source device according to claim 1, wherein a phosphor-containing silicone gel for color-converting light from the semiconductor light emitting element is sealed in the gap from the through hole, and the through hole is sealed. A color conversion plate containing a phosphor for color-converting light from the semiconductor light emitting element is fixed to the case so as to face the substrate so as to form a gap in the opening.
The case is formed with a through hole facing the gap,
2. The light source device according to claim 1, wherein a transparent silicone gel is sealed in the gap from the through hole, and the through hole is sealed. 4. The light source device according to claim 3, wherein the color conversion plate is formed to have a uniform thickness by dispersing and mixing phosphors in silicone rubber or silicone resin. The color conversion plate includes a pair of transparent plates disposed to face each other,
A frame-shaped spacer member fixed between the pair of transparent plates so as to form a space sealed in an even thickness,
4. The light source device according to claim 3, wherein a phosphor is attached to a wall surface through which light in the space portion is transmitted. The color conversion plate includes a pair of transparent plates disposed to face each other,
A frame-shaped spacer member fixed between the pair of transparent plates so as to form a space portion hermetically sealed with a uniform thickness, and having a through hole that leads to the space portion;
4. The light source device according to claim 3, wherein a silicone gel in which a phosphor is dispersed and mixed is sealed in the space from the through hole, and the through hole is sealed. The light source device according to claim 6, wherein the spacer member includes a screen printing layer. The light source device according to claim 3, wherein fine convex and / or concave dot portions are formed on a light exit surface of the color conversion plate. The heat radiation fin for radiating the heat generated during light emission driving of the semiconductor light emitting element from the substrate to the outside through the case is integrally formed in the case. The light source device according to 1. A light source device according to claim 1, wherein the light source device according to claim 1 is mounted in a line or matrix form on a heat sink.

Images