JP2008052167A - Method of manufacturing electro-optical device, electro-optical device, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electro-optical device for preventing peeling charge when peeling a panel structure from a stage for forming a scribe groove, and to provide the electro-optical device and electronic equipment. <P>SOLUTION: In manufacturing a liquid crystal device, large-sized substrates 100 and 200 are thinned in an etching process after forming a panel structure 300 by bonding the large-sized substrates 100 and 200. Then, a projection 330 is formed on the panel structure 300 by a lithography technology, and a space equivalent to height size of the projection 330 is formed between the lower face of the panel structure 300 and the upper face of the stage 550 when the panel structure 300 is formed on the stage 550 for forming the scribe groove. Thus, since a contact area between the panel structure 300 and the stage 550 is narrow, the peeling charge can be prevented when peeling the panel structure 300 from on the stage 550. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to a method for manufacturing an electro-optical device in which two substrates are bonded together, an electro-optical device, and an electronic apparatus.

Among various electro-optical devices, for example, an active matrix type liquid crystal device has a panel structure in which an element substrate and a counter substrate are bonded together, and liquid crystal is held between the element substrate and the counter substrate. Yes. Here, since each of the element substrate and the counter substrate is manufactured one by one, the productivity is low. Therefore, the first large substrate capable of obtaining a large number of single-size element substrates and the number of single-size counter substrates capable of being obtained. After the two large substrates are bonded together to form a large panel structure, the panel structure is divided into single-size panels.

When performing such division, for example, when dividing the first large substrate, the first large substrate 100 is placed in a state where the panel structure 300 is placed on the stage 550, as shown in FIG.
The scriber blade 500 is entered from the end of the planned dividing line for the first large substrate 100
After forming a scribe groove on the outer surface of the panel, the panel structure 300 is peeled off from the stage 550. Next, the first large substrate 100 is bent by pressing from the second large substrate 200 side on the back surface side, and the first large substrate 100 is cleaved by the bending stress. The same applies to the case of dividing the second large substrate 200 (see, for example, Patent Document 1).
JP 2002-316829 A

However, in the large substrates 100 and 200 (element substrate and counter substrate), since the glass substrate used as the base material is easily charged with static electricity, after forming the scribe groove,
When the panel structure 300 is to be peeled from the stage 550, peeling charging is likely to occur. For this reason, electrostatic breakdown of thin film transistors and wirings formed on the element substrate is likely to occur,
In some cases, there is a problem that electrostatic breakdown occurs in the substrate itself.

In view of the above problems, an object of the present invention is to provide an electro-optical device manufacturing method, an electro-optical device, and an electronic device capable of preventing peeling electrification when peeling a panel structure from a stage for forming a scribe groove. To provide equipment.

In order to solve the above-described problem, in the method for manufacturing an electro-optical device according to the present invention, a bonding step of bonding a first substrate and a second substrate to form a panel structure, and the panel structure Forming a scribe groove along a planned dividing line in a state of being placed on the stage, and dividing the panel structure into a single-size panel having a plurality of pixels in the pixel region, In the dividing step, a space is formed between the lower surface of the panel structure and the upper surface of the stage by a plurality of protrusions formed on at least one of the panel structure side and the stage side. Is placed on the stage.

In the present invention, when performing the dividing step, with the panel structure placed on the stage,
A protrusion is interposed between the lower surface of the panel structure and the upper surface of the stage. For this reason, the lower surface of the panel structure is in a state of being lifted from the upper surface of the stage by the height of the protrusion, so that the contact area between the panel structure and the stage is narrow. Therefore, when the panel structure is peeled off from the stage, almost no peeling charge is generated. Therefore, defects caused by the peeling charge such as electrostatic breakdown of the switching element, electrostatic breakdown of the wiring, and static electricity of the substrate itself. The occurrence of electric breakdown can be prevented.

In the present invention, before the dividing step, a masking step of covering the positions where the plurality of protrusions are to be formed with a mask among the outer surfaces of the panel structure, and a state in which the mask is formed on the panel structure And etching the outer surface of the panel structure to form the plurality of protrusions in the area covered with the mask in the panel structure and the first substrate and the second substrate. Is preferably made thin. If comprised in this way, formation of a some protrusion and thinning of a 1st board | substrate and a 2nd board | substrate can be performed simultaneously. Therefore, with the minimum number of steps, it is possible to prevent the occurrence of problems due to peeling charging and to reduce the thickness of the electro-optical device.

