JP2008071681A - Letterpress for printing and method for producing letterpress for printing - Google Patents

Abstract

A novel high-definition method for forming a printing pattern such as an organic functional layer in an organic EL element that requires very high printing accuracy by a relief printing method without printing defects such as ink color mixing or pattern shift Letterpress for printing and method for producing the same.
A convex pattern made of metal on a substrate and a photosensitive resin film having smoothness on the surface of the convex part of the metal convex pattern are provided, and the ratio of the convex part to the height and width is 1 or more. Further, a printed material is manufactured using a relief plate having a plate depth of 30 μm or more.
[Selection] Figure 1

Description

  The present invention relates to a high-definition printing relief plate used in a relief printing method and a printed matter produced using the high-definition printing relief plate.

  An organic electroluminescence element (hereinafter referred to as an organic EL element) is an element in which an organic light emitting layer made of an organic light emitting material is formed between two opposing electrodes, and light is emitted by passing a current through the organic light emitting layer. In order to emit light efficiently, the thickness of the light emitting layer is important, and it is necessary to form a thin film of about 100 nm. Furthermore, in order to make this a display capable of color display, it is necessary to pattern the organic EL element with high definition.

  Organic light-emitting materials include low-molecular materials and high-molecular materials. In general, low-molecular materials are formed into thin films by resistance heating vapor deposition or the like, and then patterned using a fine pattern mask. There is a problem that the patterning accuracy is less likely to increase as the size increases.

  Therefore, recently, a method of using a polymer material as an organic light emitting material, dissolving the organic light emitting material in a solvent to form a coating liquid, and forming a thin film by a wet coating method or a printing method has been tried. . As the wet coating method for forming a thin film, there are a spin coating method, a bar coating method, a protruding coating method, a dip coating method, and the like. It is difficult with the wet coating method. Therefore, it is effective to form a thin film by a printing method that is good at coating patterning.

  Furthermore, among various printing methods, organic EL elements and displays often use a glass substrate as a substrate, and therefore methods such as gravure printing that use hard plates such as metal printing plates are unsuitable and elastic. An offset printing method using a rubber plate having the above and a relief printing method using a photosensitive resin plate mainly composed of rubber or other resin are optimal. As attempts of these printing methods, a method by offset printing (Patent Document 1), a method by letterpress printing (Patent Document 2), and the like have been proposed.

JP 2001-93668 A JP 2001-155858 A

  The pattern of the organic light emitting layer in the organic EL element has a line width of 100 μm and a pixel pitch of 500 μm in a wide display of 40 inches, for example, in a large display for television use. In the case of a small display such as a mobile phone, for example, in a mainstream QVGA (320 × 240 pixels) with a diagonal size of 2 inches, the pixel pitch is 120 μm, and the width of the sub-pixel of each color element is 40 μm. When such a high-definition display element is to be formed by the relief printing method, a very high printing pattern accuracy of 5 μm or less is required.

  However, for example, in order to produce a display with a resolution of 200 ppi, lines and spaces with a pitch of about 40 μm are required per sub-pixel. Therefore, if the pattern accuracy is poor, it is caused by contact between the electrode layer and the hole transport layer or the electron transport layer. Short circuit and adjacent organic light emitting layers are mixed and color mixing occurs. Due to such a problem, a high-definition printing pattern with sufficient quality could not be formed with a conventional resin relief printing plate.

  Accordingly, the present invention provides a new relief printing plate for high-definition printing for forming a printing pattern that requires a very high printing accuracy, such as an organic functional layer in an organic EL element, by the relief printing method. Let it be an issue.

  The invention according to claim 1 made to solve the above-mentioned problem is characterized in that the convex portion of the convex pattern is made of metal, and the top of the convex portion is covered with a resin film, and further, the head A high-definition relief printing plate characterized in that a ratio d / a of a narrower width a to a height d from the top to the bottom of the vertical and horizontal lengths of the top plane is 1 or more. .

  The invention according to claim 2 is characterized in that the convex portion of the convex pattern is made of metal, the top and side surfaces of the convex portion, and the exposed portion of the base material surface are covered with a resin film, The high-definition relief printing plate is characterized in that a ratio a / d between a width a of the top and a height d from the top to the bottom is 1 or more.

  The invention according to claim 3 is the relief printing plate according to claim 1 or 2, wherein the sum of the width a of the convex portion and the width b of the concave portion is 60 μm or less, and from the top of the convex pattern convex portion. The relief printing plate is characterized in that the height d to the bottom is 30 μm or more.

  According to a fourth aspect of the present invention, there is provided a method for producing a relief printing plate for use in printing a high-definition pattern, the step of forming a convex pattern of a first photosensitive resin on a substrate using a photolithography method, and then Depositing a metal pattern between the first photosensitive resin patterns; forming a metal layer on the metal pattern and the first photosensitive resin; and an upper portion of the metal pattern on the substrate by photolithography. Forming the second photosensitive resin pattern only, removing the metal layer other than the portion protected by the second photosensitive resin pattern, and removing the first photosensitive resin pattern And a method for producing a relief printing plate.

  According to a fifth aspect of the present invention, there is provided a method for producing a relief printing plate for use in printing a high-definition pattern, the step of forming a convex pattern of a first photosensitive resin on a substrate using a photolithography method, and then Depositing a metal pattern between the first photosensitive resin patterns; forming a metal layer on the metal pattern and the first photosensitive resin; and an upper portion of the metal pattern on the substrate by photolithography. Forming a second photosensitive resin pattern only on the substrate, forming a layer of the third photosensitive resin on the substrate, and patterning the third photosensitive resin on the second photosensitive resin pattern by photolithography. Forming the metal layer, removing the metal layer other than the portion protected by the third photosensitive resin pattern, the first photosensitive resin pattern and the third photosensitive resin pattern A method for producing a relief printing plate, which comprises at least a step of removing.

The invention according to claim 6 includes a step of coating a resin film on a metal surface of a convex pattern side surface made of metal or an exposed portion of a substrate surface after removing the pattern of the first photosensitive resin. It is a manufacturing method of the relief printing plate of Claim 4 or 5.

  The invention according to claim 7 is characterized in that, in the invention according to claim 6, an electrodeposition method is used in the step of coating the resin surface on the metal surface on the side surface of the convex pattern or the exposed portion of the substrate surface. It is a manufacturing method of a letterpress for printing.

  The invention according to claim 8 is the method for producing a relief printing plate according to any one of claims 4 to 7, wherein an electroforming method is used in the step of forming the metal layer on the substrate.

