JP2008040810A - Molded product for RFID system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a molding for an RFID system, which secures a communication distance and operation of an RF tag and obtains an anti-static property. <P>SOLUTION: The molding includes a molded dicing frame 1 for a semiconductor wafer and the RF tag 11 of an RFID system 10, which is stuck to the exposed face of the dicing frame 1, and the exposed face of the dicing frame 1 is divided into a sticking area 20 for the RF tag 11 and a non-sticking area 21, and the non-sticking area 21 of the dicing frame 1 is subjected to surface treatment so that the surface resistance value is within a range from 1.E+03 Ω to 5.E+12 Ω and the time required when charge voltage of 5 kV in FTMS 101B method 4046-1969 is attenuated to 500 V is 5 seconds or shorter. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a molded product for an RFID system that can secure the communication distance and operation of an RF tag and obtain antistatic properties.

  In recent years, RFID systems that have a large data capacity and are resistant to dirt have been expected as next-generation technologies that replace barcodes. This RFID system is also called a mobile object identification device, a mobile object identification system, or an IC tag system, and transmits and receives radio waves by an electromagnetic induction method between an RF tag attached to a mobile object (not shown) and this RF tag. A reader / writer that accesses the internal memory of the RF tag and a computer that controls the reader / writer are configured and used for product information management, information processing information management, and the like (Patent Document 1, 2, 3, 4).

  Although a mobile body is manufactured using various materials, since a problem arises according to the field | area used or the characteristic of material, it is covered by various techniques. For example, when a moving body or an RFID system is used in the fields of electrical electronics and semiconductors, antistatic technology is used from the viewpoint of preventing the problem of electrostatic breakdown of electronic components and semiconductors. As this antistatic technique, for example, a technique of molding a moving body using a molding material having a predetermined surface resistivity can be cited.

  In addition, when molding a moving body using a molding material, if the resistance value of the moving body is too low, so-called “electric shock” occurs, which causes defects in appearance and performance. Is roughly 1. E + 04Ω / □ to 1. It is necessary to mold the moving body using a molding material adjusted to E + 13Ω / □.

An RF tag of an RFID system, which is also called an IC tag or a transponder, includes an attachment piece attached to a moving body, an IC chip attached to the attachment piece, and an antenna connected to the IC chip. Information and electric power are transmitted from the reader / writer using mutual induction of coils by an alternating magnetic field. The reader / writer includes an antenna that transmits and receives radio waves to and from the antenna of the RF tag to read and write data without contact, and a controller that controls communication with the RF tag and is connected to a computer.
JP 2000-175945 A Japanese Patent Application Laid-Open No. 07-233243 Japanese Patent Application Laid-Open No. 06-49213 JP-A-10-95811

  The RFID system is configured as described above. When the moving body is manufactured as a dicing frame for a semiconductor wafer using a low resistance material such as metal, the magnetic flux from the reader / writer moves. There is a problem that it becomes difficult to pass through the antenna of the RF tag by making it parallel on the body, that is, the surface of the metal, the induced electromotive force is not sufficiently generated, and the original communication distance cannot be secured.

  Further, there is a problem that the inductance of the RF tag antenna changes due to the influence of metal to change the resonance frequency, resulting in a decrease in the communication distance. Furthermore, there is a problem that eddy current is generated in the metal by energy from the reader / writer and Joule heat is generated, and energy loss is caused by the Joule heat to hinder the operation of the RF tag.

  As means for solving such a problem, (1) a soft magnetic sheet having a high magnetic permeability is interposed between the metal moving body and the RF tag, and an inductance and a capacitor are provided so as to obtain a predetermined resonance frequency. A method of redesigning and interposing a highly conductive metal between the metal moving body and the soft magnetic sheet. (2) Forming the moving body using conductive plastic instead of the metal moving body. (3) A method of forming a moving body using an insulating plastic instead of a metal moving body is conceivable.

  However, when the method (1) is used, although the communication distance and the operation of the RF tag can be secured, the cost is increased, and a soft magnetic sheet or a highly conductive metal is used. A large problem such as an increase in the weight, enlargement, and thickness of the RF tag will newly arise.

