JP2007229758A - Laser processing equipment - Google Patents

Abstract

A laser processing apparatus capable of performing laser processing on a plurality of transparent plates in a stacked state of workpieces.
A splitter 18 including a beam splitter 19 is provided between a laser beam generator 16 that generates a laser beam L and a workpiece 14 in which a plurality of transparent plates 14a and 14b are arranged in a stacked state. . The laser beam L generated from the laser beam generator 16 is guided to the transparent plates 14a and 14b of the work 14 so as to be focused by the dividing device 18 and the like, and is irradiated to the transparent plates 14a and 14b. A processing target part is formed.
[Selection] Figure 1

Description

  The present invention relates to a laser processing apparatus for irradiating a workpiece formed by arranging a plurality of transparent plates such as glass in a laminated state to form a processing target for cutting or the like on the plurality of transparent plates. It is about.

  A liquid crystal panel or a plasma display panel is configured by interposing a liquid crystal or a discharge cell between two transparent glass plates. In manufacturing these panels, two large glass transparent plates as workpieces were cut into a predetermined size with a cutting tool made of diamond, cemented carbide chip or the like. In this case, the mechanical cutting method using diamond or the like tends to cause cracks and cracks in the planned cutting line and its surroundings, so the cut end surface of the workpiece becomes rough, and the cut end surface of the transparent plate is polished or ground in the subsequent process. There is a problem that the processing is cumbersome and time-consuming.

In order to deal with such a problem, for example, as disclosed in Patent Document 1, a laser beam is irradiated so that the inside of the transparent plate is focused, and the melt processing region is located at the position of the cutting planned line of the transparent plate. Conventionally, a laser processing apparatus has also been proposed in which a portion to be processed is formed and a transparent plate can be cut along the portion to be processed.
JP 2002-192367 A

  However, in this conventional laser processing apparatus, since the laser beam is irradiated only to one transparent plate, a work such as a liquid crystal panel having two transparent plates as described above is used. In the case of processing, it is necessary to perform laser processing in two steps. Therefore, the processing was troublesome and time consuming.

  The present invention has been made paying attention to such problems existing in the prior art. The purpose is to provide a laser processing apparatus capable of performing laser processing on a plurality of transparent plates in a laminated state.

  In order to achieve the above object, according to the first aspect of the present invention, a laser light source, focusing means for focusing laser light emitted from the laser light source, and focusing by the focusing means are performed. Light guide means for making the inside of two or more transparent plates among the transparent plates constituting the workpiece, and the light guide means and the focusing means are laser beams for the transparent plates constituting the workpiece. Are irradiated from the same side.

The invention according to claim 2 is characterized in that in the invention according to claim 1, there is one laser light source.
In the invention described in claim 3, in the invention described in claim 1 or 2, the light guide means divides the laser light from the laser light source into transmitted light and reflected light, and is divided by the dividing means. It is characterized by comprising polarizing means for polarizing the transmitted light and reflected light and deflecting means for deflecting the transmitted light and reflected light polarized by the polarizing means.

According to a fourth aspect of the present invention, in the third aspect of the present invention, there is provided a changing means for changing a deflection direction by the deflecting means.
The invention according to claim 5 is characterized in that, in the invention according to claim 1 or 2, the light guiding means creates a focal point on each transparent plate by operating the focusing means.

  In the invention described in claim 6, in the invention described in claim 5, the focusing means is constituted by a convex lens movable in a direction approaching and separating from each workpiece on the optical axis, and the light guiding means is In order to make the object to be focused by the laser light different transparent plates, it is constituted by a drive mechanism for reciprocating the convex lens.

The invention described in claim 7 is characterized in that, in the invention described in claim 1 or 2, the light guide means comprises a focusing means.
The invention according to claim 8 is the invention according to claim 7, wherein the focusing means comprises a plurality of convex lenses arranged on one optical axis and having different focal lengths.

According to a ninth aspect of the invention, in the invention according to any one of the first to eighth aspects, the laser light source irradiates a laser beam capable of absorbing multiphotons.
According to a tenth aspect of the present invention, in the invention according to the ninth aspect, the laser beam has a pulse width of 0.003 ps to 500 ns.