  The invention according to claim 9 is characterized in that, in the second photosensitive resin layer forming step, a filtering process and a defoaming process are performed on the coating solution before coating. The method for producing a relief printing plate as described in 1. above.

  The invention according to claim 10 is a step of supplying ink from the ink supply body onto the convex pattern of the relief printing plate according to any one of claims 1 to 3, and the ink on the convex pattern to the printing medium. And a step of transferring and forming an ink pattern.

  The invention according to claim 11 is the method for producing an organic electroluminescence device comprising at least a first electrode, one or more organic light emitting medium layers, and a second electrode, wherein at least one of the organic light emitting medium layers is according to claim 10. It is the manufacturing method of the organic electroluminescent element characterized by forming using a method.

  According to the relief plate of the invention according to claim 1, the convex portion of the relief plate is made of metal, so that deformation of the plate is suppressed, and the top portion of the convex portion is covered with resin, so that the printing similar to that of the resin plate is performed. By showing the flexibility at the time, it is possible to print on a hard substrate such as a glass substrate without damaging it, and further, by the ink overflowing from the top of the head when the aspect ratio d / a of the plate is 1 or more Ink no longer mixes. As a result, printing with fewer printing defects due to misalignment of printing patterns or color mixing of inks can be performed.

  According to the relief plate of the invention according to claim 2, by further providing the resin to the side surface of the convex part or the exposed surface of the base material according to the invention according to claim 1, the effect of the ink contacting the metal surface or the exposed surface of the base material is affected. Since it can be eliminated, it is possible to perform printing with less printing defects in accordance with the characteristics of the ink.

  With the relief printing plate of the invention according to claim 3, the sum of the width a of the projections and the width b of the depressions is 60 μm or less, and the plate depth is 30 μm or more. The ink thus produced enables printing with less printing defects without being affected by color mixing.

  According to the invention according to claim 4, by first forming a pattern of the first photosensitive resin by a lithography method, a mold can be formed by a photosensitive resin that can be easily processed to form a metal convex pattern. A plate surface with good flatness can be formed by laminating a metal film. An ink contact surface suitable for printing an organic functional layer could be formed by further laminating a second photosensitive resin layer thereon by a lithography method. As a result, it was possible to produce a relief plate having both high aspect ratio flexibility and hardness that enables printing without printing defects due to deformation of the plate or color mixing of inks.

  According to the invention according to claim 5, in the relief printing method of the invention according to claim 4, the second photosensitive resin layer is protected by the third photosensitive resin layer, and the metal film is etched, so that the better The ink contact surface can be formed.

  According to the inventions according to claims 6 and 7, the method for producing a relief printing plate according to the inventions according to claims 4 and 5 further includes a step of forming a resin on the side surface of the convex part or the exposed surface of the substrate, so that the ink is a metal surface or Since the influence due to the contact with the exposed surface of the substrate can be eliminated, it is possible to perform printing with few printing defects according to the characteristics of the ink.

  With the invention according to claim 8, it is possible to easily stack the metal without gaps in the gaps of the first photosensitive resin pattern by electroforming. As a result, it was possible to easily produce a high-definition relief plate having a high aspect ratio, flexibility and hardness, and capable of printing without printing defects due to plate deformation or ink color mixing.

  According to the ninth aspect of the invention, the smoothness of the second photosensitive resin layer, which is the ink contact surface, is improved by the foreign substance removal and defoaming treatment of the second photosensitive resin, resulting in uneven printing and deformation of the plate. In addition, a relief printing plate with high aspect ratio, flexibility and hardness, which can produce high-definition printed matter without printing defects due to ink color mixing, etc., was produced.

  According to the invention of claim 10, there is no printing failure due to deformation of the plate or color mixing of inks, and it becomes possible to produce a printed material with higher definition.

  The invention according to claim 11 makes it possible to manufacture a high-definition organic EL element free from color mixing between adjacent light-emitting layers and printing defects.

<Letterpress>
FIG. 1 shows an example of a relief printing plate according to the present invention.

  Fig.1 (a) is an example of the pattern shape of the relief printing plate surface of this invention. As a pattern of a plate used for manufacturing an organic functional element such as an organic EL element or a display element such as a color filter, a line pattern or a dot pattern is used. As shown in the figure, the line width or pattern width of the plate surface convex portion 100 is a, and the interval between adjacent convex portion patterns is b.

  FIG. 1B is a cross-sectional view taken along the line P in FIG. Various materials can be used as the material of the substrate 102 as described in the description of the manufacturing method. In addition, when an electroforming method is used for plate production as described later, it is necessary to use a metal for the base material or to provide a metal film on the base material.

  A convex pattern 103 is formed on the substrate. Since this convex pattern is made of metal, assuming that the plate depth from the top to the bottom of the convex pattern is d, conventionally, when printing a high-definition print pattern, it overflows from the top during printing. The ink that has come out oozes into the concave portions, and the ink mixed with the ink from the adjacent convex portions may be transferred to the substrate to be printed, resulting in poor printing. In the present invention, this problem is solved by setting the aspect ratio a / d of the plate width and plate depth to 1 or more. However, when such a convex pattern having a high aspect ratio is formed of resin, the strength is insufficient, so that the plate is deformed or damaged, resulting in printing failure. Further, since a highly viscous resin coating solution is required, it is difficult to remove bubbles and foreign matters inside the resin, and there is a problem that the plate surface becomes non-uniform during coating.

  Therefore, in the present invention, the problem is solved by using a metal for the convex portion of the pattern. By forming the protrusions from metal, the printing pattern does not collapse due to deformation of the plate even if the aspect ratio is high.

  Furthermore, in order to print a fine organic thin film print pattern such as organic EL, the plate depth is 30 μm or more with respect to the pattern width of the convex pattern of 60 μm or less, depending on the type of ink in order to prevent color mixing of the ink. More preferably, there is a plate depth of 50 μm or more. When the convex pattern becomes as fine as 60 μm or less, the ink film thickness becomes higher than when applied on a flat surface due to surface tension when ink is applied to the surface of the convex part. This is because the ink that has flowed into the concave portion has a depth of 30 μm or less, so that the ink that has flowed in may overflow and cause color mixing or misalignment of the printing pattern.

  A resin layer 104 is provided on the top of the convex pattern. Thereby, a pattern can be printed without being damaged even when printing on a substrate to be damaged such as a glass substrate. This resin layer is preferably 1 μm or more so as not to damage the substrate to be printed during printing. Further, if the resin layer becomes too thick, the resin layer may be deformed or swelled during printing, and printing unevenness may occur.

<Manufacture of letterpress>
Next, the manufacturing method of the relief printing plate of this invention is demonstrated based on FIG.

