JP2007305650A - Electronic component mounting apparatus and mounting jig used therefor - Google Patents

Abstract

The present invention relates to an electronic component mounting apparatus and a mounting jig for mounting an electronic component on a flexible substrate on which a predetermined pattern is formed, and a plurality of the components formed on the flexible substrate sheet. An object of the present invention is to prevent wrinkling when a large number of electronic components are simultaneously mounted on each pattern, thereby improving yield and improving efficiency of mounting electronic components.
SOLUTION: On a suction fixing surface 13C of a suction fixing means 13 for sucking and fixing a mounting area of a base sheet 14 on which a plurality of patterns 22 are formed, on a non-suction portion that is not sucked by a predetermined width with respect to suction. Mounting jigs 21 </ b> A and 21 </ b> B, each having a predetermined number of protruding portions narrower than the non-adsorptive portions, are disposed on the corresponding pattern 22 of the base material sheet 14 to be fixed by suction. A predetermined number is arranged in the part.
[Selection] Figure 1

Description

  The present invention relates to an electronic component mounting apparatus and a mounting jig for mounting electronic components on a flexible substrate on which a predetermined pattern is formed.

  In recent years, for example, a technique related to a non-contact type medium (non-contact type IC card or the like) called RFID (Radio Frequency Identification) has been rapidly advanced, and its use is also various. Such an RFID is manufactured by forming an antenna pattern serving as an antenna portion on a flexible base material, and attaching what is called an inlet on which an IC chip is mounted to another base base material. When an IC chip is mounted on such an antenna part on a base material, improvement in efficiency and improvement in yield are desired.

  For example, one of the technologies for mounting an IC chip on an antenna portion on a base substrate when manufacturing the RFID is disclosed in the following patent document. That is, in the patent document, the chip module bonded to the second carrier tape is placed on the antenna formed on the first carrier tape, and is sandwiched between the upper and lower sides of the first carrier tape with fixed stamps. The manufacture of a transponder in which a microchip module is connected to the antenna is disclosed.

JP-T-2004-537177

  In the manufacture of the transponder disclosed in the above patent document, a single chip module is mounted on a single antenna, and a plurality of chip modules are mounted on a plurality of antennas formed on a single first carrier tape. When applied in the case of mounting in a predetermined plurality of units, it is not realistic to set the lower fixed stamp as a plurality of corresponding ones. Instead, it is fixed on the suction stage, and the upper fixed stamps are set as a plurality corresponding thereto. Implementation is assumed.

  Therefore, FIG. 5 shows a case where a conventional IC chip mounting apparatus is applied to simultaneous multiple mounting. 5A, an IC chip mounting apparatus 101 for manufacturing a transponder includes a plurality of mounting attachment groups 102, and a suction stage 103 is disposed below. In addition, fixed stampers 104A, 104B, 105A, 105B, 106A, 106B, 107A, and 107B are disposed above and below both sides of the suction stage 13 in the transport direction. Then, a base sheet 108 (see FIG. 1D) on which a predetermined number of predetermined patterns (antenna patterns) are formed in each row and the width direction in the conveying direction is conveyed on the suction stage 103.

  Subsequently, as shown in FIG. 5B, when the base sheet 105 is conveyed and the mounting target portion is positioned on the suction stage 103, the suction stage 103 sucks and fixes the stage on the stage. The stamper 104A, 104B, 105A, 105B, 106A, 106B, 107A, 107B is fixed on both sides in the conveying direction of the suction stage 103, and for example, an anisotropic conductive paste (ACP) is supplied by a mounting attachment group, and an IC chip is mounted. After that, mounting is performed by heating and pressing.

  However, simultaneous multiple mounting in the IC chip mounting apparatus 101 as described above has a problem that wrinkles 109 as shown in FIG. The cause is that when the base sheet 108 is sucked and fixed onto the suction stage 103, the sheet is sucked from the outside in the width direction of the transport direction, so that an air pocket is created at a predetermined position on the inside to loosen the sheet. The generation of wrinkles 109 is caused by the suction of air at the slack portion, and the generation of wrinkles 109 is promoted by the difference in thermal contraction rate between the base material of the base material sheet 108 and the antenna portion due to the heat applied during the mounting. It is assumed that This is particularly noticeable in the simultaneous mounting of a large number of IC chips.