In the present invention, it is preferable that in the masking step, the mask is formed in an area outside the panel structure body and avoiding the parting line and the pixel area.
If comprised in this way, since a processus | protrusion is not formed on a parting planned line, the formation process of a scribe groove | channel will not be prevented. In addition, since the protrusion can be formed in an area avoiding the pixel area, the presence of the protrusion does not cause a problem such as deterioration of the quality of the pixel displayed in the pixel area. Further, even when optical members such as a polarizing plate and a phase difference plate are arranged so as to overlap with the image area, the projections do not prevent the arrangement of these optical members.

In the present invention, in the masking step, it is preferable that the mask is formed in a region of the panel structure that avoids a region divided as the single-size panel. With this configuration, no protrusions remain on a single panel, so the presence of protrusions
It is not hindered to reduce the thickness of the electro-optical device.

In the present invention, in the etching step, the first substrate and the second substrate are set to 0.
. It is preferable to reduce the thickness to 5 mm or less.

In the present invention, a configuration in which the plurality of protrusions are formed on the upper surface of the stage may be employed. If comprised in this way, even if it does not change the structure of a panel structure, since the contact area of a panel structure and a stage is narrow, there is little peeling charge amount at the time of peeling a panel structure from a stage. Therefore, it is possible to prevent the occurrence of defects due to peeling charging.

The electro-optical device according to the present invention can be used in electronic devices such as mobile computers and mobile phones.

Embodiments of the present invention will be described below with reference to the drawings. In the drawings used for the following description, the scales are different for each layer and each member in order to make each layer and each member large enough to be recognized on the drawing.

[Embodiment 1]
(Overall configuration of liquid crystal device)
1A and 1B are plan views of the liquid crystal device (electro-optical device) according to Embodiment 1 of the present invention, as viewed from the counter substrate side, together with the components formed thereon, and That H-H '
It is sectional drawing.

1A and 1B, the liquid crystal device 1 of the present embodiment is a TN (Twisted Nem).
atic) mode, ECB (Electrically Controlled Bir)
efficiency) mode, or VAN (Vertical Aligned)
This is a transmissive active matrix liquid crystal device in a (Nematic) mode. The liquid crystal device 1 includes a panel 30 in which a rectangular element substrate 10 (first substrate) and a rectangular counter substrate 20 (second substrate) are bonded together with a sealant 22. Then, the liquid crystal 1 f is held between the element substrate 10 and the counter substrate 20. The base material of the element substrate 10 is a glass substrate 11 having a thickness of 0.5 mm or less, further thinned to 0.25 mm or less, and the base material of the counter substrate 20 is also 0.5 mm or less in thickness. Is a glass substrate 21 thinned to 0.25 mm or less. In this embodiment, non-alkali glass substrates are used as the glass substrates 11 and 21.

The sealing material 22 is an adhesive made of a photo-curing resin or a thermosetting resin for bonding the element substrate 10 and the counter substrate 20 around them, and is used for setting the distance between the substrates to a predetermined value. Gap materials such as glass fiber or glass beads are blended. A liquid crystal injection port 25 is formed in the sealing material 22 by the discontinuous portion, and after the liquid crystal 1f is injected, the sealing material 250 is sealed.

In the element substrate 10, the pixel transistors 1 c and the pixel electrodes 2 a are formed in a matrix shape in a region surrounded by the sealing material 22, and an alignment film 19 is formed on the surface thereof. On the counter substrate 20, a frame 26 (not shown in FIG. 1B) made of a light-shielding material is formed in an inner region of the sealing material 22, and an inner side thereof is an image display region 1 a (pixel region). . Although not shown, a light shielding film called a black matrix or black stripe is formed on the counter substrate 20 in a region facing the vertical and horizontal boundary regions of each pixel. An alignment film 29 is formed. In the counter substrate 20,
In a region facing each pixel of the element substrate 10, RGB color filters (not shown) are formed together with the protective film, so that the liquid crystal device 1 can be used for electronic devices such as mobile computers, mobile phones, and liquid crystal televisions. It can be used as a color display device. In addition,
As schematically shown in FIG. 1A, a sealing material 2 is provided between the element substrate 10 and the counter substrate 20.
The common wiring formed on the element substrate 10 and the counter electrode 28 of the counter substrate 20 are electrically connected by the conductive material 23 for inter-substrate conduction blended in No. 2 and the like.