According to an eleventh aspect of the present invention, in the invention according to the ninth or tenth aspect, the laser light has a wavelength of 0.2 μm to 2.0 μm.
According to a twelfth aspect of the present invention, in the invention according to any one of the first to eleventh aspects, a discriminating means for discriminating the position of the workpiece in the optical axis direction of the laser beam is provided. .

  As described above, according to the present invention, laser processing can be appropriately performed simultaneously on a plurality of transparent plates in a laminated state, and the cutting efficiency of the transparent plates can be improved.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the drawings. Of course, the technical scope of the present invention is not limited to the following embodiments.
(First embodiment)
First, a first embodiment of the present invention will be described with reference to FIG.

  As shown in FIG. 1, in the laser processing apparatus of this embodiment, the work support 11 is arranged so as to be movable in the X axis direction and the Y axis direction within the horizontal plane via the X axis stage 12 and the Y axis stage 13. It is installed. A work 14 is detachably mounted on the work support 11 via a work holding stop tape 15 having a high friction coefficient. Note that the work 14 may be held by air suction from an air suction port (not shown) that opens to the upper surface of the work support 11 without providing the tape 15. The work 14 is composed of two transparent glass plates 14a and 14b (thickness of about 0.5 to 1.7 mm) arranged in a laminated state at a predetermined interval, and between the transparent plates 14a and 14b. And an inclusion 14c (thickness of 0.1 mm or less) such as a liquid crystal.

  A laser beam generator 16 is disposed above the workpiece support 11 and a laser beam L is generated from the laser beam generator 16 in the lateral direction of FIG. A convex lens 17 is disposed on the optical axis of the laser light L from the laser light generator 16, and a dividing device 18 is disposed on the opposite side of the laser light generator 16 via the convex lens 17. In this embodiment, the splitter 18 is constituted by a beam splitter 19. The beam splitter 19 splits the laser light L from the laser light generator 16 into transmitted light (laser light L1) and reflected light (laser light L2). Here, the convex lens 17 is not an essential component of the present embodiment.

  A first wavelength plate 20 made of a λ / 4 plate having a filter function is disposed on the opposite side of the beam splitter 19 from the laser light generator 16, and the beam splitter 19 is interposed via the first wavelength plate 20. The first mirror 21 is disposed on the opposite side of the first focal position adjusting device 22 so that the position of the first mirror 21 can be adjusted along the optical axis direction of the transmitted light as indicated by an arrow A. Then, one laser beam L1 that is transmitted light from the beam splitter 19 is reflected or transmitted through the first wavelength plate 20, the first mirror 21, the beam splitter 19, and the convex lens 23, respectively, and the transparent plate 14a on the front side of the workpiece 14 is transmitted. Is focused in the middle in the thickness direction.

  A second wave plate 24 made of a λ / 4 plate having a filter function is disposed on the upper side of the beam splitter 19 opposite to the work 14, and the beam splitter 19 via the second wave plate 24 is disposed. On the opposite side, the second mirror 25 is arranged so that the position can be adjusted along the optical axis direction of the reflected light as indicated by the arrow B by the second focus position adjusting device 26. Then, the other laser beam L2 deflected by the beam splitter 19 is reflected or transmitted through the second wavelength plate 24, the second mirror 25, the beam splitter 19 and the convex lens 23, respectively, and is reflected on the transparent plate 14b on the back side of the workpiece 14. It is focused on the middle part in the thickness direction.

  In this laser processing apparatus, when the workpiece 14 is subjected to laser processing, the workpiece 14 is positioned and fixed on the workpiece support 11 via the tape 15. In this state, when the laser processing apparatus is activated with the focal lengths of the laser beams L1 and L2 adjusted by the first and second focal position adjusting devices 22 and 26, the X-axis stage 12 and the Y-axis stage 13 are activated. By this operation, the work support 11 is moved in the X-axis direction, the Y-axis direction, or their combined direction. At the same time, a laser beam L is generated from the laser beam generator 16, and the laser beam L is split into two laser beams L 1 and L 2 by the beam splitter 19 of the splitter 18.