  In addition, when the method (2) is used, the cost can be reduced, the weight can be reduced, and the antistatic can be achieved. However, since the resistance value is too low, the communication distance is reduced, and the electric shock reduces the appearance. This will cause performance problems. Furthermore, in the case of the method (3), the communication distance and the operation of the RF tag can be secured, but there is a possibility that electronic parts and semiconductors may be damaged or dust may be attached due to static electricity.

  The present invention has been made in view of the above, and an object of the present invention is to provide a molded product for an RFID system that can secure the communication distance and operation of an RF tag and obtain antistatic properties.

In the present invention, in order to solve the above problems, an RF tag of the RFID system is attached to the exposed surface of the molded body,
The exposed surface of the molded body is divided into a mounting area and a non-mounting area for the RF tag, and the non-attached area of the molded body is subjected to surface treatment so that the surface resistance value is 1. E + 03Ω or more It is characterized in that the time until the charge voltage 5 kV of E + 12Ω or less and the FTMS 101B Method 4046-1969 standard decays to 500 V is 5 seconds or less.

The molded body can be any of a dicing frame for semiconductor wafers, an IC tray, a lead frame case, or a mask case.
Further, surface treatment can be performed by applying a conductive resin solution in which a conductive material is dispersed in a resin dissolved in a solvent to a non-attached region of the molded body.

Further, the solubility index of the resin of the conductive resin solution can be made closer to the solubility index of the molding material of the molded body.
Alternatively, the conductive material of the conductive resin solution may be conductive carbon, metal oxide, or lithium ion conductive material.

Furthermore, a method for processing a molded product for an RFID system, in which an RF tag of the RFID system is attached to an exposed surface of the molded body,
The exposed surface of the molded body is divided into a mounting area and a non-mounting area for the RF tag, and the non-attached area of the molded body is subjected to surface treatment so that the surface resistance value is 1. E + 03Ω or more The time until the charge voltage 5 kV of E + 12Ω or less and the charge voltage 5 kV of the FTMS 101B Method 4046-1969 standard is attenuated to 500 V may be adjusted to 5 seconds or less.

  Here, the molded body in the claims is mainly a molded body used in the fields of electric and electronics and semiconductors, but is used in other fields (for example, home appliances and automobile production lines). The molded product is not particularly excluded. The molding of the molded body is mainly an injection molding method, but may be a compression molding method or an extrusion molding method. The RFID system is classified into an electromagnetic coupling method, an electromagnetic induction method, a radio wave method, and the like, but is not particularly limited.

  The frequency used in the RFID system is not particularly limited as long as it satisfies the Radio Law, Radio Law Construction Rules, Safety Standards, etc., but the 13.56 MHz band and 950 MHz that can be used in most countries. The band, 2.4 GHz, and 135 kHz or less are preferable. The RF tag includes a label shape, a cylindrical shape, a card shape, a box shape, and the like, but is not particularly limited. A reading device that transmits and receives radio waves to and from the RF tag includes an antenna and a controller integrally or separately, and is connected to a control device including a computer or the like. Furthermore, the unit of the surface resistance value may be Ω, but can also be expressed by Ω / □.

  According to the present invention, conductive carbon or the like is not easily added to the molded body, but a surface treatment is applied to the non-attached region of the molded body to reduce its resistance value to 1. E + 03Ω or more Since the time until the charge voltage 5 kV of the FTMS 101B Method 4046-1969 standard is attenuated to 500 V is adjusted to 5 seconds or less, it is possible to secure the original communication distance of the RFID system.

  The lower limit of the surface resistance value in the non-attached area of the exposed surface is set to 1. Since E + 03Ω, the antistatic property and the like can be secured and the communication distance can be prevented from being shortened. In addition, since generation of Joule heat can be suppressed, energy loss does not occur so much that the operation of the RF tag is hindered.