  As the relief printing base material 200 in the present invention, a plastic film such as glass, quartz, polypropylene, polyethersulfone, polycarbonate, cycloolefin polymer, polyacrylate, polyamide, polymethylmethacrylate, polyethylene terephthalate, polyethylene naphthalate, Sheets, silicon wafers, nickel iron alloys such as stainless steel and invar materials, and nickel cobalt iron alloy plates such as super invar can be used.

  In addition, for example, when an electroforming method is used, a metal film such as chromium or aluminum may be formed on the formation portion. Alternatively, an insulating film such as a metal oxide, a metal nitride, a metal oxynitride film, or a polymer resin film may be formed on a non-formed portion on the metal substrate. Furthermore, a plastic film may be laminated on the back surface of the metal plate. Similarly, when using an etching method, an insulating film such as a metal oxide, metal nitride, metal oxynitride film, or polymer resin film, a metal film, or a plastic film is formed to protect a portion that is not desired to be removed. May be.

  In the above-mentioned base material, in order to form a high-definition pattern with high positional accuracy particularly on a large substrate, the base material having a thermal expansion coefficient of 50 × 10 −7 / ° C. or lower, more preferably 20 × 10 −7 / ° C. or lower. It is good to choose. Furthermore, it is more preferable to have flexibility that can be wound around a printing roll. As an example of such a base material 101, it is preferable to use a metal sheet having a low thermal expansion coefficient such as Invar material or Super Invar material. As the thickness of the metal sheet, it is sufficient that the metal sheet has sufficient flexibility to be wound around a printing plate copper and has a strength that does not deform due to heat or impact, and is preferably 0.5 mm or less, more preferably 0.8 mm. 3 mm or less can be used suitably.

  First, after laminating the first photosensitive resin on the substrate 200, unnecessary portions are removed using a photolithography method to form a plurality of convex patterns 202 (FIG. 2B). The convex pattern formed at this time is a pattern that is inverted with respect to the convex pattern of the relief plate that is finally produced.

  Although there is no restriction | limiting in particular as a material of the 1st photosensitive resin layer 201, it has tolerance with respect to the plating solution and etching liquid which are mentioned later, The metal of the letterpress for printing mentioned later by this convex pattern of this 1st photosensitive resin Since the shape of the base is influenced, it is necessary that patterning with high definition and high aspect ratio is possible. Furthermore, it is preferable to select one that can be easily removed with an organic solvent or an aqueous alkali solution. Resins such as acrylic, epoxy, nylon, polyester, urethane, silicone, polyvinyl alcohol, polyimide, and novolac can be used depending on the application. The thickness is preferably 30 μm or more, and more preferably 50 μm or more, which is necessary as at least the plate depth of the relief printing plate. As a suitable means for forming such a thick resin on a large-area substrate, a negative acrylic or epoxy-based commercially available dry film resist can be used.

  Next, the metal 203 is embedded in the gap recesses of the convex pattern 202 of the first photosensitive resin (FIG. 2C). Next, a metal base film 204 is formed by laminating metal not only on the concave portions but also on the convex pattern (FIG. 2D). The metal 203 and the metal base film 204 are not particularly limited as long as they have printing pressure resistance during printing and can be etched as described later. For example, nickel, chromium, copper, gold, aluminum, silver, or the like is used. be able to.

  As a method for forming the metal 203 and the metal base film 204, an electroforming method, a wet coating method, a CVD method, a sputtering method, a vapor deposition method, or an ion plating method can be used as necessary. For depositing the metal 203, it is particularly preferable to use an electroforming method that can be uniformly embedded in the recess without a gap. In this case, as described above, a metal substrate or a substrate on which a metal film is formed is used.

  Although it is possible to omit the process of forming the metal base film 203 and use it as a relief printing plate, it is difficult to perfectly match the height of the first photosensitive resin pattern 202 and the height of the metal 203. If the second photosensitive resin that forms the ink contact surface of the printing relief printing plate is formed in this state, a printing relief printing plate having a flat top cannot be formed or the resin film thickness varies within the surface. Therefore, it is preferable to form a metal base film 204 by further laminating a metal on the concave and convex patterns. Regarding the film thickness of the metal base film, in the etching process to be described later, since the metal base film is isotropically etched in the etching process described later, the first photosensitive resin of the relief printing plate is used to form a fine plate. The film thickness is preferably less than the pattern width of the layer.

  Next, after laminating the second photosensitive resin on the metal base 204, the second photosensitive resin convex pattern 206 is formed directly on the concave portion of the first photosensitive resin by using a photolithography method ( FIG. 2 (f)).

  As a method for forming the second photosensitive resin layer 205, known coating methods such as slit coating, spin coating, screen printing, roll coating, blade coating, knife coating, die coating, and spray coating can be used. Further, the second photosensitive resin pattern 206 is a pattern that is reversed from the first photosensitive resin pattern 202. In order to form such a pattern, for example, using the same mask as that used for forming the first photosensitive resin pattern, if the first photosensitive resin material is a negative type, a positive type second photosensitive resin material is used. In the case where a negative photosensitive resin material is used, exposure may be performed using a mask having an inverted pattern. By aligning the mask with the same position as when forming the first photosensitive resin pattern, the pattern can be formed at a desired position.

  As the material of the second photosensitive resin, a photosensitive resin such as a polyimide resin, an epoxy resin, or an acrylic resin can be used. When the entire plate is composed of a photosensitive resin layer, the viscosity of the photosensitive resin coating solution needs to be very high. On the other hand, since the second photosensitive resin layer 206 can be thinned to about 1 to 5 μm, it is possible to use a photosensitive resin coating liquid having a low viscosity.

  The coating liquid for the second photosensitive resin is preferably one that can apply filtering treatment and defoaming treatment for removing foreign matters having a particle diameter of 5 μm or more, more preferably 1 μm or more. Specifically, it is preferable that the coating liquid has a viscosity of 200 mPa · s or less, more preferably 100 mPa · s or less. For the defoaming treatment, a self-revolving defoaming device or a vacuum defoaming device can be used. By these treatments, the smoothness of the ink contact surface is improved, and printing with few printing defects becomes possible.

  The second photosensitive resin pattern 206 is more preferably subjected to a post-bake treatment in order to suppress damage due to an etching process described later and a peeling process of the first photosensitive resin pattern 202. Further, before etching, the second photosensitive resin pattern 206 is coated on the second photosensitive resin pattern 206 with the same photosensitive resin (third photosensitive resin) as the first photosensitive resin, so that the photosensitive resin for protection is used. A resin film may be patterned. In this case, use a mask having a pattern reversed with respect to the mask at the time of forming the first photosensitive resin pattern so that it is aligned with the same position as at the time of forming the pattern of the first photosensitive resin and the second photosensitive resin. Thus, the third photosensitive resin layer can be patterned at a desired position.