  Then, one of the divided laser beams L1 is focused on the inside of the transparent plate 14a on the front side of the workpiece 14 via the first wavelength plate 20, the first mirror 21, the beam splitter 19, and the convex lens 23. Is irradiated. At the same time, the other deflected laser beam L2 is focused on the inside of the transparent plate 14b on the back side of the work 14 via the second wavelength plate 24, the second mirror 25, the beam splitter 19 and the convex lens 23. Irradiated as follows. Thereby, to-be-processed parts, such as a fusion processing area for cutting, are simultaneously formed on both transparent plates 14a and 14b of the work 14. In this melting process, there are a case where a melted part is formed, a case where a crack is formed without melting (when dielectric breakdown occurs), and a case where a melted part and a cracked part are formed close to each other.

  As described above, in this laser processing apparatus, the laser beam is applied to both the transparent plates 14a and 14b simultaneously by irradiating the workpiece 14 having the laminated transparent plates 14a and 14b with laser light from one direction. Processing can be performed to form a melt processing region by multiphoton absorption. Therefore, the work of the workpiece 14 can be performed easily and in a short time.

  In addition, since the laser beam is irradiated from one direction without simultaneously irradiating the workpiece 14 from both the front and back surfaces, the irradiation region of the laser beam on the workpiece 14 is limited to the vicinity of the outer peripheral edge of the workpiece 14. There is nothing. Incidentally, it is also conceivable to provide a laser beam irradiation unit at the tip (upper and lower ends) of the side-shaped lateral U-held support device so that the workpiece is irradiated with the laser beam from both the front and back surfaces. In such a case, the depth of the support device is limited, and the laser beam only on the outer periphery of the workpiece cannot be irradiated. Accordingly, laser processing can be performed at an arbitrary position of the workpiece 14, and the workpiece 14 can be easily cut into a desired size. In this case, since the cutting position is a melt processing part using multiphotons, unlike the mechanical method using diamond, there is no occurrence of cracks or cracks in the planned cutting line and its surroundings, and the post-process can be simplified.

  Here, in the first embodiment, the laser light generator is an Nd: YAG (neodymium: yttrium, aluminum, garnet) processing machine. The pulse width of the laser light in the first embodiment is preferably within the range of 0.003 ps to 500 ns, and more preferably within the range of 10 ps to 0.1 ns. Further, the wavelength of the laser beam in the first embodiment is in the range of 0.2 μm to 2.0 μm, and more preferably in the range of 0.9 μm to 1.5 μm.

  The laser light generator 16 corresponds to the laser light source described in the claims, the splitter 18 (beam splitter 19) corresponds to the splitter, and the first mirror 21 and the second mirror 25 are deflected. The first wave plate 20 and the second wave plate 24 correspond to the polarization means, and the convex lens 17 and the convex lens 23 correspond to the focusing means, and the splitter 18, the beam splitter 19, and the first mirror 21. The second mirror 25, the first wave plate 20, and the second wave plate also correspond to the light guide means.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with a focus on differences from the first embodiment. In the description of each embodiment after the second embodiment, the characteristic configuration and operation of each embodiment will be mainly described.

  In the second embodiment, as shown in FIG. 2, the first mirror 21 is configured to be position-adjustable in the optical axis direction by the first focus position adjusting device 22, and by the first tilt angle adjusting device 31. The tilt angle can be adjusted with respect to the optical axis direction. Similarly, the second mirror 25 is configured to be position adjustable in the optical axis direction by the second focus position adjusting device 26 and is configured to be adjustable in tilt angle with respect to the optical axis direction by the second tilt angle adjusting device 32. ing.

  Therefore, also in the second embodiment, the same effect as in the first embodiment can be obtained. In the second embodiment, the first and second tilt angle adjusting devices 31 and 32 adjust the tilt angles of the first and second mirrors 21 and 25, so that the laser beams L1 and L2 are in different directions. The optical axis angles of the laser beams are different from each other so that the focal position of the laser beams L1 and L2 with respect to the transparent plates 14a and 14b of the workpiece 14 is a desired amount in the X axis direction or the Y axis direction in the horizontal plane. Can only be displaced. Accordingly, it is necessary to form the processing portion at different positions with respect to both the transparent plates 14a and 14b, or to form the processing portion with a time difference with respect to the same position of both the transparent plates 14a and 14b. It is effective in the case.