According to the present invention, there is an effect that the communication distance and operation of the RF tag can be ensured and the antistatic property can be obtained.
In addition, if a surface treatment is performed by applying a conductive resin solution in which a conductive material is dispersed in a resin dissolved in a solvent to a non-attachment region of the molded body, a special device composed of a sputtering device, an ion implantation device, or the like. Surface treatment can be easily performed without using a dedicated apparatus.

  Furthermore, if the conductive material of the conductive resin solution is conductive carbon, metal oxide, or lithium ion conductive material, particularly lithium ion conductive material, antistatic properties and RF tag operability can be obtained. It becomes possible to make it compatible easily.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. A molded product for an RFID system according to the present embodiment is a dicing frame 1 for a semiconductor wafer, which is a molded body, as shown in FIGS. And an RF tag 11 of the RFID system 10 attached to the exposed surface of the dicing frame 1.

  As shown in FIGS. 1 and 2, a dicing frame 1 for a semiconductor wafer is a frame in which a semiconductor wafer W having a diameter of 300 mm is fitted and received through a gap by being injection-molded into a hollow flat substantially ring shape by a predetermined molding material. 2, and a UV-type dicing tape 3 that detachably adheres and holds the semiconductor wafer W accommodated in the hollow of the frame 2 is detachably adhered to the back surface of the frame 2. The semiconductor wafer W is used in a dicing process, a die bonding process, or the like with the semiconductor wafer W mounted and held thereon.

  The frame 2 is made of a molding material containing, for example, a thermoplastic resin (polypropylene, ABS, polystyrene, polymethyl methacrylate, vinyl chloride, polycarbonate, nylon resin, polyphenylene sulfide, aromatic polysulfone, etc.) or a necessary filler from the semiconductor wafer W. It is formed in a flat ring-shaped flat plate that is one size larger, and has a substantially triangular positioning notch 4 on both sides of the front part, and a rectangular storage hole 5 is drilled horizontally in the rear part of the surface. At the same time, the RF tag 11 is stuck in the storage hole 5 via an adhesive layer.

  The frame 2 has a bending elastic modulus at room temperature in the industry standard ASTM D790 of preferably 25 to 50 GPa, preferably 25 to 40 GPa, and a bending strength at room temperature in ASTM D790 of 150 to 600 MPa, preferably 150 to 400 MPa. It is said. This is because the strength of the frame 2 is reduced or the frame 2 is easily damaged when the values of the flexural modulus and the bending strength are out of the range.

  As shown in FIG. 1 and FIG. 2, the RFID system 10 has a small RF tag 11 attached in the housing hole 5 of the frame 2 and an electromagnetic wave between the RF tag 11 by electromagnetic induction (see FIG. 1). A reader / writer 12 that transmits / receives an access to the internal memory of the RF tag 11 and a computer 15 that controls the reader / writer 12, and is transmitted / received between the RF tag 11 and the reader / writer 12. The frequency of the radio wave is 13.56 MHz, for example, 13.56 MHz ± 7 kHz, 13.56 MHz ± 150 kHz, or 13.56 MHz ± 450 kHz.

  As shown in FIG. 2, the RF tag 11 includes a flexible thin film substrate that is attached to the housing hole 5 of the frame 2 via an adhesive layer, an IC chip that is attached to the film substrate, And an antenna connected to the IC chip, and a label type is formed by laminating an adhesive layer for frame attachment on the back surface of the film substrate. As the RF tag 11, an S-RAM capable of increasing the storage capacity, an EEP-RAM that does not require a battery for storing data, an Fe-RAM having a fast read / write time, and the like are selected and employed.

  The reader / writer 12 includes an antenna 13 that transmits and receives radio waves to and from the antenna of the RF tag 11, and a controller 14 that exchanges protocols between the RF tag 11 and the computer 15, and is a computer 15 that is a system control device. Is connected by wire or wireless.

  Now, the dicing frame 1, more specifically, the exposed surface of the frame 2 is divided into a sticking area 20 for the RF tag 11 and a non-sticking area 21, and the non-sticking area 21 is subjected to a surface treatment. Its surface resistance is 1. E + 03Ω or more E + 12Ω or less, and the time (decay time) until the charge voltage 5 kV of the FTMS 101B Method 4046-1969 standard (US Mill standard) decays to 500 V is adjusted to 5 seconds or less.