  Accordingly, the present invention has been made in view of the above-described problems, and prevents the generation of wrinkles when simultaneously mounting a large number of electronic components on each of a plurality of patterns formed on a flexible base sheet, thereby improving yield. It is an object of the present invention to provide an electronic component mounting apparatus and a mounting jig that improve the efficiency of the electronic component mounting.

  In order to solve the above-mentioned problems, in the invention of claim 1, a flexible base sheet on which a plurality of patterns are formed is conveyed by a predetermined conveying means, and a corresponding electronic component is placed on the corresponding pattern in the mounting area. An electronic component mounting apparatus that is mounted and electrically connected and mounted, and includes a suction means, and when the mounting portions for mounting the electronic components on the corresponding patterns of the base sheet are conveyed A suction fixing means for sucking and fixing a portion; and a predetermined width at a position on the suction fixing surface of the suction fixing means on the conveyance direction corresponding to a portion other than the portion on which the electronic component is mounted on the base sheet. A mounting jig in which a predetermined number of projecting portions narrower than the non-adsorption portion are formed on the non-adsorption portion that is arranged at a predetermined amount and is not adsorbed to the suction fixing means with the predetermined width; Front on fixed surface A predetermined number of mounting means for electrically connecting by supplying an electrode connecting member on the corresponding pattern of the base sheet in a portion other than the mounting jig, mounting the electronic component, and heating and pressing; It is set as the structure which has.

  In the invention of claim 2, when the corresponding mounting area of the flexible base sheet on which a plurality of patterns are formed is transported by a predetermined transport means, the corresponding electronic component is placed on the pattern. A mounting jig that is used in a predetermined number of electronic component mounting apparatuses that are mounted and electrically connected and mounted on the suction fixing surface other than the portion on which the electronic component of the base sheet is mounted Assuming that a predetermined number of predetermined widths are arranged at positions in the transport direction corresponding to the portions, a slash line portion narrower than the non-adsorption portion is predetermined on the non-adsorption portion that is not adsorbed with the predetermined width with respect to suction. A number is formed.

  According to the present invention, on the suction fixing surface that sucks and fixes the mounting region of the base sheet on which a plurality of patterns are formed, the width is narrower than the non-adsorption portion on the non-adsorption portion that is not adsorbed with a predetermined width for suction. By arranging a predetermined number of mounting jigs on which a predetermined number of projecting line portions are formed on portions other than the portions where electronic components are mounted on the corresponding pattern of the base sheet to be sucked and fixed, In the vicinity of the protruding portion on the non-adsorption portion of the mounting jig when the base sheet is sucked and fixed simultaneously when mounting a large number of electronic components on each of the plurality of patterns formed on the flexible base sheet Since the discharge path for the internal air of the base sheet is formed, the generation of wrinkles can be prevented without loosening the base sheet, the yield can be improved, and the efficiency of electronic component mounting can be improved. It can be done.

  Hereinafter, the best embodiment of the present invention will be described with reference to the drawings. In this embodiment, an IC chip mounting apparatus that mounts an IC chip on an antenna pattern on a film base sheet in RFID manufacturing is shown as an example of the electronic component mounting apparatus. However, the electronic component is not limited to this, and an electronic component is mounted on a flexible printed board. The present invention can also be applied to a mounting apparatus in which a large number are mounted simultaneously. Moreover, although the case of the resin-made film sheet is shown as a flexible base material, it is not restricted to this, It can apply also about insulating things, such as paper (a high-quality paper, a coated paper is included). .

  FIG. 1 shows a configuration diagram of an IC chip mounting apparatus according to the present invention. 1A is a conceptual diagram of an IC chip mounting apparatus which is an electronic component mounting apparatus, FIG. 1B is a conceptual perspective view of a suction fixing means, and FIG. 1C is a view from the conveying direction side of FIG. FIG. 1D is an explanatory diagram of a base sheet to be mounted.

  In FIG. 1A, the IC chip mounting apparatus 11 includes a mounting attachment group 12 in which a predetermined number of mounting attachments (here, six stages and three rows) are provided on the suction fixing means 13. . As an example, this mounting attachment includes supplying an electrode connecting member to a mounting location, mounting an IC chip as an electronic component on the part, and heating and pressing the mounted IC chip and electrode connecting member. Make electrical connections. As the electrode connecting member, for example, an anisotropic conductive paste (ACP) or an anisotropic conductive film (ACF) which is thermosetting (may be ultraviolet curable) and has conductive properties only in the vertical direction, There is a non-conductive paste (NCP) or a non-conductive film (NCF) that does not have conductive properties. Here, a thermosetting anisotropic conductive paste (ACP) is shown as an example. Then, the base sheet 14 is transported on the suction fixing means 13 by a transport means (not shown), and is fixed by suction when the mounting area of the base sheet 14 is transported onto the suction fixing means 13.