Even if the tilt angle adjusting device is provided only on one of the first and second mirrors 21 and 25, the optical axis angles of the laser beams L1 and L2 can be made different from each other.
(Third and fourth embodiments)
Next explained is the third embodiment of the invention.

  In the third embodiment, as shown in FIG. 3, the laser light generator 16 is disposed on the opposite side of the workpiece 14 via the beam splitter 19, and between the first wave plate 20 and the first mirror 21. A convex lens 27 is arranged on the front side. The second wavelength plate 24, the second mirror 25, and the second focal position adjusting device 26 are disposed on the opposite side of the first wavelength plate 20 and the like via the beam splitter 19. When the distance from the laser beam generator 16 to the beam splitter 19 is short as in this embodiment, the convex lens 27 is essential, and this convex lens 27 corresponds to the focusing means described in the claims. .

  The laser beam L from the laser beam generator 16 is split by the beam splitter 19 into a laser beam L1 that is transmitted light and a laser beam L2 that is reflected light. Thereafter, the laser beam L1 passes through the beam splitter 19, passes through the convex lens 23, and is focused on the transparent plate 14b. The laser beam L2 is reflected by the beam splitter 19, reflected by the second mirror 25, and then , Reflected by the first mirror 21, reflected by the beam splitter 19, passes through the convex lens 27, and is focused on the transparent plate 14 a.

  In the fourth embodiment, as shown in FIG. 4, a second tilt angle adjusting device 32 is attached to the first focal position adjusting device 22, and the first mirror 21 is tilted so that the optical axes of the laser beams L <b> 1 and L <b> 2. Is provided with an angle difference, and the in-focus positions with respect to the transparent plates 14a and 14b are made different.

  Therefore, the third and fourth embodiments not only have the same operation as the first and second embodiments, respectively, but also in the third and fourth embodiments, the laser light generator 16 causes the beam splitter 19 to be connected. Since the first and second mirrors 21 and 25 are disposed on both sides of the workpiece 14, the entire apparatus can be reduced in size.

In the fourth embodiment, the tilt angle adjusting device may be attached to the second focal position adjusting device 26, or may be attached to both the first and second focal position adjusting devices 22, 26.
(5th and 6th embodiment)
Next, fifth and sixth embodiments of the present invention will be described.

  In these fifth and sixth embodiments, as shown in FIGS. 5 and 6, in the third and fourth embodiments, instead of the convex lens 27, between the laser light generator 16 and the beam splitter 19, respectively. A concave lens 28 is arranged. Here, the concave lens 28 corresponds to the focusing means described in the claims.

The operation of the fifth and sixth embodiments is the same as the operation of the third and fourth embodiments.
(Seventh embodiment)
Next, a seventh embodiment of the present invention will be described.

  In the seventh embodiment, as shown in FIG. 7, a first convex lens 34 is disposed between the beam splitter 33 and the work 14. A mirror 35 is disposed on the opposite side of the laser light generator 16 via the beam splitter 33, and a second convex lens 37 is disposed between the mirror 35 and the work 14. The focal lengths of the first convex lens 34 and the second convex lens 37 with respect to the transparent plate 14a and the transparent plate 14b are adjusted by the first focal position adjusting device 22 and the second focal position adjusting device 26, respectively. Here, the beam splitter 33 corresponds to the dividing means described in the claims, the first convex lens 34 and the second convex lens 37 correspond to the focusing means, and the mirror 35 corresponds to the deflecting means.

  The laser beam L generated from the laser beam generator 16 is split into two parallel laser beams L1 and L2 at different positions in the beam splitter 33. The laser beams L1 and L2 are focused on the transparent plates 14a and 14b, respectively.

The mirror 35 may be arranged so that the tilt angle can be adjusted by the tilt angle adjusting device 36 so that the optical axes of the laser beams L1 and L2 have an angle difference.
In the seventh embodiment, the same operation as that of the first embodiment can be obtained.