  The attachment area 20 for the RF tag 11 is the storage hole 5 of the frame 2 and its periphery, and the non-attachment area 21 is the front and back of most of the storage hole 5 of the frame 2 and its periphery (FIG. 2). reference). Further, the surface treatment is performed, for example, by applying and drying a conductive resin solution in which a conductive material is blended and dispersed in a resin dissolved in various solvents such as toluene in the non-sticking region 21 of the frame 2. .

  The solvent-soluble resin is not particularly limited, and examples thereof include polyester, polycarbonate, acrylic resin, and the like, taking into consideration the adhesion to the resin used for molding the frame 2 that is a molded body. Thus, a resin having a close solubility index (SP value) is preferably used. Examples of the conductive material include conductive carbon made of ketjen black, acetylene black, etc., conductive metal oxide made of tin oxide, indium oxide, etc., or lithium perchlorate, organic boron complex lithium salt, etc. A lithium-based ion conductive material or the like is appropriately selected.

  The lower limit of the surface resistance value in the non-sticking region 21 of the frame 2 is 1. E + 03Ω, which is because if the value is lower than this value, so-called “electric shock” occurs in the frame 2 and an appearance or performance defect occurs.

  According to the above, the conductive carbon is not easily added to the molding material of the frame 2, but the coating surface treatment is applied to the non-sticking region 21 of the frame 2 to set the resistance value to 1. E + 03Ω or more Since the time until the charge voltage 5 kV of E + 12Ω or less and the charge voltage 5 kV of FTMS 101B Method 4046-1969 decays to 500 V is adjusted to 5 seconds or less, the original communication distance (20 to 30 mm) of the RFID system 10 is set. It can be secured sufficiently.

  Further, the lower limit value of the surface resistance value of the non-sticking region 21 is set to 1. Since E + 03Ω, the antistatic property and the like can be secured, and the communication distance can be prevented from being shortened. Moreover, since generation | occurrence | production of a Joule heat can be suppressed, energy loss generate | occur | produces and it does not interfere with the operation | movement of RF tag 11.

  In addition, since no special treatment is required between the frame 2 and the RF tag 11 such as interposing a soft magnetic sheet with high magnetic permeability or a highly conductive metal to maintain the communication distance, the dicing frame 1 and the RF tag 11 are not required. It is possible to prevent the tag 11 from being increased in weight, enlarged and thickened. This effect is extremely important for the dicing frame 1 that requires height limitation, rigidity, and thinness in relation to a semiconductor manufacturing line, a processing apparatus, and the like.

  In addition, the pattern circuit of the semiconductor wafer W is not damaged by static electricity, and dust that is particularly important in the semiconductor manufacturing field is not attached. If a lithium ion conductive material is selected as the conductive material of the conductive resin solution, it is possible to more easily achieve both antistatic properties and the operability of the RF tag 11.

  In addition, if the resonance frequency of the radio wave transmitted and received between the RF tag 11 and the reader / writer 12 is set to 13.56 MHz, the metal is easily affected, but not only in Japan but also in the US and Europe. It can be used as it is without changing the frequency in the country, and a remarkable improvement in versatility can be expected.

  In addition, since the RFID system 10 is used instead of the barcode system, (1) non-contact reading is possible, (2) automatic reading that can avoid human error is possible, (3) data Various effects can be obtained such that rewriting and an increase in data storage capacity can be greatly expected, and (4) the system can flexibly cope with system expansion and change by distributed processing of information. Furthermore, since the frame 2 is injection-molded, superior effects in terms of productivity, quality stability, applicability, and the like can be expected compared to other molding methods.

  Next, FIG. 3 shows a second embodiment of the present invention. In this case, the molded body is an IC tray 30 and the exposed surfaces thereof are an adhesion region 20 for the RF tag 11 and a non-adhesion region 21. And surface treatment is performed on the non-sticking region 21 and the surface resistance value is set to 1. E + 03Ω or more E + 12Ω or less, and the time until the charge voltage 5 kV of the FTMS 101B Method 4046-1969 standard decays to 500 V is adjusted to 5 seconds or less.