The element substrate 10 is larger than the counter substrate 20, and the element substrate 10 includes an extended region 15 that protrudes from the substrate edge of the counter substrate 20 outside the sealing material 22. An IC mounting region 1 s is formed in the overhang region 15, and a driving IC 60 including a gate line driving circuit 66 and a source line driving circuit 67 is provided in the IC mounting region 1 s by COG (Chip On G).
lass). Further, a substrate connection region 1t is formed in the projecting region 15 of the element substrate 10 on the outer peripheral side of the IC mounting region 1s, and a flexible wiring substrate 70 is connected to the substrate connection region 1t. Accordingly, in the element substrate 10, the wiring lines 1x and 1y extend from the image display region 1a to the IC mounting region 1s through the outer region 1b of the image display region 1a, and the IC mounting region 1s and the substrate connection are connected. A wiring (not shown) is formed between the region 1t and the region 1t.

(Manufacturing method of the liquid crystal device 1)
FIG. 2 is an explanatory view up to a bonding step in manufacturing the liquid crystal device shown in FIG.
Each of (a), (b), and (c) includes a first large substrate (first substrate), a second large substrate (second substrate), and a first substrate used for manufacturing the liquid crystal device. The large-sized panel structure which bonded together the large sized board | substrate and the 2nd large sized board | substrate is shown. FIG. 3 is an explanatory diagram of a masking process in manufacturing the liquid crystal device shown in FIG. 1, and in each of FIGS. 3A and 3B, a state in which a mask is formed on the panel structure, and A state in which the mask formed on the first large substrate is enlarged is shown. FIG. 4 is an explanatory diagram of an etching process in manufacturing the liquid crystal device shown in FIG.
Each of (a) and (b) shows a state after the etching process is performed on the panel structure and a state in which a plurality of protrusions formed on the first large substrate are enlarged. FIG. 5 is an explanatory diagram of a dividing process when the liquid crystal device shown in FIG. 1 is manufactured. In each of FIGS. 5A, 5B, and 5C, a large panel structure is formed in a strip shape. It shows a state after dividing, a state after a strip-shaped panel structure is divided into single-size panels, and a state after an overhang region is formed on a single-size panel. FIG. 6 is an explanatory diagram showing how scribe grooves are formed in the dividing step when the liquid crystal device shown in FIG. 1 is manufactured. 2, 3, 4 and 5,
A state where a large substrate or a panel structure is viewed from the upper surface side (the side from which the display light is emitted) and an arrow T
As shown in FIG. 2, the state is reversed and viewed from the lower surface side (the side opposite to the side from which the display light is emitted).

In the liquid crystal device 1 of this embodiment, both the element substrate 10 and the counter substrate 20 have a substrate thickness of 0.5 mm or less, and further 0.25 mm or less. However, if a thin substrate is used from the beginning, the substrate may be broken when the pixel transistor 1c, the pixel electrode 2a, the counter electrode 28, and the like are formed using a semiconductor process. The element substrate 10 and the counter substrate 20
If each is manufactured one by one, productivity is low.

Therefore, in this embodiment, as shown in FIGS. 2A and 2B, a large number of first large-sized glass substrates 100 capable of obtaining a large number of single-sized element substrates 10 and a large number of single-sized counter substrates 20 are provided. The second large substrate 200 made of thick glass that can be taken is prepared, and these large substrates 10 are prepared.
With respect to 0 and 200, a plurality of components such as the pixel transistor 1c, the pixel electrode 2a, and the counter electrode 28 described with reference to FIGS. A substrate portion is formed.

Next, in the bonding step, the sealing material 22 (FIG. 1A) is applied to each of the regions cut out as the element substrate 10 or the counter substrate 20 with respect to the first large substrate 100 or the second large substrate 200. , (B)) is applied or printed, and then, as shown in FIG. 2B, the large substrates 100 and 200 are bonded to each other by the sealing material 22 to form a large panel structure 300.

Here, since the first large-sized substrate 100 and the second large-sized substrate 200 are divided in a dividing step to be described later, in FIG. 2 to FIG. It is indicated by a one-dot chain line. In the present embodiment, the planned dividing line is a plurality of lines extending in one direction at positions where the outer surfaces on both sides of the panel structure 300 (the outer surface of the first large substrate 100 and the outer surface of the second large substrate 200) overlap. First dividing lines 301 and 302 and the outer surfaces on both sides of the panel structure 300 (the outer surface of the first large substrate 100 and the outer surface of the second large substrate 200) overlap each other. A plurality of second dividing planned lines 303 and 304 extending in a direction intersecting with the planned lines 301 and 302 and one outer surface of the panel structure 300 (the outer surface of the second large substrate 200) 1 planned dividing line 301, 302
And a plurality of third dividing lines 305 extending in parallel with each other.