(Eighth embodiment)
Next, an eighth embodiment of the invention will be described.
In the eighth embodiment, as shown in FIGS. 8 and 9, a compound convex lens 38 is provided. The compound convex lens 38 is integrally formed by adhering a pair of additional convex lenses 40 on both surfaces of the convex lens body 39, and is configured such that the focal lengths of the central portion 38a and the outer peripheral portion 38b are different (the additional convex lens is the center). Part 38a, and the convex lens body 39 constitutes the outer peripheral part 3b). The laser light L generated from the laser light generator 16 passes through the central portion 38a and the outer peripheral portion 38b of the compound convex lens 38, so that it is divided into two laser beams L1 and L2 having different focal lengths on the same axis. One laser beam L1 is focused on the inside of the transparent plate 14a on the front side of the workpiece 14, and the other laser beam L2 is focused on the inside of the transparent plate 14b on the back side of the workpiece 14. Here, the compound convex lens 38 corresponds to the light guiding means and the focusing means described in the claims, and the light guiding means and the focusing means are formed of the same body.

  In this embodiment, a focal position adjusting device 41 is provided on the workpiece support base 11 side. Then, the focal position of the laser beams L1 and L2 with respect to the transparent plates 14a and 14b of the workpiece 14 is adjusted by moving the workpiece 14 on the workpiece support base 11 in the Z-axis direction by the focal position adjusting device 41.

Therefore, in the eighth embodiment, the beam splitters 19 and 33 and the first and second mirrors 21 and 25 in the respective embodiments are not necessary, and the configuration is simplified.
(Ninth embodiment)
Next, a ninth embodiment of the invention will be described.

  In the ninth embodiment, as shown in FIG. 10, two large and small convex lenses 44 and 45 having different diameters are provided adjacent to each other on the same optical axis. Then, when the laser light L generated from the laser light generator 16 passes through the two convex lenses 44 and 45 having different diameters, the two laser lights L1 and L2 are guided coaxially in the same direction. It is divided into. One laser beam L1 is focused on the inside of the transparent plate 14a on the front side of the workpiece 14, and the other laser beam L2 is focused on the inside of the transparent plate 14b on the back side of the workpiece 14. In addition, as shown by a two-dot chain line in FIG. 10, the front and rear arrangements of the biconvex lenses 44 and 45 in the optical axis direction may be reversed. Here, the convex lenses 44 and 45 correspond to the light guiding means and the focusing means described in the claims, and the light guiding means and the focusing means are formed of the same body.

Therefore, the ninth embodiment has the same operation as that of the eighth embodiment.
(10th Embodiment)
Next, a tenth embodiment of the invention is described.

  In the tenth embodiment, as shown in FIG. 11, a movable convex lens 42 movably arranged in the Z-axis direction and a moving device 43 are provided. Then, the movable convex lens 42 is alternately moved by the moving device 43 to an upper position indicated by a solid line and a lower position indicated by a chain line in FIG. Thereby, the focus position of the laser beam L generated from the laser beam generator 16 is changed.

  The laser light L1 when the movable convex lens 42 is moved to the upper position is focused on the inside of the transparent plate 14a on the front side of the work 14, and the laser light L2 when the movable convex lens 42 is moved to the lower position is The inner side of the transparent plate 14b on the back side of the work 14 is focused. Here, the movable convex lens 42 corresponds to the focusing means described in the claims, and the moving device 43 corresponds to the light guiding means.

Accordingly, in the tenth embodiment, the configuration of the optical system is simple because only the movable convex lens 42 is used.
(Eleventh embodiment)
Next, an eleventh embodiment of the present invention will be described.

  In the eleventh embodiment, as shown in FIG. 12, the position of the work 14 in the Z direction, that is, the position of the work 14 with respect to the laser light generator 16 is detected on the laser optical axis. That is, a mirror 61 is disposed on the optical axis between the first wave plate 20 and the first mirror 21, and a laser light generator 62 made of a semiconductor laser device is disposed in the vicinity of the mirror 61. In addition, a mirror 63 is disposed on the optical axis between the beam splitter 19 and the second wave plate 24, and a sensor 64 constituting a determination unit is disposed in the vicinity thereof. Here, the mirror 61, the laser light generator 62, the mirror 63, and the sensor 64 correspond to the discrimination means described in the claims.