The IC tray 30 is injection-molded into a horizontally long plate shape, for example, and has a plurality of IC receiving holes 31 arranged in the XY direction on the surface to form a recess, which is used for manufacturing, testing, or shipping. Is done. As for this IC tray 30, the RF tag 11 is affixed as the sticking area | region 20 the flange which protruded to the outer side of the peripheral part, and the said surface treatment is given as the non-sticking area | region 20. The other parts are the same as those in the above embodiment, and the description thereof is omitted.
In the present embodiment, it is obvious that the same effects as those in the above embodiment can be expected, and the expansion of applications can be expected.

  Next, FIG. 4 shows a third embodiment of the present invention. In this case, the molded body is the lead frame case 40 and the exposed surface of the outer box 41 is attached to the bonding area 20 for the RF tag 11. It divides into the non-adhesion area | region 21, surface-treats to the non-adhesion area | region 21, and the surface resistance value is set to 1. E + 03Ω or more E + 12Ω or less, and the time until the charge voltage 5 kV of the FTMS 101B Method 4046-1969 standard decays to 500 V is adjusted to 5 seconds or less.

The lead frame case 40 is a pair of upper and lower outer boxes 41 that are injection-molded horizontally in a plan view and fitted together, and is detachably housed inside the pair of outer boxes 41 to prevent deformation of the lead frame. An inner box 42 that is horizontally long in plan view and is used for storing and transporting the lead frame. Each of the pair of outer boxes 41 is formed to be translucent, and a thin RF tag 11 is attached to a part of the peripheral edge of the surface of the one outer box 41 as the attachment region 20. The other parts are the same as those in the above embodiment, and the description thereof is omitted.
In this embodiment, it is obvious that the same effect as the above embodiment can be expected.

  Next, FIG. 5 shows a fourth embodiment of the present invention. In this case, the molded body is used as a mask case 50 and the exposed surface of the outer box 51 is not connected to the adhesive region 20 for the RF tag 11. It is divided into the sticking area 21 and the non-sticking area 21 is subjected to a surface treatment, and the surface resistance value is set to 1. E + 03Ω or more E + 12Ω or less, and the time until the charge voltage 5 kV of the FTMS 101B Method 4046-1969 standard decays to 500 V is adjusted to 5 seconds or less.

The mask case 50 includes a pair of upper and lower outer boxes 51 that are fitted to each other, and an inner box 52 that is detachably housed in the pair of outer boxes 51 and accommodates quartz glass of photomask material in a horizontal row. It is used for storing and transporting a thin quartz glass having a rectangular shape. Each of the pair of outer boxes 51 is formed to be transparent or translucent, and the thin RF tag 11 is attached to the peripheral wall front surface of one outer box 51 as the attachment region 20. The other parts are the same as those in the above embodiment, and the description thereof is omitted.
In the present embodiment, it is obvious that the same effect as that of the above embodiment can be expected.

  The semiconductor wafer W of the above embodiment may be a 200 mm diameter, a 450 mm diameter type or the like in addition to the 300 mm diameter type. Further, although the computer 15 is shown as a control device of the RFID system 10, various controllers and information communication devices may be used as long as the same function is exhibited. Furthermore, in the said embodiment, although the surface treatment was performed by apply | coating and drying the conductive resin solution to the non-adhesion area | regions 21 of the flame | frame 2, etc., it is not limited to this at all. For example, the surface treatment may be performed using an electroless plating method using various metals, a vapor deposition method, a sputtering method, an ion implantation method, or the like.

Examples of molded products for RFID systems according to the present invention will be described below together with comparative examples.
Example Using an ABS resin (manufactured by Toray Industries, Inc.) and a known injection molding machine, a block-shaped molded body having a thickness of 2.5 mm, a width of 30 mm, and a length of 150 mm was injection molded as a sample. The exposed surface was divided into an RF tag sticking area and a non-sticking area, and a commercially available masking tape was adhered to the sticking area.