Next, in the masking step, as shown in FIGS. 3A and 3B, a plurality of protrusions 33 described with reference to FIG. 4 out of both surfaces of the panel structure 300 using photolithography technology.
A position where 0 is to be formed is covered with a mask 340 made of a photosensitive resin. In this embodiment, the mask 340 is formed at a position on both surfaces of the panel structure 300 that avoids a region (a hatched region in FIG. 3A) where the single-size panel 30 is cut out. For this reason, the mask 340 is formed in an area that avoids the position overlapping the dividing lines 301 to 305 and avoids the image display area 1a (pixel area). In this embodiment, the panel 30
Is cut out from a position adjacent to the panel structure 300 with one of the planned cutting lines 301 to 304 interposed therebetween, so that the mask 340 is formed in a frame-like region along the outer peripheral edge of the panel structure 300. The region is a material removal region that is removed when the panel structure 300 is divided.

Next, in the etching process (thinning process), the etching including hydrofluoric acid is performed in a state where the gap between the large substrates 100 and 200 opened at the outer peripheral edge of the panel structure 300 is closed with a coating material such as epoxy resin or pitch-based paint. The panel structure 300 is immersed in the liquid, and the outer surface of the panel structure 300 (the outer surface of the large substrates 100 and 200) is etched, and the large substrates 100 and 200 are 0.5 mm as shown in FIG. Thereafter, the thickness is further reduced to 0.25 mm or less.

Next, after removing the mask 340, the panel structure 300 is cleaned. The epoxy resin or pitch paint used as the coating material may be removed with a solvent or the like, but it is preferable to remove the portion to which the coating material is adhered by a cutting process described below. In addition to wet etching, dry etching may be employed for etching the substrate.

When the etching process is performed in this manner, the large substrates 100 and 200 can be thinned as shown in FIGS. 4A and 4B, and the mask structure 340 is provided on both sides of the panel structure 300. The protrusion 330 can be formed in each of the plurality of covered regions. Further, the protrusion 330 is a region where the panel 30 is cut out in the panel structure 300 (FIG. 3B).
) In the region avoiding the hatched region).

Next, a dividing step is performed. In this dividing step, first, the panel structure 300 (the first large substrate 100 and the second large substrate 200) is divided along the first dividing lines 301 and 302 shown in FIG. A strip-shaped panel structure 350 shown in FIG. 5A is obtained.

In the dividing step, for example, to divide the first large substrate 100, first, FIG.
As shown in FIG. 2, the panel structure 300 is placed on the stage 5 with the second large substrate 200 facing downward.
50, the scriber blade 500 is made to enter the first large substrate 100 from the end of the first dividing line 301, and the scribe groove is formed along the first dividing line 301. Form. Next, after peeling the panel structure 300 from the stage 550 and turning it upside down,
The first large substrate 200 is pressed by a break bar, a break roller or the like from the first large substrate 200 side.
The large substrate 100 is bent, and the first large substrate 100 is cleaved by the bending stress. The same method is used when cleaving the second large substrate 200.

When performing such a dividing step, since the plurality of protrusions 330 are formed on the outer surfaces of the first large substrate 100 and the second large substrate 200, the panel structure 300 is placed on the stage 55.
The protrusion 330 is interposed between the lower surface of the panel structure 300 and the upper surface of the stage 550 in a state of being placed on the zero. For this reason, a space corresponding to the height dimension of the projection 330 is formed between the lower surface of the panel structure 300 and the upper surface of the stage 550, and the lower surface of the panel structure 300 extends from the upper surface of the stage 550 to the projection 330. It is in a state of floating by the height dimension. Therefore, since the contact area between the panel structure 300 and the stage 550 is narrow, when the panel structure 300 is peeled off from the stage 550, peeling charge hardly occurs.

In this way, when the large panel structure 300 is divided into the strip-shaped panel structure 350, the discontinuous portion of the sealing material 22 shown in FIG. Therefore, after the liquid crystal is injected into the panel from the liquid crystal injection port 25, the liquid crystal injection port 25 is sealed with the sealing material 250.