  Next, the portion of the metal base film not covered with the second photosensitive resin pattern 206 is etched to expose the convex portions of the first photosensitive resin 202 (FIG. 2G). The etching solution can be selected from existing etching solutions such as ferric chloride and cerium ammonium nitrate depending on the material of the metal base film.

  Next, the first photosensitive resin pattern 202 is removed (FIG. 2H). As a method for removing the first photosensitive resin, although depending on the material of the first photosensitive resin, an alkaline aqueous solution such as sodium hydroxide or sodium carbonate or an organic solvent such as toluene or acetone can be used. It is desirable to select a method having as little damage as possible for the two-photosensitive resin. When the protective photosensitive resin is formed on the second photosensitive resin pattern, it is also removed at the same time.

  Thus, the relief printing plate of the present invention provided with the metal portion 207 and the resin film 208 is completed (FIG. 2F). Furthermore, the surface of the metal part 207 or the substrate 200 can be coated with a resin or the like according to the characteristics of the printing ink. In this case, for example, an electrodeposition method can be used to coat a resin such as acrylic, epoxy, silicone, fluororesin, or polyimide.

<Manufacture of printed matter>
Next, the manufacturing method of the printed matter which forms an ink pattern on the to-be-printed substrate surface by a relief printing method using the relief printing plate of this invention is shown. FIG. 3 shows a schematic diagram of a relief printing apparatus used for producing the printed matter of the present invention. A printing substrate 301 is fixed to the stage 300, a printing relief plate 302 is fixed to a plate cylinder 303, and the printing relief plate is in contact with an anilox roll 304 as an ink supply body. The anilox roll is an ink replenishing device 305. And a doctor 306.

  First, ink is replenished from the ink replenishing device 305 to the anilox roll 304, and excess ink in the ink 307 supplied to the anilox roll is removed by the doctor 306. As the ink replenishing device, a dripping type ink replenishing device, a fountain roll, a slit coater, a die coater, a cap coater such as a cap coater, or a combination thereof may be used. As the doctor, a known object such as a doctor roll can be used in addition to the doctor blade. The anilox roll can be made of chromium or ceramics. Further, it is also possible to use a lithographic anilox plate instead of a cylindrical anilox roll as an ink supply to the printing relief plate. The lithographic anilox plate is disposed, for example, at the position of the substrate to be printed 301. After the ink is replenished to the entire surface of the anilox plate by an ink replenishing device, the plate cylinder is rotated to supply ink to the substrate to be printed Can do.

  The ink uniformly held by the doctor 306 on the surface of the anilox roll 304 which is an ink supply body to the printing relief plate is transferred and supplied to the projection pattern of the printing relief plate 302 attached to the plate cylinder 303. As the plate cylinder rotates, the convex pattern of the printing relief plate and the printing substrate 301 move relatively in contact with each other, and the ink 307 is transferred to a predetermined position on the printing substrate on the stage 300 to be printed. An ink pattern 308 is formed on the substrate. After the ink pattern is provided on the substrate to be printed, a drying step using an oven or the like can be provided as necessary.

  When printing the ink on the printing relief plate 302 on the printing substrate 301, a method of moving the stage 300 on which the printing substrate is fixed in accordance with the rotation of the plate cylinder 303 may be used. 3 A printing unit comprising an upper plate cylinder 305, a printing relief plate, an anilox roll 304, and an ink replenishing device 305 may be moved in accordance with the rotation of the plate cylinder. The printing relief plate of the present invention may be formed by forming a resin layer on the plate cylinder 303 and directly making a plate to form a convex pattern.

  Note that FIG. 3 shows a sheet-fed relief printing apparatus that forms an ink pattern on a substrate to be printed one by one, but the substrate to be printed can be wound up in a web shape in the method for producing printed matter of the present invention. In some cases, a roll-to-roll relief printing apparatus can be used. When a roll-to-roll type letterpress printing apparatus is used, it is possible to continuously form an ink pattern and to reduce the manufacturing cost.

  According to the relief printing plate of the present invention, by providing a metal portion, the projection of the plate is not damaged or deformed at the time of formation, and the resin contact layer is provided on the ink contact surface. Even a hard substrate such as a glass substrate can be printed without being damaged.

<Manufacture of organic EL elements>
Next, a method for producing an organic EL element will be described as an example of a method for producing a printed material using a relief plate in the present invention. FIG. 4 shows an example of the organic EL element. As a method for driving the organic EL element, there are a passive matrix type and an active matrix type. However, the manufacturing method of the present invention can be applied to both a passive matrix type organic EL element and an active matrix type organic EL element.

  The passive matrix method is a method in which stripe-shaped electrodes are opposed to each other so as to be orthogonal to each other, and light is emitted at the intersection, whereas the active matrix method uses a so-called thin film transistor (TFT) substrate in which a transistor is formed for each pixel. Thus, the light is emitted independently for each pixel.

  As shown in FIG. 4, the organic EL element of the present invention has a first electrode 402 in a stripe shape as an anode on a substrate 401. The partition wall 403 is provided between the first electrodes, and preferably covers the first electrode end portion for the purpose of preventing a short circuit due to burrs or the like at the first electrode end portion.

  The organic EL device of the present invention has an organic light emitting medium layer composed of an organic light emitting layer and a light emission auxiliary layer in a region on the first electrode 402 and partitioned by the partition 403. The organic light emitting medium layer sandwiched between the electrodes may be composed of an organic light emitting layer alone, or may be composed of a laminated structure of an organic light emitting layer and a light emission auxiliary layer. Examples of the light emission auxiliary layer include a hole transport layer, a hole injection layer, an electron transport layer, an electron injection layer, and a charge generation layer. FIG. 4 shows a configuration having a laminated structure of a hole transport layer 404 that is a light emission auxiliary layer and an organic light emitting layer 405. In the case of manufacturing a display, a hole transport layer 404 is provided on the first electrode, and a red (R) organic light emitting layer, a green (G) organic light emitting layer, and a blue (B) organic light emitting are formed on the hole transport layer. A layer may be provided for each pixel.