  Here, the laser beam L 3 generated from the laser beam generator 62 is reflected by the beam splitter 19 and irradiated onto the workpiece 14 via the convex lens 23. The sensor 64 monitors the focused state on the work 14 via the mirror 63. When the laser beam L3 is in focus with respect to the upper surface of the workpiece 14, the focus is circular and a small area focus image is detected by the sensor 64. When the focus is shifted to the plus side or the minus side, the focus images are distorted in different directions. For example, when the focus is shifted to the plus side, it becomes an ellipse, and when it is shifted to the minus side, it becomes an ellipse displaced 90 degrees from the ellipse. Further, the area of the focus image is widened according to the amount of focus shift. Therefore, by analyzing the focus image detected by the sensor 64, it is possible to determine the presence / absence of focus, the direction of deviation, and the amount of blur, and the determination result on the optical axis of the work 14 with respect to the laser light generator 16 is determined. The approaching / separating degree is determined.

  Then, depending on the position of the workpiece 14 determined by the detection of the sensor 64 and the data such as the thicknesses of the transparent plates 14a and 14b and inclusions 14c of the workpiece 14 set in advance, the first and second focal points. The position adjusting devices 22 and 26 are operated, and the first and second mirrors 21 and 25 are moved and adjusted so that the laser beams L and L1 are focused at appropriate positions on the transparent plates 14a and 14b.

  Therefore, in the eleventh embodiment, the position of the workpiece 14 is determined using the same optical path as that for laser processing (in other words, the distance to the surface of the workpiece 14 is measured). Is possible. As a result, it is possible to accurately determine (measure) the position of the work 14 (the distance between the work 14 and the optical system member (light guide means and focusing means)).

(Twelfth embodiment)
Next, a twelfth embodiment of the invention is described.
In the twelfth embodiment, as shown in FIGS. 13 and 14, a detection device 72 as a determination unit is supported by the dividing device 18 via a bracket 71 having a structure that does not obstruct the optical path of the laser light. The detection device 72 includes a semiconductor laser light generator 73 and a detection element 74. The laser beam L3 from the laser beam generator 73 is focused on the workpiece 14 by the action of an optical system built in the laser beam generator 73. Here, the detection device 72 corresponds to the determination means described in the claims.

  Then, the laser beam L3 from the laser beam generator 73 is irradiated on the upper surface of the workpiece 14, and the reflected light is detected by the detection element 74. As in the twelfth embodiment, the focused state on the workpiece 14 is determined. If it is determined that the focus is not in focus, the amount of shift and the direction of the shift are detected, and the degree of approach and separation on the optical axis of the work 14 with respect to the laser light generator 16 is determined according to the detection result. Accordingly, similarly to the twelfth embodiment, the first and second mirrors 21 and 25 are moved and adjusted so that the laser beams L and L1 are focused at appropriate positions on the transparent plates 14a and 14b of the workpiece 14.

  Further, in the thirteenth embodiment, as shown in FIG. 15, an optical fiber 75 for forming an optical path in the laser light generator 73 and the detection element 74 may be provided for the detection device 72. The optical fiber 75 can be deformed by bending.

  Therefore, in the twelfth embodiment, the position of the workpiece 14 can be determined without using an optical path for laser processing. As a result, the mechanism for discrimination can be simplified, and it can be easily attached to and detached from the optical system member (light guide means) for laser processing. In particular, when the optical fiber 75 is used, the irradiation position of the detection laser light L3 and the incident position on the detection element 74 can be freely adjusted by the deformation of the optical fiber 75, the displacement of the mounting position of the detection device 72, etc. It is also possible to easily cope with this.

(Example of change)
The above embodiment can be variously improved and modified without departing from the gist of the present invention. Specific examples are shown below.

  Contrary to the above-described embodiments, at the time of laser irradiation, the optical system side is moved relative to the work 14 in the X-axis direction and the Y-axis direction to change the processing part of the work 14 by the laser light. To do.

  In each of the above embodiments, the laser light L generated from the laser light generator 16 is deflected into three or more laser beams and irradiated to three or more transparent plates of the work 14. To be configured.