Next, the strip-shaped panel structure 350 is divided along the second planned dividing lines 303 and 304 shown in FIG. 5A, and as shown in FIG. obtain. Even when the division is performed, as shown in FIG. 6, in order to divide the first large substrate 100, the panel structure 350 is placed on the stage 550 with the second large substrate 200 facing downward. , First
A scribe groove is formed in the large substrate 100 along the second planned dividing line 303 by the scribe blade 500. Next, after peeling the panel structure 350 from the stage 550 and turning it upside down, the first large substrate 100 is bent by being pressed from the second large substrate 200 side by a break bar, a break roller, or the like. The first large substrate 100 is cleaved by the bending stress. The same method is used when cleaving the second large substrate 200.

Even when performing such a dividing step, since the projections 330 are formed on both ends of the strip-shaped panel structure 350, the panel structure 350 is placed on the stage 550. A protrusion 330 is interposed between the lower surface of the panel structure 350 and the upper surface of the stage 550. For this reason, the lower surface of the panel structure 350 is in a state of being lifted from the upper surface of the stage 550 by the height dimension of the protrusion 330. Therefore, since the contact area between the panel structure 350 and the stage 550 is narrow, when the panel structure 350 is peeled off from the stage 550, peeling charging hardly occurs.

Next, the counter substrate 20 is divided along the third dividing line 305 shown in FIG. 5B, and as shown in FIG. 5C, the overhanging region of the element substrate 10 in the counter substrate 20. 15 is removed, and the IC mounting region 1s and the substrate connection region 1t formed in the overhanging region 15 are removed.
Open the top of. Also when performing such division, after placing the panel 30 on the stage 550 with the element substrate 10 facing downward, the counter substrate 20 is crushed by the scribe blade 500,
A scribe groove is formed along the third planned dividing line 305. Next, after peeling the panel 30 from the stage 550 and turning it upside down, as a break process, the opposing substrate 20 is bent by pressing from the side of the element substrate 10 with a break bar or a break roller, and the bending stress is applied. The counter substrate 20 is cleaved. When performing such a cutting process, the panel 30 does not already have the protrusion 330, so the lower surface of the panel 30 and the upper surface of the stage 550 are in close contact, but unlike the panel structures 300 and 350, the panel 30 Panel 30 because its own area is small
And the contact area between the stage 550 is narrow. Therefore, when the panel 30 is peeled off from the stage 550, peeling charging hardly occurs.

(Main effects of this form)
As described above, in the method for manufacturing the liquid crystal device 1 according to the present embodiment, the panel structures 300 and 35 are placed on the stage 550 when the dividing process is performed.
A protrusion 330 is interposed between the lower surface of 0 and the upper surface of the stage 550. For this reason, since the lower surfaces of the panel structures 300 and 350 are in a state of being lifted from the upper surface of the stage 550 by the height of the protrusion, the contact area between the panel structures 300 and 350 and the stage 550 is small. Therefore, when the panel structures 300 and 350 are peeled off from the stage 550, almost no peeling charge is generated. Therefore, defects caused by the peeling charge, such as electrostatic breakdown of pixel switching elements, electrostatic breakdown of wiring, Can prevent electrostatic breakdown of the substrate itself.

Further, in this embodiment, both surfaces of the panel structure 300 are etched in a state where the mask 340 is formed on the panel structure 300, so that the large substrates 100 and 200 can be thinned and the both surfaces of the panel structure 300 can be formed. Protrusions 330 in the area covered by the mask 340
Can be formed. Therefore, with the minimum number of steps, it is possible to prevent the occurrence of defects due to peeling electrification and to reduce the thickness of the liquid crystal device 1.

Further, in the masking process, the mask 340 is formed in the area of the panel structure 300 that avoids the area that is divided as the single-size panel 30, so that no protrusion 330 remains on the single-panel 30. Therefore, the thickness of the liquid crystal device 1 is not hindered by the presence of the protrusion 330. Moreover, since the projection 330 is formed at a position avoiding the parting lines 301 to 305, the formation of the scribe groove is not hindered. Furthermore, since the protrusion 330 is formed in an area avoiding the image display area 1a, the presence of the protrusion 330 does not cause a problem such as deterioration of the quality of pixels displayed in the pixel display area 1a. Furthermore, the pixel display area 1a
However, even when optical members such as a polarizing plate and a phase difference plate are arranged so as to overlap each other, the protrusion 330 does not prevent the arrangement of these optical members.

Further, in the present embodiment, since wet etching is employed in the etching process, there are advantages such that a large number of panel structures 300 can be collectively processed as compared with dry etching.