  If the masking tape is adhered in this manner, the surface resistance value is set to 1. E + 03Ω or more E + 12Ω or less and the time until the charge voltage 5kV of FTMS 101B Method 4046-1969 decays to 500V is adjusted to 5 seconds or less, and the masking tape is peeled off from the sticking area to An RF tag was attached and the communication distance and antistatic property were examined.

  The surface treatment for the non-adhesion region is performed by applying and drying a conductive resin solution in which ketjen black is blended and dispersed in a resin solution in which an acrylic resin is dissolved in a solvent made of toluene. It was given by

  The surface resistance value was measured with a measuring instrument (trade name: Hiresta UP MCP-HT450) manufactured by Dia Instruments Co., Ltd. In addition, the time until the charge voltage 5 kV decays to 500 V (electrostatic decay time) is obtained from Electro-tech system, Inc. Measurement was performed with a measuring instrument (trade name: Static Decay Meter Model 406B).

  As the RF tag of the RFID system, a type having a resonance frequency of 13.56 MHz and a maximum communication distance of 32 mm (trade name small tag (pouch processing) manufactured by Dai Nippon Printing Co., Ltd.) was used. The reader / writer was a weak type (trade name RF-500 manufactured by Keyence Corporation).

  As a result of the examination, the communication distance of the RF tag attached to the molded body did not change at all with the communication distance in the case where the RF tag was not attached to the molded body, and an excellent antistatic property could be obtained. In addition, it was confirmed that the molded body was a good molded body without dust adhering, no spark due to static electricity short circuit.

Comparative Example Surface treatment was applied to the entire exposed surface without dividing the exposed surface of the injection-molded molded body into a sticking region and a non-sticking region. An E + 05Ω molded body was prepared and an RFID tag of an RFID system was attached, and the communication distance and antistatic property were examined. Other parts were the same as in the example.

  As a result of the examination, the communication distance of the RF tag attached to the molded body was 10 mm, and the distance was significantly shortened compared to the communication distance of 32 mm when not attached to the molded body.

1 is an overall perspective explanatory view schematically showing an embodiment of a molded product for an RFID system according to the present invention. It is a plane explanatory view showing typically an embodiment of a molding for RFID system concerning the present invention. It is a perspective explanatory view showing typically a 2nd embodiment of a molded product for RFID systems concerning the present invention. It is a perspective explanatory view showing typically a 3rd embodiment of a molded product for RFID systems concerning the present invention. It is a whole perspective explanatory view showing typically a 4th embodiment of a molded product for RFID systems concerning the present invention.

Explanation of symbols

1 Dicing frame (molded body)
2 Frame (molded body)
3 Dicing tape 5 Storage hole 10 RFID system 11 RF tag 12 Reader / writer 13 Antenna 14 Controller 15 Computer 20 Adhesion area (attachment area)
21 Non-sticking area (non-mounting area)
30 IC tray (molded body)
40 Lead frame case (molded body)
41 Outer box 50 Mask case (molded body)
51 Outer box W Semiconductor wafer

Claims (4)

A molded product for an RFID system in which an RF tag of an RFID system is attached to an exposed surface of a molded body,
The exposed surface of the molded body is divided into a mounting area and a non-mounting area for the RF tag, and the non-attached area of the molded body is subjected to surface treatment so that the surface resistance value is 1. E + 03Ω or more A molded product for an RFID system, wherein E + 12Ω or less and the time until the charge voltage 5 kV of the FTMS 101B Method 4046-1969 standard decays to 500 V is 5 seconds or less.   The molded product for an RFID system according to claim 1, wherein the molded body is any one of a dicing frame, an IC tray, a lead frame case, or a mask case for a semiconductor wafer.   The molded product for an RFID system according to claim 1 or 2, wherein a surface treatment is performed by applying a conductive resin solution in which a conductive material is dispersed in a resin dissolved in a solvent to a non-attached region of the molded body.   4. The molded product for an RFID system according to claim 3, wherein the conductive material of the conductive resin solution is conductive carbon, metal oxide, or lithium ion conductive material.

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