In place of the YAG laser device in each of the above embodiments, a device that generates pulsed laser light, such as an excimer laser device, is used.
In the eleventh and twelfth embodiments, the reflected light from the focal position is divided into two by a knife edge or the like, the light power balance is determined, and the position of the work 14 in the optical axis direction is determined from the power balance state. To determine.

The block diagram which shows the laser processing apparatus of 1st Embodiment. The block diagram which shows the laser processing apparatus of 2nd Embodiment. The block diagram which shows the laser processing apparatus of 3rd Embodiment. The block diagram which shows the laser processing apparatus of 4th Embodiment. The block diagram which shows the laser processing apparatus of 5th Embodiment. The block diagram which shows the laser processing apparatus of 6th Embodiment. The block diagram which shows the laser processing apparatus of 7th Embodiment. The block diagram which shows the laser processing apparatus of 8th Embodiment. The block diagram which decomposes | disassembles and shows the movable convex lens of the laser processing apparatus of FIG. The block diagram which shows the laser processing apparatus of 9th Embodiment. The block diagram which shows the laser processing apparatus of 10th Embodiment. The block diagram which shows the laser processing apparatus of 11th Embodiment. The block diagram which shows the laser processing apparatus of 12th Embodiment. The side view which shows the detection apparatus of 12th Embodiment. The side view which shows the modification of the detection apparatus of 12th Embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11 ... Work support stand, 14 ... Work, 14a, 14b ... Transparent plate, 16 ... Laser light source, 17 ... Convex lens, 18 ... Splitting device, 19 ... Beam splitter, 21 ... 1st mirror, 22 ... 1st focus position adjustment device , 23 ... convex lens, 25 ... second mirror, 26 ... second focus position adjusting device, 27 ... convex lens, 33 ... beam splitter, 35 ... mirror, 38 ... compound convex lens, 42 ... movable convex lens, 44 ... convex lens, 45 ... convex lens , L, L1, L2, L3... Laser light, 64... Sensor, 74.

Claims (12)

In a laser processing apparatus for laser processing a workpiece in which a plurality of transparent plates are laminated,
A laser light source;
Focusing means for focusing laser light emitted from the laser light source;
A light guide means for producing a focal point by the focusing means in two or more transparent plates among the transparent plates constituting the workpiece,
The laser processing apparatus, wherein the light guide unit and the focusing unit irradiate a transparent plate constituting the workpiece with laser light from the same side. The laser processing apparatus according to claim 1, wherein the number of laser light sources is one. The light guiding means includes a dividing means for dividing the laser light from the laser light source into transmitted light and reflected light, a polarizing means for polarizing the transmitted light and reflected light divided by the dividing means, and polarized by the polarizing means. The laser processing apparatus according to claim 1, further comprising: a deflecting unit that deflects the transmitted light and the reflected light. 4. The laser processing apparatus according to claim 3, further comprising changing means for changing a deflection direction by the deflecting means. 3. The laser processing apparatus according to claim 1, wherein the light guiding unit creates a focal point on each transparent plate by operating the focusing unit. 4. The focusing means is constituted by a convex lens that can move in a direction approaching and separating from each workpiece on the optical axis,
The laser processing apparatus according to claim 5, wherein the light guide means includes a drive mechanism that reciprocally moves the convex lens so that the laser light is focused on different transparent plates. The laser processing apparatus according to claim 1, wherein the light guide unit and the focusing unit are formed of the same body. The laser processing apparatus according to claim 7, wherein the focusing unit includes a plurality of convex lenses having different focal lengths arranged on one optical axis. The laser processing apparatus according to any one of claims 1 to 8, wherein the laser light source irradiates laser light capable of absorbing multiphotons. The laser processing apparatus according to claim 9, wherein the laser beam has a pulse width of 0.003 ps to 500 ns. The laser processing apparatus according to claim 9 or 10, wherein the laser beam has a wavelength of 0.2 µm to 2.0 µm. 12. The laser processing apparatus according to claim 1, further comprising a discriminating unit configured to discriminate the position of the workpiece in the optical axis direction of the laser light.

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