[Embodiment 2]
FIG. 7 is an explanatory view showing a method for manufacturing a liquid crystal device according to Embodiment 2 of the present invention.
Each of a) and (b) shows a state after the masking process is performed on the panel structure and a state after the etching process is performed. FIG. 8 is an explanatory diagram showing how scribe grooves are formed in the dividing step when the liquid crystal device according to the second embodiment of the present invention is manufactured. Since the basic configuration of the present embodiment and later-described third and fourth embodiments is the same as that of the first embodiment, common portions are denoted by the same reference numerals and description thereof is omitted. To do.

Also in this embodiment, as shown in FIG. 7A, the first large substrate 100 and the second large substrate 2 are used.
00, each component such as the pixel transistor 1c, the pixel electrode 2a, and the counter electrode 28 described with reference to FIGS. 1A and 1B is divided into a plurality of substrates using a semiconductor process or the like. In the bonding step, the large substrates 100 and 200 are bonded to each other with the sealing material 2.
2 (see FIGS. 1A and 1B) to form a large panel structure 300.

Here, as in the first embodiment, the planned dividing line for the large panel structure 300 is the outer surface on both sides of the panel structure 300 (the outer surface of the first large substrate 100 and the outer surface of the second large substrate 200). A plurality of first dividing lines 301 and 302 extending in one direction at positions where the surface overlaps, and outer surfaces on both sides of the panel structure 300 (the outer surface of the first large substrate 100 and the second large substrate). 200 at the overlapping position of the outer surface 200)
A plurality of second parting lines 303 and 304 extending in a direction intersecting with 01 and 302 and one outer surface of panel structure 300 (outer surface of second large substrate 200) A plurality of third scheduled dividing lines 305 extending in parallel with the planned dividing lines 301 and 302 are included.

However, in the present embodiment, the first parting lines 301 and 302 and the second parting line 303, are arranged at the boundary part of the area cut out as the panel 30 (the area hatched in FIG. 7A). Two 304 are set. For this reason, in the panel structure 300,
A frame-shaped region along the outer peripheral edge, a region sandwiched between the two first scheduled dividing lines 301 and 302, and a region sandwiched between the two second scheduled dividing lines 303 and 304 are the panel structure 300. It is a material removal area | region removed when dividing | segmenting.

Next, in the masking process, the position where the plurality of protrusions 330 described with reference to FIG. 7B are to be formed on both surfaces of the panel structure 300 using a photolithographic technique is a mask made of a photosensitive resin. Cover with 340. In the present embodiment, the frame-shaped region along the outer peripheral edge of the panel structure 300 and the two second scheduled dividing lines 303 and 304 on both surfaces of the panel structure 300.
A mask 340 is formed in a region sandwiched between the regions (between regions where the panel 30 is cut out).

Next, in the etching process (thinning process), etching including hydrofluoric acid in a state where the gap between the large substrates 100 and 200 opened at the outer periphery of the panel structure 300 is closed with a coating material such as epoxy resin or pitch-based paint. The panel structure 300 is immersed in the liquid, and the outer surface of the panel structure 300 (the outer surfaces of the large substrates 100 and 200) is etched.

As a result, the large substrates 100 and 200 can be thinned to 0.5 mm or less, and further to 0.25 mm or less, and a plurality of protrusions are formed on both surfaces of the panel structure 300 as shown in FIG. 330 can be formed. Further, the protrusion 330 is formed by the panel structure 30.
It is formed in a region avoiding the region where the panel 30 is cut out at 0 (the hatched region in FIG. 7B). More specifically, a frame-shaped region along the outer peripheral edge of the panel structure 300,
And the protrusion 330 is formed with respect to the area | region (between the area | regions where the panel 30 is cut out) pinched | interposed by the 2nd 2nd parting lines 303 and 304. FIG.

Next, as in the first embodiment, a cutting process is performed to obtain a single-sized panel 30. When performing the dividing step, the panel structures 300 and 350 are placed on the stage 550 as shown in FIG. 8, but the protrusion 330 is placed between the lower surface of the panel structures 300 and 350 and the upper surface of the stage 550. Will intervene. For this reason, the lower surfaces of the panel structures 300 and 350 are in a state of being lifted from the upper surface of the stage 550 by the height of the protrusions.
, 350 and the stage 550 have a small contact area. Therefore, when the panel structures 300 and 350 are peeled off from the stage 550, almost no peeling charge is generated. Therefore, defects caused by the peeling charge, such as electrostatic breakdown of pixel switching elements, electrostatic breakdown of wiring, Produces the same effects as those of the first embodiment, such as prevention of electrostatic breakdown of the substrate itself.