  The suction fixing means 13 sucks and fixes the mounting portion when the mounting portion of the base sheet is conveyed. As shown in FIGS. 1B and 1C, the suction fixing means 13 is placed on the suction means 13A. A suction fixing stage 13B is provided. In this case, for example, porous ceramic is used for the suction fixing surface 13C of the suction fixing stage 13B. Two mounting jigs 21A and 21B are arranged on the suction fixing surface 13C.

  That is, the mounting jigs 21 </ b> A and 21 </ b> B are arranged on the suction fixing surface 13 </ b> C of the suction fixing means 13, and are transported corresponding to a portion other than the portion where the IC chip is mounted on the base sheet 14. As a thing of predetermined width in the position on a direction, it arrange | positions by the predetermined space | interval (space | interval which does not cover a mounting area). The form of the mounting jigs 21A and 21B will be described with reference to FIG.

  And as shown in FIG.1 (D), the base material sheet 14 has the antenna pattern 22 formed on the resin film sheet by conductive ink or aluminum vapor deposition. The said antenna pattern 22 is a pattern shape according to the applied frequency of RFID, and makes two bar-shaped antenna patterns which oppose here make a pair. An IC chip is mounted between these antenna patterns, and a pair of antenna patterns are formed in a predetermined number and three rows (22A to 22C) in the longitudinal direction (conveying direction) of the resin film sheet. Shown as a thing.

  Here, FIG. 2 shows an explanatory view of an example of the mounting jig of FIG. The mounting jig 21 shown in FIG. 2A is shown as a case where it is integrally formed of, for example, plastic or metal, and the entire width B1 of the projecting line portion 32 is wider than the width A of the non-adsorbing portion 31. Narrow (A> B1). In this case, the height H of the protruding portion 32 is an appropriate height that secures an air vent path described later. In addition, the mounting jig 21 shown here may be integrally molded, or may be a case where the rod-shaped protruding portion 32 is formed on the plate-shaped non-adsorbing portion 31 by adhesion.

  Moreover, the mounting jig 21 shown in FIG. 2 (B) is, for example, by placing a wire 33 having a small diameter with respect to the width A on the resin film 31A, and further adhering the resin film 31B so as to cover it. The protruding portion 32 is formed with the full width B2 (A> B2). For example, a resin film 31A, 31B having a thickness of 10 μm and a wire 33 having a diameter of 500 μm are used. The resin films 31A and 31B are preferably heat resistant in consideration of heat applied during mounting (for example, 260 to 300 degrees). Here, the case where a resin film is used for at least the non-adsorption portion 31 of the mounting jig 21 is shown. However, non-breathable paper (for example, coated paper) or metal foil (for example, aluminum foil) is used. May be used.

  FIG. 3 shows an explanatory diagram of the mounting processing state by the mounting jig of FIG. In FIG. 3A, when the substrate sheet 14 on which the antenna patterns 22A to 22C are formed is conveyed and the mounting area reaches the suction fixing stage 13B of the suction fixing means 13, the suction fixing surface by the suction means 13A. The base sheet 14 is adsorbed and fixed on 13C. At this time, the base sheet 14 is adsorbed from the outside in the width direction with respect to the conveyance direction on the adsorbing and fixing surface 13C. At that time, as shown in FIG. The base sheet 14 is not slackened by being discharged through the air vent passage 41 generated on both sides of the protruding portion 32 of 21B. That is, the generation of wrinkles can be prevented by air bleeding during suction fixation.

  And from the mounting attachment group 12, as shown to FIG.3 (B), (C), it has a conductive property only in the vertical direction in the corresponding part of each pair of antenna pattern 22A-22C formed in the base material sheet 14. FIG. After the anisotropic conductive paste 51 is supplied, the IC chip 52 is mounted, and further mounting is performed by heating and pressing.

  As described above, the mounting jig is used when the base sheet 14 is sucked and fixed when a large number of IC chips 52 are simultaneously mounted on each of the plurality of antenna patterns 22A to 22C formed on the flexible base sheet 14. 21 is formed in the vicinity of the projecting portion 32 on the non-adsorbing portion 31 in FIG. Thus, the yield can be improved and the efficiency of electronic component (IC chip) mounting can be improved.