  Next, a second electrode 406 is disposed as a cathode on the organic light emitting medium layer so as to face the first electrode 402 as an anode. In the case of the passive matrix method, the second electrode is provided in a stripe shape so as to be orthogonal to the first electrode having a stripe shape. In the case of the active matrix method, the second electrode is formed on the entire surface of the organic EL element. Further, although not shown, a sealing body such as a glass cap is provided on the entire effective pixel in order to prevent moisture and oxygen in the environment from entering the first electrode, the organic light emitting layer, the light emitting auxiliary layer, and the second electrode. It is provided and bonded to the substrate via an adhesive.

  The organic EL device according to the production method of the present invention includes at least a substrate, a patterned first electrode supported by the substrate, an organic light emitting layer, and a second electrode. Contrary to FIG. 4, the organic EL element of the present invention may have a structure in which the first electrode is a cathode and the second electrode is an anode. In addition, in order to protect the organic light emitting medium layer and the electrode from the ingress of external oxygen and moisture in place of a sealing body such as a glass cap, a sealing layer having a function of a passivation layer and a protective layer for protecting from external stress, or both, is provided. You may provide a stop base material.

  Next, a method for manufacturing the element will be described. As the substrate according to the present invention, any substrate can be used as long as it has an insulating property. In the case of a bottom emission type organic EL element that extracts light from the substrate side, it is necessary to use a transparent substrate. For example, a glass substrate or a quartz substrate can be used as the substrate. Further, it may be a plastic film or sheet such as polypropylene, polyethersulfone, polycarbonate, cycloolefin polymer, polyacrylate, polyamide, polymethyl methacrylate, polyethylene terephthalate, or polyethylene naphthalate. These plastic films or sheets are coated with metal oxide thin films, metal fluoride thin films, metal nitride thin films, metal oxynitride thin films, or polymer resin films for the purpose of preventing moisture from entering the organic light emitting medium layer. A laminate may be used as the substrate. In addition, it is more preferable to reduce the moisture adsorbed on the inside or the surface of the substrate as much as possible by performing a heat treatment on these substrates in advance. Further, in order to improve the adhesion depending on the material to be laminated on the substrate, it is preferable to use after performing surface treatment such as ultrasonic cleaning treatment, corona discharge treatment, plasma treatment, UV ozone treatment.

  Further, a thin film transistor (TFT) can be formed on these to form a substrate for an active matrix organic EL element. In the case of the organic EL element substrate of the present invention, a planarization layer is formed on the TFT, and the lower electrode of the organic EL element is provided on the planarization layer, and the TFT and the lower electrode are provided. Are preferably electrically connected through a contact hole provided in the planarization layer. By comprising in this way, the outstanding electrical insulation can be obtained between TFT and an organic EL element. The TFT and the organic EL element formed above the TFT are supported by a support. The support is preferably excellent in mechanical strength and dimensional stability. Specifically, the materials described above as the substrate can be used.

    When the first electrode is used as an anode, the material is a metal composite such as ITO (indium tin composite oxide), IZO (indium zinc composite oxide), tin oxide, zinc oxide, indium oxide, zinc aluminum composite oxide. A single layer or a stacked layer of metal materials such as oxide, gold, platinum, and chromium can be used. As a method for forming the first electrode, a dry film forming method such as a resistance heating vapor deposition method, an electron beam vapor deposition method, a reactive vapor deposition method, an ion plating method, or a sputtering method can be used. In addition, ITO is preferably used because of its low resistance, solvent resistance, and high transparency when the bottom mission method is adopted. ITO is formed on the glass substrate by sputtering, and is patterned by photolithography to form the first electrode 2.

  After forming the first electrode 302, a partition wall 303 is formed so as to cover the edge of the first electrode. The partition 303 needs to have insulating properties, and a photosensitive material or the like can be used. The photosensitive material may be a positive type or a negative type, a photo-curing resin of a photo radical polymerization system, a photo cationic polymerization system, or a copolymer containing an acrylonitrile component, polyvinyl phenol, polyvinyl alcohol. , Novolac resin, polyimide resin, cyanoethyl pullulan, and the like can be used. Moreover, SiO2, TiO2, etc. can also be used as a partition wall forming material. When the partition wall forming material is a photosensitive material, the entire surface of the forming material solution is coated by a slit coating method or a spin coating method, and then patterning is performed by a photolithography method such as exposure and development. In the case of the spin coating method, the height of the partition wall can be controlled by conditions such as the number of rotations when spin coating, but there is a limit height in one coating, and if it is higher than that, multiple spin coatings are performed. Use an iterative approach. When the barrier rib is formed by a photolithography method using a photosensitive material, its shape can be controlled by exposure conditions and development conditions. For example, when a negative photosensitive resin is applied, exposed and developed, and then post-baked to obtain a partition wall, if the shape of the partition wall end portion is to have a forward tapered shape, development under this development condition The type, concentration, temperature, or development time of the liquid may be controlled. If the development conditions are mild, the partition wall ends have a forward taper shape, and if the development conditions are severe, the partition wall ends have a reverse taper shape. Further, when the partition wall forming material is SiO 2 or TiO 2, it can be formed by a dry film forming method such as a sputtering method or a CVD method. In this case, patterning of the partition walls can be performed by a mask or a photolithography method.

  Next, an organic light emitting medium layer composed of an organic light emitting layer and a light emission auxiliary layer is formed. The organic light emitting medium layer sandwiched between the electrodes may be composed of an organic light emitting layer alone, or an organic light emitting layer and a hole transport layer, a hole injection layer, an electron transport layer, an electron injection layer, a charge generation layer. Such a laminated structure with a light emission auxiliary layer for assisting light emission. The hole transport layer, hole injection layer, electron transport layer, electron injection layer, and charge generation layer are appropriately selected as necessary.

  In the present invention, at least one of the organic light emitting medium layers composed of a light emitting auxiliary layer such as an organic light emitting layer, a hole transport layer, a hole injection layer, an electron transport layer, an electron injection layer, and a charge generation layer is used. It can be applied when forming by printing above the first electrode by a relief printing method using a relief printing plate of the present invention using an ink in which a layer material is dissolved or dispersed in a solvent. Hereinafter, in the present invention, a case where an organic light emitting ink in which an organic light emitting material is dissolved or dispersed in a solvent is used will be described.

  The organic light emitting layer is a layer that emits light when an electric current is passed. Organic light-emitting materials formed by the organic light-emitting layer include 9,10-diarylanthracene derivatives, pyrene, coronene, perylene, rubrene, 1,1,4,4-tetraphenylbutadiene, tris (8-quinolato) aluminum complex, tris (4-methyl-8-quinolato) aluminum complex, bis (8-quinolato) zinc complex, tris (4-methyl-5-trifluoromethyl-8-quinolato) aluminum complex, tris (4-methyl-5-cyano-) 8-quinolate) aluminum complex, bis (2-methyl-5-trifluoromethyl-8-quinolinolate) [4- (4-cyanophenyl) phenolate] aluminum complex, bis (2-methyl-5-cyano-8-quinolinolate) [4- (4-cyanophenyl) phenolate] aluminum complex, Lis (8-quinolinolato) scandium complex, bis [8- (para-tosyl) aminoquinoline] zinc complex and cadmium complex, 1,2,3,4-tetraphenylcyclopentadiene, poly-2,5-diheptyloxy- A low molecular weight light emitting material such as para-phenylene vinylene can be used.