Moreover, in this embodiment, with respect to the frame-shaped region along the outer peripheral edge of the panel structure 300 and the region sandwiched between the two second planned dividing lines 303 and 304 (between the region where the panel 30 is cut out). Since the protrusion 330 is formed, the panel structure 300 is mounted on the stage 550 as shown in FIG.
In the state of being placed on top, the projection 330 is interposed between the lower surface of the panel structure 300 and the upper surface of the stage 550 in addition to the end portion thereof. For this reason, since the panel structure 300 is supported by the many protrusions 330, the inner structure is not bent. Therefore, the scribe groove can be formed in the panel structure 350 with high accuracy.

In particular, the strip-shaped panel structure 350 is different from the first embodiment in the state where the panel-shaped panel structure 350 is formed by dividing the panel structure 300 along the first scheduled dividing lines 301 and 302. Thus, the protrusions 330 are present not only at both ends thereof but also in the middle of the length direction. For this reason, in a state where the strip-shaped panel structure 350 is placed on the stage 550, the space between the lower surface of the panel structure 350 and the upper surface of the stage 550 is not only at both ends, but in the middle in the length direction. Further, since the protrusion 330 is interposed, the panel structure 350 is not bent in the middle portion in the length direction. Therefore, the scribe groove can be formed in the panel structure 350 with high accuracy.

[Embodiment 3]
FIG. 9 is an explanatory view showing a method of manufacturing a liquid crystal device according to Embodiment 3 of the present invention, and shows a state in which protrusions are formed on the panel structure.

In the first and second embodiments, the mask 340 (protrusions 330) is formed in the material removal region that is removed when the panel structure 300 is divided. However, as shown in FIG. The protrusion 330 may be formed in an area where the image display area 1 is avoided among the areas to be displayed. For example, among the outer surface of the first large substrate 100, the region corresponding to the overhang region 15 described with reference to FIGS. 1A and 1B, and the outer surface of the second large substrate 200, FIG.
A region overlapping with the overhang region 15 described with reference to (a) and (b) (first dividing line 3
The protrusion 330 may be formed in a region between the line 02 and the third planned dividing line 305.

Further, among the outer surfaces of the first large substrate 100 and the second large substrate 200, FIG.
), Protrusion 3 in the region corresponding to the end opposite to the overhang region 15 described with reference to FIG.
30 may be formed.

[Embodiment 4]
FIG. 10 is an explanatory view showing a method of manufacturing a liquid crystal device according to Embodiment 4 of the present invention, and is an explanatory view showing a state in which a scribe groove is formed in the dividing step.

In the first to third embodiments, the panel structures 300 and 350 are placed on the stage 55 in the dividing step.
When the lower surfaces of the panel structures 300 and 350 are floated from the upper surface of the stage 550 in a state of being placed on the surface 0, protrusions are formed on the panel structures 300 and 350. However, as shown in FIG. Instead of forming protrusions on the panel structures 300 and 350, a plurality of protrusions 560 are formed on the upper surface of the stage 550.

Even in such a configuration, the lower surfaces of the panel structures 300 and 350 are in a state of being lifted from the upper surface of the stage 550 by the height of the protrusions. Is narrow. Therefore, the panel structures 300 and 350 are placed on the stage 55.
When peeling from 0, almost no peeling charge is generated.
For example, it is possible to prevent electrostatic breakdown of the pixel switching element, electrostatic breakdown of the wiring, and further electrostatic breakdown of the substrate itself.

[Other embodiments]
In the above embodiment, the break process is performed after the scribe groove forming process as the dividing process. For example, the substrate is bent in advance, and then the scribe groove is formed. The present invention may be applied in the case where a method such as dividing the substrate by strengthening is adopted.

In the above embodiment, the TN mode, ECB mode, and VAN mode active matrix liquid crystal devices have been described as examples. However, IPS (In-Plane Switchin) has been described.
g) The present invention may be applied to a mode liquid crystal device (electro-optical device).

Furthermore, the present invention may be applied not only to a liquid crystal device as an electro-optical device, but also to, for example, an organic EL (electroluminescence) device, and other electro-optical devices.