  Next, FIG. 4 shows an explanatory diagram of another form of the mounting jig of FIG. The mounting jig 21 shown in FIG. 4 corresponds to FIG. 2A, but may be in the form of FIG. 2B. 4A and 4B, the mounting jigs 21 </ b> C and 21 </ b> D are on the suction fixing surface 13 </ b> C on the conveyance direction corresponding to a portion other than the portion where the IC chip is mounted on the base sheet 14. Are arranged at predetermined positions (intervals that do not cover the mounting area). The mounting jigs 21 </ b> C and 21 </ b> D are formed with two protruding portions 32 </ b> A and 32 </ b> B on the non-adsorbing portion 31 with the protruding portion full width B <b> 3 (A> B <b> 3) narrower than the width A of the non-adsorbing portion 31. It has been done. The air vent path 42 is formed by the two projecting line portions 32A and 32B.

  That is, as shown in FIG. 4C, when the base sheet 14 is sucked and fixed on the suction fixing surface 13C of the suction fixing stage 13B, the two protruding portions 32A, Internal air will be discharged by the air vent path 41 formed on both outer sides of 32B and the air vent path 42 formed between the two projecting line portions 32A, 32B. Can be prevented.

  Thus, the formation of the air release passage 42 by forming the mounting jigs 21C and 21D with the two projecting line portions 32A and 32B can prevent the generation of wrinkles as described above. The yield can be improved and the efficiency of electronic component (IC chip) mounting can be improved. That is, by increasing the number of air vent paths, the internal air can be more easily discharged. On the other hand, it is also effective when the base sheet 14 is soft and the air vent paths 41 tend to be narrow. is there.

  The electronic component mounting apparatus of the present invention is suitable for mounting an IC chip in RFID manufacturing, and also suitable for mounting a large number of electronic components on a flexible printed board at the same time.

It is a block diagram of the IC chip mounting apparatus which concerns on this invention. It is explanatory drawing of an example of the jig | tool for mounting of FIG. It is explanatory drawing of the mounting process state by the mounting jig of FIG. It is explanatory drawing of the other form in the mounting jig of FIG. This is an explanation when a conventional IC chip mounting apparatus is applied to simultaneous multiple mounting.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 IC chip mounting apparatus 12 Mounting attachment group 13 Suction fixing means 14 Base sheet 21 Mounting jig 22 Antenna pattern 31 Non-adsorption part 32 Projection part 33 Wire 41, 42 Air venting path 51 Anisotropic conductive paste 52 IC chip

Claims (2)

An electronic component mounting apparatus in which a flexible base sheet on which a plurality of patterns are formed is transported by a predetermined transport means, a corresponding electronic component is mounted on a corresponding pattern in a mounting area, and is mounted by electrical connection. There,
A suction fixing means that includes suction means, and sucks and fixes the mounting portions when the mounting portions on which the electronic components are mounted on the corresponding patterns of the base sheet, respectively,
A predetermined number of predetermined widths are arranged at positions on the suction fixing surface of the suction fixing means on the conveyance direction corresponding to portions other than the portion where the electronic component of the base sheet is mounted, with respect to the suction fixing means. A mounting jig in which a predetermined number of projecting portions narrower than the non-adsorption portion are formed on the non-adsorption portion that is not adsorbed with the predetermined width;
The electrode connection member is supplied onto the corresponding pattern of the base sheet at a portion other than the mounting jig on the suction fixing surface, and the electronic component is mounted, and electrically connected by heating and pressing. A predetermined number of mounting means;
An electronic component mounting apparatus comprising: When the corresponding mounting area of the flexible base sheet on which a plurality of patterns are formed is transported by a predetermined transport means, the corresponding electronic component is mounted on the pattern and electrically connected. A mounting jig used for a predetermined number of electronic component mounting apparatuses to be mounted,
Assuming that a predetermined number of predetermined widths are arranged at a position on the suction fixing surface in a conveying direction corresponding to a portion other than a portion where the electronic component of the base sheet is mounted, the predetermined width with respect to suction A mounting jig, wherein a predetermined number of projecting line portions narrower than the non-adsorbing portion are formed on the non-adsorbing portion that is not adsorbed by the step.

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