  Further, coumarin phosphors, perylene phosphors, pyran phosphors, anthrone phosphors, polyphyrin phosphors, quinacridone phosphors, N, N′-dialkyl-substituted quinacridone phosphors, naphthalimide phosphors, A material obtained by dispersing a low molecular weight light emitting material such as an N, N′-diaryl-substituted pyrrolopyrrole fluorescent material or a phosphorescent light emitting material such as an Ir complex in a polymer can be used. As the polymer, polystyrene, polymethyl methacrylate, polyvinyl carbazole and the like can be used.

  Further, poly (2-decyloxy-1,4-phenylene) (DO-PPP) and poly [2,5-bis- [2- (N, N, N-triethylammonium) ethoxy] -1,4-phenyl- PPP derivatives such as alto-1,4-phenylylene] dibromide, poly [2- (2′-ethylhexyloxy) -5-methoxy-1,4-phenylenevinylene] (MEH-PPV), poly [5-methoxy -(2-propanoxysulfonide) -1,4-phenylenevinylene] (MPS-PPV), poly [2,5-bis- (hexyloxy) -1,4-phenylene- (1-cyanovinylene)] ( CN-PPV), poly (9,9-dioctylfluorene) (PDAF), and polyspirofluorene may be used. Examples thereof include polymer precursors such as a PPV precursor and a PPP precursor. Other existing light emitting materials can also be used.

Examples of the hole transport material for forming the hole transport layer include metal phthalocyanines and metal-free phthalocyanines such as copper phthalocyanine and tetra (t-butyl) copper phthalocyanine, quinacridone compounds, 1,1-bis (4-di-p -Tolylaminophenyl) cyclohexane, N, N′-diphenyl-N, N′-bis (3-methylphenyl) -1,1′-biphenyl-4,4′-diamine, N, N′-di (1- Naphthyl) -N, N′-diphenyl-1,1′-biphenyl-4,4′-diamine and other aromatic amine-based low-molecular hole injection / transport materials, polyaniline, polythiophene, polyvinylcarbazole, poly (3,4 -Polymeric hole transport materials such as a mixture of ethylenedioxythiophene) and polystyrene sulfonic acid, thiophene oligomer materials, and other existing hole transport materials It is possible to choose from in.

  Examples of the electron transport material for forming the electron transport layer include 2- (4-bifinylyl) -5- (4-tert-butylphenyl) -1,3,4-oxadiazole, 2,5-bis (1 -Naphtyl) -1,3,4-oxadiazole, oxadiazole derivatives, bis (10-hydroxybenzo [h] quinolinolato) beryllium complexes, triazole compounds, and the like can be used.

  Solvents that dissolve or disperse the organic light emitting material include toluene, xylene, acetone, hexane, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, methanol, ethanol, isopropyl alcohol, ethyl acetate, butyl acetate, 2-methyl- (t-butyl) Benzene, 1,2,3,4-tetramethylbenzene, pentylbenzene, 1,3,5-triethylbenzene, cyclohexylbenzene, 1,3,5-tri-isopropylbenzene and the like can be used alone or in combination. . Moreover, surfactant, antioxidant, a viscosity modifier, a ultraviolet absorber, etc. may be added to organic luminescent ink as needed.

  Examples of the solvent for dissolving or dispersing the hole transport material and the electron transport material include, for example, toluene, xylene, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, methanol, ethanol, isopropyl alcohol, ethyl acetate, butyl acetate, water and the like Alternatively, a mixed solvent thereof can be used. In particular, water or alcohols are suitable when forming a hole transport material into an ink.

  The organic light emitting medium layer is formed by a wet film forming method. Note that in the case where these layers have a laminated structure, it is not necessary to form all of the layers by a wet film formation method. As the wet film forming method, spin coating method, die coating method, dip coating method, discharge coating method, pre-coating method, roll coating method, bar coating method and the like, relief printing method, inkjet printing method, offset printing method, Examples of the printing method include a gravure printing method. In particular, when patterning organic light emitting layers of three colors of RGB, it can be selectively formed on the pixel portion by a printing method, and an organic EL element capable of color display can be manufactured. The film thickness of the organic light emitting medium layer is 1000 nm or less, preferably 50 nm to 150 nm, even when formed by a single layer or stacked layers.

  Next, a second electrode is formed. When the second electrode is a cathode, a material having high electron injection efficiency is used as the material. Specifically, a single metal such as Mg, Al, or Yb is used, or a compound such as Li, oxidized Li, or LiF is sandwiched by about 1 nm at the interface in contact with the light emitting medium, and Al or Cu having high stability and conductivity is laminated. And use. Or, in order to achieve both electron injection efficiency and stability, one or more metals such as Li, Mg, Ca, Sr, La, Ce, Er, Eu, Sc, Y, Yb, etc., which have low work function, and stable Ag, Al An alloy system with a metal element such as Cu is used. Specifically, alloys such as MgAg, AlLi, and CuLi can be used. Further, in the case of a top emission type organic EL device, the cathode needs to have transparency, and for example, transparency can be achieved by a combination of these metals and a transparent conductive layer such as ITO.

  As a method for forming the second electrode, a dry film formation method such as a resistance heating vapor deposition method, an electron beam vapor deposition method, a reactive vapor deposition method, an ion plating method, or a sputtering method can be used. Moreover, when it is necessary to make a 2nd electrode into a pattern, it can pattern by a mask etc. The thickness of the second electrode is preferably 10 nm to 1000 nm. In the present invention, the first electrode can be a cathode and the second electrode can be an anode.

  As an organic EL element, it is possible to emit light by sandwiching an organic light emitting layer between electrodes and passing an electric current. However, some of the organic light emitting material, the light emission auxiliary layer forming material, and the electrode forming material contain moisture in the atmosphere. Since it is easily deteriorated by oxygen, a sealing body is usually provided for shielding from the outside.

  For example, the sealing body includes a first electrode, an organic light emitting layer, a light emitting auxiliary layer, and a substrate on which the second electrode is formed. Then, sealing is performed by adhering the cap and the substrate with an adhesive around the peripheral portion so that the concave portion hits the second electrode.