[Embodiment of Electronic Device]
FIG. 11 shows an embodiment in which the liquid crystal device according to the present invention is used as a display device of various electronic devices. The electronic device shown here is a personal computer, a mobile phone, or the like, and includes a display information output source 170, a display information processing circuit 171, a power supply circuit 172, a timing generator 173, and the liquid crystal device 1. Further, the liquid crystal device 1 includes a panel 175 and a drive circuit 176, and the above-described liquid crystal device 1 can be used. The display information output source 170 includes a ROM (Read Only Memory) and a RAM (Random).
A memory unit such as an access memory), a storage unit such as various disks, a tuning circuit that tunes and outputs a digital image signal, and a display such as an image signal of a predetermined format based on various clock signals generated by the timing generator 173 Information is supplied to the display information processing circuit 171. The display information processing circuit 171
It is equipped with various known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, a clamp circuit, etc., and executes processing of input display information,
The image signal is supplied to the drive circuit 176 together with the clock signal CLK. The power supply circuit 172 supplies a predetermined voltage to each component.

(A), (b) is the top view which looked at the liquid crystal device (electro-optical device) based on Embodiment 1 of this invention from the opposing substrate side with each component formed on it, respectively, and its H It is -H 'sectional drawing. It is explanatory drawing to the bonding process at the time of manufacturing the liquid crystal device shown in FIG. It is explanatory drawing of the masking process at the time of manufacturing the liquid crystal device shown in FIG. It is explanatory drawing of the etching process at the time of manufacturing the liquid crystal device shown in FIG. It is explanatory drawing of the cutting process at the time of manufacturing the liquid crystal device shown in FIG. It is explanatory drawing of a mode that a scribe groove | channel is formed in a division | segmentation process when manufacturing the liquid crystal device shown in FIG. It is explanatory drawing which shows the manufacturing method of the liquid crystal device which concerns on Embodiment 2 of this invention. It is explanatory drawing of a mode that a scribe groove | channel is formed in a parting process when manufacturing the liquid crystal device which concerns on Embodiment 2 of this invention. It is explanatory drawing which shows the manufacturing method of the liquid crystal device which concerns on Embodiment 3 of this invention. When manufacturing the liquid crystal device which concerns on Embodiment 4 of this invention, it is explanatory drawing of a mode that a scribe groove | channel is formed in a parting process. It is explanatory drawing at the time of using the liquid crystal device which concerns on this invention as a display apparatus of various electronic devices. It is explanatory drawing which shows a mode that a scribe groove | channel is formed in the manufacturing method of the conventional liquid crystal device.

Explanation of symbols

1 .... Liquid crystal device, 10 .... Element substrate (first substrate), 20 .... Counter substrate (second substrate),
30 .. Panel of single size, 100 .. First large substrate (first substrate), 200 .. Second large substrate (second substrate), 300, 350 .. Panel structure, 301, 302 .. First division line 303, 304. Second division line 305. Third division line
330 .. Projection of panel structure, 340 .. Mask, 500 .. Scribe blade, 550.
.Stage, 560, ... Stage protrusion

Claims (8)

In the method of manufacturing the electro-optical device,
A bonding step of bonding a first substrate and a second substrate to form a panel structure;
A dividing step of forming a scribe groove along a planned dividing line in a state where the panel structure is placed on a stage, and dividing the panel structure into a single-size panel having a plurality of pixels in a pixel region; Have
In the dividing step, a plurality of protrusions formed on at least one of the panel structure side and the stage side form a space between the lower surface of the panel structure body and the upper surface of the stage to thereby form the panel structure body. A method of manufacturing an electro-optical device, which is mounted on the stage. Before the dividing step, a masking step of covering the positions on the outer surface of the panel structure body where the plurality of protrusions are to be formed with a mask, and the panel structure with the mask formed on the panel structure body And an etching process for etching the outer surface of the body,
2. The electro-optical device according to claim 1, wherein the plurality of protrusions are formed in an area covered with the mask in the panel structure and the first substrate and the second substrate are thinned. Manufacturing method. 3. The electro-optical device according to claim 2, wherein, in the masking step, the mask is formed in an area outside the panel structure body in a region avoiding the parting line and the pixel region. Production method. 4. The method of manufacturing an electro-optical device according to claim 3, wherein, in the masking step, the mask is formed in a region of the panel structure that avoids a region divided as the single-size panel. 5. The electro-optical device manufacturing method according to claim 2, wherein in the etching step, the first substrate and the second substrate are thinned to a thickness of 0.5 mm or less. 6. Method. The method of manufacturing an electro-optical device according to claim 1, wherein the plurality of protrusions are formed on an upper surface of the stage. An electro-optical device manufactured by the method according to claim 1.   An electronic apparatus comprising the electro-optical device according to claim 7.

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