  In addition, the sealing body is provided with a resin layer on a sealing material with respect to the substrate on which, for example, the first electrode, the organic light emitting layer, the light emission auxiliary layer, and the second electrode are formed. It is also possible to carry out by bonding the substrates.

At this time, the sealing material needs to be a base material having low moisture and oxygen permeability. Examples of the material include ceramics such as alumina, silicon nitride, and boron nitride, glass such as alkali-free glass and alkali glass, metal foil such as quartz, aluminum, and stainless steel, and moisture-resistant film. Examples of moisture-resistant films include films formed by CVD of SiOx on both sides of plastic substrates, films with low permeability and water-absorbing films, or polymer films coated with a water-absorbing agent. The water vapor transmission rate is preferably 10 −6 g / m 2 / day or less.

  Examples of the resin layer include a photo-curing adhesive resin made of an epoxy resin, an acrylic resin, a silicone resin, a thermosetting adhesive resin, a two-component curable adhesive resin, and an ethylene ethyl acrylate (EEA) polymer. Examples thereof include acrylic resins, vinyl resins such as ethylene vinyl acetate (EVA), thermoplastic resins such as polyamide and synthetic rubber, and thermoplastic adhesive resins such as acid-modified products of polyethylene and polypropylene. Examples of methods for forming a resin layer on a sealing material include solvent solution method, extrusion lamination method, melting / hot melt method, calendar method, nozzle coating method, screen printing method, vacuum laminating method, hot roll laminating method, etc. Can be mentioned. A material having a hygroscopic property or an oxygen absorbing property may be contained as necessary. Although the thickness of the resin layer formed on a sealing material is arbitrarily determined by the magnitude | size and shape of the organic EL element to seal, about 5-500 micrometers is desirable.

  The substrate on which the first electrode, the organic light emitting layer, the light emission auxiliary layer, and the second electrode are formed and the sealing body are bonded together in a sealing chamber. When the sealing body has a two-layer structure of a sealing material and a resin layer, and a thermoplastic resin is used for the resin layer, it is preferable to perform only the pressure bonding with a heated roll. When a thermosetting adhesive resin is used, it is preferable to perform heat curing at a curing temperature after pressure bonding with a heated roll. In the case where a photocurable adhesive resin is used, curing can be performed by further irradiating light after pressure bonding with a roll. Note that although the resin layer is formed over the sealing material here, the resin layer can be formed over the substrate and bonded to the sealing material.

  Before or instead of sealing with a sealing body, for example, as a passivation film, it is also possible to form a sealing body with an inorganic thin film, such as a silicon nitride film having a thickness of 150 nm using a CVD method. It is also possible to combine these.

  As described above, any organic light emitting medium layer can be formed using the relief printing plate of the present invention. Further, as the forming method, the steps described in the section of the printed material manufacturing method can be used. By using the relief printing plate of the present invention, the ink is overflowing from the concave portion of the plate surface because the shape is a high aspect ratio, and the ink of each layer of the organic light emitting medium layer is mixed and short-circuited or uneven light emission occurs. Therefore, it is possible to form a fine organic light-emitting medium layer that does not have a printing defect, and as a result, it is possible to manufacture a high-definition organic EL element.

  Below, it shows about an example and a comparative example.

<Example 1>
(Preparation of printed substrate)
An ITO film was formed on a glass substrate by sputtering, and the ITO film was patterned in a stripe shape by photolithography and etching with an acid solution. The ITO line pattern as the anode was a pattern in which the line width was 25 μm, the space was 25 μm, and the line was formed with 192 lines. Next, a substrate to be printed was prepared by covering the end of the anode line with a photosensitive polyimide resin (thickness 2 μm).

(Preparation of printing letterpress)
A polyester protective film was pasted on one side of a 0.3 mm thick invar material, and an acrylic negative dry film (Hitachi Kasei HM4056: 56 μm thickness) was laminated as the first photosensitive resin on the other side. Using a photolithography method, a stripe convex pattern was formed which was a negative pattern of the ITO line pattern of the substrate to be printed. Next, after forming copper to the same height as the first photosensitive resin in the concave portion of the convex pattern using electroforming, a copper film is laminated so as to cover the upper portion of the convex pattern, and about A 10 μm thick metal base film was formed.

  Next, on the metal base film, a negative photosensitive polyimide resin as a second photosensitive resin is passed through a 10 μm filter, passed through a self-revolving defoaming device, and then 5 μm using a slit coat method. The coating was made with a thickness of. This polyimide film was patterned by a photolithographic method and formed on the concave metal pattern of the first photosensitive resin convex pattern. Next, the copper film exposed to the opening of the second photosensitive resin by being immersed in ferric chloride was etched until the first photosensitive resin was exposed.

  Finally, it is immersed in an aqueous sodium hydroxide solution, and the first photosensitive resin is peeled off to form a metal convex pattern and a resin layer at the top of the metal substrate, with a plate depth of 71 μm, pattern width Produced a relief printing plate having a thickness of 25 μm.

(Production of organic EL element)
The relief printing plate for high-definition printing was fixed to a cylinder of a sheet-fed printing press. As a material for the hole transport layer, an ink in which a mixture of poly (3,4-ethylenedioxythiophene) and polystyrene sulfonic acid is dispersed in an aqueous solvent is applied to the surface of the second photosensitive resin layer of the relief printing plate. The ink was inked, transferred to a substrate to be printed, and printed in a striped form in a lump of 192 lines. After printing, it was dried at 200 ° C. for 30 minutes. The film thickness after drying of the hole transport pattern formed at this time was 50 nm. A polyfluorene-based green light-emitting ink was applied onto the hole transport layer by spin coating, and then heated at 130 ° C. for 15 minutes in a nitrogen atmosphere. The thickness of the light emitting layer formed at this time was 80 nm. Next, a line was formed on the light emitting layer as a second electrode in a direction perpendicular to the first electrode. As for the cathode material, a laminated film of calcium (10 nm) and silver (150 nm) was formed by a vacuum deposition method. Finally, sealing was performed using a glass cap to produce the organic EL device of the present invention. When the light emission characteristics of the organic EL element were observed, uniform light emission of 1000 cd / m ² was obtained at 5 V over the entire surface in the pattern portion. In addition, since the hole transport layer formed by the relief printing method did not contact the adjacent lines, no leakage between the lines occurred, and a good 192 × 192 dot matrix display could be produced.

<Comparative Example 1>
As Comparative Example 1, a letterpress printing plate with L / S = 25/25 μm was formed using a commercially available flexographic plate (Asahi Kasei AWP plate) that can be used for water-based ink printing. As a result, the depth of the relief printing plate was about 5 μm. An organic EL element was produced in the same production process as in Example 1 except that this plate was used. As a result, most of the hole transport ink flowed into the intaglio, not on the printing relief plate, and this ink was transferred to the substrate to be printed, so that pattern formation was not possible, and in addition, a short-circuited portion occurred in all 192 lines. It was. Further, the film thickness uniformity of the hole transport layer was non-uniform as ± 30%. The voltage was about 100 to 500 cd / m ^{2 at} 5 V, the light emission was nonuniform, and the light emission unevenness was ± 30% or more.

<Comparative example 2>
As Comparative Example 2, a printing relief plate was prepared in the same manner as in Example 1 except that an acrylic negative photosensitive resin was applied on a substrate using a slit coating method to form a first photosensitive resin film. . As a result, a printing relief plate having a metal convex pattern and a resin layer at the top of the metal substrate, a plate depth of 20 μm, and a pattern width of 25 μm was produced on the metal substrate.

An organic EL element was produced in the same process as in Example 1. As a result, the hole transporting ink flowed into the intaglio, and this ink was transferred to the substrate to be printed, resulting in printing pattern shifts and short-circuited parts in the lines. The voltage was about 300 to 600 cd / m ^{2 at} 5 V, the light emission was nonuniform, and the light emission unevenness was ± 30% or more.

<Comparative Example 3>
As Comparative Example 3, an acrylic negative dry film (Hitachi Kasei HM4056: 56 μm thickness) was laminated as a first photosensitive resin on an invar material having a thickness of 0.3 mm. Using a photolithography method, a convex stripe pattern having the same pattern as the ITO line pattern of the substrate to be printed was formed, and a printing relief plate having a plate depth of 56 μm and a pattern width of 25 μm was produced. When an organic EL was produced by the same process as in Example 1, due to the remarkable deformation and damage of the plate, all lines were poorly printed, and most patterns could not be formed as organic EL elements.

These are sectional drawings of an example of the relief printing plate of this invention. These are explanatory sectional drawing of the manufacturing method of the relief printing plate of this invention. These are the schematic diagrams of the relief printing apparatus used for manufacture of the printed matter of this invention. These are sectional drawings of an example of the organic EL element manufactured by this invention.

Explanation of symbols

100: Plate surface convex portion 101: Plate surface concave portion 102: Base material 103: Convex pattern 104: Resin layer 200: Base material 201: First photosensitive resin layer 202: First photosensitive resin pattern 203: Metal 204: Metal base film 205: Second photosensitive resin layer 206: Second photosensitive resin pattern 207: Metal part 208: Resin layer 300: Stage 301: Printed substrate 302: Printing relief plate 303: Plate copper 304: Anilox roll 305: Ink replenisher 306: Doctor 307: Ink 308: Ink pattern 401: Substrate 402: Partition wall 403: First electrode 404: Hole transport layer 405: Organic light emitting layer 406: Second electrode

Claims (11)

A letterpress used for printing high-definition patterns,
The convex pattern of the relief plate is made of metal,
The top of the convex pattern is covered with a resin film,
A printing relief printing plate, wherein a ratio d / a of a width a of the convex pattern and a height d from the top to the bottom is 1 or more. A letterpress used for printing high-definition patterns,
The convex pattern of the relief plate is made of metal,
The top and side surfaces of the convex pattern and the exposed portion of the substrate surface are covered with a resin film,
A printing relief printing plate, wherein a ratio d / a of a width a of the convex pattern and a height d from the top to the bottom is 1 or more. The sum a + b of the convex portion width a and the concave portion width b of the relief pattern is 60 μm or less,
3. The relief printing plate for high-definition printing according to claim 1, wherein a height d from the top to the bottom of the convex portion is 30 μm or more. In a method for producing a relief plate used for printing a high-definition pattern,
Forming a first photosensitive resin layer on the substrate;
Forming a convex pattern of the first photosensitive resin using a photolithography method;
Depositing a metal pattern in the gap between the patterns of the first photosensitive resin;
Forming a metal layer on the metal pattern and the first photosensitive resin;
Forming a second photosensitive resin layer on the metal layer;
Leaving the second photosensitive resin in the previous period only on the metal pattern by photolithography, and forming a second photosensitive resin pattern;
Removing the metal layer other than the portion protected by the second photosensitive resin pattern;
Removing the pattern of the first photosensitive resin;
A method for producing a relief printing plate, comprising: In a method for producing a relief plate used for printing a high-definition pattern,
Forming a first photosensitive resin layer on the substrate;
Forming a convex pattern of the first photosensitive resin using a photolithography method;
Depositing a metal pattern in the gap between the patterns of the first photosensitive resin;
Forming a metal layer on the metal pattern and the first photosensitive resin;
Forming a second photosensitive resin layer on the metal layer;
Leaving the second photosensitive resin in the previous period only on the metal pattern by photolithography, and forming a second photosensitive resin pattern;
Forming a layer of a third photosensitive resin on the second photosensitive resin pattern;
Removing the metal layer other than the portion protected by the pattern of the third photosensitive resin;
Removing the pattern of the first photosensitive resin and the pattern of the third photosensitive resin;
A method for producing a relief printing plate, comprising: After removing the pattern of the first photosensitive resin,
6. The method for producing a relief printing plate according to claim 4, further comprising a step of coating a metal film on a side surface of the convex pattern made of metal or an exposed portion of the surface of the base material with a resin film. The relief printing method according to claim 6, wherein
A method for producing a relief printing plate, comprising using an electrodeposition method in a step of coating a resin film on a metal surface on a side surface of a convex pattern or an exposed portion of a substrate surface. The electroforming method is used for the step of forming the metal layer on the substrate,
The manufacturing method of the relief printing plate in any one of Claim 4 to 7. In the step of forming the second photosensitive resin layer,
Forming the layer by applying a coating solution of the second photosensitive resin,
In the coating solution,
Filtering process,
Defoaming treatment,
The method for producing a relief printing plate according to any one of claims 4 to 8, wherein: Supplying ink from the ink supply to the convex surface of the relief printing plate according to any one of claims 1 to 3,
Next, the step of transferring the ink on the surface of the convex portion to the printing material and forming an ink pattern;
A method for producing a printed material, comprising at least In the method for producing an organic electroluminescence device comprising at least a first electrode, one or more organic light emitting medium layers, and a second electrode,
A method for producing an organic electroluminescent element, wherein at least one layer of the organic light emitting medium layer is formed by printing using the method for producing a printed matter according to claim 10.